TI 74ALVTH16245ZQLR

SN54ALVTH16245, SN74ALVTH16245
2.5-V/3.3-V 16-BIT BUS TRANSCEIVERS
WITH 3-STATE OUTPUTS
SCES066G – JUNE 1996 – REVISED APRIL 2002
D
D
D
D
D
D
D
D
D
State-of-the-Art Advanced BiCMOS
Technology (ABT) Widebus  Design for
2.5-V and 3.3-V Operation and Low
Static-Power Dissipation
Support Mixed-Mode Signal Operation (5-V
Input and Output Voltages With 2.3-V to
3.6-V VCC )
Typical VOLP (Output Ground Bounce)
<0.8 V at VCC = 3.3 V, TA = 25°C
High Drive (–32/64 mA at 3.3-V VCC)
Ioff and Power-Up 3-State Support Hot
Insertion
Use Bus Hold on Data Inputs in Place of
External Pullup/Pulldown Resistors to
Prevent the Bus From Floating
Flow-Through Architecture Facilitates
Printed Circuit Board Layout
Distributed VCC and GND Pins Minimize
High-Speed Switching Noise
Latch-Up Performance Exceeds 100 mA Per
JESD 78, Class II
SN54ALVTH16245 . . . WD PACKAGE
SN74ALVTH16245 . . . DGG, DGV, OR DL PACKAGE
(TOP VIEW)
1DIR
1B1
1B2
GND
1B3
1B4
VCC
1B5
1B6
GND
1B7
1B8
2B1
2B2
GND
2B3
2B4
VCC
2B5
2B6
GND
2B7
2B8
2DIR
description
The ’ALVTH16245 devices are 16-bit (dual-octal)
noninverting 3-state transceivers designed for
2.5-V or 3.3-V VCC operation, but with the
capability to provide a TTL interface to a 5-V
system environment.
1
48
2
47
3
46
4
45
5
44
6
43
7
42
8
41
9
40
10
39
11
38
12
37
13
36
14
35
15
34
16
33
17
32
18
31
19
30
20
29
21
28
22
27
23
26
24
25
1OE
1A1
1A2
GND
1A3
1A4
VCC
1A5
1A6
GND
1A7
1A8
2A1
2A2
GND
2A3
2A4
VCC
2A5
2A6
GND
2A7
2A8
2OE
These devices can be used as two 8-bit transceivers or one 16-bit transceiver. They allow data transmission
from the A bus to the B bus or from the B bus to the A bus, depending on the logic level at the direction-control
(DIR) input. The output-enable (OE) input can be used to disable the device so that the buses are effectively
isolated.
These devices are fully specified for hot-insertion applications using Ioff and power-up 3-state. The Ioff circuitry
disables the outputs, preventing damaging current backflow through the device when it is powered down. The
power-up 3-state circuitry places the outputs in the high-impedance state during power up and power down,
which prevents driver conflict.
Active bus-hold circuitry is provided to hold unused or floating data inputs at a valid logic level. Use of pullup
or pulldown resistors with the bus-hold circuitry is not recommended.
When VCC is between 0 and 1.2 V, the devices are in the high-impedance state during power up or power down.
However, to ensure the high-impedance state above 1.2 V, OE should be tied to VCC through a pullup resistor;
the minimum value of the resistor is determined by the current-sinking capability of the driver.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
Widebus is a trademark of Texas Instruments.
Copyright  2002, Texas Instruments Incorporated
UNLESS OTHERWISE NOTED this document contains PRODUCTION
DATA information current as of publication date. Products conform to
specifications per the terms of Texas Instruments standard warranty.
Production processing does not necessarily include testing of all
parameters.
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
1
SN54ALVTH16245, SN74ALVTH16245
2.5-V/3.3-V 16-BIT BUS TRANSCEIVERS
WITH 3-STATE OUTPUTS
SCES066G – JUNE 1996 – REVISED APRIL 2002
SN74ALVTH16245 . . . GQL PACKAGE
(TOP VIEW)
1
2
3
4
5
terminal assignments
6
1
2
3
4
5
6
A
1DIR
NC
NC
NC
NC
1OE
B
1B2
1B1
GND
GND
1A1
1A2
C
1B4
1B3
1A4
1B6
1B5
VCC
GND
1A3
D
VCC
GND
1A5
1A6
E
1B8
1B7
1A7
1A8
E
F
2B1
2B2
2A2
2A1
F
G
2B3
2B4
GND
GND
2A4
2A3
G
H
2B5
2B6
VCC
GND
2A6
2A5
2A8
2A7
NC
NC
2OE
A
B
C
D
H
J
2B7
2B8
VCC
GND
J
K
2DIR
NC
NC
NC – No internal connection
K
ORDERING INFORMATION
TA
–40°C
40°C to 85°C
ORDERABLE
PART NUMBER
PACKAGE†
TOP-SIDE
MARKING
SSOP – DL
Tape and reel
SN74ALVTH16245DLR
ALVTH16245
TSSOP – DGG
Tape and reel
SN74ALVTH16245GR
ALVTH16245
TVSOP – DGV
Tape and reel
SN74ALVTH16245VR
VT245
VFBGA – GQL
Tape and reel
SN74ALVTH16245QR
–55°C to 125°C
CFP – WD
Tube
SNJ54ALVTH16245WD
SNJ54ALVTH16245WD
† Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are
available at www.ti.com/sc/package.
FUNCTION TABLE
(each 8-bit section)
INPUTS
2
OPERATION
OE
DIR
L
L
B data to A bus
L
H
A data to B bus
H
X
Isolation
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
SN54ALVTH16245, SN74ALVTH16245
2.5-V/3.3-V 16-BIT BUS TRANSCEIVERS
WITH 3-STATE OUTPUTS
SCES066G – JUNE 1996 – REVISED APRIL 2002
logic diagram (positive logic)
1DIR
1
2DIR
48
1A1
25
1OE
47
2A1
2
24
2OE
36
13
1B1
To Seven Other Channels
2B1
To Seven Other Channels
Pin numbers shown are for the DGG, DGV, DL, and WD packages.
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)†
Supply voltage range, VCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.5 V to 4.6 V
Input voltage range, VI (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.5 V to 7 V
Voltage range applied to any output in the high or power-off state, VO (see Note 1) . . . . . . . . . –0.5 V to 7 V
Output current in the low state, IO: SN54ALVTH16245 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 96 mA
SN74ALVTH16245 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 128 mA
Output current in the high state, IO: SN54ALVTH16245 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –48 mA
SN74ALVTH16245 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –64 mA
Input clamp current, IIK (VI < 0) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –50 mA
Output clamp current, IOK (VO < 0) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –50 mA
Package thermal impedance, θJA (see Note 2): DGG package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 70°C/W
DGV package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 58°C/W
DL package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 63°C/W
GQL package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 42°C/W
Storage temperature range, Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –65°C to 150°C
† Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTES: 1. The input and output negative-voltage ratings may be exceeded if the input and output clamp-current ratings are observed.
2. The package thermal impedance is calculated in accordance with JESD 51-7.
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
3
SN54ALVTH16245, SN74ALVTH16245
2.5-V/3.3-V 16-BIT BUS TRANSCEIVERS
WITH 3-STATE OUTPUTS
SCES066G – JUNE 1996 – REVISED APRIL 2002
recommended operating conditions, VCC = 2.5 V ± 0.2 V (see Note 3)
SN54ALVTH16245
SN74ALVTH16245
MIN
MAX
MIN
2.7
2.3
VCC
VIH
Supply voltage
2.3
High-level input voltage
1.7
VIL
VI
Low-level input voltage
IOH
High-level output current
IOL
∆t/∆v
TYP
TYP
2.7
1.7
0
VCC
5.5
0.7
0
VCC
–6
Low-level output current
V
V
5.5
V
–8
mA
6
8
Low-level output current; current duty cycle ≤ 50%; f ≥ 1 kHz
18
24
Input transition rise or fall rate
10
10
Outputs enabled
UNIT
V
0.7
Input voltage
MAX
mA
ns/V
∆t/∆VCC
Power-up ramp rate
200
200
µs/V
TA
Operating free-air temperature
–55
125
–40
85
°C
NOTE 3: All unused control inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report,
Implications of Slow or Floating CMOS Inputs, literature number SCBA004.
recommended operating conditions, VCC = 3.3 V ± 0.3 V (see Note 3)
SN54ALVTH16245
SN74ALVTH16245
MIN
MAX
MIN
3.6
3
VCC
VIH
Supply voltage
3
High-level input voltage
2
VIL
VI
Low-level input voltage
IOH
High-level output current
Low-level output current
Low-level output current; current duty cycle ≤ 50%; f ≥ 1 kHz
IOL
TYP
TYP
3.6
2
0
∆t/∆v
Input transition rise or fall rate
∆t/∆VCC
TA
Power-up ramp rate
200
Operating free-air temperature
–55
Outputs enabled
VCC
UNIT
V
V
0.8
Input voltage
MAX
0.8
V
5.5
V
–24
–32
mA
24
32
48
64
5.5
0
10
VCC
10
–40
ns/V
µs/V
200
125
mA
85
°C
NOTE 3: All unused control inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report,
Implications of Slow or Floating CMOS Inputs, literature number SCBA004.
PRODUCT PREVIEW information concerns products in the formative or
design phase of development. Characteristic data and other
specifications are design goals. Texas Instruments reserves the right to
change or discontinue these products without notice.
4
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
SN54ALVTH16245, SN74ALVTH16245
2.5-V/3.3-V 16-BIT BUS TRANSCEIVERS
WITH 3-STATE OUTPUTS
SCES066G – JUNE 1996 – REVISED APRIL 2002
electrical characteristics over recommended operating free-air temperature range,
VCC = 2.5 V ± 0.2 V (unless otherwise noted)
PARAMETER
VIK
VOH
VCC = 2.3 V,
VCC = 2.3 V to 2.7 V,
II = –18 mA
IOH = –100 µA
3V
VCC = 2
2.3
IOH = –6 mA
IOH = –8 mA
VCC = 2.3 V to 2.7 V,
VOL
VCC = 2
2.3
3V
Control inputs
VCC = 2.7 V,
VCC = 0 or 2.7 V,
A or B ports
VCC = 2.7 V
II
Ioff
IBHL‡
IBHH§
IBHLO¶
IBHHO#
IEX||
SN54ALVTH16245
MIN TYP†
MAX
TEST CONDITIONS
SN74ALVTH16245
MIN TYP†
MAX
–1.2
VCC–0.2
1.8
–1.2
V
1.8
IOL = 100 µA
IOL = 6 mA
0.2
0.2
0.4
IOL = 8 mA
IOL = 18 mA
0.4
V
0.5
IOL = 24 mA
VI = VCC or GND
0.5
±1
±1
VI = 5.5 V
VI = 5.5 V
10
10
20
20
VI = VCC
VI = 0
1
1
–5
–5
VCC = 0,
VCC = 2.3 V,
VI or VO = 0 to 4.5 V
VI = 0.7 V
VCC = 2.3 V,
VCC = 2.7 V,
VI = 1.7 V
VI = 0 to VCC
VCC = 2.7 V,
VCC = 2.3 V,
VI = 0 to VCC
VO = 5.5 V
±100
µA
µA
115
115
µA
–10
–10
µA
300
300
µA
–300
–300
µA
125
125
µA
±100
±100
µA
IOZ(PU/PD)k
VCC = 2.7 V,
IO = 0,
VI = VCC or GND
Outputs high
0.04
0.1
0.04
0.1
ICC
Outputs low
2.3
4.5
2.3
4.5
Outputs disabled
0.04
0.1
0.04
0.1
VCC = 2.5 V,
VCC = 2.5 V,
VI = 2.5 V or 0
VO = 2.5 V or 0
3.5
3.5
8
8
Cio
V
VCC–0.2
VCC ≤ 1.2 V, VO = 0.5 V to VCC,
VI = GND or VCC, OE = don’t care
Ci
UNIT
mA
pF
pF
† All typical values are at VCC = 2.5 V, TA = 25°C.
‡ The bus-hold circuit can sink at least the minimum low sustaining current at VIL max. IBHL should be measured after lowering VIN to GND and
then raising it to VIL max.
§ The bus-hold circuit can source at least the minimum high sustaining current at VIH min. IBHH should be measured after raising VIN to VCC and
then lowering it to VIH min.
¶ An external driver must source at least IBHLO to switch this node from low to high.
# An external driver must sink at least IBHHO to switch this node from high to low.
|| Current into an output in the high state when VO > VCC
k High-impedance state during power up or power down
PRODUCT PREVIEW information concerns products in the formative or
design phase of development. Characteristic data and other
specifications are design goals. Texas Instruments reserves the right to
change or discontinue these products without notice.
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
5
SN54ALVTH16245, SN74ALVTH16245
2.5-V/3.3-V 16-BIT BUS TRANSCEIVERS
WITH 3-STATE OUTPUTS
SCES066G – JUNE 1996 – REVISED APRIL 2002
electrical characteristics over recommended operating free-air temperature range,
VCC = 3.3 V ± 0.3 V (unless otherwise noted)
PARAMETER
VIK
VOH
VCC = 3 V,
VCC = 3 V to 3.6 V,
II = –18 mA
IOH = –100 µA
VCC = 3 V
IOH = –24 mA
IOH = –32 mA
VCC = 3 V to 3.6 V,
VOL
VCC = 3 V
Control inputs
Ioff
IBHL‡
IBHH§
IBHLO¶
IBHHO#
IEX||
IOZ(PU/PD)k
ICC
2
IOL = 100 µA
IOL = 16 mA
0.2
IOL = 24 mA
IOL = 32 mA
0.5
IOL = 48 mA
IOL = 64 mA
0.55
0.5
V
0.55
±1
±1
10
10
20
20
1
1
VI = 0
VI or VO = 0 to 4.5 V
–5
VI = 0.8 V
VI = 2 V
VI = 0 to VCC
VI = 0 to VCC
75
µA
–75
–75
µA
500
500
µA
Outputs high
Outputs low
Outputs disabled
Ci
VCC = 3.3 V,
VCC = 3.3 V,
VI = 3.3 V or 0
VO = 3.3 V or 0
µA
–500
0.07
VCC = 3 V to 3.6 V, One input at VCC – 0.6 V,
Other inputs at VCC or GND
µA
75
–500
∆ICCh
µA
–5
±100
VO = 5.5 V
VCC ≤ 1.2 V, VO = 0.5 V to VCC,
VI = GND or VCC, OE = don’t care
VCC = 3.6 V,
IO = 0,
VI = VCC or GND
0.2
0.4
VCC = 3.6 V
VCC = 3.6 V,
VCC = 3 V,
V
V
VI = 5.5 V
VI = VCC
VCC = 3 V,
VCC = 3.6 V,
–1.2
UNIT
VCC–0.2
VI = VCC or GND
VI = 5.5 V
VCC = 0,
VCC = 3 V,
SN74ALVTH16245
MIN TYP†
MAX
–1.2
VCC–0.2
2
VCC = 3.6 V,
VCC = 0 or 3.6 V,
II
A or B ports
SN54ALVTH16245
MIN TYP†
MAX
TEST CONDITIONS
125
125
µA
±100
±100
µA
0.1
0.07
0.1
3.2
5
3.2
5
0.07
0.1
0.07
0.1
0.2
3.5
0.2
3.5
mA
mA
pF
Cio
8
8
pF
† All typical values are at VCC = 3.3 V, TA = 25°C.
‡ The bus-hold circuit can sink at least the minimum low sustaining current at VIL max. IBHL should be measured after lowering VIN to GND and
then raising it to VIL max.
§ The bus-hold circuit can source at least the minimum high sustaining current at VIH min. IBHH should be measured after raising VIN to VCC and
then lowering it to VIH min.
¶ An external driver must source at least IBHLO to switch this node from low to high.
# An external driver must sink at least IBHHO to switch this node from high to low.
|| Current into an output in the high state when VO > VCC
k High-impedance state during power up or power down
h This is the increase in supply current for each input that is at the specified TTL voltage level rather than VCC or GND.
PRODUCT PREVIEW information concerns products in the formative or
design phase of development. Characteristic data and other
specifications are design goals. Texas Instruments reserves the right to
change or discontinue these products without notice.
6
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
SN54ALVTH16245, SN74ALVTH16245
2.5-V/3.3-V 16-BIT BUS TRANSCEIVERS
WITH 3-STATE OUTPUTS
SCES066G – JUNE 1996 – REVISED APRIL 2002
switching characteristics over recommended operating free-air temperature range, CL = 30 pF,
VCC = 2.5 V ± 0.2 V (unless otherwise noted) (see Figure 1)
PARAMETER
FROM
(INPUT)
TO
(OUTPUT)
tPLH
tPHL
A or B
B or A
tPZH
tPZL
OE
A or B
OE
A or B
tPHZ
tPLZ
SN54ALVTH16245
SN74ALVTH16245
MIN
MAX
MIN
MAX
0.5
3.6
0.5
3.6
0.5
3.4
0.5
3.4
1.5
4.9
1.5
4.9
1
4
1
4
1.5
4.9
1.5
4.9
1
4.2
1
4.2
UNIT
ns
ns
ns
switching characteristics over recommended operating free-air temperature range, CL = 50 pF,
VCC = 3.3 V ± 0.3 V (unless otherwise noted) (see Figure 1)
PARAMETER
FROM
(INPUT)
TO
(OUTPUT)
tPLH
tPHL
A or B
B or A
tPZH
tPZL
OE
A or B
OE
A or B
tPHZ
tPLZ
SN54ALVTH16245
SN74ALVTH16245
MIN
MAX
MIN
MAX
0.5
3.1
0.5
3.1
0.5
2.9
0.5
2.9
1
4.2
1
4.2
1
3.5
1
3.5
1.5
5.3
1.5
5.3
1.5
5
1.5
5
UNIT
ns
ns
ns
skew
tps (pin or transition skew), tps = |tPHL – tPHL|
tpsmax
VCC = 2.5 V
TYP
VCC = 3.3 V
TYP
UNIT
438
118
ps
tOST = |tpΦm – tpΦn|, where Φ is any edge transition (high to low or low to high) measured between any two
outputs (m or n) within any given device (see Note 4)
tOST
VCC = 2.5 V
TYP
VCC = 3.3 V
TYP
A–B
227
248
B–A
223
243
UNIT
ps
NOTE 4: One output switching, TA = 25°C
tOSHL/tOSLH (common edge skew), tOSHL = |tPHLmax – tPHLmin| (output skew for low-to-high transitions), and
tOSLH = |tPLHmax – tPLHmin| (output skew for high-to-low transitions) (see Note 4)
tOSLH
tOSHL
A B
A–B
tOSLH
tOSHL
B A
B–A
VCC = 2.5 V
TYP
VCC = 3.3 V
TYP
210
145
243
351
207
136
238
350
UNIT
ps
ps
NOTE 4: One output switching, TA = 25°C
PRODUCT PREVIEW information concerns products in the formative or
design phase of development. Characteristic data and other
specifications are design goals. Texas Instruments reserves the right to
change or discontinue these products without notice.
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
7
SN54ALVTH16245, SN74ALVTH16245
2.5-V/3.3-V 16-BIT BUS TRANSCEIVERS
WITH 3-STATE OUTPUTS
SCES066G – JUNE 1996 – REVISED APRIL 2002
PARAMETER MEASUREMENT INFORMATION
2 × VCC
S1
RL
From Output
Under Test
Open
GND
CL
(see Note A)
RL
TEST
S1
tPLH/tPHL
tPLZ/tPZL
tPHZ/tPZH
Open
2 × VCC
GND
CL
30 pF
50 pF
VCC
2.5 V ±0.2 V
3.3 V ±0.3 V
LOAD CIRCUIT
V∆
0.15 V
0.3 V
RL
500 Ω
500 Ω
VCC
Timing Input
VCC/2
0V
tw
tsu
VCC
VCC/2
Input
VCC/2
th
VCC
VCC/2
Data Input
VCC/2
0V
0V
VOLTAGE WAVEFORMS
PULSE DURATION
VOLTAGE WAVEFORMS
SETUP AND HOLD TIMES
VCC
VCC/2
Input
VCC/2
0V
tPHL
tPLH
Output
VCC/2
VOL
tPHL
VCC/2
tPLZ
VCC
VCC/2
VOL
VOLTAGE WAVEFORMS
PROPAGATION DELAY TIMES
INVERTING AND NONINVERTING OUTPUTS
Output
Waveform 2
S1 at GND
(see Note B)
VOL + V∆
VOL
tPHZ
tPZH
VCC/2
VCC/2
0V
Output
Waveform 1
S1 at 2 × VCC
(see Note B)
tPLH
VOH
Output
VCC/2
tPZL
VOH
VCC/2
VCC
Output
Control
VCC/2
VOH – V∆
VOH
≈0 V
VOLTAGE WAVEFORMS
ENABLE AND DISABLE TIMES
LOW- AND HIGH-LEVEL ENABLING
NOTES: A. CL includes probe and jig capacitance.
B. Waveform 1 is for an output with internal conditions such that the output is low except when disabled by the output control.
Waveform 2 is for an output with internal conditions such that the output is high except when disabled by the output control.
C. All input pulses are supplied by generators having the following characteristics: PRR ≤ 10 MHz, ZO = 50 Ω, tr ≤ 2 ns, tf ≤ 2 ns.
D. The outputs are measured one at a time with one transition per measurement.
E. tPLZ and tPHZ are the same as tdis.
F. tPZL and tPZH are the same as ten.
G. tPLH and tPHL are the same as tpd.
H. All parameters and waveforms are not applicable to all devices.
Figure 1. Load Circuit and Voltage Waveforms
8
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
PACKAGE OPTION ADDENDUM
www.ti.com
6-Dec-2006
PACKAGING INFORMATION
Orderable Device
Status (1)
Package
Type
Package
Drawing
Pins Package Eco Plan (2)
Qty
74ALVTH16245DLG4
ACTIVE
SSOP
DL
48
74ALVTH16245DLRG4
ACTIVE
SSOP
DL
74ALVTH16245GRE4
ACTIVE
TSSOP
74ALVTH16245VRE4
ACTIVE
74ALVTH16245ZQLR
ACTIVE
SN74ALVTH16245DL
ACTIVE
SN74ALVTH16245DLR
25
Lead/Ball Finish
MSL Peak Temp (3)
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
48
1000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
DGG
48
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
TVSOP
DGV
48
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
BGA MI
CROSTA
R JUNI
OR
ZQL
56
1000 Green (RoHS &
no Sb/Br)
SNAGCU
Level-1-260C-UNLIM
SSOP
DL
48
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
ACTIVE
SSOP
DL
48
1000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74ALVTH16245GR
ACTIVE
TSSOP
DGG
48
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74ALVTH16245KR
ACTIVE
BGA MI
CROSTA
R JUNI
OR
GQL
56
1000
SNPB
Level-1-240C-UNLIM
SN74ALVTH16245VR
ACTIVE
TVSOP
DGV
48
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
25
TBD
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
6-Dec-2006
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 2
MECHANICAL DATA
MPDS006C – FEBRUARY 1996 – REVISED AUGUST 2000
DGV (R-PDSO-G**)
PLASTIC SMALL-OUTLINE
24 PINS SHOWN
0,40
0,23
0,13
24
13
0,07 M
0,16 NOM
4,50
4,30
6,60
6,20
Gage Plane
0,25
0°–8°
1
0,75
0,50
12
A
Seating Plane
0,15
0,05
1,20 MAX
PINS **
0,08
14
16
20
24
38
48
56
A MAX
3,70
3,70
5,10
5,10
7,90
9,80
11,40
A MIN
3,50
3,50
4,90
4,90
7,70
9,60
11,20
DIM
4073251/E 08/00
NOTES: A.
B.
C.
D.
All linear dimensions are in millimeters.
This drawing is subject to change without notice.
Body dimensions do not include mold flash or protrusion, not to exceed 0,15 per side.
Falls within JEDEC: 24/48 Pins – MO-153
14/16/20/56 Pins – MO-194
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
MECHANICAL DATA
MSSO001C – JANUARY 1995 – REVISED DECEMBER 2001
DL (R-PDSO-G**)
PLASTIC SMALL-OUTLINE PACKAGE
48 PINS SHOWN
0.025 (0,635)
0.0135 (0,343)
0.008 (0,203)
48
0.005 (0,13) M
25
0.010 (0,25)
0.005 (0,13)
0.299 (7,59)
0.291 (7,39)
0.420 (10,67)
0.395 (10,03)
Gage Plane
0.010 (0,25)
1
0°–ā8°
24
0.040 (1,02)
A
0.020 (0,51)
Seating Plane
0.110 (2,79) MAX
0.004 (0,10)
0.008 (0,20) MIN
PINS **
28
48
56
A MAX
0.380
(9,65)
0.630
(16,00)
0.730
(18,54)
A MIN
0.370
(9,40)
0.620
(15,75)
0.720
(18,29)
DIM
4040048 / E 12/01
NOTES: A.
B.
C.
D.
All linear dimensions are in inches (millimeters).
This drawing is subject to change without notice.
Body dimensions do not include mold flash or protrusion not to exceed 0.006 (0,15).
Falls within JEDEC MO-118
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
MECHANICAL DATA
MTSS003D – JANUARY 1995 – REVISED JANUARY 1998
DGG (R-PDSO-G**)
PLASTIC SMALL-OUTLINE PACKAGE
48 PINS SHOWN
0,27
0,17
0,50
48
0,08 M
25
6,20
6,00
8,30
7,90
0,15 NOM
Gage Plane
1
0,25
24
0°– 8°
A
0,75
0,50
Seating Plane
0,15
0,05
1,20 MAX
PINS **
0,10
48
56
64
A MAX
12,60
14,10
17,10
A MIN
12,40
13,90
16,90
DIM
4040078 / F 12/97
NOTES: A.
B.
C.
D.
All linear dimensions are in millimeters.
This drawing is subject to change without notice.
Body dimensions do not include mold protrusion not to exceed 0,15.
Falls within JEDEC MO-153
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications,
enhancements, improvements, and other changes to its products and services at any time and to discontinue
any product or service without notice. Customers should obtain the latest relevant information before placing
orders and should verify that such information is current and complete. All products are sold subject to TI’s terms
and conditions of sale supplied at the time of order acknowledgment.
TI warrants performance of its hardware products to the specifications applicable at the time of sale in
accordance with TI’s standard warranty. Testing and other quality control techniques are used to the extent TI
deems necessary to support this warranty. Except where mandated by government requirements, testing of all
parameters of each product is not necessarily performed.
TI assumes no liability for applications assistance or customer product design. Customers are responsible for
their products and applications using TI components. To minimize the risks associated with customer products
and applications, customers should provide adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right,
copyright, mask work right, or other TI intellectual property right relating to any combination, machine, or process
in which TI products or services are used. Information published by TI regarding third-party products or services
does not constitute a license from TI to use such products or services or a warranty or endorsement thereof.
Use of such information may require a license from a third party under the patents or other intellectual property
of the third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of information in TI data books or data sheets is permissible only if reproduction is without
alteration and is accompanied by all associated warranties, conditions, limitations, and notices. Reproduction
of this information with alteration is an unfair and deceptive business practice. TI is not responsible or liable for
such altered documentation.
Resale of TI products or services with statements different from or beyond the parameters stated by TI for that
product or service voids all express and any implied warranties for the associated TI product or service and
is an unfair and deceptive business practice. TI is not responsible or liable for any such statements.
Following are URLs where you can obtain information on other Texas Instruments products and application
solutions:
Products
Applications
Amplifiers
amplifier.ti.com
Audio
www.ti.com/audio
Data Converters
dataconverter.ti.com
Automotive
www.ti.com/automotive
DSP
dsp.ti.com
Broadband
www.ti.com/broadband
Interface
interface.ti.com
Digital Control
www.ti.com/digitalcontrol
Logic
logic.ti.com
Military
www.ti.com/military
Power Mgmt
power.ti.com
Optical Networking
www.ti.com/opticalnetwork
Microcontrollers
microcontroller.ti.com
Security
www.ti.com/security
Low Power Wireless www.ti.com/lpw
Mailing Address:
Telephony
www.ti.com/telephony
Video & Imaging
www.ti.com/video
Wireless
www.ti.com/wireless
Texas Instruments
Post Office Box 655303 Dallas, Texas 75265
Copyright  2006, Texas Instruments Incorporated
PACKAGE OPTION ADDENDUM
www.ti.com
30-Mar-2007
PACKAGING INFORMATION
Orderable Device
Status (1)
Package
Type
Package
Drawing
Pins Package Eco Plan (2)
Qty
74ALVTH16245DLG4
ACTIVE
SSOP
DL
48
74ALVTH16245DLRG4
ACTIVE
SSOP
DL
74ALVTH16245GRE4
ACTIVE
TSSOP
74ALVTH16245VRE4
ACTIVE
74ALVTH16245ZQLR
ACTIVE
SN74ALVTH16245DL
ACTIVE
SN74ALVTH16245DLR
25
Lead/Ball Finish
MSL Peak Temp (3)
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
48
1000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
DGG
48
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
TVSOP
DGV
48
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
BGA MI
CROSTA
R JUNI
OR
ZQL
56
1000 Green (RoHS &
no Sb/Br)
SNAGCU
Level-1-260C-UNLIM
SSOP
DL
48
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
ACTIVE
SSOP
DL
48
1000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74ALVTH16245GR
ACTIVE
TSSOP
DGG
48
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74ALVTH16245KR
NRND
BGA MI
CROSTA
R JUNI
OR
GQL
56
1000
SNPB
Level-1-240C-UNLIM
SN74ALVTH16245VR
ACTIVE
TVSOP
DGV
48
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
25
TBD
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
30-Mar-2007
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 2
MECHANICAL DATA
MPDS006C – FEBRUARY 1996 – REVISED AUGUST 2000
DGV (R-PDSO-G**)
PLASTIC SMALL-OUTLINE
24 PINS SHOWN
0,40
0,23
0,13
24
13
0,07 M
0,16 NOM
4,50
4,30
6,60
6,20
Gage Plane
0,25
0°–8°
1
0,75
0,50
12
A
Seating Plane
0,15
0,05
1,20 MAX
PINS **
0,08
14
16
20
24
38
48
56
A MAX
3,70
3,70
5,10
5,10
7,90
9,80
11,40
A MIN
3,50
3,50
4,90
4,90
7,70
9,60
11,20
DIM
4073251/E 08/00
NOTES: A.
B.
C.
D.
All linear dimensions are in millimeters.
This drawing is subject to change without notice.
Body dimensions do not include mold flash or protrusion, not to exceed 0,15 per side.
Falls within JEDEC: 24/48 Pins – MO-153
14/16/20/56 Pins – MO-194
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
MECHANICAL DATA
MSSO001C – JANUARY 1995 – REVISED DECEMBER 2001
DL (R-PDSO-G**)
PLASTIC SMALL-OUTLINE PACKAGE
48 PINS SHOWN
0.025 (0,635)
0.0135 (0,343)
0.008 (0,203)
48
0.005 (0,13) M
25
0.010 (0,25)
0.005 (0,13)
0.299 (7,59)
0.291 (7,39)
0.420 (10,67)
0.395 (10,03)
Gage Plane
0.010 (0,25)
1
0°–ā8°
24
0.040 (1,02)
A
0.020 (0,51)
Seating Plane
0.110 (2,79) MAX
0.004 (0,10)
0.008 (0,20) MIN
PINS **
28
48
56
A MAX
0.380
(9,65)
0.630
(16,00)
0.730
(18,54)
A MIN
0.370
(9,40)
0.620
(15,75)
0.720
(18,29)
DIM
4040048 / E 12/01
NOTES: A.
B.
C.
D.
All linear dimensions are in inches (millimeters).
This drawing is subject to change without notice.
Body dimensions do not include mold flash or protrusion not to exceed 0.006 (0,15).
Falls within JEDEC MO-118
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
MECHANICAL DATA
MTSS003D – JANUARY 1995 – REVISED JANUARY 1998
DGG (R-PDSO-G**)
PLASTIC SMALL-OUTLINE PACKAGE
48 PINS SHOWN
0,27
0,17
0,50
48
0,08 M
25
6,20
6,00
8,30
7,90
0,15 NOM
Gage Plane
1
0,25
24
0°– 8°
A
0,75
0,50
Seating Plane
0,15
0,05
1,20 MAX
PINS **
0,10
48
56
64
A MAX
12,60
14,10
17,10
A MIN
12,40
13,90
16,90
DIM
4040078 / F 12/97
NOTES: A.
B.
C.
D.
All linear dimensions are in millimeters.
This drawing is subject to change without notice.
Body dimensions do not include mold protrusion not to exceed 0,15.
Falls within JEDEC MO-153
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications,
enhancements, improvements, and other changes to its products and services at any time and to
discontinue any product or service without notice. Customers should obtain the latest relevant information
before placing orders and should verify that such information is current and complete. All products are sold
subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.
TI warrants performance of its hardware products to the specifications applicable at the time of sale in
accordance with TI’s standard warranty. Testing and other quality control techniques are used to the extent
TI deems necessary to support this warranty. Except where mandated by government requirements, testing
of all parameters of each product is not necessarily performed.
TI assumes no liability for applications assistance or customer product design. Customers are responsible
for their products and applications using TI components. To minimize the risks associated with customer
products and applications, customers should provide adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any TI patent
right, copyright, mask work right, or other TI intellectual property right relating to any combination, machine,
or process in which TI products or services are used. Information published by TI regarding third-party
products or services does not constitute a license from TI to use such products or services or a warranty or
endorsement thereof. Use of such information may require a license from a third party under the patents or
other intellectual property of the third party, or a license from TI under the patents or other intellectual
property of TI.
Reproduction of information in TI data books or data sheets is permissible only if reproduction is without
alteration and is accompanied by all associated warranties, conditions, limitations, and notices.
Reproduction of this information with alteration is an unfair and deceptive business practice. TI is not
responsible or liable for such altered documentation.
Resale of TI products or services with statements different from or beyond the parameters stated by TI for
that product or service voids all express and any implied warranties for the associated TI product or service
and is an unfair and deceptive business practice. TI is not responsible or liable for any such statements.
Following are URLs where you can obtain information on other Texas Instruments products and application
solutions:
Products
Applications
Amplifiers
amplifier.ti.com
Audio
www.ti.com/audio
Data Converters
dataconverter.ti.com
Automotive
www.ti.com/automotive
DSP
dsp.ti.com
Broadband
www.ti.com/broadband
Interface
interface.ti.com
Digital Control
www.ti.com/digitalcontrol
Logic
logic.ti.com
Military
www.ti.com/military
Power Mgmt
power.ti.com
Optical Networking
www.ti.com/opticalnetwork
Microcontrollers
microcontroller.ti.com
Security
www.ti.com/security
Low Power Wireless
www.ti.com/lpw
Telephony
www.ti.com/telephony
Mailing Address:
Video & Imaging
www.ti.com/video
Wireless
www.ti.com/wireless
Texas Instruments
Post Office Box 655303 Dallas, Texas 75265
Copyright © 2007, Texas Instruments Incorporated