TI SN74AUP1G79DCKR

SCES592A − JULY 2004 − REVISED SEPTEMBER 2005
D Available in the Texas Instruments
D
D
D
D
D
D
NanoStar and NanoFree Packages
Low Static-Power Consumption;
ICC = 0.9 µA Max
Low Dynamic-Power Consumption;
Cpd = 3 pF Typ at 3.3 V
Low Input Capacitance; Ci = 1.5 pF Typ
Low Noise − Overshoot and Undershoot
<10% of VCC
Ioff Supports Partial-Power-Down Mode
Operation
Input Hysteresis Allows Slow Input
Transition and Better Switching Noise
Immunity at the Input
(Vhys = 250 mV Typ at 3.3 V)
D Wide Operating VCC Range of 0.8 V to 3.6 V
D Optimized for 3.3-V Operation
D 3.6-V I/O Tolerant to Support Mixed-Mode
D
D
D
D
D
Signal Operation
tpd = 3.6 ns Max at 3.3 V
Suitable for Point-to-Point Applications
Latch-Up Performance Exceeds 100 mA Per
JESD 78, Class II
ESD Performance Tested Per JESD 22
− 2000-V Human-Body Model
(A114-B, Class II)
− 200-V Machine Model (A115-A)
− 1000-V Charged-Device Model (C101)
ESD Protection Exceeds ±5000 V With
Human-Body Model
DBV OR DCK PACKAGE
(TOP VIEW)
D
CLK
GND
1
5
YEP OR YZP PACKAGE
(BOTTOM VIEW)
GND
CLK
D
VCC
2
3
4
Q
Q
3 4
2
VCC
1 5
description /ordering information
The AUP family is TI’s premier solution to the industry’s low power needs in battery-powered portable
applications. This family ensures a very low static and dynamic power consumption across the entire VCC range
of 0.8 V to 3.6 V, resulting in an increased battery life. This product also maintains excellent signal integrity (see
Figures 1 and 2).
Static-Power Consumption
(µA)
Dynamic-Power Consumption
(pF)
100%
100%
80%
80%
40%
3
60%
3.3-V
Logic†
40%
3.3-V
LVC
Logic†
AUP
0%
2.5
Input
2
Output
1.5
1
0.5
20%
20%
0%
3.5
Voltage − V
60%
Switching Characteristics
at 25 MHz†
AUP
† Single, dual, and triple gates
0
−0.5
0
5
10
15
20 25 30
Time − ns
35
40
45
† AUP1G08 data at CL = 15 pF
Figure 1. AUP − The Lowest-Power Family
Figure 2. Excellent Signal Integrity
This is a single positive-edge-triggered D-type flip-flop. When data at the data (D) input meets the setup time
requirement, the data is transferred to the Q output on the positive-going edge of the clock pulse. Clock
triggering occurs at a voltage level and is not directly related to the rise time of the clock pulse. Following the
hold-time interval, data at the D input can be changed without affecting the levels at the outputs.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
NanoStar and NanoFree are trademarks of Texas Instruments.
Copyright  2005, Texas Instruments Incorporated
! "#$ ! %#&'" ($)
(#"! " !%$""! %$ *$ $! $+! !#$!
!(( ,-) (#" %"$!!. ($! $"$!!'- "'#($
$!. '' %$$!)
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
1
SCES592A − JULY 2004 − REVISED SEPTEMBER 2005
description/ordering information (continued)
NanoStar and NanoFree package technology is a major breakthrough in IC packaging concepts, using the
die as the package.
This device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs,
preventing damaging current backflow through the device when it is powered down.
ORDERING INFORMATION
ORDERABLE
PART NUMBER
PACKAGE†
TA
NanoStar − WCSP (DSBGA)
0.23-mm Large Bump − YEP
TOP-SIDE
MARKING‡
SN74AUP1G79YEPR
Reel of 3000
NanoFree − WCSP (DSBGA)
0.23-mm Large Bump − YZP (Pb-free)
_ _ _HW_
SN74AUP1G79YZPR
−40 C to 85
C
−40°C
85°C
SOT (SOT-23) − DBV
SOT (SC-70) − DCK
Reel of 3000
SN74AUP1G79DBVR
Reel of 250
SN74AUP1G79DBVT
Reel of 3000
SN74AUP1G79DCKR
Reel of 250
SN74AUP1G79DCKT
H79_
HW_
† Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at
www.ti.com/sc/package.
‡ DBV/DCK: The actual top-side marking has one additional character that designates the assembly/test site.
YEP/YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one
following character to designate the assembly/test site. Pin 1 identifier indicates solder-bump composition
(1 = SnPb, • = Pb-free).
FUNCTION TABLE
INPUTS
CLK
D
OUTPUT
Q
↑
H
H
↑
L
L
L or H
X
Q0
logic diagram (positive logic)
CLK
CLK
Q
D
2
D
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
Q
SCES592A − JULY 2004 − REVISED SEPTEMBER 2005
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)†
Supply voltage range, VCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to 4.6 V
Input voltage range, VI (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to 4.6 V
Voltage range applied to any output in the high-impedance or power-off state, VO
(see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to 4.6 V
Output voltage range in the high or low state, VO (see Note 1) . . . . . . . . . . . . . . . . . . . −0.5 V to VCC + 0.5 V
Input clamp current, IIK (VI < 0) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −50 mA
Output clamp current, IOK (VO < 0) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −50 mA
Continuous output current, IO . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±20 mA
Continuous current through VCC or GND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±50 mA
Package thermal impedance, θJA (see Note 2): DBV package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 206°C/W
DCK package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 252°C/W
YEP/YZP package . . . . . . . . . . . . . . . . . . . . . . . . . . . 132°C/W
Storage temperature range, Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −65°C to 150°C
† Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTES: 1. The input negative-voltage and output voltage ratings may be exceeded if the input and output current ratings are observed.
2. The package thermal impedance is calculated in accordance with JESD 51-7.
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
3
SCES592A − JULY 2004 − REVISED SEPTEMBER 2005
recommended operating conditions (see Note 3)
VCC
VIH
VIL
VI
VO
Supply voltage
VCC = 0.8 V
VCC = 1.1 V to 1.95 V
High-level input voltage
VCC = 2.3 V to 2.7 V
VCC = 3 V to 3.6 V
Low-level input voltage
∆t/∆v
0.8
3.6
VCC
0.65 × VCC
UNIT
V
V
1.6
2
0
0.35 × VCC
VCC = 2.3 V to 2.7 V
VCC = 3 V to 3.6 V
0.7
V
0.9
Input voltage
0
3.6
V
Output voltage
0
VCC
−20
V
High-level output current
−1.7
VCC = 2.3 V
VCC = 3 V
−3.1
VCC = 1.4 V
VCC = 1.65 V
VCC = 2.3 V
Low-level output current
VCC = 3 V
VCC = 0.8 V to 3.6 V
Input transition rise or fall rate
µA
−1.1
VCC = 1.4 V
VCC = 1.65
VCC = 0.8 V
VCC = 1.1 V
IOL†
MAX
VCC = 0.8 V
VCC = 1.1 V to 1.95 V
VCC = 0.8 V
VCC = 1.1 V
IOH†
MIN
−1.9
mA
−4
20
µA
1.1
1.7
1.9
mA
3.1
4
200
ns/V
TA
Operating free-air temperature
−40
85
°C
† Defined by the signal integrity requirements and design-goal priorities
NOTE 3: All unused inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report,
Implications of Slow or Floating CMOS Inputs, literature number SCBA004.
4
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
SCES592A − JULY 2004 − REVISED SEPTEMBER 2005
electrical characteristics over recommended operating free-air temperature range (unless
otherwise noted)
PARAMETER
VOH
VOL
II
D or CLK
input
TEST CONDITIONS
VCC
MIN
TA = 25°C
TYP
MAX
TA = −40°C TO 85°C
MIN
MAX
IOH = −20 µA
IOH = −1.1 mA
0.8 V to 3.6 V
IOH = −1.7 mA
IOH = −1.9 mA
1.4 V
1.11
1.65 V
1.32
1.3
2.05
1.97
1.9
1.85
2.72
2.67
2.6
2.55
1.1 V
IOH = −2.3 mA
IOH = −3.1 mA
2.3 V
IOH = −2.7 mA
IOH = −4 mA
3V
VCC − 0.1
0.75 × VCC
UNIT
VCC − 0.1
0.7 × VCC
1.03
V
IOL = 20 µA
IOL = 1.1 mA
0.8 V to 3.6 V
0.1
0.1
1.1 V
0.3 × VCC
0.3 × VCC
IOL = 1.7 mA
IOL = 1.9 mA
1.4 V
0.31
0.37
1.65 V
0.31
0.35
0.31
0.33
0.44
0.45
0.31
0.33
0.44
0.45
0.1
0.5
µA
0.2
0.6
µA
0 V to 0.2 V
0.2
0.6
µA
IOL = 2.3 mA
IOL = 3.1 mA
2.3 V
IOL = 2.7 mA
IOL = 4 mA
3V
VI = GND to 3.6 V
0 V to 3.6 V
Ioff
∆Ioff
VI or VO = 0 V to 3.6 V
VI or VO = 0 V to 3.6 V
ICC
VI = GND or
VCC to 3.6 V,
IO = 0
0.8 V to 3.6 V
0.5
0.9
µA
∆ICC
VI = VCC − 0.6 V,†
IO = 0
3.3 V
40
50
µA
Ci
VI = VCC or GND
Co
VO = GND
† One-input switching
0V
V
0V
1.5
3.6 V
1.5
0V
3
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
pF
pF
5
SCES592A − JULY 2004 − REVISED SEPTEMBER 2005
timing requirements over recommended operating free-air temperature range (unless otherwise
noted) (see Figure 3)
VCC
TA = 25°C
TYP
TA = −40°C
TO 85°C
MIN
0.8 V
fclock
Clock frequency
20
1.2 V ± 0.1 V
80
1.5 V ± 0.1 V
100
1.8 V ± 0.15 V
140
2.5 V ± 0.2 V
210
3.3 V ± 0.3 V
260
0.8 V
tw
Pulse duration, CLK high or low
2.2
1.5 V ± 0.1 V
1.5
1.8 V ± 0.15 V
1.6
2.5 V ± 0.2 V
1.7
3.3 V ± 0.3 V
tsu
Setup time before CLK↑
Data low
6
Hold time, data after CLK↑
POST OFFICE BOX 655303
1.4
1.5 V ± 0.1 V
1
0.9
2.5 V ± 0.2 V
0.7
3.3 V ± 0.3 V
0.6
3.5
5.3
1.2 V ± 0.1 V
1.8
1.5 V ± 0.1 V
1.2
1.8 V ± 0.15 V
1.1
2.5 V ± 0.2 V
1
3.3 V ± 0.3 V
1
0.8 V
th
4.2
1.8 V ± 0.15 V
0.8 V
0
ns
0
1.2 V ± 0.1 V
0
1.5 V ± 0.1 V
0
1.8 V ± 0.15 V
0
2.5 V ± 0.2 V
0
3.3 V ± 0.3 V
0
• DALLAS, TEXAS 75265
ns
1.9
2.9
1.2 V ± 0.1 V
Data high
ns
4.8
1.2 V ± 0.1 V
0.8 V
UNIT
MAX
ns
SCES592A − JULY 2004 − REVISED SEPTEMBER 2005
switching characteristics over recommended operating free-air temperature range, CL = 5 pF
(unless otherwise noted) (see Figures 3 and 4)
PARAMETER
FROM
(INPUT)
TO
(OUTPUT)
MIN
0.8 V
fmax
CLK
Q
TYP
MAX
MIN
93
90
1.2 V ± 0.1 V
199
220
1.5 V ± 0.1 V
250
230
1.8 V ± 0.15 V
271
240
2.5 V ± 0.2 V
280
250
3.3 V ± 0.3 V
280
260
0.8 V
tpd
TA = −40°C
TO 85°C
TA = 25°C
VCC
UNIT
MAX
MHz
15.9
1.2 V ± 0.1 V
3.7
6.9
11
2.6
13.1
1.5 V ± 0.1 V
3
4.8
7.6
2
8.8
1.8 V ± 0.15 V
2.4
3.8
6.1
1.5
7.1
2.5 V ± 0.2 V
1.8
2.7
4.4
1.1
5
3.3 V ± 0.3 V
1.5
2.1
3.6
0.9
4
ns
switching characteristics over recommended operating free-air temperature range, CL = 10 pF
(unless otherwise noted) (see Figures 3 and 4)
PARAMETER
FROM
(INPUT)
TO
(OUTPUT)
MIN
0.8 V
fmax
CLK
Q
POST OFFICE BOX 655303
TYP
MAX
MIN
62
50
1.2 V ± 0.1 V
147
160
1.5 V ± 0.1 V
189
200
1.8 V ± 0.15 V
180
240
2.5 V ± 0.2 V
260
250
3.3 V ± 0.3 V
280
260
0.8 V
tpd
TA = −40°C
TO 85°C
TA = 25°C
VCC
UNIT
MAX
MHz
18
1.2 V ± 0.1 V
4.3
7.8
12.3
3.2
14.4
1.5 V ± 0.1 V
3.5
5.5
8.4
2.5
9.8
1.8 V ± 0.15 V
2.8
4.4
6.8
1.9
8
2.5 V ± 0.2 V
2.2
3.2
5
1.5
5.7
3.3 V ± 0.3 V
1.8
2.6
4.1
1.3
4.5
• DALLAS, TEXAS 75265
ns
7
SCES592A − JULY 2004 − REVISED SEPTEMBER 2005
switching characteristics over recommended operating free-air temperature range, CL = 15 pF
(unless otherwise noted) (see Figures 3 and 4)
PARAMETER
FROM
(INPUT)
TO
(OUTPUT)
MIN
TYP
0.8 V
fmax
CLK
Q
MAX
MIN
48
30
1.2 V ± 0.1 V
112
120
1.5 V ± 0.1 V
151
160
1.8 V ± 0.15 V
194
220
2.5 V ± 0.2 V
248
250
3.3 V ± 0.3 V
280
260
0.8 V
tpd
TA = −40°C
TO 85°C
TA = 25°C
VCC
UNIT
MAX
MHz
20.3
1.2 V ± 0.1 V
5
8.7
13.6
3.9
15.6
1.5 V ± 0.1 V
4.1
6.3
9.3
3.1
10.7
1.8 V ± 0.15 V
3.3
4
7.6
2.4
8.7
2.5 V ± 0.2 V
2.6
3.6
5.5
1.9
6.3
3.3 V ± 0.3 V
2.2
3
4.5
1.6
5
ns
switching characteristics over recommended operating free-air temperature range, CL = 30 pF
(unless otherwise noted) (see Figures 3 and 4)
PARAMETER
FROM
(INPUT)
TO
(OUTPUT)
MIN
0.8 V
fmax
CLK
Q
TYP
MAX
24
MIN
UNIT
MAX
20
1.2 V ± 0.1 V
72
80
1.5 V ± 0.1 V
100
100
1.8 V ± 0.15 V
127
140
2.5 V ± 0.2 V
185
210
3.3 V ± 0.3 V
266
260
0.8 V
tpd
TA = −40°C
TO 85°C
TA = 25°C
VCC
MHz
27.2
1.2 V ± 0.1 V
7
11.5
17.3
5.9
24
1.5 V ± 0.1 V
5.7
8.3
11.8
4.6
15.9
1.8 V ± 0.15 V
4.7
6.7
9.6
3.8
13
2.5 V ± 0.2 V
3.7
4.9
7
2.9
9
3.3 V ± 0.3 V
3.2
4.1
5.8
2.6
7.2
ns
operating characteristics, TA = 25°C
PARAMETER
Cpd
8
TEST CONDITIONS
Power dissipation capacitance
f = 10 MHz
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
VCC
0.8 V
TYP
UNIT
2.5
1.2 V ± 0.1 V
2.5
1.5 V ± 0.1 V
2.5
1.8 V ± 0.15 V
2.5
2.5 V ± 0.2 V
3
3.3 V ± 0.3 V
3
pF
SCES592A − JULY 2004 − REVISED SEPTEMBER 2005
PARAMETER MEASUREMENT INFORMATION
(Propagation Delays, Setup and Hold Times, and Pulse Width)
From Output
Under Test
CL
(see Note A)
1 MΩ
LOAD CIRCUIT
CL
VM
VI
VCC = 0.8 V
VCC = 1.2 V
± 0.1 V
VCC = 1.5 V
± 0.1 V
VCC = 1.8 V
± 0.15 V
VCC = 2.5 V
± 0.2 V
VCC = 3.3 V
± 0.3 V
5, 10, 15, 30 pF
VCC/2
VCC
5, 10, 15, 30 pF
VCC/2
VCC
5, 10, 15, 30 pF
VCC/2
VCC
5, 10, 15, 30 pF
VCC/2
VCC
5, 10, 15, 30 pF
VCC/2
VCC
5, 10, 15, 30 pF
VCC/2
VCC
tw
VCC
Input
VCC/2
VCC/2
VI
VM
Input
0V
VM
VOLTAGE WAVEFORMS
PULSE DURATION
0V
tPHL
tPLH
VOH
VM
Output
VM
VOL
tPHL
VCC
Timing Input
0V
tPLH
tsu
VOH
VM
Output
th
VCC
VM
VOL
Data Input
VCC/2
VCC/2
0V
VOLTAGE WAVEFORMS
PROPAGATION DELAY TIMES
INVERTING AND NONINVERTING OUTPUTS
NOTES: A.
B.
C.
D.
E.
VCC/2
VOLTAGE WAVEFORMS
SETUP AND HOLD TIMES
CL includes probe and jig capacitance.
All input pulses are supplied by generators having the following characteristics: PRR ≤ 10 MHz, ZO = 50 Ω, tr/tf = 3 ns.
The outputs are measured one at a time, with one transition per measurement.
tPLH and tPHL are the same as tpd.
All parameters and waveforms are not applicable to all devices.
Figure 3. Load Circuit and Voltage Waveforms
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
9
SCES592A − JULY 2004 − REVISED SEPTEMBER 2005
PARAMETER MEASUREMENT INFORMATION
(Enable and Disable Times)
2 × VCC
5 kΩ
From Output
Under Test
CL
(see Note A)
S1
GND
5 kΩ
TEST
S1
tPLZ/tPZL
tPHZ/tPZH
2 × VCC
GND
LOAD CIRCUIT
CL
VM
VI
V∆
VCC = 0.8 V
VCC = 1.2 V
± 0.1 V
VCC = 1.5 V
± 0.1 V
VCC = 1.8 V
± 0.15 V
VCC = 2.5 V
± 0.2 V
VCC = 3.3 V
± 0.3 V
5, 10, 15, 30 pF
VCC/2
VCC
0.1 V
5, 10, 15, 30 pF
VCC/2
VCC
0.1 V
5, 10, 15, 30 pF
VCC/2
VCC
0.1 V
5, 10, 15, 30 pF
VCC/2
VCC
0.15 V
5, 10, 15, 30 pF
VCC/2
VCC
0.15 V
5, 10, 15, 30 pF
VCC/2
VCC
0.3 V
VCC
Output
Control
Output
Waveform 1
S1 at 2 × VCC
(see Note B)
VCC/2
VCC/2
0V
tPLZ
tPZL
VCC
VCC/2
VOL
tPHZ
tPZH
Output
Waveform 2
S1 at GND
(see Note B)
VOL + V∆
VCC/2
VOH − V∆
VOH
≈0 V
VOLTAGE WAVEFORMS
ENABLE AND DISABLE TIMES
LOW- AND HIGH-LEVEL ENABLING
NOTES: A. CL includes probe and jig capacitance.
B. Waveform 1 is for an output with internal conditions such that the output is low, except when disabled by the output control.
Waveform 2 is for an output with internal conditions such that the output is high, except when disabled by the output control.
C. All input pulses are supplied by generators having the following characteristics: PRR ≤ 10 MHz, ZO = 50 Ω, tr/tf = 3 ns.
D. The outputs are measured one at a time, with one transition per measurement.
E. tPLZ and tPHZ are the same as tdis.
F. tPZL and tPZH are the same as ten.
G. All parameters and waveforms are not applicable to all devices.
Figure 4. Load Circuit and Voltage Waveforms
10
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
PACKAGE OPTION ADDENDUM
www.ti.com
23-Sep-2005
PACKAGING INFORMATION
Orderable Device
Status (1)
Package
Type
Package
Drawing
Pins Package Eco Plan (2)
Qty
SN74AUP1G79DBVR
ACTIVE
SOT-23
DBV
5
3000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74AUP1G79DBVRE4
ACTIVE
SOT-23
DBV
5
3000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74AUP1G79DBVT
ACTIVE
SOT-23
DBV
5
250
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74AUP1G79DBVTE4
ACTIVE
SOT-23
DBV
5
250
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74AUP1G79DCKR
ACTIVE
SC70
DCK
5
3000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74AUP1G79DCKRE4
ACTIVE
SC70
DCK
5
3000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74AUP1G79DCKT
ACTIVE
SC70
DCK
5
250
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74AUP1G79DCKTE4
ACTIVE
SC70
DCK
5
250
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
Lead/Ball Finish
MSL Peak Temp (3)
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS) or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
11-Oct-2005
PACKAGING INFORMATION
Orderable Device
Status (1)
Package
Type
Package
Drawing
Pins Package Eco Plan (2)
Qty
SN74AUP1G79DBVR
ACTIVE
SOT-23
DBV
5
3000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74AUP1G79DBVRE4
ACTIVE
SOT-23
DBV
5
3000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74AUP1G79DBVRG4
ACTIVE
SOT-23
DBV
5
3000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74AUP1G79DBVT
ACTIVE
SOT-23
DBV
5
250
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74AUP1G79DBVTE4
ACTIVE
SOT-23
DBV
5
250
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74AUP1G79DCKR
ACTIVE
SC70
DCK
5
3000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74AUP1G79DCKRE4
ACTIVE
SC70
DCK
5
3000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74AUP1G79DCKT
ACTIVE
SC70
DCK
5
250
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74AUP1G79DCKTE4
ACTIVE
SC70
DCK
5
250
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
Lead/Ball Finish
MSL Peak Temp (3)
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS) or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 1
MECHANICAL DATA
MPDS025C – FEBRUARY 1997 – REVISED FEBRUARY 2002
DCK (R-PDSO-G5)
PLASTIC SMALL-OUTLINE PACKAGE
0,30
0,15
0,65
5
0,10 M
4
1,40
1,10
1
0,13 NOM
2,40
1,80
3
Gage Plane
2,15
1,85
0,15
0°–8°
0,46
0,26
Seating Plane
1,10
0,80
0,10
0,00
0,10
4093553-2/D 01/02
NOTES: A.
B.
C.
D.
All linear dimensions are in millimeters.
This drawing is subject to change without notice.
Body dimensions do not include mold flash or protrusion.
Falls within JEDEC MO-203
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications,
enhancements, improvements, and other changes to its products and services at any time and to discontinue
any product or service without notice. Customers should obtain the latest relevant information before placing
orders and should verify that such information is current and complete. All products are sold subject to TI’s terms
and conditions of sale supplied at the time of order acknowledgment.
TI warrants performance of its hardware products to the specifications applicable at the time of sale in
accordance with TI’s standard warranty. Testing and other quality control techniques are used to the extent TI
deems necessary to support this warranty. Except where mandated by government requirements, testing of all
parameters of each product is not necessarily performed.
TI assumes no liability for applications assistance or customer product design. Customers are responsible for
their products and applications using TI components. To minimize the risks associated with customer products
and applications, customers should provide adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right,
copyright, mask work right, or other TI intellectual property right relating to any combination, machine, or process
in which TI products or services are used. Information published by TI regarding third-party products or services
does not constitute a license from TI to use such products or services or a warranty or endorsement thereof.
Use of such information may require a license from a third party under the patents or other intellectual property
of the third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of information in TI data books or data sheets is permissible only if reproduction is without
alteration and is accompanied by all associated warranties, conditions, limitations, and notices. Reproduction
of this information with alteration is an unfair and deceptive business practice. TI is not responsible or liable for
such altered documentation.
Resale of TI products or services with statements different from or beyond the parameters stated by TI for that
product or service voids all express and any implied warranties for the associated TI product or service and
is an unfair and deceptive business practice. TI is not responsible or liable for any such statements.
Following are URLs where you can obtain information on other Texas Instruments products and application
solutions:
Products
Applications
Amplifiers
amplifier.ti.com
Audio
www.ti.com/audio
Data Converters
dataconverter.ti.com
Automotive
www.ti.com/automotive
DSP
dsp.ti.com
Broadband
www.ti.com/broadband
Interface
interface.ti.com
Digital Control
www.ti.com/digitalcontrol
Logic
logic.ti.com
Military
www.ti.com/military
Power Mgmt
power.ti.com
Optical Networking
www.ti.com/opticalnetwork
Microcontrollers
microcontroller.ti.com
Security
www.ti.com/security
Telephony
www.ti.com/telephony
Video & Imaging
www.ti.com/video
Wireless
www.ti.com/wireless
Mailing Address:
Texas Instruments
Post Office Box 655303 Dallas, Texas 75265
Copyright  2005, Texas Instruments Incorporated