MICROCHIP 23LCV512

23LCV512
512 Kbit SPI Serial SRAM with Battery Backup and SDI Interface
Device Selection Table
Part
Number
23LCV512
VCC Range
Dual I/O
(SDI)
Battery
Backup
Max. Clock
Frequency
2.5-5.5V
Yes
Yes
20 MHz
Packages
SN, ST, P
Features:
Description:
• SPI-Compatible Bus Interface:
- 20 MHz Clock rate
- SPI/SDI mode
• Low-Power CMOS Technology:
- Read Current: 3 mA at 5.5V, 20 MHz
- Standby Current: 4 A at +85°C
• Unlimited Read and Write Cycles
• External Battery Backup support
• Zero Write Time
• 64K x 8-bit Organization:
- 32-byte page
• Byte, Page and Sequential mode for Reads and
Writes
• High Reliability
• Temperature Range Supported:
- Industrial (I):
-40C to +85C
The Microchip Technology Inc. 23LCV512 is a 512 Kbit
Serial SRAM device. The memory is accessed via a
simple Serial Peripheral Interface (SPI) compatible
serial bus. The bus signals required are a clock input
(SCK) plus separate data in (SI) and data out (SO)
lines. Access to the device is controlled through a Chip
Select (CS) input. Additionally, SDI (Serial Dual Interface) is supported if your application needs faster data
rates.
This device also supports unlimited reads and writes to
the memory array, and supports data backup via external battery/coin cell connected to VBAT (pin 7).
The 23LCV512 is available in standard packages
including 8-lead SOIC, PDIP and advanced 8-lead
TSSOP.
Package Types (not to scale)
• Pb-Free and RoHS Compliant, Halogen Free.
• 8-Lead SOIC, TSSOP and PDIP Packages
Pin Function Table
Name
SOIC/TSSOP/PDIP
Function
CS
Chip Select Input
SO/SIO1
Serial Output/SDI pin
Vss
Ground
SI/SIO0
Serial Input/SDI pin
SCK
Serial Clock
VBAT
External Backup Supply Input
Vcc
Power Supply
 2012 Microchip Technology Inc.
Preliminary
CS
1
8
Vcc
SO/SIO1
2
7
VBAT
NC
3
6
SCK
Vss
4
5
SI/SIO0
DS25157A-page 1
23LCV512
1.0
ELECTRICAL CHARACTERISTICS
Absolute Maximum Ratings (†)
VCC .............................................................................................................................................................................6.5V
All inputs and outputs w.r.t. VSS ......................................................................................................... -0.3V to VCC +0.3V
Storage temperature ...............................................................................................................................-65°C to +150°C
Ambient temperature under bias ...............................................................................................................-40°C to +85°C
† NOTICE: Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the
device. This is a stress rating only and functional operation of the device at those or any other conditions above those
indicated in the operational listings of this specification is not implied. Exposure to maximum rating conditions for an
extended period of time may affect device reliability.
TABLE 1-1:
DC CHARACTERISTICS
DC CHARACTERISTICS
Param.
No.
Sym.
Characteristic
TA = -40°C to +85°C
Industrial (I):
Min.
Typ.(1)
Max.
Units
Test Conditions
D001
VCC
Supply voltage
2.5
—
5.5
V
D002
VIH
High-level input
voltage
.7 VCC
—
VCC +0.3
V
D003
VIL
Low-level input
voltage
-0.3
—
0.10xVCC
V
23LCV512
D004
VOL
Low-level output
voltage
—
—
0.2
V
IOL = 1 mA
D005
VOH
High-level output
voltage
VCC -0.5
—
—
V
IOH = -400 A
D006
ILI
Input leakage
current
—
—
±1
A
CS = VCC, VIN = VSS OR VCC
D007
ILO
Output leakage
current
—
—
±1
A
CS = VCC, VOUT = VSS OR VCC
D008
ICC Read Operating current
—
3
10
mA
FCLK = 20 MHz; SO = O, 5.5V
D009
ICCS
Standby current
—
4
10
A
CS = VCC = 5.5V, Inputs tied to
VCC or VSS
D010
CINT
Input capacitance
—
—
7
pF
VCC = 0V, f = 1 MHz, Ta = 25°C
(Note 1)
D011
VDR
RAM data retention
voltage
—
1.0
—
V
(Note 2)
D012
VTRIP
VBAT Change Over
1.6
1.8
2.0
V
Typical at Ta = 25°C
(Note 1)
D013
VBAT
VBAT Voltage Range
1.4
—
3.6
V
(Note 1)
D014
IBAT
VBAT Current
—
1
—
A
Typical at 2.5V, Ta = 25°C
(Note 1)
Note 1:
2:
23LCV512
This parameter is periodically sampled and not 100% tested. Typical measurements taken at room
temperature (25°C).
This is the limit to which VDD can be lowered without losing RAM data. This parameter is periodically
sampled and not 100% tested.
DS25157A-page 2
Preliminary
 2012 Microchip Technology Inc.
23LCV512
TABLE 1-2:
AC CHARACTERISTICS
AC CHARACTERISTICS
Param.
Sym.
No.
Industrial (I):
Characteristic
TA = -40°C to +85°C
Min.
Max.
Units
1
FCLK
Clock frequency
—
20
MHz
2
TCSS
CS setup time
25
—
ns
3
TCSH
CS hold time
50
—
ns
Test Conditions
4
TCSD
CS disable time
25
—
ns
5
Tsu
Data setup time
10
—
ns
6
THD
Data hold time
10
—
ns
7
TR
CLK rise time
—
20
ns
Note 1
8
TF
CLK fall time
—
20
ns
Note 1
9
THI
Clock high time
25
—
ns
10
TLO
Clock low time
25
—
ns
11
TCLD
Clock delay time
25
—
ns
12
TV
Output valid from clock low
—
25
ns
13
THO
Output hold time
0
—
ns
14
TDIS
Output disable time
—
20
ns
Note 1:
Note 1
This parameter is periodically sampled and not 100% tested.
TABLE 1-3:
AC TEST CONDITIONS
AC Waveform:
Input pulse level
Input rise/fall time
Operating temperature
CL = 30 pF
0.1 VCC to 0.9 VCC
5 ns
-40°C to +85°C
—
Timing Measurement Reference Level:
Input
0.5 VCC
Output
0.5 VCC
 2012 Microchip Technology Inc.
Preliminary
DS25157A-page 3
23LCV512
FIGURE 1-1:
SERIAL INPUT TIMING (SPI MODE)
4
CS
2
7
8
3
11
SCK
5
SI
6
MSB in
LSB in
High-Impedance
SO
FIGURE 1-2:
SERIAL OUTPUT TIMING (SPI MODE)
CS
9
3
10
SCK
12
SO
SI
DS25157A-page 4
13
MSB out
14
LSB out
Don’t Care
Preliminary
 2012 Microchip Technology Inc.
23LCV512
2.0
FUNCTIONAL DESCRIPTION
2.1
Principles of Operation
The 23LCV512 is an 512 Kbit Serial SRAM designed to
interface directly with the Serial Peripheral Interface
(SPI) port of many of today’s popular microcontroller
families, including Microchip’s PIC® microcontrollers. It
may also interface with microcontrollers that do not
have a built-in SPI port by using discrete I/O lines programmed properly in firmware to match the SPI protocol. In addition, the 23LCV512 is also capable of
operating in SDI (or dual SPI) mode.
The 23LCV512 contains an 8-bit instruction register.
The device is accessed via the SI pin, with data being
clocked in on the rising edge of SCK. The CS pin must
be low for the entire operation.
Table 2-1 contains a list of the possible instruction
bytes and format for device operation. All instructions,
addresses and data are transferred MSB first, LSB last.
2.2
Modes of Operation
The 23LCV512 has three modes of operation that are
selected by setting bits 7 and 6 in the MODE register.
The modes of operation are Byte, Page and Burst.
Byte Operation – is selected when bits 7 and 6 in the
MODE register are set to 00. In this mode, the read/
write operations are limited to only one byte. The
command followed by the 16-bit address is clocked into
the device and the data to/from the device is transferred
on the next eight clocks (Figure 2-1, Figure 2-2).
If operating in Sequential mode, the data stored in the
memory at the next address can be read sequentially
by continuing to provide clock pulses. The internal
Address Pointer is automatically incremented to the
next higher address after each byte of data is shifted
out. When the highest address is reached (FFFFh),
the address counter rolls over to address 0000h,
allowing the read cycle to be continued indefinitely.
The read operation is terminated by raising the CS
pin.
2.4
Write Sequence
Prior to any attempt to write data to the 23LCV512, the
device must be selected by bringing CS low.
Once the device is selected, the Write command can
be started by issuing a WRITE instruction, followed by
the 16-bit address, and then the data to be written. A
write is terminated by the CS being brought high.
If operating in Page mode, after the initial data byte is
shifted in, additional bytes can be shifted into the
device. The Address Pointer is automatically
incremented. This operation can continue for the entire
page (32 bytes) before data will start to be overwritten.
If operating in Sequential mode, after the initial data
byte is shifted in, additional bytes can be clocked into
the device. The internal Address Pointer is automatically incremented. When the Address Pointer reaches
the highest address (FFFFh), the address counter rolls
over to (0000h). This allows the operation to continue
indefinitely, however, previous data will be overwritten.
Page Operation – is selected when bits 7 and 6 in the
MODE register are set to 10. The 23LCV512 has 2048
pages of 32 bytes. In this mode, the read and write operations are limited to within the addressed page (the
address is automatically incremented internally). If the
data being read or written reaches the page boundary,
then the internal address counter will increment to the
start of the page (Figure 2-3, Figure 2-4).
Sequential Operation – is selected when bits 7 and 6
in the MODE register are set to 01. Sequential operation allows the entire array to be written to and read
from. The internal address counter is automatically
incremented and page boundaries are ignored. When
the internal address counter reaches the end of the
array, the address counter will roll over to 0x0000
(Figure 2-5, Figure 2-6).
2.3
Read Sequence
The device is selected by pulling CS low. The 8-bit
READ instruction is transmitted to the 23LCV512
followed by the 16-bit address. After the correct READ
instruction and address are sent, the data stored in the
memory at the selected address is shifted out on the
SO pin.
 2012 Microchip Technology Inc.
Preliminary
DS25157A-page 5
23LCV512
TABLE 2-1:
INSTRUCTION SET
Instruction Format
Hex
Code
Description
READ
0000 0011
0x03
Read data from memory array beginning at selected address
WRITE
0000 0010
0x02
Write data to memory array beginning at selected address
EDIO
0011 1011
0x3B
Enter Dual I/O access
RSTIO
1111 1111
0xFF
Reset Dual I/O access
RDMR
0000 0101
0x05
Read Mode Register
WRMR
0000 0001
0x01
Write Mode Register
Instruction Name
FIGURE 2-1:
BYTE READ SEQUENCE (SPI MODE)
CS
0
1
2
3
4
5
6
7
8
9 10 11
21 22 23 24 25 26 27 28 29 30 31
SCK
Instruction
0
SI
0
0
0
0
16-bit Address
0
1
1 15 14 13 12
2
1
0
Data Out
High-Impedance
7
SO
FIGURE 2-2:
6
5
4
3
2
1
0
BYTE WRITE SEQUENCE (SPI MODE)
CS
0
1
2
3
4
5
6
7
8
9 10 11
21 22 23 24 25 26 27 28 29 30 31
SCK
Instruction
SI
0
0
0
0
0
16-bit Address
0 1
0 15 14 13 12
Data Byte
2
1
0
7
6
5
4
3
2
1
0
High-Impedance
SO
DS25157A-page 6
Preliminary
 2012 Microchip Technology Inc.
23LCV512
FIGURE 2-3:
PAGE READ SEQUENCE (SPI MODE)
CS
0
1
2
0
0
0
3
4
5
6
7
8
9 10 11
21 22 23 24 25 26 27 28 29 30 31
SCK
Instruction
SI
0
0
16-bit Address
0 1
2
1 15 14 13 12
1
0
Page X, Word Y
Page X, Word Y
High-Impedance
SO
7
6
5
4
3
2
1
0
CS
32 33 34 35 36 37 38 39
SCK
SI
Page X, Word Y+1
7
SO
6
FIGURE 2-4:
5
4
3
2
1
Page X, Word 31
0
7
6
5
4
3
2
Page X, Word 0
1
0
7
6
5
4
3
2
1
0
PAGE WRITE SEQUENCE (SPI MODE)
CS
0
1
2
0
0
0
3
4
5
6
7
8
9 10 11
21 22 23 24 25 26 27 28 29 30 31
SCK
Instruction
SI
0
0
Page X, Word Y
16-bit Address
0 1
2
0 15 14 13 12
1
0
7
6
5
4
3
2
1
0
Page X, Word Y
CS
32 33 34 35 36 37 38 39
SCK
Page X, Word Y+1
SI
7
6
5
4
 2012 Microchip Technology Inc.
3
2
1
Page X, Word 31
0
7
6
5
4
3
Preliminary
2
Page X, Word 0
1
0
7
6
5
4
3
2
1
0
DS25157A-page 7
23LCV512
FIGURE 2-5:
SEQUENTIAL READ SEQUENCE (SPI MODE)
CS
0
1
2
0
0
0
3
4
5
6
7
8
9 10 11
21 22 23 24 25 26 27 28 29 30 31
SCK
Instruction
SI
0
0
16-bit Address
0 1
1 15 14 13 12
2
1
0
Page X, Word Y
7
SO
6
5
4
3
2
1
0
CS
SCK
SI
Page X, Word 31
SO
7
6
5
4
3
2
Page X+1, Word 0
1
0
7
6
5
4
3
2
1
Page X+1, Word 1
0
7
6
5
4
3
2
1
0
CS
SCK
SI
Page X+1, Word 31
SO
7
DS25157A-page 8
6
5
4
3
2
Page X+n, Word 1
1
0
7
6
5
4
3
2
Preliminary
1
Page X+n, Word 31
0
7
6
5
4
3
2
1
0
 2012 Microchip Technology Inc.
23LCV512
FIGURE 2-6:
SEQUENTIAL WRITE SEQUENCE (SPI MODE)
CS
0
1
2
3
4
5
6
7
8
9 10 11
21 22 23 24 25 26 27 28 29 30 31
SCK
Instruction
SI
0
0
0
0
0
16-bit Address
0 1
Data Byte 1
2
0 15 14 13 12
1
0
7
6
5
4
3
2
1
0
CS
32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47
SCK
Data Byte 2
SI
7
6
5
4
 2012 Microchip Technology Inc.
3
2
Data Byte 3
1
0
7
6
5
4
3
2
Preliminary
Data Byte n
1
0
7
6
5
4
3
2
1
0
DS25157A-page 9
23LCV512
2.5
Read Mode Register Instruction
(RDMR)
The mode bits indicate the operating mode of the
SRAM. The possible modes of operation are:
0 0 = Byte mode
The Read Mode Register instruction (RDMR) provides
access to the MODE register. The MODE register may
be read at any time. The MODE register is formatted as
follows:
TABLE 2-2:
1 0 = Page mode
0 1 = Sequential mode (default operation)
1 1 = Reserved
Bits 0 through 5 are reserved and should always be set
to ‘0’.
MODE REGISTER
7
6
5
4
3
2
1
0
W/R
W/R
–
–
–
–
–
–
0
0
0
0
0
0
MODE MODE
See Figure 2-7 for the RDMR timing sequence.
W/R = writable/readable
FIGURE 2-7:
READ MODE REGISTER TIMING SEQUENCE (RDMR)
CS
0
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
1
0
SCK
Instruction
SI
0
0
0
0
0
High-Impedance
SO
DS25157A-page 10
1
0
1
Data from MODE Register
7
Preliminary
6
5
4
3
2
 2012 Microchip Technology Inc.
23LCV512
2.6
Write Mode Register Instruction
(WRMR)
The Write Mode Register instruction (WRMR) allows the
user to write to the bits in the MODE register as shown
in Table 2-2. This allows for setting of the Device
Operating mode. Several of the bits in the MODE
register must be cleared to ‘0’. See Figure 2-8 for the
WRMR timing sequence.
FIGURE 2-8:
WRITE MODE REGISTER TIMING SEQUENCE (WRMR)
CS
0
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
1
0
SCK
Instruction
SI
0
0
0
0
Data to MODE Register
0
0
0
1
7
6
5
4
3
2
High-Impedance
SO
2.7
Power-On State
The 23LCV512 powers on in the following state:
• The device is in low-power Standby mode
(CS = 1)
• A high-to-low-level transition on CS is required to
enter active state
 2012 Microchip Technology Inc.
Preliminary
DS25157A-page 11
23LCV512
3.0
PIN DESCRIPTIONS
3.6
The VBAT pin is used as an input for external backup
supply to maintain SRAM data when VCC is below the
VTRIP point. If the VBAT function is not being used, it is
recommended to connect this pin to VSS.
The descriptions of the pins are listed in Table 3-1.
TABLE 3-1:
Name
PIN FUNCTION TABLE
SOIC/
PDIP
TSSOP
VBAT supply Input
3.7
Function
CS
1
Chip Select Input
SO/SIO1
2
Serial Data Output/SDI Pin
NC
3
No Connect
VSS
4
SPI and SDI Pin Designations
SPI Mode:
1
8
Ground
SO
2
7
VBAT
3
6
SCK
4
5
SI
SI/SIO0
5
Serial Data Input/SDI Pin
NC
SCK
6
Serial Clock Input
Vss
VBAT
7
External Backup Supply
VCC
8
Power Supply
3.1
SDI Mode:
Chip Select (CS)
A low level on this pin selects the device. A high level
deselects the device and forces it into Standby mode.
When the device is deselected, SO goes to the highimpedance state, allowing multiple parts to share the
same SPI bus. After power-up, a low level on CS is
required, prior to any sequence being initiated.
3.2
Vcc
CS
CS
1
8
Vcc
SIO1
2
7
VBAT
NC
3
6
SCK
Vss
4
5
SIO0
Serial Output (SO)
The SO pin is used to transfer data out of the
23LCV512. During a read cycle, data is shifted out on
this pin after the falling edge of the serial clock.
3.3
Serial Input (SI)
The SI pin is used to transfer data into the device. It
receives instructions, addresses, and data. Data is
latched on the rising edge of the serial clock.
3.4
Serial Dual Interface Pins(SIO0,
SIO1)
The SIO0 and SIO1 pins are used for SDI mode of
operation. Functionality of these I/O pins is shared with
SO and SI.
3.5
Serial Clock (SCK)
The SCK is used to synchronize the communication
between a master and the 23LCV512. Instructions,
addresses or data present on the SI pin are latched on
the rising edge of the clock input, while data on the SO
pin is updated after the falling edge of the clock input.
DS25157A-page 12
Preliminary
 2012 Microchip Technology Inc.
23LCV512
4.0
DUAL SERIAL MODE
4.1
The 23LCV512 supports SDI (Serial Dual) mode of
operation. To enter SDI mode the EDIO command must
be clocked in (Figure 4-1). It should be noted that if the
MCU resets before the SRAM, the user will need to
determine the serial mode of operation of the SRAM
and reset it accordingly. Byte read and write sequence
in SDI mode is shown in Figure 4-2 and Figure 4-3.
The 23LCV512 also supports SDI (Serial Dual) mode
of operation when used with compatible master
devices. As a convention for SDI mode of operation,
two bits are entered per clock using the SIO0 and SIO1
pins. Bits are clocked MSB first.
FIGURE 4-1:
Dual Interface Mode
ENTER SDI MODE (EDIO) FROM SPI MODE
CS
0
1
2
3
0
1
1
4
5
6
7
SCK
0
SI
1
0
1
1
High-Impedance
SO
FIGURE 4-2:
BYTE READ MODE SDI
CS
0
1
2
3
4
5
6
7
9 10 11 12 13 14 15 16 17 18 19
8
SCK
SIO0
0 0 0
1 14 12 10 8 6
Instruction
SIO1
0 0
0
4
2
Dummy Byte
16-Bit Address
1 15 13 11 9
7
5
6
0
3 1
4
2
0
Data Out
7
5
3
1
Note:
Page and Sequential mode are similar in that additional bytes can be clocked out before CS is brought high.
Note:
The first byte read after the address will be a dummy byte.
 2012 Microchip Technology Inc.
Preliminary
DS25157A-page 13
23LCV512
FIGURE 4-3:
BYTE WRITE MODE SDI
CS
0
1
2
3
4
5
6
7
9 10 11 12 13 14 15
8
SCK
SIO0
0 0 0
0 14 12 10 8 6
Instruction
SIO1
Note:
4.2
0 0
0
4
2
0
6
7
5
2
0
Data In
16-Bit Address
1 15 13 11 9
4
3 1
7
5
3
1
Page and Sequential mode are similar in that additional bytes can be clocked in before CS is brought high.
Exit SDI Mode
To exit from SDI mode, the RSTIO command must be
issued. The command must be entered in the current
device configuration see (Figure 4-4).
FIGURE 4-4:
RESET SDI MODE (RSTIO) – FROM SDI MODE
CS
0
1
2
3
SIO0
1
1
1
1
SIO1
1
1
1
1
SCK
DS25157A-page 14
Preliminary
 2012 Microchip Technology Inc.
23LCV512
5.0
VBAT
The VBAT trip point is the point at which the internal
switch operates the device from the VBAT supply and is
typically 1.8V (VTRIP specification D012). When VCC
falls below the VTRIP point the system will continue to
maintain the SRAM contents.
The 23LCV512 features an internal switch that will
maintain the SRAM contents. In the event that the VCC
supply is not available, the voltage applied to the VBAT
pin serves as the backup supply.
Supply Condition
The following conditions apply:
Read/Write Access
Powered By
VCC < VTRIP, VCC < VBAT
No
VBAT
VCC > VTRIP, VCC < VBAT
Yes
VCC
VCC > VTRIP, VCC > VBAT
Yes
VCC
 2012 Microchip Technology Inc.
Preliminary
DS25157A-page 15
23LCV512
6.0
PACKAGING INFORMATION
6.1
Package Marking Information
8-Lead PDIP (300 mil)
Example
XXXXXXXX
XXXXXNNN
23LCV512
I/P e3 1L7
0528
YYWW
8-Lead SOIC (3.90 mm)
Example:
XXXXXXXT
XXXXYYWW
NNN
23LCVAI
SN e3 0528
1L7
Example:
8-Lead TSSOP
3LVA
XXXX
TYWW
NNN
Legend: XX...X
T
Y
YY
WW
NNN
e3
I837
1L7
Part number or part number code
Temperature (I, E)
Year code (last digit of calendar year)
Year code (last 2 digits of calendar year)
Week code (week of January 1 is week ‘01’)
Alphanumeric traceability code (2 characters for small packages)
Pb-free JEDEC designator for Matte Tin (Sn)
Note:
For very small packages with no room for the Pb-free JEDEC designator
e3 , the marking will only appear on the outer carton or reel label.
Note:
In the event the full Microchip part number cannot be marked on one line, it will
be carried over to the next line, thus limiting the number of available
characters for customer-specific information.
DS25157A-page 16
Preliminary
 2012 Microchip Technology Inc.
23LCV512
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 2012 Microchip Technology Inc.
Preliminary
DS25157A-page 17
23LCV512
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
DS25157A-page 18
Preliminary
 2012 Microchip Technology Inc.
23LCV512
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
 2012 Microchip Technology Inc.
Preliminary
DS25157A-page 19
23LCV512
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DS25157A-page 20
Preliminary
 2012 Microchip Technology Inc.
23LCV512
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 2012 Microchip Technology Inc.
Preliminary
DS25157A-page 21
23LCV512
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
DS25157A-page 22
Preliminary
 2012 Microchip Technology Inc.
23LCV512
APPENDIX A:
REVISION HISTORY
Revision A (09/2012)
Initial release.
 2012 Microchip Technology Inc.
Preliminary
DS25157A-page 23
23LCV512
NOTES:
DS25157A-page 24
Preliminary
 2012 Microchip Technology Inc.
23LCV512
THE MICROCHIP WEB SITE
CUSTOMER SUPPORT
Microchip provides online support via our WWW site at
www.microchip.com. This web site is used as a means
to make files and information easily available to
customers. Accessible by using your favorite Internet
browser, the web site contains the following
information:
Users of Microchip products can receive assistance
through several channels:
• Product Support – Data sheets and errata,
application notes and sample programs, design
resources, user’s guides and hardware support
documents, latest software releases and archived
software
• General Technical Support – Frequently Asked
Questions (FAQ), technical support requests,
online discussion groups, Microchip consultant
program member listing
• Business of Microchip – Product selector and
ordering guides, latest Microchip press releases,
listing of seminars and events, listings of
Microchip sales offices, distributors and factory
representatives
•
•
•
•
•
Distributor or Representative
Local Sales Office
Field Application Engineer (FAE)
Technical Support
Development Systems Information Line
Customers
should
contact
their
distributor,
representative or field application engineer (FAE) for
support. Local sales offices are also available to help
customers. A listing of sales offices and locations is
included in the back of this document.
Technical support is available through the web site
at: http://microchip.com/support
CUSTOMER CHANGE NOTIFICATION
SERVICE
Microchip’s customer notification service helps keep
customers current on Microchip products. Subscribers
will receive e-mail notification whenever there are
changes, updates, revisions or errata related to a
specified product family or development tool of interest.
To register, access the Microchip web site at
www.microchip.com. Under “Support”, click on
“Customer Change Notification” and follow the
registration instructions.
 2012 Microchip Technology Inc.
Preliminary
DS25157A-page 25
23LCV512
READER RESPONSE
It is our intention to provide you with the best documentation possible to ensure successful use of your Microchip
product. If you wish to provide your comments on organization, clarity, subject matter, and ways in which our
documentation can better serve you, please FAX your comments to the Technical Publications Manager at
(480) 792-4150.
Please list the following information, and use this outline to provide us with your comments about this document.
TO:
Technical Publications Manager
RE:
Reader Response
Total Pages Sent ________
From: Name
Company
Address
City / State / ZIP / Country
Telephone: (_______) _________ - _________
FAX: (______) _________ - _________
Application (optional):
Would you like a reply?
Y
N
Device: 23LCV512
Literature Number: DS25157A
Questions:
1. What are the best features of this document?
2. How does this document meet your hardware and software development needs?
3. Do you find the organization of this document easy to follow? If not, why?
4. What additions to the document do you think would enhance the structure and subject?
5. What deletions from the document could be made without affecting the overall usefulness?
6. Is there any incorrect or misleading information (what and where)?
7. How would you improve this document?
DS25157A-page 26
Preliminary
 2012 Microchip Technology Inc.
23LCV512
PRODUCT IDENTIFICATION SYSTEM
To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office. Not all possible ordering options
are shown below..
PART NO.
X
Device
Tape & Reel
–
X
/XX
Temp Range
Package
Examples:
a)
b)
Device:
23LCV512 =
512 Kbit, 2.5 - 5.5V, SPI Serial SRAM, VBAT
Tape & Reel:
Blank
T
=
=
Standard packaging (tube)
Tape & Reel
Temperature
Range:
I
=
-40C to+85C
Package:
SN
ST
P
=
=
=
Plastic SOIC (3.90 mm body), 8-lead
Plastic TSSOP (4.4 mm body), 8-lead
Plastic PDIP (300 mil body), 8-lead
 2012 Microchip Technology Inc.
Preliminary
c)
23LCV512-I/ST = 512 Kbit, 2.5 - 5.5V Serial
SRAM, Industrial temp., TSSOP package
23LCV512-I/SN = 512 Kbit, 2.5 - 5.5V Serial
SRAM, Industrial temp., SOIC package
23LCV512-I/P = 512 Kbit, 2.5 - 5.5V Serial
SRAM, Industrial temp., PDIP package
DS25157A-page 27
23LCV512
NOTES:
DS25157A-page 28
Preliminary
 2012 Microchip Technology Inc.
Note the following details of the code protection feature on Microchip devices:
•
Microchip products meet the specification contained in their particular Microchip Data Sheet.
•
Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the
intended manner and under normal conditions.
•
There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our
knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data
Sheets. Most likely, the person doing so is engaged in theft of intellectual property.
•
Microchip is willing to work with the customer who is concerned about the integrity of their code.
•
Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not
mean that we are guaranteeing the product as “unbreakable.”
Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our
products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts
allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.
Information contained in this publication regarding device
applications and the like is provided only for your convenience
and may be superseded by updates. It is your responsibility to
ensure that your application meets with your specifications.
MICROCHIP MAKES NO REPRESENTATIONS OR
WARRANTIES OF ANY KIND WHETHER EXPRESS OR
IMPLIED, WRITTEN OR ORAL, STATUTORY OR
OTHERWISE, RELATED TO THE INFORMATION,
INCLUDING BUT NOT LIMITED TO ITS CONDITION,
QUALITY, PERFORMANCE, MERCHANTABILITY OR
FITNESS FOR PURPOSE. Microchip disclaims all liability
arising from this information and its use. Use of Microchip
devices in life support and/or safety applications is entirely at
the buyer’s risk, and the buyer agrees to defend, indemnify and
hold harmless Microchip from any and all damages, claims,
suits, or expenses resulting from such use. No licenses are
conveyed, implicitly or otherwise, under any Microchip
intellectual property rights.
Trademarks
The Microchip name and logo, the Microchip logo, dsPIC,
FlashFlex, KEELOQ, KEELOQ logo, MPLAB, PIC, PICmicro,
PICSTART, PIC32 logo, rfPIC, SST, SST Logo, SuperFlash
and UNI/O are registered trademarks of Microchip Technology
Incorporated in the U.S.A. and other countries.
FilterLab, Hampshire, HI-TECH C, Linear Active Thermistor,
MTP, SEEVAL and The Embedded Control Solutions
Company are registered trademarks of Microchip Technology
Incorporated in the U.S.A.
Silicon Storage Technology is a registered trademark of
Microchip Technology Inc. in other countries.
Analog-for-the-Digital Age, Application Maestro, BodyCom,
chipKIT, chipKIT logo, CodeGuard, dsPICDEM,
dsPICDEM.net, dsPICworks, dsSPEAK, ECAN,
ECONOMONITOR, FanSense, HI-TIDE, In-Circuit Serial
Programming, ICSP, Mindi, MiWi, MPASM, MPF, MPLAB
Certified logo, MPLIB, MPLINK, mTouch, Omniscient Code
Generation, PICC, PICC-18, PICDEM, PICDEM.net, PICkit,
PICtail, REAL ICE, rfLAB, Select Mode, SQI, Serial Quad I/O,
Total Endurance, TSHARC, UniWinDriver, WiperLock, ZENA
and Z-Scale are trademarks of Microchip Technology
Incorporated in the U.S.A. and other countries.
SQTP is a service mark of Microchip Technology Incorporated
in the U.S.A.
GestIC and ULPP are registered trademarks of Microchip
Technology Germany II GmbH & Co. & KG, a subsidiary of
Microchip Technology Inc., in other countries.
All other trademarks mentioned herein are property of their
respective companies.
© 2012, Microchip Technology Incorporated, Printed in the
U.S.A., All Rights Reserved.
Printed on recycled paper.
ISBN: 9781620766002
QUALITY MANAGEMENT SYSTEM
CERTIFIED BY DNV
== ISO/TS 16949 ==
 2012 Microchip Technology Inc.
Microchip received ISO/TS-16949:2009 certification for its worldwide
headquarters, design and wafer fabrication facilities in Chandler and
Tempe, Arizona; Gresham, Oregon and design centers in California
and India. The Company’s quality system processes and procedures
are for its PIC® MCUs and dsPIC® DSCs, KEELOQ® code hopping
devices, Serial EEPROMs, microperipherals, nonvolatile memory and
analog products. In addition, Microchip’s quality system for the design
and manufacture of development systems is ISO 9001:2000 certified.
Preliminary
DS25157A-page 29
Worldwide Sales and Service
AMERICAS
ASIA/PACIFIC
ASIA/PACIFIC
EUROPE
Corporate Office
2355 West Chandler Blvd.
Chandler, AZ 85224-6199
Tel: 480-792-7200
Fax: 480-792-7277
Technical Support:
http://www.microchip.com/
support
Web Address:
www.microchip.com
Asia Pacific Office
Suites 3707-14, 37th Floor
Tower 6, The Gateway
Harbour City, Kowloon
Hong Kong
Tel: 852-2401-1200
Fax: 852-2401-3431
India - Bangalore
Tel: 91-80-3090-4444
Fax: 91-80-3090-4123
India - New Delhi
Tel: 91-11-4160-8631
Fax: 91-11-4160-8632
Austria - Wels
Tel: 43-7242-2244-39
Fax: 43-7242-2244-393
Denmark - Copenhagen
Tel: 45-4450-2828
Fax: 45-4485-2829
India - Pune
Tel: 91-20-2566-1512
Fax: 91-20-2566-1513
France - Paris
Tel: 33-1-69-53-63-20
Fax: 33-1-69-30-90-79
Japan - Osaka
Tel: 81-66-152-7160
Fax: 81-66-152-9310
Germany - Munich
Tel: 49-89-627-144-0
Fax: 49-89-627-144-44
Atlanta
Duluth, GA
Tel: 678-957-9614
Fax: 678-957-1455
Boston
Westborough, MA
Tel: 774-760-0087
Fax: 774-760-0088
Chicago
Itasca, IL
Tel: 630-285-0071
Fax: 630-285-0075
Cleveland
Independence, OH
Tel: 216-447-0464
Fax: 216-447-0643
Dallas
Addison, TX
Tel: 972-818-7423
Fax: 972-818-2924
Detroit
Farmington Hills, MI
Tel: 248-538-2250
Fax: 248-538-2260
Indianapolis
Noblesville, IN
Tel: 317-773-8323
Fax: 317-773-5453
Los Angeles
Mission Viejo, CA
Tel: 949-462-9523
Fax: 949-462-9608
Santa Clara
Santa Clara, CA
Tel: 408-961-6444
Fax: 408-961-6445
Toronto
Mississauga, Ontario,
Canada
Tel: 905-673-0699
Fax: 905-673-6509
Australia - Sydney
Tel: 61-2-9868-6733
Fax: 61-2-9868-6755
China - Beijing
Tel: 86-10-8569-7000
Fax: 86-10-8528-2104
Japan - Yokohama
Tel: 81-45-471- 6166
Fax: 81-45-471-6122
China - Chengdu
Tel: 86-28-8665-5511
Fax: 86-28-8665-7889
Korea - Daegu
Tel: 82-53-744-4301
Fax: 82-53-744-4302
China - Chongqing
Tel: 86-23-8980-9588
Fax: 86-23-8980-9500
China - Hangzhou
Tel: 86-571-2819-3187
Fax: 86-571-2819-3189
Korea - Seoul
Tel: 82-2-554-7200
Fax: 82-2-558-5932 or
82-2-558-5934
China - Hong Kong SAR
Tel: 852-2401-1200
Fax: 852-2401-3431
Malaysia - Kuala Lumpur
Tel: 60-3-6201-9857
Fax: 60-3-6201-9859
China - Nanjing
Tel: 86-25-8473-2460
Fax: 86-25-8473-2470
Malaysia - Penang
Tel: 60-4-227-8870
Fax: 60-4-227-4068
China - Qingdao
Tel: 86-532-8502-7355
Fax: 86-532-8502-7205
Philippines - Manila
Tel: 63-2-634-9065
Fax: 63-2-634-9069
China - Shanghai
Tel: 86-21-5407-5533
Fax: 86-21-5407-5066
Singapore
Tel: 65-6334-8870
Fax: 65-6334-8850
China - Shenyang
Tel: 86-24-2334-2829
Fax: 86-24-2334-2393
Taiwan - Hsin Chu
Tel: 886-3-5778-366
Fax: 886-3-5770-955
China - Shenzhen
Tel: 86-755-8203-2660
Fax: 86-755-8203-1760
Taiwan - Kaohsiung
Tel: 886-7-536-4818
Fax: 886-7-330-9305
China - Wuhan
Tel: 86-27-5980-5300
Fax: 86-27-5980-5118
Taiwan - Taipei
Tel: 886-2-2500-6610
Fax: 886-2-2508-0102
China - Xian
Tel: 86-29-8833-7252
Fax: 86-29-8833-7256
Thailand - Bangkok
Tel: 66-2-694-1351
Fax: 66-2-694-1350
Netherlands - Drunen
Tel: 31-416-690399
Fax: 31-416-690340
Spain - Madrid
Tel: 34-91-708-08-90
Fax: 34-91-708-08-91
UK - Wokingham
Tel: 44-118-921-5869
Fax: 44-118-921-5820
China - Xiamen
Tel: 86-592-2388138
Fax: 86-592-2388130
China - Zhuhai
Tel: 86-756-3210040
Fax: 86-756-3210049
DS25157A-page 30
Italy - Milan
Tel: 39-0331-742611
Fax: 39-0331-466781
11/29/11
Preliminary
 2012 Microchip Technology Inc.