TI CD74ACT109E

CD54ACT109, CD74ACT109
DUAL J-K POSITIVE-EDGE-TRIGGERED FLIP-FLOPS
WITH CLEAR AND PRESET
SCHS327 – JANUARY 2003
D
D
D
D
D
D
CD54ACT109 . . . F PACKAGE
CD74ACT109 . . . E OR M PACKAGE
(TOP VIEW)
Inputs Are TTL-Voltage Compatible
Speed of Bipolar F, AS, and S, With
Significantly Reduced Power Consumption
Balanced Propagation Delays
±24-mA Output Drive Current
– Fanout to 15 F Devices
SCR-Latchup-Resistant CMOS Process and
Circuit Design
Exceeds 2-kV ESD Protection Per
MIL-STD-883, Method 3015
1CLR
1J
1K
1CLK
1PRE
1Q
1Q
GND
1
16
2
15
3
14
4
13
5
12
6
11
7
10
8
9
VCC
2CLR
2J
2K
2CLK
2PRE
2Q
2Q
description/ordering information
The ’ACT109 devices contain two independent J-K positive-edge-triggered flip-flops. A low level at the preset
(PRE) or clear (CLR) inputs sets or resets the outputs, regardless of the levels of the other inputs. When PRE
and CLR are inactive (high), data at the J and K inputs meeting the setup-time requirements are transferred to
the outputs on the positive-going edge of the clock (CLK) pulse. Clock triggering occurs at a voltage level and
is not directly related to the rise time of the clock pulse. Following the hold-time interval, data at the J and K inputs
can be changed without affecting the levels at the outputs. These versatile flip-flops can perform as toggle
flip-flops by grounding K and tying J high. They also can perform as D-type flip-flops if J and K are tied together.
ORDERING INFORMATION
PDIP – E
–55°C
55°C to 125°C
ORDERABLE
PART NUMBER
PACKAGE†
TA
SOIC – M
Tube
CD74ACT109E
Tube
CD74ACT109M
Tape and reel
CD74ACT109M96
TOP-SIDE
MARKING
CD74ACT109E
ACT109M
CDIP – F
Tube
CD54ACT109F3A
CD54ACT109F3A
† Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines
are available at www.ti.com/sc/package.
FUNCTION TABLE
(each flip-flop)
INPUTS
OUTPUTS
PRE
CLR
CLK
J
K
Q
L
H
X
X
X
H
Q
L
H
L
X
X
X
H
H†
H
L
L
X
X
X
L
H†
H
H
↑
L
L
L
H
H
↑
H
L
H
H
↑
L
H
Q0
Q0
H
H
↑
H
H
H
L
Toggle
H
H
L
X
X
Q0
Q0
‡ Unpredictable and unstable condition if both PRE and CLR
go high simultaneously after both being low at the same
time
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
Copyright  2003, Texas Instruments Incorporated
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.
On products compliant to MIL-PRF-38535, all parameters are tested
unless otherwise noted. On all other products, production
processing does not necessarily include testing of all parameters.
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
1
CD54ACT109, CD74ACT109
DUAL J-K POSITIVE-EDGE-TRIGGERED FLIP-FLOPS
WITH CLEAR AND PRESET
SCHS327 – JANUARY 2003
logic diagram, each flip-flop (positive logic)
PRE
C
J
C
Q
TG
TG
K
C
C
CLK
C
C
TG
TG
C
C
C
C
Q
CLR
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)†
Supply voltage range, VCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.5 V to 6 V
Input clamp current, IIK (VI < 0 V or VI > VCC) (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±20 mA
Output clamp current, IOK (VO < 0 V or VO > VCC) (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±50 mA
Continuous output current, IO (VO > 0 V or VO < VCC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±50 mA
Continuous current through VCC or GND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±100 mA
Package thermal impedance, θJA (see Note 2): E package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 67°C/W
M package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 73°C/W
Storage temperature range, Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –65°C to 150°C
† Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTES: 1. The input and output voltage ratings may be exceeded if the input and output current ratings are observed.
2. The package thermal impedance is calculated in accordance with JESD 51-7.
recommended operating conditions (see Note 3)
TA = 25°C
–40°C to
85°C
UNIT
MIN
MAX
MIN
MAX
MIN
MAX
4.5
5.5
4.5
5.5
4.5
5.5
VCC
VIH
Supply voltage
VIL
VI
Low-level input voltage
Input voltage
0
VO
IOH
Output voltage
0
High-level output current
–24
IOL
∆t/∆v
Low-level output current
Input transition rise or fall rate
High-level input voltage
–55°C to
125°C
2
2
0.8
2
V
0.8
V
VCC
VCC
V
–24
–24
mA
24
24
24
mA
10
10
10
ns/V
VCC
VCC
0.8
V
0
0
VCC
VCC
0
0
V
NOTE 3: All unused inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report,
Implications of Slow or Floating CMOS Inputs, literature number SCBA004.
2
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
CD54ACT109, CD74ACT109
DUAL J-K POSITIVE-EDGE-TRIGGERED FLIP-FLOPS
WITH CLEAR AND PRESET
SCHS327 – JANUARY 2003
electrical characteristics over recommended operating free-air temperature range (unless
otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
VOH
VOL
II
ICC
DICC‡
VI = VIH or VIL
VI = VIH or VIL
VI = VCC or GND
VI = VCC or GND,
–55°C to
125°C
TA = 25°C
VCC
MAX
MIN
–40°C to
85°C
MAX
MIN
UNIT
MAX
IOH = –50 µA
IOH = –24 mA
4.5 V
4.4
4.5 V
3.94
IOH = –50 mA†
IOH = –75 mA†
5.5 V
IOL = 50 µA
IOL = 24 mA
IOL = 50 mA†
4.5 V
0.1
0.1
0.1
4.5 V
0.36
0.5
0.44
IOL = 75 mA†
5.5 V
4.4
3.7
3.8
V
3.85
5.5 V
3.85
5.5 V
IO = 0
1.65
V
1.65
5.5 V
±0.1
±1
±1
µA
5.5 V
4
80
40
µA
2.4
3
2.8
mA
4.5 V to
5.5 V
VI = VCC – 2.1 V
4.4
Ci
10
10
10
pF
† Test one output at a time, not exceeding 1-second duration. Measurement is made by forcing indicated current and measuring voltage to minimize
power dissipation. Test verifies a minimum 50-Ω transmission-line drive capability at 85°C and 75-Ω transmission-line drive capability at 125°C.
‡ Additional quiescent supply current per input pin, TTL inputs high, 1 unit load
ACT INPUT LOAD TABLE
INPUT
UNIT LOAD
J or CLK
1
K
0.53
CLR or PRE
0.58
Unit Load is ∆ICC limit specified in
electrical characteristics table
(e.g., 2.4 mA at 25°C).
timing requirements over recommended operating conditions (unless otherwise noted)
–55°C to
125°C
MIN
fclock
Clock frequency
MAX
–40°C to
85°C
MIN
100
114
CLK high or low
5
4.4
CLR or PRE low
5.5
4.8
UNIT
MAX
MHz
tw
Pulse duration
tsu
th
Setup time, before CLK↑
J or K
5.5
4.8
ns
Hold time, after CLK↑
J or K
0
0
ns
trec
Recovery time, before CLK↑
CLR↑ or PRE↑
2.5
2.2
ns
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
ns
3
CD54ACT109, CD74ACT109
DUAL J-K POSITIVE-EDGE-TRIGGERED FLIP-FLOPS
WITH CLEAR AND PRESET
SCHS327 – JANUARY 2003
switching characteristics over recommended operating free-air temperature range,
VCC = 5 V ± 0.5 V, CL = 50 pF (unless otherwise noted) (see Figure 1)
PARAMETER
FROM
(INPUT)
TO
(OUTPUT)
fmax
tPLH
tPHL
–55°C to
125°C
MIN
MAX
100
CLK
Q or Q
CLR or PRE
CLK
Q or Q
CLR or PRE
–40°C to
85°C
MIN
UNIT
MAX
114
MHz
2.6
10.3
2.7
9.4
3.1
12.2
3.2
11.1
2.6
10.3
2.7
9.4
3.1
12.2
3.2
11.1
ns
ns
operating characteristics, VCC = 5 V, TA = 25°C
PARAMETER
Cpd
4
Power dissipation capacitance
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
TYP
UNIT
56
pF
CD54ACT109, CD74ACT109
DUAL J-K POSITIVE-EDGE-TRIGGERED FLIP-FLOPS
WITH CLEAR AND PRESET
SCHS327 – JANUARY 2003
PARAMETER MEASUREMENT INFORMATION
S1
R1 = 500 Ω
From Output
Under Test
2 × VCC
Open
GND
CL = 50 pF
(see Note A)
R2 = 500 Ω
TEST
S1
tPLH/tPHL
tPLZ/tPZL
tPHZ/tPZH
Open
2 × VCC
GND
tw
3V
1.5 V
Input
LOAD CIRCUIT
1.5 V
0V
VOLTAGE WAVEFORMS
PULSE DURATION
CLR
Input
3V
Reference
Input
3V
1.5 V
1.5 V
0V
0V
trec
Data
Input
3V
1.5 V
CLK
th
tsu
1.5 V
10%
90%
90%
tr
0V
VOLTAGE WAVEFORMS
RECOVERY TIME
3V
1.5 V
10% 0 V
tf
VOLTAGE WAVEFORMS
SETUP AND HOLD AND INPUT RISE AND FALL TIMES
3V
Input
1.5 V
1.5 V
0V
tPLH
In-Phase
Output
50%
10%
90%
90%
tr
90%
1.5 V
1.5 V
0V
tPHL
tPHL
Out-of-Phase
Output
3V
Output
Control
VOH
50% VCC
10%
VOL
tf
tPLH
50% VCC
10%
tf
50%
10%
90%
VOH
VOL
tr
VOLTAGE WAVEFORMS
PROPAGATION DELAY AND OUTPUT TRANSITION TIMES
Output
Waveform 1
S1 at 2 × VCC
(see Note B)
tPLZ
tPZL
20% VCC
tPHZ
tPZH
Output
Waveform 2
S1 at GND
(see Note B)
≈VCC
20% VCC
VOL
80% VCC
VOH
80% VCC
≈0 V
VOLTAGE WAVEFORMS
OUTPUT ENABLE AND DISABLE TIMES
NOTES: A. CL includes probe and test-fixture capacitance.
B. Waveform 1 is for an output with internal conditions such that the output is low except when disabled by the output control.
Waveform 2 is for an output with internal conditions such that the output is high except when disabled by the output control.
C. All input pulses are supplied by generators having the following characteristics: PRR ≤ 1 MHz, ZO = 50 Ω, tr = 3 ns, tf = 3 ns.
Phase relationships between waveforms are arbitrary.
D. For clock inputs, fmax is measured with the input duty cycle at 50%.
E. The outputs are measured one at a time with one input transition per measurement.
F. tPLH and tPHL are the same as tpd.
G. tPZL and tPZH are the same as ten.
H. tPLZ and tPHZ are the same as tdis.
I. All parameters and waveforms are not applicable to all devices.
Figure 1. Load Circuit and Voltage Waveforms
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
5
PACKAGE OPTION ADDENDUM
www.ti.com
12-Jan-2006
PACKAGING INFORMATION
Orderable Device
Status (1)
Package
Type
CD54ACT109F3A
ACTIVE
CDIP
J
16
1
TBD
Call TI
N / A for Pkg Type
CD74ACT109E
ACTIVE
PDIP
N
16
25
Pb-Free
(RoHS)
CU NIPDAU
N / A for Pkg Type
CD74ACT109EE4
ACTIVE
PDIP
N
16
25
Pb-Free
(RoHS)
CU NIPDAU
N / A for Pkg Type
CD74ACT109M
ACTIVE
SOIC
D
16
40
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CD74ACT109M96
ACTIVE
SOIC
D
16
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CD74ACT109M96E4
ACTIVE
SOIC
D
16
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CD74ACT109ME4
ACTIVE
SOIC
D
16
CU NIPDAU
Level-1-260C-UNLIM
Package
Drawing
Pins Package Eco Plan (2)
Qty
40
Green (RoHS &
no Sb/Br)
Lead/Ball Finish
MSL Peak Temp (3)
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
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incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 1
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