YED210 Series SPGA – Interstitial (TH) Specifications Part Number (Details) Insulation Resistance: 1012Ω min. Withstanding Voltage: 1,000 VRMS for 1 minute Contact Resistance: 10mΩ max. at 10mA / 20mV Current Rating: 1A max. Operating Temperature Range: -55°C ~ +125°C Acceptable Pin Diameter: 0.46 ±0.05 Mating Cycles: 100 insertions min. YED210 Materials and Finish – 321 37 – 0 B S 4 Series No. No. of Contact Pins Grid RoHS Housing: PCT, 30% glass filled Polyester, UL94V-0 Contact: Inner clip – Beryllium Copper (BeCu), Au over Ni (2-3µm) Outer sleeve – Machined Brass, Sn (5µm) over Ni (2-3µm) Features Design No. Inner Contact Plating B = Gold Outer Sleeve Plating S = Solder Terminal Style ¼ Custom specific pin counts with grids to 41x41 ¼ Pin-Grid-Array precision-IC-Sockets, with displaced contacts, for picking up of ICs with high packing density. ¼ Contacts with 6-finger-clip, for low insertion and withdrawal force . Outline Socket Dimensions (Grid 37 x 37) Contact Position Detail Without Stand-off pins (Standard) With Stand-off pins Stand-off pin A-40 Sockets and Connectors SPECIFICATIONS ARE SUBJECT TO ALTERATION WITHOUT PRIOR NOTICE - DIMENSIONS IN MILLIMETER