!
SLUS459B – OCTOBER 2000 – REVISED APRIL 2001
D SCSI SPI-2, SPI-3, Ultra2, Ultra3, Ultra160,
D
D
D
D
REG
SGND
PGND
LVD
L10–
L10+
L11–
L11+
L22+
L22–
1
64 63 62 61 60 59 58 57 56 55 54 53 52 51 50 49
48
2
47
3
46
4
45
5
44
6
43
7
42
8
41
9
40
10
39
11
38
12
37
13
36
14
35
15
34
33
16
17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32
{DISCNCT1
{DISCNCT2
L21–
L21+
L20–
L20+
L19–
L19+
DIFSENS
DIFFB
L18–
L18+
L17–
L17+
L16–
L16+
L12+
L12–
L13+
L13–
L1+
L1–
L2+
L2–
L3+
L3–
L4+
L4–
L14+
L14–
L15+
L15–
D
PM PACKAGE
(TOP VIEW)
L24+
L24–
L23+
L23–
L9+
L9–
L8+
L8–
L7+
L7–
L6+
L6–
L5+
L5–
D
D
Ultra320 SCSI Compliance
Smallest Footprint
Lowest Channel
Capacitance, 2 pF
L25–
Less than 0.5-pF Capacitance
L25+
Differential Between Pairs
L26–
L26+
2.7 V to 5.25 V Operation
L27–
Differential Failsafe Bias
L27+
Built–in SPI-3 Mode
STRMPWR
Change/Filter Delay
PTRMPWR
64-Pin Low Profile QFP
{For the UCC5687, Pin 47 is DISCNCT1 and Pin 48 is DISCNCT2.
description
The UCC5686 is a twenty-seven line active terminator for low-voltage-differential (LVD) SCSI networks. This
LVD SCSI-only design allows the user to reach peak bus performance, while reducing system cost. The device
is designed as an active Y-terminator to improve the frequency response of the LVD SCSI Bus. Designed with
a 2-pF (typical) channel capacitance, the UCC5686 allows for minimal bus loading for a maximum number of
peripherals. With the UCC5686, the designer is able to comply with the Ultra2, Ultra3, Ultra160, and Ultra320
SCSI specifications. The UCC5686 also provides a much-needed system migration path for the ever improving
SCSI system standards.
This device is available in the 64-pin low-profile QFP package for ease of layout use.
Single-ended (SE) and high-voltage differential (HVD) SCSI drivers are not supported.
AVAILABLE OPTIONS
DISCONNECT
STATUS
TA
0°C to 70°C
REGULAR
PACKAGED DEVICES†
LOW PROFILE QFP
(PM)
UCC5686PM
REVERSE
UCC5687PM
† The PM package is available taped and reeled. Add TR suffix to
device type (e.g. UCC5686PMTR) to order quantities of 1000
devices per reel.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
Copyright 2000, Texas Instruments Incorporated
"#$%&'()"%# "* +,&&-#) (* %$ .,/0"+()"%# 1()-2
&%1,+)* +%#$%&' )% *.-+"$"+()"%#* .-& )3- )-&'* %$ -4(* #*)&,'-#)*
*)(#1(&1 5(&&(#)62 &%1,+)"%# .&%+-**"#7 1%-* #%) #-+-**(&"06 "#+0,1)-*)"#7 %$ (00 .(&('-)-&*2
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
1
!
SLUS459B – OCTOBER 2000 – REVISED APRIL 2001
block diagram
DIFSENS
40
–15mA ≤ ISOURCE ≤ –5mA
50 µA ≤ ISINK ≤ 200 µ A
*FOR THE UCC5687 PIN 47 IS DISCNCT1 AND PIN 48 IS DISCNCT2.
REF 1.3V
1.3V +/– 0.1V
2.15 V
DIFFB
HPD
+
39
100 ms TO
300 ms
DELAY/
FILTER
+
STRMPWR
7
PTRMPWR
8
*DISCNCT1
*DISCNCT2
48
47
12
0.6V
LVD
SE
125
REF
1.25V
L10
L1
SOURCE/SINK
REGULATOR
L27
L9
52
– +
+56mV
MODE
ALL SWITCHES
SE
LVD
HVD
DISCNCT
OPEN
DOWN
OPEN
OPEN
22
L1–
21
L1+
5
L27–
6
L27+
52
+ –
+56mV
125
52
– +
+56mV
52
+ –
+56mV
10
11
9
SGND
PGND
REG
UDG-00123
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)†‡
Input voltage VIN (STRMPWR, PTRMPWR) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 V
Signal line input voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0 V to 5 V
Regulator output current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0.75 A
Storage temperature range, Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –55°C to 150°C
Operating virtual junction temperature range, TJ . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –55°C to 150°C
Lead temperature (soldering, 10 seconds) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 300°C
† Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
‡ Unless otherwise indicated, voltages are reference to ground and currents are positive into and negative out of the specified terminals. Consult
Packaging Section of the Interface Products Data Book (TI Literature Number SLUD002) for thermal limitations and considerations of packages.
All voltages are referenced to GND.
2
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
!
SLUS459B – OCTOBER 2000 – REVISED APRIL 2001
electrical characteristics over recommended operating free-air temperature range,
xTRMPWR = 2.7 V to 5.25 V, TA = 0_C to 70_C, DISCNCT1 = DISCNCT2 = 0 V for UCC5686,
DISCNCT1 = DISCNCT2 = open for UCC5687, TA = TJ. (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
xTRMPWR Supply Current Section
LVD mode
xTRMPWR supply current
Disabled terminator
65
mA
500
µA
1.25 V Regulator Section
1.25 V regulator
0.5 V ≤ VCM ≤ 2.0 V,
Regulator source current
VREG = 0 V
Regulator sink current
VREG = 3.0 V
240
300
1.3 V regulator
–5mA ≤ IDIFSENS ≤ 50 µA
1.2
1.3
1.4
V
Short-circuit source current
VDIFSENS = 0 V
–5
–8
–15
mA
Short-circuit sinkcurrent
VDIFSENS = 2.75 V
50
200
µA
See Note 1
1.15
1.25
1.35
V
–300
–240
mA
mA
1.3 V (DIFSENS) Regulator Section
Differential Termination Section (Applies to each line pair 1–27)
Differential bias voltage
100
125
mV
Differential impedance
100
105
110
Ω
1.15
1.25
1.35
V
110
140
165
Ω
10
400
nA
3
pF
Common-mode bias voltage
L+ and L– shorted together
Common-mode impedance
L+ and L– shorted together,
See Note 2
SE measurement to GND,
See Note 3
Disconnected Termination Section
Output leakage current
Output capacitance
Disconnect Control (DISCNCT1) or (DISNCNT2) and DIFFB Input Section
DISCNCT threshold voltage
0.8
DISCNCT input current
VDISCNCT = 0 V and 2.0 V
DIFFB SE to LVD threshold voltage
DIFFB LVD to HPD threshold voltage
0 V ≤ VDIFFB ≤ 2.75 V
DIFFB Input current
2.0
V
–30
1.3
–10
µA
0.5
0.7
V
1.9
2.4
V
–10
10
µA
–4
mA
Low-Voltage Differential (LVD) Status Bit Section
Source current
VLOAD = 2.4 V
Sink current
VLOAD = 0.4 V
–6
2
5
mA
(See Note 4)
100
190
300
ms
For increasing temperature
140
155
170
_C
Time Delay/Filter Section
Mode change delay
Thermal Shutdown Section
Thermal shutdown threshold
Thermal shutdown hysteresis
10
_C
NOTES: 1. VCM is applied to all L+ and L– lines simultaneously.
2.0 V * 0.5 V
2. Z
+
, VCM(max) = 2.0 V, VCM(min) = 0.5 V
CM
I
*I
VCM (max)
VCM (max)
3. Ensured by design, not production tested.
4. A new mode change can begin any time after a previous mode change has been detected.
ƪ
ƫ
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
3
!
SLUS459B – OCTOBER 2000 – REVISED APRIL 2001
pin descriptions
STRMPWR: 2.7 V to 5.25 V power supply for all circuitry except the 1.25-V regulator.
SGND: Ground reference for all circuitry except the 1.25-V regulator.
PTRMPWR: 2.7 V to 5.25 V power supply for the 1.25-V regulator.
PGND: Ground reference for the 1.25-V regulator.
REG: Output of the internal 1.25-V regulator; must be connected to a 4.7-µF bypass capacitor and a
high-frequency, low-ESR 0.01-µF capacitor to GND.
DIFSENS: Drives the SCSI bus DIFF SENSE line to 1.3 V to detect what types of devices are tied to the bus.
DIFFB: DIFF SENSE input pin. Connect through a 20-kΩ resistor to DIFSENS and through a 0.1-µF capacitor
to GND. Input to comparators that detect what type of drives are connected to the SCSI bus.
DISCNCT1: Disconnect one controls termination lines 10–27 (control and low byte).
DISCNCT2: Disconnect two controls termination lines 1–9 (high byte).
LVD: TTL compatible status bit indicating when low-voltage-differential voltage is present on DIFFB.
L1– thru L27–: Negative lines for the SCSI bus.
L1+ thru L27+: Positive lines for the SCSI bus.
4
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
!
SLUS459B – OCTOBER 2000 – REVISED APRIL 2001
APPLICATION INFORMATION
UCC5686
Termpower
0.01 µ F
7
STRMPWR
8
PTRMPWR
L1+ 21
21 L1+
L1– 22
22 L1–
12 LVD
L9+ 60
60 L9+
L9– 59
59 L9–
L10+ 14
CONTROL AND
LOW BYTE
L18– 38
38 L18–
L19+ 41
41 L19+
10 SGND
DISCNCT2
0.01 µ F
6
6
L27+
L27– 5
5
L27–
40
40
DIFSENS
DIFSENS
11
SGND
10
DIFFB
DIFFB
REG
39
39
9
20 kΩ
0.1 µ F
0.1 µ F
S4
PGND
9
20 kΩ
47
HIGH BYTE
REG
4.7 µ F
S3
42 L19–
HIGH BYTE
11 PGND
0.01 µ F
48
CONTROL AND
LOW BYTE
DATA (8)
+ PARITY LINES
L27+
8
DISCNCT1
37 L18+
L19– 42
S2
PTRMPWR
13 L10–
L18+ 37
DISCNCT2
7
4.7 µ F
DATA (8)
+ PARITY LINES
48 DISCNCT1
STRMPWR
14 L10+
L10– 13
47
Termpower
CONTROL LINES (9)
4.7 µ F
S1
UCC5686
4.7 µF
0.01 µF
NOTE A: Close S1, S2, S3, and S4 to connect terminators in UCC5686. Open S1, S2, S3, and S4 to connect terminators in UCC5687.
Figure 1. Typical Application Diagram
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
5
PACKAGE OPTION ADDENDUM
www.ti.com
8-Aug-2005
PACKAGING INFORMATION
Orderable Device
Status (1)
Package
Type
Package
Drawing
Pins Package Eco Plan (2)
Qty
TBD
Lead/Ball Finish
MSL Peak Temp (3)
UCC5686PM
ACTIVE
LQFP
PM
64
160
CU NIPDAU
Level-3-260C-168 HR
UCC5686PMTR
ACTIVE
LQFP
PM
64
1000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-3-260C-168 HR
UCC5686PMTRG4
ACTIVE
LQFP
PM
64
1000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-3-260C-168 HR
UCC5687PM
ACTIVE
LQFP
PM
64
160
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-3-260C-168 HR
UCC5687PMTR
ACTIVE
LQFP
PM
64
1000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-3-260C-168 HR
UCC5687PMTRG4
ACTIVE
LQFP
PM
64
1000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-3-260C-168 HR
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS) or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 1
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications,
enhancements, improvements, and other changes to its products and services at any time and to discontinue
any product or service without notice. Customers should obtain the latest relevant information before placing
orders and should verify that such information is current and complete. All products are sold subject to TI’s terms
and conditions of sale supplied at the time of order acknowledgment.
TI warrants performance of its hardware products to the specifications applicable at the time of sale in
accordance with TI’s standard warranty. Testing and other quality control techniques are used to the extent TI
deems necessary to support this warranty. Except where mandated by government requirements, testing of all
parameters of each product is not necessarily performed.
TI assumes no liability for applications assistance or customer product design. Customers are responsible for
their products and applications using TI components. To minimize the risks associated with customer products
and applications, customers should provide adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right,
copyright, mask work right, or other TI intellectual property right relating to any combination, machine, or process
in which TI products or services are used. Information published by TI regarding third-party products or services
does not constitute a license from TI to use such products or services or a warranty or endorsement thereof.
Use of such information may require a license from a third party under the patents or other intellectual property
of the third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of information in TI data books or data sheets is permissible only if reproduction is without
alteration and is accompanied by all associated warranties, conditions, limitations, and notices. Reproduction
of this information with alteration is an unfair and deceptive business practice. TI is not responsible or liable for
such altered documentation.
Resale of TI products or services with statements different from or beyond the parameters stated by TI for that
product or service voids all express and any implied warranties for the associated TI product or service and
is an unfair and deceptive business practice. TI is not responsible or liable for any such statements.
Following are URLs where you can obtain information on other Texas Instruments products and application
solutions:
Products
Applications
Amplifiers
amplifier.ti.com
Audio
www.ti.com/audio
Data Converters
dataconverter.ti.com
Automotive
www.ti.com/automotive
DSP
dsp.ti.com
Broadband
www.ti.com/broadband
Interface
interface.ti.com
Digital Control
www.ti.com/digitalcontrol
Logic
logic.ti.com
Military
www.ti.com/military
Power Mgmt
power.ti.com
Optical Networking
www.ti.com/opticalnetwork
Microcontrollers
microcontroller.ti.com
Security
www.ti.com/security
Telephony
www.ti.com/telephony
Video & Imaging
www.ti.com/video
Wireless
www.ti.com/wireless
Mailing Address:
Texas Instruments
Post Office Box 655303 Dallas, Texas 75265
Copyright 2005, Texas Instruments Incorporated