SCBS081L − JANUARY 1991 − REVISED APRIL 2005 SN54ABT245A . . . J OR W PACKAGE SN74ABT245B . . . DB, DGV, DW, N, NS, OR PW PACKAGE (TOP VIEW) 19 3 18 4 17 5 16 6 15 7 14 8 13 9 12 10 11 SN54ABT245B . . . FK PACKAGE (TOP VIEW) VCC OE B1 B2 B3 B4 B5 B6 B7 B8 A1 A2 A3 A4 A5 A6 A7 A8 20 A2 A1 DIR VCC 1 A3 A4 A5 A6 A7 19 OE 18 B1 2 3 17 B2 16 B3 4 5 15 B4 14 B5 6 7 13 B6 12 B7 8 9 10 11 4 3 2 1 20 19 18 5 17 6 16 7 15 8 14 9 10 11 12 13 B1 B2 B3 B4 B5 A8 GND B8 B7 B6 20 2 VCC 1 B8 DIR A1 A2 A3 A4 A5 A6 A7 A8 GND JEDEC Standard JESD 17 ESD Protection Exceeds JESD 22 − 2000-V Human-Body Model (A114-A) − 200-V Machine Model (A115-A) SN74ABT245B . . . RGY PACKAGE (TOP VIEW) DIR D D GND D D Latch-Up Performance Exceeds 500 mA Per <1 V at VCC = 5 V, TA = 25°C Ioff and Power-Up 3-State Support Hot Insertion High-Drive Outputs (−32-mA IOH, 64-mA IOL) OE D Typical VOLP (Output Ground Bounce) description/ordering information These octal bus transceivers are designed for asynchronous communication between data buses. The devices transmit data from the A bus to the B bus or from the B bus to the A bus, depending on the logic level at the direction-control (DIR) input. The output-enable (OE) input can be used to disable the device so the buses are effectively isolated. ORDERING INFORMATION Tube SN74ABT245BN SN74ABT245BN QFN − RGY Tape and reel SN74ABT245BRGYR AB245B Tube SN74ABT245BDW Tape and reel SN74ABT245BDWR SOP − NS Tape and reel SN74ABT245BNSR ABT245B SSOP − DB Tape and reel SN74ABT245BDBR AB245B Tube SN74ABT245BPW Tape and reel SN74ABT245BPWR Tape and reel SN74ABT245BDGVR TSSOP − PW TVSOP − DGV VFBGA − GQN VFBGA − ZQN (Pb-free) −55°C −55 C to 125 125°C C TOP-SIDE MARKING PDIP − N SOIC − DW −40°C 85°C −40 C to 85 C ORDERABLE PART NUMBER PACKAGE† TA ABT245B AB245B AB245B SN74ABT245BGQNR Tape and reel SN74ABT245BZQNR AB245B CDIP − J Tube SNJ54ABT245AJ SNJ54ABT245AJ CFP − W Tube SNJ54ABT245AW SNJ54ABT245AW LCCC − FK Tube SNJ54ABT245AFK SNJ54ABT245AFK † Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at www.ti.com/sc/package. Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. Copyright 2005, Texas Instruments Incorporated ! " #$%! " &$'(#! )!%* )$#!" # ! "&%##!" &% !+% !%" %," "!$%!" "!)) -!.* )$#! &#%""/ )%" ! %#%""(. #($)% !%"!/ (( &%!%"* &)$#!" #&(! ! 012 (( &%!%" % !%"!%) $(%"" !+%-"% !%)* (( !+% &)$#!" &)$#! &#%""/ )%" ! %#%""(. #($)% !%"!/ (( &%!%"* POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 1 SCBS081L − JANUARY 1991 − REVISED APRIL 2005 description/ordering information (continued) To ensure the high-impedance state during power up or power down, OE should be tied to VCC through a pullup resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver. This device is fully specified for hot-insertion applications using Ioff and power-up 3-state. The Ioff circuitry disables the outputs, preventing damaging current backflow through the device when it is powered down. The power-up 3-state circuitry places the outputs in the high-impedance state during power up and power down, which prevents driver conflict. SN74ABT245B . . . GQN OR ZQN PACKAGE (TOP VIEW) 1 2 3 terminal assignments 4 1 2 3 4 A A A1 DIR B A3 B2 VCC A2 OE B C C A5 A4 B4 B3 D D A7 B6 A6 B5 E E GND A8 B8 B7 FUNCTION TABLE INPUTS OE DIR OPERATION L L B data to A bus L H A data to B bus H X Isolation logic diagram (positive logic) DIR 1 19 A1 2 18 To Seven Other Channels Pin numbers shown are for the DB, DGV, DW, FK, J, N, NS, PW, RGY, and W packages. 2 OE POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 B1 B1 SCBS081L − JANUARY 1991 − REVISED APRIL 2005 absolute maximum ratings over operating free-air temperature range (unless otherwise noted)† Supply voltage range, VCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to 7 V Input voltage range, VI (except I/O ports) (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to 7 V Voltage range applied to any output in the high or power-off state, VO . . . . . . . . . . . . . . . . . . . −0.5 V to 5.5 V Current into any output in the low state, IO: SN54ABT245A . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 96 mA SN74ABT245B . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 128 mA Input clamp current, IIK (VI < 0) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −18 mA Output clamp current, IOK (VO < 0) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −50 mA Package thermal impedance, θJA (see Note 2): DB package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 70°C/W (see Note 2): DGV package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 92°C/W (see Note 2): DW package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 58°C/W (see Note 2): GQN/ZQN package . . . . . . . . . . . . . . . . . . . . . . . . . . . 78°C/W (see Note 2): N package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 69°C/W (see Note 2): NS package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 60°C/W (see Note 2): PW package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 83°C/W (see Note 3): RGY package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37°C/W Storage temperature range, Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −65°C to 150°C † Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. NOTES: 1. The input and output negative-voltage ratings may be exceeded if the input and output clamp-current ratings are observed. 2. The package thermal impedance is calculated in accordance with JESD 51-7. 3. The package thermal impedance is calculated in accordance with JESD 51-5. recommended operating conditions (see Note 4) SN54ABT245A MAX MIN MAX 4.5 5.5 4.5 5.5 VCC VIH Supply voltage VIL VI Low-level input voltage IOH IOL High-level output current VCC −24 Low-level output current 48 ∆t/∆v Input transition rise or fall rate ∆t/∆VCC TA Power-up ramp rate High-level input voltage SN74ABT245B MIN 2 2 0.8 Input voltage 0 5 −55 125 mA 64 mA 5 −40 V VCC −32 V ns/V µs/V 200 Operating free-air temperature V V 0.8 0 UNIT 85 °C NOTE 4: All unused inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report, Implications of Slow or Floating CMOS Inputs, literature number SCBA004. POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 3 SCBS081L − JANUARY 1991 − REVISED APRIL 2005 electrical characteristics over recommended operating free-air temperature range (unless otherwise noted) PARAMETER VIK VOH TEST CONDITIONS VCC = 4.5 V, VCC = 4.5 V, II = −18 mA IOH = −3 mA VCC = 5 V, VCC = 4.5 V VOL VCC = 4.5 V MIN TA = 25°C TYP† MAX MIN −1.2 MAX SN74ABT245B MIN −1.2 2.5 2.5 IOH = −3 mA IOH = −24 mA 3 3 3 2 2 IOH = −32 mA IOL = 48 mA 2* A or B ports UNIT V V 2 0.55 IOL = 64 mA 0.55 0.55* 0.55 100 Control inputs VCC = 0 to 5.5 V, VI = VCC or GND VCC = 2.1 V to 5.5 V, VI = VCC or GND V mV ±1 ±1 ±1 ±20 ±100 ±20 µA IOZPU VCC = 0 to 2.1 V, VO = 0.5 V to 2.7 V, OE = X ±50 ±50 ±50 µA IOZPD VCC = 2.1 V to 0, VO = 0.5 V to 2.7 V, OE = X ±50 ±50 ±50 µA IOZH‡ VCC = 2.1 V to 5.5 V, VO = 2.7 V, OE ≥ 2 V 10 10 10 µA IOZL‡ VCC = 2.1 V to 5.5 V, VO = 0.5 V, OE ≥ 2 V −10 −10 −10 µA Ioff VCC = 0, VCC = 5.5 V, VO = 5.5 V VI or VO ≤ 5.5 V ±100 µA 50 µA VCC = 5.5 V, VO = 2.5 V Outputs high −180 mA 250 µA ICEX IO§ ICC A or B ports Data inputs ∆ICC¶ Control inputs Ci Control inputs Cio A or B ports VCC = 5.5 V, IO = 0, VI = VCC or GND ±100 Outputs high Outputs low Outputs disabled 50 −50 −140 −180 5 250 −50 −180 −50 250 22 30 30 30 mA 1 250 250 250 µA 1.5 1.5 1.5 mA 50 50 50 µA 1.5 1.5 1.5 mA VCC = 5.5 V, Outputs enabled One input at 3.4 V, Other inputs at Outputs disabled VCC or GND VCC = 5.5 V, One input at 3.4 V, Other inputs at VCC or GND VI = 2.5 V or 0.5 V VO = 2.5 V or 0.5 V 50 4 pF 8 pF * On products compliant to MIL-PRF-38535, this parameter does not apply. † All typical values are at VCC = 5 V. ‡ The parameters IOZH and IOZL include the input leakage current. § Not more than one output should be tested at a time, and the duration of the test should not exceed one second. ¶ This is the increase in supply current for each input that is at the specified TTL voltage level, rather than VCC or GND. 4 MAX −1.2 2.5 Vhys II SN54ABT245A POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 SCBS081L − JANUARY 1991 − REVISED APRIL 2005 switching characteristics over recommended ranges of supply voltage and operating free-air temperature, CL = 50 pF (unless otherwise noted) (see Figure 1) FROM (INPUT) TO (OUTPUT) tPLH tPHL A or B B or A tPZH tPZL OE A or B tPHZ tPLZ OE A or B PARAMETER tsk(o) VCC = 5 V, TA = 25°C SN54ABT245A MIN TYP MAX MIN MAX MIN MAX 1 2 3.2 0.8 3.8 1 3.6 1 2.6 3.5 1 4.2 1 3.9 2 3.5 4.5 1.2 6.2 2 5.6 1.9 4 5.3 1.3 6.8 1.9 6.2 2.2 4.4 5.4 2.2 6.1 2.2 5.9 1.5 3 4 1.0 4.9 1.5 4.5 0.5 POST OFFICE BOX 655303 SN74ABT245B • DALLAS, TEXAS 75265 0.5 UNIT ns ns ns ns 5 SCBS081L − JANUARY 1991 − REVISED APRIL 2005 PARAMETER MEASUREMENT INFORMATION 7V S1 500 Ω From Output Under Test Open GND CL = 50 pF (see Note A) 500 Ω TEST S1 tPLH/tPHL tPLZ/tPZL tPHZ/tPZH Open 7V Open LOAD CIRCUIT 3V Timing Input 1.5 V 0V tw tsu 3V Input 1.5 V 1.5 V th 3V Data Input 1.5 V 1.5 V 0V 0V VOLTAGE WAVEFORMS PULSE DURATION VOLTAGE WAVEFORMS SETUP AND HOLD TIMES 3V Input 1.5 V 1.5 V 0V VOH 1.5 V Output 1.5 V VOL Output 1.5 V tPLZ 1.5 V tPZH VOH 1.5 V VOL VOLTAGE WAVEFORMS PROPAGATION DELAY TIMES INVERTING AND NONINVERTING OUTPUTS 1.5 V 0V Output Waveform 1 S1 at 7 V (see Note B) tPLH tPHL 1.5 V tPZL tPHL tPLH 3V Output Control Output Waveform 2 S1 at Open (see Note B) 3.5 V VOL + 0.3 V VOL tPHZ 1.5 V VOH − 0.3 V VOH ≈0 V VOLTAGE WAVEFORMS ENABLE AND DISABLE TIMES LOW- AND HIGH-LEVEL ENABLING NOTES: A. CL includes probe and jig capacitance. B. Waveform 1 is for an output with internal conditions such that the output is low, except when disabled by the output control. Waveform 2 is for an output with internal conditions such that the output is high, except when disabled by the output control. C. All input pulses are supplied by generators having the following characteristics: PRR ≤ 10 MHz, ZO = 50 Ω, tr ≤ 2.5 ns, tf ≤ 2.5 ns. D. The outputs are measured one at a time, with one transition per measurement. E. All parameters and waveforms are not applicable to all devices. Figure 1. Load Circuit and Voltage Waveforms 6 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 PACKAGE OPTION ADDENDUM www.ti.com 6-Dec-2006 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Eco Plan (2) Qty 5962-9214802Q2A ACTIVE LCCC FK 20 1 TBD 5962-9214802QRA ACTIVE CDIP J 20 1 TBD 1 Lead/Ball Finish MSL Peak Temp (3) POST-PLATE N / A for Pkg Type A42 SNPB N / A for Pkg Type TBD A42 N / A for Pkg Type TBD Call TI 5962-9214802QSA ACTIVE CFP W 20 SN74ABT245BDBLE OBSOLETE SSOP DB 20 SN74ABT245BDBR ACTIVE SSOP DB 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74ABT245BDBRG4 ACTIVE SSOP DB 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74ABT245BDGVR ACTIVE TVSOP DGV 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74ABT245BDGVRE4 ACTIVE TVSOP DGV 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74ABT245BDW ACTIVE SOIC DW 20 25 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74ABT245BDWG4 ACTIVE SOIC DW 20 25 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74ABT245BDWR ACTIVE SOIC DW 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74ABT245BDWRG4 ACTIVE SOIC DW 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74ABT245BGQNR ACTIVE GQN 20 1000 TBD SNPB Level-1-240C-UNLIM SN74ABT245BN ACTIVE PDIP N 20 20 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type SN74ABT245BNE4 ACTIVE PDIP N 20 20 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type SN74ABT245BNSR ACTIVE SO NS 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74ABT245BNSRE4 ACTIVE SO NS 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74ABT245BPW ACTIVE TSSOP PW 20 70 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74ABT245BPWE4 ACTIVE TSSOP PW 20 70 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74ABT245BPWLE OBSOLETE TSSOP PW 20 SN74ABT245BPWR ACTIVE TSSOP PW 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74ABT245BPWRE4 ACTIVE TSSOP PW 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74ABT245BRGYR ACTIVE QFN RGY 20 1000 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1YEAR SN74ABT245BRGYRG4 ACTIVE QFN RGY 20 1000 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1YEAR SN74ABT245BZQNR ACTIVE ZQN 20 1000 Green (RoHS & no Sb/Br) SNAGCU Level-1-260C-UNLIM BGA MI CROSTA R JUNI OR BGA MI CROSTA R JUNI OR TBD Addendum-Page 1 Call TI Call TI Call TI PACKAGE OPTION ADDENDUM www.ti.com 6-Dec-2006 Orderable Device Status (1) Package Type Package Drawing Pins Package Eco Plan (2) Qty SNJ54ABT245AFK ACTIVE LCCC FK 20 1 TBD SNJ54ABT245AJ ACTIVE CDIP J 20 1 TBD A42 SNPB N / A for Pkg Type SNJ54ABT245AW ACTIVE CFP W 20 1 TBD A42 N / A for Pkg Type Lead/Ball Finish MSL Peak Temp (3) POST-PLATE N / A for Pkg Type (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 2 MECHANICAL DATA MLCC006B – OCTOBER 1996 FK (S-CQCC-N**) LEADLESS CERAMIC CHIP CARRIER 28 TERMINAL SHOWN 18 17 16 15 14 13 NO. OF TERMINALS ** 12 19 11 20 10 A B MIN MAX MIN MAX 20 0.342 (8,69) 0.358 (9,09) 0.307 (7,80) 0.358 (9,09) 28 0.442 (11,23) 0.458 (11,63) 0.406 (10,31) 0.458 (11,63) 21 9 22 8 44 0.640 (16,26) 0.660 (16,76) 0.495 (12,58) 0.560 (14,22) 23 7 52 0.739 (18,78) 0.761 (19,32) 0.495 (12,58) 0.560 (14,22) 24 6 68 0.938 (23,83) 0.962 (24,43) 0.850 (21,6) 0.858 (21,8) 84 1.141 (28,99) 1.165 (29,59) 1.047 (26,6) 1.063 (27,0) B SQ A SQ 25 5 26 27 28 1 2 3 4 0.080 (2,03) 0.064 (1,63) 0.020 (0,51) 0.010 (0,25) 0.020 (0,51) 0.010 (0,25) 0.055 (1,40) 0.045 (1,14) 0.045 (1,14) 0.035 (0,89) 0.045 (1,14) 0.035 (0,89) 0.028 (0,71) 0.022 (0,54) 0.050 (1,27) 4040140 / D 10/96 NOTES: A. B. C. D. E. All linear dimensions are in inches (millimeters). This drawing is subject to change without notice. This package can be hermetically sealed with a metal lid. The terminals are gold plated. Falls within JEDEC MS-004 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 MECHANICAL DATA MPDS006C – FEBRUARY 1996 – REVISED AUGUST 2000 DGV (R-PDSO-G**) PLASTIC SMALL-OUTLINE 24 PINS SHOWN 0,40 0,23 0,13 24 13 0,07 M 0,16 NOM 4,50 4,30 6,60 6,20 Gage Plane 0,25 0°–8° 1 0,75 0,50 12 A Seating Plane 0,15 0,05 1,20 MAX PINS ** 0,08 14 16 20 24 38 48 56 A MAX 3,70 3,70 5,10 5,10 7,90 9,80 11,40 A MIN 3,50 3,50 4,90 4,90 7,70 9,60 11,20 DIM 4073251/E 08/00 NOTES: A. B. C. D. All linear dimensions are in millimeters. This drawing is subject to change without notice. Body dimensions do not include mold flash or protrusion, not to exceed 0,15 per side. Falls within JEDEC: 24/48 Pins – MO-153 14/16/20/56 Pins – MO-194 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 MECHANICAL DATA MSSO002E – JANUARY 1995 – REVISED DECEMBER 2001 DB (R-PDSO-G**) PLASTIC SMALL-OUTLINE 28 PINS SHOWN 0,38 0,22 0,65 28 0,15 M 15 0,25 0,09 8,20 7,40 5,60 5,00 Gage Plane 1 14 0,25 A 0°–ā8° 0,95 0,55 Seating Plane 2,00 MAX 0,10 0,05 MIN PINS ** 14 16 20 24 28 30 38 A MAX 6,50 6,50 7,50 8,50 10,50 10,50 12,90 A MIN 5,90 5,90 6,90 7,90 9,90 9,90 12,30 DIM 4040065 /E 12/01 NOTES: A. B. C. D. All linear dimensions are in millimeters. This drawing is subject to change without notice. Body dimensions do not include mold flash or protrusion not to exceed 0,15. Falls within JEDEC MO-150 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 MECHANICAL DATA MTSS001C – JANUARY 1995 – REVISED FEBRUARY 1999 PW (R-PDSO-G**) PLASTIC SMALL-OUTLINE PACKAGE 14 PINS SHOWN 0,30 0,19 0,65 14 0,10 M 8 0,15 NOM 4,50 4,30 6,60 6,20 Gage Plane 0,25 1 7 0°– 8° A 0,75 0,50 Seating Plane 0,15 0,05 1,20 MAX PINS ** 0,10 8 14 16 20 24 28 A MAX 3,10 5,10 5,10 6,60 7,90 9,80 A MIN 2,90 4,90 4,90 6,40 7,70 9,60 DIM 4040064/F 01/97 NOTES: A. B. C. D. All linear dimensions are in millimeters. This drawing is subject to change without notice. Body dimensions do not include mold flash or protrusion not to exceed 0,15. Falls within JEDEC MO-153 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue any product or service without notice. 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