LATTICE ISPLSI3448

ispLSI 3448
®
In-System Programmable High Density PLD
Functional Block Diagram
J3
J2
J1
...
J0
Output Routing Pool (ORP)
H3
Output Routing Pool (ORP)
H1
H0
G3
D Q
D Q
K1
G2
OR
Array
D Q
K2
G1
K3
D Q
D Q
OR
Array
Twin
GLB
G0
D Q
...
• ispLSI FEATURES:
— 5V In-System Programmable (ISP™) Using Lattice
ISP or Boundary Scan Test (IEEE 1149.1) Protocol
— Increased Manufacturing Yields, Reduced Time-toMarket, and Improved Product Quality
— Reprogram Soldered Devices for Faster Debugging
H2
K0
...
• HIGH-PERFORMANCE E2CMOS® TECHNOLOGY
— fmax = 90 MHz Maximum Operating Frequency
— tpd = 12 ns Propagation Delay
— TTL Compatible Inputs and Outputs
— Electrically Erasable and Reprogrammable
— Non-Volatile
— 100% Tested at Time of Manufacture
— Unused Product Term Shutdown Saves Power
Output Routing Pool (ORP)
D Q
D Q
D3
N0
D2
N1
Global Routing Pool
(GRP)
N2
D1
D0
N3
A0
A1
A2
A3
Output Routing Pool (ORP)
C0
...
C1
Output Routing Pool (ORP)
Output Routing Pool (ORP)
Boundary
Scan
C2
Output Routing Pool (ORP)
• HIGH-DENSITY PROGRAMMABLE LOGIC
— 224 I/O
— 20000 PLD Gates
— 672 Registers
— High Speed Global Interconnect
— Wide Input Gating for Fast Counters, State
Machines, Address Decoders, etc.
— Small Logic Block Size for Random Logic
AND Array
Features
C3
Output Routing Pool (ORP)
• 100% IEEE 1149.1 BOUNDARY SCAN COMPATIBLE
0139/3448
• OFFERS THE EASE OF USE AND FAST SYSTEM
SPEED OF PLDs WITH THE DENSITY AND FLEXIBILITY
OF FIELD PROGRAMMABLE GATE ARRAYS
— Complete Programmable Device Can Combine Glue
Logic and Structured Designs
— Enhanced Pin Locking Capability
— Five Dedicated Clock Inputs
— Synchronous and Asynchronous Clocks
— Programmable Output Slew Rate Control to Minimize Switching Noise
— Flexible I/O Placement
— Optimized Global Routing Pool Provides Global
Interconnectivity
Description
The ispLSI 3448 is a High-Density Programmable Logic
Device containing 672 Registers, 224 Universal I/Os, five
Dedicated Clock Inputs, 14 Output Routing Pools (ORP)
and a Global Routing Pool (GRP) which allows complete
inter-connectivity between all of these elements. The
ispLSI 3448 features 5V in-system programmability and
in-system diagnostic capabilities. The ispLSI 3448 offers
non-volatile reprogrammability of the logic, as well as the
interconnect to provide truly reconfigurable systems.
The basic unit of logic on the ispLSI 3448 device is the
Twin Generic Logic Block (Twin GLB) labelled A0, A1...N3.
There are a total of 56 of these Twin GLBs in the ispLSI
3448 device. Each Twin GLB has 24 inputs, a programmable AND array and two OR/Exclusive-OR Arrays, and
eight outputs which can be configured to be either combinatorial or registered. All Twin GLB inputs come from
the GRP.
• ispDesignEXPERT™ – LOGIC COMPILER AND COMPLETE ISP DEVICE DESIGN SYSTEMS FROM HDL
SYNTHESIS THROUGH IN-SYSTEM PROGRAMMING
— Superior Quality of Results
— Tightly Integrated with Leading CAE Vendor Tools
— Productivity Enhancing Timing Analyzer, Explore
Tools, Timing Simulator and ispANALYZER™
— PC and UNIX Platforms
Copyright © 2000 Lattice Semiconductor Corp. All brand or product names are trademarks or registered trademarks of their respective holders. The specifications and information herein are subject
to change without notice.
LATTICE SEMICONDUCTOR CORP., 5555 Northeast Moore Ct., Hillsboro, Oregon 97124, U.S.A.
Tel. (503) 268-8000; 1-800-LATTICE; FAX (503) 268-8556; http://www.latticesemi.com
3448_06
1
February 2000
Specifications ispLSI 3448
Functional Block Diagram
Input Bus
Input Bus
Input Bus
Input Bus
Output Routing Pool
Output Routing Pool
Output Routing Pool
Output Routing Pool
TOE
TMS/MODE
TCK/SCLK
BSCAN/ispEN
I/O 163
I/O 162
I/O 161
I/O 160
I/O 167
I/O 166
I/O 165
I/O 164
I/O 171
I/O 170
I/O 169
I/O 168
I/O 175
I/O 174
I/O 173
I/O 172
I/O 179
I/O 178
I/O 177
I/O 176
I/O 183
I/O 182
I/O 181
I/O 180
I/O 187
I/O 186
I/O 185
I/O 184
I/O 191
I/O 190
I/O 189
I/O 188
I/O 195
I/O 194
I/O 193
I/O 192
I/O 199
I/O 198
I/O 197
I/O 196
I/O 203
I/O 202
I/O 201
I/O 200
I/O 207
I/O 206
I/O 205
I/O 204
I/O 211
I/O 210
I/O 209
I/O 208
I/O 215
I/O 214
I/O 213
I/O 212
I/O 219
I/O 218
I/O 217
I/O 216
I/O 223
I/O 222
I/O 221
I/O 220
GOE1
GOE0
Figure 1. ispLSI 3448 Functional Block Diagram
Boundary
Scan
TDI/SDI
TRST
TDO/SDO
I/O 36
I/O 37
I/O 38
I/O 39
I/O 40
I/O 41
I/O 42
I/O 43
I/O 44
I/O 45
I/O 46
I/O 47
Input Bus
I/O 32
I/O 33
I/O 34
I/O 35
M3
M2
M1
M0
L3
L2
L1
L0
K3
K2
K1
K0
I/O 159
I/O 158
I/O 157
I/O 156
A1
J2
A2
J1
A3
J0
I/O 147
I/O 146
I/O 145
I/O 144
B0
I3
I/O 143
I/O 142
I/O 141
I/O 140
B1
I2
I1
Input Bus
Global Routing Pool
(GRP)
B2
Input Bus
J3
Output Routing Pool
A0
I/O 155
I/O 154
I/O 153
I/O 152
I/O 151
I/O 150
I/O 149
I/O 148
I/O 139
I/O 138
I/O 137
I/O 136
I/O 135
I/O 134
I/O 133
I/O 132
B3
I0
I/O 131
I/O 130
I/O 129
I/O 128
C0
H3
I/O 127
I/O 126
I/O 125
I/O 124
C1
H2
C2
H1
C3
H0
D0
D1
D2
D3
E0
E1
E2
E3
F0
F1
F2
F3
G0
G1
G2
Input Bus
I/O 28
I/O 29
I/O 30
I/O 31
N0
Output Routing Pool
I/O 24
I/O 25
I/O 26
I/O 27
N1
Output Routing Pool
I/O 20
I/O 21
I/O 22
I/O 23
Input Bus
I/O 16
I/O 17
I/O 18
I/O 19
N2
G3
Output Routing Pool
Output Routing Pool
Output Routing Pool
Output Routing Pool
Input Bus
Input Bus
Input Bus
Input Bus
Y0
Y1
Y2
Y3
Y4
I/O 108
I/O 109
I/O 110
I/O 111
I/O 104
I/O 105
I/O 106
I/O 107
I/O 100
I/O 101
I/O 102
I/O 103
I/O 96
I/O 97
I/O 98
I/O 99
I/O 92
I/O 93
I/O 94
I/O 95
I/O 88
I/O 89
I/O 90
I/O 91
I/O 84
I/O 85
I/O 86
I/O 87
I/O 80
I/O 81
I/O 82
I/O 83
I/O 76
I/O 77
I/O 78
I/O 79
I/O 72
I/O 73
I/O 74
I/O 75
I/O 68
I/O 69
I/O 70
I/O 71
I/O 64
I/O 65
I/O 66
I/O 67
I/O 60
I/O 61
I/O 62
I/O 63
I/O 56
I/O 57
I/O 58
I/O 59
I/O 52
I/O 53
I/O 54
I/O 55
I/O 48
I/O 49
I/O 50
I/O 51
RESET
0130/3448
2
I/O 123
I/O 122
I/O 121
I/O 120
I/O 119
I/O 118
I/O 117
I/O 116
I/O 115
I/O 114
I/O 113
I/O 112
CLK0
CLK1
CLK2
IOCLK1
IOCLK0
I/O 12
I/O 13
I/O 14
I/O 15
Output Routing Pool
I/O 8
I/O 9
I/O 10
I/O 11
Output Routing Pool
I/O 4
I/O 5
I/O 6
I/O 7
Input Bus
I/O 0
I/O 1
I/O 2
I/O 3
Output Routing Pool
N3
Specifications ispLSI 3448
Description (continued)
Clocks in the ispLSI 3448 device are provided through
five dedicated signals. Three clocks are provided for the
Twin GLBs and the remaining two clocks are provided for
the I/O cells.
All local logic block outputs are brought back into the
GRP so they can be connected to the inputs of any other
logic block on the device. The device also has 224 I/O
cells, each of which is directly connected to an I/O ball.
Each I/O cell can be individually programmed to be a
combinatorial input, a registered input, a latched input, an
output or a bidirectional I/O with 3-state control. The
signal levels are TTL compatible voltages and the output
drivers can source 4 mA or sink 8 mA. Each output can
be programmed independently for fast or slow output
slew rate to minimize overall output switching noise.
The table below lists key attributes of the device along
with the number of resources available.
An additional feature of the ispLSI 3448 is the Boundary
Scan capability, which is composed of cells connected
between the on-chip system logic and the device’s inputs
and outputs. All I/O have associated boundary scan
registers, with 3-state I/O using three boundary scan
registers and inputs using one.
The 224 I/O cells are grouped into 14 sets of 16 bits. Each
of these I/O groups is associated with a logic Megablock
through the use of the ORP. Each Megablock is able to
provide one Product Term Output Enable (PTOE) signal
which is globally distributed to all I/O cells. That PTOE
signal can be generated within any GLB in the Megablock.
Each I/O cell can select one of 16 available OEs (two
Global OEs and 14 PTOEs).
The ispLSI 3448 supports all IEEE 1149.1 mandatory
instructions, which include BYPASS, EXTEST and
SAMPLE.
Key Attributes of the ispLSI 3448
Attribute
Four Twin GLBs, 16 I/O cells and one ORP are connected together to make a logic Megablock. The
Megablock is defined by the resources that it shares. The
outputs of the four Twin GLBs are connected to a set of
16 I/O cells by the ORP. The ispLSI 3448 device
contains 14 of these Megablocks.
The GRP has as its inputs the outputs from all of the Twin
GLBs and all of the inputs from the bidirectional I/O cells.
All of these signals are made available to the inputs of the
Twin GLBs. Delays through the GRP have been equalized to minimize timing skew and logic glitching.
Quantity
Twin GLBs
56
Registers
672
I/O
224
Global Clocks
5
Global OE
2
Test OE
1
Table 1-0003/3448
3
Specifications ispLSI 3448
Absolute Maximum Ratings 1
Supply Voltage Vcc .................................. -0.5 to +7.0V
Input Voltage Applied ........................ -2.5 to VCC +1.0V
Off-State Output Voltage Applied ..... -2.5 to VCC +1.0V
Storage Temperature ................................ -65 to 150°C
Case Temp. with Power Applied .............. -55 to 125°C
Max. Junction Temp. (TJ) with Power Applied ... 140°C
1. Stresses above those listed under the “Absolute Maximum Ratings” may cause permanent damage to the device. Functional
operation of the device at these or at any other conditions above those indicated in the operational sections of this specification
is not implied (while programming, follow the programming specifications).
DC Recommended Operating Condition
TA
VCC
VIL
VIH
MIN.
PARAMETER
SYMBOL
MAX.
UNITS
0
70
°C
4.75
5.25
V
Input Low Voltage
0
0.8
V
Input High Voltage
2.0
VCC +1
Ambient Temperature
Supply Voltage
V
Table 2-0005/3448
Capacitance (TA=25°C,f=1.0 MHz)
TYPICAL
UNITS
I/O Capacitance
10
pf
VCC = 5.0V, VI/O = 2.0V
Clock Capacitance
11
pf
VCC = 5.0V, VY = 2.0V
SYMBOL
C1
C2
PARAMETER
TEST CONDITIONS
Table 2-0006/3320
Data Retention Specifications
PARAMETER
MINIMUM
MAXIMUM
UNITS
20
–
Years
10000
–
Cycles
Data Retention
ispLSI Erase/Reprogram Cycles
Table 2-0008/3320
4
Specifications ispLSI 3448
Switching Test Conditions
Input Pulse Levels
Figure 2. Test Load
GND to 3.0V
+ 5V
≤ 3 ns 10% to 90%
Input Rise and Fall Time
Input Timing Reference Levels
1.5V
Ouput Timing Reference Levels
1.5V
Output Load
R1
Device
Output
See Figure 2
Table 2-0003/3448
3-state levels are measured 0.5V from
steady-state active level.
Test
Point
R2
C L*
*CL includes Test Fixture and Probe Capacitance.
Output Load conditions (See Figure 2)
0213A
TEST CONDITION
A
B
C
R1
R2
CL
470Ω
390Ω
35pF
Active High
∞
390Ω
35pF
Active Low
470Ω
390Ω
35pF
Active High to Z
at VOH -0.5V
∞
390Ω
5pF
Active Low to Z
at VOL +0.5V
470Ω
390Ω
5pF
Table 2 - 0004A
DC Electrical Characteristics
Over Recommended Operating Conditions
SYMBOL
VOL
VOH
IIL
IIH
IIL-isp
IIL-PU
IOS1
ICC2, 4
CONDITION
PARAMETER
3
MIN.
TYP.
MAX. UNITS
Output Low Voltage
IOL= 8 mA
–
–
0.4
V
Output High Voltage
IOH = -4 mA
2.4
–
–
V
Input or I/O Low Leakage Current
0V ≤ VIN ≤ VIL (Max.)
–
–
-10
µA
Input or I/O High Leakage Current
3.5V ≤ VIN ≤ VCC
–
–
10
µA
ispEN Input Low Leakage Current
0V ≤ VIN ≤ VIL
–
–
-150
µA
I/O Active Pull-Up Current
0V ≤ VIN ≤ VIL
–
–
-150
µA
Output Short Circuit Current
VCC = 5V, VOUT = 0.5V
–
–
-200
mA
Operating Power Supply Current
VIL = 0.0V, VIH = 3.0V, fCLOCK = 1 MHz
–
470
–
mA
Table 2-0007/3448
1. One output at a time for a maximum duration of one second. VOUT = 0.5V was selected to avoid test problems
by tester ground degradation. Guaranteed but not 100% tested.
2. Measured using 28 16-bit counters.
3. Typical values are at VCC = 5V and TA= 25°C.
4. Maximum I CC varies widely with specific device configuration and operating frequency. Refer to the Power Consumption
section of this data sheet and Thermal Management section of the Lattice Semiconductor Data Book or CD-ROM to estimate
maximum I CC .
5
Specifications ispLSI 3448
External Switching Characteristics1, 2, 3
Over Recommended Operating Conditions
5
PARAMETER
tpd1
tpd2
fmax
fmax (Ext.)
fmax (Tog.)
tsu1
tco1
th1
tsu2
tco2
th2
tr1
trw1
tptoeen
tptoedis
tgoeen
tgoedis
ttoeen
ttoedis
twh
twl
tsu3
th3
1.
2.
3.
4.
5.
TEST
#2
COND.
DESCRIPTION
-70
-90
1
MIN. MAX. MIN. MAX.
UNITS
A
1 Data Propagation Delay, 4PT Bypass, ORP Bypass
–
12.0
–
15.0
ns
A
2 Data Propagation Delay
–
15.0
–
18.0
ns
90.0
–
70.0
–
MHz
62.5
–
50.0
–
MHz
100
–
83.0
–
MHz
7.0
–
9.0
–
ns
A
–
3 Clock Frequency with Internal Feedback
3
4 Clock Frequency with External Feedback
(
1
tsu2 + tco1
)
4
–
5 Clock Frequency, Maximum Toggle
–
6 GLB Reg. Setup Time before Clock, 4 PT Bypass
A
7 GLB Reg. Clock to Output Delay, ORP Bypass
–
7.5
–
9.0
ns
–
8 GLB Reg. Hold Time after Clock, 4 PT Bypass
0.0
–
0.0
–
ns
–
9 GLB Reg. Setup Time before Clock
8.5
–
11.0
–
ns
–
10 GLB Reg. Clock to Output Delay
–
8.0
–
10.0
ns
–
11 GLB Reg. Hold Time after Clock
0.0
–
0.0
–
ns
A
12 Ext. Reset Pin to Output Delay
–
14.0
–
15.0
ns
–
13 Ext. Reset Pulse Duration
9.0
–
12.0
–
ns
B
14 Input to Output Enable
–
25.0
–
30.0
ns
C
15 Input to Output Disable
–
25.0
–
30.0
ns
B
16 Global OE Output Enable
–
10.0
–
12.0
ns
C
17 Global OE Output Disable
–
10.0
–
12.0
ns
B
18 Test OE Output Enable
–
13.0
–
15.0
ns
C
19 Test OE Output Disable
–
13.0
–
15.0
ns
–
20 Ext. Synchronous Clock Pulse Duration, High
5.0
–
6.0
–
ns
–
21 Ext. Synchronous Clock Pulse Duration, Low
5.0
–
6.0
–
ns
–
22 I/O Reg Setup Time before Ext. Synchronous Clock (Y3, Y4)
4.5
–
5.0
–
ns
–
23 I/O Reg Hold Time after Ext. Sync Clock (Y3, Y4)
0.0
–
0.0
–
ns
Unless noted otherwise, all parameters use 20 PTXOR path and ORP.
Refer to Timing Model in this data sheet for further details.
Standard 16-bit counter using GRP feedback.
fmax (Toggle) may be less than 1/(twh + twl). This is to allow for a clock duty cycle of other than 50%.
Reference Switching Test Conditions section.
6
Table 2-0030/3320
Specifications ispLSI 3448
Internal Timing Parameters1
Over Recommended Operating Conditions
PARAMETER
2
#
DESCRIPTION
-70
-90
MIN. MAX. MIN. MAX.
UNITS
Inputs
tiobp
tiolat
tiosu
tioh
tioco
tior
24 I/O Register Bypass
–
2.3
–
3.2
ns
25 I/O Latch Delay
–
14.0
–
18.2
ns
26 I/O Register Setup Time before Clock
7.5
–
9.0
–
ns
27 I/O Register Hold Time after Clock
-3.0
–
-4.0
–
ns
28 I/O Register Clock to Out Delay
–
8.3
–
10.2
ns
29 I/O Register Reset to Out Delay
–
8.3
–
10.2
ns
30 GRP Delay
–
3.2
–
3.5
ns
31 Feedback Delay
–
1.0
–
1.6
ns
32 4 Product Term Bypass Path Delay (Comb.)
–
4.0
–
5.3
ns
33 4 Product Term Bypass Path Delay (Reg.)
–
3.5
–
3.8
ns
34 1 Product Term/XOR Path Delay
–
5.0
–
5.8
ns
35 20 Product Term/XOR Path Delay
–
5.0
–
5.8
ns
–
6.2
–
7.3
ns
–
0.5
–
0.5
ns
38 GLB Register Setup Time before Clock
1.5
–
2.5
–
ns
39 GLB Register Hold Time after Clock
5.4
–
6.3
–
ns
40 GLB Register Clock to Output Delay
–
0.5
–
1.0
ns
41 GLB Register Reset to Output Delay
–
1.0
–
1.0
ns
42 GLB Product Term Reset to Register Delay
–
8.9
–
10.5
ns
43 GLB Product Term Output Enable to I/O Cell Delay
–
15.0
–
18.3
ns
3.7
3.7
4.5
4.5
ns
45 ORP Delay
–
1.5
–
2.0
ns
46 ORP Bypass Delay
–
0.0
–
0.0
ns
GRP
tgrp
tfeedback
GLB
t4ptbp
t4ptbr
t1ptxor
t20ptxor
txoradj
tgbp
tgsu
tgh
tgco
tgro
tptre
tptoe
tptck
36 XOR Adjacent Path Delay
3
37 GLB Register Bypass Delay
44 GLB Product Term Clock Delay
ORP
torp
torpbp
1. Internal Timing Parameters are not tested and are for reference only.
2. Refer to Timing Model in this data sheet for further details.
3. The XOR adjacent path can only be used by hard macros.
7
Table 2-0036/3448
Specifications ispLSI 3448
Internal Timing Parameters1
Over Recommended Operating Conditions
PARAMETER
2
#
DESCRIPTION
-90
-70
MIN. MAX. MIN. MAX.
UNITS
Outputs
tob
tobs
toen
todis
47 Output Buffer Delay
–
2.5
–
3.0
ns
48 Output Buffer Delay, Slew Limited Adder
–
13.0
–
13.0
ns
49 I/O Cell OE to Output Enabled
–
4.5
–
5.0
ns
50 I/O Cell OE to Output Disabled
–
4.5
–
5.0
ns
51 Clock Delay, Y0 or Y1 or Y2 to Global GLB Clock Line
3.5
3.5
4.0
4.0
ns
52 Clock Delay, Y3 or Y4 to I/O Cell Global Clock Line
3.0
3.0
4.0
4.0
ns
53 Global Reset to GLB and I/O Registers
–
9.0
–
9.0
ns
54 Global OE Pad Buffer
–
5.5
–
7.0
ns
55 Test OE Pad Buffer
–
8.5
–
10.0
ns
Clocks
tgy0/1/2
tioy3/4
Global Reset
tgr
tgoe
ttoe
1. Internal Timing Parameters are not tested and are for reference only.
2. Refer to Timing Model in this data sheet for further details.
8
Table 2-0037/3448
Specifications ispLSI 3448
ispLSI 3448 Timing Model
I/O Cell
GRP
GLB
Feedback
ORP
I/O Cell
#31
#32
I/O Reg Bypass
I/O
(Input)
#24
#53
GRP
#30
Input
D Register Q
RST
#25 - 29
4 PT Bypass
GLB Reg Bypass
ORP Bypass
#33
#37
#46
20 PT
XOR Delays
GLB Reg
Delay
ORP
Delay
D
#34 - 36
Q
#45
RST
#53
Reset
Y3,4
#38 - 41
#52
Control RE
PTs
OE
#42 - 44 CK
#51
Y0,1,2
#54
GOE0,1
#55
TOE
0902/3448
Derivations of tsu, th and tco from the Product Term Clock 1
tsu
=
=
=
2.8 ns =
Logic + Reg su - Clock (min)
(tiobp + tgrp + t20ptxor) + (tgsu) - (tiobp + tgrp + tptck(min))
(#24+ #30+ #35) + (#38) - (#24+ #30+ #44)
(2.3 + 3.2 + 5.0) + (1.5) - (2.3 + 3.2 + 3.7)
th
=
=
=
4.1 ns =
Clock (max) + Reg h - Logic
(tiobp + tgrp + tptck(max)) + (tgh) - (tiobp + tgrp + t20ptxor)
(#24+ #30+ #44) + (#39) - (#24+ #30+ #35)
(2.3 + 3.2 + 3.7) + (5.4) - (2.3 + 3.2 + 5.0)
tco
=
=
=
13.7 ns =
Clock (max) + Reg co + Output
(tiobp + tgrp + tptck(max)) + (tgco) + (torp + tob)
(#24 + #30 + #44) + (#40) + (#45 + #47)
(2.3 + 3.2 + 3.7) + (0.5) + (1.5 + 2.5)
Table 2-0042/3448
Note: Calculations are based on timing specs for the ispLSI 3448-90L.
9
#47, 48
#49, 50
I/O
(Output)
Specifications ispLSI 3448
Power Consumption
Power consumption in the ispLSI 3448 device depends
on two primary factors: the speed at which the device is
operating and the number of product terms used.
Figure 3 shows the relationship between power and
operating speed.
Figure 3. Typical Device Power Consumption vs fmax
1000
ispLSI 3448
ICC (mA)
800
600
400
200
0
30
60
90
fmax (MHz)
Notes: Configuration of 28 16-bit Counters
Typical Current at 5V, 25° C
ICC can be estimated for the ispLSI 3448 using the following equation:
ICC = 60 + (# of PTs * 0.46) + (# of nets * Max. freq * 0.01) where:
# of PTs = Number of Product Terms used in design
# of nets = Number of Signals used in device
Max. freq = Highest Clock Frequency to the device
The ICC estimate is based on typical conditions (VCC = 5.0V, room temperature) and an assumption of two
GLB loads on average exists. These values are for estimates only. Since the value of ICC is sensitive to
operating conditions and the program in the device, the actual ICC should be verified.
0127A/3448
10
Specifications ispLSI 3448
Signal Description
Signal Name
I/O
Description
Input/Output – These are the general purpose I/O used by the logic array.
GOE0, GOE1
Global Output Enable inputs.
TOE
Test Output Enable pin – This pin tristates all I/O pins when a logic low is driven.
RESET
Active Low (0) Reset which resets all of the GLB and I/O registers in the device.
Y0, Y1, Y2
Dedicated Clock inputs connect to one of the clock inputs of all the GLBs on the device.
Y3, Y4
Dedicated Clock inputs connect to one of the clock inputs of all the I/O cells on the device.
BSCAN/ispEN
Input – Dedicated in-system programming enable input. When this is high, the BSCAN TAP
controller signals TMS, TDI, TDO and TCK are enabled. When this is brought low, the ISP State
Machine control signals MODE, SDI, SDO and SLCK are enabled. High-to-low transition will put the
device in the programming mode and put all I/O in the high-Z state.
TDI/SDI
Input – This signal performs two functions. It is the Test Data input signal when ispEN is logic high.
When ispEN is logic low, it functions as an input to load programming data into the device. SDI is also
used as one of the two control signals for the ISP State Machine.
TCK/SCLK
Input – This signal performs two functions. It is the Test Clock input signal when ispEN is logic high.
When ispEN is logic low, it functions as a clock signal for the Serial Shift Register.
TMS/MODE
Input – This signal performs two functions. It is the Test Mode Select input signal when ispEN is logic
high. When ispEN is logic low, it controls the operation of the ISP State Machine.
TRST
Input – Test Reset, active low to reset the Boundary Scan State Machine.
TDO/SDO
Output – This signal performs two functions. When ispEN is logic low, it reads the ISP data. When
ispEN is high, it functions as Test Data Out.
GND
Ground (GND)
VCC
Vcc
NC1
No Connect.
Signal Locations
Signal
432-Ball BGA
GOE0, GOE1
R2, W1
TOE
H3
RESET
AA31
Y0, Y1, Y2, Y3, Y4 U30, N31, L1, AB3, AF1
BSCAN/ispEN
AD29
TDI/SDI
K29
TCK/SCLK
AG29
TMS/MODE
F31
TRST
E3
TDO/SDO
AH3
GND
A1, A2, A16, A30, A31, B1, B5, B9, B13, B19, B23, B27, B31, E2, E30, J2, J30, N2, N30, T1, T31, W2,
W30, AC2, AC30, AG2, AG30, AK1, AK5, AK9, AK13, AK19, AK23, AK27, AK31, AL1, AL2, AL16,
AL30, AL31
VCC
A3, A10, A22, A29, B14, B18, C1, C31, K1, K31, P2, P30, V2, V30, AB1, AB31, AJ1, AJ31, AK14,
AK18, AL3, AL10, AL22, AL29
NC1
B2, B3, B30, C3, C7, C11, C14, C18, C21, C25, C29, D4, D5, D6, D7, D8, D9, D10, D11, D12, D13,
D14, D15, D16, D17, D18, D19, D20, D21, D22, D23, D24, D25, D26, D27, D28, E4, E28, F4, F28,
G3, G4, G28, G29, H4, H28, J4, J28, K4, K28, L3, L4, L28, L29, M4, M28, N4, N28, P3, P4, P28, P29,
R4, R28, T4, T28, U4, U28, V3, V4, V28, V29, W4, W28, Y4, Y28, AA3, AA4, AA28, AA29, AB4, AB28,
AC4, AC28, AD4, AD28, AE3, AE4, AE28, AE29, AF4, AF28, AG4, AG28, AH4, AH5, AH6, AH7, AH8,
AH9, AH10, AH11, AH12, AH13, AH14, AH15, AH16, AH17, AH18, AH19, AH20, AH21, AH22, AH23,
AH24, AH25, AH26, AH27, AH28, AJ3, AJ7, AJ11, AJ14, AJ18, AJ21, AJ25, AJ29, AK2, AK30
1. NCs are not to be connected to any active signals, VCC or GND.
11
Specifications ispLSI 3448
I/O Locations
Signal
I/O 0
I/O 1
I/O 2
I/O 3
I/O 4
I/O 5
I/O 6
I/O 7
I/O 8
I/O 9
I/O 10
I/O 11
I/O 12
I/O 13
I/O 14
I/O 15
I/O 16
I/O 17
I/O 18
I/O 19
I/O 20
I/O 21
I/O 22
I/O 23
I/O 24
I/O 25
I/O 26
I/O 27
I/O 28
I/O 29
I/O 30
I/O 31
I/O 32
I/O 33
I/O 34
I/O 35
I/O 36
I/O 37
BGA
T30
U29
U31
V31
W31
W29
Y31
Y30
Y29
AA30
AB30
AB29
AC31
AC29
AD31
AD30
AE31
AE30
AF31
AF30
AF29
AG31
AH31
AH30
AJ30
AH29
AJ28
AK29
AK28
AJ27
AL28
AL27
AJ26
AK26
AL26
AK25
AL25
AJ24
Signal
I/O 38
I/O 39
I/O 40
I/O 41
I/O 42
I/O 43
I/O 44
I/O 45
I/O 46
I/O 47
I/O 48
I/O 49
I/O 50
I/O 51
I/O 52
I/O 53
I/O 54
I/O 55
I/O 56
I/O 57
I/O 58
I/O 59
I/O 60
I/O 61
I/O 62
I/O 63
I/O 64
I/O 65
I/O 66
I/O 67
I/O 68
I/O 69
I/O 70
I/O 71
I/O 72
I/O 73
I/O 74
I/O 75
BGA
AK24
AL24
AJ23
AL23
AJ22
AK22
AK21
AL21
AJ20
AK20
AL20
AJ19
AL19
AL18
AJ17
AK17
AL17
AJ16
AK16
AJ15
AK15
AL15
AL14
AL13
AJ13
AL12
AK12
AJ12
AL11
AK11
AK10
AJ10
AL9
AJ9
AL8
AK8
AJ8
AL7
Signal
I/O 76
I/O 77
I/O 78
I/O 79
I/O 80
I/O 81
I/O 82
I/O 83
I/O 84
I/O 85
I/O 86
I/O 87
I/O 88
I/O 89
I/O 90
I/O 91
I/O 92
I/O 93
I/O 94
I/O 95
I/O 96
I/O 97
I/O 98
I/O 99
I/O 100
I/O 101
I/O 102
I/O 103
I/O 104
I/O 105
I/O 106
I/O 107
I/O 108
I/O 109
I/O 110
I/O 111
I/O 112
I/O 113
BGA
AK7
AL6
AK6
AJ6
AL5
AL4
AJ5
AK4
AK3
AJ4
AJ2
AH2
AG3
AH1
AG1
AF3
AF2
AE2
AE1
AD3
AD2
AD1
AC3
AC1
AB2
AA2
AA1
Y3
Y2
Y1
W3
V1
U3
U2
U1
T3
T2
R3
12
Signal
BGA
Signal
BGA
Signal
I/O 114
I/O 115
I/O 116
I/O 117
I/O 118
I/O 119
I/O 120
I/O 121
I/O 122
I/O 123
I/O 124
I/O 125
I/O 126
I/O 127
I/O 128
I/O 129
I/O 130
I/O 131
I/O 132
I/O 133
I/O 134
I/O 135
I/O 136
I/O 137
I/O 138
I/O 139
I/O 140
I/O 141
I/O 142
I/O 143
I/O 144
I/O 145
I/O 146
I/O 147
I/O 148
I/O 149
I/O 150
I/O 151
R1
P1
N1
N3
M1
M2
M3
L2
K2
K3
J1
J3
H1
H2
G1
G2
F1
F2
F3
E1
D1
D2
C2
D3
C4
B4
C5
A4
A5
C6
B6
A6
B7
A7
C8
B8
A8
C9
I/O 152
I/O 153
I/O 154
I/O 155
I/O 156
I/O 157
I/O 158
I/O 159
I/O 160
I/O 161
I/O 162
I/O 163
I/O 164
I/O 165
I/O 166
I/O 167
I/O 168
I/O 169
I/O 170
I/O 171
I/O 172
I/O 173
I/O 174
I/O 175
I/O 176
I/O 177
I/O 178
I/O 179
I/O 180
I/O 181
I/O 182
I/O 183
I/O 184
I/O 185
I/O 186
I/O 187
I/O 188
I/O 189
A9
C10
B10
B11
A11
C12
B12
A12
C13
A13
A14
C15
B15
A15
C16
B16
C17
B17
A17
A18
A19
C19
A20
B20
C20
A21
B21
B22
C22
A23
C23
A24
B24
C24
A25
B25
A26
B26
I/O 190
I/O 191
I/O 192
I/O 193
I/O 194
I/O 195
I/O 196
I/O 197
I/O 198
I/O 199
I/O 200
I/O 201
I/O 202
I/O 203
I/O 204
I/O 205
I/O 206
I/O 207
I/O 208
I/O 209
I/O 210
I/O 211
I/O 212
I/O 213
I/O 214
I/O 215
I/O 216
I/O 217
I/O 218
I/O 219
I/O 220
I/O 221
I/O 222
I/O 223
BGA
C26
A27
A28
C27
B28
B29
C28
D29
C30
D30
E29
D31
E31
F29
F30
G30
G31
H29
H30
H31
J29
J31
K30
L30
L31
M29
M30
M31
N29
P31
R29
R30
R31
T29
Specifications ispLSI 3448
Signal Configuration
ispLSI 3448 432-Ball BGA Signal Diagram
31 30 29 28 27 26 25 24 23 22 21 20 19 18 17 16 15 14 13 12 11 10
9
8
7
6
5
4
3
2
1
A
GND
GND
VCC
I/O
192
I/O
191
I/O
188
I/O
186
I/O
183
I/O
181
VCC
I/O
177
I/O
174
I/O
172
I/O
171
I/O
170
GND
I/O
165
I/O
162
I/O
161
I/O
159
I/O
156
VCC
I/O
152
I/O
150
I/O
147
I/O
145
I/O
142
I/O
141
VCC
GND
GND
A
B
GND
NC1
I/O
195
I/O
194
GND
I/O
189
I/O
187
I/O
184
GND
I/O
179
I/O
178
I/O
175
GND
VCC
I/O
169
I/O
167
I/O
164
VCC
GND
I/O
158
I/O
155
I/O
154
GND
I/O
149
I/O
146
I/O
144
GND
I/O
139
NC1
NC1
GND
B
C
VCC
I/O
198
NC
1
I/O
196
I/O
193
I/O
190
NC
1
I/O
185
I/O
182
I/O
180
NC
1
I/O
176
I/O
173
NC
1
I/O
168
I/O
166
I/O
163
NC
1
I/O
160
I/O
157
NC
1
I/O
153
I/O
151
I/O
148
NC
1
I/O
143
I/O
140
I/O
138
NC
1
I/O
136
VCC
C
D
I/O
201
I/O
199
I/O
197
NC1
NC1
NC1
NC1
NC1
NC1
NC1
NC1
NC1
NC1
NC1
NC1
NC1
NC1
NC1
NC1
NC1
NC1
NC1
NC1
NC1
NC1
NC1
NC1
NC1
I/O
137
I/O
135
I/O
134
D
E
I/O
202
GND
I/O
200
NC1
NC1
TRST GND
I/O
133
E
F
MODE/
TMS
I/O
204
I/O
203
NC1
NC1
I/O
132
I/O
131
I/O
130
F
G
I/O
206
I/O
205
NC
1
1
1
1
I/O
129
I/O
128
G
H
I/O
209
I/O
208
I/O
207
NC1
NC1
TOE
I/O
127
I/O
126
H
J
I/O
211
GND
I/O
210
NC1
NC1
I/O
125
GND
I/O
124
J
K
VCC
I/O
212
TDI/
SDI
NC
1
1
I/O
123
I/O
122
VCC
K
L
I/O
214
I/O
213
NC1
NC1
NC1
NC1
I/O
121
Y2
L
M
I/O
217
I/O
216
I/O
215
NC1
NC1
I/O
120
I/O
119
I/O
118
M
N
Y1
GND
I/O
218
NC1
NC1
I/O
117
GND
I/O
116
N
P
I/O
219
VCC
NC
1
1
1
1
VCC
I/O
115
P
R
I/O
222
I/O
221
I/O
220
NC1
NC1
I/O
113
GOE
0
I/O
114
R
T
GND
I/O
0
I/O
223
NC1
NC1
U
I/O
2
Y0
I/O
1
NC
V
I/O
3
VCC
NC1
W
I/O
4
GND
Y
I/O
6
I/O
7
AA
RESET
I/O
9
NC
AB
VCC
I/O
10
I/O
11
AC
I/O
12
GND
I/O
13
AD
I/O
14
I/O
15
AE
I/O
16
I/O
17
NC
AF
I/O
18
I/O
19
I/O
20
AG
I/O
21
AH
I/O
22
I/O
23
AJ
VCC
I/O
24
NC
AK
GND
NC1
AL
GND
GND
NC
NC
NC
NC
NC
ispLSI 3448
NC
NC
I/O
111
I/O
112
GND
T
1
I/O
108
I/O
109
I/O
110
U
NC1
NC1
NC1
VCC
I/O
107
V
I/O
5
NC1
NC1
I/O
106
GND
GOE
1
W
I/O
8
NC1
NC1
I/O
103
I/O
104
I/O
105
Y
1
1
NC
1
I/O
101
I/O
102
AA
NC1
NC1
Y3
I/O
100
VCC
AB
NC1
NC1
I/O
98
GND
I/O
99
AC
ispEN/
NC1
BSCAN
NC
1
I/O
95
I/O
96
I/O
97
AD
NC
1
I/O
93
I/O
94
AE
1
1
GND TCK/
SCLK
I/O
25
NC
NC
Bottom View
1
NC
1
NC
1
NC1
NC1
I/O
91
I/O
92
Y4
AF
NC1
NC1
I/O
88
GND
I/O
90
AG
TDO/
SDO
AH
NC1
NC1
NC1
I/O
26
I/O
29
I/O
32
NC
I/O
27
I/O
28
GND
I/O
33
VCC
I/O
30
I/O
31
I/O
34
1
NC
NC1
NC1
NC1
NC1
I/O
37
I/O
40
I/O
42
NC
I/O
35
I/O
38
GND
I/O
43
I/O
36
I/O
39
I/O
41
VCC
1
NC1
NC1
NC1
I/O
46
I/O
49
NC
I/O
44
I/O
47
GND
I/O
45
I/O
48
I/O
50
1
NC1
NC1
NC1
NC1
I/O
52
I/O
55
I/O
57
NC
VCC
I/O
53
I/O
56
I/O
58
I/O
51
I/O
54
GND
I/O
59
1
NC1
NC1
NC1
NC1
I/O
69
I/O
71
I/O
74
NC
I/O
67
I/O
68
GND
I/O
73
I/O
66
VCC
I/O
70
9
NC1
NC1
I/O
62
I/O
65
NC
VCC
GND
I/O
64
I/O
60
I/O
61
I/O
63
1
NC1
1
31 30 29 28 27 26 25 24 23 22 21 20 19 18 17 16 15 14 13 12 11 10
1. NCs are not to be connected to any active signals, VCC or GND.
Note: Ball A1 indicator dot on top side of package.
13
NC1
I/O
87
I/O
89
I/O
86
VCC
AJ
I/O
84
NC1
GND
AK
VCC
GND
GND
AL
3
2
NC1
NC1
NC1
I/O
79
I/O
82
I/O
85
NC
I/O
76
I/O
78
GND
I/O
83
I/O
72
I/O
75
I/O
77
I/O
80
I/O
81
8
7
6
5
4
1
1
1
Specifications ispLSI 3448
Part Number Description
ispLSI 3448 – XX X XXXX
X
Device Family
Grade
Blank = Commercial
Device Number
Package
B432 = BGA
Speed
90 = 90 MHz fmax
70 = 70 MHz fmax
Power
L = Low
0212/3448
Ordering Information
COMMERCIAL
FAMILY
ispLSI
fmax (MHz)
tpd (ns)
ORDERING NUMBER
PACKAGE
90
12
ispLSI 3448-90LB432
432-Ball BGA
70
15
ispLSI 3448-70LB432
432-Ball BGA
Table 2-0041/3448
14