[ /Title (CD74 HC132 , CD74 HCT13 2) /Subject (High Speed CMOS Logic Quad 2-Input NAND Schmit CD54HC132, CD74HC132, CD54HCT132, CD74HCT132 Data sheet acquired from Harris Semiconductor SCHS145E High-Speed CMOS Logic Quad 2-Input NAND Schmitt Trigger August 1997 - Revised March 2004 Features Description • Unlimited Input Rise and Fall Times The ’HC132 and ’HCT132 each contain four 2-input NAND Schmitt Triggers in one package. This logic device utilizes silicon gate CMOS technology to achieve operating speeds similar to LSTTL gates with the low power consumption of standard CMOS integrated circuits. All devices have the ability to drive 10 LSTTL loads. The HCT logic family is functionally pin compatible with the standard LS logic family. • Exceptionally High Noise Immunity • Typical Propagation Delay: 10ns at VCC = 5V, CL = 15pF, TA = 25oC • Fanout (Over Temperature Range) - Standard Outputs . . . . . . . . . . . . . . . 10 LSTTL Loads - Bus Driver Outputs . . . . . . . . . . . . . 15 LSTTL Loads Ordering Information • Wide Operating Temperature Range . . . -55oC to 125oC PART NUMBER • Balanced Propagation Delay and Transition Times • Significant Power Reduction Compared to LSTTL Logic ICs • HC Types - 2V to 6V Operation - High Noise Immunity: NIL = 37%, NIH = 51% of VCC at VCC = 5V • HCT Types - 4.5V to 5.5V Operation - Direct LSTTL Input Logic Compatibility, VIL= 0.8V (Max), VIH = 2V (Min) - CMOS Input Compatibility, Il ≤ 1µA at VOL, VOH TEMP. RANGE (oC) PACKAGE CD54HC132F3A -55 to 125 14 Ld CERDIP CD54HCT132F3A -55 to 125 14 Ld CERDIP CD74HC132E -55 to 125 14 Ld PDIP CD74HC132M -55 to 125 14 Ld SOIC CD74HC132MT -55 to 125 14 Ld SOIC CD74HC132M96 -55 to 125 14 Ld SOIC CD74HCT132E -55 to 125 14 Ld PDIP CD74HCT132M -55 to 125 14 Ld SOIC CD74HCT132MT -55 to 125 14 Ld SOIC CD74HCT132M96 -55 to 125 14 Ld SOIC NOTE: When ordering, use the entire part number. The suffix 96 denotes tape and reel. The suffix T denotes a small-quantity reel of 250. Pinout CD54HC132, CD54HCT132 (CERDIP) CD74HC132, CD74HCT132 (PDIP, SOIC) TOP VIEW 1A 1 14 VCC 1B 2 13 4B 1Y 3 12 4A 2A 4 11 4Y 2B 5 10 3B 2Y 6 9 3A GND 7 8 3Y CAUTION: These devices are sensitive to electrostatic discharge. Users should follow proper IC Handling Procedures. Copyright © 2004, Texas Instruments Incorporated 1 CD54HC132, CD74HC132, CD54HCT132, CD74HCT132 Functional Diagram 1 14 2 13 1A 4B 1B 1Y 2A 2B 2Y GND VCC 3 12 4 11 5 10 6 9 7 8 4A 4Y 3B 3A 3Y TRUTH TABLE INPUTS OUTPUT nA nB nY L L H L H H H L H H H L H = High Voltage Level, L = Low Voltage Level Logic Symbol nA nY nB 2 CD54HC132, CD74HC132, CD54HCT132, CD74HCT132 Absolute Maximum Ratings Thermal Information DC Supply Voltage, VCC . . . . . . . . . . . . . . . . . . . . . . . . -0.5V to 7V DC Input Diode Current, IIK For VI < -0.5V or VI > VCC + 0.5V . . . . . . . . . . . . . . . . . . . . . .±20mA DC Output Diode Current, IOK For VO < -0.5V or VO > VCC + 0.5V . . . . . . . . . . . . . . . . . . . .±20mA DC Output Source or Sink Current per Output Pin, IO For VO > -0.5V or VO < VCC + 0.5V . . . . . . . . . . . . . . . . . . . .±25mA DC VCC or Ground Current, ICC or IGND . . . . . . . . . . . . . . . . . .±50mA Thermal Resistance (Typical, Note 1) θJA (oC/W) E (PDIP) Package . . . . . . . . . . . . . . . . . . . . . . . . . . 80 M (SOIC) Package. . . . . . . . . . . . . . . . . . . . . . . . . . 86 Maximum Junction Temperature . . . . . . . . . . . . . . . . . . . . . . . 150oC Maximum Storage Temperature Range . . . . . . . . . .-65oC to 150oC Maximum Lead Temperature (Soldering 10s) . . . . . . . . . . . . . 300oC (SOIC - Lead Tips Only) Operating Conditions Temperature Range (TA) . . . . . . . . . . . . . . . . . . . . . -55oC to 125oC Supply Voltage Range, VCC HC Types . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .2V to 6V HCT Types . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .4.5V to 5.5V DC Input or Output Voltage, VI, VO . . . . . . . . . . . . . . . . . 0V to VCC CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. NOTE: 1. The package thermal impedance is calculated in accordance with JESD 51-7. DC Electrical Specifications TEST CONDITIONS PARAMETER SYMBOL VI (V) VT+ - 25oC IO (mA) VCC (V) -40oC TO 85oC -55oC TO 125oC MIN TYP MAX MIN MAX MIN MAX UNITS 2 0.7 - 1.5 0.7 1.5 0.7 1.5 V 4.5 1.7 - 3.15 1.7 3.15 1.7 3.15 V 6 2.1 - 4.2 2.1 4.2 2.1 4.2 V 2 0.3 - 1 0.3 1 0.3 1 V 4.5 0.9 - 2.2 0.9 2.2 0.9 2.2 V 6 1.2 - 3 1.2 3 1.2 3 V 2 0.2 - 1 0.2 1 0.2 1 V 4.5 0.4 - 1.4 0.4 1.4 0.4 1.4 V 6 0.6 - 1.6 0.6 1.6 0.6 1.6 V -0.02 2 1.9 - - 1.9 - 1.9 - V -0.02 4.5 4.4 - - 4.4 - 4.4 - V -0.02 6 5.9 - - 5.9 - 5.9 - V -4 4.5 3.98 - - 3.84 - 3.7 - V -5.2 6 5.48 - - 5.34 - 5.2 - V 0.02 2 - - 0.1 - 0.1 - 0.1 V 0.02 4.5 - - 0.1 - 0.1 - 0.1 V 0.02 6 - - 0.1 - 0.1 - 0.1 V 4 4.5 - - 0.26 - 0.33 - 0.4 V 5.2 6 - - 0.26 - 0.33 - 0.4 V HC TYPES Input Switch Points (Note 2) V T- - - - VH High Level Output Voltage CMOS Loads VOH VT+ or V T- High Level Output Voltage TTL Loads Low Level Output Voltage CMOS Loads Low Level Output Voltage TTL Loads VOL VT+ or V T- 3 CD54HC132, CD74HC132, CD54HCT132, CD74HCT132 DC Electrical Specifications (Continued) TEST CONDITIONS PARAMETER Input Leakage Current Quiescent Device Current SYMBOL VI (V) II VCC or GND - ICC VCC or GND VT+ - 25oC IO (mA) VCC (V) -40oC TO 85oC -55oC TO 125oC MIN TYP MAX MIN MAX MIN MAX UNITS 6 - - ±0.1 - ±1 - ±1 µA 0 6 - - 2 - 20 - 40 µA - 4.5 1.2 - 1.9 1.2 1.9 1.2 1.9 V 5.5 1.4 - 2.1 1.4 2.1 1.4 2.1 V 4.5 0.5 - 1.2 0.5 1.2 0.5 1.2 V 5.5 0.6 - 1.4 0.6 1.4 0.6 1.4 V 4.5 0.4 - 1.4 0.4 1.4 0.4 1.4 V 5.5 0.4 - 1.5 0.4 1.5 0.4 1.5 V -0.02 4.5 4.4 - - 4.4 - 4.4 - V -4 4.5 3.98 - - 3.84 - 3.7 - V 0.02 4.5 - - 0.1 - 0.1 - 0.1 V 4 4.5 - - 0.26 - 0.33 - 0.4 V HCT TYPES Input Switch Points (Note 2) V T- VH High Level Output Voltage CMOS Loads - - - VT+ or V T- High Level Output Voltage TTL Loads Low Level Output Voltage CMOS Loads VOL VT+ or V T- Low Level Output Voltage TTL Loads Input Leakage Current Quiescent Device Current Additional Quiescent Device Current Per Input Pin: 1 Unit Load - - II VCC and GND - 5.5 - - ±0.1 - ±1 - ±1 µA ICC VCC or GND 0 5.5 - - 2 - 20 - 40 µA ∆ICC (Note 3) VCC - 2.1 - 4.5 to 5.5 - 100 360 - 450 - 490 µA NOTES: 2. Hysteresis definition, characteristic and test setup see Test Circuits and Waveforms 3. For dual-supply systems theoretical worst case (VI = 2.4V, VCC = 5.5V) specification is 1.8mA. 4 CD54HC132, CD74HC132, CD54HCT132, CD74HCT132 HCT Input Loading Table INPUT UNIT LOADS nA, nB 0.6 NOTE: Unit Load is ∆ICC limit specified in DC Electrical Specifications table, e.g. 360µA max at 25oC. Switching Specifications Input tr, tf = 6ns PARAMETER SYMBOL TEST CONDITIONS tPLH, tPHL CL = 50pF 25oC VCC -40oC TO 85oC -55oC TO 125oC (V) MIN TYP MAX MIN MAX MIN MAX UNITS 2 - - 125 - 156 - 188 ns 4.5 - - 25 - 31 - 38 ns 6 - - 21 - 27 - 32 ns HC TYPES Propagation Delay A, B to Y (Figure 1) Propagation Delay A, B to Y tTLH, tTHL CL = 15pF 5 - 10 - - - - - pF Transition Times (Figure 1) tTLH, tTHL CL = 50pF 2 - - 75 - 95 - 110 ns 4.5 - - 15 - 19 - 22 ns 6 - - 13 - 16 - 19 ns Input Capacitance Power Dissipation Capacitance (Notes 4, 5) CI - - - - 10 - 10 - 10 pF CPD - 5 - 30 - - - - - pF HCT TYPES Propagation Delay A, B to Y (Figure 2) tPHL, tPHL CL = 50pF 4.5 - - 33 - 41 - 50 ns Propagation Delay A, B to Y tPLH, tPHL CL = 15pF 5 - 13 - - - - - pF Transition Times (Figure 2) tTLH, tTHL CL = 50pF 4.5 - - 15 - 19 - 22 ns Input Capacitance Power Dissipation Capacitance (Notes 4, 5) CI - - - - 10 - 10 - 10 pF CPD - 5 - 30 - - - - - pF NOTES: 4. CPD is used to determine the dynamic power consumption, per gate. 5. PD = VCC2 fi (CPD + CL) where fi = input frequency, CL = output load capacitance, VCC = supply voltage. 5 CD54HC132, CD74HC132, CD54HCT132, CD74HCT132 Test Circuits and Waveforms tr = 6ns tf = 6ns 90% 50% 10% INPUT GND tTLH GND tTHL 90% 50% 10% INVERTING OUTPUT 3V 2.7V 1.3V 0.3V INPUT tTHL tPHL tf = 6ns tr = 6ns VCC tTLH 90% 1.3V 10% INVERTING OUTPUT tPHL tPLH FIGURE 1. HC AND HCU TRANSITION TIMES AND PROPAGATION DELAY TIMES, COMBINATION LOGIC tPLH FIGURE 2. HCT TRANSITION TIMES AND PROPAGATION DELAY TIMES, COMBINATION LOGIC VH VO + VH = V T - V T Vl VT + VT + VT VT VCC Vl VH GND VCC VCC VO GND Vl VO FIGURE 3. HYSTERESIS DEFINITION, CHARACTERISTIC, AND TEST SET-UP 6 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All products are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment. TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standard warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where mandated by government requirements, testing of all parameters of each product is not necessarily performed. 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Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is solely at the Buyer's risk, and that they are solely responsible for compliance with all legal and regulatory requirements in connection with such use. TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products are designated by TI as compliant with ISO/TS 16949 requirements. Buyers acknowledge and agree that, if they use any non-designated products in automotive applications, TI will not be responsible for any failure to meet such requirements. Following are URLs where you can obtain information on other Texas Instruments products and application solutions: Products Applications Amplifiers amplifier.ti.com Audio www.ti.com/audio Data Converters dataconverter.ti.com Automotive www.ti.com/automotive DSP dsp.ti.com Broadband www.ti.com/broadband Interface interface.ti.com Digital Control www.ti.com/digitalcontrol Logic logic.ti.com Military www.ti.com/military Power Mgmt power.ti.com Optical Networking www.ti.com/opticalnetwork Microcontrollers microcontroller.ti.com Security www.ti.com/security Low Power Wireless www.ti.com/lpw Telephony www.ti.com/telephony Video & Imaging www.ti.com/video Wireless www.ti.com/wireless Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265 Copyright © 2007, Texas Instruments Incorporated PACKAGE OPTION ADDENDUM www.ti.com 23-Apr-2007 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Eco Plan (2) Qty 5962-8984501CA ACTIVE CDIP J 14 1 TBD A42 SNPB N / A for Pkg Type CD54HC132F3A ACTIVE CDIP J 14 1 TBD A42 SNPB N / A for Pkg Type Lead/Ball Finish MSL Peak Temp (3) CD54HCT132F ACTIVE CDIP J 14 1 TBD A42 SNPB N / A for Pkg Type CD54HCT132F3A ACTIVE CDIP J 14 1 TBD A42 SNPB N / A for Pkg Type CD74HC132E ACTIVE PDIP N 14 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type CD74HC132EE4 ACTIVE PDIP N 14 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type CD74HC132M ACTIVE SOIC D 14 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD74HC132M96 ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD74HC132M96E4 ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD74HC132M96G4 ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD74HC132ME4 ACTIVE SOIC D 14 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD74HC132MG4 ACTIVE SOIC D 14 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD74HC132MT ACTIVE SOIC D 14 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD74HC132MTE4 ACTIVE SOIC D 14 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD74HC132MTG4 ACTIVE SOIC D 14 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD74HCT132E ACTIVE PDIP N 14 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type CD74HCT132EE4 ACTIVE PDIP N 14 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type CD74HCT132M ACTIVE SOIC D 14 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD74HCT132M96 ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD74HCT132M96E4 ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD74HCT132M96G4 ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD74HCT132ME4 ACTIVE SOIC D 14 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD74HCT132MG4 ACTIVE SOIC D 14 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD74HCT132MT ACTIVE SOIC D 14 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD74HCT132MTE4 ACTIVE SOIC D 14 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD74HCT132MTG4 ACTIVE SOIC D 14 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Addendum-Page 1 PACKAGE OPTION ADDENDUM www.ti.com 23-Apr-2007 (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 2 PACKAGE MATERIALS INFORMATION www.ti.com 19-May-2007 TAPE AND REEL INFORMATION Pack Materials-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com Device 19-May-2007 Package Pins Site Reel Diameter (mm) Reel Width (mm) A0 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant CD74HC132M96 D 14 MLA 330 16 6.5 9.0 2.1 8 16 Q1 CD74HCT132M96 D 14 MLA 330 16 6.5 9.0 2.1 8 16 Q1 TAPE AND REEL BOX INFORMATION Device Package Pins Site Length (mm) Width (mm) Height (mm) CD74HC132M96 D 14 MLA 342.9 336.6 28.58 CD74HCT132M96 D 14 MLA 342.9 336.6 28.58 Pack Materials-Page 2 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All products are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment. TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standard warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where mandated by government requirements, testing of all parameters of each product is not necessarily performed. TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and applications using TI components. To minimize the risks associated with customer products and applications, customers should provide adequate design and operating safeguards. TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask work right, or other TI intellectual property right relating to any combination, machine, or process in which TI products or services are used. Information published by TI regarding third-party products or services does not constitute a license from TI to use such products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI. Reproduction of information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an unfair and deceptive business practice. TI is not responsible or liable for such altered documentation. Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice. TI is not responsible or liable for any such statements. TI products are not authorized for use in safety-critical applications (such as life support) where a failure of the TI product would reasonably be expected to cause severe personal injury or death, unless officers of the parties have executed an agreement specifically governing such use. Buyers represent that they have all necessary expertise in the safety and regulatory ramifications of their applications, and acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any use of TI products in such safety-critical applications, notwithstanding any applications-related information or support that may be provided by TI. Further, Buyers must fully indemnify TI and its representatives against any damages arising out of the use of TI products in such safety-critical applications. TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products are specifically designated by TI as military-grade or "enhanced plastic." Only products designated by TI as military-grade meet military specifications. Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is solely at the Buyer's risk, and that they are solely responsible for compliance with all legal and regulatory requirements in connection with such use. TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products are designated by TI as compliant with ISO/TS 16949 requirements. Buyers acknowledge and agree that, if they use any non-designated products in automotive applications, TI will not be responsible for any failure to meet such requirements. Following are URLs where you can obtain information on other Texas Instruments products and application solutions: Products Applications Amplifiers amplifier.ti.com Audio www.ti.com/audio Data Converters dataconverter.ti.com Automotive www.ti.com/automotive DSP dsp.ti.com Broadband www.ti.com/broadband Interface interface.ti.com Digital Control www.ti.com/digitalcontrol Logic logic.ti.com Military www.ti.com/military Power Mgmt power.ti.com Optical Networking www.ti.com/opticalnetwork Microcontrollers microcontroller.ti.com Security www.ti.com/security RFID www.ti-rfid.com Telephony www.ti.com/telephony Low Power Wireless www.ti.com/lpw Video & Imaging www.ti.com/video Wireless www.ti.com/wireless Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265 Copyright © 2007, Texas Instruments Incorporated