FREESCALE MC56F8025

56F8025
Data Sheet
Preliminary Technical Data
56F8000
16-bit Digital Signal Controllers
MC56F8025
Rev. 3
01/2007
freescale.com
Document Revision History
Version History
Description of Change
Rev. 0
Initial public release.
Rev. 1
• In Table 5-3, changed the ITCN_BASE address from $00 F060 (incorrect value) to
$00 F0E0 (the correct value).
• In Table 10-4, added an entry for flash data retention with less than 100 program/erase
cycles (minimum 20 years).
• In Table 10-6, changed the device clock speed in STOP mode from 8MHz to 4MHz.
• In Table 10-12, changed the typical relaxation oscillator output frequency in Standby mode
from 400kHz to 200kHz.
• Changed input propagation delay values in Table 10-20 as follows:
Old values: 1 μs typical, 2 μs maximum
New values: 35 ns typical, 45 ns maximum
Rev. 2
• In Table 10-19, changed the maximum ADC internal clock frequency from 8MHz to
5.33MHz.
• Replaced the case outline schematics in Figure 11-2, Figure 11-3, and Figure 11-4.
Rev. 3
Added the following note to the description of the TMS signal in Table 2-3:
Note: Always tie the TMS pin to VDD through a 2.2K resistor.
Please see http://www.freescale.com for the most current data sheet revision.
56F8025 Data Sheet, Rev. 3
2
Freescale Semiconductor
Preliminary
56F8025 General Description
• Up to 32 MIPS at 32MHz core frequency
• One Queued Serial Peripheral Interfaces (QSPI)
• DSP and MCU functionality in a unified,
C-efficient architecture
• One 16-bit Quad Timer
• One Inter-Integrated Circuit (I2C) port
• 32KB (16K x 16) Program Flash
• Computer Operating Properly (COP)/Watchdog
• 4KB (2K x 16) Unified Data/Program RAM
• On-Chip Relaxation Oscillator
• One 6-channel PWM module
• Integrated Power-On Reset (POR) and Low-Voltage
Interrupt (LVI) module
• Two 4-channel 12-bit Analog-to-Digital Converters
(ADCs)
• JTAG/Enhanced On-Chip Emulation (OnCE™) for
unobtrusive, real-time debugging
• Two Internal 12-bit Digital-to-Analog Converters
(DACs)
• Up to 35 GPIO lines
• Two Analog Comparators
• 44-pin LQFP Package
• Three Programmable Interval Timers (PITs)
• One Queued Serial Communication Interface (QSCI)
with LIN slave functionality
RESET or
GPIOA
4
JTAG/EOnCE
Port or
GPIOD
PWM
or TMRA or CMP
or GPIOA
11
4
VSS
2
3
Digital Reg
VDDA
VSSA
Analog Reg
Low-Voltage
Supervisor
Data ALU
16 x 16 + 36 -> 36-Bit MAC
Three 16-bit Input Registers
Four 36-bit Accumulators
Bit
Manipulation
Unit
PAB
PDB
CDBR
CDBW
DAC
4
VDD
2
16-Bit
56800E Core
Address
Generation Unit
Program Controller
and Hardware
Looping Unit
VCAP
AD0
Memory
ADC
or CMP
or GPIOC
R/W Control
Program Memory
16K x 16 Flash
AD1
Unified Data /
Program RAM
2K x 16
Programmable
Interval
Timer
I2C
or CMP
or GPIOB
2
XDB2
XAB1
XAB2
System Bus
Control
PAB
PDB
CDBR
CDBW
IPBus Bridge (IPBB)
QSPI
or PWM
or I2C
or TMRA
or GPIOB
4
QSCI
or PWM
or I2C
or TMRA
or GPIOB
COP/
Watchdog
Interrupt
Controller
System
Integration
Module
P
O
R
O
Clock
S
Generator* C
XTAL, CLKIN, or
GPIOD
EXTAL or GPIOD
*Includes On-Chip
Relaxation Oscillator
3
56F8025 Block Diagram
56F8025 Data Sheet, Rev. 3
Freescale Semiconductor
Preliminary
3
56F8025 Data Sheet Table of Contents
Part 1: Overview . . . . . . . . . . . . . . . . . . . . . . . 5
1.1.
1.2.
1.3.
1.4.
1.5.
1.6.
56F8025 Features . . . . . . . . . . . . . . . . . . . . . 5
56F8025 Description. . . . . . . . . . . . . . . . . . . 7
Award-Winning Development Environment . 8
Architecture Block Diagram . . . . . . . . . . . . . 8
Product Documentation . . . . . . . . . . . . . . . 16
Data Sheet Conventions. . . . . . . . . . . . . . . 16
Part 2: Signal/Connection Descriptions . . . 17
2.1. Introduction . . . . . . . . . . . . . . . . . . . . . . . . . 17
2.2. 56F8025 Signal Pins . . . . . . . . . . . . . . . . . 21
Part 3: OCCS . . . . . . . . . . . . . . . . . . . . . . . . . 32
3.1.
3.2.
3.3.
3.4.
3.5.
3.6.
3.7.
Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . 32
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . 32
Operating Modes . . . . . . . . . . . . . . . . . . . . 32
Internal Clock Source . . . . . . . . . . . . . . . . . 33
Crystal Oscillator. . . . . . . . . . . . . . . . . . . . . 33
Ceramic Resonator. . . . . . . . . . . . . . . . . . . 34
External Clock Input - Crystal
Oscillator Option. . . . . . . . . . . . . . 34
3.8. Alternate External Clock Input . . . . . . . . . . . 35
Part 4: Memory Maps . . . . . . . . . . . . . . . . . 35
4.1.
4.2.
4.3.
4.4.
4.5.
4.6.
Introduction . . . . . . . . . . . . . . . . . . . . . . . . . 35
Interrupt Vector Table . . . . . . . . . . . . . . . . . 36
Program Map . . . . . . . . . . . . . . . . . . . . . . . . 38
Data Map . . . . . . . . . . . . . . . . . . . . . . . . . . . 38
EOnCE Memory Map . . . . . . . . . . . . . . . . . . 39
Peripheral Memory-Mapped Registers . . . . 40
Part 5: Interrupt Controller (ITCN) . . . . . . . . 53
5.1.
5.2.
5.3.
5.4.
5.5.
5.6.
5.7.
Introduction . . . . . . . . . . . . . . . . . . . . . . . . . 53
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . 53
Functional Description . . . . . . . . . . . . . . . . 53
Block Diagram . . . . . . . . . . . . . . . . . . . . . . . 55
Operating Modes . . . . . . . . . . . . . . . . . . . . 55
Register Descriptions . . . . . . . . . . . . . . . . . 55
Resets . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 74
Part 6: System Integration Module (SIM). . 75
6.1.
6.2.
6.3.
6.4.
6.5.
6.6.
6.7.
6.8.
Introduction . . . . . . . . . . . . . . . . . . . . . . . . . 75
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . 76
Register Descriptions . . . . . . . . . . . . . . . . . 77
Clock Generation Overview . . . . . . . . . . . . 102
Power-Saving Modes . . . . . . . . . . . . . . . . 103
Resets . . . . . . . . . . . . . . . . . . . . . . . . . . . . 104
Clocks . . . . . . . . . . . . . . . . . . . . . . . . . . . . 105
Interrupts . . . . . . . . . . . . . . . . . . . . . . . . . 107
Part 8: General-Purpose
Input/Output (GPIO) . . . . . . . . . . . . 109
8.1. Introduction . . . . . . . . . . . . . . . . . . . . . . . . 109
8.2. Configuration . . . . . . . . . . . . . . . . . . . . . . . 109
8.3. Reset Values . . . . . . . . . . . . . . . . . . . . . . . 112
Part 9: Joint Test Action Group (JTAG) . . 117
9.1. 56F8025 Information . . . . . . . . . . . . . . . . . 117
Part 10: Specifications. . . . . . . . . . . . . . . . 117
10.1. General Characteristics . . . . . . . . . . . . . . 117
10.2. DC Electrical Characteristics . . . . . . . . . . 121
10.3. AC Electrical Characteristics . . . . . . . . . . 124
10.4. Flash Memory Characteristics . . . . . . . . . 125
10.5. External Clock Operation Timing . . . . . . . 125
10.6. Phase Locked Loop Timing . . . . . . . . . . . 126
10.7. Relaxation Oscillator Timing . . . . . . . . . . 127
10.8. Reset, Stop, Wait, Mode Select, and
Interrupt Timing . . . . . . . . . . . . . . 129
10.9. Serial Peripheral Interface (SPI) Timing . 130
10.10. Quad Timer Timing . . . . . . . . . . . . . . . . 133
10.11. Serial Communication Interface
(SCI) Timing. . . . . . . . . . . . . . . . . 135
10.12. Inter-Integrated Circuit Interface
(I2C) Timing . . . . . . . . . . . . . . . . . 136
10.13. JTAG Timing. . . . . . . . . . . . . . . . . . . . . . 138
10.14. Analog-to-Digital Converter
(ADC) Parameters . . . . . . . . . . . . 139
10.15. Equivalent Circuit for ADC Inputs . . . . . . 140
10.16. Comparator (CMP) Parameters . . . . . . . 140
10.17. Digital-to-Analog Converter
(DAC) Parameters . . . . . . . . . . . . 141
10.18. Power Consumption . . . . . . . . . . . . . . . 142
Part 11: Packaging . . . . . . . . . . . . . . . . . . .143
11.1. 56F8025 Package and
Pin-Out Information . . . . . . . . . . . 143
Part 12: Design Considerations . . . . . . . . .149
12.1. Thermal Design Considerations . . . . . . . . 149
12.2. Electrical Design Considerations . . . . . . . 150
Part 13: Ordering Information . . . . . . . . . . 151
Part 14: Appendix. . . . . . . . . . . . . . . . . . . . 152
Part 7: Security Features . . . . . . . . . . . . . . 107
7.1. Operation with Security Enabled . . . . . . . . 107
7.2. Flash Access Lock and
Unlock Mechanisms
108
56F8025 Data Sheet, Rev. 3
4
Freescale Semiconductor
Preliminary
56F8025 Features
Part 1 Overview
1.1 56F8025 Features
1.1.1
•
•
•
•
•
•
•
•
•
•
•
•
•
•
1.1.2
•
•
•
Digital Signal Controller Core
Efficient 16-bit 56800E family Digital Signal Controller (DSC) engine with dual Harvard architecture
As many as 32 Million Instructions Per Second (MIPS) at 32MHz core frequency
Single-cycle 16 × 16-bit parallel Multiplier-Accumulator (MAC)
Four 36-bit accumulators, including extension bits
32-bit arithmetic and logic multi-bit shifter
Parallel instruction set with unique DSP addressing modes
Hardware DO and REP loops
Three internal address buses
Four internal data buses
Instruction set supports both DSP and controller functions
Controller-style addressing modes and instructions for compact code
Efficient C compiler and local variable support
Software subroutine and interrupt stack with depth limited only by memory
JTAG/Enhanced On-Chip Emulation (OnCE) for unobtrusive, processor speed-independent real-time
debugging
Memory
Dual Harvard architecture permits as many as three simultaneous accesses to program and data memory
Flash security and protection that prevent unauthorized users from gaining access to the internal Flash
On-chip memory
— 32KB of Program Flash
— 4KB of Unified Data/Program RAM
•
1.1.3
•
EEPROM emulation capability using Flash
Peripheral Circuits for 56F8025
One multi-function six-output Pulse Width Modulator (PWM) module
— Up to 96MHz PWM operating clock
— 15 bits of resolution
— Center-aligned and edge-aligned PWM signal mode
— Four programmable fault inputs with programmable digital filter
— Double-buffered PWM registers
— Each complementary PWM signal pair allows selection of a PWM supply source from:
– PWM generator
56F8025 Data Sheet, Rev. 3
Freescale Semiconductor
Preliminary
5
– External GPIO
– Internal timers
– Analog comparator outputs
– ADC conversion result which compares with values of ADC high- and low-limit registers to set
PWM output
•
Two independent 12-bit Analog-to-Digital Converters (ADCs)
— 2 x 4 channel inputs
— Supports both simultaneous and sequential conversions
— ADC conversions can be synchronized by both PWM and timer modules
— Sampling rate up to 2.67MSPS
— 16-word result buffer registers
•
Two internal 12-bit Digital-to-Analog Converters (DACs)
— 2 microsecond settling time when output swing from rail to rail
— Automatic waveform generation generates square, triangle and sawtooth waveforms with
programmable period, update rate, and range
•
One 16-bit multi-purpose Quad Timer module (TMR)
— Up to 96MHz operating clock
— Eight independent 16-bit counter/timers with cascading capability
— Each timer has capture and compare capability
— Up to 12 operating modes
•
One Queued Serial Communication Interface (QSCI) with LIN Slave functionality
— Full-duplex or single-wire operation
— Two receiver wake-up methods:
– Idle line
– Address mark
— Four-bytes-deep FIFOs are available on both transmitter and receiver
•
One Queued Serial Peripheral Interfaces (QSPI)
— Full-duplex operation
— Master and slave modes
— Four-words-deep FIFOs available on both transmitter and receiver
— Programmable Length Transactions (2 to 16 bits)
•
One Inter-Integrated Circuit (I2C) port
— Operates up to 400kbps
— Supports both master and slave operation
— Supports both 10-bit address mode and broadcasting mode
•
Three 16-bit Programmable Interval Timers (PITs)
56F8025 Data Sheet, Rev. 3
6
Freescale Semiconductor
Preliminary
56F8025 Description
•
Two analog Comparators (CMPs)
— Selectable input source includes external pins, DACs
— Programmable output polarity
— Output can drive Timer input, PWM fault input, PWM source, external pin output and trigger ADCs
— Output falling and rising edge detection able to generate interrupts
•
•
•
•
•
Computer Operating Properly (COP)/Watchdog timer capable of selecting different clock sources
Up to 35 General-Purpose I/O (GPIO) pins with 5V tolerance
Integrated Power-On Reset (POR) and Low-Voltage Interrupt (LVI) module
Phase Lock Loop (PLL) provides a high-speed clock to the core and peripherals
Clock sources:
— On-chip relaxation oscillator
— External clock: Crystal oscillator, ceramic resonator, and external clock source
•
1.1.4
•
•
•
•
•
JTAG/EOnCE debug programming interface for real-time debugging
Energy Information
Fabricated in high-density CMOS with 5V tolerance
On-chip regulators for digital and analog circuitry to lower cost and reduce noise
Wait and Stop modes available
ADC smart power management
Each peripheral can be individually disabled to save power
1.2 56F8025 Description
The 56F8025 is a member of the 56800E core-based family of Digital Signal Controllers (DSCs). It
combines, on a single chip, the processing power of a DSP and the functionality of a microcontroller with
a flexible set of peripherals to create an extremely cost-effective solution. Because of its low cost,
configuration flexibility, and compact program code, the 56F8025 is well-suited for many applications.
The 56F8025 includes many peripherals that are especially useful for industrial control, motion control,
home appliances, general-purpose inverters, smart sensors, fire and security systems, switched-mode
power supply, power management, and medical monitoring applications.
The 56800E core is based on a dual Harvard-style architecture consisting of three execution units
operating in parallel, allowing as many as six operations per instruction cycle. The MCU-style
programming model and optimized instruction set allow straightforward generation of efficient, compact
DSP and control code. The instruction set is also highly efficient for C compilers to enable rapid
development of optimized control applications.
The 56F8025 supports program execution from internal memories. Two data operands can be accessed
from the on-chip data RAM per instruction cycle. The 56F8025 also offers up to 35 General-Purpose
Input/Output (GPIO) lines, depending on peripheral configuration.
The 56F8025 Digital Signal Controller includes 32KB of Program Flash and 4KB of Unified
56F8025 Data Sheet, Rev. 3
Freescale Semiconductor
Preliminary
7
Data/Program RAM. Program Flash memory can be independently bulk erased or erased in pages.
Program Flash page erase size is 512 Bytes (256 Words).
A full set of programmable peripherals — PWM, ADCs, QSCI, QSPI, I2C, PITs, Quad Timers, DACs,
and analog comparators — supports various applications. Each peripheral can be independently shut down
to save power. Any pin in these peripherals can also be used as General Purpose Input/Outputs (GPIOs).
1.3 Award-Winning Development Environment
Processor ExpertTM (PE) provides a Rapid Application Design (RAD) tool that combines easy-to-use
component-based software application creation with an expert knowledge system.
The CodeWarrior Integrated Development Environment is a sophisticated tool for code navigation,
compiling, and debugging. A complete set of evaluation modules (EVMs), demonstration board kit and
development system cards will support concurrent engineering. Together, PE, CodeWarrior and EVMs
create a complete, scalable tools solution for easy, fast, and efficient development.
1.4 Architecture Block Diagram
The 56F8025’s architecture is shown in Figures 1-1, 1-2, 1-3, 1-4, 1-5, 1-6, and 1-7. Figure 1-1 illustrates
how the 56800E system buses communicate with internal memories and the IPBus Bridge and the internal
connections between each unit of the 56800E core. Figure 1-2 shows the peripherals and control blocks
connected to the IPBus Bridge. Figures 1-3, 1-4, 1-5, 1-6, and 1-7 detail how the device’s I/O pins are
muxed. The figures do not show the on-board regulator and power and ground signals. Please see Part 2,
Signal/Connection Descriptions, for information about which signals are multiplexed with those of other
peripherals.
1.4.1
PWM, TMR and ADC Connections
Figure 1-3 shows the over- and under-voltage connections from the ADC to the PWM and the connections
to the PWM from the TMR and GPIO. These signals can control the PWM outputs in a similar manner to
the over- and under-voltage control signals. See the 56F802x and 56F803x Peripheral Reference
Manual for additional information.
The PWM_reload_sync output can be connected to the Timer’s Channel 3 input and the Timer’s Channels
2 and 3 outputs are connected to the ADC sync inputs. Timer Channel 3 output is connected to SYNC0
and Timer Channel 2 is connected to SYNC1. These are controlled by bits in the SIM Control Register;
see Section 6.3.1.
56F8025 Data Sheet, Rev. 3
8
Freescale Semiconductor
Preliminary
Architecture Block Diagram
DSP56800E Core
Program Control Unit
PC
LA
LA2
HWS0
HWS1
FIRA
OMR
SR
LC
LC2
FISR
Address
Generation
Unit
(AGU)
Instruction
Decoder
Interrupt
Unit
ALU1
ALU2
R0
R1
R2
R3
R4
R5
N
M01
N3
Looping
Unit
Program
Memory
SP
XAB1
XAB2
PAB
PDB
Data /
Program
RAM
CDBW
CDBR
XDB2
A2
B2
C2
D2
BitManipulation
Unit
Enhanced
OnCE™
JTAG TAP
Y
A1
B1
C1
D1
Y1
Y0
X0
MAC and ALU
A0
B0
C0
D0
IPBUS
Interface
Data
Arithmetic
Logic Unit
(ALU)
Multi-Bit Shifter
Figure 1-1 56800E Core Block Diagram
56F8025 Data Sheet, Rev. 3
Freescale Semiconductor
Preliminary
9
To/From IPBus Bridge
OCCS
(ROSC / PLL /
OSC)
Interrupt
Controller
Low-Voltage Interrupt
GPIO A
POR & LVI
GPIO B
System POR
GPIO C
SIM
GPIO D
RESET
(Muxed with GPIOA7)
COP Reset
COP
IPBus
(Continues on Figure 1-3)
Figure 1-2 Peripheral Subsystem
56F8025 Data Sheet, Rev. 3
10
Freescale Semiconductor
Preliminary
Architecture Block Diagram
To/From IPBus Bridge
IPBus
INTC
SYNC
PIT0
MSTR_CNT_EN
3
MSTR_CNT_EN
DAC SYNC on Figure 1-5
SYNC
PIT1
MSTR_CNT_EN
SYNC
PIT2
2
3
Sync0,
Sync1
Over/Under
Limits
SYNC0, SYNC1 on Figure 1-7
LIMIT on Figure 1-6
ANA0
ANA0 on Figure 1-5
GPIOC2
ANA2 (VREFHA)
GPIOC3
ANA3 (VREFLA)
GPIOC1
ANA1
ADC
ANB0
ANB0 on Figure 1-5
ANB2 (VREFHB)
ANB3 (VREFLB)
ANB1
GPIOC6
GPIOC7
GPIOC5
Figure 1-3 56F8025 I/O Pin-Out Muxing (Part 1/5)
56F8025 Data Sheet, Rev. 3
Freescale Semiconductor
Preliminary
11
To/From IPBus Bridge
GPIOB6 - 7
QSCI0
RXD0, TXD0
2
TA2, TA3 on Figure 1-7
MISO0, MOSI0
QSPI0
SCLK0, SS0
2
2
2
I2C
SCL, SDA
GPIOB2 - 3
2
GPIOB0 - 1
2
IPBus
Figure 1-4 56F8025 I/O Pin-Out Muxing (Part 2/5)
56F8025 Data Sheet, Rev. 3
12
Freescale Semiconductor
Preliminary
Architecture Block Diagram
To/From IPBus Bridge
FAULT1 on Figure 1-6
TA2 on Figure 1-7
CMP_IN1
CMP_IN3
CMPAI1
CMPAI3
GPIOC0
CMPA
CMP_OUT
CMP_IN2
GPIOA8
CMPAO on Figure 1-6, Figure 1-7
CMPAI2
ANA0 on Figure 1-3
Export Import
GPIOA10
TB2 on Figure 1-4
GPIOB10
DAC0
2
3
TA0o, TA1o on Figure 1-7
DAC SYNC on Figure 1-3
RELOAD on Figure 1-6
DAC1
GPIOB11
Import Export
CMP_IN2
CMP_OUT
ANB0 on Figure 1-3
GPIOA11
CMPBI2
CMPBO on Figure 1-6, Figure 1-7
CMPB
GPIOC4
CMP_IN3
CMP_IN1
CMPBI3
CMPBI1
TA3 on Figure 1-7
GPIOA9
FAULT2 on Figure 1-6
IPBus
Figure 1-5 56F8025 I/O Pin-Out Muxing (Part 3/5)
56F8025 Data Sheet, Rev. 3
Freescale Semiconductor
Preliminary
13
To/From IPBus Bridge
TA0 on Figure 1-7
GPIOA6
2
TA2 - 3 on Figure 1-7
GPIOA0 - 3
4
PWM0 - 3
FAULT0
GPIOA4 - 5
2
PWMA4 - 5
1
2
PWM
FAULT1
FAULT1 on Figure 1-5
FAULT2
RELOAD
PSRC0 - 1
1
FAULT3
FAULT2 on Figure 1-5
TA1 on Figure 1-7
RELOAD on Figure 1-7, Figure 1-5
IPBus
GPIOB5
CMPAO on Figure 1-5
COUTB_A on Figure 1-5
3
3
3
3
GPIOB2 - 4 on Figure 1-4
LIMIT on Figure 1-3
TA0o, TA2o, TA3o on Figure 1-3
Figure 1-6 56F8025 I/O Pin-Out Muxing (Part 4/5)
56F8025 Data Sheet, Rev. 3
14
Freescale Semiconductor
Preliminary
Architecture Block Diagram
To/From IPBus Bridge
TA0o on Figure 1-6 (PWM)
TA0 on Figure 1-6 (GPIOA6)
T0o
T0i
T1o
T1i
TA1 on Figure 1-6 (GPIOB5)
CMPAO on Figure 1-6 (CMPA)
SYNC1 on Figure 1-3 (ADC)
TMRA
TA2o on Figure 1-6 (PWM)
TA2 - 3 on Figure 1-6 (GPIOA4)
T2o
TA2 on Figure 1-5 (GPIOA8)
T2i
TA2 - 3 on Figure 1-4 (GPIOB2)
COUTB_A on Figure 1-6 (CMPB)
SYNC0 on Figure 1-3 (ADC)
TA3o on Figure 1-6 (PWM)
TA2 - 3 on Figure 1-6 (GPIOA5)
T3o
TA3 on Figure 1-5 (GPIOA9)
T3i
TA2 - 3 on Figure 1-4 (GPIOB3)
RELOAD on Figure 1-6 (PWM)
IPBus
Figure 1-7 56F8025 I/O Pin-Out Muxing (Part 5/5)
56F8025 Data Sheet, Rev. 3
Freescale Semiconductor
Preliminary
15
1.5 Product Documentation
The documents listed in Table 1-1 are required for a complete description and proper design with the
56F8025. Documentation is available from local Freescale distributors, Freescale Semiconductor sales offices,
Freescale Literature Distribution Centers, or online at:
http://www.freescale.com
Table 1-1 56F8025 Chip Documentation
Topic
Description
Order Number
DSP56800E
Reference Manual
Detailed description of the 56800E family architecture,
16-bit Digital Signal Controller core processor, and the
instruction set
DSP56800ERM
56F802x and 56F803x
Peripheral Reference
Manual
Detailed description of peripherals of the 56F802x and
56F803x family of devices
MC56F80xxRM
56F802x and 56F803x
Serial Bootloader User
Guide
Detailed description of the Serial Bootloader in the
56F802x and 56F803x family of devices
56F80xxBLUG
56F8025
Technical Data Sheet
Electrical and timing specifications, pin descriptions,
and package descriptions (this document)
MC56F8025
56F8025
Errata
Details any chip issues that might be present
MC56F8025E
1.6 Data Sheet Conventions
This data sheet uses the following conventions:
OVERBAR
This is used to indicate a signal that is active when pulled low. For example, the RESET pin is
active when low.
“asserted”
A high true (active high) signal is high or a low true (active low) signal is low.
“deasserted”
A high true (active high) signal is low or a low true (active low) signal is high.
Examples:
Signal/Symbol
Logic State
Signal State
Voltage1
PIN
True
Asserted
VIL/VOL
PIN
False
Deasserted
VIH/VOH
PIN
True
Asserted
VIH/VOH
PIN
False
Deasserted
VIL/VOL
1. Values for VIL, VOL, VIH, and VOH are defined by individual product specifications.
56F8025 Data Sheet, Rev. 3
16
Freescale Semiconductor
Preliminary
Introduction
Part 2 Signal/Connection Descriptions
2.1 Introduction
The input and output signals of the 56F8025 are organized into functional groups, as detailed in Table 2-1.
Table 2-2 summarizes all device pins. In Table 2-2, each table row describes the signal or signals present
on a pin, sorted by pin number.
Table 2-1 Functional Group Pin Allocations
Functional Group
Number of Pins
Power Inputs (VDD, VDDA)
3
Ground (VSS, VSSA)
4
Supply Capacitors
2
Reset1
1
Pulse Width Modulator (PWM) Ports1
12
Serial Peripheral Interface (SPI) Ports1
4
Timer Module A (TMRA) Ports1
4
Analog-to-Digital Converter (ADC) Ports1
8
Serial Communications Interface 0 (SCI0) Ports1
2
Inter-Integrated Circuit Interface (I2C) Ports1
2
Oscillator Signals1
2
JTAG/Enhanced On-Chip Emulation (EOnCE)1
4
1. Pins may be shared with other peripherals; see Table 2-2.
56F8025 Data Sheet, Rev. 3
Freescale Semiconductor
Preliminary
17
In Table 2-2, peripheral pins in bold identify reset state.
Table 2-2 56F8025 Pins
Peripherals:
Pin
#
Pin Name
Signal Name
GPIO
I2C
QSCI
RXD0
QSPI
ADC
PWM
Quad
Timer
Comp
Power &
Ground
1
GPIOB6
GPIOB6, RXD0, SDA,
CLKIN
B6
SDA
2
GPIOB1
GPIOB1, SS0, SDA
B1
SDA
3
GPIOB7
GPIOB7, TXD0, SCL
B7
SCL
4
GPIOB5
GPIOB5, TA1,
FAULT3, CLKIN
B5
FAULT3
TA1
5
GPIOA9
GPIOA9, FAULT2,
TA3, CMPBI1
A9
FAULT2
TA3
6
GPIOA11
GPIOA11, CMPBI2
A11
7
GPIOC4
GPIOC4, ANB0,
CMPBI3
C4
ANB0
8
GPIOC5
GPIOC5, ANB1
C5
ANB1
9
GPIOC6
GPIOC6, ANB2,
VREFHB
C6
ANB2
VREFHB
10
GPIOC7
GPIOC7, ANB3,
VREFLB
C7
ANB3
VREFLB
11
VDDA
VDDA
VDDA
12
VSSA
VSSA
VSSA
13
GPIOC3
GPIOC3, ANA3,
VREFLA
C3
ANA3
VREFLA
14
GPIOC2
GPIOC2, ANA2,
VREFHA
C2
ANA2
VREFHA
15
GPIOC1
GPIOC1, ANA1
C1
ANA1
16
GPIOC0
GPIOC0, ANA0,
CMPAI3
C0
ANA0
17
VSS_IO
VSS
VSS
18
VCAP
VCAP
VCAP
19
TCK
TCK, GPIOD2
D2
20
GPIOB10
GPIOB10, CMPAO
B10
21
RESET
RESET, GPIOA7
A7
22
GPIOB3
GPIOB3, MOSI0, TA3,
PSRC1
B3
MOSI0
PSRC1
TA3
23
GPIOB2
GPIOB2, MISO0, TA2,
PSRC0
B2
MISO0
PSRC0
TA2
24
GPIOA6
GPIOA6, FAULT0,
TA0
A6
FAULT0
TA0
25
GPIOA10
GPIOA10, CMPAI2
A10
26
GPIOA8
GPIOA8, FAULT1,
TA2, CMPAI1
A8
FAULT1
TA2
27
GPIOA5
GPIOA5, PWM5, TA3,
FAULT2
A5
PWM5
FAULT2
TA3
JTAG
Misc
CLKIN
SS0
TXD0
CLKIN
CMPBI1
CMPBI2
CMPBI3
CMPAI3
TCK
CMPAO
RESET
CMPAI2
CMPAI1
56F8025 Data Sheet, Rev. 3
18
Freescale Semiconductor
Preliminary
Introduction
Table 2-2 56F8025 Pins (Continued)
Peripherals:
Pin
#
Pin Name
28
VSS_IO
VSS
VSS
29
VDD_IO
VDD
VDD
30
GPIOB0
GPIOB0, SCLK0, SCL
B0
31
GPIOA4
GPIOA4, PWM4, TA2,
FAULT1
A4
PWM4
FAULT1
32
GPIOA2
GPIOA2, PWM2
A2
PWM2
33
GPIOA3
GPIOA3, PWM3
A3
PWM3
34
VCAP
VCAP
VCAP
35
VDD_IO
VDD
VDD
36
VSS_IO
VSS
VSS
37
GPIOD5
GPIOD5, XTAL, CLKIN
D5
XTAL
CLKIN
38
GPIOD4
GPIOD4, EXTAL
D4
EXTAL
39
GPIOA1
GPIOA1, PWM1
A1
PWM1
40
GPIOA0
GPIOA0, PWM0
A0
PWM0
41
TDI
TDI, GPIOD0
D0
42
GPIOB11
GPIOB11, COUTB_A
B11
43
TMS
TMS, GPIOD3
D3
TMS
44
TDO
TDO, GPIOD1
D1
TDO
Signal Name
GPIO
I2C
SCL
QSCI
QSPI
ADC
PWM
Quad
Timer
Comp
Power &
Ground
JTAG
Misc
SCLK0
TA2
TD1
COUTB_A
56F8025 Data Sheet, Rev. 3
Freescale Semiconductor
Preliminary
19
VDD
Power
Ground
Power
Ground
Other
Supply
Ports
VSS
VDDA
VSSA
VCAP
GPIOD4 (EXTAL)
OSC Port
or GPIO
GPIOD5 (XTAL, CLKIN)
RESET
or GPIOA
RESET (GPIOA7)
GPIOB0 (SCLK0, SCL)
QSPI
or I2C
or PWM
or TMRA
or GPIOB
GPIOB1 (SS0, SDA)
GPIOB2 (MISO0, TA2, PSRC0)
GPIOB3 (MOSI0, TA3, PSRC1)
QSCI
or PWM
or I2C
or TMRA
or QSPI
or GPIOB
GPIOB5 (TA1, FAULT3, CLKIN)
4
2
3
1
1
1
1
56F8025
2
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
TMS (GPIOD3)
GPIOA8 (FAULT1, TA2, CMPAI1)
PWM
or TMRA
or CMP
or GPIOA
GPIOA9 (FAULT2, TA3, CMPBI1)
GPIOA10 (CMPAI2)
GPIOA11 (CMPBI2)
GPIOB10 (CMPAO)
CMP
or GPIOB
GPIOB11 (COUTB_A)
1
GPIOB7 (TXD0, SCL)
TCK (GPIOD2)
GPIOA6 (FAULT0, TA0)
1
1
JTAG/ EOnCE
or GPIOD
GPIOA5 (PWM5, TA3, FAULT2)
1
1
TDO (GPIOD1)
GPIOA4 (PWM4, TA2, FAULT1)
1
GPIOB6 (RXD0, SDA, CLKIN)
TDI (GPIOD0)
GPIOA0-3 (PWM0-3)
1
1
1
1
1
1
1
GPIOC0 (ANA0 & CMPAI3)
GPIOC1 (ANA1)
GPIOC2 (ANA2, VREFHA)
GPIOC3 (ANA3, VREFLA)
ADC
or CMP
or GPIOC
GPIOC4 (ANB0 & CMPBI3)
GPIOC5 (ANB1)
GPIOC6 (ANB2, VREFHA)
GPIOC7 (ANB3, VREFLB)
1
Figure 2-1 56F8025 Signals Identified by Functional Group
56F8025 Data Sheet, Rev. 3
20
Freescale Semiconductor
Preliminary
56F8025 Signal Pins
2.2 56F8025 Signal Pins
After reset, each pin is configured for its primary function (listed first). Any alternate functionality must
be programmed.
Table 2-3 56F8025 Signal and Package Information for the 44-Pin LQFP
Signal
Name
LQFP
Pin No.
Type
State During
Reset
Signal Description
VDD
29
Supply
Supply
I/O Power — This pin supplies 3.3V power to the chip I/O interface.
VDD
35
VSS
17
Supply
Supply
VSS — These pins provide ground for chip logic and I/O drivers.
VSS
28
VSS
36
VDDA
11
Supply
Supply
ADC Power — This pin supplies 3.3V power to the ADC modules. It
must be connected to a clean analog power supply.
VSSA
12
Supply
Supply
ADC Analog Ground — This pin supplies an analog ground to the
ADC modules.
VCAP
18
Supply
Supply
VCAP
34
VCAP — Connect this pin to a 4.7μF or greater bypass capacitor in
order to bypass the core voltage regulator, required for proper chip
operation. See Section 10.2.1.
RESET
21
Input
Input,
internal
pull-up
enabled
Reset — This input is a direct hardware reset on the processor.
When RESET is asserted low, the chip is initialized and placed in the
reset state. A Schmitt trigger input is used for noise immunity. The
internal reset signal will be deasserted synchronous with the internal
clocks after a fixed number of internal clocks.
(GPIOA7)
Input/Open
Drain
Output
Port A GPIO — This GPIO pin can be individually programmed as
an input or open drain output pin. Note that RESET functionality is
disabled in this mode and the chip can only be reset via POR, COP
reset, or software reset.
After reset, the default state is RESET.
Return to Table 2-2
56F8025 Data Sheet, Rev. 3
Freescale Semiconductor
Preliminary
21
Table 2-3 56F8025 Signal and Package Information for the 44-Pin LQFP (Continued)
Signal
Name
LQFP
Pin No.
GPIOA0
40
(PWM0)
Type
Input/
Output
State During
Reset
Input,
internal
pull-up
enabled
Output
Signal Description
Port A GPIO — This GPIO pin can be individually programmed as
an input or output pin.
PWM0 — This is one of the six PWM output pins.
After reset, the default state is GPIOA0.
GPIOA1
39
(PWM1)
Input/
Output
Input,
internal
pull-up
enabled
Output
Port A GPIO — This GPIO pin can be individually programmed as
an input or output pin.
PWM1 — This is one of the six PWM output pins.
After reset, the default state is GPIOA1.
GPIOA2
32
Input/
Output
Input,
internal
pull-up
enabled
Output
(PWM2)
Port A GPIO — This GPIO pin can be individually programmed as
an input or output pin.
PWM2 — This is one of the six PWM output pins.
After reset, the default state is GPIOA2.
GPIOA3
33
(PWM3)
Input/
Output
Output
Input,
internal
pull-up
enabled
Port A GPIO — This GPIO pin can be individually programmed as
an input or output pin.
PWM3 — This is one of the six PWM output pins.
After reset, the default state is GPIOA3.
Return to Table 2-2
56F8025 Data Sheet, Rev. 3
22
Freescale Semiconductor
Preliminary
56F8025 Signal Pins
Table 2-3 56F8025 Signal and Package Information for the 44-Pin LQFP (Continued)
Signal
Name
LQFP
Pin No.
GPIOA4
31
Type
Input/
Output
State During
Reset
Input,
internal
pull-up
enabled
Signal Description
Port A GPIO — This GPIO pin can be individually programmed as
an input or output pin.
(PWM4)
Output
PWM4 — This is one of the six PWM output pins.
(TA21)
Input/
Output
TA2 — Timer A, Channel 2
(FAULT12)
Input
Fault1 — This fault input pin is used for disabling selected PWM
outputs in cases where fault conditions originate off-chip.
After reset, the default state is GPIOA4. The peripheral functionality
is controlled via the SIM. See Section 6.3.16.
1The
2
TA2 signal is also brought out on the GPIOA8-9 and GPIOB2-3 pins.
The Fault1 signal is also brought out on the GPIOA8-9 and GPIOB10 pins.
GPIOA5
27
Input/
Output
Input,
internal
pull-up
enabled
Port A GPIO — This GPIO pin can be individually programmed as
an input or output pin.
(PWM5)
Output
PWM5 — This is one of the six PWM output pins.
(TA33)
Input/
Output
TA3 — Timer A, Channel 3
(FAULT24)
Input
Fault2 — This fault input pin is used for disabling selected PWM
outputs in cases where fault conditions originate off-chip.
After reset, the default state is GPIOA5. The peripheral functionality
is controlled via the SIM. See Section 6.3.16.
3
The TA3 signal is also brought out on the GPIOA8-9 and GPIOB2-3 pins.
4The
Fault2 signal is also brought out on the GPIOA8-9 and GPIOB10 pins.
Return to Table 2-2
56F8025 Data Sheet, Rev. 3
Freescale Semiconductor
Preliminary
23
Table 2-3 56F8025 Signal and Package Information for the 44-Pin LQFP (Continued)
Signal
Name
LQFP
Pin No.
GPIOA6
24
(FAULT0)
Type
Input/
Output
State During
Reset
Input,
internal
pull-up
enabled
Input
Signal Description
Port A GPIO — This GPIO pin can be individually programmed as
an input or output pin.
Fault0 — This fault input pin is used for disabling selected PWM
outputs in cases where fault conditions originate off-chip.
(TA0)
TA0 — Timer A, Channel 0.
After reset, the default state is GPIOA6. The peripheral functionality
is controlled via the SIM. See Section 6.3.16.
GPIOA8
26
Input/
Output
(FAULT1)
Input
(TA2)
Input/
Output
(CMPAI1)
Input
Input,
internal
pull-up
enabled
Port A GPIO — This GPIO pin can be individually programmed as
an input or output pin.
Fault1 — This fault input pin is used for disabling selected PWM
outputs in cases where fault conditions originate off-chip.
TA2 — Timer A, Channel 2.
Comparator A, Input 1 — This is an analog input to Comparator A.
After reset, the default state is GPIOA8. The peripheral functionality
is controlled via the SIM. See Section 6.3.16.
GPIOA9
5
Input/
Output
(FAULT2)
Input
(TA3)
Input/
Output
(CMPBI1)
Input
Input,
internal
pull-up
enabled
Port A GPIO — This GPIO pin can be individually programmed as
an input or output pin.
Fault2 — This fault input pin is used for disabling selected PWM
outputs in cases where fault conditions originate off-chip.
TA2 — Timer A, Channel 3.
Comparator B, Input 1 — This is an analog input to Comparator B.
After reset, the default state is GPIOA9. The peripheral functionality
is controlled via the SIM. See Section 6.3.16.
Return to Table 2-2
56F8025 Data Sheet, Rev. 3
24
Freescale Semiconductor
Preliminary
56F8025 Signal Pins
Table 2-3 56F8025 Signal and Package Information for the 44-Pin LQFP (Continued)
Signal
Name
LQFP
Pin No.
GPIOA10
25
(CMPAI2)
Type
Input/
Output
Input
State During
Reset
Input,
internal
pull-up
enabled
Signal Description
Port A GPIO — This GPIO pin can be individually programmed as
an input or output pin.
Comparator A, Input 2 — This is an analog input to Comparator A.
After reset, the default state is GPIOA10. The peripheral functionality
is controlled via the SIM. See Section 6.3.16.
GPIOA11
6
(CMPBI2)
Input/
Output
Input
Input,
internal
pull-up
enabled
Port A GPIO — This GPIO pin can be individually programmed as
an input or output pin.
Comparator B, Input 2 — This is an analog input to Comparator B.
After reset, the default state is GPIOA11. The peripheral functionality
is controlled via the SIM. See Section 6.3.16.
GPIOB0
30
Input/
Output
Input,
internal
pull-up
enabled
Port B GPIO — This GPIO pin can be individually programmed as
an input or output pin.
(SCLK0)
Input/
Output
QSPI0 Serial Clock — In the master mode, this pin serves as an
output, clocking slaved listeners. In slave mode, this pin serves as
the data clock input. A Schmitt trigger input is used for noise
immunity.
(SCL5)
Input/
Output
Serial Clock — This pin serves as the I2C serial clock.
After reset, the default state is GPIOB0. The peripheral functionality
is controlled via the SIM. See Section 6.3.16.
5The
SCL signal is also brought out on the GPIOB7 pin.
GPIOB1
2
Input/
Output
(SS0)
Input/
Output
(SDA6)
Input
Input,
internal
pull-up
enabled
Port B GPIO — This GPIO pin can be individually programmed as
an input or output pin.
QSPI0 Slave Select — SS is used in slave mode to indicate to the
QSPI0 module that the current transfer is to be received.
Serial Data — This pin serves as the I2C serial data line.
After reset, the default state is GPIOB1. The peripheral functionality
is controlled via the SIM. See Section 6.3.16.
6The
SDA signal is also brought out on the GPIOB6 pin.
56F8025 Data Sheet, Rev. 3
Freescale Semiconductor
Preliminary
25
Table 2-3 56F8025 Signal and Package Information for the 44-Pin LQFP (Continued)
Signal
Name
LQFP
Pin No.
Type
State During
Reset
Signal Description
Return to Table 2-2
GPIOB2
23
Input/
Output
Input,
internal
pull-up
enabled
Port B GPIO — This GPIO pin can be individually programmed as
an input or output pin.
(MISO0)
Input/
Output
QSPI0 Master In/Slave Out — This serial data pin is an input to a
master device and an output from a slave device. The MISO line of a
slave device is placed in the high-impedance state if the slave device
is not selected. The slave device places data on the MISO line a
half-cycle before the clock edge the master device uses to latch the
data.
(TA27)
Input/
Output
TA2 — Timer A, Channel 2
(PSRC0)
Input
PSRC0 — External PWM signal source input for the complementary
PWM4/PWM5 pair.
After reset, the default state is GPIOB2. The peripheral functionality
is controlled via the SIM. See Section 6.3.16.
7The
TA2 signal is also brought out on the GPIOA4 and GPIOA8 pins.
GPIOB3
22
Input/
Output
Input,
internal
pull-up
enabled
Port B GPIO — This GPIO pin can be individually programmed as
an input or output pin.
(MOSI0)
Input/
Output
QSPI0 Master Out/Slave In— This serial data pin is an output from
a master device and an input to a slave device. The master device
places data on the MOSI line a half-cycle before the clock edge the
slave device uses to latch the data.
(TA38)
Input/
Output
TA3 — Timer A, Channel 3
(PSRC1)
Input
PSRC1 — External PWM signal source input for the complementary
PWM2/PWM3 pair.
After reset, the default state is GPIOB3. The peripheral functionality
is controlled via the SIM. See Section 6.3.16.
8The
TA3 signal is also brought out on the GPIOA5 and GPIOA9 pins.
Return to Table 2-2
56F8025 Data Sheet, Rev. 3
26
Freescale Semiconductor
Preliminary
56F8025 Signal Pins
Table 2-3 56F8025 Signal and Package Information for the 44-Pin LQFP (Continued)
Signal
Name
LQFP
Pin No.
GPIOB5
4
Type
Input/
Output
State During
Reset
Input,
internal
pull-up
enabled
Signal Description
Port B GPIO — This GPIO pin can be individually programmed as
an input or output pin.
(TA1)
Input/
Output
(FAULT3)
Input
FAULT3 — This fault input pin is used for disabling selected PWM
outputs in cases where fault conditions originate off-chip.
(CLKIN)
Input
External Clock Input— This pin serves as an external clock input.
TA1 — Timer A, Channel 1
After reset, the default state is GPIOB5. The peripheral functionality
is controlled via the SIM. See Section 6.3.16.
GPIOB6
1
Input/
Output
(RXD0)
Input
(SDA9)
Input/
Output
(CLKIN)
Input
Input,
internal
pull-up
enabled
Port B GPIO — This GPIO pin can be individually programmed as
an input or output pin.
Receive Data 0 — QSCI0 receive data input.
Serial Data — This pin serves as the I2C serial data line.
External Clock Input — This pin serves as an external clock input.
After reset, the default state is GPIOB6. The peripheral functionality
is controlled via the SIM (See Section 6.3.16) and the CLKMODE bit
of the OCCS Oscillator Control Register.
9
The SDA signal is also brought out on the GPIOB1 pin.
GPIOB7
3
Input/
Output
Input,
internal
pull-up
enabled
Port B GPIO — This GPIO pin can be individually programmed as
an input or output pin.
(TXD0)
Input/
Output
Transmit Data 0 — QSCI0 transmit data output or transmit/receive
in single wire operation.
(SCL10)
Input/
Output
Serial Clock — This pin serves as the I2C serial clock.
After reset, the default state is GPIOB7. The peripheral functionality
is controlled via the SIM. See Section 6.3.16.
10
The SCL signal is also brought out on the GPIOB0 pin.
56F8025 Data Sheet, Rev. 3
Freescale Semiconductor
Preliminary
27
Table 2-3 56F8025 Signal and Package Information for the 44-Pin LQFP (Continued)
Signal
Name
LQFP
Pin No.
Type
State During
Reset
Signal Description
Return to Table 2-2
GPIOB10
20
(CMPAO)
Input/
Output
Output
Input,
internal
pull-up
enabled
Port B GPIO — This GPIO pin can be individually programmed as
an input or output pin.
Comparator A Output— This is the output of comparator A.
After reset, the default state is GPIOB10. The peripheral functionality
is controlled via the SIM. See Section 6.3.16.
GPIOB11
42
(COUTB_A)
Input/
Output
Output
Input,
internal
pull-up
enabled
Port B GPIO — This GPIO pin can be individually programmed as
an input or output pin.
Comparator B Output— This is the output of comparator B.
After reset, the default state is GPIOB11. The peripheral functionality
is controlled via the SIM. See Section 6.3.16.
GPIOC0
16
(ANA0 &
CMPAI3)
Input/
Output
Input
Port C GPIO — This GPIO pin can be individually programmed as
an input or output pin.
ANA0 — Analog input to ADC A, Channel 0.
Analog
Input
Comparator A, Input 3 — This is an analog input to Comparator A.
When used as an analog input, the signal goes to both the ANA0
and CMPAI3.
After reset, the default state is GPIOC0.
GPIOC1
15
(ANA1)
Input/
Output
Input
Analog
Input
Port C GPIO — This GPIO pin can be individually programmed as
an input or output pin.
ANA1 — Analog input to ADC A, Channel 1.
After reset, the default state is GPIOC1.
GPIOC2
14
Input/
Output
Input
Port C GPIO — This GPIO pin can be individually programmed as
an input or output pin.
(ANA2)
Analog
Input
ANA2 — Analog input to ADC A, Channel 2.
(VREFHA)
Analog
Input
VREFHA — Analog reference voltage high (ADC A).
After reset, the default state is GPIOC2.
56F8025 Data Sheet, Rev. 3
28
Freescale Semiconductor
Preliminary
56F8025 Signal Pins
Table 2-3 56F8025 Signal and Package Information for the 44-Pin LQFP (Continued)
Signal
Name
LQFP
Pin No.
Type
State During
Reset
Signal Description
Return to Table 2-2
GPIOC3
13
Input/
Output
Input
Port C GPIO — This GPIO pin can be individually programmed as
an input or output pin.
(ANA3)
Analog
Input
ANA3 — Analog input to ADC A, Channel 3.
(VREFLA)
Analog
Input
VREFLA — Analog reference voltage low (ADC A).
After reset, the default state is GPIOC3.
GPIOC4
7
(ANB0 &
CMPBI3)
Input/
Output
Input
Analog
Input
Port C GPIO — This GPIO pin can be individually programmed as
an input or output pin.
ANB0 — Analog input to ADC B, Channel 0.
Comparator B, Input 3 — This is an analog input to Comparator B.
When used as an analog input, the signal goes to both the ANB0
and CMPBI3.
After reset, the default state is GPIOC4.
GPIOC5
8
(ANB1)
Input/
Output
Input
Port C GPIO — This GPIO pin can be individually programmed as
an input or output pin.
ANB1 — Analog input to ADC B, Channel 1.
Analog
Input
After reset, the default state is GPIOC5.
GPIOC6
9
Input/
Output
(ANB2)
Analog
Input
(VREFHB)
Input
Input
Port C GPIO — This GPIO pin can be individually programmed as
an input or output pin.
ANB2 — Analog input to ADC B, Channel 2.
VREFHB — Analog reference voltage high (ADC B).
After reset, the default state is GPIOC6.
Return to Table 2-2
56F8025 Data Sheet, Rev. 3
Freescale Semiconductor
Preliminary
29
Table 2-3 56F8025 Signal and Package Information for the 44-Pin LQFP (Continued)
Signal
Name
LQFP
Pin No.
GPIOC7
10
Type
Input/
Output
(ANB3)
Analog
Input
(VREFLB)
Input
State During
Reset
Input
Signal Description
Port C GPIO — This GPIO pin can be individually programmed as
an input or output pin.
ANB3 — Analog input to ADC B, Channel 3.
VREFLB — Analog reference voltage low (ADC B).
After reset, the default state is GPIOC7.
GPIOD4
38
(EXTAL)
Input/
Output
Input
Analog
Input
Port D GPIO — This GPIO pin can be individually programmed as
an input or output pin.
External Crystal Oscillator Input — This input can be connected to
an 8MHz external crystal. Tie this pin low if XTAL is being driven by
an external clock source.
After reset, the default state is GPIOD4.
GPIOD5
37
Input/
Output
(XTAL)
Analog
Input/
Output
(CLKIN)
Input
Input
Port D GPIO — This GPIO pin can be individually programmed as
an input or output pin.
External Crystal Oscillator Output — This output connects the
internal crystal oscillator output to an external crystal.
External Clock Input — This pin serves as an external clock input.
After reset, the default state is GPIOD5.
TDI
41
(GPIOD0)
Input
Input/
Output
Input,
internal
pull-up
enabled
Test Data Input — This input pin provides a serial input data stream
to the JTAG/EOnCE port. It is sampled on the rising edge of TCK
and has an on-chip pull-up resistor.
Port D GPIO — This GPIO pin can be individually programmed as
an input or output pin.
After reset, the default state is TDI.
Return to Table 2-2
56F8025 Data Sheet, Rev. 3
30
Freescale Semiconductor
Preliminary
56F8025 Signal Pins
Table 2-3 56F8025 Signal and Package Information for the 44-Pin LQFP (Continued)
Signal
Name
LQFP
Pin No.
Type
TDO
44
Output
(GPIOD1)
State During
Reset
Output
tri-stated,
internal
pull-up
enabled
Input/
Output
Signal Description
Test Data Output — This tri-stateable output pin provides a serial
output data stream from the JTAG/EOnCE port. It is driven in the
shift-IR and shift-DR controller states, and changes on the falling
edge of TCK.
Port D GPIO — This GPIO pin can be individually programmed as
an input or output pin.
After reset, the default state is TDO.
TCK
19
(GPIOD2)
Input
Input,
internal
pull-up
enabled
Input/
Output
Test Clock Input — This input pin provides a gated clock to
synchronize the test logic and shift serial data to the JTAG/EOnCE
port. The pin is connected internally to a pull-up resistor. A Schmitt
trigger input is used for noise immunity.
Port D GPIO — This GPIO pin can be individually programmed as
an input or output pin.
After reset, the default state is TCK.
TMS
43
(GPIOD3)
Input
Input/
Output
Input,
internal
pull-up
enabled
Test Mode Select Input — This input pin is used to sequence the
JTAG TAP controller’s state machine. It is sampled on the rising
edge of TCK and has an on-chip pull-up resistor.
Port D GPIO — This GPIO pin can be individually programmed as
an input or output pin.
After reset, the default state is TMS.
Note:
Always tie the TMS pin to VDD through a 2.2K resistor.
Return to Table 2-2
56F8025 Data Sheet, Rev. 3
Freescale Semiconductor
Preliminary
31
Part 3 OCCS
3.1 Overview
The On-Chip Clock Synthesis (OCCS) module allows designers using an internal relaxation oscillator, an
external crystal, or an external clock to run 56F8000 family devices at user-selectable frequencies up to
32MHz. For details, see the OCCS chapter in the 56F802x and 56F803x Peripheral Reference Manual.
3.2 Features
The OCCS module interfaces to the oscillator and PLL and offers these features:
•
•
•
•
•
•
•
•
•
Internal relaxation oscillator
Ability to power down the internal relaxation oscillator or crystal oscillator
Ability to put the internal relaxation oscillator into Standby mode
3-bit postscaler provides control for the PLL output
Ability to power down the PLL
Provides a 2X system clock which operates at twice the system clock to the System Integration Module
(SIM)
Provides a 3X system clock which operates at three times the system clock to PWM and Timer modules
Safety shutdown feature is available if the PLL reference clock is lost
Can be driven from an external clock source
The clock generation module provides the programming interface for the PLL, internal relaxation
oscillator, and crystal oscillator.
3.3 Operating Modes
In 56F8000 family devices, an internal oscillator, an external crystal, or an external clock source can be
used to provide a reference clock to the SIM.
The 2X system clock source output from the OCCS can be described by one of the following equations:
2X system frequency = oscillator frequency
2X system frequency = (oscillator frequency x 8) / (postscaler)
where:
postscaler = 1, 2, 4, 8, 16, or 32
The SIM is responsible for further dividing these frequencies by two, which will insure a 50% duty cycle
in the system clock output.
56F8025 Data Sheet, Rev. 3
32
Freescale Semiconductor
Preliminary
Internal Clock Source
The 56F8000 family devices’ on-chip clock synthesis module has the following registers:
•
•
•
•
•
Control Register (OCCS_CTRL)
Divide-by Register (OCCS_DIVBY)
Status Register (OCCS_STAT)
Shutdown Register (OCCS_SHUTDN)
Oscillator Control Register (OCCS_OCTRL)
For more information on these registers, please refer to the 56F802x and 56F803x Peripheral Reference
Manual.
3.4 Internal Clock Source
An internal relaxation oscillator can supply the reference frequency when an external frequency source or
crystal is not used. It is optimized for accuracy and programmability while providing several power-saving
configurations which accommodate different operating conditions. The internal relaxation oscillator has
very little temperature and voltage variability. To optimize power, the architecture supports a standby state
and a power-down state.
During a boot or reset sequence, the relaxation oscillator is enabled by default (the PRECS bit in the
PLLCR word is set to 0). Application code can then also switch to the external clock source and power
down the internal oscillator, if desired. If a changeover between internal and external clock sources is
required at power-on, the user must ensure that the clock source is not switched until the desired external
clock source is enabled and stable.
To compensate for variances in the device manufacturing process, the accuracy of the relaxation oscillator
can be incrementally adjusted to within + 0.078% of 8MHz by trimming an internal capacitor. Bits 0-9 of
the OSCTL (oscillator control) register allow the user to set in an additional offset (trim) to this preset
value to increase or decrease capacitance. Each unit added or subtracted changes the output frequency by
about 0.078% of 8MHz, allowing incremental adjustment until the desired frequency accuracy is achieved.
The center frequency of the internal oscillator is calibrated at the factory to 8MHz and the TRIM value is
stored in the Flash information block and loaded to the FMOPT1 register at reset. When using the
relaxation oscillator, the boot code should read the FMOPT1 register and set this value as OSCTL TRIM.
For further information, see the 56F802x and 56F803x Peripheral Reference Manual.
3.5 Crystal Oscillator
The internal crystal oscillator circuit is designed to interface with a parallel-resonant crystal resonator in a
frequency range of 4-8MHz, specified for the external crystal. Figure 3-1 shows a typical crystal oscillator
circuit. Follow the crystal supplier’s recommendations when selecting a crystal, since crystal parameters
determine the component values required to provide maximum stability and reliable start-up. The load
capacitance values used in the oscillator circuit design should include all stray layout capacitances. The
crystal and associated components should be mounted as near as possible to the EXTAL and XTAL pins
to minimize output distortion and start-up stabilization time.
56F8025 Data Sheet, Rev. 3
Freescale Semiconductor
Preliminary
33
Crystal Frequency = 4 - 8MHz (optimized for 8MHz)
EXTAL XTAL
Rz
EXTAL XTAL
Rz
Sample External Crystal Parameters:
Rz = 750 KΩ
Note: If the operating temperature range is limited to
below 85oC (105oC junction), then Rz = 10 Meg Ω
CL1
CL2
Figure 3-1 External Crystal Oscillator Circuit
3.6 Ceramic Resonator
The internal crystal oscillator circuit is also designed to interface with a ceramic resonator in the frequency
range of 4-8MHz. Figure 3-2 shows the typical 2- and 3-terminal ceramic resonators and their circuits.
Follow the resonator supplier’s recommendations when selecting a resonator, since their parameters
determine the component values required to provide maximum stability and reliable start up. The load
capacitance values used in the resonator circuit design should include all stray layout capacitances. The
resonator and associated components should be mounted as near as possible to the EXTAL and XTAL pins
to minimize output distortion and start-up stabilization time.
Resonator Frequency = 4 - 8MHz (optimized for 8MHz)
3 Terminal
2 Terminal
EXTAL XTAL
Rz
CL1
CL2
EXTAL XTAL
Rz
C1
Sample External Ceramic Resonator Parameters:
Rz = 750 KΩ
C2
Figure 3-2 External Ceramic Resonator Circuit
3.7 External Clock Input - Crystal Oscillator Option
The recommended method of connecting an external clock is illustrated in Figure 3-3. The external clock
source is connected to XTAL and the EXTAL pin is grounded. The external clock input must be generated
using a relatively low impedance driver.
56F8025 Data Sheet, Rev. 3
34
Freescale Semiconductor
Preliminary
Alternate External Clock Input
56F8025
CLKMODE = 1
XTAL
EXTAL
External
Clock
GND or
GPIO
Figure 3-3 Connecting an External Clock Signal using XTAL
3.8 Alternate External Clock Input
The recommended method of connecting an external clock is illustrated in Figure 3-3. The external clock
source is connected to GPIO6/RXD (primary) or GPIOB5/TA1/FAULT3/XTAL/EXTAL (secondary).
The user has the option of using GPIO6/RXD/CLKIN or GPIOB5/TA1/FAULT3/CLKIN as external
clock input.
56F8025
GPIO
External Clock
Figure 3-4 Connecting an External Clock Signal using GPIO
Part 4 Memory Maps
4.1 Introduction
The 56F8025 device is a 16-bit motor-control chip based on the 56800E core. It uses a Harvard-style
architecture with two independent memory spaces for Data and Program. On-chip RAM is shared by both
spaces and Flash memory is used only in Program space.
This section provides memory maps for:
•
•
Program Address Space, including the Interrupt Vector Table
Data Address Space, including the EOnCE Memory and Peripheral Memory Maps
On-chip memory sizes for the device are summarized in Table 4-1. Flash memories’ restrictions are
identified in the “Use Restrictions” column of Table 4-1.
56F8025 Data Sheet, Rev. 3
Freescale Semiconductor
Preliminary
35
Table 4-1 Chip Memory Configurations
On-Chip Memory
56F8025
Use Restrictions
Program Flash
(PFLASH)
16k x 16
or
32KB
Erase / Program via Flash interface unit and word writes to CDBW
Unified RAM (RAM)
2k x 16
or
4KB
Usable by both the Program and Data memory spaces
4.2 Interrupt Vector Table
Table 4-2 provides the 56F8025’s reset and interrupt priority structure, including on-chip peripherals. The
table is organized with higher-priority vectors at the top and lower-priority interrupts lower in the table.
As indicated, the priority of an interrupt can be assigned to different levels, allowing some control over
interrupt priorities. All level 3 interrupts will be serviced before level 2, and so on. For a selected priority
level, the lowest vector number has the highest priority.
The location of the vector table is determined by the Vector Base Address (VBA). Please see Section 5.6.8
for the reset value of the VBA.
By default, VBA = 0, and the reset address and COP reset address will correspond to vector 0 and 1 of the
interrupt vector table. In these instances, the first two locations in the vector table must contain branch or
JMP instructions. All other entries must contain JSR instructions.
Table 4-2 Interrupt Vector Table Contents1
Peripheral
Vector
Number
Priority
Level
core
Vector Base
Address +
P:$00
core
Interrupt Function
Reserved for Reset Overlay2
P:$02
Reserved for COP Reset Overlay
core
2
3
P:$04
Illegal Instruction
core
3
3
P:$06
SW Interrupt 3
core
4
3
P:$08
HW Stack Overflow
core
5
3
P:$0A
Misaligned Long Word Access
core
6
1-3
P:$0C
EOnCE Step Counter
core
7
1-3
P:$0E
EOnCE Breakpoint Unit
core
8
1-3
P:$10
EOnCE Trace Buffer
core
9
1-3
P:$12
EOnCE Transmit Register Empty
core
10
1-3
P:$14
EOnCE Receive Register Full
core
11
2
P:$16
SW Interrupt 2
core
12
1
P:$18
SW Interrupt 1
core
13
0
P:$1A
SW Interrupt 0
56F8025 Data Sheet, Rev. 3
36
Freescale Semiconductor
Preliminary
Interrupt Vector Table
Table 4-2 Interrupt Vector Table Contents1 (Continued)
Peripheral
Vector
Number
Priority
Level
Vector Base
Address +
14
Interrupt Function
Reserved
LVI
15
1-3
P:$1E
Low-Voltage Detector (Power Sense)
PLL
16
1-3
P:$20
Phase-Locked Loop
FM
17
0-2
P:$22
FM Access Error Interrupt
FM
18
0-2
P:$24
FM Command Complete
FM
19
0-2
P:$26
FM Command, Data, and Address Buffers Empty
20-23
Reserved
GPIOD
24
0-2
P:$30
GPIOD
GPIOC
25
0-2
P:$32
GPIOC
GPIOB
26
0-2
P:$34
GPIOB
GPIOA
27
0-2
P:$36
GPIOA
QSPI0
28
0-2
P:$38
QSPI0 Receiver Full
QSPI0
29
0-2
P:$3A
QSPI0 Transmitter Empty
30-31
Reserved
QSCI0
32
0-2
P:$40
QSCI0 Transmitter Empty
QSCI0
33
0-2
P:$42
QSCI0 Transmitter Idle
QSCI0
34
0-2
P:$44
QSCI0 Receiver Error
QSCI0
35
0-2
P:$46
QSCI0 Receiver Full
I2C
40
0-2
P:$50
I2C Error
I2C
41
0-2
P:$52
I2C General
I2C
42
0-2
P:$54
I2C Receive
I2C
43
0-2
P:$56
I2C Transmit
I2C
44
0-2
P:$58
I2C Status
TMRA
45
0-2
P:$5A
Timer A, Channel 0
TMRA
46
0-2
P:$5C
Timer A, Channel 1
TMRA
47
0-2
P:$5E
Timer A, Channel 2
48
0-2
P:$60
Timer A, Channel 3
36-39
TMRA
Reserved
49-52
Reserved
CMPA
53
0-2
P:$6A
Comparator A
CMPB
54
0-2
P:$6C
Comparator B
PIT0
55
0-2
P:$6E
Interval Timer 0
PIT1
56
0-2
P:$70
Interval Timer 1
PIT2
57
0-2
P:$72
Interval Timer 2
ADC
58
0-2
P:$74
ADC A Conversion Complete
ADC
59
0-2
P:$76
ADC B Conversion Complete
ADC
60
0-2
P:$78
ADC Zero Crossing or Limit Error
PWM
61
0-2
P:$7A
Reload PWM
PWM
62
0-2
P:$7C
PWM Fault
SWILP
63
-1
P:$7E
SW Interrupt Low Priority
56F8025 Data Sheet, Rev. 3
Freescale Semiconductor
Preliminary
37
1. Two words are allocated for each entry in the vector table. This does not allow the full address range to be referenced
from the vector table, providing only 19 bits of address.
2. If the VBA is set to $0000, the first two locations of the vector table will overlay the chip reset addresses since the reset
address would match the base of this vector table.
4.3 Program Map
The Program Memory map is shown in Table 4-3.
Table 4-3 Program Memory Map1 at Reset
Begin/End Address
Memory Allocation
P: $1F FFFF
P: $00 8800
RESERVED
P: $00 87FF
P: $00 8000
On-Chip RAM2
4KB
P: $00 7FFF
P: $00 4000
Internal Program Flash
32KB
Cop Reset Address = $00 4002
Boot Location = $00 4000
P: $00 3FFF
P: $00 0000
RESERVED
1. All addresses are 16-bit Word addresses.
2. This RAM is shared with Data space starting at address X: $00 0000; see Figure 4-1.
4.4 Data Map
Table 4-4 Data Memory Map1
Begin/End Address
Memory Allocation
X:$FF FFFF
X:$FF FF00
EOnCE
256 locations allocated
X:$FF FEFF
X:$01 0000
RESERVED
X:$00 FFFF
X:$00 F000
On-Chip Peripherals
4096 locations allocated
X:$00 EFFF
X:$00 8800
RESERVED
X:$00 87FF
X:$00 8000
RESERVED
X:$00 7FFF
X:$00 0800
RESERVED
X:$00 07FF
X:$00 0000
On-Chip Data RAM2
4KB
56F8025 Data Sheet, Rev. 3
38
Freescale Semiconductor
Preliminary
EOnCE Memory Map
1. All addresses are 16-bit Word addresses.
2. This RAM is shared with Program space starting at P: $00 8000; see Figure 4-1.
Program
Data
EOnCE
Reserved
Reserved
RAM
Peripherals
Reserved
Dual Port RAM
Reserved
Flash
RAM
Figure 4-1 Dual Port RAM
4.5 EOnCE Memory Map
Figure 4-5 lists all EOnCE registers necessary to access or control the EOnCE.
Table 4-5 EOnCE Memory Map
Address
Register Acronym
Register Name
X:$FF FFFF
OTX1 / ORX1
Transmit Register Upper Word
Receive Register Upper Word
X:$FF FFFE
OTX / ORX (32 bits)
Transmit Register
Receive Register
X:$FF FFFD
OTXRXSR
Transmit and Receive Status and Control Register
X:$FF FFFC
OCLSR
Core Lock / Unlock Status Register
X:$FF FFFB - X:$FF FFA1
X:$FF FFA0
Reserved
OCR
Control Register
X:$FF FF9F
X:$FF FF9E
Instruction Step Counter
OSCNTR (24 bits)
Instruction Step Counter
X:$FF FF9D
OSR
Status Register
X:$FF FF9C
OBASE
Peripheral Base Address Register
X:$FF FF9B
OTBCR
Trace Buffer Control Register
X:$FF FF9A
OTBPR
Trace Buffer Pointer Register
X:$FF FF99
Trace Buffer Register Stages
X:$FF FF98
OTB (21 - 24 bits/stage) Trace Buffer Register Stages
X:$FF FF97
Breakpoint Unit Control Register
56F8025 Data Sheet, Rev. 3
Freescale Semiconductor
Preliminary
39
Table 4-5 EOnCE Memory Map (Continued)
Address
X:$FF FF96
Register Acronym
OBCR (24 bits)
Register Name
Breakpoint Unit Control Register
X:$FF FF95
Breakpoint Unit Address Register 1
X:$FF FF94
OBAR1 (24 bits)
Breakpoint Unit Address Register 1
X:$FF FF93
Breakpoint Unit Address Register 2
X:$FF FF92
OBAR2 (32 bits)
Breakpoint Unit Address Register 2
X:$FF FF91
Breakpoint Unit Mask Register 2
X:$FF FF90
OBMSK (32 bits)
Breakpoint Unit Mask Register 2
X:$FF FF8F
Reserved
X:$FF FF8E
OBCNTR
EOnCE Breakpoint Unit Counter
X:$FF FF8D
Reserved
X:$FF FF8C
Reserved
X:$FF FF8B
Reserved
X:$FF FF8A
OESCR
External Signal Control Register
X:$FF FF89 - X:$FF FF00
Reserved
4.6 Peripheral Memory-Mapped Registers
On-chip peripheral registers are part of the data memory map on the 56800E series. These locations may
be accessed with the same addressing modes used for ordinary Data memory, except all peripheral
registers should be read or written using word accesses only.
Table 4-6 summarizes base addresses for the set of peripherals on the 56F8025 device. Peripherals are
listed in order of the base address.
The following tables list all of the peripheral registers required to control or access the peripherals.
Table 4-6 Data Memory Peripheral Base Address Map Summary
Peripheral
Prefix
Base Address
Table Number
X:$00 F000
4-7
Timer A
TMRA
ADC
ADC
X:$00 F080
4-8
PWM
PWM
X:$00 F0C0
4-9
ITCN
ITCN
X:$00 F0E0
4-10
SIM
SIM
X:$00 F100
4-11
COP
COP
X:$00 F120
4-12
CLK, PLL, OSC
OCCS
X:$00 F130
4-13
Power Supervisor
PS
X:$00 F140
4-14
GPIO Port A
GPIOA
X:$00 F150
4-15
GPIO Port B
GPIOB
X:$00 F160
4-16
GPIO Port C
GPIOC
X:$00 F170
4-17
GPIO Port D
GPIOD
X:$00 F180
4-18
56F8025 Data Sheet, Rev. 3
40
Freescale Semiconductor
Preliminary
Peripheral Memory-Mapped Registers
Table 4-6 Data Memory Peripheral Base Address Map Summary (Continued)
Peripheral
Prefix
Base Address
Table Number
PIT 0
PIT0
X:$00 F190
4-19
PIT 1
PIT1
X:$00 F1A0
4-20
PIT 2
PIT2
X:$00 F1B0
4-21
DAC 0
DAC0
X:$00 F1C0
4-22
DAC 1
DAC1
X:$00 F1D0
4-23
Comparator A
CMPA
X:$00 F1E0
4-24
Comparator B
CMPB
X:$00 F1F0
4-25
QSCI 0
SCI0
X:$00 F200
4-26
QSPI 0
SPI0
X:$00 F220
4-27
I2C
I2C
X:$00 F280
4-28
FM
FM
X:$00 F400
4-29
Table 4-7 Quad Timer A Registers Address Map
(TMRA_BASE = $00 F000)
Register Acronym
Address Offset
Register Description
TMRA0_COMP1
$0
Compare Register 1
TMRA0_COMP2
$1
Compare Register 2
TMRA0_CAPT
$2
Capture Register
TMRA0_LOAD
$3
Load Register
TMRA0_HOLD
$4
Hold Register
TMRA0_CNTR
$5
Counter Register
TMRA0_CTRL
$6
Control Register
TMRA0_SCTRL
$7
Status and Control Register
TMRA0_CMPLD1
$8
Comparator Load Register 1
TMRA0_CMPLD2
$9
Comparator Load Register 2
TMRA0_CSCTRL
$A
Comparator Status and Control Register
TMRA0_FILT
$B
Input Filter Register
Reserved
TMRA0_ENBL
$F
Timer Channel Enable Register
TMRA1_COMP1
$10
Compare Register 1
TMRA1_COMP2
$11
Compare Register 2
TMRA1_CAPT
$12
Capture Register
TMRA1_LOAD
$13
Load Register
TMRA1_HOLD
$14
Hold Register
TMRA1_CNTR
$15
Counter Register
TMRA1_CTRL
$16
Control Register
TMRA1_SCTRL
$17
Status and Control Register
TMRA1_CMPLD1
$18
Comparator Load Register 1
56F8025 Data Sheet, Rev. 3
Freescale Semiconductor
Preliminary
41
Table 4-7 Quad Timer A Registers Address Map (Continued)
(TMRA_BASE = $00 F000)
Register Acronym
Address Offset
Register Description
TMRA1_CMPLD2
$19
Comparator Load Register 2
TMRA1_CSCTRL
$1A
Comparator Status and Control Register
TMRA1_FILT
$1B
Input Filter Register
Reserved
TMRA2_COMP1
$20
Compare Register 1
TMRA2_COMP2
$21
Compare Register 2
TMRA2_CAPT
$22
Capture Register
TMRA2_LOAD
$23
Load Register
TMRA2_HOLD
$24
Hold Register
TMRA2_CNTR
$25
Counter Register
TMRA2_CTRL
$26
Control Register
TMRA2_SCTRL
$27
Status and Control Register
TMRA2_CMPLD1
$28
Comparator Load Register 1
TMRA2_CMPLD2
$29
Comparator Load Register 2
TMRA2_CSCTRL
$2A
Comparator Status and Control Register
TMRA2_FILT
$2B
Input Filter Register
Reserved
TMRA3_COMP1
$30
Compare Register 1
TMRA3_COMP2
$31
Compare Register 2
TMRA3_CAPT
$32
Capture Register
TMRA3_LOAD
$33
Load Register
TMRA3_HOLD
$34
Hold Register
TMRA3_CNTR
$35
Counter Register
TMRA3_CTRL
$36
Control Register
TMRA3_SCTRL
$37
Status and Control Register
TMRA3_CMPLD1
$38
Comparator Load Register 1
TMRA3_CMPLD2
$39
Comparator Load Register 2
TMRA3_CSCTRL
$3A
Comparator Status and Control Register
TMRA3_FILT
$3B
Input Filter Register
Reserved
Table 4-8 Analog-to-Digital Converter Registers Address Map
(ADC_BASE = $00 F080)
Register Acronym
Address Offset
Register Description
ADC_CTRL1
$0
Control Register 1
ADC_CTRL2
$1
Control Register 2
ADC_ZXCTRL
$2
Zero Crossing Control Register
56F8025 Data Sheet, Rev. 3
42
Freescale Semiconductor
Preliminary
Peripheral Memory-Mapped Registers
Table 4-8 Analog-to-Digital Converter Registers Address Map (Continued)
(ADC_BASE = $00 F080)
Register Acronym
Address Offset
Register Description
ADC_CLIST 1
$3
Channel List Register 1
ADC_CLIST 2
$4
Channel List Register 2
ADC_CLIST 3
$5
Channel List Register 3
ADC_CLIST 4
$6
Channel List Register 4
ADC_SDIS
$7
Sample Disable Register
ADC_STAT
$8
Status Register
ADC_RDY
$9
Conversion Ready Register
ADC_LIMSTAT
$A
Limit Status Register
ADC_ZXSTAT
$B
Zero Crossing Status Register
ADC_RSLT0
$C
Result Register 0
ADC_RSLT1
$D
Result Register 1
ADC_RSLT2
$E
Result Register 2
ADC_RSLT3
$F
Result Register 3
ADC_RSLT4
$10
Result Register 4
ADC_RSLT5
$11
Result Register 5
ADC_RSLT6
$12
Result Register 6
ADC_RSLT7
$13
Result Register 7
ADC_RSLT8
$14
Result Register 8
ADC_RSLT9
$15
Result Register 9
ADC_RSLT10
$16
Result Register 10
ADC_RSLT11
$17
Result Register 11
ADC_RSLT12
$18
Result Register 12
ADC_RSLT13
$19
Result Register 13
ADC_RSLT14
$1A
Result Register 14
ADC_RSLT15
$1B
Result Register 15
ADC_LOLIM0
$1C
Low Limit Register 0
ADC_LOLIM1
$1D
Low Limit Register 1
ADC_LOLIM2
$1E
Low Limit Register 2
ADC_LOLIM3
$1F
Low Limit Register 3
ADC_LOLIM4
$20
Low Limit Register 4
ADC_LOLIM5
$21
Low Limit Register 5
ADC_LOLIM6
$22
Low Limit Register 6
ADC_LOLIM7
$23
Low Limit Register 7
ADC_HILIM0
$24
High Limit Register 0
ADC_HILIM1
$25
High Limit Register 1
ADC_HILIM2
$26
High Limit Register 2
ADC_HILIM3
$27
High Limit Register 3
56F8025 Data Sheet, Rev. 3
Freescale Semiconductor
Preliminary
43
Table 4-8 Analog-to-Digital Converter Registers Address Map (Continued)
(ADC_BASE = $00 F080)
Register Acronym
Address Offset
Register Description
ADC_HILIM4
$28
High Limit Register 4
ADC_HILIM5
$29
High Limit Register 5
ADC_HILIM6
$2A
High Limit Register 6
ADC_HILIM7
$2B
High Limit Register 7
ADC_OFFST0
$2C
Offset Register 0
ADC_OFFST1
$2D
Offset Register 1
ADC_OFFST2
$2E
Offset Register 2
ADC_OFFST3
$2F
Offset Register 3
ADC_OFFST4
$30
Offset Register 4
ADC_OFFST5
$31
Offset Register 5
ADC_OFFST6
$32
Offset Register 6
ADC_OFFST7
$33
Offset Register 7
ADC_PWR
$34
Power Control Register
ADC_CAL
$35
Calibration Register
Reserved
Table 4-9 Pulse Width Modulator Registers Address Map
(PWM_BASE = $00 F0C0)
Register Acronym
Address Offset
Register Description
PWM_CTRL
$0
Control Register
PWM_FCTRL
$1
Fault Control Register
PWM_FLTACK
$2
Fault Status Acknowledge Register
PWM_OUT
$3
Output Control Register
PWM_CNTR
$4
Counter Register
PWM_CMOD
$5
Counter Modulo Register
PWM_VAL0
$6
Value Register 0
PWM_VAL1
$7
Value Register 1
PWM_VAL2
$8
Value Register 2
PWM_VAL3
$9
Value Register 3
PWM_VAL4
$A
Value Register 4
PWM_VAL5
$B
Value Register 5
PWM_DTIM0
$C
Dead Time Register 0
PWM_DTIM1
$D
Dead Time Register 1
PWM_DMAP1
$E
Disable Mapping Register 1
PWM_DMAP2
$F
Disable Mapping Register 2
PWM_CNFG
$10
Configure Register
56F8025 Data Sheet, Rev. 3
44
Freescale Semiconductor
Preliminary
Peripheral Memory-Mapped Registers
Table 4-9 Pulse Width Modulator Registers Address Map (Continued)
(PWM_BASE = $00 F0C0)
Register Acronym
Address Offset
Register Description
PWM_CCTRL
$11
Channel Control Register
PWM_PORT
$12
Port Register
PWM_ICCTRL
$13
Internal Correction Control Register
PWM_SCTRL
$14
Source Control Register
PWM_SYNC
$15
Synchronization Window Register
PWM_FFILT0
$16
Fault0 Filter Register
PWM_FFILT1
$17
Fault1 Filter Register
PWM_FFILT2
$18
Fault2 Filter Register
PWM_FFILT3
$19
Fault3 Filter Register
Table 4-10 Interrupt Control Registers Address Map
(ITCN_BASE = $00 F0E0)
Register Acronym
Address Offset
Register Description
ITCN_IPR0
$0
Interrupt Priority Register 0
ITCN_IPR1
$1
Interrupt Priority Register 1
ITCN_IPR2
$2
Interrupt Priority Register 2
ITCN_IPR3
$3
Interrupt Priority Register 3
ITCN_IPR4
$4
Interrupt Priority Register 4
ITCN_IPR5
$5
Interrupt Priority Register 5
ITCN_IPR6
$6
Interrupt Priority Register 6
ITCN_VBA
$7
Vector Base Address Register
ITCN_FIM0
$8
Fast Interrupt Match 0 Register
ITCN_FIVAL0
$9
Fast Interrupt Vector Address Low 0 Register
ITCN_FIVAH0
$A
Fast Interrupt Vector Address High 0 Register
ITCN_FIM1
$B
Fast Interrupt Match 1 Register
ITCN_FIVAL1
$C
Fast Interrupt Vector Address Low 1 Register
ITCN_FIVAH1
$D
Fast Interrupt Vector Address High 1 Register
ITCN_IRQP0
$E
IRQ Pending Register 0
ITCN_IRQP1
$F
IRQ Pending Register 1
ITCN_IRQP2
$10
IRQ Pending Register 2
ITCN_IRQP3
$11
IRQ Pending Register 3
ITCN_ICTRL
$16
Reserved
Interrupt Control Register
Reserved
56F8025 Data Sheet, Rev. 3
Freescale Semiconductor
Preliminary
45
Table 4-11 SIM Registers Address Map
(SIM_BASE = $00 F100)
Register Acronym
Address Offset
Register Description
SIM_CTRL
$0
Control Register
SIM_RSTAT
$1
Reset Status Register
SIM_SWC0
$2
Software Control Register 0
SIM_SWC1
$3
Software Control Register 1
SIM_SWC2
$4
Software Control Register 2
SIM_SWC3
$5
Software Control Register 3
SIM_MSHID
$6
Most Significant Half JTAG ID
SIM_LSHID
$7
Least Significant Half JTAG ID
SIM_PWR
$8
Power Control Register
Reserved
SIM_CLKOUT
$A
Clock Out Select Register
SIM_PCR
$B
Peripheral Clock Rate Register
SIM_PCE0
$C
Peripheral Clock Enable Register 0
SIM_PCE1
$D
Peripheral Clock Enable Register 1
SIM_SD0
$E
Peripheral STOP Disable Register 0
SIM_SD1
$F
Peripheral STOP Disable Register 1
SIM_IOSAHI
$10
I/O Short Address Location High Register
SIM_IOSALO
$11
I/O Short Address Location Low Register
SIM_PROT
$12
Protection Register
SIM_GPSA0
$13
GPIO Peripheral Select Register 0 for GPIOA
SIM_GPSA1
$14
GPIO Peripheral Select Register 1 for GPIOA
SIM_GPSB0
$15
GPIO Peripheral Select Register 0 for GPIOB
SIM_GPSB1
$16
GPIO Peripheral Select Register 1 for GPIOB
SIM_GPSCD
$17
GPIO Peripheral Select Register for GPIOC and GPIOD
SIM_IPS0
$18
Internal Peripheral Source Select Register 0 for PWM
SIM_IPS1
$19
Internal Peripheral Source Select Register 1 for DACs
SIM_IPS2
$1A
Internal Peripheral Source Select Register 2 for TMRA
Reserved
Table 4-12 Computer Operating Properly Registers Address Map
(COP_BASE = $00 F120)
Register Acronym
Address Offset
Register Description
COP_CTRL
$0
Control Register
COP_TOUT
$1
Time-Out Register
COP_CNTR
$2
Counter Register
56F8025 Data Sheet, Rev. 3
46
Freescale Semiconductor
Preliminary
Peripheral Memory-Mapped Registers
Table 4-13 Clock Generation Module Registers Address Map
(OCCS_BASE = $00 F130)
Register Acronym
Address Offset
Register Description
OCCS_CTRL
$0
Control Register
OCCS_DIVBY
$1
Divide-By Register
OCCS_STAT
$2
Status Register
Reserved
OCCS_OCTRL
$5
Oscillator Control Register
OCCS_CLKCHK
$6
Clock Check Register
OCCS_PROT
$7
Protection Register
Table 4-14 Power Supervisor Registers Address Map
(PS_BASE = $00 F140)
Register Acronym
Address Offset
Register Description
PS_CTRL
$0
Control Register
PS_STAT
$1
Status Register
Reserved
Table 4-15 GPIOA Registers Address Map
(GPIOA_BASE = $00 F150)
Register Acronym
Address Offset
Register Description
GPIOA_PUPEN
$0
Pull-up Enable Register
GPIOA_DATA
$1
Data Register
GPIOA_DDIR
$2
Data Direction Register
GPIOA_PEREN
$3
Peripheral Enable Register
GPIOA_IASSRT
$4
Interrupt Assert Register
GPIOA_IEN
$5
Interrupt Enable Register
GPIOA_IEPOL
$6
Interrupt Edge Polarity Register
GPIOA_IPEND
$7
Interrupt Pending Register
GPIOA_IEDGE
$8
Interrupt Edge-Sensitive Register
GPIOA_PPOUTM
$9
Push-Pull Output Mode Control Register
GPIOA_RDATA
$A
Raw Data Input Register
GPIOA_DRIVE
$B
Output Drive Strength Control Register
56F8025 Data Sheet, Rev. 3
Freescale Semiconductor
Preliminary
47
Table 4-16 GPIOB Registers Address Map
(GPIOB_BASE = $00 F160)
Register Acronym
Address Offset
Register Description
GPIOB_PUPEN
$0
Pull-up Enable Register
GPIOB_DATA
$1
Data Register
GPIOB_DDIR
$2
Data Direction Register
GPIOB_PEREN
$3
Peripheral Enable Register
GPIOB_IASSRT
$4
Interrupt Assert Register
GPIOB_IEN
$5
Interrupt Enable Register
GPIOB_IEPOL
$6
Interrupt Edge Polarity Register
GPIOB_IPEND
$7
Interrupt Pending Register
GPIOB_IEDGE
$8
Interrupt Edge-Sensitive Register
GPIOB_PPOUTM
$9
Push-Pull Output Mode Control Register
GPIOB_RDATA
$A
Raw Data Input Register
GPIOB_DRIVE
$B
Output Drive Strength Control Register
Table 4-17 GPIOC Registers Address Map
(GPIOC_BASE = $00 F170)
Register Acronym
GPIOC_PUPEN
Address Offset
$0
Register Description
Pull-up Enable Register
GPIOC_DATA
$1
Data Register
GPIOC_DDIR
$2
Data Direction Register
GPIOC_PEREN
$3
Peripheral Enable Register
GPIOC_IASSRT
$4
Interrupt Assert Register
GPIOC_IEN
$5
Interrupt Enable Register
GPIOC_IEPOL
$6
Interrupt Edge Polarity Register
GPIOC_IPEND
$7
Interrupt Pending Register
GPIOC_IEDGE
$8
Interrupt Edge-Sensitive Register
GPIOC_PPOUTM
$9
Push-Pull Output Mode Control Register
GPIOC_RDATA
$A
Raw Data Input Register
GPIOC_DRIVE
$B
Output Drive Strength Control Register
56F8025 Data Sheet, Rev. 3
48
Freescale Semiconductor
Preliminary
Peripheral Memory-Mapped Registers
Table 4-18 GPIOD Registers Address Map
(GPIOD_BASE = $00 F180)
Register Acronym
Address Offset
Register Description
GPIOD_PUPEN
$0
Pull-up Enable Register
GPIOD_DATA
$1
Data Register
GPIOD_DDIR
$2
Data Direction Register
GPIOD_PEREN
$3
Peripheral Enable Register
GPIOD_IASSRT
$4
Interrupt Assert Register
GPIOD_IEN
$5
Interrupt Enable Register
GPIOD_IEPOL
$6
Interrupt Edge Polarity Register
GPIOD_IPEND
$7
Interrupt Pending Register
GPIOD_IEDGE
$8
Interrupt Edge-Sensitive Register
GPIOD_PPOUTM
$9
Push-Pull Output Mode Control Register
GPIOD_RDATA
$A
Raw Data Input Register
GPIOD_DRIVE
$B
Output Drive Strength Control Register
Table 4-19 Programmable Interval Timer 0 Registers Address Map
(PIT0_BASE = $00 F190)
Register Acronym
Address Offset
Register Description
PIT0_CTRL
$0
Control Register
PIT0_MOD
$1
Modulo Register
PIT0_CNTR
$2
Counter Register
Table 4-20 Programmable Interval Timer 1 Registers Address Map
(PIT1_BASE = $00 F1A0)
Register Acronym
Address Offset
Register Description
PIT1_CTRL
$0
Control Register
PIT1_MOD
$1
Modulo Register
PIT1_CNTR
$2
Counter Register
Table 4-21 Programmable Interval Timer 2 Registers Address Map
(PIT2_BASE = $00 F1B0)
Register Acronym
Address Offset
Register Description
PIT2_CTRL
$0
Control Register
PIT2_MOD
$1
Modulo Register
56F8025 Data Sheet, Rev. 3
Freescale Semiconductor
Preliminary
49
Table 4-21 Programmable Interval Timer 2 Registers Address Map (Continued)
(PIT2_BASE = $00 F1B0)
Register Acronym
PIT2_CNTR
Address Offset
$2
Register Description
Counter Register
Table 4-22 Digital-to-Analog Converter 0 Registers Address Map
(DAC0_BASE = $00 F1C0)
Register Acronym
Address Offset
Register Description
DAC0_CTRL
$0
Control Register
DAC0_DATA
$1
Data Register
DAC0_STEP
$2
Step Register
DAC0_MINVAL
$3
Minimum Value Register
DAC0_MAXVAL
$4
Maximum Value Register
Table 4-23 Digital-to-Analog Converter 0 Registers Address Map
(DAC1_BASE = $00 F1D0)
Register Acronym
Address Offset
Register Description
DAC1_CTRL
$0
Control Register
DAC1_DATA
$1
Data Register
DAC1_STEP
$2
Step Register
DAC1_MINVAL
$3
Minimum Value Register
DAC1_MAXVAL
$4
Maximum Value Register
Table 4-24 Comparator A Registers Address Map
(CMPA_BASE = $00 F1E0)
Register Acronym
Address Offset
Register Description
CMPA_CTRL
$0
Control Register
CMPA_STAT
$1
Status Register
CMPA_FILT
$2
Filter Register
Table 4-25 Comparator B Registers Address Map
(CMPB_BASE = $00 F1F0)
Register Acronym
Address Offset
Register Description
CMPB_CTRL
$0
Control Register
CMPB_STAT
$1
Status Register
CMPB_FILT
$2
Filter Register
56F8025 Data Sheet, Rev. 3
50
Freescale Semiconductor
Preliminary
Peripheral Memory-Mapped Registers
Table 4-26 Queued Serial Communication Interface 0 Registers Address Map
(QSCI0_BASE = $00 F200)
Register Acronym
Address Offset
Register Description
QSCI0_RATE
$0
Baud Rate Register
QSCI0_CTRL1
$1
Control Register 1
QSCI0_CTRL2
$2
Control Register 2
QSCI0_STAT
$3
Status Register
QSCI0_DATA
$4
Data Register
Table 4-27 Queued Serial Peripheral Interface 0 Registers Address Map
(QSPI0_BASE = $00 F220)
Register Acronym
QSPI0_SCTRL
Address Offset
Register Description
$0
Status and Control Register
QSPI0_DSCTRL
$1
Data Size and Control Register
QSPI0_DRCV
$2
Data Receive Register
QSPI0_DXMIT
$3
Data Transmit Register
QSPI0_FIFO
$4
FIFO Control Register
QSPI0_DELAY
$5
Delay Register
Table 4-28 I2C Registers Address Map
(I2C_BASE = $00 F280)
Register Acronym
I2C_CTRL
Address Offset
$0
Register Description
Control Register
I2C_TAR
$2
Target Address Register
I2C_SAR
$4
Slave Address Register
I2C_DATA
$8
RX/TX Data Buffer and Command Register
I2C_SSHCNT
$A
Standard Speed Clock SCL High Count Register
I2C_SSLCNT
$C
Standard Speed Clock SCL Low Count Register
I2C_FSHCNT
$E
Fast Speed Clock SCL High Count Register
I2C_FSLCNT
$10
Fast Speed Clock SCL Low Count Register
I2C_ISTAT
$16
Interrupt Status Register
I2C_IMASK
$18
Interrupt Mask Register
I2C_RISTAT
$1A
Raw Interrupt Status Register
I2C_RXFT
$1C
Receive FIFO Threshold Register
I2C_TXFT
$1E
Transmit FIFO Threshold Register
56F8025 Data Sheet, Rev. 3
Freescale Semiconductor
Preliminary
51
Table 4-28 I2C Registers Address Map (Continued)
(I2C_BASE = $00 F280)
Register Acronym
Address Offset
Register Description
I2C_CLRINT
$20
Clear Combined and Individual Interrupts Register
I2C_CLRRXUND
$22
Clear RX_UNDER Interrupt Register
I2C_CLRRXOVR
$24
Clear RX_OVER Interrupt Register
I2C_CLRTXOVR
$26
Clear TX_OVER Interrupt Register
I2C_CLRRDREQ
$28
Clear RD_REQ Interrupt Register
I2C_CLRTXABRT
$2A
Clear TX_ABRT Interrupt Register
I2C_CLRRXDONE
$2C
Clear RX_DONE Interrupt Register
I2C_CLRACT
$2E
Clear Activity Interrupt Register
I2C_CLRSTPDET
$30
Clear STOP_DET Interrupt Register
I2C_CLRSTDET
$32
Clear START_DET Interrupt Register
I2C_CLRGC
$34
Clear GEN_CALL Interrupt Register
I2C_ENBL
$36
Enable Register
I2C_STAT
$38
Status Register
I2C_TXFLR
$3A
Transmit FIFO Level Register
I2C_RXFLR
$3C
Receive FIFO Level Register
I2C_TXABRTSRC
$40
Transmit Abort Status Register
Table 4-29 Flash Module Registers Address Map
(FM_BASE = $00 F400)
Register Acronym
FM_CLKDIV
FM_CNFG
Address Offset
$0
Register Description
Clock Divider Register
$1
Configuration Register
$2
Reserved
FM_SECHI
$3
Security High Half Register
FM_SECLO
$4
Security Low Half Register
$5 - $9
FM_PROT
$10
Protection Register
$11 - $12
FM_USTAT
FM_CMD
User Status Register
$14
Command Register
$18
FM_TSTSIG
Reserved
Data Buffer Register
$19 - $A
FM_IFROPT_1
Reserved
$13
$15 - $17
FM_DATA
Reserved
Reserved
$1B
Information Option Register 1
$1C
Reserved
$1D
Test Array Signature Register
56F8025 Data Sheet, Rev. 3
52
Freescale Semiconductor
Preliminary
Introduction
Part 5 Interrupt Controller (ITCN)
5.1 Introduction
The Interrupt Controller (ITCN) module arbitrates between various interrupt requests (IRQs), to signals
the 56800E core when an interrupt of sufficient priority exists, and to what address to jump in order to
service this interrupt.
5.2 Features
The ITCN module design includes these distinctive features:
•
•
•
•
Programmable priority levels for each IRQ
Two programmable Fast Interrupts
Notification to SIM module to restart clocks out of Wait and Stop modes
Ability to drive initial address on the address bus after reset
For further information, see Table 4-2, Interrupt Vector Table Contents.
5.3 Functional Description
The Interrupt Controller is a slave on the IPBus. It contains registers that allow each of the 64 interrupt
sources to be set to one of four priority levels (excluding certain interrupts that are of fixed priority). Next,
all of the interrupt requests of a given level are priority encoded to determine the lowest numerical value
of the active interrupt requests for that level. Within a given priority level, number 0 is the highest priority
and number 63 is the lowest.
5.3.1
Normal Interrupt Handling
Once the INTC has determined that an interrupt is to be serviced and which interrupt has the highest
priority, an interrupt vector address is generated. Normal interrupt handling concatenates the Vector Base
Address (VBA) and the vector number to determine the vector address, generating an offset into the vector
table for each interrupt.
5.3.2
Interrupt Nesting
Interrupt exceptions may be nested to allow an IRQ of higher priority than the current exception to be
serviced. The 56800E core controls the masking of interrupt priority levels it will accept by setting the I0
and I1 bits in its status register.
56F8025 Data Sheet, Rev. 3
Freescale Semiconductor
Preliminary
53
Table 5-1 Interrupt Mask Bit Definition
SR[9] (I1)
SR[8] (I0)
Exceptions Permitted
Exceptions Masked
0
0
Priorities 0, 1, 2, 3
None
0
1
Priorities 1, 2, 3
Priority 0
1
0
Priorities 2, 3
Priorities 0, 1
1
1
Priority 3
Priorities 0, 1, 2
The IPIC bits of the ICTRL register reflect the state of the priority level being presented to the 56800E
core.
Table 5-2 Interrupt Priority Encoding
5.3.3
IPIC_VALUE[1:0]
Current Interrupt
Priority Level
Required Nested
Exception Priority
00
No interrupt or SWILP
Priorities 0, 1, 2, 3
01
Priority 0
Priorities 1, 2, 3
10
Priority 1
Priorities 2, 3
11
Priority 2 or 3
Priority 3
Fast Interrupt Handling
Fast interrupts are described in the DSP56800E Reference Manual. The interrupt controller recognizes
Fast Interrupts before the core does.
A Fast Interrupt is defined (to the ITCN) by:
1. Setting the priority of the interrupt as level 2, with the appropriate field in the IPR registers
2. Setting the FIMn register to the appropriate vector number
3. Setting the FIVALn and FIVAHn registers with the address of the code for the Fast Interrupt
When an interrupt occurs, its vector number is compared with the FIM0 and FIM1 register values. If a
match occurs, and it is a level 2 interrupt, the ITCN handles it as a Fast Interrupt. The ITCN takes the vector
address from the appropriate FIVALn and FIVAHn registers, instead of generating an address that is an
offset from the VBA.
The core then fetches the instruction from the indicated vector address and if it is not a JSR, the core starts
its Fast Interrupt handling.
56F8025 Data Sheet, Rev. 3
54
Freescale Semiconductor
Preliminary
Block Diagram
5.4 Block Diagram
any0
Priority
Level
INT1
Level 0
64 -> 6
Priority
Encoder
2 -> 4
Decode
6
INT
VAB
CONTROL
any3
Level 3
IACK
SR[9:8]
Priority
Level
INT64
IPIC
64 -> 6
Priority
Encoder
6
PIC_EN
2 -> 4
Decode
Figure 5-1 Interrupt Controller Block Diagram
5.5 Operating Modes
The ITCN module design contains two major modes of operation:
•
•
Functional Mode
The ITCN is in this mode by default.
Wait and Stop Modes
During Wait and Stop modes, the system clocks and the 56800E core are turned off. The ITCN will signal
a pending IRQ to the System Integration Module (SIM) to restart the clocks and service the IRQ. An IRQ
can only wake up the core if the IRQ is enabled prior to entering the Wait or Stop mode.
5.6 Register Descriptions
A register address is the sum of a base address and an address offset. The base address is defined at the
system level and the address offset is defined at the module level.
56F8025 Data Sheet, Rev. 3
Freescale Semiconductor
Preliminary
55
Table 5-3 ITCN Register Summary
(ITCN_BASE = $00 F0E0)
Register
Acronym
Base Address +
Register Name
Section Location
IPR0
$0
Interrupt Priority Register 0
5.6.1
IPR1
$1
Interrupt Priority Register 1
5.6.2
IPR2
$2
Interrupt Priority Register 2
5.6.3
IPR3
$3
Interrupt Priority Register 3
5.6.4
IPR4
$4
Interrupt Priority Register 4
5.6.5
IPR5
$5
Interrupt Priority Register 5
5.6.6
IPR6
$6
Interrupt Priority Register 6
5.6.7
VBA
$7
Vector Base Address Register
5.6.8
FIM0
$8
Fast Interrupt Match 0 Register
5.6.9
FIVAL0
$9
Fast Interrupt 0 Vector Address Low Register
5.6.10
FIVAH0
$A
Fast Interrupt 0 Vector Address High 0 Register
5.6.11
FIM1
$B
Fast Interrupt Match 1 Register
5.6.12
FIVAL1
$C
Fast Interrupt 1 Vector Address Low Register
5.6.13
FIVAH1
$D
Fast Interrupt 1 Vector Address High Register
5.6.14
IRQP0
$E
IRQ Pending Register 0
5.6.15
IRQP1
$F
IRQ Pending Register 1
5.6.16
IRQP2
$10
IRQ Pending Register 2
5.6.17
IRQP3
$11
IRQ Pending Register 3
5.6.18
Reserved
ICTRL
$16
Interrupt Control Register
5.6.19
Reserved
56F8025 Data Sheet, Rev. 3
56
Freescale Semiconductor
Preliminary
Register Descriptions
Add.
Offset
Register
Name
$0
IPR0
$1
IPR1
$2
IPR2
$3
IPR3
$4
IPR4
$5
IPR5
$6
IPR6
$7
VBA
$8
FIM0
$9
FIVAL0
$A
FIVAH0
$B
FIM1
$C
FIVAL1
$D
FIVAH1
$E
IRQP0
$F
IRQP1
$10
IRQP2
$11
IRQP3
15
R
W
R
W
R
W
R
W
R
W
R
W
R
14
13
PLL IPL
12
LVI IPL
GPIOD IPL
QSCI0_XMIT
IPL
I2C_ERR IPL
11
10
0
0
0
0
0
0
0
0
0
0
0
0
0
0
9
8
RX_REG IPL
0
QSPI0_XMIT
IPL
0
6
TX_REG IPL
0
0
0
QSPI0_RCV
IPL
0
0
0
5
4
0
BKPT_U IPL
STPCNT IPL
FM_CBE IPL
FM_CC IPL
FM_ERR IPL
GPIOA IPL
GPIOB IPL
GPIOC IPL
QSCI0_RCV
IPL
QSCI0_RERR
IPL
QSCI0_TIDL
IPL
TMRA_1 IPL
TMRA_0 IPL
I2C_STAT
IPL
I2C_TX IPL
I2C_RX IPL
I2C_GEN IPL
PIT1 IPL
PIT0 IPL
COMPB IPL
COMPA IPL
TMRB_3 IPL
TMRB_2 IPL
TMRB_1 IPL
TMRB_0 IPL
0
0
0
PWM_F IPL
PWM_RL IPL
ADC_ZC IPL
ADCB_CC
IPL
ADCA_CC IPL
PIT2 IPL
0
0
0
0
0
VECTOR_BASE_ADDRESS
0
0
0
R
0
0
0
0
0
FAST INTERRUPT 0
FAST INTERRUPT 0 VECTOR ADDRESS LOW
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
FAST INTERRUPT 0 VECTOR
ADDRESS HIGH
W
FAST INTERRUPT 1
W
R
FAST INTERRUPT 1 VECTOR ADDRESS LOW
W
R
1
TMRA_2 IPL
W
R
2
TRBUF IPL
W
R
3
TMRA_3 IPL
W
R
7
0
0
0
0
0
0
0
0
0
0
0
FAST INTERRUPT 1 VECTOR
ADDRESS HIGH
W
R
1
PENDING[16:2]
W
R
PENDING[32:17]
W
R
PENDING[48:33]
W
R
PENDING[63:49]
W
Reserved
$16
ICTRL
R
INT
IPIC
VAB
W
INT_
DIS
1
1
1
0
0
Reserved
= Reserved
Figure 5-2 ITCN Register Map Summary
56F8025 Data Sheet, Rev. 3
Freescale Semiconductor
Preliminary
57
5.6.1
Interrupt Priority Register 0 (IPR0)
Base + $0
Read
15
14
13
PLL IPL
Write
RESET
0
0
12
11
10
0
0
0
0
LVI IPL
0
0
9
8
RX_REG IPL
0
0
7
6
TX_REG IPL
0
0
5
4
TRBUF IPL
0
0
3
2
BKPT_U IPL
0
0
1
0
STPCNT IPL
0
0
Figure 5-3 Interrupt Priority Register 0 (IPR0)
5.6.1.1
PLL Loss of Reference or Change in Lock Status Interrupt Priority Level
(PLL IPL)—Bits 15–14
This field is used to set the interrupt priority levels for the PLL Loss of Reference or Change in Lock Status
IRQ. This IRQ is limited to priorities 1 through 3. It is disabled by default.
•
•
•
•
00 = IRQ disabled (default)
01 = IRQ is priority level 1
10 = IRQ is priority level 2
11 = IRQ is priority level 3
5.6.1.2
Low Voltage Detector Interrupt Priority Level (LVI IPL)—Bits 13–12
This field is used to set the interrupt priority levels for the Low Voltage Detector IRQ. This IRQ is limited
to priorities 1 through 3 and is disabled by default.
•
•
•
•
00 = IRQ disabled (default)
01 = IRQ is priority level 1
10 = IRQ is priority level 2
11 = IRQ is priority level 3
5.6.1.3
Reserved—Bits 11–10
This bit field is reserved. Each bit must be set to 0.
5.6.1.4
EOnCE Receive Register Full Interrupt Priority Level
(RX_REG IPL)— Bits 9–8
This field is used to set the interrupt priority level for the EOnCE Receive Register Full IRQ. This IRQ is
limited to priorities 1 through 3. It is disabled by default.
•
•
•
•
00 = IRQ disabled (default)
01 = IRQ is priority level 1
10 = IRQ is priority level 2
11 = IRQ is priority level 3
56F8025 Data Sheet, Rev. 3
58
Freescale Semiconductor
Preliminary
Register Descriptions
5.6.1.5
EOnCE Transmit Register Empty Interrupt Priority Level
(TX_REG IPL)— Bits 7–6
This field is used to set the interrupt priority level for the EOnCE Transmit Register Empty IRQ. This IRQ
is limited to priorities 1 through 3. It is disabled by default.
•
•
•
•
00 = IRQ disabled (default)
01 = IRQ is priority level 1
10 = IRQ is priority level 2
11 = IRQ is priority level 3
5.6.1.6
EOnCE Trace Buffer Interrupt Priority Level
(TRBUF IPL)— Bits 5–4
This field is used to set the interrupt priority level for the EOnCE Trace Buffer IRQ. This IRQ is limited
to priorities 1 through 3. It is disabled by default.
•
•
•
•
00 = IRQ disabled (default)
01 = IRQ is priority level 1
10 = IRQ is priority level 2
11 = IRQ is priority level 3
5.6.1.7
EOnCE Breakpoint Unit Interrupt Priority Level
(BKPT_U IPL)— Bits 3–2
This field is used to set the interrupt priority level for the EOnCE Breakpoint Unit IRQ. This IRQ is limited
to priorities 1 through 3. It is disabled by default.
•
•
•
•
00 = IRQ disabled (default)
01 = IRQ is priority level 1
10 = IRQ is priority level 2
11 = IRQ is priority level 3
5.6.1.8
EOnCE Step Counter Interrupt Priority Level
(STPCNT IPL)— Bits 1–0
This field is used to set the interrupt priority level for the EOnCE Step Counter IRQ. This IRQ is limited
to priorities 1 through 3. It is disabled by default.
•
•
•
•
00 = IRQ disabled (default)
01 = IRQ is priority level 1
10 = IRQ is priority level 2
11 = IRQ is priority level 3
56F8025 Data Sheet, Rev. 3
Freescale Semiconductor
Preliminary
59
5.6.2
Interrupt Priority Register 1 (IPR1)
Base + $1
Read
15
14
GPIOD IPL
Write
RESET
0
0
13
12
11
10
9
8
7
6
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
5
4
FM_CBE IPL
0
0
3
2
FM_CC IPL
0
0
1
0
FM_ERR IPL
0
0
Figure 5-4 Interrupt Priority Register 1 (IPR1)
5.6.2.1
GPIOD Interrupt Priority Level (GPIOD IPL)—Bits 15–14
This field is used to set the interrupt priority level for the GPIOD IRQ. This IRQ is limited to priorities 0
through 2. It is disabled by default.
•
•
•
•
00 = IRQ disabled (default)
01 = IRQ is priority level 0
10 = IRQ is priority level 1
11 = IRQ is priority level 2
5.6.2.2
Reserved—Bits 13–6
This bit field is reserved. Each bit must be set to 0.
5.6.2.3
FM Command, Data, Address Buffers Empty Interrupt Priority Level
(FM_CBE IPL)—Bits 5–4
This field is used to set the interrupt priority level for the FM Command, Data Address Buffers Empty
IRQ. This IRQ is limited to priorities 0 through 2. It is disabled by default.
•
•
•
•
00 = IRQ disabled (default)
01 = IRQ is priority level 0
10 = IRQ is priority level 1
11 = IRQ is priority level 2
5.6.2.4
FM Command Complete Interrupt Priority Level (FM_CC IPL)—Bits 3–2
This field is used to set the interrupt priority level for the FM Command Complete IRQ. This IRQ is
limited to priorities 0 through 2. It is disabled by default.
•
•
•
•
00 = IRQ disabled (default)
01 = IRQ is priority level 0
10 = IRQ is priority level 1
11 = IRQ is priority level 2
56F8025 Data Sheet, Rev. 3
60
Freescale Semiconductor
Preliminary
Register Descriptions
5.6.2.5
FM Error Interrupt Priority Level (FM_ERR IPL)—Bits 1–0
This field is used to set the interrupt priority level for the FM Error IRQ. This IRQ is limited to priorities
0 through 2. It is disabled by default.
•
•
•
•
00 = IRQ disabled (default)
01 = IRQ is priority level 0
10 = IRQ is priority level 1
11 = IRQ is priority level 2
5.6.3
Interrupt Priority Register 2 (IPR2)
Base + $2
Read
15
14
QSCI0_XMIT
IPL
Write
RESET
0
0
13
12
11
10
0
0
0
0
0
0
0
0
9
8
QSPI0_XMIT
IPL
0
0
7
6
QSPI0_RCV
IPL
0
0
5
4
GPIOA IPL
0
0
3
2
GPIOB IPL
0
0
1
0
GPIOC IPL
0
0
Figure 5-5 Interrupt Priority Register 2 (IPR2)
5.6.3.1
QSCI 0 Transmitter Empty Interrupt Priority Level (QSCI0_XMIT IPL)—
Bits 15–14
This field is used to set the interrupt priority level for the QSCI0 Transmitter Empty IRQ. This IRQ is
limited to priorities 0 through 2. It is disabled by default.
•
•
•
•
00 = IRQ disabled (default)
01 = IRQ is priority level 0
10 = IRQ is priority level 1
11 = IRQ is priority level 2
5.6.3.2
Reserved—Bits 13–10
This bit field is reserved. Each bit must be set to 0.
5.6.3.3
QSPI 0 Transmitter Empty Interrupt Priority Level (QSPI0_XMIT IPL)—
Bits 9–8
This field is used to set the interrupt priority level for the QSPI0 Transmitter Empty IRQ. This IRQ is
limited to priorities 0 through 2. It is disabled by default.
•
•
•
•
00 = IRQ disabled (default)
01 = IRQ is priority level 0
10 = IRQ is priority level 1
11 = IRQ is priority level 2
56F8025 Data Sheet, Rev. 3
Freescale Semiconductor
Preliminary
61
5.6.3.4
QSPI 0 Receiver Full Interrupt Priority Level (QSPI0_RCV IPL)—Bits 7–6
This field is used to set the interrupt priority level for the QSPI0 Receiver Full IRQ. This IRQ is limited
to priorities 0 through 2. It is disabled by default.
•
•
•
•
00 = IRQ disabled (default)
01 = IRQ is priority level 0
10 = IRQ is priority level 1
11 = IRQ is priority level 2
5.6.3.5
GPIOA Interrupt Priority Level (GPIOA IPL)—Bits 5–4
This field is used to set the interrupt priority level for the GPIOA IRQ. This IRQ is limited to priorities 0
through 2. It is disabled by default.
•
•
•
•
00 = IRQ disabled (default)
01 = IRQ is priority level 0
10 = IRQ is priority level 1
11 = IRQ is priority level 2
5.6.3.6
GPIOB Interrupt Priority Level (GPIOB IPL)—Bits 3–2
This field is used to set the interrupt priority level for the GPIOB IRQ. This IRQ is limited to priorities 0
through 2. It is disabled by default.
•
•
•
•
00 = IRQ disabled (default)
01 = IRQ is priority level 0
10 = IRQ is priority level 1
11 = IRQ is priority level 2
5.6.3.7
GPIOC Interrupt Priority Level (GPIOC IPL)—Bits 1–0
This field is used to set the interrupt priority level for the GPIOC IRQ. This IRQ is limited to priorities 0
through 2. It is disabled by default.
•
•
•
•
5.6.4
00 = IRQ disabled (default)
01 = IRQ is priority level 0
10 = IRQ is priority level 1
11 = IRQ is priority level 2
Interrupt Priority Register 3 (IPR3)
Base + $3
Read
Write
RESET
15
14
I2C_ERR IPL
0
0
13
12
11
10
9
8
7
6
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
5
4
QSCI0_RCV
IPL
0
0
3
2
QSCI0_RERR
IPL
0
0
1
0
QSCI0_TIDL
IPL
0
0
Figure 5-6 Interrupt Priority Register 3 (IPR3)
56F8025 Data Sheet, Rev. 3
62
Freescale Semiconductor
Preliminary
Register Descriptions
5.6.4.1
I2C Error Interrupt Priority Level (I2C_ERR IPL)—Bits 15–14
This field is used to set the interrupt priority level for the I2C Error IRQ. This IRQ is limited to priorities
0 through 2. It is disabled by default.
•
•
•
•
00 = IRQ disabled (default)
01 = IRQ is priority level 0
10 = IRQ is priority level 1
11 = IRQ is priority level 2
5.6.4.2
Reserved—Bits 13–6
This bit field is reserved. Each bit must be set to 0.
5.6.4.3
QSCI 0 Receiver Full Interrupt Priority Level (QSCI0_RCV IPL)—Bits 5–4
This field is used to set the interrupt priority level for the QSCI0 Receiver Full IRQ. This IRQ is limited
to priorities 0 through 2. It is disabled by default.
•
•
•
•
00 = IRQ disabled (default)
01 = IRQ is priority level 0
10 = IRQ is priority level 1
11 = IRQ is priority level 2
5.6.4.4
QSCI 0 Receiver Error Interrupt Priority Level (QSCI0_RERR IPL)—
Bits 3–2
This field is used to set the interrupt priority level for the QSCI0 Receiver Error IRQ. This IRQ is limited
to priorities 0 through 2. It is disabled by default.
•
•
•
•
00 = IRQ disabled (default)
01 = IRQ is priority level 0
10 = IRQ is priority level 1
11 = IRQ is priority level 2
5.6.4.5
QSCI 0 Transmitter Idle Interrupt Priority Level (QSCI0_TIDL IPL)—
Bits 1–0
This field is used to set the interrupt priority level for the QSCI0 Transmitter Idle IRQ. This IRQ is limited
to priorities 0 through 2. It is disabled by default.
•
•
•
•
00 = IRQ disabled (default)
01 = IRQ is priority level 0
10 = IRQ is priority level 1
11 = IRQ is priority level 2
56F8025 Data Sheet, Rev. 3
Freescale Semiconductor
Preliminary
63
5.6.5
Interrupt Priority Register 4 (IPR4)
Base + $4
Read
15
14
TMRA_3 IPL
Write
RESET
0
0
13
12
TMRA_2 IPL
0
0
11
10
TMRA_1 IPL
0
0
9
8
TMRA_0 IPL
0
0
7
6
I2C_STAT IPL
0
0
5
4
I2C_TX IPL
0
0
3
2
I2C_RX IPL
0
0
1
0
I2C_GEN IPL
0
0
Figure 5-7 Interrupt Priority Register 4 (IPR4)
5.6.5.1
Timer A, Channel 3 Interrupt Priority Level (TMRA_3 IPL)—
Bits 15–14
This field is used to set the interrupt priority level for the Timer A, Channel 3 IRQ. This IRQ is limited to
priorities 0 through 2. It is disabled by default.
•
•
•
•
00 = IRQ disabled (default)
01 = IRQ is priority level 0
10 = IRQ is priority level 1
11 = IRQ is priority level 2
5.6.5.2
Timer A, Channel 2 Interrupt Priority Level (TMRA_2 IPL)—
Bits 13–12
This field is used to set the interrupt priority level for the Timer A, Channel 2 IRQ. This IRQ is limited to
priorities 0 through 2. It is disabled by default.
•
•
•
•
00 = IRQ disabled (default)
01 = IRQ is priority level 0
10 = IRQ is priority level 1
11 = IRQ is priority level 2
5.6.5.3
Timer A, Channel 1 Interrupt Priority Level (TMRA_1 IPL)—
Bits 11–10
This field is used to set the interrupt priority level for the Timer A, Channel 1 IRQ. This IRQ is limited to
priorities 0 through 2. It is disabled by default.
•
•
•
•
00 = IRQ disabled (default)
01 = IRQ is priority level 0
10 = IRQ is priority level 1
11 = IRQ is priority level 2
56F8025 Data Sheet, Rev. 3
64
Freescale Semiconductor
Preliminary
Register Descriptions
5.6.5.4
Timer A, Channel 0 Interrupt Priority Level (TMRA_0 IPL)—
Bits 9–8
This field is used to set the interrupt priority level for the Timer A, Channel 0 IRQ. This IRQ is limited to
priorities 0 through 2. It is disabled by default.
•
•
•
•
00 = IRQ disabled (default)
01 = IRQ is priority level 0
10 = IRQ is priority level 1
11 = IRQ is priority level 2
5.6.5.5
I2C Status Interrupt Priority Level (I2C_STAT IPL)—Bits 7–6
This field is used to set the interrupt priority level for the I2C Status IRQ. This IRQ is limited to priorities
0 through 2. It is disabled by default.
•
•
•
•
00 = IRQ disabled (default)
01 = IRQ is priority level 0
10 = IRQ is priority level 1
11 = IRQ is priority level 2
5.6.5.6
I2C Transmit Interrupt Priority Level (I2C_TX IPL)—Bits 5–4
This field is used to set the interrupt priority level for the I2C Transmit IRQ. This IRQ is limited to
priorities 0 through 2. It is disabled by default.
•
•
•
•
00 = IRQ disabled (default)
01 = IRQ is priority level 0
10 = IRQ is priority level 1
11 = IRQ is priority level 2
5.6.5.7
I2C Receive Interrupt Priority Level (I2C_RX IPL)— Bits 3–2
This field is used to set the interrupt priority level for the I2C Receiver IRQ. This IRQ is limited to
priorities 0 through 2. It is disabled by default.
•
•
•
•
00 = IRQ disabled (default)
01 = IRQ is priority level 0
10 = IRQ is priority level 1
11 = IRQ is priority level 2
5.6.5.8
I2C General Call Interrupt Priority Level (I2C_GEN IPL)—Bits 1–0
This field is used to set the interrupt priority level for the I2C General Call IRQ. This IRQ is limited to
priorities 0 through 2. It is disabled by default.
•
•
00 = IRQ disabled (default)
01 = IRQ is priority level 0
56F8025 Data Sheet, Rev. 3
Freescale Semiconductor
Preliminary
65
•
•
10 = IRQ is priority level 1
11 = IRQ is priority level 2
5.6.6
Interrupt Priority Register 5 (IPR5)
Base + $5
Read
Write
RESET
15
14
13
12
PIT1 IPL
PIT0 IPL
0
0
0
0
11
10
COMPB IPL
0
0
9
8
COMPA IPL
0
0
7
6
5
4
3
2
1
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
Figure 5-8 Interrupt Priority Register 5 (IPR6)
5.6.6.1
Programmable Interval Timer 1 Interrupt Priority Level (PIT1 IPL)—
Bits 15–14
This field is used to set the interrupt priority level for the Programmable Interval Timer 1 IRQ. This IRQ
is limited to priorities 0 through 2. It is disabled by default.
•
•
•
•
00 = IRQ disabled (default)
01 = IRQ is priority level 0
10 = IRQ is priority level 1
11 = IRQ is priority level 2
5.6.6.2
Programmable Interval Timer 0 Interrupt Priority Level (PIT0 IPL)—
Bits 13–12
This field is used to set the interrupt priority level for the Programmable Interval Timer 0 IRQ. This IRQ
is limited to priorities 0 through 2. It is disabled by default.
•
•
•
•
00 = IRQ disabled (default)
01 = IRQ is priority level 0
10 = IRQ is priority level 1
11 = IRQ is priority level 2
5.6.6.3
Comparator B Interrupt Priority Level (COMPB IPL)—
Bits 11–10
This field is used to set the interrupt priority level for the Comparator B IRQ. This IRQ is limited to
priorities 0 through 2. It is disabled by default.
•
•
•
•
00 = IRQ disabled (default)
01 = IRQ is priority level 0
10 = IRQ is priority level 1
11 = IRQ is priority level 2
56F8025 Data Sheet, Rev. 3
66
Freescale Semiconductor
Preliminary
Register Descriptions
5.6.6.4
Comparator A Interrupt Priority Level (COMPA IPL)—
Bits 9–8
This field is used to set the interrupt priority level for the Comparator IRQ. This IRQ is limited to priorities
0 through 2. It is disabled by default.
•
•
•
•
00 = IRQ disabled (default)
01 = IRQ is priority level 0
10 = IRQ is priority level 1
11 = IRQ is priority level 2
5.6.6.5
Reserved—Bits 7–0
This bit field is reserved. Each bit must be set to 0.
5.6.7
Interrupt Priority Register 6 (IPR6)
Base + $6
15
14
13
12
Read
0
0
0
0
0
0
0
0
Write
RESET
11
10
PWM_F IPL
0
9
8
PWM_RL IPL
0
0
0
7
6
ADC_ZC IPL
0
0
5
4
ADCB_CC
IPL
0
0
3
2
ADCA_CC
IPL
0
0
1
0
PIT2 IPL
0
0
Figure 5-9 Interrupt Priority Register 6 (IPR6)
5.6.7.1
Reserved—Bits 15–12
This bit field is reserved. Each bit must be set to 0.
5.6.7.2
PWM Fault Interrupt Priority Level (PWM_F IPL)—Bits 11–10
This field is used to set the interrupt priority level for the PWM Fault Interrupt IRQ. This IRQ is limited
to priorities 0 through 2. It is disabled by default.
•
•
•
•
00 = IRQ disabled (default)
01 = IRQ is priority level 0
10 = IRQ is priority level 1
11 = IRQ is priority level 2
5.6.7.3
Reload PWM Interrupt Priority Level (PWM_RL IPL)—Bits 9–8
This field is used to set the interrupt priority level for the Reload PWM Interrupt IRQ. This IRQ is limited
to priorities 0 through 2. It is disabled by default.
•
•
•
•
00 = IRQ disabled (default)
01 = IRQ is priority level 0
10 = IRQ is priority level 1
11 = IRQ is priority level 2
56F8025 Data Sheet, Rev. 3
Freescale Semiconductor
Preliminary
67
5.6.7.4
ADC Zero Crossing Interrupt Priority Level (ADC_ZC IPL)—Bits 7–6
This field is used to set the interrupt priority level for the ADC Zero Crossing IRQ. This IRQ is limited to
priorities 0 through 2. It is disabled by default.
•
•
•
•
00 = IRQ disabled (default)
01 = IRQ is priority level 0
10 = IRQ is priority level 1
11 = IRQ is priority level 2
5.6.7.5
ADC B Conversion Complete Interrupt Priority Level
(ADCB_CC IPL)—Bits 5–4
This field is used to set the interrupt priority level for the ADC B Conversion Complete IRQ. This IRQ is
limited to priorities 0 through 2. It is disabled by default.
•
•
•
•
00 = IRQ disabled (default)
01 = IRQ is priority level 0
10 = IRQ is priority level 1
11 = IRQ is priority level 2
5.6.7.6
ADC A Conversion Complete Interrupt Priority Level
(ADCA_CC IPL)—Bits 3–2
This field is used to set the interrupt priority level for the ADC A Conversion Complete IRQ. This IRQ is
limited to priorities 0 through 2. It is disabled by default.
•
•
•
•
00 = IRQ disabled (default)
01 = IRQ is priority level 0
10 = IRQ is priority level 1
11 = IRQ is priority level 2
5.6.7.7
Programmable Interval Timer 2 Interrupt Priority Level
(PIT2 IPL)—Bits 1–0
This field is used to set the interrupt priority level for the Programmable Interval Timer 2 IRQ. This IRQ
is limited to priorities 0 through 2. It is disabled by default.
•
•
•
•
00 = IRQ disabled (default)
01 = IRQ is priority level 0
10 = IRQ is priority level 1
11 = IRQ is priority level 2
56F8025 Data Sheet, Rev. 3
68
Freescale Semiconductor
Preliminary
Register Descriptions
5.6.8
Vector Base Address Register (VBA)
Base + $7
15
14
Read
0
0
0
0
13
12
11
10
9
7
6
5
4
3
2
1
0
01
0
0
0
0
VECTOR_BASE_ADDRESS
Write
RESET
8
0
0
0
0
0
0
0
0
0
1. The 56F8025 resets to a value of 0 x 0000. This corresponds to reset addresses of 0 x 000000.
Figure 5-10 Vector Base Address Register (VBA)
5.6.8.1
Reserved—Bits 15–14
This bit field is reserved. Each bit must be set to 0.
5.6.8.2
Vector Address Bus (VAB) Bits 13–0
The value in this register is used as the upper 14 bits of the interrupt vector VAB[20:0]. The lower 7 bits
are determined based on the highest priority interrupt and are then appended onto VBA before presenting
the full VAB to the Core.
5.6.9
Fast Interrupt Match 0 Register (FIM0)
Base + $8
15
14
13
12
11
10
9
8
7
6
Read
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
5
4
2
1
0
0
0
FAST INTERRUPT 0
Write
RESET
3
0
0
0
0
Figure 5-11 Fast Interrupt Match 0 Register (FIM0)
5.6.9.1
Reserved—Bits 15–6
This bit field is reserved. Each bit must be set to 0.
5.6.9.2
Fast Interrupt 0 Vector Number (FAST INTERRUPT 0)—Bits 5–0
These values determine which IRQ will be Fast Interrupt 0. Fast Interrupts vector directly to a service
routine based on values in the Fast Interrupt Vector Address registers without having to go to a jump table
first. IRQs used as Fast Interrupts must be set to priority level 2. Unexpected results will occur if a Fast
Interrupt vector is set to any other priority. A Fast Interrupt automatically becomes the highest-priority
level 2 interrupt regardless of its location in the interrupt table prior to being declared as Fast Interrupt.
Fast Interrupt 0 has priority over Fast Interrupt 1. To determine the vector number of each IRQ, refer to
the vector table.
56F8025 Data Sheet, Rev. 3
Freescale Semiconductor
Preliminary
69
5.6.10
Fast Interrupt 0 Vector Address Low Register (FIVAL0)
Base + $9
15
14
13
12
11
Read
10
9
8
7
6
5
4
3
2
1
0
0
0
0
0
0
FAST INTERRUPT 0 VECTOR ADDRESS LOW
Write
RESET
0
0
0
0
0
0
0
0
0
0
0
Figure 5-12 Fast Interrupt 0 Vector Address Low Register (FIVAL0)
5.6.10.1
Fast Interrupt 0 Vector Address Low (FIVAL0)—Bits 15–0
The lower 16 bits of the vector address used for Fast Interrupt 0. This register is combined with FIVAH0
to form the 21-bit vector address for Fast Interrupt 0 defined in the FIM0 register.
5.6.11
Fast Interrupt 0 Vector Address High Register (FIVAH0)
Base + $A
15
14
13
12
11
10
9
8
7
6
5
Read
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
4
2
1
0
FAST INTERRUPT 0 VECTOR
ADDRESS HIGH
Write
RESET
3
0
0
0
0
0
Figure 5-13 Fast Interrupt 0 Vector Address High Register (FIVAH0)
5.6.11.1
Reserved—Bits 15–5
This bit field is reserved. Each bit must be set to 0.
5.6.11.2
Fast Interrupt 0 Vector Address High (FIVAH0)—Bits 4–0
The upper five bits of the vector address used for Fast Interrupt 0. This register is combined with FIVAL0
to form the 21-bit vector address for Fast Interrupt 0 defined in the FIM0 register.
5.6.12
Fast Interrupt 1 Match Register (FIM1)
Base + $B
15
14
13
12
11
10
9
8
7
6
Read
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
5
4
2
1
0
0
0
FAST INTERRUPT 1
Write
RESET
3
0
0
0
0
Figure 5-14 Fast Interrupt 1 Match Register (FIM1)
5.6.12.1
Reserved—Bits 15–6
This bit field is reserved. Each bit must be set to 0.
5.6.12.2
Fast Interrupt 1 Vector Number (FAST INTERRUPT 1)—Bits 5–0
These values determine which IRQ will be Fast Interrupt 1. Fast Interrupts vector directly to a service
routine based on values in the Fast Interrupt Vector Address registers without having to go to a jump table
first. IRQs used as Fast Interrupts must be set to priority level 2. Unexpected results will occur if a Fast
56F8025 Data Sheet, Rev. 3
70
Freescale Semiconductor
Preliminary
Register Descriptions
Interrupt vector is set to any other priority. A Fast Interrupt automatically becomes the highest priority
level 2 interrupt, regardless of its location in the interrupt table prior to being declared as Fast Interrupt.
Fast Interrupt 0 has priority over Fast Interrupt 1. To determine the vector number of each IRQ, refer to
the vector table.
5.6.13
Fast Interrupt 1 Vector Address Low Register (FIVAL1)
Base + $C
15
14
13
12
11
Read
10
9
8
7
6
5
4
3
2
1
0
0
0
0
0
0
FAST INTERRUPT 1 VECTOR ADDRESS LOW
Write
RESET
0
0
0
0
0
0
0
0
0
0
0
Figure 5-15 Fast Interrupt 1 Vector Address Low Register (FIVAL1)
5.6.13.1
Fast Interrupt 1 Vector Address Low (FIVAL1)—Bits 15–0
The lower 16 bits of the vector address used for Fast Interrupt 1. This register is combined with FIVAH1
to form the 21-bit vector address for Fast Interrupt 1 defined in the FIM1 register.
5.6.14
Fast Interrupt 1 Vector Address High (FIVAH1)
Base + $D
15
14
13
12
11
10
9
8
7
6
5
Read
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
4
2
1
0
FAST INTERRUPT 1 VECTOR
ADDRESS HIGH
Write
RESET
3
0
0
0
0
0
Figure 5-16 Fast Interrupt 1 Vector Address High Register (FIVAH1)
5.6.14.1
Reserved—Bits 15–5
This bit field is reserved. Each bit must be set to 0.
5.6.14.2
Fast Interrupt 1 Vector Address High (FIVAH1)—Bits 4–0
The upper five bits of the vector address used for Fast Interrupt 1. This register is combined with FIVAL1
to form the 21-bit vector address for Fast Interrupt 1 defined in the FIM1 register.
5.6.15
IRQ Pending Register 0 (IRQP0)
Base + $E
15
14
13
12
11
10
Read
9
8
7
6
5
4
3
2
1
PENDING[16:2]
0
1
Write
RESET
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
Figure 5-17 IRQ Pending Register 0 (IRQP0)
56F8025 Data Sheet, Rev. 3
Freescale Semiconductor
Preliminary
71
5.6.15.1
IRQ Pending (PENDING)—Bits 16–2
These register bit values represent the pending IRQs for interrupt vector numbers 2 through 16. Ascending
IRQ numbers correspond to ascending bit locations.
•
•
0 = IRQ pending for this vector number
1 = No IRQ pending for this vector number
5.6.15.2
Reserved—Bit 0
This bit field is reserved. It must be set to 1.
5.6.16
IRQ Pending Register 1 (IRQP1)
Base + $F
15
14
13
12
11
10
9
Read
8
7
6
5
4
3
2
1
0
1
1
1
1
1
1
1
PENDING[32:17]
Write
RESET
1
1
1
1
1
1
1
1
1
Figure 5-18 IRQ Pending Register 1 (IRQP1)
5.6.16.1
IRQ Pending (PENDING)—Bits 32–17
These register bit values represent the pending IRQs for interrupt vector numbers 17 through 32.
Ascending IRQ numbers correspond to ascending bit locations.
•
•
0 = IRQ pending for this vector number
1 = No IRQ pending for this vector number
5.6.17
IRQ Pending Register 2 (IRQP2)
Base + $10
15
14
13
12
11
10
9
Read
8
7
6
5
4
3
2
1
0
1
1
1
1
1
1
1
PENDING[48:33]
Write
RESET
1
1
1
1
1
1
1
1
1
Figure 5-19 IRQ Pending Register 2 (IRQP2)
5.6.17.1
IRQ Pending (PENDING)—Bits 48–33
These register bit values represent the pending IRQs for interrupt vector numbers 33 through 48.
Ascending IRQ numbers correspond to ascending bit locations.
•
•
0 = IRQ pending for this vector number
1 = No IRQ pending for this vector number
56F8025 Data Sheet, Rev. 3
72
Freescale Semiconductor
Preliminary
Register Descriptions
5.6.18
IRQ Pending Register 3 (IRQP3)
Base + $11
15
14
13
12
11
10
9
Read
8
7
6
5
4
3
2
1
0
1
1
1
1
1
1
1
PENDING[63:49]
Write
RESET
1
1
1
1
1
1
1
1
1
Figure 5-20 IRQ Pending Register 3 (IRQP3)
5.6.18.1
IRQ Pending (PENDING)—Bits 63–49
These register bit values represent the pending IRQs for interrupt vector numbers 49 through 63.
Ascending IRQ numbers correspond to ascending bit locations.
•
•
0 = IRQ pending for this vector number
1 = No IRQ pending for this vector number
5.6.19
Interrupt Control Register (ICTRL)
$Base + $16
15
Read
INT
14
13
12
11
10
IPIC
9
8
7
6
VAB
Write
RESET
0
0
0
0
0
0
0
0
0
0
5
4
3
2
1
0
INT_
DIS
1
1
1
0
0
0
1
1
1
0
0
Figure 5-21 Interrupt Control Register (ICTRL)
5.6.19.1
Interrupt (INT)—Bit 15
This read-only bit reflects the state of the interrupt to the 56800E core.
•
•
0 = No interrupt is being sent to the 56800E core
1 = An interrupt is being sent to the 56800E core
5.6.19.2
Interrupt Priority Level (IPIC)—Bits 14–13
These read-only bits reflect the state of the new interrupt priority level bits being presented to the 56800E
core. These bits indicate the priority level needed for a new IRQ to interrupt the current interrupt being
sent to the 56800E core. This field is only updated when the 56800E core jumps to a new interrupt service
routine.
Note:
•
•
•
•
Nested interrupts may cause this field to be updated before the original interrupt service routine can
read it.
00 = Required nested exception priority levels are 0, 1, 2, or 3
01 = Required nested exception priority levels are 1, 2, or 3
10 = Required nested exception priority levels are 2 or 3
11 = Required nested exception priority level is 3
56F8025 Data Sheet, Rev. 3
Freescale Semiconductor
Preliminary
73
Table 5-4 Interrupt Priority Encoding
5.6.19.3
IPIC_VALUE[1:0]
Current Interrupt
Priority Level
Required Nested
Exception Priority
00
No interrupt or SWILP
Priorities 0, 1, 2, 3
01
Priority 0
Priorities 1, 2, 3
10
Priority 1
Priorities 2, 3
11
Priority 2 or 3
Priority 3
Vector Number - Vector Address Bus (VAB)—Bits 12–6
This read-only field shows bits [7:1] of the Vector Address Bus used at the time the last IRQ was taken.
In the case of a Fast Interrupt, it shows the lower address bits of the jump address. This field is only updated
when the 56800E core jumps to a new interrupt service routine.
Note:
Nested interrupts may cause this field to be updated before the original interrupt service routine can
read it.
5.6.19.4
Interrupt Disable (INT_DIS)—Bit 5
This bit allows all interrupts to be disabled.
•
•
0 = Normal operation (default)
1 = All interrupts disabled
5.6.19.5
Reserved—Bits 4-2
This bit field is reserved. Each bit must be set to 1.
5.6.19.6
Reserved—Bits 1–0
This bit field is reserved. Each bit must be set to 0.
5.7 Resets
5.7.1
General
Table 5-5 Reset Summary
Reset
Core Reset
Priority
Source
Characteristics
RST
Core reset from the SIM
56F8025 Data Sheet, Rev. 3
74
Freescale Semiconductor
Preliminary
Introduction
5.7.2
Description of Reset Operation
5.7.2.1
Reset Handshake Timing
The ITCN provides the 56800E core with a reset vector address on the VAB pins whenever RESET is
asserted from the SIM. The reset vector will be presented until the second rising clock edge after RESET
is released. The general timing is shown in Figure 5-22.
RES
CLK
VAB
RESET_VECTOR_ADR
PAB
READ_ADR
Figure 5-22 Reset Interface
5.7.3
ITCN After Reset
After reset, all of the ITCN registers are in their default states. This means all interrupts are disabled,
except the core IRQs with fixed priorities:
•
•
•
•
•
•
•
•
Illegal Instruction
SW Interrupt 3
HW Stack Overflow
Misaligned Long Word Access
SW Interrupt 2
SW Interrupt 1
SW Interrupt 0
SW Interrupt LP
These interrupts are enabled at their fixed priority levels.
Part 6 System Integration Module (SIM)
6.1 Introduction
The SIM module is a system catchall for the glue logic that ties together the system-on-chip. It controls
distribution of resets and clocks and provides a number of control features. The System Integration
Module’s functions are discussed in more detail in the following sections.
56F8025 Data Sheet, Rev. 3
Freescale Semiconductor
Preliminary
75
6.2 Features
The SIM has the following features:
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
Chip reset sequencing
Core and peripheral clock control and distribution
Stop/Wait mode control
System status control
Registers containing the JTAG ID of the chip
Controls for programmable peripheral and GPIO connections
Peripheral clocks for TMR and PWM with a high-speed (3X) option
Power-saving clock gating for peripherals
Three power modes (Run, Wait, Stop) to control power utilization
— Stop mode shuts down the 56800E core, system clock, and peripheral clock
— Wait mode shuts down the 56800E core and unnecessary system clock operation
— Run mode supports full device operation
Controls the enable/disable functions of the 56800E core WAIT and STOP instructions with write protection
capability
Controls the enable/disable functions of Large Regulator Standby mode with write protection capability
Permits selected peripherals to run in Stop mode to generate Stop recovery interrupts
Controls for programmable peripheral and GPIO connections
Software chip reset
I/O short address base location control
Peripheral protection control to provide runaway code protection for safety-critical applications
Controls output of internal clock sources to CLKO pin
Four general-purpose software control registers are reset only at power-on
Peripherals Stop mode clocking control
56F8025 Data Sheet, Rev. 3
76
Freescale Semiconductor
Preliminary
Register Descriptions
6.3 Register Descriptions
A write to an address without an associated register is an NOP. A read from an address without an
associated register returns unknown data.
Table 6-1 SIM Registers (SIM_BASE = $00 F100)
Register
Acronym
Base Address +
Register Name
Section
Location
CTRL
$0
Control Register
6.3.1
RSTAT
$1
Reset Status Register
6.3.2
SWC0
$2
Software Control Register 0
6.3.3
SWC1
$3
Software Control Register 1
6.3.3
SWC2
$4
Software Control Register 2
6.3.3
SWC3
$5
Software Control Register 3
6.3.3
MSHID
$6
Most Significant Half of JTAG ID
6.3.4
LSHID
$7
Least Significant Half of JTAG ID
6.3.5
PWR
$8
Power Control Register
6.3.6
Reserved
CLKOUT
$A
CLKO Select Register
6.3.7
PCR
$B
Peripheral Clock Rate Register
6.3.8
PCE0
$C
Peripheral Clock Enable Register 0
6.3.9
PCE1
$D
Peripheral Clock Enable Register 0
6.3.10
SD0
$E
Stop Disable Register 0
6.3.11
SD1
$F
Stop Disable Register 1
6.3.12
IOSAHI
$10
I/O Short Address Location High Register
6.3.13
IOSALO
$11
I/O Short Address Location Low Register
6.3.14
PROT
$12
Protection Register
6.3.15
GPSA0
$13
GPIO Peripheral Select Register 0 for GPIOA
6.3.16
GPSA1
$14
GPIO Peripheral Select Register 1 for GPIOA
6.3.17
GPSB0
$15
GPIO Peripheral Select Register 0 for GPIOB
6.3.18
GPSB1
$16
GPIO Peripheral Select Register 1 for GPIOB
6.3.19
GPSCD
$17
GPIO Peripheral Select Register for GPIOC and GPIOD
6.3.20
IPS0
$18
Internal Peripheral Source Select Register 0 for PWM
6.3.21
IPS1
$19
Internal Peripheral Source Select Register 1 for DACs
6.3.22
IPS2
$1A
Internal Peripheral Source Select Register 2 for Quad Timer A
6.3.23
Reserved
56F8025 Data Sheet, Rev. 3
Freescale Semiconductor
Preliminary
77
Add.
Offset
Address
Acronym
$0
SIM_
CTRL
$1
SIM_
RSTAT
$2
SIM_SWC0
$3
SIM_SWC1
$4
SIM_SWC2
$5
SIM_SWC3
$6
SIM_MSHID
$7
SIM_LSHID
$8
SIM_PWR
R
15
14
13
12
11
10
9
8
7
6
5
4
0
0
0
0
0
0
0
0
0
0
ONCE
EBL0
SW
RST
0
0
0
0
0
0
0
0
0
SWR
W
R
3
2
1
STOP_
DISABLE
COP_ COP_
EXTR
TOR
LOR
0
WAIT_
DISABLE
POR
0
0
W
R
Software Control Data 0
W
R
Software Control Data 1
W
R
Software Control Data 2
W
R
Software Control Data 3
W
R
0
0
0
0
0
0
0
1
1
1
1
1
0
0
1
0
1
0
0
0
0
0
0
0
0
0
0
1
1
1
0
1
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
1
0
0
0
0
0
0
TMRA_
CR
PWM_
CR
I2C_
CR
0
0
0
0
0
0
0
0
CMPB
CMPA
DAC1
DAC0
PIT2
PIT1
PIT0
DAC1_
SD
W
R
W
R
LRSTDBY
W
Reserved
$A
SIM_
CLKOUT
$B
SIM_PCR
$C
SIM_PCE0
$D
SIM_PCE1
$E
SIM_SD0
$F
SIM_SD1
$10
SIM_IOSAHI
$11
SIM_IOSALO
$12
SIM_PROT
$13
SIM_GPSA0
$14
SIM_GPSA1
$15
SIM_GPSB0
$16
SIM_GPSB1
$17
SIM_GPSCD
$18
SIM_IPS0
$19
SIM_IPS1
R
W
R
W
R
W
R
0
W
R
W
R
CMPB_ CMPA_
SD
SD
ADC
0
0
0
0
0
0
0
I2C
0
0
QSCI0
0
0
0
0
0
0
0
0
DAC0_
SD
0
ADC_
SD
0
0
0
I2C_
SD
0
QSPI0
TA1
TA0
QSCI0
_SD
0
QSPI0
_SD
0
PWM_
SD
TA1_
SD
TA0_
SD
PIT1_SD
PIT0_
SD
0
0
0
0
0
0
0
0
TA3_
SD
TA2_
SD
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
GPS_
A11
0
GPS_
A10
ISAL[23:22]
W
ISAL[21:6]
W
R
0
0
0
0
0
0
0
0
GPS_
A6
0
0
0
0
0
0
0
PCEP
W
R
W
R
GPS_A5
GPS_A4
0
0
0
0
0
0
0
W
R
0
GPS_B6
W
R
GPS_B5
0
0
GPS_A9
GPS_A8
0
GPS_
B1
0
GPS_
B0
0
0
0
0
0
GPS_
B11
0
GPS_
B10
0
0
0
0
0
GPS_
B7
0
0
0
GPS_
D5
0
0
0
0
0
0
0
0
0
0
0
0
0
0
IPS0_
FAULT2
0
IPS0_
FAULT1
0
0
0
0
0
0
0
0
0
0
0
W
R
GPS_B2
0
0
W
R
GPS_B3
0
GIPSP
0
W
R
PWM
TA2
PIT2_
SD
R
0
TA3
0
W
R
0
PWM3 PWM2 PWM1 PWM0
W
IPS0_PSRC1
0
IPS1_DSYNC1
IPS0_PSRC0
0
IPS1_DSYNC0
56F8025 Data Sheet, Rev. 3
78
Freescale Semiconductor
Preliminary
Register Descriptions
$1A
SIM_IPS2
R
0
0
0
IPS2_
TA3
W
0
0
0
IPS2_
TA2
0
0
0
IPS2_
TA1
0
0
0
0
Reserved
0
= Read as 0
= Read as 1
1
= Reserved
Figure 6-1 SIM Register Map Summary
6.3.1
SIM Control Register (SIM_CTRL)
Base + $0
15
14
13
12
11
10
9
8
7
6
5
4
Read
0
0
0
0
0
0
0
0
0
0
ONCE
EBL
SW
RST
0
0
0
0
0
0
0
0
0
0
0
0
Write
RESET
3
2
1
0
STOP_
DISABLE
WAIT_
DISABLE
0
0
0
0
Figure 6-2 SIM Control Register (SIM_CTRL)
6.3.1.1
Reserved—Bits 15–6
This bit field is reserved. Each bit must be set to 0.
6.3.1.2
•
•
0 = OnCE clock to 56800E core enabled when core TAP is enabled
1 = OnCE clock to 56800E core is always enabled
Note:
Using default state “0” is recommended.
6.3.1.3
•
•
•
•
6.3.2
Stop Disable (STOP_DISABLE)—Bits 3–2
00 = Stop mode will be entered when the 56800E core executes a STOP instruction
01 = The 56800E STOP instruction will not cause entry into Stop mode
10 = Stop mode will be entered when the 56800E core executes a STOP instruction and the
STOP_DISABLE field is write-protected until the next reset
11 = The 56800E STOP instruction will not cause entry into Stop mode and the STOP_DISABLE field is
write-protected until the next reset
6.3.1.5
•
•
•
Software Reset (SWRST)—Bit 4
Writing 1 to this field will cause the device to reset
Read is zero
6.3.1.4
•
•
•
OnCE Enable (ONCEEBL)—Bit 5
Wait Disable (WAIT_DISABLE)—Bits 1–0
00 = Wait mode will be entered when the 56800E core executes a WAIT instruction
01 = The 56800E WAIT instruction will not cause entry into Wait mode
10 = Wait mode will be entered when the 56800E core executes a WAIT instruction and the
WAIT_DISABLE field is write-protected until the next reset
11 = The 56800E WAIT instruction will not cause entry into Wait mode and the WAIT_DISABLE field is
write-protected until the next reset
SIM Reset Status Register (SIM_RSTAT)
This read-only register is updated upon any system reset and indicates the cause of the most recent reset.
It indicates whether the COP reset vector or regular reset vector (including Power-On Reset, External
56F8025 Data Sheet, Rev. 3
Freescale Semiconductor
Preliminary
79
Reset, Software Reset) in the vector table is used. This register is asynchronously reset during Power-On
Reset and subsequently is synchronously updated based on the precedence level of reset inputs. Only the
most recent reset source will be indicated if multiple resets occur. If multiple reset sources assert
simultaneously, the highest-precedence source will be indicated. The precedence from highest to lowest is
Power-On Reset, External Reset, COP Loss of Reference Reset, COP Time-Out Reset, and Software
Reset. Power-On Reset is always set during a Power-On Reset; however, Power-On Reset will be cleared
and External Reset will be set if the external reset pin is asserted or remains asserted after the Power-On
Reset has deasserted.
Base + $1
Read
15
14
13
12
11
10
9
8
7
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
6
5
COP_
SWR
TOR
4
3
2
1
0
COP_
LOR
EXTR
POR
0
0
0
0
1
0
0
Write
RESET
0
0
Figure 6-3 SIM Reset Status Register (SIM_RSTAT)
6.3.2.1
Reserved—Bits 15–7
This bit field is reserved. Each bit must be set to 0.
6.3.2.2
Software Reset (SWR)—Bit 6
When set, this bit indicates that the previous system reset occurred as a result of a software reset (written
1 to SWRST bit in the SIM_CTRL register).
6.3.2.3
COP Time-Out Reset (COP_TOR)—Bit 5
When set, this bit indicates that the previous system reset was caused by the Computer Operating Properly
(COP) module signaling a COP time-out reset. If COP_TOR is set as code starts executing, the COP reset
vector in the vector table will be used. Otherwise, the normal reset vector is used.
6.3.2.4
COP Loss of Reference Reset (COP_LOR)—Bit 4
When set, this bit indicates that the previous system reset was caused by the Computer Operating Properly
(COP) module signaling a loss of COP reference clock reset. If COP_LOR is set as code starts executing,
the COP reset vector in the vector table will be used. Otherwise, the normal reset vector is used.
6.3.2.5
External Reset (EXTR)—Bit 3
When set, this bit indicates that the previous system reset was caused by an external reset.
6.3.2.6
Power-On Reset (POR)—Bit 2
This bit is set during a Power-On Reset.
6.3.2.7
Reserved—Bits 1–0
This bit field is reserved. Each bit must be set to 0.
56F8025 Data Sheet, Rev. 3
80
Freescale Semiconductor
Preliminary
Register Descriptions
6.3.3
SIM Software Control Registers (SIM_SWC0, SIM_SWC1,
SIM_SWC2, and SIM_SWC3)
These registers are general-purpose registers. They are reset only at power-on, so they can monitor
software execution flow.
Base + $2
15
14
13
12
11
10
Read
9
8
7
6
5
4
3
2
1
0
0
0
0
0
0
0
Software Control Data 0 - 3
Write
RESET
0
0
0
0
0
0
0
0
0
0
Figure 6-4 SIM Software Control Register 0 (SIM_SWC0 - 3)
6.3.3.1
Software Control Register 0 - 3 (FIELD)—Bits 15–0
This register is reset only by the Power-On Reset (POR). It is intended for use by a software developer to
contain data that will be unaffected by the other reset sources (external reset, software reset, and COP
reset).
6.3.4
Most Significant Half of JTAG ID (SIM_MSHID)
This read-only register displays the most significant half of the JTAG ID for the chip. This register reads
$01F2.
Base + $6
15
14
13
12
11
10
9
8
7
6
5
4
3
2
1
0
Read
0
0
0
0
0
0
0
1
1
1
1
1
0
0
1
0
0
0
0
0
0
0
0
1
1
1
1
1
0
0
1
0
Write
RESET
Figure 6-5 Most Significant Half of JTAG ID (SIM_MSHID)
6.3.5
Least Significant Half of JTAG ID (SIM_LSHID)
This read-only register displays the least significant half of the JTAG ID for the chip. This register reads
$801D.
Base + $7
15
14
13
12
11
10
9
8
7
6
5
4
3
2
1
0
Read
1
0
0
0
0
0
0
0
0
0
0
1
1
1
0
1
1
0
0
0
0
0
0
0
0
0
0
1
1
1
0
1
Write
RESET
Figure 6-6 Least Significant Half of JTAG ID (SIM_LSHID)
6.3.6
SIM Power Control Register (SIM_PWR)
This register controls the Standby mode of the large on-chip regulator. The large on-chip regulator derives
56F8025 Data Sheet, Rev. 3
Freescale Semiconductor
Preliminary
81
the core digital logic power supply from the IO power supply. At a system bus frequency of 200kHz, the
large regulator may be put in a reduced-power standby mode without interfering with device operation to
reduce device power consumption. Refer to the overview of power-down modes and the overview of clock
generation for more information on the use of large regulator standby.
Base + $8
15
14
13
12
11
10
9
8
7
6
5
4
3
2
Read
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
1
LRSTDBY
Write
RESET
0
0
0
Figure 6-7 SIM Power Control Register (SIM_PWR)
6.3.6.1
Reserved—Bits 15–2
6.3.6.2
Large Regulator Standby Mode (LRSTDBY)—Bits 1–0
This bit field is reserved. Each bit must be set to 0.
•
•
•
•
00 = Large regulator is in Normal mode
01 = Large regulator is in Standby (reduced-power) mode
10 = Large regulator is in Normal mode and the LRSTDBY field is write-protected until the next reset
11 = Large regulator is in Standby mode and the LRSTDBY field is write-protected until the next reset
6.3.7
Clock Output Select Register (SIM_CLKOUT)
The Clock Output Select register can be used to multiplex out selected clock sources generated inside the
clock generation and SIM modules onto the muxed clock output pins. All functionality is for test purposes
only. Glitches may be produced when the clock is enabled or switched. The delay from the clock source
to the output is unspecified. The observability of the clock output signals at output pads is subject to the
frequency limitations of the associated IO cell.
GPIOA[3:0] can function as GPIO, PWM, or as clock output pins. If GPIOA[3:0] are programmed to
operate as peripheral outputs, then the choice is between PWM and clock outputs. The default state is for
the peripheral function of GPIOA[3:0] to be programmed as PWM (selected by bits [9:6] of the Clock
Output Select register).
See Figure 6-8 for details.
Base + $A
15
14
13
12
11
10
Read
0
0
0
0
0
0
0
0
0
0
0
0
Write
RESET
9
8
PWM3
PWM2
0
0
7
6
PWM1 PWM0
0
0
5
4
3
2
1
0
1
0
0
0
0
0
1
0
0
0
0
0
Figure 6-8 CLKO Select Register (SIM_CLKOUT)
56F8025 Data Sheet, Rev. 3
82
Freescale Semiconductor
Preliminary
Register Descriptions
6.3.7.1
Reserved—Bits 15–10
This bit field is reserved. Each bit must be set to 0.
6.3.7.2
•
•
PWM3—Bit 9
0 = Peripheral output function of GPIOA[3] is defined to be PWM3
1 = Peripheral output function of GPIOA[3] is defined to be the Relaxation Oscillator Clock
6.3.7.3
•
•
PWM2—Bit 8
0 = Peripheral output function of GPIOA[2] is defined to be PWM2
1 = Peripheral output function of GPIOA[2] is defined to be the system clock
6.3.7.4
•
•
PWM1—Bit 7
0 = Peripheral output function of GPIOA[1] is defined to be PWM1
1 = Peripheral output function of GPIOA[1] is defined to be 2X system clock
6.3.7.5
•
•
PWM0—Bit 6
0 = Peripheral output function of GPIOA[0] is defined to be PWM0
1 = Peripheral output function of GPIOA[0] is defined to be 3X system clock
6.3.7.6
Reserved—Bit 5
This bit field is reserved for factory test. It must be set to 1.
6.3.7.7
Reserved—Bits 4–0
This bit field is reserved for factory test. Each bit must be set to 0.
6.3.8
Peripheral Clock Rate Register (SIM_PCR)
By default, all peripherals are clocked at the system clock rate, which has a maximum of 32MHz. Selected
peripherals clocks have the option to be clocked at 3X system clock rate, which has a maximum of 96MHz,
if the PLL output clock is selected as the system clock. If PLL is disabled, the 3X system clock will not be
available. This register is used to enable high-speed clocking for those peripherals that support it.
Note:
Operation is unpredictable if peripheral clocks are reconfigured at runtime, so peripherals should be
disabled before a peripheral clock is reconfigured.
Base + $B
15
Read
0
14
Write
RESET
13
TMRA_ PWM_
CR
CR
0
0
0
12
11
10
9
8
7
6
5
4
3
2
1
0
I2C_
CR
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
Figure 6-9 Peripheral Clock Rate Register (SIM_PCR)
56F8025 Data Sheet, Rev. 3
Freescale Semiconductor
Preliminary
83
6.3.8.1
Reserved—Bits 15
This bit field is reserved. Each bit must be set to 0.
6.3.8.2
Quad Timer A Clock Rate (TMRA_CR)—Bit 14
This bit selects the clock speed for the Quad Timer A module.
•
•
0 = Quad Timer A clock rate equals the system clock rate, to a maximum 32MHz (default)
1 = Quad Timer A clock rate equals 3X system clock rate, to a maximum 96MHz
6.3.8.3
Pulse Width Modulator Clock Rate (PWM_CR)—Bit 13
This bit selects the clock speed for the PWM module.
•
•
0 = PWM module clock rate equals the system clock rate, to a maximum 32MHz (default)
1 = PWM module clock rate equals 3X system clock rate, to a maximum 96MHz
6.3.8.4
Inter-Integrated Circuit Run Clock Rate (I2C_CR)—Bit 12
This bit selects the clock speed for the I2C run clock.
•
0 = I2C module run clock rate equals the system clock rate, to a maximum 32MHz (default)
•
1 = I2C module run clock rate equals 3X system clock rate, to a maximum 96MHz
6.3.8.5
Reserved—Bits 11–0
This bit field is reserved. Each bit must be set to 0.
6.3.9
Peripheral Clock Enable Register 0 (SIM_PCE0)
The Peripheral Clock Enable register enables or disables clocks to the peripherals as a power savings
feature. Significant power savings are achieved by enabling only the peripheral clocks that are in use.
When a peripheral’s clock is disabled, that peripheral is in Stop mode. Accesses made to a module that has
its clock disabled will have no effect. The corresponding peripheral should itself be disabled while its clock
is shut off. IPBus writes are not possible.
Setting the PCE bit does not guarantee that the peripheral’s clock is running. Enabled peripheral clocks
will still become disabled in Stop mode, unless the peripheral’s Stop Disable control in the SDn register
is set to 1.
Base + $C
Read
Write
RESET
15
14
13
12
CMPB
CMPA
DAC1
DAC0
0
0
0
0
11
0
0
10
ADC
0
9
8
7
0
0
0
0
0
0
6
I2C
0
5
0
0
4
QSCI0
0
3
0
2
QSPI0
0
0
1
0
0
0
PWM
0
Figure 6-10 Peripheral Clock Enable Register 0 (SIM_PCE0)
6.3.9.1
•
Comparator B Clock Enable (CMPB)—Bit 15
0 = The clock is not provided to the Comparator B module (the Comparator B module is disabled)
56F8025 Data Sheet, Rev. 3
84
Freescale Semiconductor
Preliminary
Register Descriptions
•
1 = The clock is enabled to the Comparator B module
6.3.9.2
•
•
0 = The clock is not provided to the Comparator A module (the Comparator A module is disabled)
1 = The clock is enabled to the Comparator A module
6.3.9.3
•
•
Digital-to-Analog Clock Enable 1 (DAC1)—Bit 13
0 = The clock is not provided to the DAC1 module (the DAC1 module is disabled)
1 = The clock is enabled to the DAC1 module
6.3.9.4
•
•
Comparator A Clock Enable (CMPA)—Bit 14
Digital-to-Analog Clock Enable 0 (DAC0)—Bit 12
0 = The clock is not provided to the DAC0 module (the DAC0 module is disabled)
1 = The clock is enabled to the DAC0 module
6.3.9.5
Reserved—Bit 11
This bit field is reserved. It must be set to 0.
6.3.9.6
•
•
Analog-to-Digital Converter Clock Enable (ADC)—Bit 10
0 = The clock is not provided to the ADC module (the ADC module is disabled)
1 = The clock is enabled to the ADC module
6.3.9.7
Reserved—Bits 9–7
This bit field is reserved. Each bit must be set to 0.
6.3.9.8
Inter-Integrated Circuit IPBus Clock Enable (I2C)—Bit 6
•
0 = The clock is not provided to the I2C module (the I2C module is disabled)
•
1 = The clock is enabled to the I2C module
6.3.9.9
Reserved—Bit 5
This bit field is reserved. It must be set to 0.
6.3.9.10
•
•
QSCI 0 Clock Enable (QSCI0)—Bit 4
0 = The clock is not provided to the QSCI0 module (the QSCI0 module is disabled)
1 = The clock is enabled to the QSCI0 module
6.3.9.11
Reserved—Bit 3
This bit field is reserved. It must be set to 0.
6.3.9.12
•
•
QSPI 0 Clock Enable (QSPI0)—Bit 2
0 = The clock is not provided to the QSPI0 module (the QSPI0 module is disabled)
1 = The clock is enabled to the QSPI0 module
56F8025 Data Sheet, Rev. 3
Freescale Semiconductor
Preliminary
85
6.3.9.13
Reserved—Bit 1
This bit field is reserved. It must be set to 0.
6.3.9.14
•
•
PWM Clock Enable (PWM)—Bit 0
0 = The clock is not provided to the PWM module (the PWM module is disabled)
1 = The clock is enabled to the PWM module
6.3.10
Peripheral Clock Enable Register 1 (SIM_PCE1)
See Section 6.3.9 for general information about Peripheral Clock Enable registers.
Base + $D
15
Read
0
Write
RESET
0
14
13
12
PIT2
PIT1
PIT0
0
0
0
11
10
9
8
7
6
5
4
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
3
2
1
0
TA3
TA2
TA1
TA0
0
0
0
0
Figure 6-11 Peripheral Clock Enable Register 1 (SIM_PCE1)
6.3.10.1
Reserved—Bit 15
This bit field is reserved. It must be set to 0.
6.3.10.2
•
•
0 = The clock is not provided to the PIT2 module (the PIT2 module is disabled)
1 = The clock is enabled to the PIT2 module
6.3.10.3
•
•
Programmable Interval Timer 1 Clock Enable (PIT1)—Bit 13
0 = The clock is not provided to the PIT1 module (the PIT1 module is disabled)
1 = The clock is enabled to the PIT1 module
6.3.10.4
•
•
Programmable Interval Timer 2 Clock Enable (PIT2)—Bit 14
Programmable Interval Timer 0 Clock Enable (PIT0)—Bit 12
0 = The clock is not provided to the PIT0 module (the PIT0 module is disabled)
1 = The clock is enabled to the PIT0 module
6.3.10.5
Reserved—Bits 11–4
This bit field is reserved. Each bit must be set to 0.
6.3.10.6
•
•
0 = The clock is not provided to the Timer A3 module (the Timer A3 module is disabled)
1 = The clock is enabled to the Timer A3 module
6.3.10.7
•
•
Quad Timer A, Channel 3 Clock Enable (TA3)—Bit 3
Quad Timer A, Channel 2 Clock Enable (TA2)—Bit 2
0 = The clock is not provided to the Timer A2 module (the Timer A2 module is disabled)
1 = The clock is enabled to the Timer A2 module
56F8025 Data Sheet, Rev. 3
86
Freescale Semiconductor
Preliminary
Register Descriptions
6.3.10.8
•
•
0 = The clock is not provided to the Timer A1 module (the Timer A1 module is disabled)
1 = The clock is enabled to the Timer A1 module
6.3.10.9
•
•
Quad Timer A, Channel 1 Clock Enable (TA1)—Bit 1
Quad Timer A, Channel 0 Clock Enable (TA0)—Bit 0
0 = The clock is not provided to the Timer A0 module (the Timer A0 module is disabled)
1 = The clock is enabled to the Timer A0 module
6.3.11
Stop Disable Register 0 (SD0)
By default, peripheral clocks are disabled during Stop mode in order to maximize power savings. This
register will allow an individual peripheral to operate in Stop mode. Since asserting an interrupt causes the
system to return to Run mode, this feature is provided so that selected peripherals can be left operating in
Stop mode for the purpose of generating a wake-up interrupt.
For power-conscious applications, it is recommended that only a minimum set of peripherals be
configured to remain operational during Stop mode.
Peripherals should be put in a non-operating (disabled) configuration prior to entering Stop mode unless
their corresponding Stop Disable control is set to 1. Refer to the 56F802x and 56F803x Peripheral
Reference Manual for further details. Reads and writes cannot be made to a module that has its clock
disabled.
Base + $E
Read
Write
RESET
15
14
13
12
CMPB_ CMPA_ DAC1_ DAC0_
SD
SD
SD
SD
0
0
0
0
11
10
9
8
7
6
5
4
3
2
1
0
0
ADC_
SD
0
0
0
I2C_
SD
0
QSCI0_
SD
0
QSPI0_
SD
0
PWM_
SD
0
0
0
0
0
0
0
0
0
0
0
0
Figure 6-12 Stop Disable Register 0 (SD0)
6.3.11.1
•
•
0 = The clock is disabled during Stop mode
1 = The clock is enabled during Stop mode if the clock to this peripheral is enabled in the SIM_PCE0
register
6.3.11.2
•
•
Comparator A Clock Stop Disable (CMPA_SD)—Bit 14
0 = The clock is disabled during Stop mode
1 = The clock is enabled during Stop mode if the clock to this peripheral is enabled in the SIM_PCE0
register
6.3.11.3
•
•
Comparator B Clock Stop Disable (CMPB_SD)—Bit 15
Digital-to-Analog Converter 1 Clock Stop Disable (DAC1_SD)—Bit 13
0 = The clock is disabled during Stop mode
1 = The clock is enabled during Stop mode if the clock to this peripheral is enabled in the SIM_PCE0
register
56F8025 Data Sheet, Rev. 3
Freescale Semiconductor
Preliminary
87
6.3.11.4
•
•
Digital-to-Analog Converter 0 Clock Stop Disable (DAC0_SD)—Bit 12
0 = The clock is disabled during Stop mode
1 = The clock is enabled during Stop mode if the clock to this peripheral is enabled in the SIM_PCE0
register
6.3.11.5
Reserved—Bit 11
This bit field is reserved. It must be set to 0.
6.3.11.6
•
•
Analog-to-Digital Converter Clock Stop Disable (ADC_SD)—Bit 10
0 = The clock is disabled during Stop mode
1 = The clock is enabled during Stop mode if the clock to this peripheral is enabled in the SIM_PCE0
register
6.3.11.7
Reserved—Bits 9–7
This bit field is reserved. Each bit must be set to 0.
6.3.11.8
•
•
Inter-Integrated Circuit Clock Stop Disable (I2C_SD)—Bit 6
0 = The clock is disabled during Stop mode
1 = The clock is enabled during Stop mode if the clock to this peripheral is enabled in the SIM_PCE0
register
6.3.11.9
Reserved—Bit 5
This bit field is reserved. It must be set to 0.
6.3.11.10 QSCI0 Clock Stop Disable (QSCI0_SD)—Bit 4
•
•
0 = The clock is disabled during Stop mode
1 = The clock is enabled during Stop mode if the clock to this peripheral is enabled in the SIM_PCE0
register
6.3.11.11 Reserved—Bit 3
This bit field is reserved. It must be set to 0.
6.3.11.12 QSPI0 Clock Stop Disable (QSPI0_SD)—Bit 2
Each bit controls clocks to the indicated peripheral.
•
•
0 = The clock is disabled during Stop mode
1 = The clock is enabled during Stop mode if the clock to this peripheral is enabled in the SIM_PCE0
register
6.3.11.13 Reserved—Bit 1
This bit field is reserved. It must be set to 0.
56F8025 Data Sheet, Rev. 3
88
Freescale Semiconductor
Preliminary
Register Descriptions
6.3.11.14 PWM Clock Stop Disable (PWM_SD)—Bit 0
•
•
0 = The clock is disabled during Stop mode
1 = The clock is enabled during Stop mode if the clock to this peripheral is enabled in the SIM_PCE0
register
6.3.12
Stop Disable Register 1 (SD1)
See Section 6.3.11 for general information about Stop Disable Registers.
Base + $F
15
Read
0
PIT2_
SD
0
0
Write
RESET
14
13
12
11
10
9
8
7
6
5
4
3
2
1
0
PIT1_
SD
PIT0_
SD
0
0
0
0
0
0
0
0
TA3_
SD
TA2_
SD
TA1_
SD
TA0_
SD
0
0
0
0
0
0
0
0
0
0
0
0
0
0
Figure 6-13 Stop Disable Register 1 (SD1)
6.3.12.1
Reserved—Bit 15
This bit field is reserved. It must be set to 0.
6.3.12.2
•
•
0 = The clock is disabled during Stop mode
1 = The clock is enabled during Stop mode if the clock to this peripheral is enabled in the SIM_PCE1
register
6.3.12.3
•
•
Programmable Interval Timer 1 Clock Stop Disable (PIT1_SD)—Bit 13
0 = The clock is disabled during Stop mode
1 = The clock is enabled during Stop mode if the clock to this peripheral is enabled in the SIM_PCE1
register
6.3.12.4
•
•
Programmable Interval Timer 2 Clock Stop Disable (PIT2_SD)—Bit 14
Programmable Interval Timer 0 Clock Stop Disable (PIT0_SD)—Bit 12
0 = The clock is disabled during Stop mode
1 = The clock is enabled during Stop mode if the clock to this peripheral is enabled in the SIM_PCE1
register
6.3.12.5
Reserved—Bits 11–4
This bit field is reserved. Each bit must be set to 0.
6.3.12.6
•
•
Quad Timer A, Channel 3 Clock Stop Disable (TA3_SD)—Bit 3
0 = The clock is disabled during Stop mode
1 = The clock is enabled during Stop mode if the clock to this peripheral is enabled in the SIM_PCE1
register
56F8025 Data Sheet, Rev. 3
Freescale Semiconductor
Preliminary
89
6.3.12.7
•
•
0 = The clock is disabled during Stop mode
1 = The clock is enabled during Stop mode if the clock to this peripheral is enabled in the SIM_PCE1
register
6.3.12.8
•
•
Quad Timer A, Channel 1 Clock Stop Disable (TA1_SD)—Bit 1
0 = The clock is disabled during Stop mode
1 = The clock is enabled during Stop mode if the clock to this peripheral is enabled in the SIM_PCE1
register
6.3.12.9
•
•
Quad Timer A, Channel 2 Clock Stop Disable (TA2_SD)—Bit 2
Quad Timer A, Channel 0 Clock Stop Disable (TA0_SD)—Bit 0
0 = The clock is disabled during Stop mode
1 = The clock is enabled during Stop mode if the clock to this peripheral is enabled in the SIM_PCE1
register
6.3.13
I/O Short Address Location Register High (SIM_IOSAHI)
In I/O short address mode, the instruction specifies only 6 LSBs of the effective address; the upper 18 bits
are “hard coded” to a specific area of memory. This scheme allows efficient access to a 64-location area
in peripheral space with single word instruction. Short address location registers specify the upper 18 bits
of I/O address, which are “hard coded”. These registers allow access to peripherals using I/O short address
mode, regardless of the physical location of the peripheral, as shown in Figure 6-14.
“Hard Coded” Address Portion
Instruction Portion
6 Bits from I/O Short Address Mode Instruction
16 Bits from SIM_IOSALO Register
2 bits from SIM_IOSAHI Register
Full 24-Bit for Short I/O Address
Figure 6-14 I/O Short Address Determination
With this register set, software can set the SIM_IOSAHI and SIM_IOSALO registers to point to its
peripheral registers and then use the I/O short addressing mode to access them.
Note:
The default value of this register set points to the EOnCE registers.
56F8025 Data Sheet, Rev. 3
90
Freescale Semiconductor
Preliminary
Register Descriptions
Note:
The pipeline delay between setting this register set and using short I/O addressing with the new value
is five instruction cycles.
Base + $10
15
14
13
12
11
10
9
8
7
6
5
4
3
2
Read
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
Write
RESET
1
0
ISAL[23:22]
1
1
Figure 6-15 I/O Short Address Location High Register (SIM_IOSAHI)
6.3.13.1
Reserved—Bits 15—2
This bit field is reserved. Each bit must be set to 0.
6.3.13.2
Input/Output Short Address Location (ISAL[23:22])—Bits 1–0
This field represents the upper two address bits of the “hard coded” I/O short address.
6.3.14
I/O Short Address Location Register Low (SIM_IOSALO)
See Section 6.3.13 for general information about I/O short address location registers.
Base + $11
15
14
13
12
11
10
9
Read
8
7
6
5
4
3
2
1
0
1
1
1
1
1
1
1
ISAL[21:6]
Write
RESET
1
1
1
1
1
1
1
1
1
Figure 6-16 I/O Short Address Location Low Register (SIM_IOSALO)
6.3.14.1
Input/Output Short Address Location (ISAL[21:6])—Bits 15–0
This field represents the lower 16 address bits of the “hard coded” I/O short address.
6.3.15
Protection Register (SIM_PROT)
This register provides write protection of selected control fields for safety-critical applications. The
primary purpose is to prevent unsafe conditions due to the unintentional modification of these fields
between the onset of a code runaway and a reset by the COP watchdog. The GPIO and Internal Peripheral
Select Protection (GIPSP) field protects the contents of registers in the SIM and GPIO modules that control
inter-peripheral signal muxing and GPIO configuration. The Peripheral Clock Enable Protection (PCEP)
field protects the SIM registers’ contents, which contain peripheral clock controls. Some peripherals
provide additional safety features. Refer to the 56F802x and 56F803x Peripheral Reference Manual for
details.
Flexibility is provided so that write protection control values may themselves be optionally locked
(write-protected). Protection controls in this register have two bit values which determine the setting of the
control and whether the value is locked. While a protection control remains unlocked, protection can be
56F8025 Data Sheet, Rev. 3
Freescale Semiconductor
Preliminary
91
disabled and re-enabled by software. Once a protection control is locked, its value can only be altered by
a chip reset, which restores its default non-locked value.
Base + $12
15
14
13
12
11
10
9
8
7
6
5
4
Read
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
3
1
PCEP
Write
RESET
2
0
0
GIPSP
0
0
0
Figure 6-17 Protection Register (SIM_PROT)
6.3.15.1
Reserved—Bits 15–4
This bit field is reserved. Each bit must be set to 0.
6.3.15.2
Peripheral Clock Enable Protection (PCEP)—Bits 3–2
These bits enable write protection of all fields in the PCEn, SDn, and PCR registers in the SIM module.
•
•
•
•
00 = Write protection off (default)
01 = Write protection on
10 = Write protection off and locked until chip reset
11 = Write protection on and locked until chip reset
6.3.15.3
GPIO and Internal Peripheral Select Protection (GIPSP)—Bits 1–0
These bits enable write protection of GPSn and IPSn registers in the SIM module and write protect all
GPIOx_PEREN, GPIOx_PPOUTM and GPIOx_DRIVE registers in GPIO modules.
•
•
•
•
00 = Write protection off (default)
01 = Write protection on
10 = Write protection off and locked until chip reset
11 = Write protection on and locked until chip reset
Note:
The PWM fields in the CLKOUT register are also write protected by GIPSP. They are reserved for
in-house test only.
6.3.16
SIM GPIO Peripheral Select Register 0 for GPIOA (SIM_GPSA0)
Most I/O pins have an associated GPIO function. In addition to the GPIO function, I/O can be configured
to be one of several peripheral functions. The GPIOx_PEREN register within the GPIO module controls
the selection between peripheral or GPIO control of the I/O pins. The GPIO function is selected when the
GPIOx_PEREN bit for the I/O is 0. When the GPIOx_PEREN bit of the GPIO is 1, the fields in the GPSn
registers select which peripheral function has control of the I/O. Figure 6-18 illustrates the output path to
an I/O pin when an I/O has two peripheral functions. Similar muxing is required on peripheral function
inputs to receive input from the properly selected I/O pin.
56F8025 Data Sheet, Rev. 3
92
Freescale Semiconductor
Preliminary
Register Descriptions
GPIOA6_PEREN
Register
SIM_GPSA0
Register
PWM
FAULT0
0
Timer A0
1
GPIOA6
0
GPIOA6 pin
1
Figure 6-18 Overall Control of Signal Source Using SIM_GPSnn Control
In some cases, the user can choose peripheral function between several I/O, each of which have the option
to be programmed to control a specific peripheral function. If the user wishes to use that function, only one
of these I/O must be configured to control that peripheral function. If more than one I/O is configured to
control the peripheral function, the peripheral output signal will fan out to each I/O, but the peripheral input
signal will be the logical OR and AND of all the I/O signals.
Complete lists of I/O muxings are provided in Table 2-3.
The GPSn setting can be altered during normal operation, but a delay must be inserted between the time
when one function is disabled and another function is enabled.
Note:
After reset, all I/O pins are GPIO, except the JTAG pins and the RESET pin.
Base + $13
15
14
13
Read
0
0
0
0
0
0
Write
RESET
12
GPS_A6
0
11
10
9
8
GPS_A5
GPS_A4
0
0
0
0
7
6
5
4
3
2
1
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
Figure 6-19 GPIO Peripheral Select Register 0 for GPIOA (SIM_GPSA0)
6.3.16.1
Reserved—Bits 15–13
This bit field is reserved. Each bit must be set to 0.
6.3.16.2
Configure GPIOA6 (GPS_A6)—Bit 12
This field selects the alternate function for GPIOA6.
•
•
0 = FAULT0 - PWM FAULT0 Input (default)
1 = TA0 - Timer A0
6.3.16.3
Configure GPIOA5 (GPS_A5)—Bits 11–10
This field selects the alternate function for GPIOA5.
•
00 = PWM5 - PWM5 (default)
56F8025 Data Sheet, Rev. 3
Freescale Semiconductor
Preliminary
93
•
•
•
01 = FAULT2 - PWM FAULT2 Input
10 = TA3 - Timer A3
11 = Reserved
6.3.16.4
Configure GPIOA4 (GPS_A4)—Bits 9–8
This field selects the alternate function for GPIOA4.
•
•
•
•
00 = PWM4 - PWM4 (default)
01 = FAULT1 - PWM FAULT1 Input
10 = TA2 - Timer A2
11 = Reserved
6.3.16.5
Reserved—Bits 7–0
This bit field is reserved. Each bit must be set to 0.
6.3.17
SIM GPIO Peripheral Select Register 1 for GPIOA (SIM_GPSA1)
See Section 6.3.16 for general information about GPIO Peripheral Select Registers.
Base + $14
15
14
13
12
11
10
9
8
7
6
5
4
Read
0
0
0
0
0
0
0
0
0
GPS_
A11
0
GPS_
A10
0
0
0
0
0
0
0
0
0
0
0
0
Write
RESET
3
2
1
0
GPS_A9
GPS_A8
0
0
0
0
Figure 6-20 GPIO Peripheral Select Register 1 for GPIOA (SIM_GPSA1)
6.3.17.1
Reserved—Bits 15–7
This bit field is reserved. Each bit must be set to 0.
6.3.17.2
Configure GPIOA11 (GPS_A11)—Bit 6
This field selects the alternate function for GPIOA11.
•
•
0 = CINB - Comparator B Input 2 (default)
1 = Reserved
6.3.17.3
Reserved—Bit 5
This bit field is reserved. It must be set to 0.
6.3.17.4
Configure GPIOA10 (GPS_A10)—Bit 4
This field selects the alternate function for GPIOA10.
•
•
0 = CINA- Comparator A Input 2 (default)
1 = Reserved
56F8025 Data Sheet, Rev. 3
94
Freescale Semiconductor
Preliminary
Register Descriptions
6.3.17.5
Configure GPIOA9 (GPS_A9)—Bits 3–2
This field selects the alternate function for GPIOA9.
•
•
•
•
00 = FAULT2 - PWM FAULT2 Input (default)
01 = TA3 - Timer A3
10 = CMPBI1 - Comparator B Input 1
11 = Reserved
6.3.17.6
Configure GPIOA8 (GPS_A8)—Bits 1–0
This field selects the alternate function for GPIOA8.
•
•
•
•
00 = FAULT1 - PWM FAULT1 Input (default)
01 = TA2 - Timer A2
10 = CMPAI1 - Comparator A Input 1
11 = Reserved
6.3.18
SIM GPIO Peripheral Select Register 0 for GPIOB (SIM_GPSB0)
See Section 6.3.16 for general information about GPIO Peripheral Select Registers.
Base + $15
15
Read
0
Write
RESET
0
14
13
12
11
GPS_B6
GPS_B5
0
0
0
0
10
9
8
0
0
0
0
0
0
7
6
5
4
GPS_B3
GPS_B2
0
0
0
0
3
2
1
0
0
GPS_
B1
0
GPS_
B0
0
0
0
0
Figure 6-21 GPIO Peripheral Select Register 0 for GPIOB (SIM_GPSB0)
6.3.18.1
Reserved—Bit 15
This bit field is reserved. It must be set to 0.
6.3.18.2
Configure GPIOB6 (GPS_B6)—Bits 14–13
This field selects the alternate function for GPIOB6.
•
00 = RXD0 - QSCI0 Receive Data (default)
•
•
•
01 = SDA - I2C Serial
10 = CLKIN - External Clock Input
11 = Reserved
6.3.18.3
Configure GPIOB5 (GPS_B5)—Bits 12–11
This field selects the alternate function for GPIOB5.
•
•
•
00 = TA1 - Timer A1 (default)
01 = FAULT3 - PWM FAULT3 Input
10 = CLKIN - External Clock Input
56F8025 Data Sheet, Rev. 3
Freescale Semiconductor
Preliminary
95
•
11 = Reserved
6.3.18.4
Reserved—Bits 10–8
This bit field is reserved. Each bit must be set to 0.
6.3.18.5
Configure GPIOB3 (GPS_B3)—Bits 7–6
This field selects the alternate function for GPIOB3.
•
•
•
•
00 = MOSI0 - QSPI0 Master Out/Slave In (default)
01 = TA3 - Timer A3
10 = PSRC1 - PWM2/PWM3 Pair External Source
11 = Reserved
6.3.18.6
Configure GPIOB2 (GPS_B2)—Bits 5–4
This field selects the alternate function for GPIOB2.
•
•
•
•
00 = MISO0 QSPI0 Master In/Slave Out (default)
01 = TA2 - Timer A2
10 = PSRC0 - PWM0/PWM1 Pair External Source
11 = Reserved
6.3.18.7
Reserved—Bit 3
This bit field is reserved. It must be set to 0.
6.3.18.8
Configure GPIOB1 (GPS_B1)—Bit 2
This field selects the alternate function for GPIOB1.
•
•
0 = SS0 - QSPI0 Slave Select (default)
1 = SDA - I2C Serial Data
6.3.18.9
Reserved—Bit 1
This bit field is reserved. It must be set to 0.
6.3.18.10 Configure GPIOB0 (GPS_B0)—Bits 0
This field selects the alternate function for GPIOB0.
•
0 = SCLK0 - QSPI0 Serial Clock (default)
•
1 = SCL - I2C Serial Clock
6.3.19
SIM GPIO Peripheral Select Register 1 for GPIOB (SIM_GPSB1)
See Section 6.3.16 for general information about GPIO Peripheral Select Registers.
56F8025 Data Sheet, Rev. 3
96
Freescale Semiconductor
Preliminary
Register Descriptions
Base + $16
15
14
13
12
11
10
9
8
7
6
5
4
3
2
1
0
Read
0
0
0
0
0
0
0
GPS_
B11
0
GPS_
B10
0
0
0
0
0
GPS_
B7
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
Write
RESET
Figure 6-22 GPIO Peripheral Select Register 1 for GPIOB (SIM_GPSB1)
6.3.19.1
Reserved—Bits 15–9
This bit field is reserved. Each bit must be set to 0.
6.3.19.2
Configure GPIOB11 (GPS_B11)—Bit 8
This field selects the alternate function for GPIOB11.
•
•
0 = COUTB_A - Comparator B Output (default)
1 = Reserved
6.3.19.3
Reserved—Bit 7
This bit field is reserved. It must be set to 0.
6.3.19.4
Configure GPIOB10 (GPS_B10)—Bit 6
This field selects the alternate function for GPIOB10.
•
•
0 = CMPAO - Comparator A Output (default)
1 = Reserved
6.3.19.5
Reserved—Bits 5–1
This bit field is reserved. Each bit must be set to 0.
6.3.19.6
Configure GPIOB7 (GPS_B7)—Bit 0
This field selects the alternate function for GPIOB7.
•
0 = TXD0 - QSCI0 Transmit Data (default)
•
1 = SCL - I2C Serial Clock
6.3.20
SIM GPIO Peripheral Select Register for GPIOC and GPIOD
(SIM_GPSCD)
See Section 6.3.16 for general information about GPIO Peripheral Select Registers.
Base + $17
15
14
13
12
11
10
9
8
7
6
5
4
3
2
1
0
Read
0
0
0
GPS_
D5
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
Write
RESET
Figure 6-23 GPIO Peripheral Select Register for GPIOC and GPIOD (SIM_GPSCD)
56F8025 Data Sheet, Rev. 3
Freescale Semiconductor
Preliminary
97
6.3.20.1
Reserved—Bits 15–13
This bit field is reserved. Each bit must be set to 0.
6.3.20.2
Configure GPIOD5 (GPS_D5)—Bit 12
This field selects the alternate function for GPIOD5.
•
•
0 = XTAL - External Crystal Oscillator Output (default)
1 = CLKIN - External Clock Input
6.3.20.3
Reserved—Bits 11–0
This bit field is reserved. Each bit must be set to 0.
6.3.21
Internal Peripheral Source Select Register 0 for Pulse Width
Modulator (SIM_IPS0)
The internal integration of peripherals provides input signal source selection for peripherals where an input
signal to a peripheral can be fed from one of several sources. These registers are organized by peripheral
type and provide a selection list for every peripheral input signal that has more than one alternative source
to indicate which source is selected.
If one of the alternative sources is GPIO, the setting in these registers must be made consistently with the
settings in the GPSn and GPIOx_PEREN registers. Specifically, when an IPSn field is configured to select
an I/O pin as the source, then GPSn register settings must configure only one I/O pin to feed this peripheral
input function. Also, the GPIOx_PEREN bit for that I/O pin must be set to 1 to enable peripheral control
of the I/O.
GPIOA5_PEREN
Register
SIM_GPSA0
Register
SIM_IPS0
Register
GPIOA5
PWM5
0
PWM
FAULT2
GPIOA5 pin
00
01
Timer A3
0
1
10
1
Comparator A
Output (Internal)
Figure 6-24 Overall Control of Signal Source using SIM_IPSn Control
IPSn settings should not be altered while an affected peripheral is in an enabled (operational)
configuration. See the 56F802x and 56F803x Peripheral Reference Manual for details.
56F8025 Data Sheet, Rev. 3
98
Freescale Semiconductor
Preliminary
Register Descriptions
Base + $18
15
14
13
12
11
10
9
8
7
6
Read
0
0
IPS0_
FAULT2
0
IPS0_
FAULT1
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
Write
RESET
5
4
3
2
IPS0_PSRC1
0
0
1
0
IPS0_PSRC0
0
0
0
0
Figure 6-25 Internal Peripheral Source Select Register for PWM (SIM_IPS0)
6.3.21.1
Reserved—Bits 15–14
This bit field is reserved. Each bit must be set to 0.
6.3.21.2
Select Peripheral Input Source for FAULT2 (IPS0_FAULT2)—Bit 13
This field selects the alternate input source signal to feed PWM input FAULT2.
•
•
0 = I/O Pin (External) - Use PWM FAULT2 Input Pin (default)
1 = COUTB_A (Internal) - Use Comparator B Output
6.3.21.3
Reserved—Bit 12
This bit field is reserved. It must be set to 0.
6.3.21.4
Select Input Source for FAULT1 (IPS0_FAULT1)—Bit 11
This field selects the alternate input source signal to feed PWM input FAULT1.
•
•
0 = I/O pin (External) - Use PWM FAULT2 Input Pin (default)
1 = CMPAO (Internal) - Use Comparator A Output
6.3.21.5
Reserved—Bits 10–6
This bit field is reserved. Each bit must be set to 0.
6.3.21.6
Select Peripheral Input Source for PWM2/PWM3 Pair Source
(IPS0_PSRC1)—Bits 5–3
This field selects the alternate input source signal to feed PWM input PSRC1 as the PWM2/PWM3 pair
source.
•
•
•
000 = I/O pin (External) - Use a PSRC1 input pin as PWM source (default)
001 = TA2 (Internal) - Use Timer A2 output as PWM source
010 = ADC SAMPLE1 (Internal) - Use ADC SAMPLE1 result as PWM source
— If the ADC conversion result in SAMPLE1 is greater than the value programmed into the High Limit
register HLMT1, then PWM2 is set to 0 and PWM3 is set to 1
— If the ADC conversion result in SAMPLE1 is less than the value programmed into the Low Limit
register LLMT2, then PWM2 is set to 1 and PWM3 is set to 0
•
•
•
011 = CMPAO (Internal) - Use Comparator A output as PWM source
100 = COUTB_A (Internal) - Use Comparator B output as PWM source
11x = Reserved
56F8025 Data Sheet, Rev. 3
Freescale Semiconductor
Preliminary
99
•
1x1 = Reserved
6.3.21.7
Select Peripheral Input Source for PWM0/PWM1 Pair Source
(IPS0_PSRC0)—Bits 2–0
This field selects the alternate input source signal to feed PWM input PSRC0 as the PWM0/PWM1 pair
source.
•
•
•
000 = I/O pin (External) - Use a PSRC0 input pin as PWM source (default)
001 = TA0 (Internal) - Use Timer A0 output as PWM source
010 = ADC SAMPLE0 (Internal) - Use ADC SAMPLE0 result as PWM source
— If the ADC conversion result in SAMPLE0 is greater than the value programmed into the High Limit
register HLMT1, then PWM0 is set to 0 and PWM1 is set to 1
— If the ADC conversion result in SAMPLE0 is less than the value programmed into the Low Limit
register LLMT2, then PWM0 is set to 1 and PWM1 is set to 0
•
•
•
•
011 = CMPAO (Internal) - Use Comparator A output as PWM source
100 = COUTB_A (Internal) - Use Comparator B output as PWM source
11x = Reserved
1x1 = Reserved
6.3.22
Internal Peripheral Source Select Register 1 for Digital-to-Analog
Converters (SIM_IPS1)
See Section 6.3.21 for general information about Internal Peripheral Source Select registers.
Base + $19
15
14
13
12
11
10
9
8
7
Read
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
6
4
0
0
3
0
IPS1_DSYNC1
Write
RESET
5
0
0
2
1
0
IPS1_DSYNC0
0
0
0
Figure 6-26 Internal Peripheral Source Select Register for DACs (SIM_IPS1)
6.3.22.1
Reserved—Bits 15–7
This bit field is reserved. Each bit must be set to 0.
6.3.22.2
Select Input Source for SYNC Input to DAC 1 (IPS1_DSYNC1)—Bits 6–4
This field selects the alternate input source signal to feed DAC1 SYNC input.
•
•
•
•
•
•
000 = PIT0 (Internal) - Use Programmable Interval Timer 0 Output as DAC SYNC input (default)
001 = PIT1 (Internal) - Use Programmable Interval Timer 1 Output as DAC SYNC input
010 = PIT2 (Internal) - Use Programmable Interval Timer 2 Output as DAC SYNC input
011 = PWM SYNC (Internal) - Use PWM reload synchronization signal as DAC SYNC input
100 = TA0 (Internal) - Use Timer A0 output as DAC SYNC input
101 = TA1 (Internal) - Use Timer A1 output as DAC SYNC input
56F8025 Data Sheet, Rev. 3
100
Freescale Semiconductor
Preliminary
Register Descriptions
•
11x = Reserved
6.3.22.3
Reserved—Bit 3
This bit field is reserved. It must be set to 0.
6.3.22.4
Select Peripheral Input Source for SYNC Input to DAC 0
(IPS1_DSYNC0)—Bits 2–0
This field selects the alternate input source signal to feed DAC0 SYNC input.
•
•
•
•
•
•
•
000 = PIT0 (Internal) - Use Programmable Interval Timer 0 Output as DAC SYNC input (default)
001 = PIT1 (Internal) - Use Programmable Interval Timer 1 Output as DAC SYNC input
010 = PIT2 (Internal) - Use Programmable Interval Timer 2 Output as DAC SYNC input
011 = PWM SYNC (Internal) - Use PWM reload synchronization signal as DAC SYNC input
100 = TA0 (Internal) - Use Timer A0 output as DAC SYNC input
101 = TA1 (Internal) - Use Timer A1 output as DAC SYNC input
11x = Reserved
6.3.23
Internal Peripheral Source Select Register 2 for Quad Timer A
(SIM_IPS2)
See Section 6.3.21 for general information about Internal Peripheral Source Select registers.
Base + $1A
15
14
13
12
11
10
9
8
7
6
5
4
3
2
1
0
Read
0
0
0
IPS2_
TA3
0
0
0
IPS2_
TA2
0
0
0
IPS2_
TA1
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
Write
RESET
Figure 6-27 Internal Peripheral Source Select Register for TMRA (SIM_IPS2)
6.3.23.1
Reserved—Bits 15–13
This bit field is reserved. Each bit must be set to 0.
6.3.23.2
Select Input Source for TA3 (IPS2_TA3)—Bit 12
This field selects the alternate input source signal to feed Quad Timer A, input 3.
•
•
0 = I/O pin (External) - Use Timer A3 input/output pin
1 = PWM SYNC (Internal) - Use PWM reload synchronization signal
6.3.23.3
Reserved—Bits 11–9
This bit field is reserved. Each bit must be set to 0.
6.3.23.4
Select Input Source for TA2 (IPS2_TA2)—Bit 8
This field selects the alternate input source signal to feed Quad Timer A, input 2.
56F8025 Data Sheet, Rev. 3
Freescale Semiconductor
Preliminary
101
•
•
0 = I/O pin (External) - Use Timer A2 input/output pin
1 = COUTB_A (Internal) - Use Comparator B output
6.3.23.5
Reserved—Bits 7–5
This bit field is reserved. Each bit must be set to 0.
6.3.23.6
Select Input Source for TA1 (IPS2_TA1)—Bit 4
This field selects the alternate input source signal to feed Quad Timer A, input 1.
•
•
0 = I/O pin (External) - Use Timer A1 input/output pin
1 = CMPAO (Internal) - Use Comparator A output
6.3.23.7
Reserved—Bits 3–0
This bit field is reserved. Each bit must be set to 0.
For Timer A to detect the PWM SYNC signal, the clock rate of both the PWM module and Timer A
module must be identical, at either the system clock rate or 3X system clock rate.
6.4 Clock Generation Overview
The SIM uses the master clock (2X system clock) at a maximum of 64MHz from the OCCS module to
produce a system clock at a maximum of 32MHz for the peripheral, core, and memory. It divides the
master clock by two and gates it with appropriate power mode and clock gating controls. A 3X system
high-speed peripheral clock input from OCCS operates at three times the system clock at a maximum of
96MHz and can be an optional clock for PWM, Timer A, Timer B, and I2C modules. These clocks are
generated by gating the 3X system high-speed peripheral clock with appropriate power mode and clock
gating controls.
The OCCS configuration controls the operating frequency of the SIM’s master clocks. In the OCCS, either
an external clock (CLKIN), a crystal oscillator, or the relaxation oscillator can be selected as the master
clock source (MSTR_OSC). An external clock can be operated at any frequency up to 64MHz. The crystal
oscillator can be operated only at a maximum of 8MHz. The relaxation oscillator can be operated at full
speed (8MHz), standby speed (400kHz using ROSB), or powered down (using ROPD). An 8MHz
MSTR_OSC can be multiplied to 196MHz using the PLL and postscaled to provide a variety of high-speed
clock rates. Either the postscaled PLL output or MSTR_OSC signal can be selected to produce the master
clocks to the SIM. When the PLL is selected, both the 3X system clock and the 2X system clock are
enabled. If the PLL is not selected, the 3X system clock is disabled and the master clock is MSTR_OSC.
In combination with the OCCS module, the SIM provides power modes (see Section 6.5), clock enables,
and clock rate controls to provide flexible control of clocking and power utilization. The clock rate
controls enable the high-speed clocking option for the two quad timers (TMRA and TMRB) and PWM,
but requires the PLL to be on and selected. Refer to the 56F802x and 56F803x Peripheral Reference
Manual for further details. The peripheral clock enable controls can be used to disable an individual
peripheral clock when it is not used.
56F8025 Data Sheet, Rev. 3
102
Freescale Semiconductor
Preliminary
Power-Saving Modes
6.5 Power-Saving Modes
The 56F8025 operates in one of five Power-Saving modes, as shown in Table 6-2.
Table 6-2 Clock Operation in Power-Saving Modes
Mode
Core Clocks
Peripheral Clocks
Description
Run
Core and memory
clocks enabled
Peripheral clocks
enabled
Device is fully functional
Wait
Core and memory
clocks disabled
Peripheral clocks
enabled
Core executes WAIT instruction to enter this
mode.
Typically used for power-conscious applications.
Possible recoveries from Wait mode to Run
mode are:
1. Any interrupt
2. Executing a Debug mode entry command
during the 56800E core JTAG interface
3. Any reset (POR, external, software, COP)
Stop
Master clock generation in the OCCS
remains operational, but the SIM disables
the generation of system and peripheral
clocks.
Core executes STOP instruction to enter this
mode.
Possible recoveries from Stop mode to Run
mode are:
1. Interrupt from any peripheral configured in the
CTRL register to operate in Stop mode (TA0-3,
QSCI0, PIT0-1, CAN, CMPA-B)
2. Low-voltage interrupt
3. Executing a Debug mode entry command
using the 56800E core JTAG interface
4. Any reset (POR, external, software, COP)
Standby
The OCCS generates the master clock at a
reduced frequency (400kHz). The PLL is
disabled and the high-speed peripheral
option is not available. System and
peripheral clocks operate at 200kHz.
The user configures the OCCS and SIM to select
the relaxation oscillator clock source (PRECS),
shut down the PLL (PLLPD), put the relaxation
oscillator in Standby mode (ROSB), and put the
large regulator in Standby (LRSTDBY). The
device is fully operational, but operating at a
minimum frequency and power configuration.
Recovery requires reversing the sequence used
to enter this mode (allowing for PLL lock time).
Power-Down
Master clock generation in the OCCS is
completely shut down. All system and
peripheral clocks are disabled.
The user configures the OCCS and SIM to enter
Standby mode as shown in the previous
description, followed by powering down the
oscillator (ROPD). The only possible recoveries
from this mode are:
1. External Reset
2. Power-On Reset
The power-saving modes provide additional power management options by disabling the clock,
reconfiguring the voltage regulator clock generation to manage power utilization, as shown in Table 6-2.
Run, Wait, and Stop modes provide methods of enabling/disabling the peripheral and/or core clocking as
a group. Stop disable controls for an individual peripheral are provided in the SDn registers to override the
56F8025 Data Sheet, Rev. 3
Freescale Semiconductor
Preliminary
103
default behavior of Stop mode. By asserting a peripheral’s Stop disable bit, the peripheral clock continues
to operate in Stop mode. This is useful to generate interrupts which will recover the device from Stop mode
to Run mode. Standby mode provides normal operation but at very low speed and power utilization. It is
possible to invoke Stop or Wait mode while in Standby mode for even greater levels of power reduction.
A 400kHz external clock can optionally be used in Standby mode to produce the required Standby 200kHz
system clock rate. Power-down mode, which selects the ROSC clock source but shuts it off, fully disables
the device and minimizes its power utilization but is only recoverable via reset.
When the PLL is not selected and the system bus is operating at 200kHz or less, the large regulator can be
put into its Standby mode (LRSTDBY) to reduce the power utilization of that regulator.
All peripherals, except the COP/watchdog timer, run at the system clock frequency or optional 3X system
clock for PWM, Timers, and I2C. The COP timer runs at OSC_CLK / 1024. The maximum frequency of
operation is 32MHz.
6.6 Resets
The SIM supports five sources of reset, as shown in Figure 6-28. The two asynchronous sources are the
external reset pin and the Power-On Reset (POR). The three synchronous sources are the software reset
(SW reset), which is generated within the SIM itself by writing the SIM_CTRL register in Section 6.3.1,
the COP time-out reset (COP_TOR), and the COP loss-of-reference reset (COP_LOR). The reset
generation module has three reset detectors, which resolve into four primary resets. These are outlined in
Table 6-3. The JTAG circuitry is reset by the Power-On Reset.
Table 6-3 Primary System Resets
Reset Sources
Reset Signal
POR
External
Software
COP
Comments
EXTENDED_POR
X
CLKGEN_RST
X
X
X
X
Released 32 OSC_CLK cycles after all reset
sources, including EXTENDED_POR, have
released
PERIP_RST
X
X
X
X
Releases 32 SYS_CLK cycles after the
CLKGEN_RST is released
CORE_RST
X
X
X
X
Releases 32 SYS_CLK cycles after
PERIP_RST is released
Stretched version of POR released 64
OSC_CLK cycles after POR deasserts
Figure 6-28 provides a graphic illustration of the details in Table 6-3. Note that the POR_Delay blocks
use the OSC_CLK as their time base, since other system clocks are inactive during this phase of reset.
56F8025 Data Sheet, Rev. 3
104
Freescale Semiconductor
Preliminary
Clocks
EXTENDED_POR
JTAG
POR
Power-On
Reset
(active low)
pulse shaper
Delay 64
OSC_CLK
Clock
Memory
Subsystem
CLKGEN_RST
OCCS
COMBINED_RST
External
RESET IN
(active low)
pulse shaper
COP_TOR
(active low)
SW Reset
COP_LOR
(active low)
PERIP_RST
Delay 32
OSC_CLK
Clock
RESET
Delay 32
sys clocks
pulse shaper
Delay blocks assert immediately and
deassert only after the programmed
number of clock cycles.
Peripherals
56800E
Delay 32
sys clocks
pulse shaper
CORE_RST
Figure 6-28 Sources of RESET Functional Diagram (Test modes not included)
POR resets are extended 64 OSC_CLK clocks to stabilize the power supply and clock source. All resets
are subsequently extended for an additional 32 OSC_CLK clocks and 64 system clocks as the various
internal reset controls are released. Given the normal relaxation oscillator rate of 8MHz, the duration of a
POR reset from when power comes on to when code is running is 28µS. An external reset generation
circuit may also be used. A description of how these resets are used to initialize the clocking system and
system modules is included in Section 6.7.
6.7 Clocks
The memory, peripheral and core clocks all operate at the same frequency (32MHz maximum), with the
exception of the peripheral clocks for quad timers TMRA and TMRB and the PWM, which have the option
to operate at 3X system clock. The SIM is responsible for clock distributions.
While the SIM generates the ADC peripheral clock in the same way it generates all other peripheral clocks,
the ADC standby and conversion clocks are generated by a direct interface between the ADC and the
OCCS module.
56F8025 Data Sheet, Rev. 3
Freescale Semiconductor
Preliminary
105
The deassertion sequence of internal resets coordinates the device start up, including the clocking system
start up. The sequence is described in the following steps:
1. As power is applied, the Relaxation Oscillator starts to operate. When a valid operating voltage is
reached, the POR reset will release.
2. The release of POR reset permits operation of the POR reset extender. The POR extender generates
an extended POR reset, which is released 64 OSC_CLK cycles after POR reset. This provides an
additional time period for the clock source and power to stabilize.
3. A Combined reset consists of the OR of the extended POR reset, the external reset, the COP reset
and Software reset. The entire device, except for the POR extender, is held reset as long as
Combined reset is asserted. The release of Combined reset permits operation of the CTRL register,
the Synchronous reset generator, and the CLKGEN reset extender.
4. The Synchronous reset generator generates a reset to the Software and COP reset logic. The COP
and Software reset logic is released three OSC_CLK cycles after Combined reset deasserts. This
provides a reasonable minimum duration to the reset for these specialized functions.
5. The CLKGEN reset extender generates the CLKGEN reset used by the clock generation logic. The
CLKGEN reset is released 32 OSC_CLK cycles after Combined reset deasserts. This provides a
window in which the SIM stabilizes the master clock inputs to the clock generator.
6. The release of CLKGEN reset permits operation of the clock generation logic and the Peripheral
reset extender. The Peripheral reset extender generates the Peripheral reset, which is released 32
SYS_CLK cycles after CLKGEN reset. This provides a window in which peripheral and core logic
remain clocked, but in reset, so that synchronous resets can be resolved.
7. The release of Peripheral reset permits operation of the peripheral logic and the Core reset extender.
The Core reset extender generates the Core reset, which is released 32 SYS_CLK cycles after the
Peripheral reset. This provides a window in which critical peripheral start-up functions, such as
Flash Security in the Flash memory, can be implemented.
8. The release of Core reset permits execution of code by the 56800E core and marks the end of the
system start-up sequence.
Figure 6-29 illustrates clock relationships to one another and to the various resets as the device comes out
of reset. RST is assumed to be the logical AND of all active-low system resets (for example, POR, external
reset, COP and Software reset). In the 56F8025, this signal will be stretched by the SIM for a period of
time (up to 96 OSC_CLK clock cycles, depending upon the status of the POR) to create the clock
generation reset signal (CLKGEN_RST). The SIM should deassert CLKGEN_RST synchronously with
the negative edge of OSC_CLK in order to avoid skew problems. CLKGEN_RST is delayed 32 SYS_CLK
cycles to create the peripheral reset signal (PERIP_RST). PERIP_RST is then delayed by 32 SYS_CLK
cycles to create CORE_RST. Both PERIP_RST and CORE_RST should be released on the negative edge
of SYS_CLK_D as shown. This phased releasing of system resets is necessary to give some peripherals
(for example, the Flash interface unit) set-up time prior to the 56800E core becoming active.
56F8025 Data Sheet, Rev. 3
106
Freescale Semiconductor
Preliminary
Interrupts
Maximum Delay = 64 OSC_CLK cycles for POR reset extension and 32 OSC_CLK cycles
for Combined reset extension
RST
MSTR_OSC
Switch on falling OSC_CLK
96 MSTR_OSC cycles
CKGEN_RST
2X SYS_CLK
SYS_CLK
SYS_CLK_D
SYS_CLK_DIV2
32 SYS_CLK cycles delay
Switch on falling SYS_CLK
PERIP_RST
Switch on falling SYS_CLK
32 SYS_CLK cycles delay
CORE_RST
Figure 6-29 Timing Relationships of Reset Signal to Clocks
6.8 Interrupts
The SIM generates no interrupts.
Part 7 Security Features
The 56F8025 offers security features intended to prevent unauthorized users from reading the contents of
the Flash Memory (FM) array. The 56F8025’s Flash security consists of several hardware interlocks that
prevent unauthorized users from gaining access to the Flash array.
Note, however, that part of the security must lie with the user’s code. An extreme example would be user’s
code that includes a subroutine to read and transfer the contents of the internal program to QSCI, QSPI or
another peripheral, as this code would defeat the purpose of security. At the same time, the user may also
wish to put a “backdoor” in his program. As an example, the user downloads a security key through the
QSCI, allowing access to a programming routine that updates parameters stored in another section of the
Flash.
7.1 Operation with Security Enabled
Once the user has programmed the Flash with his application code, the 56F8025 can be secured by
programming the security bytes located in the FM configuration field, which are located at the last nine
56F8025 Data Sheet, Rev. 3
Freescale Semiconductor
Preliminary
107
words of Program Flash. These non-volatile bytes will keep the device secured through reset and through
power-down of the device. Only two bytes within this field are used to enable or disable security. Refer to
the Flash Memory chapter in the 56F802x and 56F803x Peripheral Reference Manual for the state of
the security bytes and the resulting state of security. When Flash security mode is enabled in accordance
with the method described in the Flash Memory module chapter, the 56F8025 will disable the core EOnCE
debug capabilities. Normal program execution is otherwise unaffected.
7.2 Flash Access Lock and Unlock Mechanisms
The 56F8025 has several operating functional and debug modes. Effective Flash security must address
operating mode selection and anticipate modes in which the on-chip Flash can be read without explicit user
permission.
7.2.1
Disabling EOnCE Access
On-chip Flash can be read by issuing commands across the EOnCE port, which is the debug interface for
the 56800E CPU. The TCK, TMS, TDO, and TDI pins comprise a JTAG interface onto which the EOnCE
port functionality is mapped. When the 56F8025 boots, the chip-level JTAG TAP (Test Access Port) is
active and provides the chip’s boundary scan capability and access to the ID register, but proper
implementation of Flash security will block any attempt to access the internal Flash memory via the
EOnCE port when security is enabled.
7.2.2
Flash Lockout Recovery Using JTAG
If a user inadvertently enables security on the 56F8025, the only lockout recovery mechanism is the
complete erasure of the internal Flash contents, including the configuration field, and thus disables security
(the protection register is cleared). This does not compromise security, as the entire contents of the user’s
secured code stored in Flash are erased before security is disabled on the 56F8025 on the next reset or
power-up sequence.
To start the lockout recovery sequence, the JTAG public instruction (LOCKOUT_RECOVERY) must
first be shifted into the chip-level TAP controller’s instruction register. Once the
LOCKOUT_RECOVERY instruction has been shifted into the instruction register, the clock divider value
must be shifted into the corresponding 7-bit data register. After the data register has been updated, the user
must transition the TAP controller into the RUN-TEST/IDLE state for the lockout sequence to commence.
The controller must remain in this state until the erase sequence has completed. Refer to the 56F802x and
56F803x Peripheral Reference Manual for more details, or contact Freescale.
Note:
Once the lockout recovery sequence has completed, the user must reset both the JTAG TAP controller
(by advancing the TAP state machine to the reset state) and the 56F8025 (by asserting external chip
reset) to return to normal unsecured operation.
7.2.3
Flash Lockout Recovery using CodeWarrior
CodeWarrior can unlock a device using the command sequence described in Section 7.2.2 by selecting the
Debug menu, then selecting DSP56800E, followed by Unlock Flash.
56F8025 Data Sheet, Rev. 3
108
Freescale Semiconductor
Preliminary
Introduction
Another mechanism is also built into CodeWarrior using the device’s memory configuration file. The
command “Unlock_Flash_on_Connect1” in the .cfg file accomplishes the same task as using the Debug
menu.
7.2.4
Product Analysis
The recommended method of unsecuring a programmed 56F8025 for product analysis of field failures is
via the backdoor key access. The customer would need to supply Technical Support with the backdoor key
and the protocol to access the backdoor routine in the Flash. Additionally, the KEYEN bit that allows
backdoor key access must be set.
An alternative method for performing analysis on a secured microcontroller would be to mass-erase and
reprogram the Flash with the original code, but modify the security bytes.
To insure that a customer does not inadvertently lock himself out of the 56F8025 during programming, it
is recommended that the user program the backdoor access key first, the application code second, and the
security bytes within the FM configuration field last.
Part 8 General-Purpose Input/Output (GPIO)
8.1 Introduction
This section is intended to supplement the GPIO information found in the 56F802x and 56F803x
Peripheral Reference Manual and contains only chip-specific information. This information supersedes
the generic information in the 56F802x and 56F803x Peripheral Reference Manual.
8.2 Configuration
There are four GPIO ports defined on the 56F8025. The width of each port, the associated peripheral, and
reset functions are shown in Table 8-1. The specific mapping of GPIO port pins is shown in Table 8-2.
Additional details are shown in Tables 2-2 and 2-3.
Table 8-1 GPIO Ports Configuration
GPIO Port
Available
Pins in
56F8025
A
12
PWM, Timer, QSPI, Comparator, Reset
GPIO, RESET
B
9
QSPI, I2C, PWM, Clock, Comparator,
Timer
GPIO
C
8
ADC, Comparator, QSCI
GPIO
D
6
Clock, Oscillator, DAC, JTAG
GPIO, JTAG
Peripheral Function
Reset Function
56F8025 Data Sheet, Rev. 3
Freescale Semiconductor
Preliminary
109
Table 8-2 GPIO External Signals Map
GPIO Function
Peripheral Function
LQFP
Package Pin
Notes
GPIOA0
PWM0
40
Defaults to A0
GPIOA1
PWM1
39
Defaults to A1
GPIOA2
PWM2
32
Defaults to A2
GPIOA3
PWM3
33
Defaults to A3
GPIOA4
PWM4 / TA2 / FAULT1
31
SIM register SIM_GPS is used to
select between PWM4, TA2, and
FAULT1.
Defaults to A4
GPIOA5
PWM5 / TA3 / FAULT2
27
SIM register SIM_GPS is used to
select between PWM5, TA3, and
FAULT2.
Defaults to A5
GPIOA6
FAULT0 / TA0
24
SIM register SIM_GPS is used to
select between FAULT0 and TA0.
Defaults to A6
GPIOA7
RESET
21
Defaults to RESET
GPIOA8
FAULT1 / TA2 / CMPAI1
26
SIM register SIM_GPS is used to
select between FAULT1, TA2, and
CMPAI1.
Defaults to A8
GPIOA9
FAULT2 / TA3 / CMPBI1
5
SIM register SIM_GPS is used to
select between FAULT2, TA3, and
CMPBI1.
Defaults to A9
GPIOA10
CMPAI2
25
Defaults to A10
GPIOA11
CMPBI2
6
Defaults to A11
GPIOB0
SCLK0 / SCL
30
SIM register SIM_GPS is used to
select between SCLK and SCL.
Defaults to B0
GPIOB1
SS0 / SDA
2
SIM register SIM_GPS is used to
select between SS0 and SDA.
Defaults to B1
GPIOB2
MISO0 / TA2 / PSRC0
23
SIM register SIM_GPS is used to
select between MISO0, TA2, and
PSRC0.
Defaults to B2
56F8025 Data Sheet, Rev. 3
110
Freescale Semiconductor
Preliminary
Configuration
Table 8-2 GPIO External Signals Map (Continued)
GPIO Function
Peripheral Function
LQFP
Package Pin
Notes
GPIOB3
MOSI0 / TA3 / PSRC1
22
SIM register SIM_GPS is used to
select between MOSI0, TA3 and
PSRC1.
Defaults to B3
GPIOB5
TA1 / FAULT3 / CLKIN
4
SIM register SIM_GPS is used to
select between TA1, FAULT3, and
CLKIN.
CLKIN functionality is enabled using
the PLL Control Register within the
OCCS block.
Defaults to B5
GPIOB6
RXD0 / SDA / CLKIN
1
SIM register SIM_GPS is used to
select between RXD0, SDA, and
CLKIN.
CLKIN functionality is enabled using
the PLL Control Register within the
OCCS block.
Defaults to B6
GPIOB7
TXD0 / SCL
3
SIM register SIM_GPS is used to
select between TXD0 and SCL.
Defaults to B7
GPIOB10
CMPAO
20
Defaults to B10
GPIOB11
COUTB_A
42
Defaults to B11
GPIOC0
ANA0 / CMPAI3
16
SIM register SIM_GPS is used to
select between ANA0 and CMPAI3.
Defaults to C0
GPIOC1
ANA1
15
Defaults to C1
GPIOC2
ANA2 / VREFHA
14
SIM register SIM_GPS is used to
select between ANA2 and VREFHA.
Defaults to C2
GPIOC3
ANA3 / VREFLA
13
SIM register SIM_GPS is used to
select between ANA3 and VREFLA.
Defaults to C3
GPIOC4
ANB0 / CMPBI3
7
SIM register SIM_GPS is used to
select between ANB0 and CMPBI3.
Defaults to C4
GPIOC5
ANB1
8
Defaults to C5
GPIOC6
ANB2 / VREFHB
9
SIM register SIM_GPS is used to
select between ANB2 and VREFHB.
Defaults to C6
56F8025 Data Sheet, Rev. 3
Freescale Semiconductor
Preliminary
111
Table 8-2 GPIO External Signals Map (Continued)
GPIO Function
Peripheral Function
LQFP
Package Pin
Notes
GPIOC7
ANB3 / VREFLB
10
SIM register SIM_GPS is used to
select between ANB3 and VREFLB.
Defaults to C7
GPIOD0
TDI
41
Defaults to TDI
GPIOD1
TDO
44
Defaults to TDO
GPIOD2
TCK
19
Defaults to TCK
GPIOD3
TMS
43
Defaults to TMS
GPIOD4
EXTAL
38
Defaults to D4
GPIOD5
XTAL / CLKIN
37
SIM register SIM_GPSCD is used to
select between XTAL and CLKIN.
Defaults to D5
8.3 Reset Values
Tables 8-1 and 8-2 detail registers for the 56F8025; Figures 8-1 through 8-4 summarize register maps and
reset values.
56F8025 Data Sheet, Rev. 3
112
Freescale Semiconductor
Preliminary
Reset Values
Add.
Offset
Register Acronym
$0
GPIOA_PUPEN
$1
$2
$3
$4
$5
$6
$7
$8
$9
$A
$B
GPIOA_DATA
GPIOA_DDIR
GPIOA_PEREN
GPIOA_IASSRT
GPIOA_IEN
GPIOA_IEPOL
GPIOA_IPEND
GPIOA_IEDGE
GPIOA_PPOUTM
GPIOA_RDATA
GPIOA_DRIVE
15
14
13
12
R
W
RS
0
0
0
0
0
1
1
1
R
W
RS
.0
.0
.0
.0
0
0
0
0
. 0.
.0.
. 0.
0
0
0
R . 0.
W
RS 0
R
W
RS
0
0
0
0
0
0
0
0
R
W
RS
0
0
0
0
0
0
0
0
R
W
RS
0
0
0
0
0
0
0
0
R
W
RS
0
0
0
0
0
0
0
0
R
0
0
0
0
W
RS
0
0
0
0
R
W
RS
0
0
0
0
0
0
0
0
R
W
RS
0
0
0
0
0
1
1
1
R
W
RS
0
0
0
0
0
X
X
X
R
W
RS
0
0
0
0
0
0
0
0
R
W
0
RS
11
10
9
8
7
6
5
4
3
2
1
0
1
1
1
1
1
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
1
1
1
1
1
X
X
X
X
X
0
0
0
0
0
PU[15:0]
1
1
1
1
1
1
1
D[15:0]
0
0
0
0
0
0
0
DD[15:0]
0
0
0
0
0
0
0
PE[15:0]
0
0
0
0
0
0
0
IA[15:0]
0
0
0
0
0
0
0
IEN[15:0]
0
0
0
0
0
0
0
IEPOL[15:0]
0
0
0
0
0
0
0
IPR[15:0]
0
0
0
0
0
0
0
IES[15:0]
0
0
0
0
0
0
0
OEN[15:0]
1
1
1
1
1
1
1
RAW DATA[15:0]
X
X
X
X
X
X
X
DRIVE[15:0]
0
0
0
0
0
0
0
Read as 0
Reserved
Reset
Figure 8-1 GPIOA Register Map Summary
56F8025 Data Sheet, Rev. 3
Freescale Semiconductor
Preliminary
113
Add.
Offset
Register Acronym
$0
GPIOB_PUPEN
$1
$2
$3
$4
$5
$6
$7
$8
$9
$A
$B
GPIOB_DATA
GPIOB_DDIR
GPIOB_PEREN
GPIOB_IASSRT
GPIOB_IEN
GPIOB_IEPOL
GPIOB_IPEND
GPIOB_IEDGE
GPIOB_PPOUTM
GPIOB_RDATA
GPIOB_DRIVE
15
14
13
12
11
R
W
RS
0
0
0
0
0
0
1
1
R
W
RS
0
0
0
0
0
0
0
0
R
W
RS
0
0
0
0
0
0
0
0
R
W
RS
0
0
0
0
0
0
0
0
R
W
RS
0
0
0
0
0
0
0
0
R
W
RS
0
0
0
0
0
0
0
0
R
W
RS
0
0
0
0
0
0
0
0
0
R
W
RS
0
0
0
0
0
R
W
RS
0
10
9
8
0
0
1
1
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
IPR[15:0]
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
R
W
RS
0
0
0
0
0
0
0
0
1
1
1
1
R
0
0
0
0
0
0
W
RS
0
0
X
X
X
X
R
W
RS
0
0
0
0
0
0
0
0
0
0
0
0
R
W
RS
0
PU[15:0]
1
1
D[15:0]
0
0
DD[15:0]
0
0
PE[15:0]
0
0
IA[15:0]
0
0
IEN[15:0]
0
0
IEPOL[15:0]
0
IES[15:0]
0
0
OEN[15:0]
1
1
RAW
DATA[15:0]
X
X
DRIVE[15:0]
0
0
7
6
5
1
1
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
1
1
RAW DATA
X
X
X
0
0
0
0
0
0
0
1
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
IA
0
0
IEN
0
0
IEPOL
0
0
0
0
0
0
0
0
IPR
0
0
IES
0
0
OEN
1
0
X
1
PE
1
1
1
RAW DATA
X
0
DRIVE
0
0
0
OEN
1
0
1
DD
0
IES
0
0
0
IPR
0
0
0
IEPOL
0
0
0
D
0
IEN
0
1
0
IA
0
1
0
PE
0
1
1
PU
0
DD
0
2
0
D
0
3
0
PU
1
4
X
X
X
DRIVE
0
0
0
0
Read as 0
Reserved
Reset
Figure 8-2 GPIOB Register Map Summary
56F8025 Data Sheet, Rev. 3
114
Freescale Semiconductor
Preliminary
Reset Values
Add.
Offset
Register Acronym
$0
GPIOC_PUPEN
$1
$2
$3
$4
$5
$6
$7
$8
$9
$A
$B
GPIOC_DATA
GPIOC_DDIR
GPIOC_PEREN
GPIOC_IASSRT
GPIOC_IEN
GPIOC_IEPOL
GPIOC_IPEND
GPIOC_IEDGE
GPIOC_PPOUTM
GPIOC_RDATA
GPIOC_DRIVE
15
14
13
12
11
10
9
8
R
W
RS
0
0
0
0
0
0
0
0
1
1
1
1
1
1
1
1
R
W
RS
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
R
W
RS
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
R
W
RS
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
R
W
RS
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
R
W
RS
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
R
W
RS
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
R
0
0
0
0
0
0
0
0
W
RS
0
0
0
0
0
0
0
0
R
W
RS
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
R
W
RS
0
0
0
0
0
0
0
0
1
1
1
1
1
1
1
1
R
W
RS
0
0
0
0
0
0
0
0
X
X
X
X
X
X
X
X
R
W
RS
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
R
W
0
RS
7
6
5
4
3
2
1
0
1
1
1
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
1
1
1
X
X
X
0
0
0
PU[15:0]
1
1
1
1
1
D[15:0]
0
0
0
0
0
DD[15:0]
0
0
0
0
0
PE[15:0]
0
0
0
0
0
IA[15:0]
0
0
0
0
0
IEN[15:0]
0
0
0
0
0
IEPOL[15:0]
0
0
0
0
0
IPR[15:0]
0
0
0
0
0
IES[15:0]
0
0
0
0
0
OEN[15:0]
1
1
1
1
1
RAW DATA[15:0]
X
X
X
X
X
DRIVE[15:0]
0
0
0
0
0
Read as 0
Reserved
Reset
Figure 8-3 GPIOC Register Map Summary
56F8025 Data Sheet, Rev. 3
Freescale Semiconductor
Preliminary
115
Add.
Offset
Register Acronym
$0
GPIOD_PUPEN
$1
$2
$3
$4
$5
$6
GPIOD_DATA
GPIOD_DDIR
GPIOD_PEREN
GPIOD_IASSRT
GPIOD_IEN
GPIOD_IEPOL
15
R
W
RS
R
W
RS
R
W
RS
R
W
RS
R
W
RS
R
W
RS
R
W
RS
14
13
12
11
10
9
8
7
6
5
4
$8
$9
$A
$B
GPIOD_IPEND
GPIOD_IEDGE
GPIOD_PPOUTM
GPIOD_RDATA
GPIOD_DRIVE
W
RS
R
W
RS
R
W
RS
R
W
RS
R
W
RS
R
W
RS
2
1
0
1
1
0
0
0
0
1
1
0
0
0
0
0
0
0
0
0
0
1
1
PU[15:0]
0
0
0
0
0
0
0
0
1
1
1
1
1
1
D[15:0]
0
0
0
0
0
0
0
0
0
0
0
0
0
0
DD[15:0]
0
0
0
0
0
0
0
0
0
0
0
0
0
0
PE[15:0]
0
0
0
0
0
0
0
0
0
0
0
0
1
1
IA[15:0]
0
0
0
0
0
0
0
0
0
0
0
0
0
0
IEN[15:0]
0
0
0
0
0
0
0
0
0
0
0
0
0
0
IEPOL[15:0]
0
0
0
0
0
0
0
0
0
0
0
0
R
$7
3
0
0
IPR[15:0]
0
0
0
0
0
0
0
0
0
0
0
0
0
0
IES[15:0]
0
0
0
0
0
0
0
0
0
0
0
0
0
0
OEN[15:0]
0
0
0
0
0
0
0
0
1
1
1
1
1
1
RAW DATA[15:0]
0
0
0
0
0
0
0
0
X
X
X
X
X
X
X
X
0
0
DRIVE[15:0]
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
Read as 0
Reserved
Reset
Figure 8-4 GPIOD Register Map Summary
56F8025 Data Sheet, Rev. 3
116
Freescale Semiconductor
Preliminary
56F8025 Information
Part 9 Joint Test Action Group (JTAG)
9.1 56F8025 Information
Please contact your Freescale sales representative or authorized distributor for device/package-specific
BSDL information.
The TRST pin is not available in this package. The pin is tied to VDD in the package.
The JTAG state machine is reset during POR and can also be reset via a soft reset by holding TMS high
for five rising edges of TCK, as described in the 56F802x and 56F803x Peripheral Reference Manual.
Part 10 Specifications
10.1 General Characteristics
The 56F8025 is fabricated in high-density CMOS with 5V-tolerant TTL-compatible digital inputs. The
term “5V-tolerant” refers to the capability of an I/O pin, built on a 3.3V-compatible process technology,
to withstand a voltage up to 5.5V without damaging the device. Many systems have a mixture of devices
designed for 3.3V and 5V power supplies. In such systems, a bus may carry both 3.3V- and 5V-compatible
I/O voltage levels (a standard 3.3V I/O is designed to receive a maximum voltage of 3.3V ± 10% during
normal operation without causing damage). This 5V-tolerant capability therefore offers the power savings
of 3.3V I/O levels, combined with the ability to receive 5V levels without damage.
Absolute maximum ratings in Table 10-1 are stress ratings only, and functional operation at the maximum
is not guaranteed. Stress beyond these ratings may affect device reliability or cause permanent damage to
the device.
Unless otherwise stated, all specifications within this chapter apply over the temperature range of -40ºC to
125ºC ambient temperature over the following supply ranges:
VSS = VSSA = 0V, VDD = VDDA = 3.0–3.6V, CL < 50pF, fOP = 32MHz
CAUTION
This device contains protective circuitry to guard
against damage due to high static voltage or electrical
fields. However, normal precautions are advised to
avoid application of any voltages higher than
maximum-rated voltages to this high-impedance circuit.
Reliability of operation is enhanced if unused inputs are
tied to an appropriate voltage level.
56F8025 Data Sheet, Rev. 3
Freescale Semiconductor
Preliminary
117
Table 10-1 Absolute Maximum Ratings
(VSS = 0V, VSSA = 0V)
Characteristic
Symbol
Notes
Min
Max
Unit
Supply Voltage Range
VDD
-0.3
4.0
V
Analog Supply Voltage Range
VDDA
- 0.3
4.0
V
ADC High Voltage Reference
VREFHx
- 0.3
4.0
V
Voltage difference VDD to VDDA
ΔVDD
- 0.3
0.3
V
Voltage difference VSS to VSSA
ΔVSS
- 0.3
0.3
V
Digital Input Voltage Range
VIN
Pin Groups 1, 2
- 0.3
6.0
V
Oscillator Voltage Range
VOSC
Pin Group 4
- 0.4
4.0
V
Analog Input Voltage Range
VINA
Pin Group 3
- 0.3
4.0
V
Input clamp current, per pin (VIN < 0)1
VIC
—
-20.0
mA
Output clamp current, per pin (VO < 0)1
VOC
—
-20.0
mA
Output Voltage Range
(Normal Push-Pull mode)
VOUT
Pin Group 1
- 0.3
4.0
V
VOUTOD
Pin Group 2
- 0.3
6.0
V
TA
- 40
105
°C
TSTG
- 55
150
°C
Output Voltage Range
(Open Drain mode)
Ambient Temperature
Industrial
Storage Temperature Range
(Extended Industrial)
1. Continuous clamp current per pin is -2.0 mA
Default Mode
Pin Group 1: GPIO, TDI, TDO, TMS, TCK
Pin Group 2: RESET, GPIOA7
Pin Group 3: ADC and Comparator Analog Inputs
Pin Group 4: XTAL, EXTAL
10.1.1
ElectroStatic Discharge (ESD) Model
Table 10-2 56F8025 ESD Protection
Characteristic
Min
Typ
Max
Unit
ESD for Human Body Model (HBM)
2000
—
—
V
ESD for Machine Model (MM)
200
—
—
V
ESD for Charge Device Model (CDM)
750
—
—
V
56F8025 Data Sheet, Rev. 3
118
Freescale Semiconductor
Preliminary
General Characteristics
Table 10-3 LQFP Package Thermal Characteristics6
Characteristic
Comments
Symbol
Value
(LQFP)
Unit
Notes
RθJA
41
°C/W
2
Junction to ambient
Natural convection
Single layer board
(1s)
Junction to ambient
Natural convection
Four layer board
(2s2p)
RθJMA
34
°C/W
1, 2
Junction to ambient
(@200 ft/min)
Single layer board
(1s)
RθJMA
34
°C/W
2
Junction to ambient
(@200 ft/min)
Four layer board
(2s2p)
RθJMA
29
°C/W
1, 2
Junction to board
RθJB
24
°C/W
4
Junction to case
RθJC
8
°C/W
3
ΨJT
2
°C/W
5
Junction to package top
Natural Convection
1. Theta-JA determined on 2s2p test boards is frequently lower than would be observed in an application. Determined on 2s2p
thermal test board.
2. Junction to ambient thermal resistance, Theta-JA (RθJA), was simulated to be equivalent to the JEDEC specification JESD51-2
in a horizontal configuration in natural convection. Theta-JA was also simulated on a thermal test board with two internal planes
(2s2p, where “s” is the number of signal layers and “p” is the number of planes) per JESD51-6 and JESD51-7. The correct name
for Theta-JA for forced convection or with the non-single layer boards is Theta-JMA.
3. Junction to case thermal resistance, Theta-JC (RθJC), was simulated to be equivalent to the measured values using the cold plate
technique with the cold plate temperature used as the “case” temperature. The basic cold plate measurement technique is described by MIL-STD 883D, Method 1012.1. This is the correct thermal metric to use to calculate thermal performance when the
package is being used with a heat sink.
4. Junction to board thermal resistance, Theta-JB (RθJB), is a metric of the thermal resistance from the junction to the printed circuit
board determined per JESD51-8. Board temperature is measured on the top surface of the board near the package.
5. Thermal Characterization Parameter, Psi-JT (YJT), is the “resistance” from junction to reference point thermocouple on top center
of case as defined in JESD51-2. YJT is a useful value to use to estimate junction temperature in steady state customer
environments.
6. Junction temperature is a function of die size, on-chip power dissipation, package thermal resistance, mounting site (board)
temperature, ambient temperature, air flow, power dissipation of other components on the board, and board thermal resistance.
7. See Section 12.1 for more details on thermal design considerations.
Table 10-4 Recommended Operating Conditions
(VREFL x= 0V, VSSA = 0V, VSS = 0V)
Characteristic
Supply voltage
ADC Reference Voltage High
Symbol
Notes
Min
Typ
Max
Unit
VDD,
VDDA
3
3.3
3.6
V
VREFHx
3.0
VDDA
V
56F8025 Data Sheet, Rev. 3
Freescale Semiconductor
Preliminary
119
Table 10-4 Recommended Operating Conditions (Continued)
(VREFL x= 0V, VSSA = 0V, VSS = 0V)
Characteristic
Symbol
Notes
Min
Typ
Max
Unit
Voltage difference VDD to VDDA
ΔVDD
-0.1
0
0.1
V
Voltage difference VSS to VSSA
ΔVSS
-0.1
0
0.1
V
1
0
32
32
MHz
Device Clock Frequency
Using relaxation oscillator
Using external clock source
FSYSCLK
Input Voltage High (digital inputs)
VIH
Pin Groups 1, 2
2.0
5.5
V
Input Voltage Low (digital inputs)
VIL
Pin Groups 1, 2
-0.3
0.8
V
Oscillator Input Voltage High
XTAL not driven by an external clock
XTAL driven by an external clock source
VIHOSC
Pin Group 4
VDDA - 0.8
2.0
VDDA + 0.3
VDDA + 0.3
V
Oscillator Input Voltage Low
VILOSC
Pin Group 4
-0.3
0.8
V
Pin Group 1
Pin Group 1
—
—
-4
-8
mA
Pin Groups 1, 2
Pin Groups 1, 2
—
—
4
8
mA
-40
105
°C
Output Source Current High at VOH min.)1
When programmed for low drive strength
When programmed for high drive strength
IOH
Output Source Current Low (at VOL max.)1
When programmed for low drive strength
When programmed for high drive strength
IOL
Ambient Operating Temperature
(Extended Industrial)
TA
Flash Endurance
(Program Erase Cycles)
NF
TA = -40°C to
125°C
10,000
—
cycles
Flash Data Retention
TR
TJ <= 85°C avg
15
—
years
tFLRET
TJ <= 85°C avg
20
—
years
Flash Data Retention with <100
Program/Erase Cycles
—
1. Total chip source or sink current cannot exceed 75mA
Default Mode
Pin Group 1: GPIO, TDI, TDO, TMS, TCK
Pin Group 2: RESET, GPIOA7
Pin Group 3: ADC and Comparator Analog Inputs
Pin Group 4: XTAL, EXTAL
56F8025 Data Sheet, Rev. 3
120
Freescale Semiconductor
Preliminary
DC Electrical Characteristics
10.2 DC Electrical Characteristics
Table 10-5 DC Electrical Characteristics
At Recommended Operating Conditions
Symbol
Notes
Min
Typ
Max
Unit
Test
Conditions
Output Voltage High
VOH
Pin Group 1
2.4
—
—
V
IOH = IOHmax
Output Voltage Low
VOL
Pin Groups 1, 2
—
—
0.4
V
IOL = IOLmax
Digital Input Current High (a)
pull-up enabled or disabled
IIH
Pin Groups 1, 2
—
0
+/- 2.5
μA
VIN = 2.4V
to 5.5V
Comparator Input Current High
IIHC
Pin Group 3
—
0
+/- 2
μA
VIN = VDDA
IIHOSC
Pin Group 3
—
0
+/- 2
μA
VIN = VDDA
Digital Input Current Low1
pull-up enabled
pull-up disabled
IIL
Pin Groups 1, 2
μA
-15
—
-30
0
-60
+/- 2.5
VIN = 0V
Comparator Input Current Low
IILC
Pin Group 3
—
0
+/- 2
μA
VIN = 0V
Oscillator Input Current Low
IILOSC
Pin Group 3
—
0
+/- 2
μA
VIN = 0V
DAC Output Voltage Range
VDAC
Internal
Typically
VSSA +
40mV
—
Typically
VDDA 40mV
V
—
IOZ
Pin Groups 1, 2
—
0
+/- 2.5
μA
—
VHYS
Pin Groups 1, 2
—
0.35
—
V
—
CIN
—
10
—
pF
—
COUT
—
10
—
pF
—
Characteristic
Oscillator Input Current High
Output Current 1
High Impedance State
Schmitt Trigger Input Hysteresis
Input Capacitance
Output Capacitance
1. See Figure 10-1
Default Mode
Pin Group 1: GPIO, TDI, TDO, TMS, TCK
Pin Group 2: RESET, GPIOA7
Pin Group 3: ADC and Comparator Analog Inputs
Pin Group 4: XTAL, EXTAL
56F8025 Data Sheet, Rev. 3
Freescale Semiconductor
Preliminary
121
2.0
0.0
µA
- 2.0
- 4.0
- 6.0
- 8.0
- 10.0
0.0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
4.5
5.0
5.5
6.0
Volt
Figure 10-1 IIN/IOZ vs. VIN (Typical; Pull-Up Disabled)
Table 10-6 Current Consumption per Power Supply Pin
Typical @ 3.3V, 25°C
Mode
Conditions
Maximum@ 3.6V, 25°C
IDD1
IDDA
IDD1
IDDA
RUN
32MHz Device Clock
Relaxation Oscillator on
PLL powered on
Continuous MAC instructions with fetches from
Program Flash
All peripheral modules enabled. TMR and PWM
using 1X Clock
ADC/DAC powered on and clocked
Comparator powered on
48mA
18.8mA
—
—
WAIT
32MHz Device Clock
Relaxation Oscillator on
PLL powered on
Processor Core in WAIT state
All Peripheral modules enabled. TMR and PWM
using 1X Clock
ADC/DAC/Comparator powered off
29mA
0μA
—
—
STOP
4MHz Device Clock
Relaxation Oscillator on
PLL powered off
Processor Core in STOP state
All peripheral module and core clocks are off
ADC/DAC/Comparator powered off
5.4mA
0μA
—
—
56F8025 Data Sheet, Rev. 3
122
Freescale Semiconductor
Preliminary
DC Electrical Characteristics
Table 10-6 Current Consumption per Power Supply Pin (Continued)
Typical @ 3.3V, 25°C
Mode
Conditions
Maximum@ 3.6V, 25°C
IDD1
IDDA
IDD1
IDDA
STANDBY > STOP
100kHz Device Clock
Relaxation Oscillator in Standby mode
PLL powered off
Processor Core in STOP state
All peripheral module and core clocks are off
ADC/DAC/Comparator powered off
Voltage regulator in Standby mode
290μA
0μA
390μA
1μA
POWERDOWN
Device Clock is off
Relaxation Oscillator powered off
PLL powered off
Processor Core in STOP state
All peripheral module and core clocks are off
ADC /DAC/Comparator powered off
Voltage Regulator in Standby mode
190μA
0μA
250μA
1μA
1. No Output Switching
All ports configured as inputs
All inputs Low
No DC Loads
Table 10-7 Power-On Reset Low-Voltage Parameters
Characteristic
Symbol
Min
Typ
Max
Unit
Low-Voltage Interrupt for 3.3V supply1
VEI3.3
2.58
2.7
—
V
Low-Voltage Interrupt for 2.5V supply2
VE12.5
—
2.15
—
V
Low-Voltage Interrupt Recovery Hysteresis
VEIH
—
50
—
mV
Power-On Reset3
POR
—
1.8
1.9
V
1. When VDD drops below VEI3.3, an interrupt is generated.
2. When VDD drops below VEI32.5, an interrupt is generated.
3. Power-On Reset occurs whenever the internally regulated 2.5V digital supply drops below 1.8V. While
power is ramping up, this signal remains active for as long as the internal 2.5V is below 2.15V or the 3.3V
1/O voltage is below 2.7V, no matter how long the ramp-up rate is. The internally regulated voltage is
typically 100mV less than VDD during ramp-up until 2.5V is reached, at which time it self-regulates.
10.2.1
Voltage Regulator Specifications
The 56F8025 has two on-chip regulators. One supplies the PLL and relaxation oscillator. It has no external
pins and therefore has no external characteristics which must be guaranteed (other than proper operation
of the device). The second regulator supplies approximately 2.5V to the 56F8025’s core logic. This
regulator requires an external 4.4µF, or greater, capacitor for proper operation. Ceramic and tantalum
56F8025 Data Sheet, Rev. 3
Freescale Semiconductor
Preliminary
123
capacitors tend to provide better performance tolerances. The output voltage can be measured directly on
the VCAP pin. The specifications for this regulator are shown in Table 10-8.
Table 10-8. Regulator Parameters
Characteristic
Short Circuit Current
Short Circuit Tolerance
(VCAP shorted to ground)
Symbol
Min
Typical
Max
Unit
ISS
—
450
650
mA
TRSC
—
—
30
minutes
10.3 AC Electrical Characteristics
Tests are conducted using the input levels specified in Table 10-5. Unless otherwise specified,
propagation delays are measured from the 50% to the 50% point, and rise and fall times are measured
between the 10% and 90% points, as shown in Figure 10-2.
Low
VIH
Input Signal
High
90%
50%
10%
Midpoint1
VIL
Fall Time
Rise Time
Note: The midpoint is VIL + (VIH – VIL)/2.
Figure 10-2 Input Signal Measurement References
Figure 10-3 shows the definitions of the following signal states:
•
•
•
Active state, when a bus or signal is driven, and enters a low impedance state
Tri-stated, when a bus or signal is placed in a high impedance state
Data Valid state, when a signal level has reached VOL or VOH
•
Data Invalid state, when a signal level is in transition between VOL and VOH
Data2 Valid
Data1 Valid
Data1
Data3 Valid
Data2
Data3
Data
Tri-stated
Data Invalid State
Data Active
Data Active
Figure 10-3 Signal States
56F8025 Data Sheet, Rev. 3
124
Freescale Semiconductor
Preliminary
Flash Memory Characteristics
10.4 Flash Memory Characteristics
Table 10-9 Flash Timing Parameters
Characteristic
Symbol
Min
Typ
Max
Unit
Program time1
Tprog
20
—
40
μs
Erase time 2
Terase
20
—
—
ms
Tme
100
—
—
ms
Mass erase time
1. There is additional overhead which is part of the programming sequence. See the 56F802x and 56F803x Peripheral
Reference Manual for details.
2. Specifies page erase time. There are 512 bytes per page in the Program Flash memory.
10.5 External Clock Operation Timing
Table 10-10 External Clock Operation Timing Requirements1
Characteristic
Symbol
Min
Typ
Max
Unit
Frequency of operation (external clock driver)2
fosc
4
8
8
MHz
Clock Pulse Width3
tPW
6.25
—
—
ns
External Clock Input Rise Time4
trise
—
—
3
ns
External Clock Input Fall Time5
tfall
—
—
3
ns
1. Parameters listed are guaranteed by design.
2. See Figure 10-4 for details on using the recommended connection of an external clock driver.
3. The chip may not function if the high or low pulse width is smaller than 6.25ns.
4. External clock input rise time is measured from 10% to 90%.
5. External clock input fall time is measured from 90% to 10%.
VIH
External
Clock
90%
50%
10%
90%
50%
10%
tPW
tPW
tfall
trise
VIL
Note: The midpoint is VIL + (VIH – VIL)/2.
Figure 10-4 External Clock Timing
56F8025 Data Sheet, Rev. 3
Freescale Semiconductor
Preliminary
125
10.6 Phase Locked Loop Timing
Table 10-11 PLL Timing
Characteristic
Symbol
Min
Typ
Max
Unit
External reference crystal frequency for the PLL1
fosc
4
8
—
MHz
Internal reference relaxation oscillator frequency for the PLL
frosc
—
8
—
MHz
PLL output frequency2 (24 x reference frequency)
fop
96
192
—
MHz
PLL lock time3
tplls
—
40
100
µs
Accumulated jitter using an 8MHz external crystal as the PLL source4
JA
—
—
0.37
%
tjitterpll
—
350
—
ps
Cycle-to-cycle jitter
1. An externally supplied reference clock should be as free as possible from any phase jitter for the PLL to work correctly. The PLL
is optimized for 8MHz input.
2. The core system clock will operate at 1/6 of the PLL output frequency.
3. This is the time required after the PLL is enabled to ensure reliable operation.
4. This is measured on the CLKO signal (programmed as System clock) over 264 System clocks at 32MHz System clock frequency
and using an 8MHz oscillator frequency.
56F8025 Data Sheet, Rev. 3
126
Freescale Semiconductor
Preliminary
Relaxation Oscillator Timing
10.7 Relaxation Oscillator Timing
Table 10-12 Relaxation Oscillator Timing
Characteristic
Symbol
Minimum
Relaxation Oscillator output frequency1
Normal Mode
Standby Mode
fop
—
Relaxation Oscillator stabilization time2
troscs
—
1
3
ms
tjitterrosc
—
400
—
ps
Minimum tuning step size
—
.08
—
%
Maximum tuning step size
—
40
—
%
Variation over temperature -40°C to 150ºC4
—
Variation over temperature 0°C to 105ºC4
—
Cycle-to-cycle jitter. This is measured on the CLKO
signal (programmed prescaler_clock) over 264 clocks3
Typical
Maximum
Unit
—
8.05
200
MHz
kHz
+1.0 to -1.5 +3.0 to -3.0
0 to +1
+2.0 to -2.0
%
%
1. Output frequency after application of 8MHz trim value, at 125°C.
2. This is the time required from Standby to Normal mode transition.
3. JA is required to meet QSCI requirements.
4. See Figure 10-5
56F8025 Data Sheet, Rev. 3
Freescale Semiconductor
Preliminary
127
8.16
8.08
MHz
8
7.92
7.84
-50
-25
0
25
50
75
100
125
150
175
Degrees C (Junction)
Figure 10-5 Relaxation Oscillator Temperature Variation (Typical) After Trim at 125°C
56F8025 Data Sheet, Rev. 3
128
Freescale Semiconductor
Preliminary
Reset, Stop, Wait, Mode Select, and Interrupt Timing
10.8 Reset, Stop, Wait, Mode Select, and Interrupt Timing
.
Table 10-13 Reset, Stop, Wait, Mode Select, and Interrupt Timing1,2
Characteristic
Symbol
Typical Min
Typical Max
Unit
See Figure
Minimum RESET Assertion Duration
tRA
4T
—
ns
—
Minimum GPIO pin Assertion for Interrupt
tIW
2T
—
ns
10-6
tRDA
96TOSC + 64T
97TOSC + 65T
ns
—
tIF
—
6T
ns
—
RESET deassertion to First Address Fetch3
Delay from Interrupt Assertion to Fetch of first
instruction (exiting Stop)
1. In the formulas, T = system clock cycle and Tosc = oscillator clock cycle. For an operating frequency of 32MHz, T = 31.25ns. At
8MHz (used during Reset and Stop modes), T = 125ns.
2. Parameters listed are guaranteed by design.
3. During Power-On Reset, it is possible to use the 56F8025 internal reset stretching circuitry to extend this period to 2^21T.
GPIO pin
(Input)
TIW
Figure 10-6 GPIO Interrupt Timing (Negative Edge-Sensitive)
56F8025 Data Sheet, Rev. 3
Freescale Semiconductor
Preliminary
129
10.9 Serial Peripheral Interface (SPI) Timing
Table 10-14 SPI Timing1
Characteristic
Symbol
Cycle time
Master
Slave
tC
Enable lead time
Master
Slave
tELD
Enable lag time
Master
Slave
tELG
Clock (SCK) high time
Master
Slave
tCH
Clock (SCK) low time
Master
Slave
tCL
Data set-up time required for inputs
Master
Slave
tDS
Data hold time required for inputs
Master
Slave
tDH
Access time (time to data active from
high-impedance state)
Slave
tA
Disable time (hold time to high-impedance state)
Slave
tD
Data Valid for outputs
Master
Slave (after enable edge)
tDV
Data invalid
Master
Slave
tDI
Rise time
Master
Slave
tR
Fall time
Master
Slave
tF
Min
Max
Unit
125
62.5
—
—
ns
ns
—
31
—
—
ns
ns
—
125
—
—
ns
ns
50
31
—
—
ns
ns
50
31
—
—
ns
ns
20
0
—
—
ns
ns
0
2
—
—
ns
ns
4.8
15
ns
3.7
15.2
ns
—
—
4.5
20.4
ns
ns
0
0
—
—
ns
ns
—
—
11.5
10.0
ns
ns
—
—
9.7
9.0
ns
ns
See Figure
10-7, 10-8,
10-9, 10-10
10-10
10-10
10-7, 10-8,
10-9, 10-10
10-10
10-7, 10-8,
10-9, 10-10
10-7, 10-8,
10-9, 10-10
10-10
10-10
10-7, 10-8,
10-9, 10-10
10-7, 10-8,
10-9, 10-10
10-7, 10-8,
10-9, 10-10
10-7, 10-8,
10-9, 10-10
1. Parameters listed are guaranteed by design.
56F8025 Data Sheet, Rev. 3
130
Freescale Semiconductor
Preliminary
Serial Peripheral Interface (SPI) Timing
SS
SS is held High on master
(Input)
tC
tR
tF
tCL
SCLK (CPOL = 0)
(Output)
tCH
tF
tR
tCL
SCLK (CPOL = 1)
(Output)
tDH
tCH
tDS
MISO
(Input)
MSB in
Bits 14–1
tDI
MOSI
(Output)
Master MSB out
tDV
Bits 14–1
tF
LSB in
tDI(ref)
Master LSB out
tR
Figure 10-7 SPI Master Timing (CPHA = 0)
56F8025 Data Sheet, Rev. 3
Freescale Semiconductor
Preliminary
131
SS
(Input)
SS is held High on master
tC
tF
tR
tCL
SCLK (CPOL = 0)
(Output)
tCH
tF
tCL
SCLK (CPOL = 1)
(Output)
tCH
tDS
tR
MISO
(Input)
MSB in
tDH
Bits 14–1
tDI
tDV(ref)
MOSI
(Output)
LSB in
tDV
Master MSB out
tDI(ref)
Bits 14– 1
Master LSB out
tF
tR
Figure 10-8 SPI Master Timing (CPHA = 1)
SS
(Input)
tC
tF
tCL
SCLK (CPOL = 0)
(Input)
tR
tCH
tELD
tCL
SCLK (CPOL = 1)
(Input)
tCH
tA
MISO
(Output)
Slave MSB out
tDV
tDH
MSB in
tF
tR
Bits 14–1
tDS
MOSI
(Input)
tELG
Bits 14–1
tD
Slave LSB out
tDI
tDI
LSB in
Figure 10-9 SPI Slave Timing (CPHA = 0)
56F8025 Data Sheet, Rev. 3
132
Freescale Semiconductor
Preliminary
Quad Timer Timing
SS
(Input)
tF
tC
tR
tCL
SCLK (CPOL = 0)
(Input)
tCH
tELG
tELD
tCL
SCLK (CPOL = 1)
(Input)
tDV
tCH
tR
tA
MISO
(Output)
tD
tF
Slave MSB out
Bits 14–1
tDS
tDV
tDI
tDH
MOSI
(Input)
MSB in
Slave LSB out
Bits 14–1
LSB in
Figure 10-10 SPI Slave Timing (CPHA = 1)
10.10 Quad Timer Timing
Table 10-15 Timer Timing1, 2
Characteristic
Symbol
Min
Max
Unit
See Figure
PIN
2T + 6
—
ns
10-11
Timer input high / low period
PINHL
1T + 3
—
ns
10-11
Timer output period
POUT
125
—
ns
10-11
POUTHL
50
—
ns
10-11
Timer input period
Timer output high / low period
1. In the formulas listed, T = the clock cycle. For 32MHz operation, T = 31.25ns.
2. Parameters listed are guaranteed by design.
56F8025 Data Sheet, Rev. 3
Freescale Semiconductor
Preliminary
133
Timer Inputs
PIN
PINHL
PINHL
POUT
POUTHL
POUTHL
Timer Outputs
Figure 10-11 Timer Timing
56F8025 Data Sheet, Rev. 3
134
Freescale Semiconductor
Preliminary
Serial Communication Interface (SCI) Timing
10.11 Serial Communication Interface (SCI) Timing
Table 10-16 SCI Timing1
Characteristic
Symbol
Min
Max
Unit
See Figure
BR
—
(fMAX/16)
Mbps
—
RXD3 Pulse Width
RXDPW
0.965/BR
1.04/BR
ns
10-12
TXD4 Pulse Width
TXDPW
0.965/BR
1.04/BR
ns
10-13
Baud Rate2
LIN Slave Mode
Deviation of slave node clock from
nominal clock rate before
synchronization
Deviation of slave node clock relative
to the master node clock after
synchronization
FTOL_UNSYNCH
-14
14
%
—
FTOL_SYNCH
-2
2
%
—
TBREAK
13
—
Master
node bit
periods
—
11
—
Slave node
bit periods
—
Minimum break character length
1. Parameters listed are guaranteed by design.
2. fMAX is the frequency of operation of the system clock in MHz, which is 32MHz for the 56F8025 device.
3. The RXD pin in QSCI0 is named RXD0.
4. The TXD pin in QSCI0 is named TXD0.
RXD
QSCI Receive
data pin
(Input)
RXDPW
Figure 10-12 RXD Pulse Width
TXD
QSCI Receive
data pin
(Input)
TXDPW
Figure 10-13 TXD Pulse Width
56F8025 Data Sheet, Rev. 3
Freescale Semiconductor
Preliminary
135
10.12 Inter-Integrated Circuit Interface (I2C) Timing
Table 10-17 I2C Timing
Characteristic
Symbol
Standard Mode
Fast Mode
Unit
Minimum
Maximum
Minimum
Maximum
fSCL
0
100
0
400
kHz
tHD; STA
4.0
—
0.6
—
μs
LOW period of the SCL
clock
tLOW
4.7
—
1.23
—
μs
HIGH period of the SCL
clock
tHIGH
4.0
—
0.6
—
μs
Set-up time for a repeated
START condition
tSU; STA
4.7
—
0.6
—
μs
Data hold time for I2C bus
devices
tHD; DAT
01
3.452
01
0.92
μs
Data set-up time
tSU; DAT
2503
—
1003, 4
—
ns
Rise time of both SDA and
SCL signals
tr
—
1000
20 +0.1Cb5
300
ns
Fall time of both SDA and
SCL signals
tf
—
300
20 +0.1Cb5
300
ns
Set-up time for STOP
condition
tSU; STO
4.0
—
0.6
—
μs
Bus free time between
STOP and START
condition
tBUF
4.7
—
1.3
—
μs
Pulse width of spikes that
must be suppressed by
the input filter
tSP
N/A
N/A
0
50
ns
SCL Clock Frequency
Hold time (repeated)
START condition. After
this period, the first clock
pulse is generated.
1. The master mode I2C deasserts ACK of an address byte simultaneously with the falling edge of SCL. If no slaves
acknowledge this address byte, a negative hold time can result, depending on the edge rates of the SDA and SCL lines.
2. The maximum tHD; DAT must be met only if the device does not stretch the LOW period (tLOW) of the SCL signal.
3. Set-up time in slave-transmitter mode is 1 IPBus clock period, if the TX FIFO is empty.
4. A Fast mode I2C bus device can be used in a Standard mode I2C bus system, but the requirement tSU; DAT > = 250ns
must then be met. This will automatically be the case if the device does not stretch the LOW period of the SCL signal.
If such a device does stretch the LOW period of the SCL signal, it must output the next data bit to the SDA line
trmax + tSU; DAT = 1000 + 250 = 1250ns (according to the Standard mode I2C bus specification) before the SCL line is
released.
5. Cb = total capacitance of the one bus line in pF
56F8025 Data Sheet, Rev. 3
136
Freescale Semiconductor
Preliminary
Inter-Integrated Circuit Interface (I2C) Timing
SDA
tf
tLOW
tSU; DAT
tr
tf
tHD; STA
tSP
tr
tBUF
SCL
S
tHD; STA
tHD; DAT
tHIGH
tSU; STA
SR
tSU; STO
P
S
Figure 10-14 Timing Definition for Fast and Standard Mode Devices on the I2C Bus
56F8025 Data Sheet, Rev. 3
Freescale Semiconductor
Preliminary
137
10.13 JTAG Timing
Table 10-18 JTAG Timing
Characteristic
Symbol
Min
Max
Unit
See Figure
TCK frequency of operation1
fOP
DC
SYS_CLK/8
MHz
10-15
TCK clock pulse width
tPW
50
—
ns
10-15
TMS, TDI data set-up time
tDS
5
—
ns
10-16
TMS, TDI data hold time
tDH
5
—
ns
10-16
TCK low to TDO data valid
tDV
—
30
ns
10-16
TCK low to TDO tri-state
tTS
—
30
ns
10-16
1. TCK frequency of operation must be less than 1/8 the processor rate.
1/fOP
tPW
tPW
VM
VM
VIH
TCK
(Input)
VIL
VM = VIL + (VIH – VIL)/2
Figure 10-15 Test Clock Input Timing Diagram
TCK
(Input)
TDI
TMS
(Input)
tDS
tDH
Input Data Valid
tDV
TDO
(Output)
Output Data Valid
tTS
TDO
(Output)
Figure 10-16 Test Access Port Timing Diagram
56F8025 Data Sheet, Rev. 3
138
Freescale Semiconductor
Preliminary
Analog-to-Digital Converter (ADC) Parameters
10.14 Analog-to-Digital Converter (ADC) Parameters
Table 10-19 ADC Parameters1
Parameter
Symbol
Min
Typ
Max
Unit
Resolution
RES
12
—
12
Bits
ADC internal clock
fADIC
0.1
—
5.33
MHz
Conversion range
RAD
VREFL
—
VREFH
V
ADC power-up time2
tADPU
—
6
13
tAIC cycles3
Recovery from auto standby
tREC
—
0
1
tAIC cycles3
Conversion time
tADC
—
6
—
tAIC cycles3
Sample time
tADS
—
1
—
tAIC cycles3
Integral non-linearity4
(Full input signal range)
INL
—
+/- 3
+/- 5
LSB5
Differential non-linearity
DNL
—
+/- .6
+/- 1
LSB5
DC Specifications
Accuracy
Monotonicity
GUARANTEED
Offset Voltage Internal Ref
VOFFSET
—
+/- 4
+/- 9
mV
Offset Voltage External Ref
VOFFSET
—
+/- 6
+/- 12
mV
EGAIN
—
.998 to 1.002
1.01 to .99
—
Input voltage (external reference)
VADIN
VREFL
—
VREFH
V
Input voltage (internal reference)
VADIN
VSSA
—
VDDA
V
Input leakage
IIA
—
0
+/- 2
μA
VREFH current
IVREFH
—
0
—
μA
Input injection current7, per pin
IADI
—
—
3
mA
Input capacitance
CADI
—
See Figure 10-17
—
pF
Input impedance
XIN
—
See Figure 10-17
—
Ohms
Signal-to-noise ratio
SNR
60
65
dB
Total Harmonic Distortion
Gain Error (transfer gain)
ADC Inputs6 (Pin Group 3)
AC Specifications
THD
60
64
dB
Spurious Free Dynamic Range
SFDR
61
66
dB
Signal-to-noise plus distortion
SINAD
58
62
dB
Effective Number Of Bits
ENOB
—
10.0
Bits
1. All measurements were made at VDD = 3.3V, VREFH = 3.3V, and VREFL = ground
2. Includes power-up of ADC and VREF
3. ADC clock cycles
4. INL measured from VIN = VREFL to VIN = VREFH
5. LSB = Least Significant Bit = 0.806mV
6. Pin groups are detailed following Table 10-1.
7. The current that can be injected or sourced from an unselected ADC signal input without impacting the performance of the
ADC.
56F8025 Data Sheet, Rev. 3
Freescale Semiconductor
Preliminary
139
10.15 Equivalent Circuit for ADC Inputs
Figure 10-17 illustrates the ADC input circuit during sample and hold. S1 and S2 are always open/closed
at the same time that S3 is closed/open. When S1/S2 are closed and S3 is open, one input of the sample
and hold circuit moves to (VREFHx - VREFLx) / 2, while the other charges to the analog input voltage. When
the switches are flipped, the charge on C1 and C2 are averaged via S3, with the result that a single-ended
analog input is switched to a differential voltage centered about (VREFHx - VREFLx) / 2. The switches
switch on every cycle of the ADC clock (open one-half ADC clock, closed one-half ADC clock). Note that
there are additional capacitances associated with the analog input pad, routing, etc., but these do not filter
into the S/H output voltage, as S1 provides isolation during the charge-sharing phase.
One aspect of this circuit is that there is an on-going input current, which is a function of the analog input
voltage, VREF, and the ADC clock frequency.
125Ω ESD Resistor
8pF noise damping capacitor
3
Analog Input
4
S1
C1
S/H
S3
1
1.
2.
3.
4.
2
(VREFHx - VREFL x) / 2
C2
S2
C1 = C2 = 1pF
Parasitic capacitance due to package, pin-to-pin and pin-to-package base coupling; 1.8pF
Parasitic capacitance due to the chip bond pad, ESD protection devices and signal routing; 2.04pF
Equivalent resistance for the channel select mux; 100 ohms
Sampling capacitor at the sample and hold circuit. Capacitor C1 is normally disconnected from the input and is only
connected to it at sampling time; 1.4pF
Figure 10-17 Equivalent Circuit for A/D Loading
10.16 Comparator (CMP) Parameters
Table 10-20 CMP Parameters
Characteristic
Conditions/Comments
Symbol
Min
Typ
Max
Unit
Within range of VDDA - .1V to
VSSA + .1V
VOFFSET
—
+/- 10
+/- 20
mV
Input Propagation Delay
tPD
—
35
45
ns
Power-up time
tCPU
—
TBD
TBD
Input Offset Voltage1
1. No guaranteed specification within 0.1V of VDDA or VSSA
56F8025 Data Sheet, Rev. 3
140
Freescale Semiconductor
Preliminary
Digital-to-Analog Converter (DAC) Parameters
10.17 Digital-to-Analog Converter (DAC) Parameters
Table 10-21 DAC Parameters
Parameter
Conditions/Comments
Symbol
Min
Typ
Max
Unit
12
bits
DC Specifications
Resolution
12
Conversion time
Conversion rate
Power-up time
Time from release of PWRDWN
signal until DACOUT signal is
valid
TBD
—
2
µS
TBD
—
500.000
conv/sec
tDAPU
—
—
11
µS
Accuracy
Integral non-linearity1
Range of input digital words:
410 to 3891 ($19A - $F33)
5% to 95% of full range
INL
—
+/- 3
+/- 8.0
LSB2
Differential non-linearity1
Range of input digital words:
410 to 3891 ($19A - $F33)
5% to 95% of full range
DNL
—
+/- .8
<-1
LSB2
Monotonicity
> 6 sigma monotonicity,
< 3.4 ppm non-monotonicity
Offset error1
Range of input digital words:
410 to 3891 ($19A - $F33)
5% to 95% of full range
VOFFSET
—
+/- 25
+/- 40
mV
Gain error1
Range of input digital words:
410 to 3891 ($19A - $F33)
5% to 95% of full range
EGAIN
—
+/- .5
+/- 1.5
%
Within 40mV of either VREFLX or
VREFHX
VOUT
VREFLX
+.04V
—
VREFHX
- .04V
V
guaranteed
—
DAC Output
Output voltage range
AC Specifications
Signal-to-noise ratio
SNR
—
TBD
—
dB
Spurious free dynamic
range
SFDR
—
TBD
—
dB
Effective number of bits
ENOB
9
—
—
bits
1. No guaranteed specification within 5% of VDDA or VSSA
2. LSB = 0.806mV
56F8025 Data Sheet, Rev. 3
Freescale Semiconductor
Preliminary
141
10.18 Power Consumption
See Section 10.1 for a list of IDD requirements for the 56F8025. This section provides additional detail
which can be used to optimize power consumption for a given application.
Power consumption is given by the following equation:
Total power =
A: internal [static component]
+B: internal [state-dependent component]
+C: internal [dynamic component]
+D: external [dynamic component]
+E: external [static component]
A, the internal [static component], is comprised of the DC bias currents for the oscillator, leakage currents,
PLL, and voltage references. These sources operate independently of processor state or operating
frequency.
B, the internal [state-dependent component], reflects the supply current required by certain on-chip
resources only when those resources are in use. These include RAM, Flash memory and the ADCs.
C, the internal [dynamic component], is classic C*V2*F CMOS power dissipation corresponding to the
56800E core and standard cell logic.
D, the external [dynamic component], reflects power dissipated on-chip as a result of capacitive loading
on the external pins of the chip. This is also commonly described as C*V2*F, although simulations on two
of the I/O cell types used on the 56800E reveal that the power-versus-load curve does have a non-zero
Y-intercept.
Table 10-22 I/O Loading Coefficients at 10MHz
Intercept
Slope
8mA drive
1.3
0.11mW / pF
4mA drive
1.15mW
0.11mW / pF
Power due to capacitive loading on output pins is (first order) a function of the capacitive load and
frequency at which the outputs change. Table 10-22 provides coefficients for calculating power dissipated
in the I/O cells as a function of capacitive load. In these cases:
TotalPower = Σ((Intercept + Slope*Cload)*frequency/10MHz)
where:
•
•
•
Summation is performed over all output pins with capacitive loads
TotalPower is expressed in mW
Cload is expressed in pF
56F8025 Data Sheet, Rev. 3
142
Freescale Semiconductor
Preliminary
56F8025 Package and Pin-Out Information
Because of the low duty cycle on most device pins, power dissipation due to capacitive loads was found
to be fairly low when averaged over a period of time.
E, the external [static component], reflects the effects of placing resistive loads on the outputs of the
device. Sum the total of all V2/R or IV to arrive at the resistive load contribution to power. Assume V = 0.5
for the purposes of these rough calculations. For instance, if there is a total of eight PWM outputs driving
10mA into LEDs, then P = 8*.5*.01 = 40mW.
In previous discussions, power consumption due to parasitics associated with pure input pins is ignored,
as it is assumed to be negligible.
Part 11 Packaging
11.1 56F8025 Package and Pin-Out Information
This section contains package and pin-out information for the 56F8025. This device comes in a 44-pin
Low-profile Quad Flat Pack (LQFP). Figure 11-1 shows the package outline, Figure 11-2 shows the
mechanical parameters and Table 11-1 lists the pin-out.
56F8025 Data Sheet, Rev. 3
Freescale Semiconductor
Preliminary
143
GPIOB1 / SS0 / SDA
GPIOB7 / TXD0 / SCL
VCAP
VDD
VSS
GPIOD5 / XTAL / CLKIN
GPIOD4 / EXTAL
GPIOA1 / PWM1
GPIOA0 / PWM0
TDI / GPIOD0
GPIOB11 / COUTB_A
TMS / GPIOD3
TDO / GPIOD1
ORIENTATION
MARK
GPIOB6 / RXD0 / SDA / CLKIN
GPIOA3 / PWM3
GPIOA2 / PWM2
PIN 34
GPIOA4 / PWM4 / TA2 / FAULT1
PIN 1
GPIOB5 / TA1 / FAULT3 / CLKIN
GPIOB0 / SCLK0 / SCL
GPIOA9 / FAULT2 / TA3 / CMPBI1
VDD
GPIOA11 / CMPBI2
VSS
GPIOC4 / ANB0 & CMPBI3
GPIOA5 / PWM5 / TA3 / FAULTA2
GPIOC5 / ANB1
GPIOA8 / FAULTA1 / TA2 / CMPAI1
GPIOC6 / ANB2 / VREFHB
PIN 23
PIN 12
GPIOC7 / ANB3 / VREFLB
GPIOA10 / CMPAI2
GPIOA6 / FAULT0 / TA0
VDDA
GPIOB3 / MOSI0 / TA3 / PSRC1
RESET / GPIOA7
GPIOB10 / CMPAO
TCK / GPIOD2
VCAP
VSS
GPIOC0 / ANA0 & CMPAI3
GPIOC1 / ANA1
GPIOC2 / ANA2 / VREFHA
GPIOC3 / ANA3 / VREFLA
VSSA
GPIOB2 / MISO0 / TA2 / PSRC0
Figure 11-1 Top View, 56F8025 44-Pin LQFP Package
56F8025 Data Sheet, Rev. 3
144
Freescale Semiconductor
Preliminary
56F8025 Package and Pin-Out Information
Table 11-1 56F8025 44-Pin LQFP Package Identification by Pin Number1
Pin
#
Signal Name
Pin
#
Signal Name
Pin
#
Signal Name
Pin
#
Signal Name
1
GPIOB6
RXD0 / SDA / CLKIN
12
VSSA
23
GPIOB2
MISO0 / TA2 / PSRC0
34
VCAP
2
GPIOB1
SS0 / SDA
13
GPIOC3
ANA3 / VREFLA
24
GPIOA6
FAULT0 / TA0
35
VDD
3
GPIOB7
TXD0 / SCL
14
GPIOC2
ANA2 / VREFHA
25
GPIOA10
CMPAI2
36
VSS
4
GPIOB5
TA1 / FAULT3 / CLKIN
15
GPIOC1
ANA1
26
GPIOA8
FAULT1 / TA2 /
CMPAI1
37
GPIOD5
XTAL / CLKIN
5
GPIOA9
FAULT2 / TA3 /
CMPBI1
16
GPIOC0
ANA0 & CMPAI3
27
GPIOA5
PWM5 / TA3 / FAULT2
38
GPIOD4
EXTAL
6
GPIOA11
CMPBI2
17
VSS
28
VSS
39
GPIOA1
PWM1
7
GPIOC4
ANB0 &CMPBI3
18
VCAP
29
VDD
40
GPIOA0
PWM0
8
GPIOC5
ANB1
19
TCI
GPIOD2
30
GPIOB0
SCLK0 / SCL
41
TDI
GPIOD0
9
GPIOC6
ANB2 / VREFHB
20
GPIOB10
CMPAO
31
GPIOA4
PWM4 / TA2 / FAULT1
42
GPIOB11
COUTB_A
10
GPIOC7
ANB3 / VREFLB
21
RESET
GPIOA7
32
GPIOA2
PWM2
43
TMS
GPIOD3
11
VDDA
22
GPIOB3
MOSI0 / TA3 /
PSRC1
33
GPIOA3
PWM3
44
TDO
GPIOD1
1. Alternate signals are in italic
56F8025 Data Sheet, Rev. 3
Freescale Semiconductor
Preliminary
145
Figure 11-2 56F8025 44-Pin LQFP Mechanical Information (1 of 3)
Please see www.freescale.com for the most current case outline.
56F8025 Data Sheet, Rev. 3
146
Freescale Semiconductor
Preliminary
56F8025 Package and Pin-Out Information
Figure 11-3 56F8025 44-Pin LQFP Mechanical Information (2 of 3)
Please see www.freescale.com for the most current case outline.
56F8025 Data Sheet, Rev. 3
Freescale Semiconductor
Preliminary
147
Figure 11-4 56F8025 44-Pin LQFP Mechanical Information (3 of 3)
Please see www.freescale.com for the most current case outline.
56F8025 Data Sheet, Rev. 3
148
Freescale Semiconductor
Preliminary
Thermal Design Considerations
Part 12 Design Considerations
12.1 Thermal Design Considerations
An estimation of the chip junction temperature, TJ, can be obtained from the equation:
TJ = TA + (RθJΑ x PD)
where:
TA = Ambient temperature for the package (oC)
RθJΑ = Junction-to-ambient thermal resistance (oC/W)
PD
= Power dissipation in the package (W)
The junction-to-ambient thermal resistance is an industry-standard value that provides a quick and easy
estimation of thermal performance. Unfortunately, there are two values in common usage: the value
determined on a single-layer board and the value obtained on a board with two planes. For packages such
as the PBGA, these values can be different by a factor of two. Which value is closer to the application
depends on the power dissipated by other components on the board. The value obtained on a single layer
board is appropriate for the tightly packed printed circuit board. The value obtained on the board with the
internal planes is usually appropriate if the board has low-power dissipation and the components are well
separated.
When a heat sink is used, the thermal resistance is expressed as the sum of a junction-to-case thermal
resistance and a case-to-ambient thermal resistance:
RθJA = RθJC + RθCA
where:
RθJA =
RθJC =
RθCA =
Package junction-to-ambient thermal resistance (°C/W)
Package junction-to-case thermal resistance (°C/W)
Package case-to-ambient thermal resistance (°C/W)
RθJC is device related and cannot be influenced by the user. The user controls the thermal environment to
change the case to ambient thermal resistance, RθCA. For instance, the user can change the size of the heat
sink, the air flow around the device, the interface material, the mounting arrangement on printed circuit
board, or change the thermal dissipation on the printed circuit board surrounding the device.
To determine the junction temperature of the device in the application when heat sinks are not used, the
Thermal Characterization Parameter (ΨJT) can be used to determine the junction temperature with a
measurement of the temperature at the top center of the package case using the following equation:
TJ = TT + (ΨJT x PD)
where:
TT
ΨJT
PD
= Thermocouple temperature on top of package (oC)
= Thermal characterization parameter (oC/W)
= Power dissipation in package (W)
56F8025 Data Sheet, Rev. 3
Freescale Semiconductor
Preliminary
149
The thermal characterization parameter is measured per JESD51-2 specification using a 40-gauge type T
thermocouple epoxied to the top center of the package case. The thermocouple should be positioned so
that the thermocouple junction rests on the package. A small amount of epoxy is placed over the
thermocouple junction and over about 1mm of wire extending from the junction. The thermocouple wire
is placed flat against the package case to avoid measurement errors caused by cooling effects of the
thermocouple wire.
When heat sink is used, the junction temperature is determined from a thermocouple inserted at the
interface between the case of the package and the interface material. A clearance slot or hole is normally
required in the heat sink. Minimizing the size of the clearance is important to minimize the change in
thermal performance caused by removing part of the thermal interface to the heat sink. Because of the
experimental difficulties with this technique, many engineers measure the heat sink temperature and then
back-calculate the case temperature using a separate measurement of the thermal resistance of the
interface. From this case temperature, the junction temperature is determined from the junction-to-case
thermal resistance.
12.2 Electrical Design Considerations
CAUTION
This device contains protective circuitry to guard
against damage due to high static voltage or electrical
fields. However, normal precautions are advised to
avoid application of any voltages higher than
maximum-rated voltages to this high-impedance circuit.
Reliability of operation is enhanced if unused inputs are
tied to an appropriate voltage level.
Use the following list of considerations to assure correct operation of the 56F8025:
•
Provide a low-impedance path from the board power supply to each VDD pin on the 56F8025 and from the
board ground to each VSS (GND) pin
•
The minimum bypass requirement is to place 0.01–0.1µF capacitors positioned as close as possible to the
package supply pins. The recommended bypass configuration is to place one bypass capacitor on each of
the VDD/VSS pairs, including VDDA/VSSA. Ceramic and tantalum capacitors tend to provide better
tolerances.
Ensure that capacitor leads and associated printed circuit traces that connect to the chip VDD and VSS (GND)
pins are as short as possible
Bypass the VDD and VSS with approximately 100µF, plus the number of 0.1µF ceramic capacitors
•
•
•
•
PCB trace lengths should be minimal for high-frequency signals
Consider all device loads as well as parasitic capacitance due to PCB traces when calculating capacitance.
This is especially critical in systems with higher capacitive loads that could create higher transient currents
in the VDD and VSS circuits.
56F8025 Data Sheet, Rev. 3
150
Freescale Semiconductor
Preliminary
Electrical Design Considerations
•
Take special care to minimize noise levels on the VREF, VDDA, and VSSA pins
•
Using separate power planes for VDD and VDDA and separate ground planes for VSS and VSSA are
recommended. Connect the separate analog and digital power and ground planes as close as possible to
power supply outputs. If both analog circuit and digital circuit are powered by the same power supply, it is
advisable to connect a small inductor or ferrite bead in serial with both VDDA and VSSA traces.
•
It is highly desirable to physically separate analog components from noisy digital components by ground
planes. Do not place an analog trace in parallel with digital traces. It is also desirable to place an analog
ground trace around an analog signal trace to isolate it from digital traces.
•
Because the Flash memory is programmed through the JTAG/EOnCE port, QSPI, QSCI, or I2C, the
designer should provide an interface to this port if in-circuit Flash programming is desired
If desired, connect an external RC circuit to the RESET pin. The Resistor value should be in the range of
4.7k—10k; the Capacitor value should be in the range of 0.22µf - 4.7µf.
Add a 3.3k external pull-up on the TMS pin of the JTAG port to keep EOnce in a restate during normal
operation if JTAG converter is not present
During reset and after reset but before I/O initialization, all I/O pins are at input state with internal pull-up
enable. The typical value of internal pull-up is around 110K. These internal pull-ups can be disabled by
software.
To eliminate PCB trace impedance effect, each ADC input should have a 33pf-10 ohm RC filter
Device GPIOs have only a down (substrate) diode on the GPIO circuit. Devices do not have a positive clamp
diode because GPIOs use a floating gate structure to tolerate 5V input. The absolute maximum clamp
current is -20mA at Vin less than 0V. The continuous clamp current is -2mA at Vin less than 0V. If positive
voltage spikes are a concern, a positive clamp is recommended.
•
•
•
•
•
Part 13 Ordering Information
Table 13-1 lists the pertinent information needed to place an order. Consult a Freescale Semiconductor
sales office or authorized distributor to determine availability and to order devices.
Table 13-1 56F8025 Ordering Information
Device
Supply
Voltage
MC56F8025
3.0–3.6 V
Package Type
Low-Profile Quad Flat Pack (LQFP)
Pin
Count
Frequency
(MHz)
Ambient
Temperature
Range
Order Number
44
32
-40° to + 105° C
MC56F8025VLD*
* This package is RoHS compliant.
56F8025 Data Sheet, Rev. 3
Freescale Semiconductor
Preliminary
151
Part 14 Appendix
Register acronyms are revised from previous device data sheets to provide a cleaner register description.
A cross reference to legacy and revised acronyms are provided in the following table.
Table 14-1 Legacy and Revised Acronyms
Peripheral Reference
Manual
Data Sheet
Register Name
New
Acronym
Legacy
Acronym
New
Acronym
Legacy
Acronym
Processor Expert
Acronym
Memory
Address
Start
End
Analog-to-Digital Converter (ADC) Module
Control 1 Register
Control 2 Register
CTRL1
ADCR1
ADC_CTRL1
ADC_ADCR1
ADC_ADCR1
0xF080
CTRL2
ADCR2
ADC_CTRL2
ADC_ADCR2
ADC_ADCR2
0xF081
Zero Crossing Control
Register
ZXCTRL
ADZCC
ADC_ZXCTRL
ADC_ADZCC
ADC_ADZCC
0xF082
Channel List 1
Register
CLIST1
ADLST1
ADC_CLIST1
ADC_ADLST1
ADC_ADLST1
0xF083
Channel List 2
Register
CLIST2
ADLST2
ADC_CLIST2
ADC_ADLST2
ADC_ADLST2
0xF084
Channel List 3
Register
CLIST3
ADC_CLIST3
ADC_ADCLST3
ADC_ADCLST3
0xF085
Channel List 4
Register
CLIST4
ADC_CLIST4
ADC_ADCLST4
ADC_ADCLST4
0xF086
Sample Disable
Register
SDIS
ADSDIS
ADC_SDIS
ADC_ADSDIS
ADC_ADSDIS
0xF087
Status Register
STAT
ADSTAT
ADC_STAT
ADC_ADSTAT
ADC_ADSTAT
0xF088
Conversion Ready
Register
RDY
ADC_CNRDY
ADC_ADCNRDY
ADC_ADCNRDY
0xF089
Limit Status Register
LIMSTAT
ADLSTAT
ADC_LIMSTAT
ADC_ADLSTAT
ADC_ADLSTAT
0xF08A
Zero Crossing Status
Register
ZXSTAT
ADZCSTAT
ADC_ZXSTAT
ADC_ADZCSTAT
ADC_ADZCSTAT
0xF08B
Result 0-7 Registers
RSLT0-7
ADRSLT0-7
ADC_RSLT0-7
ADC_ADRSLT0-7
ADC_ADRSLT0-7
0xF08C
0XF093
0XF09B
Result 8-15 Registers
RSLT8-15
ADC_RSLT8-15
ADC_ADRSLT8-15
ADC_ADRSLT8-15
0xF094
Low Limit 0-7
Registers
LOLIM0-7
ADLLMT0-7
ADC_LOLIM0-7
ADC_ADLLMT0-7
ADC_ADLLMT0-7
0XF09C 0XF0A3
High Limit 0-7
Registers
HILIM0-7
ADHLMT0-7
ADC_HILIM0-7
ADC_ADHLMT0-7
ADC_ADHLMT0-7
0XF0A4 0XF0AB
Offset 0-7 Registers
OFFST0-7
ADOFS0-7
ADC_OFFST0-7
ADC_ADOFS0-7
ADC_ADOFS0-7
0XF0AC 0XF0B3
Power Control
Register
PWR
ADPOWER
ADC_PWR
ADC_ADPOWER
ADC_ADPOWER
0XF0B4
Calibration Register
CAL
ADC_CAL
ADC_ADCAL
ADC_ADCAL
0XF0B5
Computer Operating Properly (COP) Module
Control Register
CTRL
COPCTL
COP_CTRL
COPCTL
COPCTL
0XF120
Timeout Register
TOUT
COPTO
COP_TOUT
COPTO
COPTO
0XF121
Counter Register
CNTR
COPCTR
COP_CNTR
COPCTR
COPCTR
0XF122
56F8025 Data Sheet, Rev. 3
152
Freescale Semiconductor
Preliminary
Electrical Design Considerations
Table 14-1 Legacy and Revised Acronyms (Continued)
Peripheral Reference
Manual
Data Sheet
Register Name
New
Acronym
Legacy
Acronym
New
Acronym
Legacy
Acronym
Processor Expert
Acronym
Memory
Address
Start
End
Inter-Integrated Circuit Interface (I2C) Module
Control Register
CTRL
I2C_CTRL
I2C_IBCR
I2C_IBCR
0xF280
Target Address
Register
TAR
IBCR
I2C_TAR
I2CTAR
I2C_TAR
0xF282
Slave Address
Register
SAR
I2C_SAR
I2CSAR
I2C_SAR
0xF242
Data Buffer &
Command Register
DATA
I2C_DATA
I2C_DATACMD
I2C_DATACMD
0xF288
Standard Speed
Clock SCL High
Count Register
SSHCNT
I2C_SS_SCL_HCNT
I2C_SS_SCLHCNT
I2C_SS_SCLHCNT
0xF28A
Standard Speed
Clock SCL Low Count
Register
SSLCNT
I2C_SS_SCL_LCNT
I2C_SS_SCLLCNT
I2C_SS_SCLLCNT
0xF28C
Fast Speed Clock
SCL High Count
Register
FSHCNT
I2C_FS_SCL_HCNT
I2C_FS_SCLHCNT
I2C_FS_SCLHCNT
0xF28E
Fast Speed Clock
SCL Low Count
Register
FSLCNT
I2C_FS_SCL_LCNT
I2C_FS_SCLLCNT
I2C_FS_SCLLCNT
0xF290
Interrupt Status
Register
ISTAT
I2C_INTR_STAT
I2C_INTRSTAT
I2C_INTRSTAT
0xF296
Interrupt Mask
Register
IENBL
I2C_INTR_MASK
I2C_INTRMASK
I2C_INTRMASK
0xF298
Raw Interrupt Status
Register
RISTAT
I2C_RAW_INTR_ STAT
I2C_RAW_INTRSTAT
I2C_RAW_INTRSTAT
0xF29A
Receive FIFO
Threshold Level
Register
RXFT
I2C_RXTL
I2C_RXTL
0xF29C
Transmit FIFO
Threshold Level
Register
TXFT
I2C_TXTL
I2C_TXTL
0xF29E
Clear Combined &
Individual Interrupts
Register
CLRINT
I2C_CLRINTR
I2C_CLRINTR
0xF2A0
Clear Receive Under
Interrupt Register
CLRRXUND
I2C_CLR_RXUNDER
I2C_CLR_RXUNDER
0xF2A2
Clear Receive Over
Interrupt Register
CLRRXOVR
I2C_CLROVER
I2C_CLROVER
0xF2A4
Clear Transmit Over
Register
CLRTXOVR
I2C_CLR_TXOVER
I2C_CLR_TXOVER
0xF2A6
Clear Read Required
Interrupt Register
CLRRDREQ
I2C_CLR_RDREQ
I2C_CLR_RDREQ
0xF2A8
Clear Transmit Abort
Interrupt Register
CLRTXABRT
I2C_CLR_TXABRT
I2C_CLR_TXABRT
0xF2AA
56F8025 Data Sheet, Rev. 3
Freescale Semiconductor
Preliminary
153
Table 14-1 Legacy and Revised Acronyms (Continued)
Peripheral Reference
Manual
Data Sheet
Register Name
New
Acronym
Clear Receive Done
Interrupt Register
Legacy
Acronym
New
Acronym
Legacy
Acronym
Processor Expert
Acronym
Memory
Address
Start
End
CLRRXDONE
I2C_CLR_RXDONE
I2C_CLR_RXDONE
0xF2AC
CLRACT
I2C_CLRACTIVITY
I2C_CLRACTIVITY
0xF2AE
Clear Stop Detect
Interrupt Register
CLRSTPDET
I2C_CLR_STOPDET
I2C_CLR_STOPDET
0xF2B0
Clear Start Detect
Interrupt Register
CLRSTDET
I2C_CLR_STAR_DET
I2C_CLR_STAR_DET
0xF2B2
Clear General Call
Interrupt Register
CLRGC
I2C_CLR_GENCALL
I2C_CLR_GENCALL
0xF2B4
Clear Activity Interrupt
Register
Enable Register
ENBL
I2C_ENABLE
I2C_ENABLE
0xF2B6
Status Register
STAT
I2C_STAT
I2C_STAT
0xF2B8
Transmit FIFO Level
Register
TXFLR
I2C_TXFLR
I2C_TXFLR
0xF2BA
Receive FIFO Level
Register
RXFLR
I2C_RXFLR
I2C_RXFLR
0xF2BC
Transmit Abort
Source Register
TXABRTSRC
I2C_TX_ABRTSRC
I2C_TX_ABRTSRC
0xF2C0
Component
Parameter 1 Register
COMPARM1
I2C_COMPARM1
I2C_COMPARM1
0xF2FA
Component
Parameter 2 Register
COMPARM2
I2C_COMPARM2
I2C_COMPARM2
0xF2FB
Component Version 1
Register
COMVER1
I2C_COMVER1
I2C_COMVER1
0xF2FC
Component Version 2
Register
COMVER2
I2C_COMVER2
I2C_COMVER2
0xF2FD
Component Type 1
Register
COMTYP1
I2C_COMTYP1
I2C_COMTYP1
0xF2FE
Component Type 2
Register
COMTYP2
I2C_COMTYP2
I2C_COMTYP2
0xF2FF
PLLCR
0xF130
On-Clock Chip Synthesis (OCCS) Module
Control Register
CTRL
PLLCR
OCCS_CTRL
Divide-By Register
Status Register
DIVBY
PLLDB
OCCS_DIVBY
PLLDB
PLLDB
0xF131
STAT
PLLSR
OCCS_STAT
PLLSR
PLLSR
0xF132
Oscillator Control
Register
OCTRL
OSCTL
OCCS_OCTRL
OSCTL
OSCTL
0xF135
Clock Check Register
CLKCHK
OCCS_CLCHK
PLLCLCHK
OCCS_CLCHK
0xF136
PROT
OCCS_PROT
PLLPROT
OCCS_PROT
0xF137
Protection Register
PLLCR
Clock Divider Register
CLKDIV
FMCLKD
FM_CLKDIV
FMCLKD
FMCLKD
0xF400
Configuration
Register
CNFG
FMCR
FM_CNFG
FMCR
FMCR
0xF401
Security High Half
Register
SECHI
FMSECH
FM_SECHI
FMSECH
FMSECH
0xF403
56F8025 Data Sheet, Rev. 3
154
Freescale Semiconductor
Preliminary
Electrical Design Considerations
Table 14-1 Legacy and Revised Acronyms (Continued)
Peripheral Reference
Manual
Data Sheet
Register Name
Security Low Half
Register
New
Acronym
Legacy
Acronym
New
Acronym
Legacy
Acronym
SECLO
FMSECL
FM_SECLO
FMSECL
Processor Expert
Acronym
Memory
Address
Start
End
FMSECL
0xF404
Protection Register
PROT
FMPROT
FM_PROT
FMPROT
FMPROT
0xF410
User Status Register
USTAT
FMUSTAT
FM_USTAT
FMUSTAT
FMUSTAT
0xF413
Command Register
CMD
FMCMD
FM_CMD
FMCMD
FMCMD
0xF414
Data Buffer Register
DATA
FMDATA
FM_DATA
FMDATA
FMDATA
0xF418
Info Optional Data 1
Register
OPT1
FMOPT1
FM_OPT1
FMOPT1
FMOPT1
0xF41B
Test Array Signature
Register
TSTSIG
FMTST_SIG
FM_TSTSIG
FMTST_SIG
FMTST_SIG
0xF41D
General Purpose Input/Output (GPIO) Module
x = A (n=0) B (n=1) C (n=2) D (n=3)
Pull-Up Enable
Register
PUPEN
PUR
GPIOx_PUPEN
Data Register
Data Direction
Register
DATA
DR
GPIOx_DATA
DDIR
DDR
GPIOx_DDIR
Peripheral Enable
Register
PEREN
PER
GPIOx_PEREN
Interrupt Assert
Register
IASSRT
IAR
Interrupt Enable
Register
IEN
Interrupt Polarity
Register
GPIOx_PUR
GPIO_x_PUR
0xF1n0
GPIOx_DR
GPIO_x_DR
0xF1n1
GPIOx_DDR
GPIO_x_DDR
0xF1n2
GPIOx_PER
GPIO_x_PER
0xF1n3
GPIOx_IASSRT
GPIOx_IAR
GPIO_x_IAR
0xF1n4
IENR
GPIOx_IEN
GPIOx_IENR
GPIO_x_IENR
0xF1n5
IPOL
IPOLR
GPIOx_IPOL
GPIOx_IPOLR
GPIO_x_IPOLR
0xF1n6
Interrupt Pending
Register
IPEND
IPR
GPIOx_IPEND
GPIOx_IPR
GPIO_x_IPR
0xF1n7
Interrupt
Edge-Sensitive
Register
IEDGE
IESR
GPIOx_IEDGE
GPIOx_IESR
GPIO_x_IESR
0xF1n8
Push-Pull Mode
Registers
PPOUTM
PPMODE
GPIOx_PPOUTM
GPIOx_PPMODE
GPIO_x_PPMODE
0xF1n9
Raw Data Input
Register
RDATA
RAWDATA
GPIOx_RDATA
GPIOx_RAWDATA
GPIO_x_RAWDATA
0xF1nA
Output Drive Strength
Register
DRIVE
DRIVE
GPIOx_DRIVE
GPIOx_DRIVE
GPIO_x_DRIVE
0xF1nB
56F8025 Data Sheet, Rev. 3
Freescale Semiconductor
Preliminary
155
Table 14-1 Legacy and Revised Acronyms (Continued)
Peripheral Reference
Manual
Data Sheet
Register Name
New
Acronym
Legacy
Acronym
New
Acronym
Legacy
Acronym
Processor Expert
Acronym
Memory
Address
Start
End
Pulse Width Modulator (PWM) Module
Control Register
CTRL
PMCTL
Fault Control Register
FCTRL
Fault
Status/Acknowledge
Regis.
FLTACK
Output Control
Register
PWM_CTRL
PWM_PMCTL
PWM_PMCTL
0xF0C0
PMFCTL
PWM_FCTRL
PWM_PMFCTL
PWM_PMFCTL
0xF0C1
PMFSA
PWM_FLTACK
PWM_PMFSA
PWM_PMFSA
0xF0C2
OUT
PMOUT
PWM_OUT
PWM_PMOUT
PWM_PMOUT
0xF0C3
Counter Register
CNTR
PMCNT
PWM_CNTR
PWM_PMCNT
PWM_PMCNT
0xF0C4
Counter Modulo
Register
CMOD
MCM
PWM_CMOD
PWM_MCM
PWM_MCM
0xF0C5
Value 0-5 Registers
VAL0-5
PMVAL0-5
PWM_VAL0-5
PWM_PMVAL0-5
PWM_PMVAL0-5
Deadtime 0-1
Registers
DTIM0-1
PMDEADTM0-1
PWM_DTIM0-1
PWM_PMDEADTM0-1
PWM_PMDEADTM0-1 0xF0CC 0xF0CD
Disable Mapping 1-2
Registers
DMAP1-2
PMDISMAP1-2
PWM_DMAP1-2
PWM_PMDISMAP1-2
PWM_PMDISMAP1-2
0xF0C6
0xF0CE
0xF0CB
0xF0CF
Configure Register
CNFG
PMCFG
PWM_CNFG
PWM_PMCFG
PWM_PMCFG
0xF0D0
Channel Control
Register
CCTRL
PMCCR
PWM_CCTRL
PWM_PMCCR
PWM_PMCCR
0xF0D1
Port Register
PORT
PMPORT
PWM_PORT
PWM_PMPORT
PWM_PMPORT
0xF0D2
Internal Correction
Control Register
ICCTRL
PMICCR
PWM_ICCTRL
PWM_PMICCR
PWM_PMICCR
0xF0D3
Source Control
Register
SCTRL
PMSRC
PWM_SCTRL
PWM_PMSRC
PWM_PMSRC
0xF0D4
Synchronization
Window Register
SYNC
PWM_SYNC
PWM_SYNC
PWM_SYNC
0xF0D5
FFILT0-3
PWM_FFILT0-3
PWM_FFILT0-3
PWM_FFILT0-3
Fault Filter 0-3
Register
0xF0D6
0xF0D9
Multi-Scalable Controller Area Network (MSCAN) Module
Control 0 Register
CTRL0
CAN_CTRL0
CANCTRL0
0XF800
Control 1 Register
CTRL1
CAN_CTRL1
CANCTRL1
0XF801
Bus Timing 0 Register
BTR0
CAN_BTR0
CANBTR0
0XF802
Bus Timing 1 Register
BTR1
CAN_BTR1
CANBTR1
0XF803
Receive Flag Register
RFLG
CAN_RFLG
CANRFLG
0XF804
Receiver Interrupt
Enable Register
RIER
CAN_RIER
CANRIER
0XF805
Transmitter Flag
Register
TFLG
CAN_TFLG
CANTFLG
0XF806
Transmitter Interrupt
Enable Register.
TIER
CAN_TIER
CANTIER
0XF807
Transmitter Msg Abort
Request Register
TARQ
CAN_TARQ
CANTARQ
0XF808
56F8025 Data Sheet, Rev. 3
156
Freescale Semiconductor
Preliminary
Electrical Design Considerations
Table 14-1 Legacy and Revised Acronyms (Continued)
Peripheral Reference
Manual
Data Sheet
Register Name
New
Acronym
Legacy
Acronym
New
Acronym
Legacy
Acronym
Processor Expert
Acronym
Memory
Address
Start
End
Transmitter Message
Abort Acknowledge
Register
TAAK
CAN_TAAK
CANTAAK
0XF809
Transmitter FIFO
Selection Register
TBSEL
CAN_TBSEL
CANTBSEL
0XF80A
Identifier Acceptance
Control Register
IDAC
CAN_IDAC
CANIDAC
0XF80B
Miscellaneous
Register
MISC
CAN_MISC
CANMISC
0XF80D
Receive Error
Register
RXERR
CAN_RXERR
CANRXERR
0XF80E
Transmit Error
Register
TXERR
CAN_TXERR
CANTXERR
0XF80F
Identifier Acceptance
0-3 Registers
IDAR0-3
CAN_IDAR0-3
CANIDAR0-3
0xF810
0xF813
Identifier Mask 0-3
Registers
IDMR0-3
CAN_IDMR0-3
CANIDMR0-3
0xF814
0xF817
Identifier Acceptance
4-7 Register
IDAR4-7
CAN_IDAR4-7
CANIDAR4-7
0xF818
0xF81B
Identifier Mask 4-7
Registers
IDMR4-7
CAN_IDMR4-7
CANIDMR4-7
0xF81C
0xF81F
Foreground Receive
FIFO Register
RXFG
CAN_RXFG
CANRXFG
0xF82F
0xF820
Foreground Transmit
FIFO Register
TXFG
CAN_TXFG
CANTXFG
0xF830
0xF83F
Power Supervisor (PS) Module
Control Register
CTRL
LVICONTROL
PS_CTRL
LVICONTROL
LVICTRL
0xF140
Status Register
STAT
LVISTATUS
PS_STAT
LVISTATUS
LVISR
0xF141
56F8025 Data Sheet, Rev. 3
Freescale Semiconductor
Preliminary
157
Table 14-1 Legacy and Revised Acronyms (Continued)
Peripheral Reference
Manual
Data Sheet
Register Name
New
Acronym
Legacy
Acronym
New
Acronym
Legacy
Acronym
Processor Expert
Acronym
Memory
Address
Start
End
Queued Serial Communications Interface (QSCI) Module
n = 0, 1
Baud Rate Register
RATE
QSCI_RATE
QSCI_SCIBR
0xF2n0
Control 1 Register
CTRL1
QSCI_CTRL1
QSCI_SCICR
0xF2n1
Control 2 Register
CTRL2
QSCI_CTRL2
QSCI_SCICR2
0xF2n2
Status Register
STAT
QSCI_STAT
QSCI_SCISR
0xF2n3
Data Register
DATA
QSCI_DATA
QSCI_SCIDR
0xF2n4
Queued Serial Peripheral Interface (QSPI) Module
Status and Control
Register
SCTRL
QSPI_SCTRL
QSPI_SPSCR
0xF2n0
DSCTRL
QSPI_DSCTRL
QSPI_SPDSR
0xF2n1
Data Receive
Register
DRCV
QSPI_DRCV
QSPI_SPDRR
0xF2n2
Data Transmit
Register
DXMIT
QSPI_DXMIT
QSPI_SPDTR
0xF2n3
Data Size and Control
Register
FIFO Control Register
FIFO
QSPI_FIFO
QSPI_SPFIFO
0xF2n4
Wait Register
WAIT
QSPI_WAIT
QSPI_SPWAIT
0xF2n5
Quad-Timer (TMR) Module
n = 0, 1, 2, 3
Compare 1 Register
COMP1
TMRCMP1
TMRn_COMP1
TMRn_CMP1
TMRn_CMP1
0xF0n0
Compare 2 Register
COMP2
TMRCMP2
TMRn_COMP2
TMRn_CMP2
TMRn_CMP2
0xF0n1
Capture Register
CAPT
TMRCAP
TMRn_CAPT
TMRn_CAP
TMRn_CAP
0xF0n2
Load Register
LOAD
TMRLOAD
TMRn_LOAD
TMRn_LOAD
TMRn_LOAD
0xF0n3
Hold Register
HOLD
TMRHOLD
TMRn_HOLD
TMRn_HOLD
TMRn_HOLD
0xF0n4
Counter Register
CNTR
TMRCNTR
TMRn_CNTR
TMRn_CNTR
TMRn_CNTR
0xF0n5
Control Register
CTRL
TMRCTRL
TMRn_CTRL
TMRn_CTRL
TMRn_CTRL
0xF0n6
Status and Control
Register
SCTRL
TMRSCR
TMRn_SCTRL
TMRn_SCR
TMRn_SCR
0xF0n7
Comparator Load 1
Register
CMPLD1
TMRCMPLD1
TMRn_CMPLD1
TMRn_CMPLD1
TMRn_CMPLD1
0xF0n8
Comparator Load 2
Register
CMPLD2
TMRCMPLD2
TMRn_CMPLD2
TMRn_CMPLD2
TMRn_CMPLD2
0xF0n9
Comparator
Status/Control
Register
CSCTRL
TMRCOMSCR
TMRn_CSCTRL
TMRn_COMSCR
TMRn_COMSCR
0xF0nA
Input Filter Register
FILT
TMRn_FILT
TMRn_FILT
TMRn_FILT
0xF0nB
Enable Register
ENBL
TMRn_ENBL
TMRn_ENBL
TMRn_ENBL
0xF0nF
Voltage Regulator (VREG) Module
See SIM section
56F8025 Data Sheet, Rev. 3
158
Freescale Semiconductor
Preliminary
Electrical Design Considerations
Table 14-1 Legacy and Revised Acronyms (Continued)
Peripheral Reference
Manual
Register Name
New
Acronym
Legacy
Acronym
Memory
Address
Data Sheet
New
Acronym
Legacy
Acronym
Processor Expert
Acronym
Start
End
Programmable Interval Timer (PIT) Module
n = 0, 1, 2
Control Register
CTRL
PITn_CTRL
PITCTRL0-2
PITn_CTRL
0xF1n0
Modulo Register
MOD
PITn_MOD
PITMOD0-2
PITn_MOD
0xF1n1
Counter Register
CNTR
PITn_CNTR
PITCNTR0-2
PITn_CNTR
0xF1n2
Control Register
CTRL
DACn_CTRL
DACCTRL0-2
DACn_CTRL
0xF1n0
Data Register
DATA
DACn_DATA
DACDATA0-2
DACn_DATA
0xF1n1
Step Register
STEP
DACn_STEP
DACSTEP0-2
DACn_STEP
0xF1n2
Minimum Value
Register
MINVAL
DACn_MINVAL
DACMINVAL0-2
DACn_MINVAL
0xF1n3
Maximum Value
Register
MAXVAL
DACn_MAXVAL
DACMAXVAL0-2
DACn_MAXVAL
0xF1n4
n = 0, 1
Comparator (CMP) Module
Ax=EBx=F
Control Register
CTRL
CMP_CTRL
CMPx_CTRL
CMPx_CTRL
0xF1x0
Status Register
STAT
CMP_STAT
CMPx_STAT
CMPx_STAT
0xF1x1
Filter Register
FILT
CMP_FILT
CMPx_FILT
CMPx_FILT
0xF1x2
Interrupt Controller (ITCN) Module
Interrupt Priority 0-4
Registers
N/A
N/A
ITCN_IPR0-4
ITCN_IPR0-4
INTC_IPR0-4
Vector Base Address
Register
N/A
N/A
ITCN_VBA
ITCN_VBA
INTC_VBA
0XF065
Fast Interrupt Match 0
Register
N/A
N/A
ITCN_FIM0
ITCN_FIM0
INTC_FIM0
0XF066
Fast Interrupt Vector
Address Low 0
N/A
N/A
ITCN_FIVAL0
ITCN_FIVAL0
INTC_FIVAL0
0XF067
Fast Interrupt Vector
Address High 0
N/A
N/A
ITCN_FIVAH0
ITCN_FIVAH0
INTC_FIVAH0
0XF068
Fast Interrupt Match 1
Register
N/A
N/A
ITCN_FIM1
ITCN_FIM1
INTC_FIM1
0xF069
Fast Interrupt Vector
Address Low 1
N/A
N/A
ITCN_FIVAL1
ITCN_FIVAL1
INTC_FIVAL1
0xF06A
Fast Interrupt Vector
Address High 1
N/A
N/A
ITCN_FIVAH1
ITCN_FIVAH1
INTC_FIVAH1
0xF06B
Interrupt Pending 0
Register
N/A
N/A
ITCN_IRQP0
ITCN_IRQP0
INTC_IRQP0
0xF06C
Interrupt Pending 1
Register
N/A
N/A
ITCN_IRQP1
ITCN_IRQP1
INTC_IRQP1
0xF06D
Interrupt Pending 2
Register
N/A
N/A
ITCN_IRQP2
ITCN_IRQP2
INTC_IRQP2
0xF06E
0XF060
0XF064
56F8025 Data Sheet, Rev. 3
Freescale Semiconductor
Preliminary
159
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© Freescale Semiconductor, Inc. 2006. All rights reserved.
MC56F8025
Rev. 3
01/2007