TI SN74HCT374NSR

SCLS005D − MARCH 1984 − REVISED AUGUST 2003
D Operating Voltage Range of 4.5 V to 5.5 V
D High-Current 3-State True Outputs Can
D
D
D
D
D
D
D
SN54HCT374 . . . J OR W PACKAGE
SN74HCT374 . . . DB, DW, N, NS, OR PW PACKAGE
(TOP VIEW)
Drive Up To 15 LSTTL Loads
Low Power Consumption, 80-µA Max ICC
Typical tpd = 22 ns
±6-mA Output Drive at 5 V
Low Input Current of 1 µA Max
Inputs Are TTL-Voltage Compatible
Eight D-Type Flip-Flops in a Single Package
Full Parallel Access for Loading
OE
1Q
1D
2D
2Q
3Q
3D
4D
4Q
GND
description/ordering information
These 8-bit flip-flops feature 3-state outputs
designed specifically for driving highly capacitive
or relatively low-impedance loads. They are
particularly suitable for implementing buffer
registers, I/O ports, bidirectional bus drivers, and
working registers.
1
20
2
19
3
18
4
17
5
16
6
15
7
14
8
13
9
12
10
11
VCC
8Q
8D
7D
7Q
6Q
6D
5D
5Q
CLK
1D
1Q
OE
VCC
8Q
SN54HCT374 . . . FK PACKAGE
(TOP VIEW)
2D
2Q
3Q
3D
4D
3 2 1 20 19
18
5
17
6
16
7
15
8
14
9 10 11 12 13
8D
7D
7Q
6Q
6D
4Q
GND
CLK
5Q
5D
The eight flip-flops of the ’HCT374 devices are
edge-triggered D-type flip-flops. On the positive
transition of the clock (CLK) input, the Q outputs
are set to the logic levels that were set up at the
data (D) inputs.
4
An output-enable (OE) input places the eight
outputs in either a normal logic state (high or low
logic levels) or the high-impedance state. In the high-impedance state, the outputs neither load nor drive the
bus lines significantly. The high-impedance state and increased drive provide the capability to drive bus lines
without interface or pullup components.
ORDERING INFORMATION
PDIP − N
SN74HCT374N
Tube of 25
SN74HCT374DW
Reel of 2000
SN74HCT374DWR
SOP − NS
Reel of 2000
SN74HCT374NSR
HCT374
SSOP − DB
Reel of 2000
SN74HCT374DBR
HT374
Tube of 70
SN74HCT374PW
Reel of 2000
SN74HCT374PWR
TSSOP − PW
−55°C
−55
C to 125
125°C
C
TOP-SIDE
MARKING
Tube of 20
SOIC − DW
−40°C to 85°C
ORDERABLE
PART NUMBER
PACKAGE†
TA
SN74HCT374N
HCT374
HT374
Reel of 250
SN74HCT374PWT
CDIP − J
Tube of 20
SNJ54HCT374J
SNJ54HCT374J
CFP − W
Tube of 85
SNJ54HCT374W
SNJ54HCT374W
LCCC − FK
Tube of 55
SNJ54HCT374FK
SNJ54HCT374FK
† Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are
available at www.ti.com/sc/package.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
Copyright  2003, Texas Instruments Incorporated
! " #$%! " &$'(#! )!%*
)$#!" # ! "&%##!" &% !+% !%" %," "!$%!"
"!)) -!.* )$#! &#%""/ )%" ! %#%""(. #($)%
!%"!/ (( &%!%"*
&)$#!" #&(! ! 01
(( &%!%" % !%"!%)
$(%"" !+%-"% !%)* (( !+% &)$#!"
&)$#!
&#%""/ )%" ! %#%""(. #($)% !%"!/ (( &%!%"*
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
1
SCLS005D − MARCH 1984 − REVISED AUGUST 2003
description/ordering information (continued)
OE does not affect the internal operations of the flip-flops. Old data can be retained or new data can be entered
while the outputs are in the high-impedance state.
FUNCTION TABLE
(each flip-flop)
INPUTS
OE
CLK
D
OUTPUT
Q
L
↑
H
H
L
↑
L
L
L
H or L
X
Q0
H
X
X
Z
logic diagram (positive logic)
OE
CLK
1
11
C1
1D
3
1D
2
1Q
To Seven Other Channels
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)†
Supply voltage range, VCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to 7 V
Input clamp current, IIK (VI < 0 or VI > VCC) (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±20 mA
Output clamp current, IOK (VO < 0 or VO > VCC) (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±20 mA
Continuous output current, IO (VO = 0 to VCC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±35 mA
Continuous current through VCC or GND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±70 mA
Package thermal impedance, θJA (see Note 2): DB package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 70°C/W
DW package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 58°C/W
N package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 69°C/W
NS package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 60°C/W
PW package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 83°C/W
Storage temperature range, Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −65°C to 150°C
† Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTES: 1. The input and output voltage ratings may be exceeded if the input and output current ratings are observed.
2. The package thermal impedance is calculated in accordance with JESD 51-7.
2
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
SCLS005D − MARCH 1984 − REVISED AUGUST 2003
recommended operating conditions (see Note 3)
SN54HCT374
MIN
NOM
MAX
MIN
NOM
MAX
4.5
5
5.5
4.5
5
5.5
VCC
VIH
Supply voltage
VIL
VI
Low-level input voltage
Input voltage
0
VO
∆t/∆v
Output voltage
0
High-level input voltage
VCC = 4.5 V to 5.5 V
VCC = 4.5 V to 5.5 V
SN74HCT374
2
2
Input transition rise/fall time
V
V
0.8
VCC
VCC
UNIT
0
0
500
0.8
V
VCC
VCC
V
500
ns
V
TA
Operating free-air temperature
−55
125
−40
85
°C
NOTE 3: All unused inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report,
Implications of Slow or Floating CMOS Inputs, literature number SCBA004.
electrical characteristics over recommended operating free-air temperature range (unless
otherwise noted)
PARAMETER
TEST CONDITIONS
VCC
VOH
VI = VIH or VIL
IOH = −20 µA
IOH = −6 mA
4.5 V
VOL
VI = VIH or VIL
IOL = 20 µA
IOL = 6 mA
4.5 V
II
IOZ
VI = VCC or 0
VO = VCC or 0
ICC
VI = VCC or 0,
IO = 0
One input at 0.5 V or 2.4 V,
Other inputs at 0 or VCC
5.5 V
∆ICC†
MIN
SN54HCT374
MIN
MAX
SN74HCT374
MIN
4.4
4.499
4.4
4.4
3.98
4.3
3.7
3.84
MAX
UNIT
V
0.001
0.1
0.1
0.1
0.17
0.26
0.4
0.33
5.5 V
±0.1
±100
±1000
±1000
nA
5.5 V
±0.01
±0.5
±10
±5
µA
8
160
80
µA
1.4
2.4
3
2.9
mA
3
10
10
10
pF
5.5 V
4.5 V
to 5.5 V
Ci
TA = 25°C
TYP
MAX
V
† This is the increase in supply current for each input that is at one of the specified TTL voltage levels, rather than 0 V or VCC.
timing requirements over recommended operating free-air temperature range (unless otherwise
noted)
fclock
Clock frequency
tw
Pulse duration, CLK high or low
tsu
Setup time, data before CLK↑
th
Hold time, data after CLK↑
POST OFFICE BOX 655303
TA = 25°C
MIN
MAX
SN54HCT374
VCC
4.5 V
31
21
25
5.5 V
36
23
28
MIN
MAX
SN74HCT374
MIN
4.5 V
16
24
20
5.5 V
14
22
18
4.5 V
20
30
25
5.5 V
17
27
23
4.5 V
10
10
10
5.5 V
10
10
10
• DALLAS, TEXAS 75265
MAX
UNIT
MHz
ns
ns
ns
3
SCLS005D − MARCH 1984 − REVISED AUGUST 2003
switching characteristics over recommended operating free-air temperature range, CL = 50 pF
(unless otherwise noted) (see Figure 1)
PARAMETER
FROM
(INPUT)
TO
(OUTPUT)
fmax
tpd
CLK
Any Q
ten
OE
Any Q
tdis
OE
Any Q
tt
Any Q
TA = 25°C
TYP
MAX
SN54HCT374
SN74HCT374
VCC
MIN
4.5 V
31
36
21
25
5.5 V
36
40
23
28
MIN
MAX
MIN
MAX
UNIT
MHz
4.5 V
30
36
54
45
5.5 V
25
32
49
41
4.5 V
26
30
45
38
5.5 V
23
27
41
34
4.5 V
23
30
45
38
5.5 V
22
27
41
34
4.5 V
10
12
18
15
5.5 V
9
11
16
14
ns
ns
ns
ns
switching characteristics over recommended operating free-air temperature range, CL = 150 pF
(unless otherwise noted) (see Figure 1)
PARAMETER
FROM
(INPUT)
TO
(OUTPUT)
tpd
CLK
Any Q
ten
OE
Any Q
tt
Any Q
VCC
MIN
TA = 25°C
TYP
MAX
SN54HCT374
MIN
MAX
SN74HCT374
MIN
MAX
4.5 V
40
46
69
58
5.5 V
35
41
62
52
4.5 V
34
40
60
50
5.5 V
29
36
54
45
4.5 V
18
42
63
53
5.5 V
16
38
57
48
UNIT
ns
ns
ns
operating characteristics, TA = 25°C
PARAMETER
Cpd
4
TEST CONDITIONS
Power dissipation capacitance per flip-flop
POST OFFICE BOX 655303
No load
• DALLAS, TEXAS 75265
TYP
85
UNIT
pF
SCLS005D − MARCH 1984 − REVISED AUGUST 2003
PARAMETER MEASUREMENT INFORMATION
VCC
S1
Test
Point
From Output
Under Test
PARAMETER
ten
RL
tdis
CL
(see Note A)
S2
tPZH
1 kΩ
tPZL
tPHZ
tPLZ
tpd or tt
CL
S1
S2
50 pF
or
150 pF
Open
Closed
Closed
Open
Open
Closed
Closed
Open
Open
Open
RL
1 kΩ
50 pF
50 pF
or
150 pF
−−
LOAD CIRCUIT
3V
High-Level
Pulse
1.3 V
3V
Reference
Input
1.3 V
0V
1.3 V
tsu
0V
tw
Data
Input 1.3 V
0.3 V
3V
Low-Level
Pulse
1.3 V
1.3 V
Output
Control
(Low-Level
Enabling)
3V
1.3 V
0V
tPLH
In-Phase
Output
1.3 V
10%
tPHL
90%
90%
tr
Out-ofPhase
Output
tPHL
90%
VOH
1.3 V
10% V
OL
tf
tPLH
1.3 V
10%
1.3 V
10%
tf
2.7 V
3V
1.3 V
0.3 V 0 V
tf
VOLTAGE WAVEFORMS
SETUP AND HOLD AND INPUT RISE AND FALL TIMES
VOLTAGE WAVEFORMS
PULSE DURATIONS
1.3 V
2.7 V
tr
0V
Input
th
3V
1.3 V
1.3 V
0V
tPZL
Output
Waveform 1
(See Note B)
tPLZ
≈VCC
1.3 V
10%
tPZH
90%
VOH
VOL
tr
VOLTAGE WAVEFORMS
PROPAGATION DELAY AND OUTPUT RISE AND FALL TIMES
Output
Waveform 2
(See Note B)
VOL
tPHZ
1.3 V
90%
VOH
≈0 V
VOLTAGE WAVEFORMS
ENABLE AND DISABLE TIMES FOR 3-STATE OUTPUTS
NOTES: A. CL includes probe and test-fixture capacitance.
B. Waveform 1 is for an output with internal conditions such that the output is low except when disabled by the output control.
Waveform 2 is for an output with internal conditions such that the output is high except when disabled by the output control.
C. Phase relationships between waveforms were chosen arbitrarily. All input pulses are supplied by generators having the following
characteristics: PRR ≤ 1 MHz, ZO = 50 Ω, tr = 6 ns, tf = 6 ns.
D. For clock inputs, fmax is measured when the input duty cycle is 50%.
E. The outputs are measured one at a time with one input transition per measurement.
F. tPLZ and tPHZ are the same as tdis.
G. tPZL and tPZH are the same as ten.
H. tPLH and tPHL are the same as tpd.
Figure 1. Load Circuit and Voltage Waveforms
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
5
PACKAGE OPTION ADDENDUM
www.ti.com
10-May-2007
PACKAGING INFORMATION
Orderable Device
Status (1)
Package
Type
5962-8550701VRA
ACTIVE
CDIP
J
20
1
TBD
A42 SNPB
N / A for Pkg Type
5962-8550701VSA
ACTIVE
CFP
W
20
1
TBD
A42
N / A for Pkg Type
Package
Drawing
Pins Package Eco Plan (2)
Qty
Lead/Ball Finish
MSL Peak Temp (3)
85507012A
ACTIVE
LCCC
FK
20
1
TBD
8550701RA
ACTIVE
CDIP
J
20
1
TBD
POST-PLATE N / A for Pkg Type
A42 SNPB
N / A for Pkg Type
JM38510/65652BRA
ACTIVE
CDIP
J
20
1
TBD
A42 SNPB
N / A for Pkg Type
1
TBD
A42 SNPB
N / A for Pkg Type
SN54HCT374J
ACTIVE
CDIP
J
20
SN74HCT374DBR
ACTIVE
SSOP
DB
20
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74HCT374DBRE4
ACTIVE
SSOP
DB
20
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74HCT374DW
ACTIVE
SOIC
DW
20
25
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74HCT374DWE4
ACTIVE
SOIC
DW
20
25
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74HCT374DWG4
ACTIVE
SOIC
DW
20
25
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74HCT374DWR
ACTIVE
SOIC
DW
20
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74HCT374DWRE4
ACTIVE
SOIC
DW
20
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74HCT374DWRG4
ACTIVE
SOIC
DW
20
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74HCT374N
ACTIVE
PDIP
N
20
Pb-Free
(RoHS)
CU NIPDAU
N / A for Pkg Type
SN74HCT374N3
OBSOLETE
PDIP
N
20
TBD
Call TI
SN74HCT374NE4
ACTIVE
PDIP
N
20
Pb-Free
(RoHS)
CU NIPDAU
N / A for Pkg Type
SN74HCT374NSR
ACTIVE
SO
NS
20
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74HCT374NSRE4
ACTIVE
SO
NS
20
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74HCT374PW
ACTIVE
TSSOP
PW
20
70
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74HCT374PWE4
ACTIVE
TSSOP
PW
20
70
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74HCT374PWR
ACTIVE
TSSOP
PW
20
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74HCT374PWRE4
ACTIVE
TSSOP
PW
20
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74HCT374PWT
ACTIVE
TSSOP
PW
20
250
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74HCT374PWTE4
ACTIVE
TSSOP
PW
20
250
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SNJ54HCT374FK
ACTIVE
LCCC
FK
20
1
TBD
SNJ54HCT374J
ACTIVE
CDIP
J
20
1
TBD
20
20
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
Addendum-Page 1
Call TI
POST-PLATE N / A for Pkg Type
A42 SNPB
N / A for Pkg Type
PACKAGE OPTION ADDENDUM
www.ti.com
10-May-2007
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
19-May-2007
TAPE AND REEL INFORMATION
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
Device
19-May-2007
Package Pins
Site
Reel
Diameter
(mm)
Reel
Width
(mm)
A0 (mm)
B0 (mm)
K0 (mm)
P1
(mm)
W
Pin1
(mm) Quadrant
SN74HCT374DBR
DB
20
MLA
330
16
8.2
7.5
2.5
12
16
Q1
SN74HCT374DWR
DW
20
MLA
330
24
10.8
13.0
2.7
12
24
Q1
SN74HCT374DWR
DW
20
TAI
330
24
10.8
13.1
2.65
12
24
Q1
SN74HCT374NSR
NS
20
MLA
330
24
8.2
13.0
2.5
12
24
Q1
SN74HCT374PWR
PW
20
MLA
330
16
6.95
7.1
1.6
8
16
Q1
TAPE AND REEL BOX INFORMATION
Device
Package
Pins
Site
Length (mm)
Width (mm)
Height (mm)
SN74HCT374DBR
DB
20
MLA
342.9
336.6
28.58
SN74HCT374DWR
DW
20
MLA
333.2
333.2
31.75
SN74HCT374DWR
DW
20
TAI
346.0
346.0
41.0
SN74HCT374NSR
NS
20
MLA
333.2
333.2
31.75
SN74HCT374PWR
PW
20
MLA
342.9
336.6
28.58
Pack Materials-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
19-May-2007
Pack Materials-Page 3
MECHANICAL DATA
MLCC006B – OCTOBER 1996
FK (S-CQCC-N**)
LEADLESS CERAMIC CHIP CARRIER
28 TERMINAL SHOWN
18
17
16
15
14
13
NO. OF
TERMINALS
**
12
19
11
20
10
A
B
MIN
MAX
MIN
MAX
20
0.342
(8,69)
0.358
(9,09)
0.307
(7,80)
0.358
(9,09)
28
0.442
(11,23)
0.458
(11,63)
0.406
(10,31)
0.458
(11,63)
21
9
22
8
44
0.640
(16,26)
0.660
(16,76)
0.495
(12,58)
0.560
(14,22)
23
7
52
0.739
(18,78)
0.761
(19,32)
0.495
(12,58)
0.560
(14,22)
24
6
68
0.938
(23,83)
0.962
(24,43)
0.850
(21,6)
0.858
(21,8)
84
1.141
(28,99)
1.165
(29,59)
1.047
(26,6)
1.063
(27,0)
B SQ
A SQ
25
5
26
27
28
1
2
3
4
0.080 (2,03)
0.064 (1,63)
0.020 (0,51)
0.010 (0,25)
0.020 (0,51)
0.010 (0,25)
0.055 (1,40)
0.045 (1,14)
0.045 (1,14)
0.035 (0,89)
0.045 (1,14)
0.035 (0,89)
0.028 (0,71)
0.022 (0,54)
0.050 (1,27)
4040140 / D 10/96
NOTES: A.
B.
C.
D.
E.
All linear dimensions are in inches (millimeters).
This drawing is subject to change without notice.
This package can be hermetically sealed with a metal lid.
The terminals are gold plated.
Falls within JEDEC MS-004
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
MECHANICAL DATA
MSSO002E – JANUARY 1995 – REVISED DECEMBER 2001
DB (R-PDSO-G**)
PLASTIC SMALL-OUTLINE
28 PINS SHOWN
0,38
0,22
0,65
28
0,15 M
15
0,25
0,09
8,20
7,40
5,60
5,00
Gage Plane
1
14
0,25
A
0°–ā8°
0,95
0,55
Seating Plane
2,00 MAX
0,10
0,05 MIN
PINS **
14
16
20
24
28
30
38
A MAX
6,50
6,50
7,50
8,50
10,50
10,50
12,90
A MIN
5,90
5,90
6,90
7,90
9,90
9,90
12,30
DIM
4040065 /E 12/01
NOTES: A.
B.
C.
D.
All linear dimensions are in millimeters.
This drawing is subject to change without notice.
Body dimensions do not include mold flash or protrusion not to exceed 0,15.
Falls within JEDEC MO-150
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
MECHANICAL DATA
MTSS001C – JANUARY 1995 – REVISED FEBRUARY 1999
PW (R-PDSO-G**)
PLASTIC SMALL-OUTLINE PACKAGE
14 PINS SHOWN
0,30
0,19
0,65
14
0,10 M
8
0,15 NOM
4,50
4,30
6,60
6,20
Gage Plane
0,25
1
7
0°– 8°
A
0,75
0,50
Seating Plane
0,15
0,05
1,20 MAX
PINS **
0,10
8
14
16
20
24
28
A MAX
3,10
5,10
5,10
6,60
7,90
9,80
A MIN
2,90
4,90
4,90
6,40
7,70
9,60
DIM
4040064/F 01/97
NOTES: A.
B.
C.
D.
All linear dimensions are in millimeters.
This drawing is subject to change without notice.
Body dimensions do not include mold flash or protrusion not to exceed 0,15.
Falls within JEDEC MO-153
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements,
improvements, and other changes to its products and services at any time and to discontinue any product or service without notice.
Customers should obtain the latest relevant information before placing orders and should verify that such information is current and
complete. All products are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.
TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s
standard warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this
warranty. Except where mandated by government requirements, testing of all parameters of each product is not necessarily
performed.
TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and
applications using TI components. To minimize the risks associated with customer products and applications, customers should
provide adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask
work right, or other TI intellectual property right relating to any combination, machine, or process in which TI products or services
are used. Information published by TI regarding third-party products or services does not constitute a license from TI to use such
products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under
the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of information in TI data books or data sheets is permissible only if reproduction is without alteration and is
accompanied by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an
unfair and deceptive business practice. TI is not responsible or liable for such altered documentation.
Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service
voids all express and any implied warranties for the associated TI product or service and is an unfair and deceptive business
practice. TI is not responsible or liable for any such statements.
TI products are not authorized for use in safety-critical applications (such as life support) where a failure of the TI product would
reasonably be expected to cause severe personal injury or death, unless officers of the parties have executed an agreement
specifically governing such use. Buyers represent that they have all necessary expertise in the safety and regulatory ramifications
of their applications, and acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related
requirements concerning their products and any use of TI products in such safety-critical applications, notwithstanding any
applications-related information or support that may be provided by TI. Further, Buyers must fully indemnify TI and its
representatives against any damages arising out of the use of TI products in such safety-critical applications.
TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products are
specifically designated by TI as military-grade or "enhanced plastic." Only products designated by TI as military-grade meet military
specifications. Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is
solely at the Buyer's risk, and that they are solely responsible for compliance with all legal and regulatory requirements in
connection with such use.
TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products
are designated by TI as compliant with ISO/TS 16949 requirements. Buyers acknowledge and agree that, if they use any
non-designated products in automotive applications, TI will not be responsible for any failure to meet such requirements.
Following are URLs where you can obtain information on other Texas Instruments products and application solutions:
Products
Applications
Amplifiers
amplifier.ti.com
Audio
www.ti.com/audio
Data Converters
dataconverter.ti.com
Automotive
www.ti.com/automotive
DSP
dsp.ti.com
Broadband
www.ti.com/broadband
Interface
interface.ti.com
Digital Control
www.ti.com/digitalcontrol
Logic
logic.ti.com
Military
www.ti.com/military
Power Mgmt
power.ti.com
Optical Networking
www.ti.com/opticalnetwork
Microcontrollers
microcontroller.ti.com
Security
www.ti.com/security
RFID
www.ti-rfid.com
Telephony
www.ti.com/telephony
Low Power
Wireless
www.ti.com/lpw
Video & Imaging
www.ti.com/video
Wireless
www.ti.com/wireless
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2007, Texas Instruments Incorporated