SCAS461F − FEBRUARY 1995 − REVISED OCTOBER 2003 D 2-V to 6-V VCC Operation D Inputs Accept Voltages to 6 V D Max tpd of 7 ns at 5 V SN54AC245 . . . J OR W PACKAGE SN74AC245 . . . DB, DW, N, NS, OR PW PACKAGE (TOP VIEW) DIR A1 A2 A3 A4 A5 A6 A7 A8 GND description/ordering information The ’AC245 octal bus transceivers are designed for asynchronous two-way communication between data buses. The control-function implementation minimizes external timing requirements. When the output-enable (OE) is low, the device passes noninverted data from the A bus to the B bus or from the B bus to the A bus, depending on the logic level at the direction control (DIR) input. A high on OE disables the device so that the buses are effectively isolated. 1 20 2 19 3 18 4 17 5 16 6 15 7 14 8 13 9 12 10 11 VCC OE B1 B2 B3 B4 B5 B6 B7 B8 To ensure the high-impedance state during power up or power down, OE should be tied to VCC through a pullup resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver. 4 3 2 1 20 19 18 5 17 6 16 7 15 8 14 9 10 11 12 13 B1 B2 B3 B4 B5 A8 GND B8 B7 B6 A3 A4 A5 A6 A7 OE A2 A1 DIR VCC SN54AC245 . . . FK PACKAGE (TOP VIEW) ORDERING INFORMATION PDIP − N SN74AC245N Tube SN74AC245DW Tape and reel SN74AC245DWR SOP − NS Tape and reel SN74AC245NSR AC245 SSOP − DB Tape and reel SN74AC245DBR AC245 Tube SN74AC245PW Tape and reel SN74AC245PWR CDIP − J Tube SNJ54AC245J SNJ54AC245J CFP − W Tube SNJ54AC245W SNJ54AC245W LCCC − FK Tube SNJ54AC245FK SNJ54AC245FK TSSOP − PW −55°C 125°C −55 C to 125 C TOP-SIDE MARKING Tube SOIC − DW −40°C 85°C −40 C to 85 C ORDERABLE PART NUMBER PACKAGE† TA SN74AC245N AC245 AC245 † Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at www.ti.com/sc/package. Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. Copyright 2003, Texas Instruments Incorporated ! " #$%! " &$'(#! )!%* )$#!" # ! "&%##!" &% !+% !%" %," "!$%!" "!)) -!.* )$#! &#%""/ )%" ! %#%""(. #($)% !%"!/ (( &%!%"* &)$#!" #&(! ! 012 (( &%!%" % !%"!%) $(%"" !+%-"% !%)* (( !+% &)$#!" &)$#! &#%""/ )%" ! %#%""(. #($)% !%"!/ (( &%!%"* POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 1 SCAS461F − FEBRUARY 1995 − REVISED OCTOBER 2003 FUNCTION TABLE INPUTS OE DIR L L H L H X OPERATION B data to A bus A data to B bus Isolation logic diagram (positive logic) DIR 1 19 A1 OE 2 18 B1 To Seven Other Channels absolute maximum ratings over operating free-air temperature range (unless otherwise noted)† Supply voltage range, VCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to 7 V Input voltage range, VI (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to VCC + 0.5 V Output voltage range, VO (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to VCC + 0.5 V Input clamp current, IIK (VI < 0 or VI > VCC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±20 mA Output clamp current, IOK (VO < 0 or VO > VCC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±20 mA Continuous output current, IO (VO = 0 to VCC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±50 mA Continuous current through VCC or GND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±200 mA Package thermal impedance, θJA (see Note 2): DB package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 70°C/W DW package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 58°C/W N package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 69°C/W NS package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 60°C/W PW package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 83°C/W Storage temperature range, Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −65°C to 150°C † Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. NOTES: 1. The input and output voltage ratings may be exceeded if the input and output current ratings are observed. 2. The package thermal impedance is calculated in accordance with JESD 51-7. 2 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 SCAS461F − FEBRUARY 1995 − REVISED OCTOBER 2003 recommended operating conditions (see Note 3) SN54AC245 VCC VIH Supply voltage VCC = 3 V VCC = 4.5 V High-level input voltage VCC = 5.5 V VCC = 3 V VIL VI VO IOH IOL Dt/Dv MIN MAX 2 6 Input voltage Low-level output current 2 6 3.15 3.15 3.85 3.85 0 High-level output current MAX 2.1 0 Output voltage MIN 2.1 VCC = 4.5 V VCC = 5.5 V Low-level input voltage SN74AC245 0.9 1.35 1.35 1.65 1.65 0 0 VCC VCC VCC = 3 V VCC = 4.5 V −12 −12 −24 −24 VCC = 5.5 V VCC = 3 V −24 −24 12 12 VCC = 4.5 V VCC = 5.5 V 24 24 24 24 8 8 Input transition rise or fall rate V V 0.9 VCC VCC UNIT V V V mA mA ns/V TA Operating free-air temperature −55 125 −40 85 °C NOTE 3: All unused inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report, Implications of Slow or Floating CMOS Inputs, literature number SCBA004. POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 3 SCAS461F − FEBRUARY 1995 − REVISED OCTOBER 2003 electrical characteristics over recommended operating free-air temperature range (unless otherwise noted) PARAMETER TEST CONDITIONS VCC IOH = −50 mA IOH = −12 mA VOH IOH = −24 mA TA = 25°C TYP MAX MIN MAX SN74AC245 MIN 3V 2.9 2.9 2.9 4.5 V 4.4 4.4 4.4 5.5 V 5.4 5.4 5.4 3V 2.56 2.4 2.46 4.5 V 3.86 3.7 3.76 5.5 V 4.86 4.7 4.76 MAX 3V 0.002 0.1 0.1 0.1 IOL = 50 mA 4.5 V 0.001 0.1 0.1 0.1 5.5 V 0.001 0.1 0.1 0.1 3.85 5.5 V IOL = 50 mA† IOL = 75 mA† UNIT V 5.5 V IOL = 24 mA 3.85 3V 0.36 0.5 0.44 4.5 V 0.36 0.5 0.44 5.5 V 0.36 0.5 0.44 5.5 V V 1.65 5.5 V 1.65 A or B ports‡ II SN54AC245 IOH = −50 mA† IOH = −75 mA† IOL = 12 mA VOL MIN ±0.1 ±1 ±1 ±0.1 ±1 ±1 A mA VI = VCC or GND 5.5 V IOZ VO = VCC or GND, VI(OE) = VIL or VIH 5.5 V ±0.5 ±10 ±5 mA ICC Ci VI = VCC or GND, VI = VCC or GND 5.5 V 4 80 40 mA OE or DIR IO = 0 5V 4.5 pF Cio VO = VCC or GND 5V 15 † Not more than one output should be tested at a time, and the duration of the test should not exceed 2 ms. ‡ For I/O ports, the parameter IOZ includes the input leakage current. pF switching characteristics over recommended operating free-air temperature range, VCC = 3.3 V " 0.3 V (unless otherwise noted) (see Figure 1) 4 PARAMETER FROM (INPUT) TO (OUTPUT) tPLH tPHL A or B B or A tPZH tPZL OE A or B tPHZ tPLZ OE A or B POST OFFICE BOX 655303 MIN TA = 25°C TYP MAX 1.5 5 1.5 5 2.5 SN54AC245 SN74AC245 MIN MAX MIN MAX 8.5 1 11.5 1 9 8.5 1 10 1 9 7 11.5 1 13.5 2 12.5 2.5 7.5 12 1 14.5 2 13.5 2 6.5 12 1 13.5 1 12.5 2 7 11.5 1 14 1.5 13 • DALLAS, TEXAS 75265 UNIT ns ns ns SCAS461F − FEBRUARY 1995 − REVISED OCTOBER 2003 switching characteristics over recommended operating free-air temperature range, VCC = 5 V " 5 V (unless otherwise noted) (see Figure 1) PARAMETER FROM (INPUT) TO (OUTPUT) tPLH tPHL A or B B or A tPZH tPZL OE A or B tPHZ tPLZ OE A or B MIN TA = 25°C TYP MAX SN54AC245 SN74AC245 MIN MAX MIN MAX 1.5 3.5 6.5 1 8.5 1 7 1.5 3.5 6 1 7.5 1 7 1.5 5 8.5 1 10 1 9 1.5 5.5 9 1 10.5 1 9.5 1.5 5.5 9 1 10.5 1 10 1.5 5.5 9 1 10.5 1 10 UNIT ns ns ns operating characteristics, VCC = 5 V, TA = 25°C PARAMETER Cpd TEST CONDITIONS Power dissipation capacitance per transceiver CL = 50 pF, TYP f = 1 MHz 45 UNIT pF PARAMETER MEASUREMENT INFORMATION 2 × VCC S1 500 Ω From Output Under Test CL = 50 pF (see Note A) Open TEST S1 tPLH/tPHL tPLZ/tPZL tPHZ/tPZH Open 2 × VCC Open 500 Ω LOAD CIRCUIT VCC Input 50% 50% 0V tPHL tPLH In-Phase Output 50% VCC tPHL Out-of-Phase Output VOH 50% VCC VOL tPLH 50% VCC VOH 50% VCC VOL Output Control (low-level enabling) VCC 50% VCC 50% VCC 0V tPLZ tPZL Output Waveform 1 S1 at 2 × VCC (see Note B) 50% VCC ≈VCC VOL + 0.3 V VOL tPHZ tPZH Output Waveform 2 S1 at Open (see Note B) 50% VCC VOH − 0.3 V VOH ≈0 V VOLTAGE WAVEFORMS VOLTAGE WAVEFORMS NOTES: A. CL includes probe and jig capacitance. B. Waveform 1 is for an output with internal conditions such that the output is low except when disabled by the output control. Waveform 2 is for an output with internal conditions such that the output is high except when disabled by the output control. C. All input pulses are supplied by generators having the following characteristics: PRR ≤ 1 MHz, ZO = 50 Ω, tr v 2.5 ns, tf v 2.5 ns. D. The outputs are measured one at a time with one input transition per measurement. Figure 1. Load Circuit and Voltage Waveforms POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 5 PACKAGE OPTION ADDENDUM www.ti.com 6-Dec-2006 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Eco Plan (2) Qty 5962-87758012A ACTIVE LCCC FK 20 1 TBD 5962-8775801RA ACTIVE CDIP J 20 1 TBD Lead/Ball Finish MSL Peak Temp (3) POST-PLATE N / A for Pkg Type A42 SNPB N / A for Pkg Type 5962-8775801SA ACTIVE CFP W 20 1 TBD A42 N / A for Pkg Type 5962-8775801VRA ACTIVE CDIP J 20 1 TBD A42 SNPB N / A for Pkg Type 5962-8775801VSA ACTIVE CFP W 20 1 TBD A42 N / A for Pkg Type SN74AC245DBLE OBSOLETE SSOP DB 20 SN74AC245DBR ACTIVE SSOP DB 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74AC245DBRE4 ACTIVE SSOP DB 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74AC245DW ACTIVE SOIC DW 20 25 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74AC245DWE4 ACTIVE SOIC DW 20 25 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74AC245DWR ACTIVE SOIC DW 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74AC245DWRE4 ACTIVE SOIC DW 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74AC245N ACTIVE PDIP N 20 20 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type SN74AC245NE4 ACTIVE PDIP N 20 20 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type SN74AC245NSR ACTIVE SO NS 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74AC245NSRE4 ACTIVE SO NS 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74AC245PW ACTIVE TSSOP PW 20 70 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74AC245PWE4 ACTIVE TSSOP PW 20 70 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74AC245PWLE OBSOLETE TSSOP PW 20 SN74AC245PWR ACTIVE TSSOP PW 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74AC245PWRE4 ACTIVE TSSOP PW 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SNJ54AC245FK ACTIVE LCCC FK 20 1 TBD SNJ54AC245J ACTIVE CDIP J 20 1 TBD A42 SNPB N / A for Pkg Type SNJ54AC245W ACTIVE CFP W 20 1 TBD A42 N / A for Pkg Type TBD TBD Call TI Call TI Call TI Call TI POST-PLATE N / A for Pkg Type (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. Addendum-Page 1 PACKAGE OPTION ADDENDUM www.ti.com 6-Dec-2006 TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 2 PACKAGE MATERIALS INFORMATION www.ti.com 24-Apr-2007 TAPE AND REEL INFORMATION Pack Materials-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com Device 24-Apr-2007 Package Pins Site Reel Diameter (mm) Reel Width (mm) A0 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant SN74AC245DBR DB 20 MLA 330 16 8.2 7.5 2.5 12 16 Q1 SN74AC245DWR DW 20 MLA 330 24 10.8 13.0 2.7 12 24 Q1 SN74AC245NSR NS 20 MLA 330 24 8.2 13.0 2.5 12 24 Q1 SN74AC245PWR PW 20 MLA 330 16 6.95 7.1 1.6 8 16 Q1 TAPE AND REEL BOX INFORMATION Device Package Pins Site Length (mm) Width (mm) Height (mm) SN74AC245DBR DB 20 MLA 333.2 333.2 28.58 SN74AC245DWR DW 20 MLA 333.2 333.2 31.75 SN74AC245NSR NS 20 MLA 333.2 333.2 31.75 SN74AC245PWR PW 20 MLA 333.2 333.2 28.58 Pack Materials-Page 2 PACKAGE MATERIALS INFORMATION www.ti.com 24-Apr-2007 Pack Materials-Page 3 MECHANICAL DATA MLCC006B – OCTOBER 1996 FK (S-CQCC-N**) LEADLESS CERAMIC CHIP CARRIER 28 TERMINAL SHOWN 18 17 16 15 14 13 NO. OF TERMINALS ** 12 19 11 20 10 A B MIN MAX MIN MAX 20 0.342 (8,69) 0.358 (9,09) 0.307 (7,80) 0.358 (9,09) 28 0.442 (11,23) 0.458 (11,63) 0.406 (10,31) 0.458 (11,63) 21 9 22 8 44 0.640 (16,26) 0.660 (16,76) 0.495 (12,58) 0.560 (14,22) 23 7 52 0.739 (18,78) 0.761 (19,32) 0.495 (12,58) 0.560 (14,22) 24 6 68 0.938 (23,83) 0.962 (24,43) 0.850 (21,6) 0.858 (21,8) 84 1.141 (28,99) 1.165 (29,59) 1.047 (26,6) 1.063 (27,0) B SQ A SQ 25 5 26 27 28 1 2 3 4 0.080 (2,03) 0.064 (1,63) 0.020 (0,51) 0.010 (0,25) 0.020 (0,51) 0.010 (0,25) 0.055 (1,40) 0.045 (1,14) 0.045 (1,14) 0.035 (0,89) 0.045 (1,14) 0.035 (0,89) 0.028 (0,71) 0.022 (0,54) 0.050 (1,27) 4040140 / D 10/96 NOTES: A. B. C. D. E. All linear dimensions are in inches (millimeters). This drawing is subject to change without notice. This package can be hermetically sealed with a metal lid. The terminals are gold plated. Falls within JEDEC MS-004 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 MECHANICAL DATA MSSO002E – JANUARY 1995 – REVISED DECEMBER 2001 DB (R-PDSO-G**) PLASTIC SMALL-OUTLINE 28 PINS SHOWN 0,38 0,22 0,65 28 0,15 M 15 0,25 0,09 8,20 7,40 5,60 5,00 Gage Plane 1 14 0,25 A 0°–ā8° 0,95 0,55 Seating Plane 2,00 MAX 0,10 0,05 MIN PINS ** 14 16 20 24 28 30 38 A MAX 6,50 6,50 7,50 8,50 10,50 10,50 12,90 A MIN 5,90 5,90 6,90 7,90 9,90 9,90 12,30 DIM 4040065 /E 12/01 NOTES: A. B. C. D. All linear dimensions are in millimeters. This drawing is subject to change without notice. Body dimensions do not include mold flash or protrusion not to exceed 0,15. Falls within JEDEC MO-150 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 MECHANICAL DATA MTSS001C – JANUARY 1995 – REVISED FEBRUARY 1999 PW (R-PDSO-G**) PLASTIC SMALL-OUTLINE PACKAGE 14 PINS SHOWN 0,30 0,19 0,65 14 0,10 M 8 0,15 NOM 4,50 4,30 6,60 6,20 Gage Plane 0,25 1 7 0°– 8° A 0,75 0,50 Seating Plane 0,15 0,05 1,20 MAX PINS ** 0,10 8 14 16 20 24 28 A MAX 3,10 5,10 5,10 6,60 7,90 9,80 A MIN 2,90 4,90 4,90 6,40 7,70 9,60 DIM 4040064/F 01/97 NOTES: A. B. C. D. All linear dimensions are in millimeters. This drawing is subject to change without notice. Body dimensions do not include mold flash or protrusion not to exceed 0,15. Falls within JEDEC MO-153 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue any product or service without notice. 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