TI SN74ACT240N

SN54ACT240, SN74ACT240
OCTAL BUFFERS/DRIVERS
WITH 3-STATE OUTPUTS
SCAS515C – JUNE 1995 – REVISED OCTOBER 2002
D
D
4.5-V to 5.5-V VCC Operation
Inputs Accept Voltages to 5.5 V
1
20
2
19
3
18
4
17
5
16
6
15
7
14
8
13
9
12
10
11
VCC
2OE
1Y1
2A4
1Y2
2A3
1Y3
2A2
1Y4
2A1
1A2
2Y3
1A3
2Y2
1A4
4
3 2 1 20 19
18
5
17
6
16
7
15
8
14
9 10 11 12 13
1Y1
2A4
1Y2
2A3
1Y3
2Y1
GND
2A1
1Y4
2A2
1OE
1A1
2Y4
1A2
2Y3
1A3
2Y2
1A4
2Y1
GND
SN54ACT240 . . . FK PACKAGE
(TOP VIEW)
2Y4
1A1
1OE
VCC
SN54ACT240 . . . J OR W PACKAGE
SN74ACT240 . . . DB, DW, N, NS, OR PW PACKAGE
(TOP VIEW)
Max tpd of 8.5 ns at 5 V
Inputs Are TTL Compatible
2OE
D
D
description/ordering information
These octal buffers and line drivers are designed specifically to improve the performance and density of 3-state
memory address drivers, clock drivers, and bus-oriented receivers and transmitters.
The ’ACT240 devices are organized as two 4-bit buffers/drivers with separate output-enable (OE) inputs. When
OE is low, the device passes inverted data from the A inputs to the Y outputs. When OE is high, the outputs are
in the high-impedance state.
To ensure the high-impedance state during power up or power down, OE should be tied to VCC through a pullup
resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver.
ORDERING INFORMATION
PDIP – N
–55°C to 125°C
TOP-SIDE
MARKING
Tube
SN74ACT240N
Tube
SN74ACT240DW
Tape and reel
SN74ACT240DWR
SOP – NS
Tape and reel
SN74ACT240NSR
ACT240
SSOP – DB
Tape and reel
SN74ACT240DBR
AD240
TSSOP – PW
Tape and reel
SN74ACT240PWR
AD240
CDIP – J
Tube
SNJ54ACT240J
SNJ54ACT240J
CFP – W
Tube
SNJ54ACT240W
SNJ54ACT240W
LCCC – FK
Tube
SNJ54ACT240FK
SOIC – DW
–40°C
40°C to 85°C
ORDERABLE
PART NUMBER
PACKAGE†
TA
SN74ACT240N
ACT240
SNJ54ACT240FK
† Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are
available at www.ti.com/sc/package.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
Copyright  2002, Texas Instruments Incorporated
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.
On products compliant to MIL-PRF-38535, all parameters are tested
unless otherwise noted. On all other products, production
processing does not necessarily include testing of all parameters.
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
1
SN54ACT240, SN74ACT240
OCTAL BUFFERS/DRIVERS
WITH 3-STATE OUTPUTS
SCAS515C – JUNE 1995 – REVISED OCTOBER 2002
FUNCTION TABLE
(each buffer)
INPUTS
OUTPUT
Y
OE
A
L
H
L
L
L
H
H
X
Z
logic diagram (positive logic)
1OE
1A1
1A2
1A3
1A4
1
2OE
2
18
4
16
6
14
8
12
1Y1
2A1
1Y2
2A2
1Y3
2A3
1Y4
2A4
19
11
9
13
7
15
5
17
3
2Y1
2Y2
2Y3
2Y4
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)†
Supply voltage range, VCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.5 V to 7 V
Input voltage range, VI (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.5 V to VCC + 0.5 V
Output voltage range, VO (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.5 V to VCC + 0.5 V
Input clamp current, IIK (VI < 0 or VI > VCC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±20 mA
Output clamp current, IOK (VO < 0 or VO > VCC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±20 mA
Continuous output current, IO (VO = 0 to VCC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±50 mA
Continuous current through VCC or GND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±200 mA
Package thermal impedance, θJA (see Note 2): DB package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 70°C/W
DW package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 58°C/W
N package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 69°C/W
NS package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 60°C/W
PW package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 83°C/W
Storage temperature range, Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –65°C to 150°C
† Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTES: 1. The input and output voltage ratings may be exceeded if the input and output current ratings are observed.
2. The package thermal impedance is calculated in accordance with JESD 51-7.
2
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
SN54ACT240, SN74ACT240
OCTAL BUFFERS/DRIVERS
WITH 3-STATE OUTPUTS
SCAS515C – JUNE 1995 – REVISED OCTOBER 2002
recommended operating conditions (see Note 3)
SN54ACT240
MAX
MIN
MAX
4.5
5.5
4.5
5.5
VCC
VIH
Supply voltage
VIL
VI
Low-level input voltage
Input voltage
0
VO
IOH
Output voltage
0
High-level output current
IOL
∆t/∆v
Low-level output current
High-level input voltage
SN74ACT240
MIN
2
2
V
V
0.8
Input transition rise or fall rate
UNIT
0.8
V
VCC
VCC
V
–24
–24
mA
24
24
mA
8
8
ns/V
VCC
VCC
0
0
V
TA
Operating free-air temperature
–55
125
–40
85
°C
NOTE 3: All unused inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report,
Implications of Slow or Floating CMOS Inputs, literature number SCBA004.
electrical characteristics over recommended operating free-air temperature range (unless
otherwise noted)
PARAMETER
TEST CONDITIONS
4.5 V
IOH = –50
50 µA
VOH
IOH = –24
24 mA
IOH = –50 mA†
IOH = –75 mA†
MIN
TA = 25°C
TYP
MAX
SN54ACT240
MIN
MAX
MIN
4.49
4.4
5.5 V
5.4
5.49
5.4
5.4
4.5 V
3.86
3.7
3.76
5.5 V
4.86
4.7
4.76
MAX
UNIT
4.4
V
3.85
5.5 V
IOL = 24 mA
SN74ACT240
4.4
5.5 V
IOL = 50 µA
VOL
VCC
3.85
4.5 V
0.001
0.1
0.1
5.5 V
0.001
0.1
0.1
0.1
0.1
4.5 V
0.36
0.5
0.44
5.5 V
0.36
0.5
0.44
V
IOL = 50 mA†
IOL = 75 mA†
5.5 V
IOZ
II
VO = VCC or GND
5.5 V
±0.25
±5
±2.5
µA
5.5 V
±0.1
±1
±1
µA
ICC
VI = VCC or GND
VI = VCC or GND,
IO = 0
One input at 3.4 V,
Other inputs at GND or VCC
5.5 V
4
80
40
µA
1.6
1.5
mA
∆ICC‡
Ci
VI = VCC or GND
VI = VCC or GND
1.65
5.5 V
1.65
5.5 V
0.6
5V
2.5
Co
5V
8
† Not more than one output should be tested at a time, and the duration of the test should not exceed 2 ms.
‡ This is the increase in supply current for each input that is at one of the specified TTL voltage levels, rather than 0 V or VCC.
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
pF
pF
3
SN54ACT240, SN74ACT240
OCTAL BUFFERS/DRIVERS
WITH 3-STATE OUTPUTS
SCAS515C – JUNE 1995 – REVISED OCTOBER 2002
switching characteristics over recommended operating
VCC = 5 V ± 0.5 V (unless otherwise noted) (see Figure 1)
PARAMETER
FROM
(INPUT)
TO
(OUTPUT)
tPLH
tPHL
A
Y
tPZH
tPZL
OE
Y
tPHZ
tPLZ
OE
Y
MIN
free-air
TA = 25°C
TYP
MAX
temperature
SN54ACT240
range,
SN74ACT240
MIN
MAX
MIN
MAX
1.5
6
8.5
1
9.5
1.5
9.5
1.5
5.5
7.5
1
9
1.5
8.5
1.5
7
8.5
1
10
1
9.5
2
7
9.5
1
11.5
1.5
10.5
2
8
9.5
1
11
2
10.5
2.5
6.5
10
1
11.5
2
10.5
UNIT
ns
ns
ns
operating characteristics, VCC = 5 V, TA = 25°C
PARAMETER
Cpd
TEST CONDITIONS
Power dissipation capacitance per buffer/driver
CL = 50 pF,
TYP
f = 1 MHz
45
UNIT
pF
PARAMETER MEASUREMENT INFORMATION
2 × VCC
S1
500 Ω
From Output
Under Test
CL = 50 pF
(see Note A)
Open
500 Ω
LOAD CIRCUIT
Output
Control
(low-level
enabling)
3V
Input
1.5 V
1.5 V
0V
tPLH
Output
tPHL
VOH
50% VCC
VOL
50% VCC
TEST
S1
tPLH/tPHL
tPLZ/tPZL
tPHZ/tPZH
Open
2 × VCC
Open
3V
1.5 V
1.5 V
0V
tPLZ
tPZL
≈VCC
Output
Waveform 1
S1 at 2 × VCC
(see Note B)
50% VCC
tPHZ
tPZH
Output
Waveform 2
S1 at Open
(see Note B)
VOLTAGE WAVEFORMS
VOL + 0.3 V
VOL
50% VCC
VOH – 0.3 V
VOH
≈0 V
VOLTAGE WAVEFORMS
NOTES: A. CL includes probe and jig capacitance.
B. Waveform 1 is for an output with internal conditions such that the output is low except when disabled by the output control.
Waveform 2 is for an output with internal conditions such that the output is high except when disabled by the output control.
C. All input pulses are supplied by generators having the following characteristics: PRR ≤ 1 MHz, ZO = 50 Ω, tr ≤ 2.5 ns, tf ≤ 2.5 ns.
D. The outputs are measured one at a time with one input transition per measurement.
Figure 1. Load Circuit and Voltage Waveforms
4
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
PACKAGE OPTION ADDENDUM
www.ti.com
15-Oct-2009
PACKAGING INFORMATION
Orderable Device
Status (1)
Package
Type
Package
Drawing
Pins Package Eco Plan (2)
Qty
5962-8775901M2A
ACTIVE
LCCC
FK
20
1
TBD
5962-8775901MRA
ACTIVE
CDIP
J
20
1
TBD
A42
N / A for Pkg Type
1
TBD
Call TI
N / A for Pkg Type
TBD
Call TI
Call TI
Lead/Ball Finish
MSL Peak Temp (3)
POST-PLATE N / A for Pkg Type
5962-8775901MSA
ACTIVE
CFP
W
20
SN74ACT240DBLE
OBSOLETE
SSOP
DB
20
SN74ACT240DBR
ACTIVE
SSOP
DB
20
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74ACT240DBRE4
ACTIVE
SSOP
DB
20
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74ACT240DBRG4
ACTIVE
SSOP
DB
20
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74ACT240DW
ACTIVE
SOIC
DW
20
25
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74ACT240DWE4
ACTIVE
SOIC
DW
20
25
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74ACT240DWG4
ACTIVE
SOIC
DW
20
25
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74ACT240DWR
ACTIVE
SOIC
DW
20
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74ACT240DWRE4
ACTIVE
SOIC
DW
20
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74ACT240DWRG4
ACTIVE
SOIC
DW
20
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74ACT240N
ACTIVE
PDIP
N
20
20
Pb-Free
(RoHS)
CU NIPDAU
N / A for Pkg Type
SN74ACT240NE4
ACTIVE
PDIP
N
20
20
Pb-Free
(RoHS)
CU NIPDAU
N / A for Pkg Type
SN74ACT240NSR
ACTIVE
SO
NS
20
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74ACT240NSRE4
ACTIVE
SO
NS
20
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74ACT240NSRG4
ACTIVE
SO
NS
20
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74ACT240PW
ACTIVE
TSSOP
PW
20
70
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74ACT240PWE4
ACTIVE
TSSOP
PW
20
70
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74ACT240PWG4
ACTIVE
TSSOP
PW
20
70
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74ACT240PWLE
OBSOLETE
TSSOP
PW
20
SN74ACT240PWR
ACTIVE
TSSOP
PW
20
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74ACT240PWRE4
ACTIVE
TSSOP
PW
20
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74ACT240PWRG4
ACTIVE
TSSOP
PW
20
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SNJ54ACT240FK
ACTIVE
LCCC
FK
20
1
TBD
SNJ54ACT240J
ACTIVE
CDIP
J
20
1
TBD
A42
N / A for Pkg Type
SNJ54ACT240W
ACTIVE
CFP
W
20
1
TBD
Call TI
N / A for Pkg Type
TBD
Addendum-Page 1
Call TI
Call TI
POST-PLATE N / A for Pkg Type
PACKAGE OPTION ADDENDUM
www.ti.com
15-Oct-2009
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
5-Aug-2008
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
Diameter Width
(mm) W1 (mm)
A0 (mm)
B0 (mm)
K0 (mm)
P1
(mm)
W
Pin1
(mm) Quadrant
SN74ACT240DBR
SSOP
DB
20
2000
330.0
16.4
8.2
7.5
2.5
12.0
16.0
Q1
SN74ACT240DWR
SOIC
DW
20
2000
330.0
24.4
10.8
13.0
2.7
12.0
24.0
Q1
SN74ACT240NSR
SO
NS
20
2000
330.0
24.4
8.2
13.0
2.5
12.0
24.0
Q1
SN74ACT240PWR
TSSOP
PW
20
2000
330.0
16.4
6.95
7.1
1.6
8.0
16.0
Q1
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
5-Aug-2008
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
SN74ACT240DBR
SN74ACT240DWR
SSOP
DB
20
2000
346.0
346.0
33.0
SOIC
DW
20
2000
346.0
346.0
41.0
SN74ACT240NSR
SO
NS
20
2000
346.0
346.0
41.0
SN74ACT240PWR
TSSOP
PW
20
2000
346.0
346.0
33.0
Pack Materials-Page 2
MECHANICAL DATA
MSSO002E – JANUARY 1995 – REVISED DECEMBER 2001
DB (R-PDSO-G**)
PLASTIC SMALL-OUTLINE
28 PINS SHOWN
0,38
0,22
0,65
28
0,15 M
15
0,25
0,09
8,20
7,40
5,60
5,00
Gage Plane
1
14
0,25
A
0°–ā8°
0,95
0,55
Seating Plane
2,00 MAX
0,10
0,05 MIN
PINS **
14
16
20
24
28
30
38
A MAX
6,50
6,50
7,50
8,50
10,50
10,50
12,90
A MIN
5,90
5,90
6,90
7,90
9,90
9,90
12,30
DIM
4040065 /E 12/01
NOTES: A.
B.
C.
D.
All linear dimensions are in millimeters.
This drawing is subject to change without notice.
Body dimensions do not include mold flash or protrusion not to exceed 0,15.
Falls within JEDEC MO-150
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
MECHANICAL DATA
MLCC006B – OCTOBER 1996
FK (S-CQCC-N**)
LEADLESS CERAMIC CHIP CARRIER
28 TERMINAL SHOWN
18
17
16
15
14
13
NO. OF
TERMINALS
**
12
19
11
20
10
A
B
MIN
MAX
MIN
MAX
20
0.342
(8,69)
0.358
(9,09)
0.307
(7,80)
0.358
(9,09)
28
0.442
(11,23)
0.458
(11,63)
0.406
(10,31)
0.458
(11,63)
21
9
22
8
44
0.640
(16,26)
0.660
(16,76)
0.495
(12,58)
0.560
(14,22)
23
7
52
0.739
(18,78)
0.761
(19,32)
0.495
(12,58)
0.560
(14,22)
24
6
68
0.938
(23,83)
0.962
(24,43)
0.850
(21,6)
0.858
(21,8)
84
1.141
(28,99)
1.165
(29,59)
1.047
(26,6)
1.063
(27,0)
B SQ
A SQ
25
5
26
27
28
1
2
3
4
0.080 (2,03)
0.064 (1,63)
0.020 (0,51)
0.010 (0,25)
0.020 (0,51)
0.010 (0,25)
0.055 (1,40)
0.045 (1,14)
0.045 (1,14)
0.035 (0,89)
0.045 (1,14)
0.035 (0,89)
0.028 (0,71)
0.022 (0,54)
0.050 (1,27)
4040140 / D 10/96
NOTES: A.
B.
C.
D.
E.
All linear dimensions are in inches (millimeters).
This drawing is subject to change without notice.
This package can be hermetically sealed with a metal lid.
The terminals are gold plated.
Falls within JEDEC MS-004
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
MECHANICAL DATA
MTSS001C – JANUARY 1995 – REVISED FEBRUARY 1999
PW (R-PDSO-G**)
PLASTIC SMALL-OUTLINE PACKAGE
14 PINS SHOWN
0,30
0,19
0,65
14
0,10 M
8
0,15 NOM
4,50
4,30
6,60
6,20
Gage Plane
0,25
1
7
0°– 8°
A
0,75
0,50
Seating Plane
0,15
0,05
1,20 MAX
PINS **
0,10
8
14
16
20
24
28
A MAX
3,10
5,10
5,10
6,60
7,90
9,80
A MIN
2,90
4,90
4,90
6,40
7,70
9,60
DIM
4040064/F 01/97
NOTES: A.
B.
C.
D.
All linear dimensions are in millimeters.
This drawing is subject to change without notice.
Body dimensions do not include mold flash or protrusion not to exceed 0,15.
Falls within JEDEC MO-153
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
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