Freescale Semiconductor Technical Data MPX2102 Rev 5, 10/2006 100 kPa On-Chip Temperature Compensated & Calibrated Silicon Pressure Sensors The MPX2102/MPXV2102G series device is a silicon piezoresistive pressure sensor providing a highly accurate and linear voltage output directly proportional to the applied pressure. The sensor is a single, monolithic silicon diaphragm with the strain gauge and a thin-film resistor network integrated on-chip. The chip is laser trimmed for precise span and offset calibration and temperature compensation. Features • Temperature Compensated Over 0°C to +85°C • Easy-to-Use Chip Carrier Package Options • Available in Absolute, Differential and Gauge Configurations • Ratiometric to Supply Voltage Application Examples • Pump/Motor Controllers • Robotics • Level Indicators • Medical Diagnostics • Pressure Switching • Barometers • Altimeters Options Case No. MPX Series Order No. MPX2102GP CASE 1369-01 Packing Options Device Marking SMALL OUTLINE PACKAGE (MPXV2102G SERIES) Ported Elements 0 TO 100 kPA (0 TO 14.5 psi) 40 mV FULL SCALE SPAN (TYPICAL) SMALL OUTLINE PACKAGES ORDERING INFORMATION Device Type MPX2102 MPXV2102G SERIES Gauge, Side Port, SMT 1369 MPXV2102GP Trays MPXV2102G Differential, Dual Port, SMT 1351 MPXV2102DP Trays MPXV2102G MPXV2102DP CASE 1351-01 SMALL OUTLINE PACKAGE PIN NUMBERS 1 GND(1) 5 N/C 2 +VOUT 6 N/C 3 VS 7 N/C 4 –VOUT 8 N/C 1. Pin 1 in noted by the notch in the lead. UNIBODY PACKAGE (MPX2102 SERIES) Basic Element Absolute, Differential 344 MPX2102A MPX2102D — MPX2102A MPX2102D Ported Elements Differential, Dual Port 344C MPX2102DP — MPX2102DP Absolute, Gauge 344B MPX2102AP MPX2102GP — MPX2102AP MPX2102GP Absolute, Gauge Axial 344F MPX2102ASX MPX2102GSX — MPX2102A MPX2102D Gauge, Vacuum 344D MPX2102GVP — MPX2102GVP UNIBODY PACKAGE PIN NUMBERS 1 GND(1) 3 VS 2 +VOUT 4 –VOUT 1. Pin 1 in noted by the notch in the lead. UNIBODY PACKAGES MPX2102A/D CASE 344-15 MPX2102AP/GP CASE 344B-01 MPX2102DP CASE 344C-01 © Freescale Semiconductor, Inc., 2006. All rights reserved. MPX2102GVP CASE 344D-01 MPX2102ASX/GSX CASE 344F-01 VS 3 Thin Film Temperature Compensation and Calibration Circuitry Sensing Element 2 + VOUT 4 -V OUT 1 GND Figure 1. Temperature Compensated Pressure Sensor Schematic VOLTAGE OUTPUT VS. APPLIED DIFFERENTIAL PRESSURE The differential voltage output of the sensor is directly proportional to the differential pressure applied. The absolute sensor has a built-in reference vacuum. The output voltage will decrease as vacuum, relative to ambient, is drawn on the pressure (P1) side. The output voltage of the differential or gauge sensor increases with increasing pressure applied to the pressure (P1) side relative to the vacuum (P2) side. Similarly, output voltage increases as increasing vacuum is applied to the vacuum (P2) side relative to the pressure (P1) side. Figure 1 illustrates a block diagram of the internal circuitry on the stand-alone pressure sensor chip. Table 1. Maximum Ratings(1) Rating Symbol Value Unit Maximum Pressure (P1 > P2) PMAX 400 kPa Storage Temperature TSTG -40 to +125 °C TA -40 to +125 °C Operating Temperature 1. Exposure beyond the specified limits may cause permanent damage or degradation to the device. MPX2102 2 Sensors Freescale Semiconductor Table 2. Operating Characteristics (VS = 10 VDC, TA = 25°C unless otherwise noted, P1 > P2) Characteristic Symbol Min Typ Max Units POP 0 — 100 kPa Supply Voltage(2) VS — 10 16 VDC Supply Current IO — 6.0 — mAdc VFSS 38.5 40 41.5 mV VOFF -1.0 -2.0 — — 1.0 2.0 mV ∆V/∆Ρ — 0.4 — mV/kPa — — -0.6 -1.0 — — 0.4 1.0 %VFSS Pressure Hysteresis(5) (0 to 100 kPa) — — ±0.1 — %VFSS Temperature Hysteresis(5)(- 40°C to +125°C) — — ±0.5 — %VFSS Temperature Coefficient of Full Scale Span(5) TCVFSS -2.0 — 2.0 %VFSS Temperature Coefficient of Offset(5) TCVOFF -1.0 — 1.0 mV ZIN 1000 — 2500 W ZOUT 1400 — 3000 W Response Time(6) (10% to 90%) tR — 1.0 — ms Warm-Up Time — — 20 — ms Offset Stability(7) — — ±0.5 — %VFSS Differential Pressure Range(1) Full Scale Span(3) Offset(4) MPX2102D Series MPX2102A Series Sensitivity Linearity(5) MPX2102D Series MPX2102A Series Input Impedance Output Impedance 1. 1.0 kPa (kiloPascal) equals 0.145 psi. 2. Device is ratiometric within this specified excitation range. Operating the device above the specified excitation range may induce additional error due to device self-heating. 3. Full Scale Span (VFSS) is defined as the algebraic difference between the output voltage at full rated pressure and the output voltage at the minimum related pressure. 4. Offset (VOFF) is defined as the output voltage at the minimum rated pressure. 5. Accuracy (error budget) consists of the following: • Linearity: • • • • Output deviation from a straight line relationship with pressure, using end point method, over the specified pressure range. Temperature Hysteresis:Output deviation at any temperature within the operating temperature range, after the temperature is cycled to and from the minimum or maximum operating temperature points, with zero differential pressure applied. Pressure Hysteresis: Output deviation at any pressure with the specified range, when this pressure is cycled to and from the minimum or maximum rated pressure at 25°C. TcSpan: Output deviation at full rated pressure over the temperature range of 0 to 85°C, relative to 25°C. TcOffset: Output deviation with minimum rated pressure applied, over the temperature range of 0 to 85°C, relative to 25°C. 6. Response Time is defined as the time form the incremental change in the output to go from 10% to 90% of its final value when subjected to a specified step change in pressure. 7. Offset stability is the product’s output deviation when subjected to 1000 hours of Pulsed Pressure, Temperature Cycling with Bias Test. MPX2102 Sensors Freescale Semiconductor 3 Least Squares Fit Least Square Deviation Exaggerated Performance Curve Straight Line Deviation Relative Voltage Output LINEARITY Linearity refers to how well a transducer's output follows the equation: VOUT = VOFF + sensitivity x P over the operating pressure range. There are two basic methods for calculating nonlinearity: (1) end point straight line fit (see Figure 2) or (2) a least squares best line fit. While a least squares fit gives the “best case” linearity error (lower numerical value), the calculations required are burdensome. Conversely, an end point fit will give the “worst case” error (often more desirable in error budget calculations) and the calculations are more straightforward for the user. Freescale’s specified pressure sensor linearities are based on the end point straight line method measured at the midrange pressure. End Point Straight Line Fit Offset 50 Pressure (% Fullscale) 0 100 Figure 2. Linearity Specification Comparison ON-CHIP TEMPERATURE COMPENSATION AND CALIBRATION Figure 3 shows the output characteristics of the MPX2102/ MPXV2102G series at 25°C. The output is directly proportional to the differential pressure and is essentially a straight line. VS = 10 VDC TA = 25°C MPX2102 P1 > P2 40 35 30 The effects of temperature on Full Scale Span and Offset are very small and are shown under Operating Characteristics. TYP Output (mVDC) 25 20 Span Range (TYP) MAX 15 MIN 10 5 0 kPa PSI -5 0 25 3.62 50 7.25 75 10.88 100 14.5 Offset (TYP) Figure 3. Output vs. Pressure Differential Silcone Gel Die Coat Differential/Gauge Die P1 Epoxy Case Wire Bond Lead Frame Silicone Gel Die Coat Stainless Steel Metal Cover Differential/GaugeElement P2 Bond Die Absolute Die Stainless Steel Metal Cover P1 Epoxy Case Wire Bond Lead Frame Absolute Element P2 Die Bond Figure 4. Cross Sectional Diagrams (Not to Scale) Figure 4 illustrates the absolute sensing configuration (right) and the differential or gauge configuration in the basic chip carrier (Case 344). A silicone gel isolates the die surface and wire bonds from the environment, while allowing the pressure signal to be transmitted to the silicon diaphragm. The MPX2102/MPXV2102G series pressure sensor operating characteristics and internal reliability and qualification tests are based on use of dry air as the pressure media. Media other than dry air may have adverse effects on sensor performance and long term reliability. Contact the factory for information regarding media compatibility in your application. MPX2102 4 Sensors Freescale Semiconductor PRESSURE (P1)/VACUUM (P2) SIDE IDENTIFICATION TABLE Freescale designates the two sides of the pressure sensor as the Pressure (P1) side and the Vacuum (P2) side. The Pressure (P1) side is the side containing the silicone gel which isolates the die. The differential or gauge sensor is designed to operate with positive differential pressure applied, P1 > P2. The absolute sensor is designed for vacuum applied to P1 side. The Pressure (P1) side may be identified by using Table 3. Table 3. Pressure (P1) Side Delineation Part Number MPX2102A MPX2102D MPX2102DP Case Type 344 Pressure (P1) Side Identifier Stainless Steep Cap 344C Side with Part Marking 344B Side with Port Attached MPX2102GVP 344D Stainless Steep Cap MPX2102ASX MPX2102GSX 344F Side with Port Marking MPX2102GP 1369 Side with Port Attached MPX2102DP 1351 Side with Part Marking MPX2102AP MPX2102GP MPX2102 Sensors Freescale Semiconductor 5 PACKAGE DIMENSIONS C R M 1 B 2 -A- 3 Z 4 DIM A B C D F G J L M N R Y Z N L 1 2 3 4 PIN 1 -TSEATING PLANE J F G F Y D 4 PL 0.136 (0.005) STYLE 1: PIN 1. 2. 3. 4. M T A DAMBAR TRIM ZONE: THIS IS INCLUDED WITHIN DIM. "F" 8 PL M STYLE 2: PIN 1. 2. 3. 4. GROUND + OUTPUT + SUPPLY - OUTPUT STYLE 3: PIN 1. 2. 3. 4. VCC - SUPPLY + SUPPLY GROUND NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION -A- IS INCLUSIVE OF THE MOLD STOP RING. MOLD STOP RING NOT TO EXCEED 16.00 (0.630). INCHES MILLIMETERS MIN MAX MIN MAX 0.595 0.630 15.11 16.00 0.514 0.534 13.06 13.56 0.200 0.220 5.08 5.59 0.016 0.020 0.41 0.51 0.048 0.064 1.22 1.63 0.100 BSC 2.54 BSC 0.014 0.016 0.36 0.40 0.695 0.725 17.65 18.42 30˚ NOM 30˚ NOM 0.475 0.495 12.07 12.57 0.430 0.450 10.92 11.43 0.048 0.052 1.22 1.32 0.106 0.118 2.68 3.00 GND -VOUT VS +VOUT CASE 344-15 ISSUE AA UNIBODY PACKAGE SEATING PLANE NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. -A- -T- U L R H N PORT #1 POSITIVE PRESSURE (P1) -Q- B 1 2 3 4 PIN 1 K -P0.25 (0.010) J M T Q S S F C G D 4 PL 0.13 (0.005) M T S S Q S DIM A B C D F G H J K L N P Q R S U INCHES MILLIMETERS MIN MAX MIN MAX 1.145 1.175 29.08 29.85 0.685 0.715 17.40 18.16 0.305 0.325 7.75 8.26 0.016 0.020 0.41 0.51 0.048 0.064 1.22 1.63 0.100 BSC 2.54 BSC 0.182 0.194 4.62 4.93 0.014 0.016 0.36 0.41 0.695 0.725 17.65 18.42 0.290 0.300 7.37 7.62 0.420 0.440 10.67 11.18 0.153 0.159 3.89 4.04 0.153 0.159 3.89 4.04 0.230 0.250 5.84 6.35 0.220 0.240 5.59 6.10 0.910 BSC 23.11 BSC STYLE 1: PIN 1. GROUND 2. + OUTPUT 3. + SUPPLY 4. - OUTPUT CASE 344B-01 ISSUE B UNIBODY PACKAGE MPX2102 6 Sensors Freescale Semiconductor PACKAGE DIMENSIONS NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. -AU V PORT #1 R W L H PORT #2 N DIM A B C D F G H J K L N P Q R S U V W PORT #1 POSITIVE PRESSURE (P1) PORT #2 VACUUM (P2) -QB SEATING PLANE SEATING PLANE 1 2 3 4 PIN 1 K -P-T- -T- 0.25 (0.010) M T Q S S F J G D 4 PL C 0.13 (0.005) T S M S Q S INCHES MILLIMETERS MIN MAX MIN MAX 1.145 1.175 29.08 29.85 0.685 0.715 17.40 18.16 0.405 0.435 10.29 11.05 0.016 0.020 0.41 0.51 0.048 0.064 1.22 1.63 0.100 BSC 2.54 BSC 0.182 0.194 4.62 4.93 0.014 0.016 0.36 0.41 0.695 0.725 17.65 18.42 0.290 0.300 7.37 7.62 0.420 0.440 10.67 11.18 0.153 0.159 3.89 4.04 0.153 0.159 3.89 4.04 0.063 0.083 1.60 2.11 0.220 0.240 5.59 6.10 0.910 BSC 23.11 BSC 0.248 0.278 6.30 7.06 0.310 0.330 7.87 8.38 STYLE 1: PIN 1. 2. 3. 4. GROUND + OUTPUT + SUPPLY - OUTPUT CASE 344C-01 ISSUE B UNIBODY PACKAGE NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: INCH. -AU SEATING PLANE -T- L H PORT #2 VACUUM (P2) R DIM A B C D F G H J K L N P Q R S U POSITIVE PRESSURE (P1) N -Q- B 1 2 3 4 K PIN 1 S C F -P- J 0.25 (0.010) M T Q S G D 4 PL 0.13 (0.005) M T S S Q S STYLE 1: PIN 1. 2. 3. 4. INCHES MILLIMETERS MIN MAX MIN MAX 1.145 1.175 29.08 29.85 0.685 0.715 17.40 18.16 0.305 0.325 7.75 8.26 0.016 0.020 0.41 0.51 0.048 0.064 1.22 1.63 0.100 BSC 2.54 BSC 0.182 0.194 4.62 4.93 0.014 0.016 0.36 0.41 0.695 0.725 17.65 18.42 0.290 0.300 7.37 7.62 0.420 0.440 10.67 11.18 0.153 0.159 3.89 4.04 0.153 0.158 3.89 4.04 0.230 0.250 5.84 6.35 0.220 0.240 5.59 6.10 0.910 BSC 23.11 BSC GROUND + OUTPUT + SUPPLY - OUTPUT CASE 344D-01 ISSUE B UNIBODY PACKAGE MPX2102 Sensors Freescale Semiconductor 7 PACKAGE DIMENSIONS -TC A E -Q- U N V B R PORT #1 POSITIVE PRESSURE (P1) PIN 1 -P0.25 (0.010) M T Q M 4 3 2 1 S K J F D 4 PL 0.13 (0.005) NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. DIM A B C D E F G J K N P Q R S U V INCHES MILLIMETERS MIN MAX MIN MAX 1.080 1.120 27.43 28.45 0.740 0.760 18.80 19.30 0.630 0.650 16.00 16.51 0.016 0.020 0.41 0.51 0.160 0.180 4.06 4.57 0.048 0.064 1.22 1.63 0.100 BSC 2.54 BSC 0.014 0.016 0.36 0.41 0.220 0.240 5.59 6.10 0.070 0.080 1.78 2.03 0.150 0.160 3.81 4.06 0.150 0.160 3.81 4.06 0.440 0.460 11.18 11.68 0.695 0.725 17.65 18.42 0.840 0.860 21.34 21.84 0.182 0.194 4.62 4.92 G M T P S Q S STYLE 1: PIN 1. 2. 3. 4. GROUND V (+) OUT V SUPPLY V (-) OUT CASE 344F-01 ISSUE B UNIBODY PACKAGE MPX2102 8 Sensors Freescale Semiconductor PACKAGE DIMENSIONS PAGE 1 OF 2 CASE 1351-01 ISSUE A SMALL OUTLINE PACKAGE MPX2102 Sensors Freescale Semiconductor 9 PACKAGE DIMENSIONS PAGE 2 OF 2 CASE 1351-01 ISSUE A SMALL OUTLINE PACKAGE MPX2102 10 Sensors Freescale Semiconductor PACKAGE DIMENSIONS PAGE 1 OF 2 CASE 1369-01 ISSUE B SMALL OUTLINE PACKAGE MPX2102 Sensors Freescale Semiconductor 11 PACKAGE DIMENSIONS PAGE 2 OF 2 CASE 1369-01 ISSUE B SMALL OUTLINE PACKAGE MPX2102 12 Sensors Freescale Semiconductor NOTES MPX2102 Sensors Freescale Semiconductor 13 How to Reach Us: Home Page: www.freescale.com Web Support: http://www.freescale.com/support USA/Europe or Locations Not Listed: Freescale Semiconductor, Inc. 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