TI SN74AUC2G79DCUR

SN74AUC2G79
DUAL POSITIVE-EDGE-TRIGGERED D-TYPE FLIP-FLOP
www.ti.com
SCES536A – DECEMBER 2003 – REVISED MARCH 2005
FEATURES
•
•
•
•
•
•
•
•
•
DCT OR DCU PACKAGE
(TOP VIEW)
Available in the Texas Instruments
NanoStar™ and NanoFree™ Packages
Optimized for 1.8-V Operation and Is 3.6-V I/O
Tolerant to Support Mixed-Mode Signal
Operation
Ioff Supports Partial-Power-Down Mode
Operation
Sub-1-V Operable
Max tpd of 1.9 ns at 1.8 V
Low Power Consumption, 10-µA Max ICC
±8-mA Output Drive at 1.8 V
Latch-Up Performance Exceeds 100 mA Per
JESD 78, Class II
ESD Performance Tested Per JESD 22
– 2000-V Human-Body Model
(A114-B, Class II)
– 200-V Machine Model (A115-A)
– 1000-V Charged-Device Model (C101)
1CLK
1D
2Q
GND
1
8
2
7
3
6
4
5
VCC
1Q
2D
2CLK
YEP OR YZP PACKAGE
(BOTTOM VIEW)
GND
2Q
1D
1CLK
4 5
3 6
2 7
1 8
2CLK
2D
1Q
VCC
DESCRIPTION/ORDERING INFORMATION
This single positive-edge-triggered D-type flip-flop is operational at 0.8-V to 2.7-V VCC, but is designed
specifically for 1.65-V to 1.95-V VCC operation.
When data at the data (D) input meets the setup time requirement, the data is transferred to the Q output on the
positive-going edge of the clock pulse. Clock triggering occurs at a voltage level and is not directly related to the
rise time of the clock pulse. Following the hold-time interval, data at the D input can be changed without affecting
the levels at the outputs.
NanoStar™ and NanoFree™ package technology is a major breakthrough in IC packaging concepts, using the
die as the package.
This device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs,
preventing damaging current backflow through the device when it is powered down.
ORDERING INFORMATION
PACKAGE (1)
TA
–40°C to 85°C
(1)
(2)
ORDERABLE PART NUMBER
TOP-SIDE MARKING (2)
NanoStar™ – WCSP (DSBGA)
0.23-mm Large Bump – YEP
Tape and reel
SN74AUC2G79YEPR
NanoFree™ – WCSP (DSBGA)
0.23-mm Large Bump – YZP (Pb-free)
Tape and reel
SN74AUC2G79YZPR
SSOP – DCT
Tape and reel
SN74AUC2G79DCTR
U79_ _ _
VSSOP – DCU
Tape and reel
SN74AUC2G79DCUR
U79_
_ _ _UR_
Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at
www.ti.com/sc/package.
DCT: The actual top-side marking has three additional characters that designate the year, month, and assembly/test site.
DCU: The actual top-side marking has one additional character that designates the assembly/test site.
YEP/YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one following
character to designate the assembly/test site. Pin 1 identifier indicates solder-bump composition (1 = SnPb, ⋅ = Pb-free).
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
NanoStar, NanoFree are trademarks of Texas Instruments.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2003–2005, Texas Instruments Incorporated
SN74AUC2G79
DUAL POSITIVE-EDGE-TRIGGERED D-TYPE FLIP-FLOP
www.ti.com
SCES536A – DECEMBER 2003 – REVISED MARCH 2005
FUNCTION TABLE
INPUTS
CLK
D
OUTPUT
Q
↑
H
H
↑
L
L
L
X
Q0
LOGIC DIAGRAM, EACH FLIP-FLOP (POSITIVE LOGIC)
CLK
C
C
C
TG
C
Q
C
C
C
D
TG
TG
TG
C
C
C
Absolute Maximum Ratings (1)
over operating free-air temperature range (unless otherwise noted)
MIN
MAX
UNIT
VCC
Supply voltage range
–0.5
3.6
V
VI
Input voltage range (2)
–0.5
3.6
V
VO
Voltage range applied to any output in the high-impedance or power-off state (2)
–0.5
3.6
V
–0.5
VCC + 0.5
range (2)
VO
Output voltage
IIK
Input clamp current
VI < 0
–50
mA
IOK
Output clamp current
VO < 0
–50
mA
IO
Continuous output current
±20
mA
±100
mA
Continuous current through VCC or GND
θJA
Package thermal impedance (3)
Tstg
Storage temperature range
DCT package
220
DCU package
227
YEP/YZP package
(1)
(2)
(3)
2
V
°C/W
102
–65
150
°C
Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating
conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
The input negative-voltage and output voltage ratings may be exceeded if the input and output current ratings are observed.
The package thermal impedance is calculated in accordance with JESD 51-7.
SN74AUC2G79
DUAL POSITIVE-EDGE-TRIGGERED D-TYPE FLIP-FLOP
www.ti.com
Recommended Operating Conditions
VCC
SCES536A – DECEMBER 2003 – REVISED MARCH 2005
(1)
Supply voltage
VCC = 0.8 V
VIH
High-level input voltage
VCC = 1.1 V to 1.95 V
VCC = 2.3 V to 2.7 V
MIN
MAX
0.8
2.7
UNIT
V
VCC
0.65 × VCC
V
1.7
VCC = 0.8 V
0
0.35 × VCC
VIL
Low-level input voltage
VCC = 1.1 V to 1.95 V
VI
Input voltage
0
3.6
V
VO
Output voltage
0
VCC
V
VCC = 2.3 V to 2.7 V
IOH
High-level output current
IOL
Low-level output current
0.7
VCC = 0.8 V
–0.7
VCC = 1.1 V
–3
VCC = 1.4 V
–5
VCC = 1.65 V
–8
VCC = 2.3 V
–9
VCC = 0.8 V
0.7
VCC = 1.1 V
3
VCC = 1.4 V
5
VCC = 1.65 V
8
VCC = 2.3 V
∆t/∆v
TA
(1)
(2)
(3)
Input transition rise or fall rate
Operating free-air temperature
V
mA
mA
9
VCC = 0.8 V to 1.65 V (2)
20
VCC = 1.65 V to 2.3 V (3)
20
VCC = 2.3 V to 2.7 V (3)
20
–40
85
ns/V
°C
All unused inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report,
Implications of Slow or Floating CMOS Inputs, literature number SCBA004.
The data was taken at CL = 15 pF, RL = 2 kΩ (see Figure 1).
The data was taken at CL = 30 pF, RL = 500 Ω (see Figure 1).
3
SN74AUC2G79
DUAL POSITIVE-EDGE-TRIGGERED D-TYPE FLIP-FLOP
www.ti.com
SCES536A – DECEMBER 2003 – REVISED MARCH 2005
Electrical Characteristics
over recommended operating free-air temperature range (unless otherwise noted)
PARAMETER
TEST CONDITIONS
VOH
VOL
MIN TYP (1)
VCC
MAX
IOH = –100 µA
0.8 V to 2.7 V
IOH = –0.7 mA
0.8 V
IOH = –3 mA
1.1 V
0.8
IOH = –5 mA
1.4 V
1
IOH = –8 mA
1.65 V
1.2
IOH = –9 mA
2.3 V
1.8
IOL = 100 µA
0.8 V to 2.7 V
IOL = 0.7 mA
0.8 V
IOL = 3 mA
1.1 V
0.3
IOL = 5 mA
1.4 V
0.4
IOL = 8 mA
1.65 V
0.45
IOL = 9 mA
2.3 V
0.6
UNIT
VCC – 0.1
0.55
V
0.2
0.25
V
VI = VCC or GND
0 to 2.7 V
±5
µA
Ioff
VI or VO = 2.7 V
0
±10
µA
ICC
VI = VCC or GND,
0.8 V to 2.7 V
10
µA
Ci
VI = VCC or GND
II
(1)
D or CLK inputs
IO = 0
2.5 V
2.5
pF
All typical values are at TA = 25°C.
Timing Requirements
over recommended operating free-air temperature range (unless otherwise noted) (see Figure 1)
VCC = 1.2 V
± 0.1 V
VCC = 0.8 V
TYP
MIN
MAX
VCC = 1.5 V
± 0.1 V
MIN
200
MAX
VCC = 1.8 V
± 0.15 V
MIN
MAX
MIN
250
UNIT
MAX
fclock
Clock frequency
50
tw
Pulse duration, CLK high or low
2.4
1
1
1
1
ns
tsu
Setup time before CLK↑
1.6
0.9
0.6
0.6
0.5
ns
th
Hold time, data after CLK↑
0
0
0.1
0.1
ns
0
225
VCC = 2.5 V
± 0.2 V
275
MHz
Switching Characteristics
over recommended operating free-air temperature range, CL = 15 pF (unless otherwise noted) (see Figure 1)
PARAMETER
FROM
(INPUT)
TO
(OUTPUT)
VCC = 0.8 V
fmax
tpd
CLK
Q
VCC = 1.2 V
± 0.1 V
TYP
MIN
50
200
5
1
MAX
VCC = 1.5 V
± 0.1 V
MIN
MAX
225
3.9
0.8
VCC = 1.8 V
± 0.15 V
MIN
TYP
VCC = 2.5 V
± 0.2 V
MAX
250
2.5
0.3
MIN
275
1
1.9
0.3
UNIT
MAX
MHz
1.3
ns
Switching Characteristics
over recommended operating free-air temperature range, CL = 30 pF (unless otherwise noted) (see Figure 1)
PARAMETER
FROM
(INPUT)
TO
(OUTPUT)
CLK
Q
fmax
tpd
4
VCC = 1.8 V
± 0.15 V
MIN
VCC = 2.5 V
± 0.2 V
TYP MAX
250
0.8
275
1.5
2.4
UNIT
MIN MAX
0.6
ns
1.8
ns
SN74AUC2G79
DUAL POSITIVE-EDGE-TRIGGERED D-TYPE FLIP-FLOP
www.ti.com
SCES536A – DECEMBER 2003 – REVISED MARCH 2005
Operating Characteristics
TA = 25°C
TEST
CONDITIONS
PARAMETER
Data
Cpd
Power dissipation
capacitance
CLK
Total
f = 10 MHz
VCC = 0.8 V
VCC = 1.2 V
VCC = 1.5 V
VCC = 1.8 V
VCC = 2.5 V
TYP
TYP
TYP
TYP
TYP
16
16.2
18
19.8
29.2
1.1
1.1
1.2
1.5
2.7
17.1
17.3
19.2
21.3
31.9
UNIT
pF
5
SN74AUC2G79
DUAL POSITIVE-EDGE-TRIGGERED D-TYPE FLIP-FLOP
www.ti.com
SCES536A – DECEMBER 2003 – REVISED MARCH 2005
PARAMETER MEASUREMENT INFORMATION
2 × VCC
S1
RL
From Output
Under Test
Open
GND
CL
(see Note A)
TEST
S1
tPLH/tPHL
tPLZ/tPZL
tPHZ/tPZH
Open
2 × VCC
GND
RL
LOAD CIRCUIT
VCC
CL
RL
V∆
0.8 V
1.2 V ± 0.1 V
1.5 V ± 0.1 V
1.8 V ± 0.15 V
2.5 V ± 0.2 V
1.8 V ± 0.15 V
2.5 V ± 0.2 V
15 pF
15 pF
15 pF
15 pF
15 pF
30 pF
30 pF
2 kΩ
2 kΩ
2 kΩ
2 kΩ
2 kΩ
1 kΩ
500 Ω
0.1 V
0.1 V
0.1 V
0.15 V
0.15 V
0.15 V
0.15 V
VCC
Timing Input
VCC/2
0V
tw
tsu
th
VCC
VCC/2
Input
VCC/2
VCC
VCC/2
VCC/2
Data Input
0V
0V
VOLTAGE WAVEFORMS
SETUP AND HOLD TIMES
VOLTAGE WAVEFORMS
PULSE DURATION
VCC
VCC/2
Input
VCC/2
0V
tPHL
tPLH
VOH
VCC/2
Output
VCC/2
VOL
tPHL
VCC/2
VOL
VOLTAGE WAVEFORMS
PROPAGATION DELAY TIMES
INVERTING AND NONINVERTING OUTPUTS
VCC/2
VCC/2
0V
tPZL
tPLZ
VCC
VCC/2
tPZH
VOH
Output
Output
Waveform 1
S1 at 2 × VCC
(see Note B)
tPLH
VCC/2
VCC
Output
Control
Output
Waveform 2
S1 at GND
(see Note B)
VOL + V∆
VOL
tPHZ
VCC/2
VOH - V∆
VOH
≈0 V
VOLTAGE WAVEFORMS
ENABLE AND DISABLE TIMES
LOW- AND HIGH-LEVEL ENABLING
NOTES: A. CL includes probe and jig capacitance.
B. Waveform 1 is for an output with internal conditions such that the output is low, except when disabled by the output control.
Waveform 2 is for an output with internal conditions such that the output is high, except when disabled by the output control.
C. All input pulses are supplied by generators having the following characteristics: PRR ≤ 10 MHz, ZO = 50 Ω, slew rate ≥ 1 V/ns.
D. The outputs are measured one at a time, with one transition per measurement.
E. tPLZ and tPHZ are the same as tdis.
F. tPZL and tPZH are the same as ten.
G. tPLH and tPHL are the same as tpd.
H. All parameters and waveforms are not applicable to all devices.
Figure 1. Load Circuit and Voltage Waveforms
6
PACKAGE OPTION ADDENDUM
www.ti.com
17-Mar-2006
PACKAGING INFORMATION
Orderable Device
Status (1)
Package
Type
Package
Drawing
Pins Package Eco Plan (2)
Qty
SN74AUC2G79DCTR
ACTIVE
SM8
DCT
8
3000
Pb-Free
(RoHS)
CU NIPDAU
Level-1-260C-UNLIM
SN74AUC2G79DCTRE4
ACTIVE
SM8
DCT
8
3000
Pb-Free
(RoHS)
CU NIPDAU
Level-1-260C-UNLIM
SN74AUC2G79DCUR
ACTIVE
US8
DCU
8
3000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74AUC2G79DCURE4
ACTIVE
US8
DCU
8
3000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74AUC2G79YEPR
NRND
WCSP
YEP
8
3000
TBD
SNPB
Level-1-260C-UNLIM
SN74AUC2G79YZPR
ACTIVE
WCSP
YZP
8
3000
Pb-Free
(RoHS)
SNAGCU
Level-1-260C-UNLIM
Lead/Ball Finish
MSL Peak Temp (3)
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 1
MECHANICAL DATA
MPDS049B – MAY 1999 – REVISED OCTOBER 2002
DCT (R-PDSO-G8)
PLASTIC SMALL-OUTLINE PACKAGE
0,30
0,15
0,65
8
0,13 M
5
0,15 NOM
ÇÇÇÇÇ
ÇÇÇÇÇ
ÇÇÇÇÇ
ÇÇÇÇÇ
2,90
2,70
4,25
3,75
Gage Plane
PIN 1
INDEX AREA
1
0,25
4
0° – 8°
3,15
2,75
0,60
0,20
1,30 MAX
Seating Plane
0,10
0,10
0,00
NOTES: A.
B.
C.
D.
4188781/C 09/02
All linear dimensions are in millimeters.
This drawing is subject to change without notice.
Body dimensions do not include mold flash or protrusion
Falls within JEDEC MO-187 variation DA.
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications,
enhancements, improvements, and other changes to its products and services at any time and to discontinue
any product or service without notice. Customers should obtain the latest relevant information before placing
orders and should verify that such information is current and complete. All products are sold subject to TI’s terms
and conditions of sale supplied at the time of order acknowledgment.
TI warrants performance of its hardware products to the specifications applicable at the time of sale in
accordance with TI’s standard warranty. Testing and other quality control techniques are used to the extent TI
deems necessary to support this warranty. Except where mandated by government requirements, testing of all
parameters of each product is not necessarily performed.
TI assumes no liability for applications assistance or customer product design. Customers are responsible for
their products and applications using TI components. To minimize the risks associated with customer products
and applications, customers should provide adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right,
copyright, mask work right, or other TI intellectual property right relating to any combination, machine, or process
in which TI products or services are used. Information published by TI regarding third-party products or services
does not constitute a license from TI to use such products or services or a warranty or endorsement thereof.
Use of such information may require a license from a third party under the patents or other intellectual property
of the third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of information in TI data books or data sheets is permissible only if reproduction is without
alteration and is accompanied by all associated warranties, conditions, limitations, and notices. Reproduction
of this information with alteration is an unfair and deceptive business practice. TI is not responsible or liable for
such altered documentation.
Resale of TI products or services with statements different from or beyond the parameters stated by TI for that
product or service voids all express and any implied warranties for the associated TI product or service and
is an unfair and deceptive business practice. TI is not responsible or liable for any such statements.
Following are URLs where you can obtain information on other Texas Instruments products and application
solutions:
Products
Applications
Amplifiers
amplifier.ti.com
Audio
www.ti.com/audio
Data Converters
dataconverter.ti.com
Automotive
www.ti.com/automotive
DSP
dsp.ti.com
Broadband
www.ti.com/broadband
Interface
interface.ti.com
Digital Control
www.ti.com/digitalcontrol
Logic
logic.ti.com
Military
www.ti.com/military
Power Mgmt
power.ti.com
Optical Networking
www.ti.com/opticalnetwork
Microcontrollers
microcontroller.ti.com
Security
www.ti.com/security
Mailing Address:
Telephony
www.ti.com/telephony
Video & Imaging
www.ti.com/video
Wireless
www.ti.com/wireless
Texas Instruments
Post Office Box 655303 Dallas, Texas 75265
Copyright  2006, Texas Instruments Incorporated