TI CD74HCT4316E

[ /Title
(CD74
HC431
6,
CD74
HCT43
16)
/Subject
(HighSpeed
CMOS
CD54HC4316, CD74HC4316,
CD74HCT4316
Data sheet acquired from Harris Semiconductor
SCHS212D
High-Speed CMOS Logic
Quad Analog Switch with Level Translation
February 1998 - Revised October 2003
Features
In addition these devices contain logic-level translation
circuits that provide for analog signal switching of voltages
between ±5V via 5V logic. Each switch is turned on by a
high-level voltage on its select input (S) when the common
Enable (E) is Low. A High E disables all switches. The digital
inputs can swing between VCC and GND; the analog
inputs/outputs can swing between VCC as a positive limit
and VEE as a negative limit. Voltage ranges are shown in
Figures 2 and 3.
• Wide Analog-Input-Voltage Range
VCC - VEE . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0V to 10V
• Low “ON” Resistance
- 45Ω (Typ) . . . . . . . . . . . . . . . . . . . . . . . . . . .VCC = 4.5V
- 35Ω (Typ) . . . . . . . . . . . . . . . . . . . . . . . . . . . . VCC = 6V
- 30Ω (Typ) . . . . . . . . . . . . . . . . . . . . . . . VCC - VEE = 9V
• Fast Switching and Propagation Delay Times
Ordering Information
• Low “OFF” Leakage Current
• Built-In “Break-Before-Make” Switching
PART NUMBER
• Logic-Level Translation to Enable 5V Logic to
Accommodate ±5V Analog Signals
TEMP. RANGE
(oC)
PACKAGE
CD54HC4316F3A
-55 to 125
16 Ld CERDIP
CD74HC4316E
-55 to 125
16 Ld PDIP
CD74HC4316M
-55 to 125
16 Ld SOIC
• HC Types
- 2V to 10V Operation
- High Noise Immunity: NIL = 30%, NIH = 30% of VCC
at VCC = 5V
CD74HC4316MT
-55 to 125
16 Ld SOIC
CD74HC4316M96
-55 to 125
16 Ld SOIC
CD74HC4316NSR
-55 to 125
16 Ld SOP
• HCT Types
- Direct LSTTL Input Logic Compatibility,
VIL= 0.8V (Max), VIH = 2V (Min)
- CMOS Input Compatibility, Il ≤ 1µA at VOL, VOH
CD74HC4316PW
-55 to 125
16 Ld TSSOP
CD74HC4316PWR
-55 to 125
16 Ld TSSOP
CD74HC4316PWT
-55 to 125
16 Ld TSSOP
CD74HCT4316E
-55 to 125
16 Ld PDIP
Description
CD74HCT4316M
-55 to 125
16 Ld SOIC
CD74HCT4316MT
-55 to 125
16 Ld SOIC
CD74HCT4316M96
-55 to 125
16 Ld SOIC
• Wide Operating Temperature Range . . . -55oC to 125oC
The ’HC4316 and CD74HCT4316 contain four independent
digitally controlled analog switches that use silicon-gate
CMOS technology to achieve operating speeds similar to
LSTTL with the low power consumption of standard CMOS
integrated circuits.
Pinout
NOTE: When ordering, use the entire part number. The suffixes 96
and R denote tape and reel. The suffix T denotes a small-quantity
reel of 250.
CD54HC4316 (CERDIP)
CD74HC4316 (PDIP, SOIC, SOP, TSSOP)
CD74HCT4316 (PDIP, SOIC)
TOP VIEW
1Z 1
16 VCC
1Y 2
15 1S
2Y 3
14 4S
2Z 4
13 4Z
2S 5
12 4Y
3S 6
11 3Y
E 7
10 3Z
9 VEE
GND 8
CAUTION: These devices are sensitive to electrostatic discharge. Users should follow proper IC Handling Procedures.
Copyright
© 2003, Texas Instruments Incorporated
1
CD54HC4316, CD74HC4316, CD74HCT4316
Functional Diagram
VCC
16
2
15
1Y
1S
1
5
1Z
3
2S
LOGIC
LEVEL
CONV.
AND
CONTROL
6
3S
2Y
4
2Z
11
3Y
14
4S
10
12
E
7
3Z
4Y
13
4Z
8
9
GND
VEE
TRUTH TABLE
INPUTS
E
S
SWITCH
L
L
OFF
L
H
ON
H
X
OFF
H= High Level Voltage
L= Low Level Voltage
X= Don’t Care
Logic Diagram
nY
TO 3 OTHER
SWITCHES
E
nS
VCC
VCC
LOGIC
LEVEL
CONV.
nZ
VEE
VEE
FIGURE 1. ONE SWITCH
2
CD54HC4316, CD74HC4316, CD74HCT4316
Absolute Maximum Ratings
Thermal Information
DC Supply Voltage, VCC . . . . . . . . . . . . . . . . . . . . . . . . -0.5V to 7V
DC Supply Voltage, VCC - VEE . . . . . . . . . . . . . . . . . . -0.5V to 10.5V
DC Supply Voltage, VEE . . . . . . . . . . . . . . . . . . . . . . . . 0.5V to -7V
DC Input Diode Current, IIK
For VI < -0.5V or VI > VCC 0.5V. . . . . . . . . . . . . . . . . . . . . . . .±20mA
DC Switch Diode Current, IOK
For VI < VEE -0.5V or VI < VCC + 0.5V . . . . . . . . . . . . . . . . .±25mA
DC Switch Diode Current
For VI > VEE -0.5V or VI < VCC + 0.5V . . . . . . . . . . . . . . . . .±25mA
DC Output Diode Current, IOK
For VO < -0.5V or VO > VCC + 0.5V . . . . . . . . . . . . . . . . . . . .±20mA
DC Output Source or Sink Current per Output Pin, IO
For VO > -0.5V or VO < VCC + 0.5V . . . . . . . . . . . . . . . . . . . .±25mA
DC VCC or Ground Current, ICC . . . . . . . . . . . . . . . . . . . . . . . . .±50mA
Package Thermal Impedance, θJA (see Note 1):
E (PDIP) Package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 67oC/W
M (SOIC) Package. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 73oC/W
NS (SOP) Package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 64oC/W
PW (TSSOP) Package . . . . . . . . . . . . . . . . . . . . . . . . . . 108oC/W
Maximum Junction Temperature (Plastic Package) . . . . . . . . . 150o
Maximum Storage Temperature Range . . . . . . . . . . . -65oC to 150o
Maximum Lead Temperature (Soldering 10s) . . . . . . . . . . . . . . 300o
SOIC - Lead Tips Only
Operating Conditions
Temperature Range, TA . . . . . . . . . . . . . . . . . . . . . . -55oC to 125oC
Supply Voltage Range, VCC
HC Types . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .2V to 6V
HCT Types . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .4.5V to 5.5V
Supply Voltage Range, VCC - VEE
HC, HCT Types (Figure 2) . . . . . . . . . . . . . . . . . . . . . . .2V to 10V
Supply Voltage Range, VEE
HC, HCT Types (Figure 3) . . . . . . . . . . . . . . . . . . . . . . . 0V to -6V
DC Input or Output Voltage, VI . . . . . . . . . . . . . . . . . . . GND to VCC
Analog Switch I/O Voltage, VIS . . . . . . . . . . . . . . . . . . . . . VEE (Min)
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . VCC (Max)
Input Rise and Fall Time, tr, tf
2V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1000ns (Max)
4.5V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 500ns (Max)
6V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 400ns (Max)
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation
of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
NOTE:
1. The package thermal impedance is calculated in accordance with JESD 51-7.
Recommended Operating Area as a Function of Supply Voltage
8
8
6
VCC - GND
(V)
4
6
VCC - GND
(V)
4
HCT
HC
2
0
HCT
HC
2
0
2
0
4
6
8
10 12
VCC - VEE (V)
FIGURE 2.
0
-2
-4 -6 -8
VEE - GND (V)
FIGURE 3.
3
CD54HC4316, CD74HC4316, CD74HCT4316
DC Electrical Specifications
TEST CONDITIONS
PARAMETER
SYMBOL
VI (V)
VIS (V)
VIH
-
-
-40oC TO
85oC
25oC
VEE (V) VCC (V)
-55oC TO
125oC
MIN
TYP
MAX
MIN
MAX
MIN
MAX
UNITS
2
1.5
-
-
1.5
-
1.5
-
V
4.5
3.15
-
-
3.15
-
3.15
-
V
6
4.2
-
-
4.2
-
4.2
-
V
2
-
-
0.5
-
0.5
-
0.5
V
4.5
-
-
1.35
-
1.35
-
1.35
V
6
-
-
1.8
-
1.8
-
1.8
V
0
4.5
-
45
180
-
225
-
270
Ω
0
6
-
35
160
-
200
-
240
Ω
-4.5
4.5
-
30
135
-
170
-
205
Ω
0
4.5
-
85
320
-
400
-
480
Ω
0
6
-
55
240
-
300
-
360
Ω
-4.5
4.5
-
35
170
-
215
-
255
Ω
0
4.5
-
10
-
-
-
-
-
Ω
0
6
-
8.5
-
-
-
-
-
Ω
-4.5
4.5
-
5
-
-
-
-
-
Ω
0
6
-
-
±0.1
-
±1
-
±1
µA
-5
5
-
-
±0.1
-
±1
-
±1
µA
HC TYPES
High Level Input
Voltage
Low Level Input
Voltage
“ON” Resistance
IO = 1mA
(Figures 4, 5)
VIL
RON
-
VIH or
VIL
-
VCC or
VEE
VCC to
VEE
Maximum “ON”
Resistance Between
Any Two Channels
∆RON
Switch Off Leakage
Current
IIZ
Control Input Leakage
Current
Quiescent Device
Current
IO = 0
-
-
-
-
VIH or
VIL
VCC VEE
IIL
VCC or
GND
-
0
6
-
-
±0.1
-
±1
-
±1
µA
ICC
VCC or
When
0
GND VIS = VEE,
VOS=VCC -5
6
-
-
8
-
80
-
160
µA
5
-
-
16
-
160
-
320
µA
When
VIS = VCC,
VOS =VEE
HCT TYPES
High Level Input
Voltage
VIH
-
-
-
4.5 to
5.5
2
-
-
2
-
2
-
V
Low Level Input
Voltage
VIL
-
-
-
4.5 to
5.5
-
-
0.8
-
0.8
-
0.8
V
“ON” Resistance
IO = 1mA
(Figures 4, 5)
RON
VIH or
VIL
VCC or
VEE
0
4.5
-
45
180
-
225
-
270
Ω
-4.5
4.5
-
30
135
-
170
-
205
Ω
0
4.5
-
85
320
-
400
-
480
Ω
-4.5
4.5
-
35
170
-
215
-
255
Ω
0
4.5
-
10
-
-
-
-
-
Ω
-4.5
4.5
-
5
-
-
-
-
-
Ω
0
6
-
-
±0.1
-
±1
-
±1
µA
-5
5
-
-
±0.1
-
±1
-
±1
µA
VCC to
VEE
Maximum “ON”
Resistance Between
Any Two Channels
∆RON
Switch Off Leakage
Current
IIZ
-
VIH or
VIL
-
VCC VEE
4
CD54HC4316, CD74HC4316, CD74HCT4316
DC Electrical Specifications
(Continued)
PARAMETER
SYMBOL
VI (V)
VIS (V)
Control Input Leakage
Current
II
VCC or
GND
-
Quiescent Device
Current
IO = 0
Additional Quiescent
Device Current Per
Input Pin: 1 Unit Load
ICC
∆ICC
(Note 2)
Any
When
Voltage VIS = VEE,
BeVOS =
tween
VCC,
VCC and
When
GND VIS = VCC,
VOS = VEE
VCC
-2.1
-40oC TO
85oC
25oC
TEST CONDITIONS
VEE (V) VCC (V)
-55oC TO
125oC
MIN
TYP
MAX
MIN
MAX
MIN
MAX
UNITS
0
5.5
-
-
±0.1
-
±1
-
±1
µA
0
5.5
-
-
8
-
80
-
160
µA
-4.5
5.5
-
-
16
-
160
-
320
µA
-
4.5 to
5.5
-
100
360
-
450
-
490
µA
-
NOTE:
2. For dual-supply systems theoretical worst case (VI = 2.4V, VCC = 5.5V) specification is 1.8mA.
HCT Input Loading Table
INPUT
UNIT LOADS
All
0.5
NOTE: Unit Load is ∆ICC limit specified in DC Electrical Table, e.g.,
360µA max at 25oC.
Switching Specifications Input tr, tf = 6ns
PARAMETER
-40oC TO
85oC
25oC
-55oC TO
125oC
SYMBOL
TEST
CONDITIONS
VEE
(V)
VCC
(V)
MIN
TYP
MAX
MIN
MAX
MIN
MAX
UNITS
tPLH, tPHL
CL = 50pF
0
2
-
-
60
-
75
-
90
ns
0
4.5
-
-
12
-
15
-
18
ns
0
6
-
-
10
-
13
-
15
ns
-4.5
4.5
-
-
8
-
10
-
12
ns
0
2
-
-
205
-
255
-
310
ns
0
4.5
-
-
41
-
51
-
62
ns
0
6
-
-
35
-
43
-
53
ns
HC TYPES
Propagation Delay,
Switch In to Out
Turn “ON” Time E to Out
Turn “ON” Time nS to Out
Turn “OFF” Time E to Out
tPZH, tPZL
tPZH, tPZL
tPLZ, tPHZ
CL = 50pF
-4.5
4.5
-
-
37
-
47
-
56
ns
CL = 15pF
-
5
-
17
-
-
-
-
-
ns
CL = 50pF
0
2
-
-
175
-
220
-
265
ns
0
4.5
-
-
35
-
44
-
53
ns
0
6
-
-
30
-
37
-
45
ns
-4.5
4.5
-
-
34
-
43
-
51
ns
CL = 15pF
-
5
-
14
-
-
-
-
-
ns
CL = 50pF
0
2
-
-
205
-
255
-
310
ns
0
4.5
-
-
41
-
51
-
62
ns
0
6
-
-
35
-
43
-
53
ns
-4.5
4.5
-
-
37
-
47
-
56
ns
-
5
-
17
-
-
-
-
-
ns
CL = 15pF
5
CD54HC4316, CD74HC4316, CD74HCT4316
Switching Specifications Input tr, tf = 6ns
PARAMETER
Turn “OFF” Time nS to Out
Input (Control) Capacitance
Power Dissipation Capacitance
(Notes 3, 4)
(Continued)
-40oC TO
85oC
25oC
-55oC TO
125oC
VCC
(V)
MIN
TYP
MAX
MIN
MAX
MIN
MAX
UNITS
0
2
-
-
175
-
220
-
265
ns
0
4.5
-
-
35
-
44
-
53
ns
SYMBOL
TEST
CONDITIONS
VEE
(V)
tPLZ, tPHZ
CL = 50pF
0
6
-
-
30
-
37
-
45
ns
-4.5
4.5
-
-
34
-
43
-
51
ns
CL = 15pF
-
5
-
14
-
-
-
-
-
ns
CI
-
-
-
-
-
10
-
10
-
10
pF
CPD
-
-
5
-
42
-
-
-
-
-
pF
tPLH, tPHL
CL = 50pF
0
4.5
-
-
12
-
15
-
18
ns
-4.5
4.5
-
-
8
-
10
-
12
ns
tPZH
CL = 50pF
0
4.5
-
-
44
-
55
-
66
ns
-4.5
4.5
-
-
42
-
53
-
63
ns
-
5
-
18
-
-
-
-
-
ns
HCT TYPES
Propagation Delay,
Switch In to Switch Out
Turn “ON” Time E to Out
CL = 15pF
tPZL
Turn “ON” Time nS to Out
tPZH
CL = 50pF
Turn “OFF” Time E to Out
Turn “OFF” Time nS to Out
Input (Control) Capacitance
Power Dissipation Capacitance
(Notes 3, 4)
4.5
-
-
56
-
70
-
85
ns
4.5
-
-
42
-
53
-
63
ns
CL = 15pF
-
5
-
24
-
-
-
-
-
ns
CL = 50pF
0
4.5
-
-
40
-
53
-
60
ns
-4.5
4.5
-
-
34
-
43
-
51
ns
-
5
-
17
-
-
-
-
-
ns
CL = 15pF
tPZL
0
-4.5
CL = 50pF
0
4.5
-
-
50
-
63
-
75
ns
-4.5
4.5
-
-
34
-
43
-
51
ns
CL = 15pF
-
5
-
18
-
-
-
-
-
ns
tPLZ
CL = 50pF
0
4.5
-
-
50
-
63
-
75
ns
-4.5
4.5
-
-
46
-
58
-
69
ns
tPLZ, tPHZ
CL = 15pF
-
5
-
21
-
-
-
-
-
ns
tPHZ
CL = 50pF
0
4.5
-
-
44
-
55
-
66
ns
-4.5
4.5
-
-
40
-
50
-
60
ns
tPLZ, tPHZ
CL = 15pF
-
5
-
18
-
-
-
-
-
ns
CI
-
-
-
-
-
10
-
10
-
10
pF
CPD
-
-
5
-
47
-
-
-
-
-
pF
NOTES:
3. CPD is used to determine the dynamic power consumption, per package.
4. PD = CPD VCC2 fi + Σ (CL + CS) VCC2 fo where fi = input frequency, fo = output frequency, CL = output load capacitance, CS = switch
capacitance, VCC = supply voltage.
Analog Channel Specifications
TA = 25oC
TEST
CONDITIONS
VCC (V)
HC4316
CD74HCT4316
UNITS
Figure 9 (Notes 5, 6)
4.5
>200
>200
MHz
Crosstalk Between Any Two Switches (Figure 7) Figure 8 (Notes 6, 7)
4.5
TBE
TBE
dB
PARAMETER
Switch Frequency Response Bandwidth at -3dB
(Figure 6)
6
CD54HC4316, CD74HC4316, CD74HCT4316
Analog Channel Specifications
TA = 25oC (Continued)
TEST
CONDITIONS
VCC (V)
HC4316
CD74HCT4316
UNITS
1kHz, VIS = 4VP-P
(Figure 10)
4.5
0.078
0.078
%
1kHz, VIS = 8VP-P
(Figure 10)
9
0.018
0.018
%
4.5
TBE
TBE
mV
9
TBE
TBE
mV
Figure 12 (Notes 6, 7)
4.5
-62
-62
dB
-
-
5
5
pF
PARAMETER
Total Harmonic Distortion
Control to Switch Feedthrough Noise
Switch “OFF” Signal Feedthrough (Figure 7)
Figure 11
Switch Input Capacitance, CS
NOTES:
5. Adjust input level for 0dBm at output, f = 1MHz.
6. VIS is centered at VCC/2.
7. Adjust input for 0dBm at VIS.
Typical Performance Curves
110
60
“ON” RESISTANCE, RON (Ω)
“ON” RESISTANCE, RON (Ω)
100
90
VCC = 4.5V, VEE = 0V
80
70
60
50
40
VCC = 6V, VEE = 0V
30
20
50
45
40
30
25
20
15
10
5
10
0
1
2
3
4 4.5
INPUT SIGNAL VOLTAGE, VIS (V)
5
0
-4.5
6
CROSSTALK, dB
SWITCH OFF SIGNAL FEEDTHROUGH, dB
CL = 10pF
-2 VCC = 4.5V
RL = 50Ω
TA = 25oC
PIN 4 TO 3
-3
CL = 10pF
VCC = 9V
RL = 50Ω
TA = 25oC
PIN 4 TO 3
-4
10K
100K
1M
10M
FREQUENCY (f), Hz
-2.5
-1.5
-0.5
0.5
1.5
2.5
3.5
4.5
FIGURE 5. TYPICAL “ON” RESISTANCE vs INPUT SIGNAL
VOLTAGE
0
-1
-3.5
INPUT SIGNAL VOLTAGE, VIS (V)
FIGURE 4. TYPICAL “ON” RESISTANCE vs INPUT SIGNAL
VOLTAGE
CHANNEL ON BANDWIDTH, dB
VCC = 4.5V, VEE = 4.5V
35
0
-40
FIGURE 6. SWITCH FREQUENCY RESPONSE
CL = 10pF
VCC = 9V
RL = 50Ω
TA = 25oC
PIN 4 TO 3
-60
-80
-100
10K
100M
CL = 10pF
VCC = 4.5V
RL = 50Ω
TA = 25oC
PIN 4 TO 3
-20
100K
1M
10M
FREQUENCY (f), Hz
100M
FIGURE 7. SWITCH-OFF SIGNAL FEEDTHROUGH AND
CROSSTALK vs FREQUENCY
7
CD54HC4316, CD74HC4316, CD74HCT4316
Analog Test Circuits
VIS
VCC
VCC
0.1µF
SWITCH
ON
VIS
VOS1
R
R
VOS2
SWITCH
ON
R
C
R
VCC/2
C
dB
METER
VCC/2
fIS = 1MHz SINEWAVE
R = 50Ω
C = 10pF
VCC/2
FIGURE 8. CROSSTALK BETWEEN TWO SWITCHES TEST CIRCUIT
VCC
VCC
0.1µF
VIS
SINE
WAVE 10µF
VIS
VOS
SWITCH
ON
50Ω
VIS
VI = VIH
SWITCH
ON
VOS
10kΩ
10pF
dB
METER
VCC/2
50pF
DISTORTION
METER
VCC/2
fIS = 1kHz TO 10kHz
FIGURE 9. FREQUENCY RESPONSE TEST CIRCUIT
E
VCC
600Ω
VCC/2
SWITCH
ALTERNATING
ON AND OFF
tr, tf ≤ 6ns
fCONT = 1MHz
50% DUTY
CYCLE
FIGURE 10. TOTAL HARMONIC DISTORTION TEST CIRCUIT
VCC
VP-P
VOS
0.1µF
600Ω
50pF
VCC/2
SCOPE
FIGURE 11. CONTROL-TO-SWITCH FEEDTHROUGH NOISE
TEST CIRCUIT
fIS ≥ 1MHz SINEWAVE
R = 50Ω
C = 10pF
VOS
SWITCH
ON
VIS
VOS
VC = VIL
R
R
VCC/2
VCC/2
C
dB
METER
FIGURE 12. SWITCH OFF SIGNAL FEEDTHROUGH
8
CD54HC4316, CD74HC4316, CD74HCT4316
Test Circuits and Waveforms
6ns
6ns
3V (HCT)
90%
50%
tf = 6ns
tPLH
OUTPUT LOW
TO OFF
90%
50%
10%
50%
50%
SWITCH
ON
FIGURE 13. SWITCH PROPAGATION DELAY TIMES
tPZH
90%
OUTPUT HIGH
TO OFF
VEE
SWITCH OUTPUT
50%
10%
tPHZ
tPHL
GND
tPZL
tPLZ
tr = 6ns
SWITCH INPUT
10%
E
VCC
VCC (HC)
OUTPUTS
DISABLED
SWITCH OFF
OUTPUTS
ENABLED
SWITCH ON
FIGURE 14. SWITCH TURN-ON AND TURN-OFF
PROPAGATION DELAY TIMES WAVEFORMS
9
10
PACKAGE OPTION ADDENDUM
www.ti.com
9-Oct-2007
PACKAGING INFORMATION
Orderable Device
Status (1)
Package
Type
CD54HC4316F3A
ACTIVE
CDIP
J
16
1
TBD
A42 SNPB
N / A for Pkg Type
CD74HC4316E
ACTIVE
PDIP
N
16
25
Pb-Free
(RoHS)
CU NIPDAU
N / A for Pkg Type
CD74HC4316EE4
ACTIVE
PDIP
N
16
25
Pb-Free
(RoHS)
CU NIPDAU
N / A for Pkg Type
CD74HC4316M
ACTIVE
SOIC
D
16
40
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CD74HC4316M96
ACTIVE
SOIC
D
16
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CD74HC4316M96E4
ACTIVE
SOIC
D
16
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CD74HC4316M96G4
ACTIVE
SOIC
D
16
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CD74HC4316ME4
ACTIVE
SOIC
D
16
40
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CD74HC4316MG4
ACTIVE
SOIC
D
16
40
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CD74HC4316MT
ACTIVE
SOIC
D
16
250
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CD74HC4316MTE4
ACTIVE
SOIC
D
16
250
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CD74HC4316MTG4
ACTIVE
SOIC
D
16
250
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CD74HC4316NSR
ACTIVE
SO
NS
16
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CD74HC4316NSRE4
ACTIVE
SO
NS
16
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CD74HC4316NSRG4
ACTIVE
SO
NS
16
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CD74HC4316PW
ACTIVE
TSSOP
PW
16
90
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CD74HC4316PWE4
ACTIVE
TSSOP
PW
16
90
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CD74HC4316PWG4
ACTIVE
TSSOP
PW
16
90
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CD74HC4316PWR
ACTIVE
TSSOP
PW
16
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CD74HC4316PWRE4
ACTIVE
TSSOP
PW
16
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CD74HC4316PWRG4
ACTIVE
TSSOP
PW
16
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CD74HC4316PWT
ACTIVE
TSSOP
PW
16
250
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CD74HC4316PWTE4
ACTIVE
TSSOP
PW
16
250
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CD74HC4316PWTG4
ACTIVE
TSSOP
PW
16
250
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CD74HCT4316E
ACTIVE
PDIP
N
16
25
Pb-Free
(RoHS)
CU NIPDAU
N / A for Pkg Type
Package
Drawing
Pins Package Eco Plan (2)
Qty
Addendum-Page 1
Lead/Ball Finish
MSL Peak Temp (3)
PACKAGE OPTION ADDENDUM
www.ti.com
9-Oct-2007
Orderable Device
Status (1)
Package
Type
Package
Drawing
Pins Package Eco Plan (2)
Qty
CD74HCT4316EE4
ACTIVE
PDIP
N
16
25
Pb-Free
(RoHS)
CU NIPDAU
N / A for Pkg Type
CD74HCT4316M
ACTIVE
SOIC
D
16
40
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CD74HCT4316M96
ACTIVE
SOIC
D
16
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CD74HCT4316M96E4
ACTIVE
SOIC
D
16
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CD74HCT4316M96G4
ACTIVE
SOIC
D
16
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CD74HCT4316ME4
ACTIVE
SOIC
D
16
40
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CD74HCT4316MG4
ACTIVE
SOIC
D
16
40
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CD74HCT4316MT
ACTIVE
SOIC
D
16
250
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CD74HCT4316MTE4
ACTIVE
SOIC
D
16
250
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CD74HCT4316MTG4
ACTIVE
SOIC
D
16
250
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
Lead/Ball Finish
MSL Peak Temp (3)
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
4-Oct-2007
TAPE AND REEL BOX INFORMATION
Device
Package Pins
Site
Reel
Diameter
(mm)
Reel
Width
(mm)
A0 (mm)
B0 (mm)
K0 (mm)
P1
(mm)
W
Pin1
(mm) Quadrant
CD74HC4316M96
D
16
SITE 27
330
16
6.5
10.3
2.1
8
16
Q1
CD74HC4316NSR
NS
16
SITE 41
330
16
8.2
10.5
2.5
12
16
Q1
CD74HC4316PWR
PW
16
SITE 41
330
12
7.0
5.6
1.6
8
12
Q1
CD74HCT4316M96
D
16
SITE 27
330
16
6.5
10.3
2.1
8
16
Q1
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
Device
4-Oct-2007
Package
Pins
Site
Length (mm)
Width (mm)
Height (mm)
CD74HC4316M96
D
16
SITE 27
342.9
336.6
28.58
CD74HC4316NSR
NS
16
SITE 41
346.0
346.0
33.0
CD74HC4316PWR
PW
16
SITE 41
346.0
346.0
29.0
CD74HCT4316M96
D
16
SITE 27
342.9
336.6
28.58
Pack Materials-Page 2
MECHANICAL DATA
MTSS001C – JANUARY 1995 – REVISED FEBRUARY 1999
PW (R-PDSO-G**)
PLASTIC SMALL-OUTLINE PACKAGE
14 PINS SHOWN
0,30
0,19
0,65
14
0,10 M
8
0,15 NOM
4,50
4,30
6,60
6,20
Gage Plane
0,25
1
7
0°– 8°
A
0,75
0,50
Seating Plane
0,15
0,05
1,20 MAX
PINS **
0,10
8
14
16
20
24
28
A MAX
3,10
5,10
5,10
6,60
7,90
9,80
A MIN
2,90
4,90
4,90
6,40
7,70
9,60
DIM
4040064/F 01/97
NOTES: A.
B.
C.
D.
All linear dimensions are in millimeters.
This drawing is subject to change without notice.
Body dimensions do not include mold flash or protrusion not to exceed 0,15.
Falls within JEDEC MO-153
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
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