TI SNJ54BCT2244FK

SN54BCT2244, SN74BCT2244
OCTAL BUFFERS AND LINE/MOS DRIVERS
WITH 3-STATE OUTPUTS
SCBS017D – SEPTEMBER 1988 – REVISED MARCH 2003
D
D
SN54BCT2244 . . . J OR W PACKAGE
SN74BCT2244 . . . DW, N, OR NS PACKAGE
(TOP VIEW)
Operating Voltage Range of 4.5 V to 5.5 V
State-of-the-Art BiCMOS Design
Significantly Reduces ICCZ
Output Ports Have Equivalent 33-Ω Series
Resistors, So No External Resistors Are
Required
3-State Outputs Drive Bus Lines or Buffer
Memory Address Registers
1OE
1A1
2Y4
1A2
2Y3
1A3
2Y2
1A4
2Y1
GND
description/ordering information
The ’BCT2244 devices are designed specifically
to improve both the performance and density of
3-state memory address drivers, clock drivers,
and bus-oriented receivers and transmitters.
Together with the ’BCT2240 devices and
SN74BCT2241, these devices provide the choice
of selected combinations of inverting and
noninverting outputs, symmetrical active-low
output-enable (OE) inputs, and complementary
OE and OE inputs. These devices feature high
fan-out and improved fan-in.
1
20
2
19
3
18
4
17
5
16
6
15
7
14
8
13
9
12
10
11
VCC
2OE
1Y1
2A4
1Y2
2A3
1Y3
2A2
1Y4
2A1
2Y4
1A1
1OE
VCC
SN54BCT2244 . . . FK PACKAGE
(TOP VIEW)
1A2
2Y3
1A3
2Y2
1A4
4
3 2 1 20 19
18
5
17
6
16
7
15
8
14
9 10 11 12 13
1Y1
2A4
1Y2
2A3
1Y3
2Y1
GND
2A1
1Y4
2A2
To ensure the high-impedance state during power
up or power down, OE should be tied to VCC
through a pullup resistor; the minimum value of
the resistor is determined by the current-sinking
capability of the driver.
2OE
D
D
The outputs, which are designed to source or sink
up to 12 mA, include 33-Ω series resistors to
reduce overshoot and undershoot.
ORDERING INFORMATION
PDIP – N
0°C to 70°C
–55°C to 125°C
ORDERABLE
PART NUMBER
PACKAGE†
TA
TOP-SIDE
MARKING
Tube
SN74BCT2244N
Tube
SN74BCT2244DW
Tape and reel
SN74BCT2244DWR
SOP – NS
Tape and reel
SN74BCT2244NSR
BCT2244
CDIP – J
Tube
SNJ54BCT2244J
SNJ54BCT2244J
CFP – W
Tube
SNJ54BCT2244W
SNJ54BCT2244W
SOIC – DW
SN74BCT2244N
BCT2244
LCCC – FK
Tube
SNJ54BCT2244FK
SNJ54BCT2244FK
† Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are
available at www.ti.com/sc/package.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
Copyright  2003, Texas Instruments Incorporated
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.
On products compliant to MIL-PRF-38535, all parameters are tested
unless otherwise noted. On all other products, production
processing does not necessarily include testing of all parameters.
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
1
SN54BCT2244, SN74BCT2244
OCTAL BUFFERS AND LINE/MOS DRIVERS
WITH 3-STATE OUTPUTS
SCBS017D – SEPTEMBER 1988 – REVISED MARCH 2003
FUNCTION TABLE
(each buffer)
INPUTS
OE
A
OUTPUT
Y
L
H
H
L
L
L
H
X
Z
logic diagram (positive logic)
1
1OE
1A1
1A2
1A3
1A4
2OE
2A1
2A2
2A3
2A4
2
2
18
4
16
6
14
8
12
1Y1
1Y2
1Y3
1Y4
19
11
9
13
7
15
5
17
3
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
2Y1
2Y2
2Y3
2Y4
SN54BCT2244, SN74BCT2244
OCTAL BUFFERS AND LINE/MOS DRIVERS
WITH 3-STATE OUTPUTS
SCBS017D – SEPTEMBER 1988 – REVISED MARCH 2003
schematic of Y outputs
VCC
Output
GND
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)†
Supply voltage range, VCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.5 V to 7 V
Input voltage range, VI (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.5 V to 7 V
Voltage range applied to any output in the disabled or power-off state, VO . . . . . . . . . . . . . . . . –0.5 V to 5.5 V
Voltage range applied to any output in the high state, VO . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.5 V to VCC
Input clamp current, IIK . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –30 mA
Current into any output in the low state, IO . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24 mA
Package thermal impedance, θJA (see Note 2): DW package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 58°C/W
N package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 69°C/W
NS package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 60°C/W
Storage temperature range, Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –65°C to 150°C
† Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTES: 1. The input and output voltage ratings may be exceeded if the input and output current ratings are observed.
2. The package thermal impedance is calculated in accordance with JESD 51-7.
recommended operating conditions(see Note 3)
SN54BCT2244
SN74BCT2244
MIN
NOM
MAX
MIN
NOM
MAX
4.5
5
5.5
4.5
5
5.5
UNIT
VCC
VIH
Supply voltage
VIL
IIK
Low-level input voltage
0.8
0.8
V
Input clamp current
–18
–18
mA
IOH
IOL
High-level output current
–12
–12
mA
Low-level output current
12
12
mA
High-level input voltage
2
2
V
V
TA
Operating free-air temperature
–55
125
0
70
°C
NOTE 3: All unused inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report,
Implications of Slow or Floating CMOS Inputs, literature number SCBA004.
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
3
SN54BCT2244, SN74BCT2244
OCTAL BUFFERS AND LINE/MOS DRIVERS
WITH 3-STATE OUTPUTS
SCBS017D – SEPTEMBER 1988 – REVISED MARCH 2003
electrical characteristics over recommended operating free-air temperature range (unless
otherwise noted)
PARAMETER
VIK
SN54BCT2244
TYP†
MAX
TEST CONDITIONS
VCC = 4.5 V,
MIN
II = –18 mA
IOH = –1 mA
VOH
VCC = 4
4.5
5V
VOL
VCC = 4
4.5
5V
II
VCC = 5.5 V,
IOL = 12 mA
VI = 7 V
IIH
IIL
VCC = 5.5 V,
VCC = 5.5 V,
IOZH
SN74BCT2244
TYP†
MAX
MIN
–1.2
–1.2
2.4
2.4
2
2
IOH = –12 mA
IOL = 1 mA
UNIT
V
V
0.15
0.5
0.15
0.5
0.35
0.8
0.35
0.8
V
0.1
0.1
VI = 2.7 V
20
20
µA
VI = 0.5 V
–1
–1
mA
VCC = 5.5 V,
VO = 2.7 V
50
50
µA
IOZL
IOS‡
VCC = 5.5 V,
VO = 0.5 V
VCC = 5.5 V,
VO = 0
ICCH
ICCL
VCC = 5.5 V,
VCC = 5.5 V,
Outputs open
23
37
Outputs open
53
77
ICCZ
Ci
VCC = 5.5 V,
VCC = 5 V,
Outputs open
6.5
10
–50
µA
–225
mA
23
37
mA
53
77
mA
6.5
10
mA
–50
–100
–225
–100
VI = 2.5 V or 0.5 V
6
VCC = 5 V,
VO = 2.5 V or 0.5 V
11
† All typical values are at VCC = 5 V, TA = 25°C.
‡ Not more than one output should be tested at a time, and the duration of the test should not exceed one second.
Co
mA
6
pF
11
pF
switching characteristics over recommended ranges of supply voltage and operating free-air
temperature, CL = 50 pF (unless otherwise noted) (see Figure 1)
FROM
(INPUT)
TO
(OUTPUT)
tPLH
tPHL
A
Y
tPZH
tPZL
OE
Y
tPHZ
tPLZ
OE
Y
PARAMETER
VCC = 5 V,
TA = 25°C
SN54BCT2244
MIN
TYP
MAX
MIN
MAX
MIN
MAX
0.5
3
4.4
0.5
5.2
0.5
4.9
1.6
4.6
6.3
1.6
7.1
1.6
6.7
2.4
6.1
7.7
2.4
9.1
2.4
8.7
3.9
7.6
9.4
3.9
10.8
3.9
10.4
1.7
5.2
6.9
1.7
8.1
1.7
7.8
2.8
6.5
8.3
2.8
10.9
2.8
9.8
PARAMETER MEASUREMENT INFORMATION
4
POST OFFICE BOX 655303
SN74BCT2244
• DALLAS, TEXAS 75265
UNIT
ns
ns
ns
SN54BCT2244, SN74BCT2244
OCTAL BUFFERS AND LINE/MOS DRIVERS
WITH 3-STATE OUTPUTS
SCBS017D – SEPTEMBER 1988 – REVISED MARCH 2003
7 V (tPZL, tPLZ, O.C.)
S1
Open
(all others)
From Output
Under Test
Test
Point
CL
(see Note A)
R1
From Output
Under Test
R1
Test
Point
CL
(see Note A)
R2
LOAD CIRCUIT FOR
TOTEM-POLE OUTPUTS
RL = R1 = R2
LOAD CIRCUIT FOR
3-STATE AND OPEN-COLLECTOR OUTPUTS
High-Level
Pulse
(see Note B)
3V
Timing Input
(see Note B)
3V
1.5 V
1.5 V
0V
1.5 V
tw
0V
Data Input
(see Note B)
3V
th
tsu
Low-Level
Pulse
3V
1.5 V
1.5 V
0V
1.5 V
1.5 V
VOLTAGE WAVEFORMS
PULSE DURATION
0V
VOLTAGE WAVEFORMS
SETUP AND HOLD TIMES
3V
3V
Input
(see Note B)
1.5 V
1.5 V
0V
tPLH
In-Phase
Output
(see Note D)
VOH
1.5 V
1.5 V
VOL
VOH
1.5 V
1.5 V
0V
tPLZ
1.5 V
Waveform 1
(see Notes C and D)
3.5 V
VOL
tPHZ
tPLH
1.5 V
1.5 V
tPZL
tPHL
tPHL
Out-of-Phase
Output
(see Note D)
Output
Control
(low-level enable)
0.3 V
tPZH
Waveform 2
(see Notes C and D)
VOL
VOLTAGE WAVEFORMS
PROPAGATION DELAY TIMES (see Note D)
VOH
1.5 V
0.3 V
0V
VOLTAGE WAVEFORMS
ENABLE AND DISABLE TIMES, 3-STATE OUTPUTS
NOTES: A. CL includes probe and jig capacitance.
B. All input pulses are supplied by generators having the following characteristics: PRR ≤ 10 MHz, tr = tf ≤ 2.5 ns, duty cycle = 50%.
C. Waveform 1 is for an output with internal conditions such that the output is low except when disabled by the output control.
Waveform 2 is for an output with internal conditions such that the output is high except when disabled by the output control.
D. The outputs are measured one at a time with one transition per measurement.
E. When measuring propagation delay times of 3-state outputs, switch S1 is open.
F. All parameters and waveforms are not applicable to all devices.
Figure 1. Load Circuit and Voltage Waveforms
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
5
PACKAGE OPTION ADDENDUM
www.ti.com
9-Oct-2007
PACKAGING INFORMATION
Orderable Device
Status (1)
Package
Type
Package
Drawing
Pins Package Eco Plan (2)
Qty
5962-9074101M2A
ACTIVE
LCCC
FK
20
1
TBD
5962-9074101MRA
ACTIVE
CDIP
J
20
1
TBD
5962-9074101MSA
ACTIVE
CFP
W
20
1
SN74BCT2244DW
ACTIVE
SOIC
DW
20
25
SN74BCT2244DWE4
ACTIVE
SOIC
DW
20
25
SN74BCT2244DWG4
ACTIVE
SOIC
DW
20
25
SN74BCT2244DWR
ACTIVE
SOIC
DW
SN74BCT2244DWRE4
ACTIVE
SOIC
SN74BCT2244DWRG4
ACTIVE
SN74BCT2244N
Lead/Ball Finish
MSL Peak Temp (3)
POST-PLATE N / A for Pkg Type
A42 SNPB
N / A for Pkg Type
TBD
A42
N / A for Pkg Type
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
20
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
DW
20
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SOIC
DW
20
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
ACTIVE
PDIP
N
20
20
Pb-Free
(RoHS)
CU NIPDAU
N / A for Pkg Type
SN74BCT2244NE4
ACTIVE
PDIP
N
20
20
Pb-Free
(RoHS)
CU NIPDAU
N / A for Pkg Type
SN74BCT2244NSR
ACTIVE
SO
NS
20
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74BCT2244NSRE4
ACTIVE
SO
NS
20
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74BCT2244NSRG4
ACTIVE
SO
NS
20
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SNJ54BCT2244FK
ACTIVE
LCCC
FK
20
1
TBD
SNJ54BCT2244J
ACTIVE
CDIP
J
20
1
TBD
A42 SNPB
N / A for Pkg Type
SNJ54BCT2244W
ACTIVE
CFP
W
20
1
TBD
A42
N / A for Pkg Type
POST-PLATE N / A for Pkg Type
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
9-Oct-2007
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
11-Mar-2008
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
SN74BCT2244DWR
Package Package Pins
Type Drawing
SOIC
DW
20
SPQ
Reel
Reel
Diameter Width
(mm) W1 (mm)
2000
330.0
24.4
Pack Materials-Page 1
A0 (mm)
B0 (mm)
K0 (mm)
P1
(mm)
W
Pin1
(mm) Quadrant
10.8
13.0
2.7
12.0
24.0
Q1
PACKAGE MATERIALS INFORMATION
www.ti.com
11-Mar-2008
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
SN74BCT2244DWR
SOIC
DW
20
2000
346.0
346.0
41.0
Pack Materials-Page 2
MECHANICAL DATA
MLCC006B – OCTOBER 1996
FK (S-CQCC-N**)
LEADLESS CERAMIC CHIP CARRIER
28 TERMINAL SHOWN
18
17
16
15
14
13
NO. OF
TERMINALS
**
12
19
11
20
10
A
B
MIN
MAX
MIN
MAX
20
0.342
(8,69)
0.358
(9,09)
0.307
(7,80)
0.358
(9,09)
28
0.442
(11,23)
0.458
(11,63)
0.406
(10,31)
0.458
(11,63)
21
9
22
8
44
0.640
(16,26)
0.660
(16,76)
0.495
(12,58)
0.560
(14,22)
23
7
52
0.739
(18,78)
0.761
(19,32)
0.495
(12,58)
0.560
(14,22)
24
6
68
0.938
(23,83)
0.962
(24,43)
0.850
(21,6)
0.858
(21,8)
84
1.141
(28,99)
1.165
(29,59)
1.047
(26,6)
1.063
(27,0)
B SQ
A SQ
25
5
26
27
28
1
2
3
4
0.080 (2,03)
0.064 (1,63)
0.020 (0,51)
0.010 (0,25)
0.020 (0,51)
0.010 (0,25)
0.055 (1,40)
0.045 (1,14)
0.045 (1,14)
0.035 (0,89)
0.045 (1,14)
0.035 (0,89)
0.028 (0,71)
0.022 (0,54)
0.050 (1,27)
4040140 / D 10/96
NOTES: A.
B.
C.
D.
E.
All linear dimensions are in inches (millimeters).
This drawing is subject to change without notice.
This package can be hermetically sealed with a metal lid.
The terminals are gold plated.
Falls within JEDEC MS-004
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
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products in automotive applications, TI will not be responsible for any failure to meet such requirements.
Following are URLs where you can obtain information on other Texas Instruments products and application solutions:
Products
Amplifiers
Data Converters
DSP
Clocks and Timers
Interface
Logic
Power Mgmt
Microcontrollers
RFID
RF/IF and ZigBee® Solutions
amplifier.ti.com
dataconverter.ti.com
dsp.ti.com
www.ti.com/clocks
interface.ti.com
logic.ti.com
power.ti.com
microcontroller.ti.com
www.ti-rfid.com
www.ti.com/lprf
Applications
Audio
Automotive
Broadband
Digital Control
Medical
Military
Optical Networking
Security
Telephony
Video & Imaging
Wireless
www.ti.com/audio
www.ti.com/automotive
www.ti.com/broadband
www.ti.com/digitalcontrol
www.ti.com/medical
www.ti.com/military
www.ti.com/opticalnetwork
www.ti.com/security
www.ti.com/telephony
www.ti.com/video
www.ti.com/wireless
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