MOTOROLA MC68SZ328

Freescale Semiconductor, Inc.
MC68SZ328P/D
Rev. 2, 11/2001
Freescale Semiconductor, Inc...
MC68SZ328
MC68SZ328 (DragonBall™ Super VZ)
Integrated Portable System Processor
Product Brief
The DragonBall series of microprocessors is specifically designed for advanced information appliances
and messaging applications including PDAs, smart phones, web appliances, and next-generation wireless
communicators. To meet these market needs, Motorola continues to build on the popularity of the
DragonBall series with the introduction of the DragonBall Super VZ.
The DragonBall Super VZ is the fourth generation in the DragonBall series of products. DragonBall
Super VZ is designed to save system and software designers’ time by reducing programming steps with
increased software re-use, to decrease the overall system cost with additional on-chip peripherals, and to
provide an increase in performance.
The major enhancements the new DragonBall Super VZ provides compared to previous versions of
DragonBall processors include:
•
Improved system speed
•
TFT color LCD support
•
A/D converter (ADC) with touch panel control
•
MMC/SD and Memory Stick™ host controllers
•
DMA controller
•
Embedded SRAM
•
USB device controller
•
I2C interface
All these features combine to make the DragonBall Super VZ the microprocessor of choice among system
designers. Its functionality and glue logic are optimally connected, timed with the same clock, fully tested,
and uniformly documented. The primary package is a 196-pin MAP BGA designed to occupy the smallest
possible footprint on your board.
This document contains information on a product under development. Motorola
reserves the right to change or discontinue this product without notice.
© Motorola, Inc., 2001. All rights reserved.
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Block Diagram
With several generations of handheld computer processors, the DragonBall series of microprocessors
provides designers of handheld portable products with:
•
Just the right performance.
•
Just the right integration.
•
Just the right battery life.
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The DragonBall series gives manufacturers and design engineers the ability to create exceptional products
that take consumers where they want to go—with mobility, connectivity, scalability, and enhanced
freedom.
1
Block Diagram
Figure 1 is a simplified functional block diagram of the MC68SZ328.
System Control
Power
Control
ICEM
Bootstrap
CGM
(DPLLx2)
Standard
System I/O
GPIO
PWM 1 & 2
Connectivity
MC68SZ328
MMC/SD
CPU Complex
Timer 1 & 2
FLX68000
RTC
MSHC
CSPI
WD
UART 1
(IrDA1.0)
UART 2
(IrDA1.0)
Interrupt
Controller
DMAC
eSRAM
(100K)
IP/68KLB
Gasket
Bus
Control
Human
Interface
ASP
USB Device
I2C
Chip-Select
Module
Inherited from MC68VZ328
DRAMC
EDO/SDRAM
LCDC
New with MC68SZ328
Figure 1. MC68SZ328 Functional Block Diagram
2
MC68SZ328 Product Brief
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Features
2
Features
The MC68SZ328 boasts a robust array of features that support a wide variety of applications. The features
of the MC68SZ328 include the following:
•
Static FLX68000 CPU—identical to MC68EC000 microprocessor
— Full compatibility with MC68000 and MC68EC000
— 32-bit internal address bus and 16-bit data bus
— Static design allows processor clock to be stopped for power saving
— 66.32 MHz processor clock
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— External M68000 bus interface with selectable bus sizing for 8-bit and 16-bit data ports
•
Clock generation module (CGM) and power control module
— Digital PLLs (phase-locked loops) for all internal clock generation
— Dual crystal inputs:
– 32.768 kHz for DMA clock, CPU clock, system clock, LCD clock, and optionally USB
clock generation
– Separate crystal input for USB clock generation
— Support for three power modes for different power consumption needs: normal, doze, and sleep
— Programmable processor clock frequency from DC to 66.32 MHz for different bandwidth
requirements
•
Chip-select module
— 12 chip-select signals: 10 general-purpose, programmable chip-select signals for external
devices with programmable wait state and base address; 1 signal to select eSRAM; 1 signal for
the emulation module.
— Up to 32 Mbyte per chip-select (with a total of 4 Gbyte programmable space for address
mapping).
— Each chip-select can be configured to address an 8-bit or 16-bit space. Both 8-bit and 16-bit
contiguous address memory devices can be mixed on a 16-bit data bus system.
— Glueless interface to SRAM, EDO DRAM, SDRAM, EPROM, and flash memory.
•
DRAM controller (DRAMC)
— Two chip-select signals for supporting either SDRAM or EDO DRAM (self-refresh type only).
— Each chip-select supports four banks of single data rate 64 Mbit, 128 Mbit, and 256 Mbit
SDRAM with up to four banks active simultaneously.
— Support for 4 Mbit, 16 Mbit, and 64 Mbit self-refresh-type EDO DRAM with 8, 9, 10, and 11
column addresses.
— Configurable row cycle delay (tRC), row precharge delay (tRP), row-to-column delay (tRCD),
and column-to-data delay (CAS latency).
— Programmable refresh rate.
— Data retention capability during normal system reset.
— Support for power-down mode and self-refresh mode for SDRAM power saving.
— Support for self-refresh mode for EDO DRAM power saving.
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Features
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Features
•
Embedded SRAM (eSRAM)
— 100K (102,400 bytes) general-purpose internal SRAM
•
Direct memory access controller (DMAC)
— Provides two memory-to-memory channels and four I/O-to-memory or memory-to-I/O
channels.
— Supports 8-bit and 16-bit FIFO and memory port size for data transfer.
— Supports modules shown in Table 1.
— Provides data transfer complete and error (burst time-out or request-out) interrupts to interrupt
controller. DMA burst length is configurable for each channel.
— Provides bus utilization control for memory channels.
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— Generates DMA burst time-out error for both memory and I/O channels to terminate DMA
cycle when the burst cannot be completed in a programmed timing period.
— Generates DMA request time-out error for I/O channels to interrupt 68K core when a DMA
request is not expected during a programmed timing period.
— Supports repeat data transfer function.
— Supports block transfer function to speed up display functions such as image block movement
in LCD display, retrieval of pre-store image pattern, and window effect.
— Provides two external DMA request pins for external devices to initiate data transfer in memory
channels 0 and 1, respectively.
Table 1. Modules with DMA Support
•
Module
DMA Capability
CSPI
Yes
UART 1 and 2
Yes
USB
Yes
MMC/SD
Yes
MSHC
Yes
ASP
Yes (enhanced ADC)
I2C
No
PWM 1 and 2
No
Timer 1 and 2
No
RTC
No
Bootstrap
No
LCD controller (LCDC)
— Support for single-screen (non-split), color or monochrome LCD panels and self-refresh-type
LCD panels
— Panel sizes and summary of color and monochrome support are shown in Table 2 on page 5 and
Table 3 on page 6
4
MC68SZ328 Product Brief
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Features
— Support for 4 bpp (bits per pixel) and 8 bpp for passive color panels and support for 4 bpp,
8 bpp, 12 bpp, and 16 bpp for TFT panels
– Up to 256 colors from a palette of 4096 colors for 8 bpp displays
– Up to 4096 colors for 12 bpp displays
– True 64K colors for 16 bpp displays
— 16 simultaneous grayscale levels from a palette of 16 for monochrome displays
— Standard panel interface for common LCD drivers; panel interface of 16-bit, 8-bit, 4-bit, 2-bit,
and 1-bit wide LCD panel data bus for monochrome or color panels
— Glueless interface to passive and active color panel (TFT); direct interface to Sharp® 320 × 240
HR-TFT panel
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— Use of system memory and embedded SRAM for display memory
— Hardware blinking cursor programmable at a maximum 63 × 63 pixels; support for logical
operation between color hardware cursor and background
— Hardware panning (soft horizontal scrolling)
— Hardware assisted landscape and portrait rotation
— Picture enlargement mode that supports pixel doubling function
— 8-bit pulse-width modulator for software contrast control
l
Table 2. External Memory Used for Display Memory
Panel
Type
Bits/
Pixel
Panel Interface
(Bits)
Number of Grayscale
Levels or Colors
Max. Standard Panel
Size Supported (Pixels)1
Monochrome
1
1, 2, 4, 8
Black and white
640 x 480
2
1, 2, 4, 8
4
640 x 480
4
1, 2, 4, 8
16
640 x 480
CSTN
4, 8
8
16, 256
640 x 480
TFT
4, 8
16
16, 256
640 x 480
12, 16
12,16
4096, 64K
640 x 480
1.
MOTOROLA
The actual maximum panel size is constrained by system bandwidth use.
Features
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Features
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Table 3. eSRAM Used for Display Memory
Panel
Type
Bits/
Pixel
Panel Interface
(Bits)
Number of Grayscale
Levels or Colors
Max. Standard Panel
Size Supported (Pixels)1
Monochrome
1
1, 2, 4, 8
Black and white
640 x 480
2
1, 2, 4, 8
4
640 x 480
4
1, 2, 4, 8
16
320 x 240 or 240 x 320
CSTN
4, 8
8
16, 256
320 x 240 or 240 x 320
TFT
4, 8
16
16, 256
320 x 240 or 240 x 320
12, 16
12, 16
4096, 64K
240 x 160 or 160 x 240
1.
•
The actual maximum panel size is constrained by the size of eSRAM.
Analog signal processing (ASP) module
— ADC (16-bit resolution, 12-bit accuracy) with 3 inputs for touch panel and low voltage detect
— Enhanced ADC (16-bit resolution, 12-bit accuracy) for use as second ADC with DMA support
— Embedded touch panel circuitry
— Pen ADC that supports auto data sampling at a configured sample rate
— Interrupt-based operation with 12 × 16 FIFO for pen ADC sample data and two 8 × 16 FIFOs
for data for enhanced ADC
— Significantly reduced software overhead for pen input applications
— Low power management
•
Timers
— Two identical 16-bit general-purpose timers/counters
— Capability to cascade timers together to operate as a single 32-bit timer
— Input capture capability with programmable trigger edge for interval measurement
— 15 ns resolution at 66.32 MHz system clock
— Timer input/output pin for event notification
•
Real-time clock and sampling timer (RTC)
— 32.768 kHz clock input
— Full clock function: second, minute, hour, and day (up to 512 days)
— One programmable alarm with interrupt capability
— Sampling timer with selectable frequency (4 Hz, 8 Hz, 16 Hz, 32 Hz, 64 Hz, 256 Hz, 512 Hz)
and interrupt capability that can be used for digitizer sampling or keyboard debouncing
•
Watchdog timer (WD)
— Programmable watchdog interrupt or reset
•
Pulse-width modulation (PWM) modules
— 8-bit (PWM 1) and 16-bit (PWM 2) resolution
— 5-byte FIFO in 8-bit PWM 1 provides more flexibility on performance
6
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Features
— Capability to generate high quality sound, tone, or melody
•
Interrupt controller
— All interrupts are maskable.
— Interrupt level of all internal modules is configurable.
— Four dedicated external interrupt IRQ signals (defined interrupt level; programmable edge,
level, and polarity).
•
General-purpose I/O (GPIO) ports
— 93 total I/O ports in 12 groups with interrupt capability, all multiplexed with peripheral
functions.
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— All ports are specially designed with dedicated internal pull-up and pull-down resistors.
•
Multimedia card and secure digital (MMC/SD) host controller
— Compatible with the MMC system specification version 2.2
— Compatible with the SD Memory Card specification 1.0
— Ability to achieve maximum data rate with up to 10 cards; only 1 SD card is allowed
— Password protection of cards
— Multi-SD function support
— Error auto-detection for Response CRC and time-out and Access CRC and time-out errors
— Built-in 7 and 16 CRC generation and checking for command and data
— Built-in programmable frequency counter for MMC/SD host controller bus
— Maskable hardware interrupt for internal status and FIFO status indicator
— 16-bit internal data operation, 8 × 16-bit FIFO, and DMA interface
— Automatic operation pause when internal FIFO full, allowing flexible packet transaction for
dynamic DMA transfer
— Built-in 3-bit prescaler and 3-bit bus clock divider to maximize the performance of data
transaction between memory card and host
•
Memory Stick host controller (MSHC)
— Built-in 8-byte (4-word) FIFO buffer for transmit and receive
— Built-in CRC circuit
— Support for internal or external serial clock source
— Built-in Serial Clock Divider: maximum 33.16 MHz serial data transfer rate
— DMA supported; DMA request condition is selectable based upon FIFO status
— Automatic command execution when an interrupt from the Memory Stick is detected (can be
turned on/off)
— RDY time-out period can be set by the number of serial clock cycles
— Interrupt can also be output to the core when a time out occurs
— Two built-in general-purpose input pins for detecting Memory Stick insertion/extraction
— 16-bit host bus access (byte access not supported)
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Features
•
Universal asynchronous receiver/transmitters (UARTs)
— Two identical UARTs with interrupt-based operation
— Support for serial data transmit/receive operation: 7 or 8 data bits, 1 or 2 stop bits,
programmable parity (even, odd, or none)
— Programmable standard baud rates up to 460.8 kbps
— Receive FIFO size is 32 bytes; transmit FIFO size is 32 bytes
— Both UARTs IrDA 1.0 ready
— Maximum non-standard baud rate of 4.14 Mbps
— Flexible DMA burst access to both UART 1 and UART 2 FIFO architectures
•
Configurable serial peripheral interface (CSPI)
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— Master/slave configurable
— 8 × 16 data-in FIFO and 8 × 16 data-out FIFO
— Flow control signals incorporated to enable fast data communication
•
Reset module
— Provides stable system power-on reset and normal reset
•
Bootstrap mode function
— Allows user to initialize system and download programs or data to system memory through
either UART
— Accepts execution command to run program stored in system memory
— Provides a 32-byte-long instruction buffer for 68000 instruction storage and execution
•
Universal Serial Bus (USB) device
— Compliant with Universal Serial Bus Specification revision 1.1.
— Endpoint configurations are as shown in Table 4 on page 9. Five pipes are available for
mapping.
– Endpoint 0 is required by the USB specification.
– Endpoints 1, 2, 3, and 4 may be configured as bulk or interrupt pipes (IN or OUT).
— A frame match interrupt feature is supported to notify the user when a specific USB frame
occurs. For DMA access, the maximum packet size for each endpoint is restricted by the FIFO
size of the endpoint.
— Four bulk/interrupt pipes are supported for 12 Mbps data transfer. The packet sizes are limited
to 8, 16, 32, or 64 bytes, and the maximum packet size depends on the FIFO size of endpoint.
— No power drawn from the USB bus.
— Remote wake-up feature is supported via a register bit.
— Complete FIFO interrupts are provided (full, empty, error, high, low).
— End-of-frame and start-of-frame interrupt support.
— Full-speed (12 MHz) operation.
— Intelligence related to packet retries and data framing is built into the FIFO controller.
8
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Features
Table 4. Endpoint Configurations
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•
Endpoint
Direction
Physical FIFO Size
(Bytes)
Endpoint
Configuration
Maximum
Packet Size
0
IN and OUT
32
Control
16
1
IN or OUT
16
Bulk or interrupt
16
2
IN or OUT
16
Bulk or interrupt
16
3
IN or OUT
128
Bulk or interrupt
64
4
IN or OUT
128
Bulk or interrupt
64
Inter-IC (I2C) bus module
— Compliant with Philips I2C-bus standard (support for Standard-mode and Fast-mode)
— Support for 7-bit address
— Support for 3.0 V devices
— Multiple-master operation
— Software-programmable for 1 of 64 different serial clock frequencies
— Software-selectable acknowledge bit
— Interrupt-driven, byte-by-byte data transfer
— Arbitration-lost interrupt with automatic mode switching from master to slave
— Calling address identification interrupt
— Start and stop signal generation and detection
— Repeated START signal generation
— Acknowledge bit generation and detection
— Bus-busy detection
•
In-circuit emulation module (ICEM)
— Dedicated memory space for emulator debug monitor with chip-select
— Dedicated interrupt (interrupt level 7) for in-circuit emulation
— One address-signal comparator and one control-signal comparator, with masking to support
single or multiple hardware execution breakpoints
— One breakpoint instruction insertion unit
•
Operating system frequency
— Up to 66.32 MHz
•
Operating voltages
— Core operates at 1.8 V
— Supply voltage: 2.7 V to 3.3 V
•
Package type
— 196-pin MAP BGA
— Size: 12 mm × 12 mm
— Pitch size: 0.8 mm
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DragonBall Series Comparison
3
DragonBall Series Comparison
The DragonBall Super VZ marks the fourth generation in the DragonBall series. Table 5 compares the new
processor with previous generations. The shaded cells indicate the features that are available for the first
time on the MC68SZ328.
Table 5. DragonBall Series Comparison
Feature
DragonBall
DragonBall EZ
DragonBall VZ
DragonBall Super VZ
68EC000
68EC000
FLX68000
FLX68000
Up to 4 gray
(1024 x 512)
Up to 16 gray
(320 x 240),
2 gray
(640 x 512)
Up to 16 gray
(640 x 512)
Up to 16 gray for monochrome
Up to 256 colors for passive
Up to 64K (16-bit) colors for
active TFT
16
8 (external),
1 (EMUCS)
8 (external),
1 (EMUCS)
10 (external), 1 (EMUCS),
1 (internal SRAM)
Not provided
Provided
Provided
(supports EDO
DRAM and
SDRAM)
Provided
(supports EDO DRAM and
SDRAM)
PLL and power
control
Provided
Provided
Provided
Provided
(digital PLL)
Interrupt controller
Provided
Provided
Provided
Provided
Timers
2
1
2
2
RTC
1
Enhanced
(with sampling
timer)
Enhanced
(with sampling
timer)
Enhanced
(with sampling timer)
SPI 1
Master (SPIM)
Master
Master/slave
Master/slave
SPI 2
Slave (SPIS)
Not provided
Master
Not provided
1
1
2
2
16-bit PWM
Provided
Not provided
Provided
Provided
8-bit PWM
Not provided
Provided
Provided
Provided
ICEM
Not provided
Provided
Provided
Provided
Bootstrap
Not provided
Provided
Provided
Provided
GPIO
77
54
76
93
ASP
Not provided
Not provided
Not provided
Provided
(with touch panel control
circuitry)
MMC/SD host
controller
Not provided
Not provided
Not provided
Provided
Memory Stick host
controller
Not provided
Not provided
Not provided
Provided
DMA
Not provided
Not provided
Not provided
Provided
CPU
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LCD controller
Chip-selects
DRAM controller
UART (with
infrared interface)
10
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DragonBall Series Comparison
Table 5. DragonBall Series Comparison (Continued)
Feature
DragonBall
DragonBall EZ
DragonBall VZ
DragonBall Super VZ
Embedded SRAM
Not provided
Not provided
Not provided
100 Kbyte
USB Device
Not provided
Not provided
Not provided
Provided
Not provided
Not provided
Not provided
Provided
Up to
16.58 MHz
Up to 16.58 MHz
and 20 MHz
Up to 33.16 MHz
Up to 66.32 MHz
Voltage
3.0 V to 3.6 V
4.5 V to 5.5 V
3.0 V to 3.6 V
2.7 V to 3.3 V
2.7 V to 3.3 V
Packages
144-pin TQFP
100-pin TQFP,
144-pin BGA
144-pin TQFP,
144-pin
MAP BGA
196-pin MAP BGA
2
I C
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Speed
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DragonBall Series Comparison
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limitation consequential or incidental damages. “Typical” parameters which may be provided in Motorola data sheets and/or
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© Motorola, Inc. 2001.
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MC68SZ328P/D