ONSEMI MC10ELT25D

MC10ELT25, MC100ELT25
−5 VDifferential ECL to TTL
Translator
Description
Features
•
•
•
MARKING DIAGRAMS*
8
8
1
SOIC−8
D SUFFIX
CASE 751
1
8
8
2.6 ns Typical Propagation Delay
100 MHz FMAX CLK
24 mA TTL Outputs
Flow Through Pinouts
Operating Range: VCC = 4.5 V to 5.5 V with GND = 0 V;
VEE = −4.2 V to −5.7 V with GND = 0 V
Internal Input 50 KW Pulldown Resistors
Q Output will default HIGH with inputs open or < 1.3 V
Pb−Free Packages are Available
8
HLT25
ALYW
G
1
TSSOP−8
DT SUFFIX
CASE 948R
1
DFN8
MN SUFFIX
CASE 506AA
H
K
5F
2U
M
= MC10
= MC100
= MC10
= MC100
= Date Code
KLT25
ALYW
G
1
8
HT25
ALYWG
G
1
5F MG
G
•
•
•
•
•
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1
4
A
L
Y
W
G
KT25
ALYWG
G
2U MG
G
The MC10ELT/100ELT25 is a differential ECL to TTL translator.
Because ECL levels are used, a +5 V, −5.2 V (or −4.5 V) and ground
are required. The small outline 8-lead package and the single gate of
the ELT25 makes it ideal for those applications where space,
performance and low power are at a premium.
The VBB pin, an internally generated voltage supply, is available to
this device only. For single-ended input conditions, the unused
differential input is connected to VBB as a switching reference voltage.
VBB may also rebias AC coupled inputs. When used, decouple VBB
and VCC via a 0.01 mF capacitor and limit current sourcing or sinking
to 0.5 mA. When not used, VBB should be left open.
The 100 Series contains temperature compensation.
1
4
= Assembly Location
= Wafer Lot
= Year
= Work Week
= Pb−Free Package
(Note: Microdot may be in either location)
*For additional marking information, refer to
Application Note AND8002/D.
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 5 of this data sheet.
© Semiconductor Components Industries, LLC, 2006
December, 2006 − Rev. 12
1
Publication Order Number:
MC10ELT25/D
MC10ELT25, MC100ELT25
VEE
D
1
8
TTL
2
7
Table 1. PIN DESCRIPTION
VCC
Pin
Q
ECL
D
VBB
3
6
4
5
NC
GND
Figure 1. 8−Lead Pinout (Top View) and Logic
Diagram
Function
D, D
ECL Differential Inputs
Q
TTL Output
VBB
Reference Voltage Output
VCC
Positive Supply
VEE
Negative Supply
GND
Ground
NC
No Connect
EP
Exposed pad must be connected to a sufficient
thermal conduit. Electrically connect to the most
negative supply or leave floating open.
Table 2. ATTRIBUTES
Characteristics
Value
Internal Input Pulldown Resistor
75 kW
Internal Input Pullup Resistor
N/A
ESD Protection
Human Body Model
Machine Model
> 1 kV
> 400 V
Moisture Sensitivity, Indefinite Time Out of Drypack (Note 1)
SOIC−8
TSSOP−8
DFN8
Flammability Rating
Pb Pkg
Pb−Free Pkg
Level 1
Level 1
Level 1
Level 1
Level 3
Level 1
Oxygen Index: 28 to 34
UL 94 V−0 @ 0.125 in
Transistor Count
38 Devices
Meets or exceeds JEDEC Spec EIA/JESD78 IC Latchup Test
1. For additional information, see Application Note AND8003/D.
Table 3. MAXIMUM RATINGS
Symbol
Parameter
Condition 1
Condition 2
VCC
Positive Power Supply
GND = 0 V
VEE = −5.0 V
VEE
Negative Power Supply
GND = 0 V
VCC = +5.0 V
VIN
Input Voltage
GND = 0 V
IBB
VBB Sink/Source
TA
Rating
Unit
7
V
−8
V
0 to VEE
V
± 0.5
mA
Operating Temperature Range
−40 to +85
°C
Tstg
Storage Temperature Range
−65 to +150
°C
qJA
Thermal Resistance (Junction−to−Ambient)
0 lfpm
500 lfpm
SOIC−8
SOIC−8
190
130
°C/W
°C/W
qJC
Thermal Resistance (Junction−to−Case)
Standard Board
SOIC−8
41 to 44
°C/W
qJA
Thermal Resistance (Junction−to−Ambient)
0 lfpm
500 lfpm
TSSOP−8
TSSOP−8
185
140
°C/W
°C/W
qJC
Thermal Resistance (Junction−to−Case)
Standard Board
TSSOP−8
41 to 44 ± 5%
°C/W
qJA
Thermal Resistance (Junction−to−Ambient)
0 lfpm
500 lfpm
DFN8
DFN8
129
84
°C/W
°C/W
Tsol
Wave Solder
<2 to 3 sec @ 248°C
<2 to 3 sec @ 260°C
265
265
°C
Pb
Pb−Free
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
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2
MC10ELT25, MC100ELT25
Table 4. 10ELT SERIES NECL INPUT DC CHARACTERISTICS VCC = 5.0 V; VEE = −5.0 V; GND = 0 V (Note 2)
−40°C
Max
Min
Typ
85°C
Characteristic
VIH
Input HIGH Voltage (Single−Ended) (Note 3)
−1230
−890
−1130
−810
VIL
Input LOW Voltage (Single−Ended) (Note 3)
−1950
−1500
−1950
VBB
Output Voltage Reference
−1.43
−1.30
VIHCMR
Input HIGH Voltage Common Mode Range
(Differential) (Notes 3 and 4)
−2.8
0.0
IIH
Input HIGH Current
IIL
Input LOW Current
Symbol
Typ
25°C
Min
Max
Unit
−1060
−720
mV
−1480
−1950
−1445
mV
−1.35
−1.25
−1.31
−1.19
V
−2.8
0.0
−2.8
0.0
V
175
mA
255
0.5
Max
Min
Typ
175
0.5
0.3
mA
NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit
board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared
operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit
values are applied individually under normal operating conditions and not valid simultaneously.
2. Input parameters vary 1:1 with GND. VEE can vary +0.06 V to −0.5 V.
3. TTL output RL = 500 W to GND
4. VIHCMR min varies 1:1 with VEE, VIHCMR max varies 1:1 with GND.
Table 5. 100ELT SERIES NECL INPUT DC CHARACTERISTICS VCC = 5.0 V; VEE = −5.0 V; GND = 0 V (Note 5)
−40°C
Symbol
Characteristic
Min
Typ
25°C
Max
Min
Typ
85°C
Max
Min
Typ
Max
Unit
VIH
Input HIGH Voltage (Single−Ended) (Note 6)
−1165
−880
−1165
−880
−1165
−880
mV
VIL
Input LOW Voltage (Single−Ended) (Note 6)
−1810
−1475
−1810
−1475
−1810
−1475
mV
VBB
Output Voltage Reference
−1.38
−1.26
−1.38
−1.26
−1.38
−1.26
V
VIHCMR
Input HIGH Voltage Common Mode Range
(Differential) (Notes 6 and 7)
−2.8
0.0
−2.8
0.0
−2.8
0.0
V
IIH
Input HIGH Current
175
mA
IIL
Input LOW Current
255
0.5
175
0.5
0.5
mA
NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit
board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared
operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit
values are applied individually under normal operating conditions and not valid simultaneously.
5. Input parameters vary 1:1 with GND. VEE can vary +0.8 V to −0.5 V.
6. TTL output RL = 500 W to GND
7. VIHCMR min varies 1:1 with VEE, VIHCMR max varies 1:1 with GND.
Table 6. TTL OUTPUT DC CHARACTERISTICS VCC = 4.5 V to 5.5 V; TA = −40°C to +85°C
Symbol
Characteristic
Condition
VOH
Output HIGH Voltage
IOH = −3.0 mA
VOL
Output LOW Voltage
IOL = 24 mA
ICCH
Power Supply Current
ICCL
Power Supply Current
IEE
Negative Power Supply Current
IOS
Output Short Circuit Current
Min
Typ
Max
2.4
V
0.5
V
11
16
mA
13
18
mA
21
mA
−60
mA
15
−150
Unit
NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit
board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared
operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit
values are applied individually under normal operating conditions and not valid simultaneously.
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3
MC10ELT25, MC100ELT25
Table 7. AC CHARACTERISTICS VCC= 5.0 V; VEE= −5.0 V; GND= 0 V (Note 8 and Note 9)
−40°C
Symbol
Characteristic
Min
Typ
25°C
Max
Min
Typ
85°C
Max
Min
Typ
Max
100
Unit
fmax
Maximum Toggle Frequency
tPLH
Propagation Delay @ 1.5 V
1.7
3.6
1.7
3.6
1.7
3.6
ns
tPHL
Propagation Delay @ 1.5 V
2.6
4.1
2.6
4.1
2.6
4.1
ns
tJITTER
Random Clock Jitter (RMS)
35
ps
tr
tf
Output Rise/Fall Times QTTL
10% − 90%
1.9
2.3
ns
VPP
Input Swing (Note 10)
200
1000
200
MHz
1000
200
1000
mV
NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit
board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared
operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit
values are applied individually under normal operating conditions and not valid simultaneously.
8. VCC can vary ± 0.25 V.
VEE can vary +0.06 V to −0.5 V for 10ELT; VEE can vary +0.8 V to −0.5 V for 100ELT.
9. RL = 500 W to GND and CL = 20 pF to GND. Refer to Figure 2.
10. VPP(min) is the minimum input swing for which AC parameters are guaranteed. The device has a DC gain of ≈ 40.
APPLICATION
TTL RECEIVER
CHARACTERISTIC TEST
*CL includes
fixture
capacitance
CL *
RL
AC TEST LOAD
GND
Figure 2. TTL Output Loading Used for Device Evaluation
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4
MC10ELT25, MC100ELT25
ORDERING INFORMATION
Package
Shipping†
SOIC−8
98 Units / Rail
MC10ELT25DG
SOIC−8
(Pb−Free)
98 Units / Rail
MC10ELT25DR2
SOIC−8
2500 / Tape & Reel
MC10ELT25DR2G
SOIC−8
(Pb−Free)
2500 / Tape & Reel
MC10ELT25DT
TSSOP−8
100 Units / Rail
MC10ELT25DTG
TSSOP−8
(Pb−Free)
100 Units / Rail
MC10ELT25DTR2
TSSOP−8
2500 / Tape & Reel
MC10ELT25DTR2G
TSSOP−8
(Pb−Free)
2500 / Tape & Reel
MC10ELT25MNR4
DFN8
1000 / Tape & Reel
DFN8
(Pb−Free)
1000 / Tape & Reel
SOIC−8
98 Units / Rail
MC100ELT25DG
SOIC−8
(Pb−Free)
98 Units / Rail
MC100ELT25DR2
SOIC−8
2500 / Tape & Reel
MC100ELT25DR2G
SOIC−8
(Pb−Free)
2500 / Tape & Reel
MC100ELT25DT
TSSOP−8
100 Units / Rail
MC100ELT25DTG
TSSOP−8
(Pb−Free)
100 Units / Rail
MC100ELT25DTR2
TSSOP−8
2500 / Tape & Reel
MC100ELT25DTR2G
TSSOP−8
(Pb−Free)
2500 / Tape & Reel
MC100ELT25MNR4
DFN8
1000 / Tape & Reel
DFN8
(Pb−Free)
1000 / Tape & Reel
Device
MC10ELT25D
MC10ELT25MNR4G
MC100ELT25D
MC100ELT25MNR4G
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
Resource Reference of Application Notes
AN1405/D
− ECL Clock Distribution Techniques
AN1406/D
− Designing with PECL (ECL at +5.0 V)
AN1503/D
− ECLinPSt I/O SPiCE Modeling Kit
AN1504/D
− Metastability and the ECLinPS Family
AN1568/D
− Interfacing Between LVDS and ECL
AN1672/D
− The ECL Translator Guide
AND8001/D
− Odd Number Counters Design
AND8002/D
− Marking and Date Codes
AND8020/D
− Termination of ECL Logic Devices
AND8066/D
− Interfacing with ECLinPS
AND8090/D
− AC Characteristics of ECL Devices
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5
MC10ELT25, MC100ELT25
PACKAGE DIMENSIONS
SOIC−8 NB
CASE 751−07
ISSUE AH
−X−
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION A AND B DO NOT INCLUDE
MOLD PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006)
PER SIDE.
5. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.127 (0.005) TOTAL
IN EXCESS OF THE D DIMENSION AT
MAXIMUM MATERIAL CONDITION.
6. 751−01 THRU 751−06 ARE OBSOLETE. NEW
STANDARD IS 751−07.
A
8
5
S
B
1
0.25 (0.010)
M
Y
M
4
−Y−
K
G
C
N
DIM
A
B
C
D
G
H
J
K
M
N
S
X 45 _
SEATING
PLANE
−Z−
H
0.10 (0.004)
D
0.25 (0.010)
M
Z Y
S
X
M
J
S
SOLDERING FOOTPRINT*
1.52
0.060
7.0
0.275
4.0
0.155
0.6
0.024
1.270
0.050
SCALE 6:1
mm Ǔ
ǒinches
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
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6
MILLIMETERS
MIN
MAX
4.80
5.00
3.80
4.00
1.35
1.75
0.33
0.51
1.27 BSC
0.10
0.25
0.19
0.25
0.40
1.27
0_
8_
0.25
0.50
5.80
6.20
INCHES
MIN
MAX
0.189
0.197
0.150
0.157
0.053
0.069
0.013
0.020
0.050 BSC
0.004
0.010
0.007
0.010
0.016
0.050
0 _
8 _
0.010
0.020
0.228
0.244
MC10ELT25, MC100ELT25
PACKAGE DIMENSIONS
TSSOP−8
DT SUFFIX
PLASTIC TSSOP PACKAGE
CASE 948R−02
ISSUE A
8x
0.15 (0.006) T U
0.10 (0.004)
S
2X
L/2
L
8
5
1
PIN 1
IDENT
0.15 (0.006) T U
K REF
S
M
T U
V
S
0.25 (0.010)
B
−U−
4
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION A DOES NOT INCLUDE MOLD FLASH.
PROTRUSIONS OR GATE BURRS. MOLD FLASH
OR GATE BURRS SHALL NOT EXCEED 0.15
(0.006) PER SIDE.
4. DIMENSION B DOES NOT INCLUDE INTERLEAD
FLASH OR PROTRUSION. INTERLEAD FLASH OR
PROTRUSION SHALL NOT EXCEED 0.25 (0.010)
PER SIDE.
5. TERMINAL NUMBERS ARE SHOWN FOR
REFERENCE ONLY.
6. DIMENSION A AND B ARE TO BE DETERMINED
AT DATUM PLANE −W−.
S
M
A
−V−
F
DETAIL E
C
0.10 (0.004)
−T− SEATING
PLANE
D
−W−
G
DETAIL E
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7
DIM
A
B
C
D
F
G
K
L
M
MILLIMETERS
MIN
MAX
2.90
3.10
2.90
3.10
0.80
1.10
0.05
0.15
0.40
0.70
0.65 BSC
0.25
0.40
4.90 BSC
0_
6_
INCHES
MIN
MAX
0.114
0.122
0.114
0.122
0.031
0.043
0.002
0.006
0.016
0.028
0.026 BSC
0.010
0.016
0.193 BSC
0_
6_
MC10ELT25, MC100ELT25
PACKAGE DIMENSIONS
DFN8
CASE 506AA−01
ISSUE D
D
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994 .
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED
TERMINAL AND IS MEASURED BETWEEN
0.25 AND 0.30 MM FROM TERMINAL.
4. COPLANARITY APPLIES TO THE EXPOSED
PAD AS WELL AS THE TERMINALS.
A
B
PIN ONE
REFERENCE
2X
0.10 C
2X
0.10 C
ÇÇÇ
ÇÇÇ
ÇÇÇ
ÇÇÇ
TOP VIEW
0.08 C
SEATING
PLANE
MILLIMETERS
MIN
MAX
0.80
1.00
0.00
0.05
0.20 REF
0.20
0.30
2.00 BSC
1.10
1.30
2.00 BSC
0.70
0.90
0.50 BSC
0.20
−−−
0.25
0.35
A
0.10 C
8X
DIM
A
A1
A3
b
D
D2
E
E2
e
K
L
E
(A3)
SIDE VIEW
A1
C
D2
e
e/2
4
1
8X
L
E2
K
8
5
8X
b
0.10 C A B
0.05 C
NOTE 3
BOTTOM VIEW
ECLinPS is a trademark of Semiconductor Components Industries, LLC (SCILLC).
ON Semiconductor and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications
intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should
Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates,
and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death
associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal
Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
PUBLICATION ORDERING INFORMATION
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8
ON Semiconductor Website: www.onsemi.com
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For additional information, please contact your local
Sales Representative
MC10ELT25/D