TI SN65LVDS179DGK

SN65LVDS179,, SN65LVDS180
SN65LVDS050, SN65LVDS051
www.ti.com
SLLS301O – APRIL 1998 – REVISED MAY 2007
HIGH-SPEED DIFFERENTIAL LINE DRIVERS AND RECEIVERS
FEATURES
•
•
•
•
•
•
•
•
•
•
Meets or Exceeds the Requirements of ANSI
TIA/EIA-644-1995 Standard
Full-Duplex Signaling Rates up to 100 Mbps
(See Table 1)
Bus-Terminal ESD Exceeds 12 kV
Operates From a Single 3.3-V Supply
Low-Voltage Differential Signaling With
Typical Output Voltages of 350 mV and a
100-Ω Load
Propagation Delay Times
– Driver: 1.7 ns Typ
– Receiver: 3.7 ns Typ
Power Dissipation at 200 MHz
– Driver: 25 mW Typical
– Receiver: 60 mW Typical
LVTTL Input Levels Are 5-V Tolerant
Receiver Maintains High Input Impedance
With VCC < 1.5 V
Receiver Has Open-Circuit Fail Safe
DESCRIPTION
The
SN65LVDS179,
SN65LVDS180,
SN65LVDS050, and SN65LVDS051 are differential
line drivers and receivers that use low-voltage
differential signaling (LVDS) to achieve signaling
rates as high as 400 Mbps (see the Application
Information section). The TIA/EIA-644 standard
compliant electrical interface provides a minimum
differential output voltage magnitude of 247 mV into
a 100-Ω load and receipt of 50-mV signals with up to
1 V of ground potential difference between a
transmitter and receiver.
The intended application of this device and signaling
technique is for point-to-point baseband data
transmission over controlled impedance media of
approximately 100-Ω characteristic impedance. The
transmission media may be printed-circuit board
traces, backplanes, or cables. (Note: The ultimate
rate and distance of data transfer depends on the
attenuation characteristics of the media, the noise
coupling to the environment, and other application
specific characteristics).
SN65LVDS179D (Marked as DL179 or LVD179)
SN65LVDS179DGK (Marked as S79)
(TOP VIEW)
3
VCC
R
D
GND
1
8
2
7
3
6
4
5
A
B
Z
Y
5
6
D
8
2
R
7
Y
Z
A
B
SN65LVDS180D (Marked as LVDS180)
SN65LVDS180PW (Marked as LVDS180)
(TOP VIEW)
NC
R
RE
DE
D
GND
GND
1
14
2
13
3
12
4
11
5
10
6
9
7
8
VCC
VCC
A
B
Z
Y
NC
5
D
10
4
DE
1
16
2
15
3
14
4
13
5
12
6
11
7
10
8
9
VCC
1D
1Y
1Z
DE
2Z
2Y
2D
RE
12
2
R
4
13
5
12
6
11
7
10
8
9
1Z
2DE
2Z
2Y
2D
11
14
13
12
DE
10
9
2D
3
11
2
1
1R
4
RE
6
5
2R
SN65LVDS051D (Marked as LVDS051)
SN65LVDS051PW (Marked as LVDS051)
(TOP VIEW)
15
1D
1B 1
16 VCC
4
1DE
1A 2
15 1D
3
1R 3
14 1Y
1R
1DE
2R
2A
2B
GND
9
7
14
13
2
1
10
11
2D
12
2DE
6
5
2R
Y
Z
3
SN65LVDS050D (Marked as LVDS050)
SN65LVDS050PW (Marked as LVDS050)
15
(TOP VIEW)
1D
1B
1A
1R
RE
2R
2A
2B
GND
9
7
A
B
1Y
1Z
2Y
2Z
1A
1B
2A
2B
1Y
1Z
1A
1B
2Y
2Z
2A
2B
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 1998–2007, Texas Instruments Incorporated
SN65LVDS179,, SN65LVDS180
SN65LVDS050, SN65LVDS051
www.ti.com
SLLS301O – APRIL 1998 – REVISED MAY 2007
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
DESCRIPTION (CONTINUED)
These devices offer various driver, receiver, and enabling combinations in industry-standard footprints. Because
these devices are intended for use in simplex or distributed simplex bus structures, the driver enable function
does not put the differential outputs into a high-impedance state but rather disconnects the input and reduces
the quiescent power used by the device. (For these functions with a high-impedance driver output, see the
SN65LVDM series of devices.) All devices are characterized for operation from -40°C to 85°C.
Table 1. Maximum Recommended Operating Speeds
Part Number
All Buffers Active
Rx Buffer Only
Tx Buffer Only
SN65LVDS179
150 Mbps
150 Mbps
400 Mbps
SN65LVDS180
150 Mbps
150 Mbps
400 Mbps
SN65LVDS050
100 Mbps
100 Mbps
400 Mbps
SN65LVDS051
100 Mbps
100 Mbps
400 Mbps
AVAILABLE OPTIONS (1)
PACKAGE
(1)
SMALL OUTLINE
(D)
SMALL OUTLINE
(DGK)
SMALL OUTLINE
(PW)
SN65LVDS050D
—
SN65LVDS050PW
SN65LVDS051D
—
SN65LVDS051PW
SN65LVDS179D
SN65LVDS179DGK
—
SN65LVDS180D
—
SN65LVDS180PW
For the most current package and ordering information, see the Package Option Addendum at the end
of this document, or see the TI website at www.ti.com.
FUNCTION TABLES
SN65LVDS179 RECEIVER
(1)
INPUTS
OUTPUT (1)
VID = VA - VB
R
VID ≥ 50 mV
H
50 mV < VID < 50 mV
?
VID ≤ -50 mV
L
Open
H
H = high level, L = low level, ? = indeterminate
SN65LVDS179 DRIVER (1)
INPUT
(1)
2
OUTPUTS
D
Y
Z
L
L
H
H
H
L
Open
L
H
H = high level, L = low level
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SLLS301O – APRIL 1998 – REVISED MAY 2007
SN65LVDS180, SN65LVDS050, and
SN65LVDS051 RECEIVER (1)
INPUTS
(1)
OUTPUT
VID = VA - VB
RE
R
VID≥ 50 mV
L
H
50 mV < VID < 50 mV
L
?
VID≤ -50 mV
L
L
Open
L
H
X
H
Z
H = high level, L = low level, Z = high impedance, X = don't care,
? = indeterminate
SN65LVDS180, SN65LVDS050, and
SN65LVDS051 DRIVER (1)
INPUTS
(1)
OUTPUTS
D
DE
Y
Z
L
H
L
H
H
H
H
L
Open
H
L
H
X
L
Off
Off
H = high level, L = low level, Z = high impedance, X = don't care,
Off = no output
EQUIVALENT INPUT AND OUTPUT SCHEMATIC DIAGRAMS
VCC
VCC
VCC
300 kΩ
50 Ω
5Ω
10 kΩ
D or
RE
Input
Y or Z
Output
50 Ω
DE
Input
7V
300 kΩ
7V
7V
VCC
VCC
300 kΩ
300 kΩ
5Ω
A Input
R Output
B Input
7V
7V
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7V
3
SN65LVDS179,, SN65LVDS180
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SLLS301O – APRIL 1998 – REVISED MAY 2007
ABSOLUTE MAXIMUM RATINGS (1)
over operating free-air temperature range (unless otherwise noted)
UNIT
(2))
VCC (see
Supply voltage range
–0.5 V to 4 V
Voltage range:
|VOD|
D, R, DE, RE
–0.5 V to 6 V
Y, Z, A, and B
–0.5 V to 4 V
Differential output voltage:
1V
Electrostatic discharge:
Y, Z, A, B , and GND (see
(3))
CLass 3, A:12 kV, B:600 V
All
Class 3, A:7 kV, B:500 V
Continuous power dissipation
See Dissipation Rating Table
Storage temperature range
–65°C to 150°C
Lead temperature 1,6 mm (1/16 inch) from case for 10 seconds
(1)
(2)
(3)
250°C
Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating
conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
All voltage values, except differential I/O bus voltages are with respect to network ground terminal.
Tested in accordance with MIL-STD-883C Method 3015.7.
DISSIPATION RATING TABLE
(1)
PACKAGE
TA≤ 25°C
POWER RATING
DERATING FACTOR
ABOVE TA = 25°C (1)
TA = 85°C
POWER RATING
PW(14)
736 mW
5.9 mW/°C
383 mW
PW(16)
839 mW
6.7 mW/°C
437 mW
D(8)
635 mW
5.1 mW/°C
330 mW/°C
D(14)
987 mW
7.9 mW/°C
513 mW/°C
D(16)
1110 mW
8.9 mW/°C
577 mW/°C
DGK
424 mW
3.4 mW/°C
220 mW
This is the inverse of the junction-to-ambient thermal resistance when board-mounted and with no airflow.
RECOMMENDED OPERATING CONDITIONS
MIN
NOM
MAX
VCC
Supply voltage
3
3.3
3.6
VIH
High-level input voltage
2
VIL
Low-level input voltage
|VID|
Magnitude of differential input voltage
|VOD(dis)|
Magnitude of differential output voltage with disabled driver
VOY or VOZ
Driver output voltage
VIC
Common-mode input voltage (see Figure 5)
TA
Operating free-air temperature
0
0.8
V
0.6
V
520
mV
2.4
V
ŤV Ť
ID
2
V
V
0.1
ŤV Ť
UNIT
2.4 *
ID
2
V
VCC-0.8
4
–40
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85
°C
SN65LVDS179,, SN65LVDS180
SN65LVDS050, SN65LVDS051
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SLLS301O – APRIL 1998 – REVISED MAY 2007
DEVICE ELECTRICAL CHARACTERISTICS
over recommended operating conditions (unless otherwise noted)
MIN TYP (1)
MAX
No receiver load, driver RL = 100 Ω
9
12
Driver and receiver enabled, no receiver load, driver RL = 100 Ω
9
12
PARAMETER
SN65LVDS179
SN65LVDS180
Supply
current
ICC
SN65LVDS050
SN65LVDS051
(1)
TEST CONDITIONS
Driver enabled, receiver disabled, RL = 100 Ω
5
7
Driver disabled, receiver enabled, no load
1.5
2
Disabled
0.5
1
Drivers and receivers enabled, no receiver loads, driver RL = 100 Ω
12
20
Drivers enabled, receivers disabled, RL = 100 Ω
10
16
3
6
Drivers disabled, receivers enabled, no loads
Disabled
0.5
1
Drivers enabled, No receiver loads, driver RL = 100 Ω
12
20
3
6
MIN
TYP
MAX
247
340
454
Drivers disabled, no loads
UNIT
mA
mA
mA
mA
All typical values are at 25°C and with a 3.3-V supply.
DRIVER ELECTRICAL CHARACTERISTICS
over recommended operating conditions (unless otherwise noted)
PARAMETER
TEST CONDITIONS
|VOD|
Differential output voltage magnitude
∆|VOD|
Change in differential output voltage magnitude between logic
states
VOC(SS)
Steady-state common-mode output voltage
∆VOC(SS)
Change in steady-state common-mode output voltage between
logic states
VOC(PP)
Peak-to-peak common-mode output voltage
IIH
High-level input current
IIL
Low-level input current
IOS
Short-circuit output current
DE
D
DE
D
RL = 100 Ω, See
Figure 3 and Figure 2
-50
1.125
See Figure 3
50
1.2
–50
1.375
UNIT
mV
V
50
mV
50
150
mV
–0.5
–20
2
20
–0.5
–10
2
10
VOY or VOZ = 0 V
3
10
VOD = 0 V
3
10
VIH = 5 V
VIL = 0.8 V
µA
µA
mA
DE = OV
VOY = VOZ = OV
IO(OFF)
Off-state output current
CIN
Input capacitance
DE = VCC
VOY = VOZ = OV,
VCC < 1.5 V
–1
1
3
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µA
pF
5
SN65LVDS179,, SN65LVDS180
SN65LVDS050, SN65LVDS051
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SLLS301O – APRIL 1998 – REVISED MAY 2007
RECEIVER ELECTRICAL CHARACTERISTICS
over recommended operating conditions (unless otherwise noted)
PARAMETER
TEST CONDITIONS
VIT+
Positive-going differential input voltage threshold
VIT-
Negative-going differential input voltage threshold
VOH
High-level output voltage
VOL
Low-level output voltage
II
Input current (A or B inputs)
II(OFF)
Power-off input current (A or B inputs)
IIH
IIL
IOZ
High-impedance output current
CI
Input capacitance
(1)
See Figure 5 and Table 2
MIN TYP (1)
50
–50
IOH = -8 mA
2.4
IOH = -4 mA
2.8
VI = 0
UNIT
mV
V
IOL = 8 mA
VI = 2.4 V
MAX
0.4
–2
–11
–1.2
–3
–20
V
µA
VCC = 0
±20
µA
High-level input current (enables)
VIH = 5 V
±10
µA
Low-level input current (enables)
VIL = 0.8 V
±10
µA
VO = 0 or 5 V
±10
µA
5
pF
All typical values are at 25°C and with a 3.3-V supply.
DRIVER SWITCHING CHARACTERISTICS
over recommended operating conditions (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN TYP (1)
MAX
UNIT
tPLH
Propagation delay time, low-to-high-level output
1.7
2.7
ns
tPHL
Propagation delay time, high-to-low-level output
1.7
2.7
ns
tr
Differential output signal rise time
0.8
1
ns
tf
Differential output signal fall time
0.8
1
ns
tsk(p)
Pulse skew (|tpHL - tpLH|) (2)
300
ps
tsk(o)
Channel-to-channel output skew (3)
150
ps
ten
Enable time
tdis
Disable time
(1)
(2)
(3)
RL = 100 Ω,
CL = 10 pF,
See Figure 2
See Figure 4
4.3
10
ns
3.1
10
ns
All typical values are at 25°C and with a 3.3-V supply.
tsk(p) is the magnitude of the time difference between the high-to-low and low-to-high propagation delay times at an output.
tsk(o) is the magnitude of the time difference between the outputs of a single device with all of their inputs connected together.
RECEIVER SWITCHING CHARACTERISTICS
over recommended operating conditions (unless otherwise noted)
PARAMETER
MIN TYP (1)
MAX
3.7
4.5
ns
3.7
4.5
ns
UNIT
tPLH
Propagation delay time, low-to-high-level output
tPHL
Propagation delay time, high-to-low-level output
tsk(p)
Pulse skew (|tpHL - tpLH|) (2)
tr
Output signal rise time
0.7
1.5
ns
tf
Output signal fall time
0.9
1.5
ns
tPZH
Propagation delay time, high-impedance-to-high-level output
2.5
ns
tPZL
Propagation delay time, high-impedance-to-low-level output
2.5
ns
tPHZ
Propagation delay time, high-level-to-high-impedance output
7
ns
tPLZ
Propagation delay time, low-level-to-high-impedance output
4
ns
(1)
(2)
6
TEST CONDITIONS
CL = 10 pF,
See Figure 6
See Figure 7
0.3
ns
All typical values are at 25°C and with a 3.3-V supply.
tsk(p) is the magnitude of the time difference between the high-to-low and low-to-high propagation delay times at an output.
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SLLS301O – APRIL 1998 – REVISED MAY 2007
PARAMETER MEASUREMENT INFORMATION
DRIVER
IOY
Driver Enable
Y
II
A
IOZ
VOD
V
VOY
Z
VI
OY
)V
OZ
2
VOC
VOZ
Figure 1. Driver Voltage and Current Definitions
Driver Enable
Y
100 Ω
±1%
VOD
Input
Z
CL = 10 pF
(2 Places)
2V
1.4 V
0.8 V
Input
tPHL
tPLH
100%
80%
Output
VOD(H)
0V
VOD(L)
20%
0%
tf
A.
tr
All input pulses are supplied by a generator having the following characteristics: tr or tf ≤ 1 ns, pulse repetition rate
(PRR) = 50 Mpps, pulse width = 10 ± 0.2 ns. CL includes instrumentation and fixture capacitance within 0,06 mm of
the D.U.T.
Figure 2. Test Circuit, Timing, and Voltage Definitions for the Differential Output Signal
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SN65LVDS179,, SN65LVDS180
SN65LVDS050, SN65LVDS051
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SLLS301O – APRIL 1998 – REVISED MAY 2007
PARAMETER MEASUREMENT INFORMATION (continued)
49.9 Ω, ±1% (2 Places)
Driver Enable
3V
Y
Input
0V
Z
VOC
VOC(PP)
CL = 10 pF
(2 Places)
VOC(SS)
VOC
A.
All input pulses are supplied by a generator having the following characteristics: tr or tf ≤ 1 ns, pulse repetition rate
(PRR) = 50 Mpps, pulse width = 10 ± 0.2 ns. CL includes instrumentation and fixture capacitance within 0,06 mm of
the D.U.T. The measurement of VOC(PP) is made on test equipment with a –3-dB bandwidth of at least 300 MHz.
Figure 3. Test Circuit and Definitions for the Driver Common-Mode Output Voltage
49.9 Ω, ±1% (2 Places)
Y
0.8 V or 2 V
Z
DE
1.2 V
CL = 10 pF
(2 Places)
VOY
2V
1.4 V
0.8 V
DE
VOY or VOZ
ten
ten
~1.4 V
1.25 V
1.2 V
D at 2 V and input to DE
1.2 V
1.15 V
~1 V
D at 0.8 V and input to DE
tdis
VOZ or VOY
A.
VOZ
tdis
All input pulses are supplied by a generator having the following characteristics: tr or tf ≤ 1 ns, pulse repetition rate
(PRR) = 0.5 Mpps, pulse width = 500 ± 10 ns. CL includes instrumentation and fixture capacitance within 0,06 mm of
the D.U.T.
Figure 4. Enable and Disable Time Circuit and Definitions
8
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SLLS301O – APRIL 1998 – REVISED MAY 2007
PARAMETER MEASUREMENT INFORMATION (continued)
RECEIVER
A
V
IA
)V
IB
VID
2
R
VIA
B
VIC
VO
VIB
Figure 5. Receiver Voltage Definitions
Table 2. Receiver Minimum and Maximum Input Threshold Test Voltages
APPLIED VOLTAGES
(V)
RESULTING DIFFERENTIAL
INPUT VOLTAGE (mV)
RESULTING COMMONMODE INPUT VOLTAGE (V)
VID
VIC
1.2
VIA
VIB
1.25
1.15
100
1.15
1.25
–100
1.2
2.4
2.3
100
2.35
2.3
2.4
–100
2.35
0.1
0
100
0.05
0
0.1
–100
0.05
1.5
0.9
600
1.2
0.9
1.5
–600
1.2
2.4
1.8
600
2.1
1.8
2.4
–600
2.1
0.6
0
600
0.3
0
0.6
–600
0.3
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SLLS301O – APRIL 1998 – REVISED MAY 2007
VID
VIA
VIB
CL
10 pF
VO
VIA
1.4 V
VIB
1V
VID
0.4 V
0V
–0.4 V
tPHL
VO
tPLH
VOH
2.4 V
1.4 V
0.4 V
VOL
tf
A.
tr
All input pulses are supplied by a generator having the following characteristics: tr or tf ≤ 1 ns, pulse repetition rate
(PRR) = 50 Mpps, pulse width = 10 ± 0.2 ns. CL includes instrumentation and fixture capacitance within 0,06 m of the
D.U.T.
Figure 6. Timing Test Circuit and Waveforms
10
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SLLS301O – APRIL 1998 – REVISED MAY 2007
B
1.2 V
500 Ω
A
Inputs
A.
CL
10 pF
RE
+
–
VO
VTEST
All input pulses are supplied by a generator having the following characteristics: tr or tf ≤ 1 ns, pulse repetition rate
(PRR) = 0.5 Mpps, pulse width = 500 ± 10 ns. CL includes instrumentation and fixture capacitance within 0,06 m of
the D.U.T.
2.5 V
VTEST
A
1V
2V
RE
1.4 V
0.8 V
tPZL
tPZL
tPLZ
2.5 V
1.4 V
R
VOL +0.5 V
VOL
0V
VTEST
A
1.4 V
2V
RE
1.4 V
0.8 V
tPZH
R
tPZH
tPHZ
VOH –0.5 V
VOH
1.4 V
0V
Figure 7. Enable/Disable Time Test Circuit and Waveforms
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11
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SLLS301O – APRIL 1998 – REVISED MAY 2007
TYPICAL CHARACTERISTICS
DISABLED DRIVER OUTPUT CURRENT
vs
OUTPUT VOLTAGE
Disabled Driver Output Current − mA
40
VCC = 3.3 V
TA = 25°C
DE = 0 V
30
Other output at 0 V
20
Other output at 1.2 V
10
VOZ = VOY
0
−10
Other output at 2.4 V
−20
−30
0
0.5
1
1.5
2
VO − Output Voltage − V
Figure 8.
DRIVER
LOW-LEVEL OUTPUT VOLTAGE
vs
LOW-LEVEL OUTPUT CURRENT
3.5
VCC = 3.3 V
TA = 25°C
VOH − High-Level Output Voltage − V
VOL − Low-Level Output Voltage − V
3
DRIVER
HIGH-LEVEL OUTPUT VOLTAGE
vs
HIGH-LEVEL OUTPUT CURRENT
4
3
2
1
VCC = 3.3 V
TA = 25°C
3
2.5
2
1.5
1
0.5
0
0
0
2
4
6
−4
IOL − Low-Level Output Current − mA
Figure 9.
12
2.5
−3
−2
Figure 10.
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−1
IOH − High-Level Output Current − mA
0
SN65LVDS179,, SN65LVDS180
SN65LVDS050, SN65LVDS051
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SLLS301O – APRIL 1998 – REVISED MAY 2007
TYPICAL CHARACTERISTICS (continued)
RECEIVER
LOW-LEVEL OUTPUT VOLTAGE
vs
LOW-LEVEL OUTPUT CURRENT
RECEIVER
HIGH-LEVEL OUTPUT VOLTAGE
vs
HIGH-LEVEL OUTPUT CURRENT
5
4
VCC = 3.3 V
TA = 25°C
VOH − High-Level Output Voltage − V
VOL − Low-Level Output Votlage − V
VCC = 3.3 V
TA = 25°C
4
3
2
1
0
0
10
20
30
40
50
IOL − Low-Level Output Current − mA
2
1
0
−80
60
−60
−40
−20
IOH − High-Level Output Current − mA
0
Figure 11.
Figure 12.
DRIVER
HIGH-TO-LOW LEVEL PROPAGATION DELAY TIME
vs
FREE-AIR TEMPERATURE
DRIVER
LOW-TO-HIGH LEVEL PROPAGATION DELAY TIME
vs
FREE-AIR TEMPERATURE
2.5
2
t PLH − Low-To-High Propagation Delay Time − ns
2.5
t PHL − High-To-Low Propagation Delay Time − ns
3
VCC = 3.3 V
VCC = 3 V
VCC = 3.6 V
1.5
−50
−30
−10
50
30
70
TA − Free-Air Temperature − °C
10
90
2
VCC = 3.3 V
VCC = 3 V
VCC = 3.6 V
1.5
−50
Figure 13.
−30
−10
50
10
30
70
TA − Free-Air Temperature − °C
90
Figure 14.
Submit Documentation Feedback
13
SN65LVDS179,, SN65LVDS180
SN65LVDS050, SN65LVDS051
www.ti.com
SLLS301O – APRIL 1998 – REVISED MAY 2007
TYPICAL CHARACTERISTICS (continued)
t PLH − High-To-Low Level Propagation Delay Time − ms
RECEIVER
HIGH-TO-LOW LEVEL PROPAGATION DELAY TIME
vs
FREE-AIR TEMPERATURE
4.5
VCC = 3.3 V
4
VCC = 3 V
3.5
VCC = 3.6 V
3
2.5
−50
−30
−10
50
10
30
70
TA − Free−Air Temperature − °C
90
Figure 15.
t PLH − Low-To-High Level Propagation Delay Time − ns
RECEIVER
LOW-TO-HIGH LEVEL PROPAGATION DELAY TIME
vs
FREE-AIR TEMPERATURE
14
4.5
VCC = 3 V
4
VCC = 3.3 V
3.5
VCC = 3.6 V
3
2.5
−50
−30
−10
50
30
70
TA − Free-Air Temperature − °C
Figure 16.
10
Submit Documentation Feedback
90
SN65LVDS179,, SN65LVDS180
SN65LVDS050, SN65LVDS051
www.ti.com
SLLS301O – APRIL 1998 – REVISED MAY 2007
APPLICATION INFORMATION
Equipment
•
•
•
Hewlett Packard HP6624A DC power supply
Tektronix TDS7404 Real Time Scope
Agilent ParBERT E4832A
Hewlett Packard HP6624A
DC Power Supply
Agilent ParBERT
(E4832A)
Bench Test Board
Tektronix TDS7404
Real Time Scope
Figure 17. Equipment Setup
(a)
(b)
a.
Tx + Rx running at 150 Mbps; Channel 1: R, Channel 2: Y-Z
b.
Rx only running at 150 Mbps; Channel 1: R
c.
Tx only running at 400 Mbps; Channel 1: Y-Z
(c)
Figure 18. Typical Eye Patterns SN65LVDS179: (T = 25°C; VCC = 3.6 V; PRBS = 223-1)
Submit Documentation Feedback
15
SN65LVDS179,, SN65LVDS180
SN65LVDS050, SN65LVDS051
www.ti.com
SLLS301O – APRIL 1998 – REVISED MAY 2007
APPLICATION INFORMATION (continued)
(a)
(b)
a.
Tx + Rx running at 150 Mbps; Channel 1: R, Channel 2: Y-Z
b.
Rx only running at 150 Mbps; Channel 1: R
c.
Tx only running at 400 Mbps; Channel 1: Y-Z
(c)
Figure 19. Typical Eye Patterns SN65LVDS180: (T = 25°C; VCC = 3.6 V; PRBS = 223-1)
(a)
(b)
(c)
a.
All buffers running at 100 Mbps; Channel 1: R, Channel 2: 2R, Channel 3: 1Y-1Z, Channel 4: 2Y-2Z,
b.
Rx buffers only running at 100 Mbps; Channel 1: R, Channel 2: 2R
c.
Tx buffers only running at 400 Mbps; Channel 3: 1Y-1Z, Channel 4: 2Y-2Z,
Figure 20. Typical Eye Patterns SN65LVDS050: (T = 25°C; VCC = 3.6 V; PRBS = 223-1)
(a)
(b)
(c)
a.
All buffers running at 100 Mbps; Channel 1: R, Channel 2: 2R, Channel 3: 1Y-1Z, Channel 4: 2Y-2Z,
b.
Rx buffers only running at 100 Mbps; Channel 1: R, Channel 2: 2R
c.
Tx buffers only running at 400 Mbps; Channel 3: 1Y-1Z, Channel 4: 2Y-2Z,
Figure 21. Typical Eye Patterns SN65LVDS051: (T = 25°C; VCC = 3.6 V; PRBS = 223-1)
16
Submit Documentation Feedback
SN65LVDS179,, SN65LVDS180
SN65LVDS050, SN65LVDS051
www.ti.com
SLLS301O – APRIL 1998 – REVISED MAY 2007
The devices are generally used as building blocks for high-speed point-to-point data transmission. Ground
differences are less than 1 V with a low common-mode output and balanced interface for low noise emissions.
Devices can interoperate with RS-422, PECL, and IEEE-P1596. Drivers/receivers maintain ECL speeds without
the power and dual supply requirements.
Transmission Distance – m
1000
30% Jitter
100
5% Jitter
10
1
24 AWG UTP 96 Ω (PVC Dielectric)
0.1
100k
1M
10M
100M
Data Rate – Hz
Figure 22. Data Transmission Distance Versus Rate
FAIL SAFE
One of the most common problems with differential signaling applications is how the system responds when no
differential voltage is present on the signal pair. The LVDS receiver is like most differential line receivers, in that
its output logic state can be indeterminate when the differential input voltage is between -100 mV and 100 mV
and within its recommended input common-mode voltage range. TI's LVDS receiver is different in how it handles
the open-input circuit situation, however.
Open-circuit means that there is little or no input current to the receiver from the data line itself. This could be
when the driver is in a high-impedance state or the cable is disconnected. When this occurs, the LVDS receiver
pulls each line of the signal pair to near VCC through 300-kΩ resistors as shown in Figure 11. The fail-safe
feature uses an AND gate with input voltage thresholds at about 2.3 V to detect this condition and force the
output to a high-level regardless of the differential input voltage.
VCC
300 kΩ
300 kΩ
A
Rt
100 Ω Typ
Y
B
VIT ≈ 2.3 V
Figure 23. Open-Circuit Fail Safe of the LVDS Receiver
It is only under these conditions that the output of the receiver will be valid with less than a 100-mV differential
input voltage magnitude. The presence of the termination resistor, Rt, does not affect the fail-safe function as
long as it is connected as shown in the figure. Other termination circuits may allow a dc current to ground that
could defeat the pullup currents from the receiver and the fail-safe feature.
Submit Documentation Feedback
17
PACKAGE OPTION ADDENDUM
www.ti.com
18-Apr-2008
PACKAGING INFORMATION
Orderable Device
Status (1)
Package
Type
Package
Drawing
Pins Package Eco Plan (2)
Qty
SN65LVDS050D
ACTIVE
SOIC
D
16
40
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN65LVDS050DG4
ACTIVE
SOIC
D
16
40
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN65LVDS050DR
ACTIVE
SOIC
D
16
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN65LVDS050DRG4
ACTIVE
SOIC
D
16
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN65LVDS050PW
ACTIVE
TSSOP
PW
16
90
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN65LVDS050PWG4
ACTIVE
TSSOP
PW
16
90
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN65LVDS050PWR
ACTIVE
TSSOP
PW
16
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN65LVDS050PWRG4
ACTIVE
TSSOP
PW
16
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN65LVDS051D
ACTIVE
SOIC
D
16
40
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN65LVDS051DG4
ACTIVE
SOIC
D
16
40
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN65LVDS051DR
ACTIVE
SOIC
D
16
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN65LVDS051DRG4
ACTIVE
SOIC
D
16
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN65LVDS051PW
ACTIVE
TSSOP
PW
16
90
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN65LVDS051PWG4
ACTIVE
TSSOP
PW
16
90
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN65LVDS051PWR
ACTIVE
TSSOP
PW
16
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN65LVDS051PWRG4
ACTIVE
TSSOP
PW
16
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN65LVDS179D
ACTIVE
SOIC
D
8
75
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN65LVDS179DG4
ACTIVE
SOIC
D
8
75
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN65LVDS179DGK
ACTIVE
MSOP
DGK
8
80
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN65LVDS179DGKG4
ACTIVE
MSOP
DGK
8
80
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN65LVDS179DGKR
ACTIVE
MSOP
DGK
8
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN65LVDS179DGKRG4
ACTIVE
MSOP
DGK
8
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN65LVDS179DR
ACTIVE
SOIC
D
8
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN65LVDS179DRG4
ACTIVE
SOIC
D
8
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN65LVDS180D
ACTIVE
SOIC
D
14
CU NIPDAU
Level-1-260C-UNLIM
50
Addendum-Page 1
Green (RoHS &
no Sb/Br)
Lead/Ball Finish
MSL Peak Temp (3)
PACKAGE OPTION ADDENDUM
www.ti.com
18-Apr-2008
Orderable Device
Status (1)
Package
Type
Package
Drawing
Pins Package Eco Plan (2)
Qty
SN65LVDS180DG4
ACTIVE
SOIC
D
14
SN65LVDS180DR
ACTIVE
SOIC
D
SN65LVDS180DRG4
ACTIVE
SOIC
SN65LVDS180PW
ACTIVE
SN65LVDS180PWG4
50
Lead/Ball Finish
MSL Peak Temp (3)
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
14
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
D
14
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
TSSOP
PW
14
90
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
ACTIVE
TSSOP
PW
14
90
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN65LVDS180PWR
ACTIVE
TSSOP
PW
14
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN65LVDS180PWRG4
ACTIVE
TSSOP
PW
14
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
16-Apr-2008
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
Diameter Width
(mm) W1 (mm)
A0 (mm)
B0 (mm)
K0 (mm)
P1
(mm)
W
Pin1
(mm) Quadrant
10.3
2.1
8.0
16.0
Q1
SN65LVDS050DR
SOIC
D
16
2500
330.0
16.4
6.5
SN65LVDS050PWR
TSSOP
PW
16
2000
330.0
12.4
6.67
5.4
1.6
8.0
12.0
Q1
SN65LVDS051DR
SOIC
D
16
2500
330.0
16.4
6.5
10.3
2.1
8.0
16.0
Q1
SN65LVDS051PWR
TSSOP
PW
16
2000
330.0
12.4
6.67
5.4
1.6
8.0
12.0
Q1
SN65LVDS179DGKR
MSOP
DGK
8
2500
330.0
12.4
5.3
3.4
1.4
8.0
12.0
Q1
SN65LVDS179DR
SOIC
D
8
2500
330.0
12.4
6.4
5.2
2.1
8.0
12.0
Q1
SN65LVDS179DR
SOIC
D
8
2500
330.0
12.4
6.4
5.2
2.1
8.0
12.0
Q1
SN65LVDS180DR
SOIC
D
14
2500
330.0
16.4
6.5
9.0
2.1
8.0
16.0
Q1
SN65LVDS180PWR
TSSOP
PW
14
2000
330.0
12.4
6.67
5.4
1.6
8.0
12.0
Q1
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
16-Apr-2008
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
SN65LVDS050DR
SOIC
D
16
2500
346.0
346.0
33.0
SN65LVDS050PWR
TSSOP
PW
16
2000
346.0
346.0
29.0
SN65LVDS051DR
SOIC
D
16
2500
346.0
346.0
33.0
SN65LVDS051PWR
TSSOP
PW
16
2000
346.0
346.0
29.0
SN65LVDS179DGKR
MSOP
DGK
8
2500
358.0
335.0
35.0
SN65LVDS179DR
SOIC
D
8
2500
340.5
338.1
20.6
SN65LVDS179DR
SOIC
D
8
2500
346.0
346.0
29.0
SN65LVDS180DR
SOIC
D
14
2500
346.0
346.0
33.0
SN65LVDS180PWR
TSSOP
PW
14
2000
346.0
346.0
29.0
Pack Materials-Page 2
MECHANICAL DATA
MTSS001C – JANUARY 1995 – REVISED FEBRUARY 1999
PW (R-PDSO-G**)
PLASTIC SMALL-OUTLINE PACKAGE
14 PINS SHOWN
0,30
0,19
0,65
14
0,10 M
8
0,15 NOM
4,50
4,30
6,60
6,20
Gage Plane
0,25
1
7
0°– 8°
A
0,75
0,50
Seating Plane
0,15
0,05
1,20 MAX
PINS **
0,10
8
14
16
20
24
28
A MAX
3,10
5,10
5,10
6,60
7,90
9,80
A MIN
2,90
4,90
4,90
6,40
7,70
9,60
DIM
4040064/F 01/97
NOTES: A.
B.
C.
D.
All linear dimensions are in millimeters.
This drawing is subject to change without notice.
Body dimensions do not include mold flash or protrusion not to exceed 0,15.
Falls within JEDEC MO-153
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• DALLAS, TEXAS 75265
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