NP284 Series (Open Top) Chip Scale Package (CSP, 0.50mm Pitch) Specifications Part Number (Details) 1,000MW min. at 100V DC Insulation Resistance: Dielectric Withstanding Voltage: 100V AC for 1 minute Contact Resistance: 30m W max. at 10mA/20mV max. Operating Temperature Range: –40°C to +150°C 11gf per pin approx. Contact Force: 35 x 35 Grid Size: 264 pins Pin Count: NP284 - 264 09 * Series No. No. of Contact Pins Design Number Positioning Pin: N = Without P = With Materials and Finish Housing: Polyetherimide (PEI), glass-filled Polyetherssulphone (PES), glass-filled Contacts: Beryllium Copper (BeCu) Plating: Gold over Nickel Features í Open top type socket for CSP packages with 0.50mm pitch í Self contacting structure without upper pressing force (ZIF) í Fan-out Terminal type, designed to reduce ball damage Contact Details (Section C - C) Outline Socket Dimensions 0.30 4 - 0.5x32=16.00±0.15 8.50±0.1 0.50±0.1 50.00 46.00 22.00 +0.1 18.15 0 0.15 0.85 0.50 0.15 8.50±0.1 8.50 'B' Pos. pin 1.50 Æ6.00 20.15 0.5x34=17.00±0.15 0.50±0.1 Æ2.60 Æ3.20 Thru hole 8.50±0.1 20.15 0.5x34=17.00±0.15 0.50±0.1 41.00±0.1 28.60 8.50±0.1 46.00 22.00 +0.1 18.15 0 50.00 Detail 'B' C C 0 15.65 -0.1 17.35 Recommended PC Board Layout 264 - Æ0.30 Æ3.20 0 Thru hole SPECIFICATIONS ARE SUBJECT TO ALTERATION WITHOUT PRIOR NOTICE – DIMENSIONS IN MILLIMETER Top View from Socket 8.50±0.05 8.50±0.05 +0.1 4 - Æ2.70 0 Thru hole for pos. pin +0.1 0 264 - Æ0.45 40.00±0.05 0.50±0.05 8.50±0.05 42.25±0.05 38.25±0.05 34.25±0.05 27.25±0.05 23.25±0.05 19.25±0.05 +0.1 0.50 Test & Burn-In 4 - 0.5x32=16.00±0.1 0.64 18.00 0.50 0.50x34=17.00 0.25 Matching IC Dimensions 0.50x34=17.00 +0.1 0