[ /Title (CD74H C4066, CD74H CT4066 ) /Subject (HighSpeed CMOS Logic Quad CD54HC4066, CD74HC4066, CD74HCT4066 Data sheet acquired from Harris Semiconductor SCHS208D High-Speed CMOS Logic Quad Bilateral Switch February 1998 - Revised August 2003 Features Description • Wide Analog-Input-Voltage Range . . . . . . . . . . 0V - 10V The ’HC4066 and CD74HCT4066 contain four independent digitally controlled analog switches that use silicon-gate CMOS technology to achieve operating speeds similar to LSTTL with the low power consumption of standard CMOS integrated circuits. • Low “ON” Resistance - VCC = 4.5V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .25Ω - VCC = 9V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .15Ω • Fast Switching and Propagation Delay Times These switches feature the characteristic linear “ON” resistance of the metal-gate CD4066B. Each switch is turned on by a high-level voltage on its control input. • Low “OFF” Leakage Current • Wide Operating Temperature Range . . . -55oC to 125oC Ordering Information • HC Types - 2V to 10V Operation - High Noise Immunity: NIL = 30%, NIH = 30% of VCC at VCC = 5V and 10V PART NUMBER • HCT Types - Direct LSTTL Input Logic Compatibility, VIL= 0.8V (Max), VIH = 2V (Min) - CMOS Input Compatibility, Il ≤ 1µA at VOL, VOH TEMP. RANGE (oC) PACKAGE CD54HC4066F3A -55 to 125 14 Ld CERDIP CD74HC4066E -55 to 125 14 Ld PDIP CD74HC4066M -55 to 125 14 Ld SOIC CD74HC4066MT -55 to 125 14 Ld SOIC CD74HC4066M96 -55 to 125 14 Ld SOIC CD74HC4066PW -55 to 125 14 Ld TSSOP CD74HC4066PWR -55 to 125 14 Ld TSSOP CD74HC4066PWT -55 to 125 14 Ld TSSOP CD74HCT4066E -55 to 125 14 Ld PDIP CD74HCT4066M -55 to 125 14 Ld SOIC CD74HCT4066MT -55 to 125 14 Ld SOIC CD74HCT4066M96 -55 to 125 14 Ld SOIC NOTE: When ordering, use the entire part number. The suffixes 96 and R denote tape and reel. The suffix T denotes a small-quantity reel of 250. Pinout CD54HC4066 (CERDIP) CD74HC4066 (PDIP, SOIC, TSSOP) CD74HCT4066 (PDIP, SOIC) TOP VIEW 1Y 1 14 VCC 1Z 2 13 1E 2Z 3 12 4E 2Y 4 11 4Y 2E 5 10 4Z 3E 6 9 3Z GND 7 8 3Y CAUTION: These devices are sensitive to electrostatic discharge. Users should follow proper IC Handling Procedures. Copyright © 2003, Texas Instruments Incorporated 1 CD54HC4066, CD74HC4066, CD74HCT4066 Functional Diagram 13 1 1E 2 5 4 2E 3 6 8 3E 9 12 11 4E 10 1Y 1Z 2Y 2Z 3Y 3Z 4Y 4Z GND = 7 VCC = 14 TRUTH TABLE INPUT nE SWITCH L Off H On H= High Level L= Low Level Logic Diagram nY p p n nZ n nE 2 CD54HC4066, CD74HC4066, CD74HCT4066 Absolute Maximum Ratings Thermal Information DC Supply Voltage, VCC HCT Types . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.5V to 7V HC Types . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.5V to 10.5V DC Input Diode Current, IIK For VI < -0.5V or VI > VCC + 0.5V . . . . . . . . . . . . . . . . . . . . . .±20mA DC Switch Current, IO (Note 1) For -0.5V < VO < VCC + 0.5V. . . . . . . . . . . . . . . . . . . . . . . . . .±25mA DC Output Diode Current, IOK For VO < -0.5V or VO > VCC + 0.5V . . . . . . . . . . . . . . . . . . . .±20mA DC Output Source or Sink Current per Output Pin, IO For VO > -0.5V or VO < VCC + 0.5V . . . . . . . . . . . . . . . . . . . .±25mA DC VCC or Ground Current, ICC . . . . . . . . . . . . . . . . . . . . . . . . .±50mA Thermal Resistance (Typical, Note 2) θJA E (PDIP) Package . . . . . . . . . . . . . . . . . . . . . . . . . . 80oC/W M (SOIC) Package. . . . . . . . . . . . . . . . . . . . . . . . . . 86oC/W PW (TSSOP) Package . . . . . . . . . . . . . . . . . . . . . . 113oC/W Maximum Junction Temperature (Hermetic Package or Die) . . . 175oC Maximum Junction Temperature (Plastic Package) . . . . . . . . 150oC Maximum Storage Temperature Range . . . . . . . . . .-65oC to 150oC Maximum Lead Temperature (Soldering 10s) . . . . . . . . . . . . . 300oC (SOIC - Lead Tips Only) Operating Conditions Temperature Range, TA . . . . . . . . . . . . . . . . . . . . . . -55oC to 125oC Supply Voltage Range, VCC HC Types . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .2V to 10V HCT Types . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .4.5V to 5.5V DC Input or Output Voltage, VI, VO . . . . . . . . . . . . . . . . . 0V to VCC Input Rise and Fall Time 2V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1000ns (Max) 4.5V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 500ns (Max) 6V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 400ns (Max) CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. NOTES: 1. In certain applications, the external load-resistor current may include both VCC and signal-line components. To avoid drawing VCC current when switch current flows into the transmission gate inputs, (terminals 1, 4, 8 and 11) the voltage drop across the bidirectional switch must not exceed 0.6V (calculated from RON values shown in the DC Electrical Specifications Table). No VCC current will flow through RLif the switch current flows into terminals 2, 3, 9 and 10. 2. The package thermal impedance is calculated in accordance with JESD 51-7. DC Electrical Specifications TEST CONDITIONS PARAMETER 25oC -40oC TO 85oC -55oC TO 125oC SYMBOL VI (V) VIS (V) VCC (V) MIN TYP MAX MIN MAX MIN MAX UNITS VIH - - 2 1.5 - - 1.5 - 1.5 - V 4.5 3.15 - - 3.15 - 3.15 - V 9 6.3 - - 6.3 - 6.3 - V 2 - - 0.5 - 0.5 - 0.5 V 4.5 - - 1.35 - 1.35 - 1.35 V 9 - - 2.7 - 2.7 - 2.7 V HC TYPES High Level Input Voltage Low Level Input Voltage VIL - - Input Leakage Current (Any Control) IIL VCC or GND - 10 - - ±0.1 - ±1 - ±1 µA Off-Switch Leakage Current IZ VIL VCC or GND 10 - - ±0.1 - ±1 - ±1 µA 3 CD54HC4066, CD74HC4066, CD74HCT4066 DC Electrical Specifications (Continued) TEST CONDITIONS PARAMETER “ON” Resistance IO = 1mA (Figure 1) Quiescent Device Current -40oC TO 85oC -55oC TO 125oC SYMBOL VI (V) VIS (V) VCC (V) MIN TYP MAX MIN MAX MIN MAX UNITS RON VCC VCC or GND 4.5 - 25 80 - 106 - 128 Ω 6 - 20 75 - 94 - 113 Ω 9 - 15 60 - 78 - 95 Ω 4.5 - 35 95 - 118 - 142 Ω 6 - 24 84 - 105 - 126 Ω 9 - 16 70 - 88 - 105 Ω 4.5 - 1 - - - - - Ω 6 - 0.75 - - - - - Ω 9 - 0.5 - - - - - Ω VCC to GND “ON” Resistance Between Any Two Switches 25oC ∆RON ICC VCC - VCC or GND - 6 - - 2 - 20 - 40 µA 10 - - 16 - 160 - 320 µA HCT TYPES High Level Input Voltage VIH - - 4.5 to 5.5 2 - - 2 - 2 - V Low Level Input Voltage VIL - - 4.5 to 5.5 - - 0.8 - 0.8 - 0.8 V Input Leakage Current (Any Control) IIL VCC or GND - 5.5 - - ±0.1 - ±1 - ±1 µA Off-Switch Leakage Current IZ VIL VCC or GND 5.5 - - ±0.1 - ±1 - ±1 µA RON VCC VCC or GND 4.5 - 25 80 - 106 - 128 Ω VCC to GND 4.5 - 35 95 - 118 - 142 Ω “ON” Resistance IO = 1mA (Figure 1) “ON” Resistance Between Any Two Switches ∆RON VCC - 4.5 - 1 - - - - - Ω Quiescent Device Current ICC VCC or GND - 5.5 - - 2 - 20 - 40 µA ∆ICC (Note 3) VCC - 2.1 - 4.5 to 5.5 - 100 360 - 450 - 490 µA Additional Quiescent Device Current Per Input Pin: 1 Unit Load NOTE: 3. For dual-supply systems theoretical worst case (VI = 2.4V, VCC = 5.5V) specification is 1.8mA. HCT Input Loading Table INPUT UNIT LOADS All 1 NOTE: Unit Load is ∆ICC limit specified in DC Electrical Specifications table, e.g., 360µA max at 25oC. 4 CD54HC4066, CD74HC4066, CD74HCT4066 Switching Specifications Input tr, tf = 6ns PARAMETER SYMBOL TEST CONDITIONS tPLH, tPHL CL = 50pF VCC (V) 25oC MIN TYP -40oC TO 85oC -55oC TO 125oC MAX MIN MAX MIN MAX UNITS HC TYPES Propagation Delay Time Switch In to Out Propagation Delay Time Switch Turn On Delay tPZH, tPZL 2 - - 60 - 75 - 90 ns 4.5 - - 12 - 15 - 18 ns 9 - - 8 - 11 - 13 ns CL = 15pF 5 - 4 - - - - - ns CL = 50pF 2 - - 100 - 125 - 150 ns 4.5 - - 20 - 25 - 30 ns 9 - - 12 - 15 - 18 ns 5 - 8 - - - - - ns CL = 15pF Propagation Delay Time Switch Turn Off Delay 2 - - 150 - 190 - 225 ns 4.5 - - 30 - 38 - 45 ns 9 - - 24 - 30 - 36 ns CL = 15pF 5 - 12 - - - - - ns CI - - - - 10 - 10 - 10 pF CPD - 5 - 25 - - - - - pF Propagation Delay Time Switch In to Out tPLH, tPHL CL = 50pF 4.5 - - 12 - 15 - 18 ns CL = 15pF 5 - 4 - - - - - ns Propagation Delay Time Switch Turn On Delay tPZH, tPZL CL = 50pF 4.5 - - 24 - 30 - 36 ns CL = 15pF 5 - 9 - - - - - ns Propagation Delay Time Switch Turn Off Delay tPHZ, tPLZ CL = 50pF 4.5 - - 35 - 44 - 53 ns Input (Control) Capacitance Power Dissipation Capacitance (Notes 4, 5) tPHZ, tPLZ CL = 50pF HCT TYPES Input (Control) Capacitance Power Dissipation Capacitance (Notes 4, 5) CL = 15pF 5 - 14 - - - - - ns CI - - - - 10 - 10 - 10 pF CPD - 5 - 38 - - - - - pF NOTES: 4. CPD is used to determine the dynamic power consumption, per package. 5. PD = CPD VCC2 fi + Σ (CL + CS) VCC2 fo where fi = input frequency, fo = output frequency, CL = output load capacitance, CS = switch capacitance, VCC = supply voltage. Analog Channel Specifications TA = 25oC PARAMETER TEST CONDITIONS VCC (V) HC4066 CD74HCT4066 UNITS Switch Frequency Response Bandwidth at -3dB Figure 2 Figure 5, Notes 6, 7 4.5 200 200 MHz Cross Talk Between Any Two Switches Figure 3 Figure 4, Notes 7, 8 4.5 -72 -72 dB Total Harmonic Distortion Figure 6, 1kHz, VIS = 4VP-P 4.5 0.022 0.023 % Figure 6, 1kHz, VIS = 8VP-P 9 0.008 N/A % 5 CD54HC4066, CD74HC4066, CD74HCT4066 TA = 25oC (Continued) Analog Channel Specifications PARAMETER TEST CONDITIONS Control to Switch Feedthrough Noise VCC (V) HC4066 CD74HCT4066 UNITS 4.5 200 130 mV 9 550 N/A mV 4.5 -72 -72 dB - 5 5 pF Figure 7 Switch “OFF” Signal Feedthrough Figure 3 Figure 8, Notes 7, 8 Switch Input Capacitance, CS NOTES: 6. Adjust input level for 0dBm at output, f = 1MHz. 7. VIS is centered at VCC/2. 8. Adjust input for 0dBm at VIS. Typical Performance Curves “ON” RESISTANCE, RON (Ω) 40 CHANNEL-ON BANDWIDTH, dB TA = 25oC, GND = 0V 50 VCC = 4.5V, PIN 1 TO 2 30 20 VCC = 9V, PIN 1 TO 3 10 0 0 1 2 3 4 4.5 5 6 7 8 9 CROSSTALK, dB SWITCH-OFF SIGNAL FEEDTHROUGH, dB -2 CL = 10pF VCC = 4.5V RL = 50Ω TA = 25oC PIN 4 TO 3 -3 105 106 107 FIGURE 2. SWITCH FREQUENCY RESPONSE, VCC = 4.5V CL = 10pF VCC = 4.5V RL = 50Ω TA = 25oC PIN 4 TO 3 -40 -60 -80 -100 104 108 FREQUENCY, f (Hz) FIGURE 1. TYPICAL “ON” RESISTANCE vs INPUT SIGNAL VOLTAGE -20 -1 -4 104 10 INPUT SIGNAL VOLTAGE, VIS (V) 0 0 105 106 107 108 FREQUENCY, f (Hz) FIGURE 3. SWITCH-OFF SIGNAL FEEDTHROUGH AND CROSSTALK vs FREQUENCY, VCC = 4.5V 6 CD54HC4066, CD74HC4066, CD74HCT4066 Analog Test Circuits VIS 0.1µF VCC VCC SWITCH ON VIS R VOS1 R R C VOS2 SWITCH OFF R VCC/2 VCC/2 C dB METER VCC/2 fIS = 1MHz SINEWAVE R = 50Ω C = 10pF FIGURE 4. CROSSTALK BETWEEN TWO SWITCHES TEST CIRCUIT VCC VCC 0.1µF VIS SINE WAVE 10µF VIS VOS SWITCH ON 50Ω VIS VI = VIH SWITCH ON VOS 10kΩ 10pF dB METER VCC/2 50pF DISTORTION METER VCC/2 fIS = 1kHz TO 10kHz FIGURE 5. FREQUENCY RESPONSE TEST CIRCUIT E VCC 600Ω VCC/2 FIGURE 6. TOTAL HARMONIC DISTORTION TEST CIRCUIT SWITCH ALTERNATING ON AND OFF tr, tf ≤ 6ns fCONT = 1MHz 50% DUTY CYCLE VCC VC = VIL VP-P VOS 0.1µF VOS 50pF SCOPE VCC/2 FIGURE 7. CONTROL-TO-SWITCH FEEDTHROUGH NOISE TEST CIRCUIT VOS SWITCH OFF VIS 600Ω fIS ≥ 1MHz SINEWAVE R = 50Ω C = 10pF R R VCC/2 VCC/2 C dB METER FIGURE 8. SWITCH OFF SIGNAL FEEDTHROUGH Test Circuits and Waveforms tr = 6ns tf = 6ns 90% 50% 10% INPUT GND tTLH GND tTHL 90% 50% 10% INVERTING OUTPUT 3V 2.7V 1.3V 0.3V INPUT tTHL tPHL tf = 6ns tr = 6ns VCC tTLH 90% 1.3V 10% INVERTING OUTPUT tPHL tPLH FIGURE 9. HC TRANSITION TIMES AND PROPAGATION DELAY TIMES, COMBINATION LOGIC tPLH FIGURE 10. HCT TRANSITION TIMES AND PROPAGATION DELAY TIMES, COMBINATION LOGIC 7 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All products are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment. TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standard warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where mandated by government requirements, testing of all parameters of each product is not necessarily performed. TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and applications using TI components. To minimize the risks associated with customer products and applications, customers should provide adequate design and operating safeguards. TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask work right, or other TI intellectual property right relating to any combination, machine, or process in which TI products or services are used. Information published by TI regarding third-party products or services does not constitute a license from TI to use such products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI. Reproduction of information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an unfair and deceptive business practice. TI is not responsible or liable for such altered documentation. Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice. TI is not responsible or liable for any such statements. TI products are not authorized for use in safety-critical applications (such as life support) where a failure of the TI product would reasonably be expected to cause severe personal injury or death, unless officers of the parties have executed an agreement specifically governing such use. Buyers represent that they have all necessary expertise in the safety and regulatory ramifications of their applications, and acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any use of TI products in such safety-critical applications, notwithstanding any applications-related information or support that may be provided by TI. Further, Buyers must fully indemnify TI and its representatives against any damages arising out of the use of TI products in such safety-critical applications. TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products are specifically designated by TI as military-grade or "enhanced plastic." Only products designated by TI as military-grade meet military specifications. Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is solely at the Buyer's risk, and that they are solely responsible for compliance with all legal and regulatory requirements in connection with such use. TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products are designated by TI as compliant with ISO/TS 16949 requirements. Buyers acknowledge and agree that, if they use any non-designated products in automotive applications, TI will not be responsible for any failure to meet such requirements. Following are URLs where you can obtain information on other Texas Instruments products and application solutions: Products Applications Amplifiers amplifier.ti.com Audio www.ti.com/audio Data Converters dataconverter.ti.com Automotive www.ti.com/automotive DSP dsp.ti.com Broadband www.ti.com/broadband Interface interface.ti.com Digital Control www.ti.com/digitalcontrol Logic logic.ti.com Military www.ti.com/military Power Mgmt power.ti.com Optical Networking www.ti.com/opticalnetwork Microcontrollers microcontroller.ti.com Security www.ti.com/security Low Power Wireless www.ti.com/lpw Telephony www.ti.com/telephony Video & Imaging www.ti.com/video Wireless www.ti.com/wireless Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265 Copyright © 2007, Texas Instruments Incorporated PACKAGE OPTION ADDENDUM www.ti.com 24-May-2007 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Eco Plan (2) Qty Lead/Ball Finish MSL Peak Temp (3) 5962-8950701CA ACTIVE CDIP J 14 1 TBD A42 SNPB N / A for Pkg Type CD54HC4066F3A ACTIVE CDIP J 14 1 TBD A42 SNPB N / A for Pkg Type CD74HC4066E ACTIVE PDIP N 14 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type CD74HC4066EE4 ACTIVE PDIP N 14 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type CD74HC4066M ACTIVE SOIC D 14 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD74HC4066M96 ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD74HC4066M96E4 ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD74HC4066M96G4 ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD74HC4066ME4 ACTIVE SOIC D 14 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD74HC4066MG4 ACTIVE SOIC D 14 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD74HC4066MT ACTIVE SOIC D 14 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD74HC4066MTE4 ACTIVE SOIC D 14 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD74HC4066MTG4 ACTIVE SOIC D 14 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD74HC4066PW ACTIVE TSSOP PW 14 90 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD74HC4066PWE4 ACTIVE TSSOP PW 14 90 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD74HC4066PWG4 ACTIVE TSSOP PW 14 90 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD74HC4066PWR ACTIVE TSSOP PW 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD74HC4066PWRE4 ACTIVE TSSOP PW 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD74HC4066PWRG4 ACTIVE TSSOP PW 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD74HC4066PWT ACTIVE TSSOP PW 14 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD74HC4066PWTE4 ACTIVE TSSOP PW 14 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD74HC4066PWTG4 ACTIVE TSSOP PW 14 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD74HCT4066E ACTIVE PDIP N 14 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type CD74HCT4066EE4 ACTIVE PDIP N 14 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type CD74HCT4066M ACTIVE SOIC D 14 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD74HCT4066M96 ACTIVE SOIC D 14 2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM Addendum-Page 1 PACKAGE OPTION ADDENDUM www.ti.com 24-May-2007 Orderable Device Status (1) Package Type Package Drawing Pins Package Eco Plan (2) Qty CD74HCT4066M96E4 ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD74HCT4066M96G4 ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD74HCT4066ME4 ACTIVE SOIC D 14 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD74HCT4066MG4 ACTIVE SOIC D 14 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD74HCT4066MT ACTIVE SOIC D 14 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD74HCT4066MTE4 ACTIVE SOIC D 14 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD74HCT4066MTG4 ACTIVE SOIC D 14 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Lead/Ball Finish MSL Peak Temp (3) no Sb/Br) (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 2 PACKAGE MATERIALS INFORMATION www.ti.com 19-May-2007 TAPE AND REEL INFORMATION Pack Materials-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com Device 19-May-2007 Package Pins Site Reel Diameter (mm) Reel Width (mm) A0 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant CD74HC4066M96 D 14 MLA 330 16 6.5 9.0 2.1 8 16 Q1 CD74HC4066PWR PW 14 MLA 330 12 7.0 5.6 1.6 8 12 Q1 CD74HCT4066M96 D 14 MLA 330 16 6.5 9.0 2.1 8 16 Q1 TAPE AND REEL BOX INFORMATION Device Package Pins Site Length (mm) Width (mm) Height (mm) CD74HC4066M96 D 14 MLA 342.9 336.6 28.58 CD74HC4066PWR PW 14 MLA 338.1 340.5 20.64 CD74HCT4066M96 D 14 MLA 342.9 336.6 28.58 Pack Materials-Page 2 PACKAGE MATERIALS INFORMATION www.ti.com 19-May-2007 Pack Materials-Page 3 MECHANICAL DATA MTSS001C – JANUARY 1995 – REVISED FEBRUARY 1999 PW (R-PDSO-G**) PLASTIC SMALL-OUTLINE PACKAGE 14 PINS SHOWN 0,30 0,19 0,65 14 0,10 M 8 0,15 NOM 4,50 4,30 6,60 6,20 Gage Plane 0,25 1 7 0°– 8° A 0,75 0,50 Seating Plane 0,15 0,05 1,20 MAX PINS ** 0,10 8 14 16 20 24 28 A MAX 3,10 5,10 5,10 6,60 7,90 9,80 A MIN 2,90 4,90 4,90 6,40 7,70 9,60 DIM 4040064/F 01/97 NOTES: A. B. C. D. All linear dimensions are in millimeters. This drawing is subject to change without notice. Body dimensions do not include mold flash or protrusion not to exceed 0,15. Falls within JEDEC MO-153 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All products are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment. TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standard warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where mandated by government requirements, testing of all parameters of each product is not necessarily performed. TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and applications using TI components. To minimize the risks associated with customer products and applications, customers should provide adequate design and operating safeguards. TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask work right, or other TI intellectual property right relating to any combination, machine, or process in which TI products or services are used. Information published by TI regarding third-party products or services does not constitute a license from TI to use such products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI. Reproduction of information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an unfair and deceptive business practice. TI is not responsible or liable for such altered documentation. Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice. TI is not responsible or liable for any such statements. TI products are not authorized for use in safety-critical applications (such as life support) where a failure of the TI product would reasonably be expected to cause severe personal injury or death, unless officers of the parties have executed an agreement specifically governing such use. Buyers represent that they have all necessary expertise in the safety and regulatory ramifications of their applications, and acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any use of TI products in such safety-critical applications, notwithstanding any applications-related information or support that may be provided by TI. Further, Buyers must fully indemnify TI and its representatives against any damages arising out of the use of TI products in such safety-critical applications. TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products are specifically designated by TI as military-grade or "enhanced plastic." Only products designated by TI as military-grade meet military specifications. Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is solely at the Buyer's risk, and that they are solely responsible for compliance with all legal and regulatory requirements in connection with such use. TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products are designated by TI as compliant with ISO/TS 16949 requirements. Buyers acknowledge and agree that, if they use any non-designated products in automotive applications, TI will not be responsible for any failure to meet such requirements. Following are URLs where you can obtain information on other Texas Instruments products and application solutions: Products Applications Amplifiers amplifier.ti.com Audio www.ti.com/audio Data Converters dataconverter.ti.com Automotive www.ti.com/automotive DSP dsp.ti.com Broadband www.ti.com/broadband Interface interface.ti.com Digital Control www.ti.com/digitalcontrol Logic logic.ti.com Military www.ti.com/military Power Mgmt power.ti.com Optical Networking www.ti.com/opticalnetwork Microcontrollers microcontroller.ti.com Security www.ti.com/security RFID www.ti-rfid.com Telephony www.ti.com/telephony Low Power Wireless www.ti.com/lpw Video & Imaging www.ti.com/video Wireless www.ti.com/wireless Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265 Copyright © 2007, Texas Instruments Incorporated