STMICROELECTRONICS 74LX1G07_08

74LX1G07
Single buffer/driver with open drain
Features
■
5 V tolerant inputs
■
High speed: tPD = 4.2 ns (max.) at VCC = 3.3 V
■
Low power dissipation:
– ICC = 1 μA (max.) at TA = 25 °C
■
Power down protection on inputs and outputs
■
Operating voltage range:
– VCC (opr) = 1.65 to 5.5 V
■
Latch-up performance exceeds 300 mA
(JESD 17)
■
ESD performance
– 2000-V human body model
(JESD 22 A114-A)
– 200-V machine model
(JESD 22 A115-A)
– 1000-V charge device model
(JESD 22 C101)
Applications
■
Mobile phones
SOT23-5L
SOT323-5L
Flip-chip 4
Description
The 74LX1G07 is a low voltage CMOS single
buffer/driver (open drain) fabricated with submicron silicon gate and double-layer metal wiring
C2MOS technology.
The internal circuit composed of 2 stages
including buffer output, provides high noise
immunity and stable output.
Power down protection is provided on input and 0
to 7 V can be accepted on input with no regards
to the supply voltage. This device can be used to
interface 5 to 3 V.
Table 1.
April 2008
Device summary
Order code
Package
Packaging
74LX1G07STR
SOT23-5L
Tape and reel
74LX1G07CTR
SOT323-5L
Tape and reel
74LX1G07BJR
Flip-chip 4
Tape and reel
Rev 9
1/20
www.st.com
20
Contents
74LX1G07
Contents
1
Pin connection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
2
Maximum rating . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
2.1
Recommended operating conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
3
Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
4
Package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
5
Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
2/20
74LX1G07
1
Pin connection
Pin connection
Figure 1.
Pin connection and IEC symbols
V CC
1Y
4
5
1
NC
2
GND
2
3
1Y
1A
1
4
VCC
1A
1
4
VCC
GND
2
3
1Y
3
1A GND
Flip-chip 4
Flip-chip 4
SOT package
Top view
Top view
Bottom view
CS00012
Table 2.
Pin assignments
Pin number
Symbol
Name and function
Flip-chip 4
SOT
−
1
NC
No connection
1
2
1A
Data input
3
4
1Y
Data output
2
3
GND
Ground (0V)
4
5
VCC
Positive supply voltage
Table 3.
Truth table
A
Y
L
L
H
Z
Z: High impedance
3/20
Pin connection
Figure 2.
74LX1G07
Input and output equivalent circuit
V
CC
Overvoltage
control
Output
Input
ESD
protection
GND
ESD
protection
GND
GND
GND
GND
CS08973
4/20
74LX1G07
2
Maximum rating
Maximum rating
Stressing the device above the rating listed in the “Absolute maximum ratings” table may
cause permanent damage to the device. These are stress ratings only and operation of the
device at these or any other conditions above those indicated in the operating sections of
this specification is not implied. Exposure to absolute maximum rating conditions for
extended periods may affect device reliability. Refer also to the STMicroelectronics SURE
Program and other relevant quality documents.
Table 4.
Absolute maximum ratings
Symbol
Value
Unit
Supply voltage
-0.5 to +7.0
V
VI
DC input voltage
-0.5 to +7.0
V
VO
DC output voltage (VCC = 0 V)
-0.5 to +7.0
V
VO
DC output voltage (high or low state)
-0.5 to VCC + 0.5
V
IIK
DC input diode current
- 50
mA
IOK
DC output diode current
- 50
mA
IO
DC output current
± 50
mA
ICC
DC supply current per supply pin
± 100
mA
IGND
DC ground current per supply pin
± 100
mA
Tstg
Storage temperature
-65 to +150
°C
300
°C
VCC
TL
Parameter
Lead temperature (10 sec)
5/20
Maximum rating
2.1
74LX1G07
Recommended operating conditions
Table 5.
Recommended operating conditions
Symbol
VCC
6/20
Parameter
Supply voltage
Value
Unit
1.65 to 5.5
V
VI
Input voltage
0 to 5.5
V
VO
Output voltage (VCC = 0 V)
0 to 5.5
V
VO
Output voltage (high or low state)
0 to VCC
V
IOL
High or low level output current (VCC = 4.5 to 5.5 V)
+ 32
mA
IOL
High or low level output current (VCC = 3.0 to 3.6 V)
+24
mA
IOL
High or low level output current (VCC = 2.7 to 3.0 V)
+12
mA
IOL
High or low level output current (VCC = 2.3 to 2.7 V)
+8
mA
IOL
High or low level output current (VCC = 1.65 to 2.3 V)
+4
mA
Top
Operating temperature
-40 to 85
°C
dt/dv
Input rise and fall time
0 to 10
ns/V
74LX1G07
3
Electrical characteristics
Electrical characteristics
Table 6.
DC specifications
Test condition
Symbol
VIH
VIL
Parameter
High level input
voltage
Low level input
voltage
Low level output
voltage
II
High impedance
output leakage
current
Input leakage
current
Ioff
Power off leakage
current
ICC
Quiescent supply
current
Min
1.65 − 1.95
0.65 VCC
2.3 − 2.7
0.7 VCC
3.0 − 5.5
0.7 VCC
Unit
Max
V
1.65 − 1.95
0.35 VCC
2.3 − 2.7
0.3 VCC
3.0 − 5.5
0.3 VCC
V
IO = 100 μA
0.1
1.65
IO = 4 mA
0.45
2.3
IO = 8 mA
0.3
IO = 16 mA
0.4
IO = 24 mA
0.55
4.5
IO = 32 mA
0.55
3.6
VI = 5.5 V
±10
μA
VI = 0 −5.5 V
±5
μA
0
VI or VO = 5.5 V
10
μA
1.65 − 5.5
VI = VCC or GND
10
3.6
VI or VO = 3.6 to
5.5 V
±10
3.0
IOZ
-40 to 85 °C
VCC
(V)
1.65 − 4.5
VOL
Value
1.65 − 5.5
V
μA
7/20
Electrical characteristics
Table 7.
74LX1G07
AC electrical characteristics
Test conditions
Symbol
tPLZ
tPZL
Parameter
Propagation delay
time
Propagation delay
time
VCC
(V)
CL
(pF)
R1
(Ω)
ts = tr
(ns)
1.65 − 1.95
30
1000
2.3 − 2.7
30
2.7
-40 to 85 °C
Min
Max
2.0
1.8
8.3
500
2.0
1.2
5.5
50
500
2.5
1
5
3.0 − 3.6
50
500
2.5
0.8
4.2
4.5 − 5.5
50
500
2.5
0.5
3.5
1.65 − 1.95
30
1000
2.0
1.8
8.3
2.3 − 2.7
30
500
2.0
1.2
5.5
2.7
50
500
2.5
1
5
3.0 − 3.6
50
500
2.5
0.8
4.2
−5.5
50
500
2.5
0.5
3.5
4.5
Table 8.
Value
CIN
Parameter
ns
Value
TA = 25 °C
VCC
(V)
Min
Typ
Unit
Max
Input capacitance
3.3
VIN = 0 or VCC
2.5
pF
COUT
Output capacitance
3.3
VIN = 0 or VCC
4
pF
CPD
Power dissipation
capacitance(1)
8
1.8
2.5
3.3
fIN = 10 MHz
8
8
1. CPD is defined as the value of the IC’s internal equivalent capacitance which is calculated from the
operating current consumption without load. (Refer to test circuit). Average operating current can be
obtained by the following equation: ICC(opr) = CPD x VCC x fIN + ICC
8/20
ns
Capacitive characteristics
Test conditions
Symbol
Unit
pF
74LX1G07
Electrical characteristics
Figure 3.
Test circuit
VCC
VCC
R1
Pulse generator
D.U.T
CL
RT
CS07201
Table 9.
Test circuit and waveform symbol value
VCC
Symbol
1.65
− 1.95 V
2.3 − 2.7 V
2.7 − 5.5 V
CL
30 pF
30 pF/ 50 pF
50 pF
R1
1000 Ω
500 Ω
500 Ω
VIH
VCC
VCC
VCC
VM
VCC/2
VCC/2
VCC/2
tr = tf
< 2.0 ns
< 2.0 ns
< 2.5 ns
Figure 4.
Waveform: propagation delay (f = 1 MHz; 50% duty cycle)
9/20
Package mechanical data
4
74LX1G07
Package mechanical data
In order to meet environmental requirements, ST offers these devices in ECOPACK®
packages. These packages have a Lead-free second level interconnect. The category of
second level interconnect is marked on the package and on the inner box label, in
compliance with JEDEC standard JESD97. The maximum ratings related to soldering
conditions are also marked on the inner box label. ECOPACK is an ST trademark.
ECOPACK specifications are available at: www.st.com.
Figure 5.
SOT23-5L package outline
.
7049676C
Table 10.
SOT23-5L mechanical data
millimeters
mils
Symbol
Typ
Max
Typ
Min
Max
A
0.90
1.45
35.4
57.1
A1
0.00
0.10
0.0
3.9
A2
0.90
1.30
35.4
51.2
b
0.35
0.50
13.7
19.7
C
0.09
0.20
3.5
7.8
D
2.80
3.00
110.2
118.1
E
1.50
1.75
59.0
68.8
e
10/20
Min
0.95
37.4
H
2.60
3.00
102.3
118.1
L
0.10
0.60
3.9
23.6
74LX1G07
Package mechanical data
Figure 6.
SOT323-5L package outline
Table 11.
SOT323-5L mechanical data
millimeters
mils
Symbol
Typ
Min
Max
Typ
Min
Max
A
0.80
1.10
31.5
43.3
A1
0.00
0.10
0.0
3.9
A2
0.80
1.00
31.5
39.4
b
0.15
0.30
5.9
11.8
C
0.10
0.18
3.9
7.1
D
1.80
2.20
70.9
86.6
E
1.80
2.20
70.9
94.5
E1
1.15
1.35
45.3
53.1
e
0.65
25.6
e1
1.3
51.2
L
0.10
0.30
3.9
11.8
11/20
Package mechanical data
Figure 7.
12/20
Flip-chip 4 package outline
74LX1G07
74LX1G07
Package mechanical data
Table 12.
Flip-chip 4 mechanical data
millimeters
Symbol
Min
Typ
Max
A
0.535
0.58
0.625
A1
0.18
0.205
0.23
A2
0.355
0.375
0.395
b
0.215
0.255
0.295
D
0.84
0.87
0.9
D1
E
0.5
0.84
0.87
E1
0.5
SD
0.25
SE
0.25
f
ccc
0.175
0.185
0.9
0.195
0.080
13/20
Package mechanical data
Figure 8.
14/20
Flip-chip 4 recommended footprint
74LX1G07
74LX1G07
Package mechanical data
Figure 9.
SOT23-xL tape and reel
Table 13.
SOT23-xL tape and reel mechanical data
millimeters
inches
Symbol
Typ
Min
A
Max
Typ
Min
180
13.0
7.086
C
12.8
D
20.2
0.795
N
60
2.362
T
13.2
Max
0.504
0.512
14.4
0.519
0.567
Ao
3.13
3.23
3.33
0.123
0.127
0.131
Bo
3.07
3.17
3.27
0.120
0.124
0.128
Ko
1.27
1.37
1.47
0.050
0.054
0.058
Po
3.9
4.0
4.1
0.153
0.157
0.161
P
3.9
4.0
4.1
0.153
0.157
0.161
15/20
Package mechanical data
74LX1G07
Figure 10. SOT323-xL tape and reel
1. Drawing not to scale.
Table 14.
SOT323-xL tape and reel mechanical data
millimeters
inches
Symbol
Typ
Min
Max
Typ
Min
Max
A
175
180
185
6.889
7.086
7.283
C
12.8
13
13.2
0.504
0.512
0.519
D
20.2
N
59.5
0.795
60
T
16/20
60.5
2.362
14.4
0.567
Ao
2.25
0.088
Bo
2.7
0.106
Ko
1.2
0.047
Po
3.9
4
4.1
0.153
0.157
0.161
P
3.8
4
4.2
0.149
0.157
0.165
74LX1G07
Package mechanical data
Figure 11. Flip-chip 4 reel information - back side
Figure 12. Flip-chip 4 reel information - front side
17/20
Package mechanical data
74LX1G07
Figure 13. Flip-chip 4 carrier tape information
Figure 14. Flip-chip 4 tape orientation
Tape and reel
A1
- Top view of package
- Balls underneath
- Pin A1 marked from target spec
18/20
direction of flow
74LX1G07
5
Revision history
Revision history
Table 15.
Document revision history
Date
Revision
Changes
04-Sept-2004
4
Document change.
03-May-2006
5
Data reel updating.
17-Jan-2008
6
Document restructured and converted to new ST template.
Added 74LX1G07BJR and related package information.
29-Jan-2008
7
Flip-Chip 4 replaced with Flip-chip 4 and updated Table 12 on
page 13.
21-Feb-2008
8
Replaced Flip-Chip 4 package name with Flip-chip 4, latch-up and
ESD performance among the specifications in the cover page and
updated Table 6 on page 7, Table 8 on page 8, and Table 12 on
page 13, replaced Figure 13 on page 18 and Figure 14 on page 18
23-Apr-2008
9
Modified: Table 12 on page 13 and Figure 13 on page 18.
19/20
74LX1G07
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20/20