ONSEMI LM337BD2TR4

LM337
1.5 A, Adjustable Output,
Negative Voltage Regulator
The LM337 is an adjustable 3−terminal negative voltage regulator
capable of supplying in excess of 1.5 A over an output voltage range of
−1.2 V to − 37 V. This voltage regulator is exceptionally easy to use
and requires only two external resistors to set the output voltage.
Further, it employs internal current limiting, thermal shutdown and
safe area compensation, making it essentially blow−out proof.
The LM337 serves a wide variety of applications including local, on
card regulation. This device can also be used to make a programmable
output regulator, or by connecting a fixed resistor between the
adjustment and output, the LM337 can be used as a precision current
regulator.
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THREE−TERMINAL
ADJUSTABLE NEGATIVE
VOLTAGE REGULATOR
MARKING
DIAGRAMS
Features
•
•
•
•
•
•
•
•
•
Output Current in Excess of 1.5 A
Output Adjustable between −1.2 V and −37 V
Internal Thermal Overload Protection
Internal Short Circuit Current Limiting Constant with Temperature
Output Transistor Safe−Area Compensation
Floating Operation for High Voltage Applications
Eliminates Stocking many Fixed Voltages
Available in Surface Mount D2PAK and Standard 3−Lead Transistor
Package
Pb−Free Packages are Available
D2PAK
D2T SUFFIX
CASE 936
1
LM
337yyyy
AWLYWWG
Heatsink surface (shown as terminal 4 in
case outline drawing) is connected to Pin 2.
Pin 1. Adjust
2. Vin
3. Vout
Standard Application
TO−220AB
T SUFFIX
CASE 221AB
IPROG
Cin*
1.0 mF
R2
+
CO**
1.0 mF
R1
120
+
Heatsink surface
connected to Pin 2.
1
IAdj
Vin
−Vin
LM
337xx
AWLYWWG
LM337
Vout
−Vout
*C in is required if regulator is located more than 4 inches from power supply filter.
* A 1.0 mF solid tantalum or 10 mF aluminum electrolytic is recommended.
xx
yyyy
A
WL
Y
WW
G
= BT, T
= BD2T, D2T
= Assembly Location
= Wafer Lot
= Year
= Work Week
= Pb−Free Package
**C O is necessary for stability. A 1.0 mF solid tantalum or 10 mF aluminum electrolytic
** is recommended.
ǒ
Ǔ
ORDERING INFORMATION
R
V out + –1.25V 1 ) 2
R1
© Semiconductor Components Industries, LLC, 2006
August, 2006 − Rev. 6
See detailed ordering and shipping information in the package
dimensions section on page 8 of this data sheet.
1
Publication Order Number:
LM337/D
LM337
MAXIMUM RATINGS (TA = +25°C, unless otherwise noted)
Symbol
Value
Unit
VI−VO
40
Vdc
PD
qJA
qJC
Internally Limited
65
5.0
W
°C/W
°C/W
PD
qJA
qJC
Internally Limited
70
5.0
W
°C/W
°C/W
Operating Junction Temperature Range
TJ
−40 to +125
°C
Storage Temperature Range
Tstg
−65 to +150
°C
Rating
Input−Output Voltage Differential
Power Dissipation
Case 221A
TA = +25°C
Thermal Resistance, Junction−to−Ambient
Thermal Resistance, Junction−to−Case
Case 936 (D2PAK)
TA = +25°C
Thermal Resistance, Junction−to−Ambient
Thermal Resistance, Junction−to−Case
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
ELECTRICAL CHARACTERISTICS (|VI−VO| = 5.0 V; IO = 0.5 A for T package; TJ = Tlow to Thigh [Note 1]; Imax and Pmax [Note 2].)
Figure
Symbol
Min
Typ
Max
Unit
Line Regulation (Note 3), TA = +25°C, 3.0 V ≤ |VI−VO| ≤ 40 V
1
Regline
−
0.01
0.04
%/V
Load Regulation (Note 3), TA = +25°C, 10 mA ≤ IO ≤ Imax
|VO| ≤ 5.0 V
|VO| ≥ 5.0 V
2
Regload
−
−
15
0.3
50
1.0
mV
% VO
Characteristics
Thermal Regulation, TA = +25°C (Note 5), 10 ms Pulse
Regtherm
−
0.003
0.04
% VO/W
3
IAdj
−
65
100
mA
1, 2
DIAdj
−
2.0
5.0
mA
Reference Voltage, TA = +25°C, 3.0 V ≤ |VI−VO| ≤ 40 V,
10 mA ≤ IO ≤ Imax, PD ≤ Pmax, TJ = Tlow to Thigh
3
Vref
−1.21
3
−1.20
−1.25
0
−1.25
−1.28
7
−1.30
V
Line Regulation (Note 3), 3.0 V ≤ |VI−VO| ≤ 40 V
1
Regline
−
0.02
0.07
%/V
Load Regulation (Note 3), 10 mA ≤ IO ≤ Imax
|VO| ≤ 5.0 V
|VO| ≥ 5.0 V
2
Regload
−
−
20
0.3
70
1.5
mV
% VO
Temperature Stability (Tlow ≤ TJ ≤ Thigh)
3
TS
−
0.6
−
% VO
Minimum Load Current to Maintain Regulation
(|VI−VO| ≤ 10 V)
(|VI−VO| ≤ 40 V)
3
ILmin
−
−
1.5
2.5
6.0
10
Maximum Output Current
|VI−VO| ≤ 15 V, PD ≤ Pmax, T Package
|VI−VO| ≤ 40 V, PD ≤ Pmax, TJ = +25°C, T Package
3
−
−
1.5
0.15
2.2
0.4
−
0.003
−
−
66
60
77
−
−
S
−
0.3
1.0
%/1.0 k
Hrs.
RqJC
−
4.0
−
°C/W
Adjustment Pin Current
Adjustment Pin Current Change, 2.5 V ≤ |VI−VO| ≤ 40 V,
10 mA ≤ IL ≤ Imax, PD ≤ Pmax, TA = +25°C
RMS Noise, % of VO, TA = +25°C, 10 Hz ≤ f ≤ 10 kHz
Imax
N
Ripple Rejection, VO = −10 V, f = 120 Hz (Note 4)
Without CAdj
CAdj = 10 mF
4
Long−Term Stability, TJ = Thigh (Note 6), TA = +25°C for
Endpoint Measurements
3
Thermal Resistance, Junction−to−Case, T Package
mA
A
RR
% VO
dB
1. Tlow to Thigh = 0° to +125°C, for LM337T, D2T. Tlow to Thigh = − 40° to +125°C, for LM337BT, BD2T.
2. Imax = 1.5 A, Pmax = 20 W
3. Load and line regulation are specified at constant junction temperature. Change in VO because of heating effects is covered under the
Thermal Regulation specification. Pulse testing with a low duty cycle is used.
4. CAdj, when used, is connected between the adjustment pin and ground.
5. Power dissipation within an IC voltage regulator produces a temperature gradient on the die, affecting individual IC components on the die.
These effects can be minimized by proper integrated circuit design and layout techniques. Thermal Regulation is the effect of these
temperature gradients on the output voltage and is expressed in percentage of output change per watt of power change in a specified time.
6. Since Long Term Stability cannot be measured on each device before shipment, this specification is an engineering estimate of average
stability from lot to lot.
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2
LM337
Representative Schematic Diagram
Adjust
60
100
2.0k
2.5k
810
21k
Vout
10k
800
15pF
25pF
220
5.0k
75
0
60k
100k
2.0k
15pF
800
18k
4.0k
6.0k
100
1.0k
2.2k
3.0k
9.6k
270
18k
240
5.0pF
100pF
30k
2.0
pF 250
20k
5.0k
8.0k
0.2
100k
600
2.9k
15
4.0k
155
2.4k
500
15
0.05
500
Vin
This device contains 39 active transistors.
R2
1%
+
Cin
1.0 mF
CO
IAdj
Vin
120
1%
R1
Adjust
*Pulse testing required.
1% Duty Cycle
is suggested.
LM337
1.0 mF
Vout
VIH
VIL
*
VEE
RL
VOH
VOL
LineRegulation(%ńV) +
|V
–V |
OL OH
x100
|V |
OH
Figure 1. Line Regulation and DIAdj/Line Test Circuit
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3
LM337
*Pulse testing required.
1% Duty Cycle is suggested.
1%
R2
CO +
Cin
1.0 mF
IAdj
R1
1.0 mF
120
*
Adjust
−VI
Vin
Vout
LM337
RL
(max
Load)
−VO (min Load)
−VO (max Load)
IL
Load Regulation (mV) = VO (min Load) − VO (max Load)
Load Regulation (% VO) =
VO (min Load) − VO (max Load)
VO (min Load)
x 100
Figure 2. Load Regulation and DIAdj/Load Test Circuit
1%
R2
VI
CO
1.0 mF
Cin
Vref
R1
Adjust
Vin
R2 =
VO
RL
IAdj
To Calculate R2:
+
1.0 mF
VO
Vref
This assumes IAdj is negligible.
LM337
Vout
120
IL
R1
−1
* Pulse testing required.
* 1% Duty Cycle is suggested.
Figure 3. Standard Test Circuit
+
R2
Cin
CAdj
1%
1.0 mF
CO
Adjust
Vin
10mF
LM337
120
R1
D1*
+
1.0 mF
RL
VO
1N4002
Vout
Vout = −1.25 V
14.3 V
4.3 V
* D1 Discharges CAdj if output is shorted to Ground.
f = 120 Hz
Figure 4. Ripple Rejection Test Circuit
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4
0.2
4.0
0
IL = 0.5 A
−0.2
I out , OUTPUT CURRENT (A)
ΔV out , OUTPUT VOLTAGE CHANGE (%)
LM337
−0.4
−0.6
−0.8
Vin = −15 V
Vout = −10 V
−1.0
IL = 1.5 A
3.0
2.0
TJ = 25°C
1.0
−1.2
−1.4
0
−50
−25
0
25
50
75
100 125
TJ, JUNCTION TEMPERATURE (°C)
150
0
10
20
30
Vin−Vout , INPUT−OUTPUT VOLTAGE DIFFERENTIAL (Vdc)
Figure 5. Load Regulation
Figure 6. Current Limit
3.0
V in − Vout , INPUT−OUTPUT VOLTAGE
DIFFERENTIAL (Vdc)
IAdj, ADJUSTMENT CURRENT (μA)
80
75
70
65
60
55
50
45
40
Vout = −5.0 V
DVO = 100 mV
2.5
IL = 1.5 A
2.0
1.0 A
500 mA
1.5
200 mA
20 mA
1.0
−50
−25
0
25
50 75
100 125
TJ, JUNCTION TEMPERATURE (°C)
150
−50
Figure 7. Adjustment Pin Current
−25
0
25
50 75
100 125
TJ, JUNCTION TEMPERATURE (°C)
150
Figure 8. Dropout Voltage
I B , QUIESCENT CURRENT (mA)
V ref , REFERENCE VOLTAGE (V)
1.27
1.26
1.25
1.24
1.8
1.6
1.4
1.2
1.0
TJ = 25°C
0.8
0.6
0.4
0.2
1.23
40
−50
−25
0
25
50 75
100 125
TJ, JUNCTION TEMPERATURE (°C)
0
150
0
Figure 9. Temperature Stability
10
20
30
40
Vin−Vout , INPUT−OUTPUT VOLTAGE DIFFERENTIAL (Vdc)
Figure 10. Minimum Operating Current
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5
LM337
100
CAdj = 10 mF
80
60
RR, RIPPLE REJECTION (dB)
RR, RIPPLE REJECTION (dB)
100
Without CAdj
40
Vin − Vout = 5.0 V
IL = 500 mA
f = 120 Hz
TJ = 25°C
20
0
0
−5.0
−10
−15
−20
−25
Vout, OUTPUT VOLTAGE (V)
−30
−35
40
0
0.01
10
Figure 12. Ripple Rejection versus Output Current
CAdj =10 mF
Z O , OUTPUT IMPEDANCE ()
Ω
Vin = −15 V
Vout = −10 V
IL = 500 mA
TJ = 25°C
60
Without CAdj
20
1.0 k
10 k
100 k
1.0 M
10−1
Without CAdj
CAdj = 10 mF
10−2
10−3
10
10 M
f, FREQUENCY (Hz)
1.0 k
10 k
f, FREQUENCY (Hz)
Figure 13. Ripple Rejection versus Frequency
Figure 14. Output Impedance
ΔV out , OUTPUT
VOLTAGE DEVIATION (V)
100
Vin = −15 V
Vout = −10 V
IL = 500 mA
CL = 1.0 mF
TJ = 25°C
100
0.8
0.6
0.4
0.2
0
Without CAdj
CAdj = 10 mF
−0.2
−0.4
I L , LOAD
CURRENT (A)
RR, RIPPLE REJECTION (dB)
ΔV in, INPUT
ΔV out , OUTPUT
VOLTAGE CHANGE (V) VOLTAGE DEVIATION (V)
0.1
1.0
IO, OUTPUT CURRENT (A)
101
80
Vout = −10 V
IL = 50 mA
TJ = 25°C
CL = 1.0 mF
0
−0.5
−1.0
Vin = −15 V
Vout = −10 V
f = 120 Hz
TJ = 25°C
20
−40
100
0
10
Without CAdj
60
Figure 11. Ripple Rejection versus Output Voltage
40
CAdj = 10 mF
80
0
10
20
30
40
100
100 k
0.6
0.4
Without CAdj
0.2
0
CAdj = 10 mF
−0.2
−0.4
−0.6
Vin = −15 V
Vout = −10 V
IL = 50 mA
TJ = 25°C
CL = 1.0 mF
0
−0.5
−1.0
−1.5
0
10
20
30
t, TIME (ms)
t, TIME (ms)
Figure 15. Line Transient Response
Figure 16. Load Transient Response
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6
1.0 M
40
LM337
APPLICATIONS INFORMATION
Basic Circuit Operation
The LM337 is a 3−terminal floating regulator. In
operation, the LM337 develops and maintains a nominal
−1.25 V reference (Vref) between its output and adjustment
terminals. This reference voltage is converted to a
programming current (IPROG) by R1 (see Figure 17), and this
constant current flows through R2 from ground.
The regulated output voltage is given by:
ǒ
degrading regulation. The ground end of R2 can be returned
near the load ground to provide remote ground sensing and
improve load regulation.
External Capacitors
A 1.0 mF tantalum input bypass capacitor (Cin) is
recommended to reduce the sensitivity to input line
impedance.
The adjustment terminal may be bypassed to ground to
improve ripple rejection. This capacitor (CAdj) prevents
ripple from being amplified as the output voltage is
increased. A 10 mF capacitor should improve ripple
rejection about 15 dB at 120 Hz in a 10 V application.
An output capacitance (CO) in the form of a 1.0 mF
tantalum or 10 mF aluminum electrolytic capacitor is
required for stability.
Ǔ
R
V out + V 1 ) 2 ) I R 2
ref
Adj
R1
Since the current into the adjustment terminal (IAdj)
represents an error term in the equation, the LM337 was
designed to control IAdj to less than 100 mA and keep it
constant. To do this, all quiescent operating current is
returned to the output terminal. This imposes the
requirement for a minimum load current. If the load current
is less than this minimum, the output voltage will rise.
Since the LM337 is a floating regulator, it is only the
voltage differential across the circuit which is important to
performance, and operation at high voltages with respect to
ground is possible.
Protection Diodes
When external capacitors are used with any IC regulator
it is sometimes necessary to add protection diodes to prevent
the capacitors from discharging through low current points
into the regulator.
Figure 18 shows the LM337 with the recommended
protection diodes for output voltages in excess of −25 V or
high capacitance values (CO > 25 mF, CAdj > 10 mF). Diode
D1 prevents CO from discharging thru the IC during an input
short circuit. Diode D2 protects against capacitor CAdj
discharging through the IC during an output short circuit.
The combination of diodes D1 and D2 prevents CAdj from
the discharging through the IC during an input short circuit.
+ Vout
R2
IPROG
IAdj
+
CO
Adjust
Vin
LM337
R1
Vref
− Vout
Vout
Vref = −1.25 V Typical
CAdj
+
Figure 17. Basic Circuit Configuration
+
CO
Cin
Adjust
R1
Load Regulation
−Vin
The LM337 is capable of providing extremely good load
regulation, but a few precautions are needed to obtain
maximum performance. For best performance, the
programming resistor (R1) should be connected as close to
the regulator as possible to minimize line drops which
effectively appear in series with the reference, thereby
Vin
LM337
JUNCTION-TO-AIR (°C/W)
R θ JA, THERMAL RESISTANCE
3.0
Free Air
Mounted
Vertically
2.0 oz. Copper
L
Minimum
Size Pad
ÎÎÎÎ
ÎÎÎÎ
ÎÎÎÎ
ÎÎÎÎ
2.5
2.0
L
40
1.5
RqJA
1.0
30
0
5.0
10
15
20
L, LENGTH OF COPPER (mm)
25
30
Figure 19. D2PAK Thermal Resistance and Maximum
Power Dissipation versus P.C.B. Copper Length
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7
PD, MAXIMUM POWER DISSIPATION (W)
3.5
50
− Vout
Figure 18. Voltage Regulator with Protection Diodes
PD(max) for TA = +50°C
60
Vout
D2
1N4002
D1
1N4002
80
70
+ Vout
+
R2
LM337
ORDERING INFORMATION
Device
Operating Temperature Range
Package
D2PAK
LM337BD2T
LM337BD2TG
D2PAK
(Pb−Free)
LM337BD2TR4
D2PAK
LM337BD2TR4G
TJ = − 40° to +125°C
D2PAK
(Pb−Free)
LM337BT
TO−220AB
LM337BTG
TO−220AB
(Pb−Free)
LM337D2T
D2PAK
LM337D2TG
D2PAK
(Pb−Free)
LM337D2TR4
D2PAK
LM337D2TR4G
Shipping†
TJ = 0° to +125°C
D2PAK
(Pb−Free)
LM337T
TO−220AB
LM337TG
TO−220AB
(Pb−Free)
50 Units / Rail
800 / Tape & Reel
50 Units / Rail
800 / Tape & Reel
50 Units / Rail
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
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8
LM337
PACKAGE DIMENSIONS
D2T SUFFIX
CASE 936−03
(D2PAK)
ISSUE B
OPTIONAL
CHAMFER
A
E
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. TAB CONTOUR OPTIONAL WITHIN DIMENSIONS
A AND K.
4. DIMENSIONS U AND V ESTABLISH A MINIMUM
MOUNTING SURFACE FOR TERMINAL 4.
5. DIMENSIONS A AND B DO NOT INCLUDE MOLD
FLASH OR GATE PROTRUSIONS. MOLD FLASH
AND GATE PROTRUSIONS NOT TO EXCEED
0.025 (0.635) MAXIMUM.
TERMINAL 4
−T
−
U
S
K
V
B
H
F
1
2
3
M
L
P
J
N
D
0.010 (0.254)
DIM
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
S
U
V
M
R
T
G
C
SOLDERING FOOTPRINT*
8.38
0.33
1.016
0.04
10.66
0.42
5.08
0.20
3.05
0.12
17.02
0.67
SCALE 3:1
mm Ǔ
ǒinches
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
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9
INCHES
MIN
MAX
0.386
0.403
0.356
0.368
0.170
0.180
0.026
0.036
0.045
0.055
0.051 REF
0.100 BSC
0.539
0.579
0.125 MAX
0.050 REF
0.000
0.010
0.088
0.102
0.018
0.026
0.058
0.078
5 _ REF
0.116 REF
0.200 MIN
0.250 MIN
MILLIMETERS
MIN
MAX
9.804 10.236
9.042
9.347
4.318
4.572
0.660
0.914
1.143
1.397
1.295 REF
2.540 BSC
13.691 14.707
3.175 MAX
1.270 REF
0.000
0.254
2.235
2.591
0.457
0.660
1.473
1.981
5 _ REF
2.946 REF
5.080 MIN
6.350 MIN
LM337
PACKAGE DIMENSIONS
TO−220, SINGLE GAUGE
T SUFFIX
CASE 221AB−01
ISSUE O
−T−
B
SEATING
PLANE
C
F
T
S
4
DIM
A
B
C
D
F
G
H
J
K
L
N
Q
R
S
T
U
V
Z
A
Q
1 2 3
U
H
K
Z
L
R
V
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION Z DEFINES A ZONE WHERE ALL
BODY AND LEAD IRREGULARITIES ARE
ALLOWED.
J
G
D
N
INCHES
MIN
MAX
0.570
0.620
0.380
0.405
0.160
0.190
0.025
0.035
0.142
0.147
0.095
0.105
0.110
0.155
0.018
0.025
0.500
0.562
0.045
0.060
0.190
0.210
0.100
0.120
0.080
0.110
0.020
0.055
0.235
0.255
0.000
0.050
0.045
−−−
−−−
0.080
MILLIMETERS
MIN
MAX
14.48
15.75
9.66
10.28
4.07
4.82
0.64
0.88
3.61
3.73
2.42
2.66
2.80
3.93
0.46
0.64
12.70
14.27
1.15
1.52
4.83
5.33
2.54
3.04
2.04
2.79
0.508
1.39
5.97
6.47
0.00
1.27
1.15
−−−
−−−
2.04
ON Semiconductor and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications
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PUBLICATION ORDERING INFORMATION
LITERATURE FULFILLMENT:
Literature Distribution Center for ON Semiconductor
P.O. Box 5163, Denver, Colorado 80217 USA
Phone: 303−675−2175 or 800−344−3860 Toll Free USA/Canada
Fax: 303−675−2176 or 800−344−3867 Toll Free USA/Canada
Email: [email protected]
N. American Technical Support: 800−282−9855 Toll Free
USA/Canada
Europe, Middle East and Africa Technical Support:
Phone: 421 33 790 2910
Japan Customer Focus Center
Phone: 81−3−5773−3850
http://onsemi.com
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ON Semiconductor Website: www.onsemi.com
Order Literature: http://www.onsemi.com/orderlit
For additional information, please contact your local
Sales Representative
LM337/D