SCLS307B– JANUARY 1996 – REVISED JANUARY 2003 D D D D D D D D D SN54HC377 . . . J OR W PACKAGE SN74HC377 . . . DW, N, OR NS PACKAGE (TOP VIEW) Wide Operating Voltage Range of 2 V to 6 V Outputs Can Drive Up To 10 LSTTL Loads Low Power Consumption, 80-µA Max ICC Typical tpd = 12 ns ±4-mA Output Drive at 5 V Low Input Current of 1 µA Max Eight Flip-Flops With Single-Rail Outputs Clock Enable Latched to Avoid False Clocking Applications Include: – Buffer/Storage Registers – Shift Registers – Pattern Generators CLKEN 1Q 1D 2D 2Q 3Q 3D 4D 4Q GND 1 20 2 19 3 18 4 17 5 16 6 15 7 14 8 13 9 12 10 11 VCC 8Q 8D 7D 7Q 6Q 6D 5D 5Q CLK SN54HC377 . . . FK PACKAGE (TOP VIEW) 1D 1Q CLKEN VCC 8Q description/ordering information These devices are positive-edge-triggered octal D-type flip-flops with an enable input. The ’HC377 devices are similar to the ’HC273 devices, but feature a latched clock-enable (CLKEN) input instead of a common clear. 2D 2Q 3Q 3D 4D 3 2 1 20 19 18 5 17 6 16 7 15 8 14 9 10 11 12 13 8D 7D 7Q 6Q 6D 4Q GND CLK 5Q 5D Information at the data (D) inputs meeting the setup time requirements is transferred to the Q outputs on the positive-going edge of the clock (CLK) pulse, if CLKEN is low. Clock triggering occurs at a particular voltage level and is not directly related to the transition time of the positive-going pulse. When CLK is at either the high or low level, the D input has no effect at the output. These devices are designed to prevent false clocking by transitions at CLKEN. 4 ORDERING INFORMATION PDIP – N –40°C 40°C to 85°C –55°C 55 C to 125 125°C C ORDERABLE PART NUMBER PACKAGE† TA TOP-SIDE MARKING Tube SN74HC377N Tube SN74HC377DW Tape and reel SN74HC377DWR SOP – NS Tape and reel SN74HC377NSR HC377 CDIP – J Tube SNJ54HC377J SNJ54HC377J CFP – W Tube SNJ54HC377W SNJ54HC377W SOIC – DW SN74HC377N HC377 LCCC – FK Tube SNJ54HC377FK SNJ54HC377FK † Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at www.ti.com/sc/package. Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. Copyright 2003, Texas Instruments Incorporated !" # $%&" !# '%()$!" *!"&+ *%$"# $ " #'&$$!"# '& ",& "& # &-!# #"% &"# #"!*!* .!!"/+ *%$" '$&##0 *&# " &$&##!)/ $)%*& "&#"0 !)) 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'!! &"&#+ POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 1 SCLS307B– JANUARY 1996 – REVISED JANUARY 2003 FUNCTION TABLE (each flip-flop) INPUTS CLKEN CLK D OUTPUT Q H X X Q0 L ↑ H H L ↑ L L X L X Q0 logic diagram (positive logic) CLKEN CLK 1 11 C1 1D 3 C1 2D 4 3D 4D 13 14 7D 8D 2 16 1D C1 18 15 1D C1 17 12 1D C1 6D 9 1D C1 5D 6 1D C1 8 5 1D C1 7 2 1D 1D POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 19 1Q 2Q 3Q 4Q 5Q 6Q 7Q 8Q SCLS307B– JANUARY 1996 – REVISED JANUARY 2003 absolute maximum ratings over operating free-air temperature range (unless otherwise noted)† Supply voltage range, VCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.5 V to 7 V Input clamp current, IIK (VI < 0 or VI > VCC) (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±20 mA Output clamp current, IOK (VO < 0 or VO > VCC) (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±20 mA Continuous output current, IO (VO = 0 to VCC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±25 mA Continuous current through VCC or GND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±50 mA Package thermal impedance, θJA (see Note 2): DW package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 58°C/W N package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 69°C/W NS package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 60°C/W Storage temperature range, Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –65°C to 150°C † Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. NOTES: 1. The input and output voltage ratings may be exceeded if the input and output current ratings are observed. 2. The package thermal impedance is calculated in accordance with JESD 51-7. recommended operating conditions (see Note 3) SN54HC377 VCC VIH Supply voltage High-level High level in input ut voltage VCC = 2 V VCC = 4.5 V VCC = 6 V VCC = 2 V VIL VI VO ∆t/∆v Low-level Low level in input ut voltage MIN NOM MAX 2 5 6 MIN NOM MAX 2 5 6 1.5 1.5 3.15 3.15 4.2 4.2 VCC = 4.5 V VCC = 6 V Input voltage 0 Output voltage 0 Input In ut transition rise/fall time SN74HC377 VCC = 2 V VCC = 4.5 V VCC = 6 V 0.5 1.35 1.35 1.8 1.8 0 0 V V 0.5 VCC VCC UNIT VCC VCC 1000 1000 500 500 400 400 V V V ns TA Operating free-air temperature –55 125 –40 85 °C NOTE 3: All unused inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report, Implications of Slow or Floating CMOS Inputs, literature number SCBA004. POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 3 SCLS307B– JANUARY 1996 – REVISED JANUARY 2003 electrical characteristics over recommended operating free-air temperature range (unless otherwise noted) PARAMETER TEST CONDITIONS IOH = –20 20 µA VOH VI = VIH or VIL IOH = –4 mA IOH = –5.2 mA IOL = 20 µA VOL VI = VIH or VIL IOL = 4 mA IOL = 5.2 mA II ICC VI = VCC or 0 VI = VCC or 0, IO = 0 VCC MIN TA = 25°C TYP MAX MIN MAX SN74HC377 MIN 2V 1.9 1.998 1.9 1.9 4.5 V 4.4 4.499 4.4 4.4 6V 5.9 5.999 5.9 5.9 4.5 V 3.98 4.3 3.7 3.84 6V 5.48 5.8 5.2 MAX UNIT V 5.34 2V 0.002 0.1 0.1 0.1 4.5 V 0.001 0.1 0.1 0.1 6V 0.001 0.1 0.1 0.1 4.5 V 0.17 0.26 0.4 0.33 6V 0.15 0.26 0.4 0.33 6V ±0.1 ±100 ±1000 ±1000 nA 8 160 80 µA 3 10 10 10 pF 6V Ci SN54HC377 2 V to 6 V V timing requirements over recommended operating free-air temperature range (unless otherwise noted) VCC fclock tw Clock frequency Pulse duration, CLK high or low D tsu Set p time before CLK↑ Setup CLKEN high or low th 4 Hold time after CLK↑ CLKEN inactive or active,, data POST OFFICE BOX 655303 TA = 25°C MIN MAX SN54HC377 MIN MAX SN74HC377 MIN MAX 2V 5 3 4 4.5 V 25 16 20 6V 29 19 23 2V 100 150 125 4.5 V 20 30 25 6V 17 25 21 2V 100 150 125 4.5 V 20 30 25 6V 17 25 21 2V 100 150 125 4.5 V 20 30 25 6V 17 25 21 2V 5 5 5 4.5 V 5 5 5 6V 5 5 5 • DALLAS, TEXAS 75265 UNIT MHz ns ns ns SCLS307B– JANUARY 1996 – REVISED JANUARY 2003 switching characteristics over recommended operating free-air temperature range, CL = 50 pF (unless otherwise noted) (see Figure 1) PARAMETER FROM (INPUT) TO (OUTPUT) fmax tpd d tt CLK Any Any y VCC MIN TA = 25°C TYP MAX SN54HC377 MIN MAX SN74HC377 MIN 2V 5 11 3 4 4.5 V 25 54 16 20 6V 29 64 19 23 MAX UNIT MHz 2V 56 160 240 200 4.5 V 15 32 48 40 6V 12 27 41 34 2V 38 75 110 95 4.5 V 8 15 22 19 6V 6 13 19 16 ns ns operating characteristics, TA = 25°C PARAMETER Cpd TEST CONDITIONS Power dissipation capacitance per flip-flop POST OFFICE BOX 655303 No load • DALLAS, TEXAS 75265 TYP 30 UNIT pF 5 SCLS307B– JANUARY 1996 – REVISED JANUARY 2003 PARAMETER MEASUREMENT INFORMATION From Output Under Test VCC High-Level Pulse Test Point 50% 50% 0V tw CL = 50 pF (see Note A) VCC Low-Level Pulse 50% 50% 0V LOAD CIRCUIT VOLTAGE WAVEFORMS PULSE DURATIONS Input VCC 50% 50% 0V tPLH Reference Input VCC 50% In-Phase Output 0V tsu Data Input 50% 10% 90% tr tPHL VCC 50% 10% 0 V 90% 90% tr th 90% 50% 10% tPHL Out-of-Phase Output 90% VOLTAGE WAVEFORMS SETUP AND HOLD AND INPUT RISE AND FALL TIMES tPLH 50% 10% tf tf VOH 50% 10% VOL tf 50% 10% 90% VOH VOL tr VOLTAGE WAVEFORMS PROPAGATION DELAY AND OUTPUT TRANSITION TIMES NOTES: A. CL includes probe and test-fixture capacitance. B. Phase relationships between waveforms were chosen arbitrarily. All input pulses are supplied by generators having the following characteristics: PRR ≤ 1 MHz, ZO = 50 Ω, tr = 6 ns, tf = 6 ns. C. For clock inputs, fmax is measured when the input duty cycle is 50%. D. The outputs are measured one at a time with one input transition per measurement. E. tPLH and tPHL are the same as tpd. Figure 1. Load Circuit and Voltage Waveforms 6 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 PACKAGE OPTION ADDENDUM www.ti.com 29-Jun-2006 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Eco Plan (2) Qty 5962-87807012A ACTIVE LCCC FK 20 1 TBD 5962-8780701RA ACTIVE CDIP J 20 1 TBD Lead/Ball Finish MSL Peak Temp (3) POST-PLATE N / A for Pkg Type A42 SNPB N / A for Pkg Type N / A for Pkg Type SN54HC377J ACTIVE CDIP J 20 1 TBD A42 SNPB SN74HC377DW ACTIVE SOIC DW 20 25 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74HC377DWE4 ACTIVE SOIC DW 20 25 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74HC377DWR ACTIVE SOIC DW 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74HC377DWRE4 ACTIVE SOIC DW 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74HC377N ACTIVE PDIP N 20 20 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type SN74HC377NE4 ACTIVE PDIP N 20 20 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type SN74HC377NSR ACTIVE SO NS 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74HC377NSRE4 ACTIVE SO NS 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SNJ54HC377FK ACTIVE LCCC FK 20 1 TBD SNJ54HC377J ACTIVE CDIP J 20 1 TBD POST-PLATE N / A for Pkg Type A42 SNPB N / A for Pkg Type (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI Addendum-Page 1 PACKAGE OPTION ADDENDUM www.ti.com 29-Jun-2006 to Customer on an annual basis. Addendum-Page 2 MECHANICAL DATA MLCC006B – OCTOBER 1996 FK (S-CQCC-N**) LEADLESS CERAMIC CHIP CARRIER 28 TERMINAL SHOWN 18 17 16 15 14 13 NO. OF TERMINALS ** 12 19 11 20 10 A B MIN MAX MIN MAX 20 0.342 (8,69) 0.358 (9,09) 0.307 (7,80) 0.358 (9,09) 28 0.442 (11,23) 0.458 (11,63) 0.406 (10,31) 0.458 (11,63) 21 9 22 8 44 0.640 (16,26) 0.660 (16,76) 0.495 (12,58) 0.560 (14,22) 23 7 52 0.739 (18,78) 0.761 (19,32) 0.495 (12,58) 0.560 (14,22) 24 6 68 0.938 (23,83) 0.962 (24,43) 0.850 (21,6) 0.858 (21,8) 84 1.141 (28,99) 1.165 (29,59) 1.047 (26,6) 1.063 (27,0) B SQ A SQ 25 5 26 27 28 1 2 3 4 0.080 (2,03) 0.064 (1,63) 0.020 (0,51) 0.010 (0,25) 0.020 (0,51) 0.010 (0,25) 0.055 (1,40) 0.045 (1,14) 0.045 (1,14) 0.035 (0,89) 0.045 (1,14) 0.035 (0,89) 0.028 (0,71) 0.022 (0,54) 0.050 (1,27) 4040140 / D 10/96 NOTES: A. B. C. D. E. All linear dimensions are in inches (millimeters). This drawing is subject to change without notice. This package can be hermetically sealed with a metal lid. The terminals are gold plated. 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