SN54HC08, SN74HC08 QUADRUPLE 2-INPUT POSITIVE-AND GATES www.ti.com SCLS081F – DECEMBER 1982 – REVISED JANUARY 2007 FEATURES • • • Typical tpd = 8 ns ±4-mA Output Drive at 5 V Low Input Current of 1 µA Max 3 12 4 11 5 10 6 9 7 8 VCC 4B 4A 4Y 3B 3A 3Y 1Y NC 2A NC 2B 2 20 19 18 5 17 1 4B 3 4 6 16 7 15 14 8 4A NC 4Y NC 3B 9 10 11 12 13 3A 13 VCC 14 2 3Y 1 2Y 1A 1B 1Y 2A 2B 2Y GND 1B SN54HC04...FK PACKAGE (TOP VIEW) SN54HC04...J OR W PACKAGE SN74HC04...D, DB, N, NS, OR PW PACKAGE (TOP VIEW) 1A NC Wide Operating Voltage Range of 2 V to 6 V Outputs Can Drive Up To 10 LSTTL Loads Low Power Consumption, 20-µA Max ICC GND NC • • • NC – No internal connection DESCRIPTION/ORDERING INFORMATION The ’HC08 devices contain four independent 2-input AND gates. They perform the Boolean function Y = A • B or Y = A +B in positive logic. ORDERING INFORMATION PACKAGE (1) TA PDIP – N SOIC – D –40°C to 85°C (1) SN74HC08N Reel of 1000 SN74HC08DE4 Reel of 2500 SN74HC08DR Tube of 250 SN74HC08DT SOP – NS Reel of 2000 SSOP – DB Reel of 2000 TOP-SIDE MARKING SN74HC08N HC08 SN74HC08NSR SN74HC08NSRG4 SN74HC08DBR SN74HC08DBRE4 HC08 HC08 Tube of 90 SN74HC08PW Reel of 2000 SN74HC08PWR Tube of 250 SN74HC08PWT CDIP – J Reel of 1000 SNJ54HC08J SNJ54HC08J CFP – W Reel of 900 SNJ54HC08W SNJ54HC08W LCCC –FK Reel of 2200 SNJ54HC08FK SNJ54HC08JFK TSSOP – PW –55°C to 125°C ODERABLE PART NUMBER Reel of 1000 HC08 Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at www.ti.com/sc/package. Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright © 1982–2007, Texas Instruments Incorporated SN54HC08, SN74HC08 QUADRUPLE 2-INPUT POSITIVE-AND GATES www.ti.com SCLS081F – DECEMBER 1982 – REVISED JANUARY 2007 FUNCTION TABLE (EACH INVERTER) INPUTS OUTPUT Y A B H H H L X L X L L LOGIC DIAGRAM (POSITIVE LOGIC) A Y B Absolute Maximum Ratings (1) over operating free-air temperature range (unless otherwise noted) MIN –0.5 Supply voltage range IIK Input clamp current (2) VI < 0 or VI > VCC ±20 mA IOK Output clamp current (2) VO < 0 ±20 mA IO Continuous output current VO = 0 to VCC ±25 mA ±50 mA θJA Tstg (1) (2) (3) Package thermal impedance (3) 7 UNIT VCC Continuous current through VCCor GND 2 MAX D package 86 DB package 96 N package 80 NS package 76 PW package 113 Storage temperature range –60 150 V °C/W °C Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. The input and output voltage ratings may be exceeded if the input and output current ratings are observed. The package thermal impedance is calculated in accordance with JESD 51-7. Submit Documentation Feedback SN54HC08, SN74HC08 QUADRUPLE 2-INPUT POSITIVE-AND GATES www.ti.com SCLS081F – DECEMBER 1982 – REVISED JANUARY 2007 Recommended Operating Conditions (1) SN54HC08 VCC Supply voltage VCC = 2 V VIH High-level input voltage VCC = 4.5 V VCC = 6 V MIN NOM MAX 2 5 6 Low-level input voltage MIN NOM MAX 2 5 6 1.5 1.5 3.15 3.15 4.2 4.2 VCC = 2 V VIL SN74HC08 VCC = 4.5 V VCC = 6 V UNIT V V 0.5 0.5 1.35 1.35 1.8 1.8 V VI Input voltage 0 VCC 0 VCC V VO Output voltage 0 VCC 0 VCC V VCC = 2 V ∆t/∆v Input transition rise or fall rate TA (1) Operating free-air temperature 1000 1000 VCC = 4.5 V 500 500 VCC = 6 V 400 400 –55 125 –40 85 ns °C All unused inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report, Implications of Slow or Floating CMOS Inputs, literature number SCBA004. Submit Documentation Feedback 3 SN54HC08, SN74HC08 QUADRUPLE 2-INPUT POSITIVE-AND GATES www.ti.com SCLS081F – DECEMBER 1982 – REVISED JANUARY 2007 Electrical Characteristics over operating free-air temperature range (unless otherwise noted) PARAMETER TEST CONDITIONS IOH = –20 µA VOH VI = VIH or VIL IOH = –4 mA IOH = –5.2 mA VOL ICC VI = VCC or 0, SN54HC08 MAX MIN SN74HC08 TYP 2V 1.9 1.998 1.9 1.9 4.5 V 4.4 4.499 4.4 4.4 6V 5.9 5.999 5.9 5.9 4.5 V 3.98 4.3 3.7 3.84 6V 5.48 5.8 MAX 5.2 MIN MAX UNIT V 5.34 0.002 0.1 0.1 0.1 IOL = 20 µA 4.5 V 0.001 0.1 0.1 0.1 6V 0.001 0.1 0.1 0.1 IOL = 4 mA 4.5 V 0.17 0.26 0.4 0.33 6V 0.15 0.26 0.4 0.33 6V ±0.1 ±100 ±1000 ±1000 nA 2 40 20 µA 3 10 10 10 pF IOL = 5.2 mA VI = VCC or 0 TA = 25°C MIN 2V VI = VIH or VIL II VCC IO = 0 6V Ci 2 V to 6 V V Switching Characteristics over operating free-air temperature range, CL = 50 pF (unless otherwise noted) (see Figure 1) PARAMETER FROM (INPUT) TO (OUTPUT) VCC tpd A Y tt Y TA = 25°C MIN SN54HC08 MIN SN74HC08 TYP MAX MAX MIN MAX 2V 50 100 150 125 4.5 V 10 20 30 25 6V 8 17 25 24 2V 38 75 110 95 4.5 V 8 15 22 19 6V 6 13 19 16 UNIT ns ns Operating Characteristics TA = 25°C PARAMETER Cpd 4 Power dissipation capacitance per inverter TEST CONDITIONS No load Submit Documentation Feedback TYP 20 UNIT pF SN54HC08, SN74HC08 QUADRUPLE 2-INPUT POSITIVE-AND GATES www.ti.com SCLS081F – DECEMBER 1982 – REVISED JANUARY 2007 PARAMETER MEASURMENT INFORMATION From Output Under Test Test Point Input VCC 50% 0V CL = 50 pF (see Note A) 50% 10% 90% In-Phase Output 90% tr tPHL tPLH LOAD CIRCUIT Input 50% 50% 10% 0V tPHL 90% VOH 50% 10% Out-of-Phase Output VOL tf tPLH 50% 10% tf VOLTAGE WAVEFORMS INPUT RISE AND FALL TIMES 90% tr VCC 50% 10% 90% 50% 10% 90% tf VOH VOL tr VOLTAGE WAVEFORMS PROPAGATION DELAY AND OUTPUT TRANSITION TIMES NOTES: A. CL includes probe and test-fixture capacitance. B. Phase relationships between waveforms were chosen arbitrarily. All input pulses are supplied by generators having the following characteristics: PRR ≤ 1 MHz, ZO = 50 Ω, tr = 6 ns, tf = 6 ns. C. The outputs are measured one at a time with one input transition per measurement. D. tPLH and tPHL are the same as tpd. Figure 1. Load Circuit and Voltage Waveforms Submit Documentation Feedback 5 PACKAGE OPTION ADDENDUM www.ti.com 23-Jan-2007 PACKAGING INFORMATION Orderable Device Status (1) Package Type 5962-8404701VCA ACTIVE CDIP J 14 1 TBD A42 SNPB N / A for Pkg Type 5962-8404701VDA ACTIVE CFP W 14 1 TBD A42 N / A for Pkg Type Package Drawing Pins Package Eco Plan (2) Qty Lead/Ball Finish MSL Peak Temp (3) 84047012A ACTIVE LCCC FK 20 1 TBD 8404701CA ACTIVE CDIP J 14 1 TBD POST-PLATE N / A for Pkg Type A42 SNPB N / A for Pkg Type 8404701DA ACTIVE CFP W 14 1 TBD A42 N / A for Pkg Type JM38510/65203B2A ACTIVE LCCC FK 20 1 TBD JM38510/65203BCA ACTIVE CDIP J 14 1 TBD POST-PLATE N / A for Pkg Type A42 SNPB N / A for Pkg Type JM38510/65203BDA ACTIVE CFP W 14 1 TBD A42 N / A for Pkg Type N / A for Pkg Type SN54HC08J ACTIVE CDIP J 14 1 TBD A42 SNPB SN74HC08D ACTIVE SOIC D 14 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74HC08DBR ACTIVE SSOP DB 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74HC08DBRE4 ACTIVE SSOP DB 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74HC08DE4 ACTIVE SOIC D 14 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74HC08DG4 ACTIVE SOIC D 14 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74HC08DR ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74HC08DRE4 ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74HC08DRG4 ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74HC08DT ACTIVE SOIC D 14 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74HC08DTE4 ACTIVE SOIC D 14 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74HC08N ACTIVE PDIP N 14 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type SN74HC08N3 OBSOLETE PDIP N 14 TBD Call TI SN74HC08NE4 ACTIVE PDIP N 14 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type SN74HC08NSR ACTIVE SO NS 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74HC08NSRE4 ACTIVE SO NS 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74HC08NSRG4 ACTIVE SO NS 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74HC08PW ACTIVE TSSOP PW 14 90 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74HC08PWE4 ACTIVE TSSOP PW 14 90 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74HC08PWG4 ACTIVE TSSOP PW 14 90 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74HC08PWLE OBSOLETE TSSOP PW 14 TBD Call TI 25 Addendum-Page 1 Call TI Call TI PACKAGE OPTION ADDENDUM www.ti.com 23-Jan-2007 Orderable Device Status (1) Package Type Package Drawing Pins Package Eco Plan (2) Qty SN74HC08PWR ACTIVE TSSOP PW 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74HC08PWRE4 ACTIVE TSSOP PW 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74HC08PWRG4 ACTIVE TSSOP PW 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74HC08PWT ACTIVE TSSOP PW 14 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74HC08PWTE4 ACTIVE TSSOP PW 14 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74HC08PWTG4 ACTIVE TSSOP PW 14 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SNJ54HC08FK ACTIVE LCCC FK 20 1 TBD Lead/Ball Finish MSL Peak Temp (3) POST-PLATE N / A for Pkg Type SNJ54HC08J ACTIVE CDIP J 14 1 TBD A42 SNPB N / A for Pkg Type SNJ54HC08W ACTIVE CFP W 14 1 TBD A42 N / A for Pkg Type SNV54HC08J ACTIVE CDIP J 14 TBD Call TI Call TI SNV54HC08W ACTIVE CFP W 14 TBD Call TI Call TI (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 2 MECHANICAL DATA MLCC006B – OCTOBER 1996 FK (S-CQCC-N**) LEADLESS CERAMIC CHIP CARRIER 28 TERMINAL SHOWN 18 17 16 15 14 13 NO. OF TERMINALS ** 12 19 11 20 10 A B MIN MAX MIN MAX 20 0.342 (8,69) 0.358 (9,09) 0.307 (7,80) 0.358 (9,09) 28 0.442 (11,23) 0.458 (11,63) 0.406 (10,31) 0.458 (11,63) 21 9 22 8 44 0.640 (16,26) 0.660 (16,76) 0.495 (12,58) 0.560 (14,22) 23 7 52 0.739 (18,78) 0.761 (19,32) 0.495 (12,58) 0.560 (14,22) 24 6 68 0.938 (23,83) 0.962 (24,43) 0.850 (21,6) 0.858 (21,8) 84 1.141 (28,99) 1.165 (29,59) 1.047 (26,6) 1.063 (27,0) B SQ A SQ 25 5 26 27 28 1 2 3 4 0.080 (2,03) 0.064 (1,63) 0.020 (0,51) 0.010 (0,25) 0.020 (0,51) 0.010 (0,25) 0.055 (1,40) 0.045 (1,14) 0.045 (1,14) 0.035 (0,89) 0.045 (1,14) 0.035 (0,89) 0.028 (0,71) 0.022 (0,54) 0.050 (1,27) 4040140 / D 10/96 NOTES: A. B. C. D. E. All linear dimensions are in inches (millimeters). This drawing is subject to change without notice. This package can be hermetically sealed with a metal lid. The terminals are gold plated. Falls within JEDEC MS-004 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 MECHANICAL DATA MSSO002E – JANUARY 1995 – REVISED DECEMBER 2001 DB (R-PDSO-G**) PLASTIC SMALL-OUTLINE 28 PINS SHOWN 0,38 0,22 0,65 28 0,15 M 15 0,25 0,09 8,20 7,40 5,60 5,00 Gage Plane 1 14 0,25 A 0°–ā8° 0,95 0,55 Seating Plane 2,00 MAX 0,10 0,05 MIN PINS ** 14 16 20 24 28 30 38 A MAX 6,50 6,50 7,50 8,50 10,50 10,50 12,90 A MIN 5,90 5,90 6,90 7,90 9,90 9,90 12,30 DIM 4040065 /E 12/01 NOTES: A. B. C. D. All linear dimensions are in millimeters. This drawing is subject to change without notice. Body dimensions do not include mold flash or protrusion not to exceed 0,15. Falls within JEDEC MO-150 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 MECHANICAL DATA MTSS001C – JANUARY 1995 – REVISED FEBRUARY 1999 PW (R-PDSO-G**) PLASTIC SMALL-OUTLINE PACKAGE 14 PINS SHOWN 0,30 0,19 0,65 14 0,10 M 8 0,15 NOM 4,50 4,30 6,60 6,20 Gage Plane 0,25 1 7 0°– 8° A 0,75 0,50 Seating Plane 0,15 0,05 1,20 MAX PINS ** 0,10 8 14 16 20 24 28 A MAX 3,10 5,10 5,10 6,60 7,90 9,80 A MIN 2,90 4,90 4,90 6,40 7,70 9,60 DIM 4040064/F 01/97 NOTES: A. B. C. D. All linear dimensions are in millimeters. This drawing is subject to change without notice. Body dimensions do not include mold flash or protrusion not to exceed 0,15. Falls within JEDEC MO-153 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue any product or service without notice. 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