SN54ALS541, SN74ALS540, SN74ALS541 OCTAL BUFFERS AND LINE DRIVERS WITH 3-STATE OUTPUTS SDAS025D – APRIL 1982 – REVISED MARCH 2002 D D 3-State Outputs Drive Bus Lines or Buffer Memory Address Registers pnp Inputs Reduce dc Loading Data Flowthrough Pinout (All Inputs on Opposite Side From Outputs) SN54ALS541 . . . J PACKAGE SN74ALS540 . . . DW, N, OR NS PACKAGE SN74ALS541 . . . DB, DW, N, OR NS PACKAGE (TOP VIEW) OE1 A1 A2 A3 A4 A5 A6 A7 A8 GND description These octal buffers and line drivers are designed to have the performance of the popular SN54ALS240A/ SN74ALS240A series and, at the same time, offer a pinout with inputs and outputs on opposite sides of the package. This arrangement greatly facilitates printed circuit board layout. The 3-state control gate is a 2-input NOR gate such that, if either output-enable (OE1 or OE2) input is high, all eight outputs are in the high-impedance state. The -1 versions of SN74ALS540 and SN74ALS541 are identical to the standard versions, except that the recommended maximum IOL is increased to 48 mA. There is no -1 version of the SN54ALS541. 20 2 19 3 18 4 17 5 16 6 15 7 14 8 13 9 12 10 11 VCC OE2 Y1 Y2 Y3 Y4 Y5 Y6 Y7 Y8 A2 A1 OE1 VCC SN54ALS541 . . . FK PACKAGE (TOP VIEW) A3 A4 A5 A6 A7 4 3 2 1 20 19 18 5 17 6 16 7 15 8 14 9 10 11 12 13 Y1 Y2 Y3 Y4 Y5 A8 GND Y8 Y7 Y6 The SN74ALS540 provides inverted data. The ’ALS541 provide true data at the outputs. 1 OE2 D Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. Copyright 2002, Texas Instruments Incorporated PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. On products compliant to MIL-PRF-38535, all parameters are tested unless otherwise noted. On all other products, production processing does not necessarily include testing of all parameters. POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 1 SN54ALS541, SN74ALS540, SN74ALS541 OCTAL BUFFERS AND LINE DRIVERS WITH 3-STATE OUTPUTS SDAS025D – APRIL 1982 – REVISED MARCH 2002 ORDERING INFORMATION PDIP – N SOIC – DW 0°C to 70°C SOP – NS 55°C to 125°C –55°C ORDERABLE PART NUMBER PACKAGE† TA Tube TOP-SIDE MARKING SN74ALS540N SN74ALS540N SN74ALS540-1N SN74ALS540-1N SN74ALS541N SN74ALS541N SN74ALS541-1N SN74ALS541-1N Tube SN74ALS540DW Tape and reel SN74ALS540DWR Tube SN74ALS540-1DW Tube SN74ALS541DW Tape and reel SN74ALS541DWR Tube SN74ALS541-1DW Tape and reel SN74ALS541-1DWR Tape and reel SN74ALS540NSR ALS540 SN74ALS540-1NSR ALS540-1 SN74ALS541NSR ALS541 SN74ALS541-1NSR ALS541-1 SN74ALS541DBR G541 SN74ALS541-1DBR G541-1 Tape and reel ALS540 ALS540-1 ALS541 ALS541 1 ALS541-1 SSOP – DB Tape and reel CDIP – J Tube SNJ54ALS541J SNJ54ALS541J LCCC – FK Tube SNJ54ALS541FK SNJ54ALS541FK † Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at www.ti.com/sc/package. logic diagrams (positive logic) ′ALS541 SN74ALS540 OE1 OE2 A1 1 OE1 19 2 OE2 18 Y1 A1 To Seven Other Channels 2 POST OFFICE BOX 655303 1 19 2 18 Y1 To Seven Other Channels • DALLAS, TEXAS 75265 SN54ALS541, SN74ALS540, SN74ALS541 OCTAL BUFFERS AND LINE DRIVERS WITH 3-STATE OUTPUTS SDAS025D – APRIL 1982 – REVISED MARCH 2002 absolute maximum ratings over operating free-air temperature (unless otherwise noted)† Supply voltage, VCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 V Input voltage, VI . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 V Voltage applied to a disabled 3-state output . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5.5 V Package thermal impedance, θJA (see Note 1): DB package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 70°C/W DW package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 58°C/W N package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 69°C/W NS package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 60°C/W Storage temperature range, Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –65°C to 150°C † Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. NOTE 1: The package thermal impedance is calculated in accordance with JESD 51-7. recommended operating conditions SN74ALS540 SN74ALS541 SN54ALS541 VCC VIH Supply voltage VIL IOH Low-level input voltage IOL Low level output current Low-level High-level input voltage NOM MAX MIN NOM MAX 4.5 5 5.5 4.5 5 5.5 2 High-level output current TA Operating free-air temperature † Applies only to the -1 version and only if VCC is between 4.75 V and 5.25 V POST OFFICE BOX 655303 UNIT MIN – 55 • DALLAS, TEXAS 75265 2 V V 0.7 0.8 V – 12 – 15 mA 12 24 48† mA 70 °C 125 0 3 SN54ALS541, SN74ALS540, SN74ALS541 OCTAL BUFFERS AND LINE DRIVERS WITH 3-STATE OUTPUTS SDAS025D – APRIL 1982 – REVISED MARCH 2002 electrical characteristics over recommended operating free-air temperature range (unless otherwise noted) PARAMETER MIN VIK VOH VCC = 4.5 V, VCC = 4.5 V to 5.5 V, II = – 18 mA IOH = – 0.4 mA VCC = 4.5 V IOH = – 3 mA IOH = – 12 mA VOL VCC = 4.5 V IOL = 24 mA IOL = 48 mA† IOZH IOZL VCC = 5.5 V, VCC = 5.5 V, VO = 2.7 V VO = 0.4 V II IIH VCC = 5.5 V, VCC = 5.5 V, VI = 7 V VI = 2.7 V IIL IO§ VCC = 5.5 V, VCC = 5.5 V, VI = 0.4 V VO = 2.25 V VCC = 5.5 V ICC VCC – 2 2.4 VCC = 5.5 V MAX MIN TYP‡ – 1.2 VCC – 2 2.4 3.2 UNIT MAX 3.2 V V 2 2 0.25 0.4 0.25 0.4 0.35 0.5 0.35 0.5 20 µA – 20 – 20 µA 0.1 0.1 mA 20 20 µA – 0.1 mA – 112 mA – 112 – 30 Outputs high 5 10 Outputs low 13 22 Outputs disabled 11 19 6 14 25 Outputs low Outputs disabled V 20 – 0.2 – 20 Outputs high ’ALS541 TYP‡ – 1.2 IOH = – 15 mA IOL = 12 mA SN74ALS540 SN74ALS540 SN74ALS541 SN54ALS541 TEST CONDITIONS 6 14 15 25 15 13.5 32 13.5 mA 22 † Applies only to the -1 version and only if VCC is between 4.75 V and 5.25 V ‡ All typical values are at VCC = 5 V, TA = 25°C. § The output conditions have been chosen to produce a current that closely approximates one-half of the true short-circuit output current, IOS. switching characteristics (see Figure 1) PARAMETER FROM (INPUT) VCC = 4.5 V to 5.5 V, CL = 50 pF, R1 = 500 Ω, R2 = 500 Ω, TA = MIN to MAX¶ TO (OUTPUT) SN54ALS541 tPLH tPHL A Y tPZH tPZL OE Y tPHZ tPLZ OE Y SN74ALS540 SN74ALS541 MIN MAX MIN MAX MIN MAX 4 17 2 12 4 14 2 14 2 9 2 10 5 18 5 15 5 15 8 28 8 20 8 20 1 12 1 10 1 10 2 14 2 12 2 12 ¶ For conditions shown as MIN or MAX, use the appropriate value specified under recommended operating conditions. 4 POST OFFICE BOX 655303 UNIT • DALLAS, TEXAS 75265 ns ns ns SN54ALS541, SN74ALS540, SN74ALS541 OCTAL BUFFERS AND LINE DRIVERS WITH 3-STATE OUTPUTS SDAS025D – APRIL 1982 – REVISED MARCH 2002 PARAMETER MEASUREMENT INFORMATION SERIES 54ALS/74ALS AND 54AS/74AS DEVICES 7V RL = R1 = R2 VCC S1 RL R1 Test Point From Output Under Test CL (see Note A) From Output Under Test RL Test Point From Output Under Test CL (see Note A) CL (see Note A) LOAD CIRCUIT FOR BI-STATE TOTEM-POLE OUTPUTS LOAD CIRCUIT FOR OPEN-COLLECTOR OUTPUTS 3.5 V Timing Input Test Point LOAD CIRCUIT FOR 3-STATE OUTPUTS 3.5 V High-Level Pulse 1.3 V R2 1.3 V 1.3 V 0.3 V 0.3 V tsu Data Input tw th 3.5 V 1.3 V 3.5 V Low-Level Pulse 1.3 V 0.3 V 1.3 V 0.3 V VOLTAGE WAVEFORMS PULSE DURATIONS VOLTAGE WAVEFORMS SETUP AND HOLD TIMES 3.5 V Output Control (low-level enabling) 1.3 V 1.3 V 0.3 V tPZL Waveform 1 S1 Closed (see Note B) tPLZ tPHZ 1.3 V 1.3 V 0.3 V tPHL ≈3.5 V tPLH VOL 0.3 V VOH 1.3 V 3.5 V Input 1.3 V tPZH Waveform 2 S1 Open (see Note B) 1.3 V 0.3 V ≈0 V VOH In-Phase Output 1.3 V 1.3 V VOL tPLH tPHL VOH Out-of-Phase Output (see Note C) 1.3 V 1.3 V VOL VOLTAGE WAVEFORMS PROPAGATION DELAY TIMES VOLTAGE WAVEFORMS ENABLE AND DISABLE TIMES, 3-STATE OUTPUTS NOTES: A. CL includes probe and jig capacitance. B. Waveform 1 is for an output with internal conditions such that the output is low except when disabled by the output control. Waveform 2 is for an output with internal conditions such that the output is high except when disabled by the output control. C. When measuring propagation delay items of 3-state outputs, switch S1 is open. D. All input pulses have the following characteristics: PRR ≤ 1 MHz, tr = tf = 2 ns, duty cycle = 50%. E. The outputs are measured one at a time with one transition per measurement. Figure 1. Load Circuits and Voltage Waveforms POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 5 PACKAGE OPTION ADDENDUM www.ti.com 9-Oct-2007 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Eco Plan (2) Qty Lead/Ball Finish MSL Peak Temp (3) 5962-89602012A ACTIVE LCCC FK 20 1 TBD 5962-8960201RA ACTIVE CDIP J 20 1 TBD 5962-8960201SA OBSOLETE CFP W 20 TBD Call TI SN54ALS541J ACTIVE CDIP J 20 1 TBD A42 SNPB SN74ALS540-1DW ACTIVE SOIC DW 20 25 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74ALS540-1DWE4 ACTIVE SOIC DW 20 25 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74ALS540-1DWG4 ACTIVE SOIC DW 20 25 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74ALS540-1DWR OBSOLETE SOIC DW 20 TBD Call TI SN74ALS540-1N ACTIVE PDIP N 20 20 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type SN74ALS540-1NE4 ACTIVE PDIP N 20 20 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type SN74ALS540-1NSR ACTIVE SO NS 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74ALS540-1NSRE4 ACTIVE SO NS 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74ALS540-1NSRG4 ACTIVE SO NS 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74ALS540DW ACTIVE SOIC DW 20 25 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74ALS540DWG4 ACTIVE SOIC DW 20 25 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74ALS540DWR ACTIVE SOIC DW 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74ALS540DWRG4 ACTIVE SOIC DW 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74ALS540N ACTIVE PDIP N 20 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type SN74ALS540N3 OBSOLETE PDIP N 20 TBD Call TI SN74ALS540NE4 ACTIVE PDIP N 20 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type SN74ALS540NSR ACTIVE SO NS 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74ALS540NSRE4 ACTIVE SO NS 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74ALS540NSRG4 ACTIVE SO NS 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74ALS541-1DBR ACTIVE SSOP DB 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74ALS541-1DBRE4 ACTIVE SSOP DB 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74ALS541-1DBRG4 ACTIVE SSOP DB 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74ALS541-1DW ACTIVE SOIC DW 20 CU NIPDAU Level-1-260C-UNLIM 20 20 25 Addendum-Page 1 Green (RoHS & no Sb/Br) POST-PLATE N / A for Pkg Type A42 SNPB N / A for Pkg Type Call TI N / A for Pkg Type Call TI Call TI PACKAGE OPTION ADDENDUM www.ti.com (1) 9-Oct-2007 Orderable Device Status (1) Package Type Package Drawing Pins Package Eco Plan (2) Qty SN74ALS541-1DWE4 ACTIVE SOIC DW 20 25 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74ALS541-1DWG4 ACTIVE SOIC DW 20 25 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74ALS541-1DWR ACTIVE SOIC DW 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74ALS541-1DWRE4 ACTIVE SOIC DW 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74ALS541-1DWRG4 ACTIVE SOIC DW 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74ALS541-1N ACTIVE PDIP N 20 20 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type SN74ALS541-1NE4 ACTIVE PDIP N 20 20 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type SN74ALS541-1NSR ACTIVE SO NS 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74ALS541-1NSRE4 ACTIVE SO NS 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74ALS541-1NSRG4 ACTIVE SO NS 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74ALS541DBR ACTIVE SSOP DB 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74ALS541DBRE4 ACTIVE SSOP DB 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74ALS541DBRG4 ACTIVE SSOP DB 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74ALS541DW ACTIVE SOIC DW 20 25 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74ALS541DWG4 ACTIVE SOIC DW 20 25 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74ALS541DWR ACTIVE SOIC DW 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74ALS541DWRE4 ACTIVE SOIC DW 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74ALS541DWRG4 ACTIVE SOIC DW 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74ALS541N ACTIVE PDIP N 20 CU NIPDAU N / A for Pkg Type Lead/Ball Finish MSL Peak Temp (3) 20 Pb-Free (RoHS) TBD Call TI 20 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type SN74ALS541N3 OBSOLETE PDIP N 20 SN74ALS541NE4 ACTIVE PDIP N 20 SN74ALS541NSR ACTIVE SO NS 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74ALS541NSRE4 ACTIVE SO NS 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74ALS541NSRG4 ACTIVE SO NS 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SNJ54ALS541FK ACTIVE LCCC FK 20 1 TBD SNJ54ALS541J ACTIVE CDIP J 20 1 TBD The marketing status values are defined as follows: Addendum-Page 2 Call TI POST-PLATE N / A for Pkg Type A42 SNPB N / A for Pkg Type PACKAGE OPTION ADDENDUM www.ti.com 9-Oct-2007 ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 3 PACKAGE MATERIALS INFORMATION www.ti.com 11-Mar-2008 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing SN74ALS540DWR SOIC SPQ Reel Reel Diameter Width (mm) W1 (mm) DW 20 2000 330.0 24.4 A0 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant 10.8 13.0 2.7 12.0 24.0 Q1 SN74ALS541-1DBR SSOP DB 20 2000 330.0 16.4 8.2 7.5 2.5 12.0 16.0 Q1 SN74ALS541-1DWR SOIC DW 20 2000 330.0 24.4 10.8 13.0 2.7 12.0 24.0 Q1 SN74ALS541DBR SSOP DB 20 2000 330.0 16.4 8.2 7.5 2.5 12.0 16.0 Q1 SN74ALS541DWR SOIC DW 20 2000 330.0 24.4 10.8 13.0 2.7 12.0 24.0 Q1 Pack Materials-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 11-Mar-2008 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) SN74ALS540DWR SOIC DW 20 2000 346.0 346.0 41.0 SN74ALS541-1DBR SSOP DB 20 2000 346.0 346.0 33.0 SN74ALS541-1DWR SOIC DW 20 2000 346.0 346.0 41.0 SN74ALS541DBR SSOP DB 20 2000 346.0 346.0 33.0 SN74ALS541DWR SOIC DW 20 2000 346.0 346.0 41.0 Pack Materials-Page 2 MECHANICAL DATA MSSO002E – JANUARY 1995 – REVISED DECEMBER 2001 DB (R-PDSO-G**) PLASTIC SMALL-OUTLINE 28 PINS SHOWN 0,38 0,22 0,65 28 0,15 M 15 0,25 0,09 8,20 7,40 5,60 5,00 Gage Plane 1 14 0,25 A 0°–ā8° 0,95 0,55 Seating Plane 2,00 MAX 0,10 0,05 MIN PINS ** 14 16 20 24 28 30 38 A MAX 6,50 6,50 7,50 8,50 10,50 10,50 12,90 A MIN 5,90 5,90 6,90 7,90 9,90 9,90 12,30 DIM 4040065 /E 12/01 NOTES: A. B. C. D. All linear dimensions are in millimeters. This drawing is subject to change without notice. Body dimensions do not include mold flash or protrusion not to exceed 0,15. Falls within JEDEC MO-150 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 MECHANICAL DATA MLCC006B – OCTOBER 1996 FK (S-CQCC-N**) LEADLESS CERAMIC CHIP CARRIER 28 TERMINAL SHOWN 18 17 16 15 14 13 NO. OF TERMINALS ** 12 19 11 20 10 A B MIN MAX MIN MAX 20 0.342 (8,69) 0.358 (9,09) 0.307 (7,80) 0.358 (9,09) 28 0.442 (11,23) 0.458 (11,63) 0.406 (10,31) 0.458 (11,63) 21 9 22 8 44 0.640 (16,26) 0.660 (16,76) 0.495 (12,58) 0.560 (14,22) 23 7 52 0.739 (18,78) 0.761 (19,32) 0.495 (12,58) 0.560 (14,22) 24 6 68 0.938 (23,83) 0.962 (24,43) 0.850 (21,6) 0.858 (21,8) 84 1.141 (28,99) 1.165 (29,59) 1.047 (26,6) 1.063 (27,0) B SQ A SQ 25 5 26 27 28 1 2 3 4 0.080 (2,03) 0.064 (1,63) 0.020 (0,51) 0.010 (0,25) 0.020 (0,51) 0.010 (0,25) 0.055 (1,40) 0.045 (1,14) 0.045 (1,14) 0.035 (0,89) 0.045 (1,14) 0.035 (0,89) 0.028 (0,71) 0.022 (0,54) 0.050 (1,27) 4040140 / D 10/96 NOTES: A. B. C. D. E. All linear dimensions are in inches (millimeters). This drawing is subject to change without notice. This package can be hermetically sealed with a metal lid. The terminals are gold plated. Falls within JEDEC MS-004 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All products are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment. TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standard warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where mandated by government requirements, testing of all parameters of each product is not necessarily performed. TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and applications using TI components. To minimize the risks associated with customer products and applications, customers should provide adequate design and operating safeguards. TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask work right, or other TI intellectual property right relating to any combination, machine, or process in which TI products or services are used. Information published by TI regarding third-party products or services does not constitute a license from TI to use such products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI. Reproduction of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an unfair and deceptive business practice. TI is not responsible or liable for such altered documentation. Information of third parties may be subject to additional restrictions. Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice. TI is not responsible or liable for any such statements. TI products are not authorized for use in safety-critical applications (such as life support) where a failure of the TI product would reasonably be expected to cause severe personal injury or death, unless officers of the parties have executed an agreement specifically governing such use. Buyers represent that they have all necessary expertise in the safety and regulatory ramifications of their applications, and acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any use of TI products in such safety-critical applications, notwithstanding any applications-related information or support that may be provided by TI. Further, Buyers must fully indemnify TI and its representatives against any damages arising out of the use of TI products in such safety-critical applications. TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products are specifically designated by TI as military-grade or "enhanced plastic." Only products designated by TI as military-grade meet military specifications. Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is solely at the Buyer's risk, and that they are solely responsible for compliance with all legal and regulatory requirements in connection with such use. TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products are designated by TI as compliant with ISO/TS 16949 requirements. Buyers acknowledge and agree that, if they use any non-designated products in automotive applications, TI will not be responsible for any failure to meet such requirements. Following are URLs where you can obtain information on other Texas Instruments products and application solutions: Products Amplifiers Data Converters DSP Clocks and Timers Interface Logic Power Mgmt Microcontrollers RFID RF/IF and ZigBee® Solutions amplifier.ti.com dataconverter.ti.com dsp.ti.com www.ti.com/clocks interface.ti.com logic.ti.com power.ti.com microcontroller.ti.com www.ti-rfid.com www.ti.com/lprf Applications Audio Automotive Broadband Digital Control Medical Military Optical Networking Security Telephony Video & Imaging Wireless www.ti.com/audio www.ti.com/automotive www.ti.com/broadband www.ti.com/digitalcontrol www.ti.com/medical www.ti.com/military www.ti.com/opticalnetwork www.ti.com/security www.ti.com/telephony www.ti.com/video www.ti.com/wireless Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265 Copyright © 2008, Texas Instruments Incorporated