[ /Title (CD74 HC137 , CD74 HCT13 7, CD74 HC237 , CD74 HCT23 7) /Subject (High Speed CD74HC137, CD74HCT137, CD54/74HC237, CD74HCT237 Data sheet acquired from Harris Semiconductor SCHS146C March 1998 - Revised July 2002 High Speed CMOS Logic, 3-to-8 Line Decoder Demultiplexer with Address Latches Features Description • Select One of Eight Data Outputs - Active Low for CD74HC137 and CD74HCT137 - Active High for ’HC237 and CD74HCT237 The CD74HC137, CD74HCT137, ’HC237, and CD74HCT237 are high speed silicon gate CMOS decoders well suited to memory address decoding or data routing applications. Both circuits feature low power consumption usually associated with CMOS circuitry, yet have speeds comparable to low power Schottky TTL logic. • l/O Port or Memory Selector • Two Enable Inputs to Simplify Cascading Both circuits have three binary select inputs (A0, A1 and A2) that can be latched by an active High Latch Enable (LE) signal to isolate the outputs from select-input changes. A “Low” LE makes the output transparent to the input and the circuit functions as a one-of-eight decoder. Two Output Enable inputs (OE1 and OE0) are provided to simplify cascading and to facilitate demultiplexing. The demultiplexing function is accomplished by using the A0, A1, A2 inputs to select the desired output and using one of the other Output Enable inputs as the data input while holding the other Output Enable input in its active state. In the CD74HC137 and CD74HCT137 the selected output is a “Low”; in the ’HC237 and CD74HCT237 the selected output is a “High”. • Typical Propagation Delay of 13ns at VCC = 5V, 15pF, TA = 25oC (CD74HC237) • Fanout (Over Temperature Range) - Standard Outputs . . . . . . . . . . . . . . . 10 LSTTL Loads - Bus Driver Outputs . . . . . . . . . . . . . 15 LSTTL Loads • Wide Operating Temperature Range . . . -55oC to 125oC • Balanced Propagation Delay and Transition Times • Significant Power Reduction Compared to LSTTL Logic ICs • HC Types - 2V to 6V Operation - High Noise Immunity: NIL = 30%, NIH = 30%, of VCC at VCC = 5V Ordering Information PART NUMBER • HCT Types - 4.5V to 5.5V Operation - Direct LSTTL Input Logic Compatibility, VIL= 0.8V (Max), VIH = 2V (Min) - CMOS Input Compatibility, Il ≤ 1µA at VOL, VOH Pinout CD54HC237 (CERDIP) CD74HC137, CD74HCT137, CD74HCT237 (PDIP, SOIC) CD74HC237 (PDIP, SOIC, SOP, TSSOP) TOP VIEW A0 1 16 VCC A1 2 15 Y0 A3 3 14 Y1 LE 4 13 Y2 OE1 5 12 Y3 OE0 6 11 Y4 Y7 7 10 Y5 GND 8 9 Y6 © 2002, Texas Instruments Incorporated PACKAGE CD74HC137E -55 to 125 16 Ld PDIP CD74HCT137E -55 to 125 16 Ld PDIP CD74HCT137M96 -55 to 125 16 Ld SOIC CD54HC237F -55 to 125 16 Ld CERDIP CD54HC237F3A -55 to 125 16 Ld CERDIP CD74HC237E -55 to 125 16 Ld PDIP CD74HC237M -55 to 125 16 Ld SOIC CD74HC237M96 -55 to 125 16 Ld SOIC CD74HC237NSR -55 to 125 16 Ld SOP CD74HC237PWR -55 to 125 16 Ld TSSOP CD74HCT237E -55 to 125 16 Ld PDIP NOTES: 1. When ordering, use the entire part number. Add the suffix 96 to obtain the variant in the tape and reel. 2. Wafer and die for this part number is available which meets all electrical specifications. Please contact your local TI sales office or customer service for ordering information. CAUTION: These devices are sensitive to electrostatic discharge. Users should follow proper IC Handling Procedures. Copyright TEMP. RANGE (oC) 1 CD74HC137, CD74HCT137, CD54/74HC237, CD74HCT237 Functional Diagram A0 A1 A2 HC/HCT HC/HCT 237 137 15 Y0 Y0 1 2 3-BIT LATCH 3 14 1 OF 8 DECODER 13 12 4 LE 11 10 OE1 OE0 5 9 6 7 Y1 Y1 Y2 Y2 Y3 Y3 Y4 Y4 Y5 Y5 Y6 Y6 Y7 Y7 GND = 8 VCC = 16 ’HC137, ’HCT137 TRUTH TABLE INPUTS OUTPUTS LE OE0 OE1 A2 A1 A0 Y0 Y1 Y2 Y3 Y4 Y5 Y6 Y7 X X H X X X H H H H H H H H X L X X X X H H H H H H H H L H L L L L L H H H H H H H L H L L L H H L H H H H H H L H L L H L H H L H H H H H L H L L H H H H H L H H H H L H L H L L H H H H L H H H L H L H L H H H H H H L H H L H L H H L H H H H H H L H L H L H H H H H H H H H H L H H L X X X Depends upon the address previously applied while LE was at a logic low. NOTE: H = High Voltage Level, L = Low Voltage Level, X = Don’t Care ’HC237, ’HCT237 TRUTH TABLE INPUTS OUTPUTS LE OE0 OE1 X X H X X X L L L L L L L L X L X X X X L L L L L L L L L H L L L L H L L L L L L L L H L L L H L H L L L L L L L H L L H L L L H L L L L L L H L L H H L L L H L L L L L H L H L L L L L L H L L L L H L H L H L L L L L H L L L H L H H L L L L L L L H L L L L L L L L H A2 A1 A0 L H L H H H H H L X X X Y0 Y1 Y2 Y3 Y4 Y5 Y6 Y7 Depends upon the address previously applied while LE was at a logic low. NOTE: H = High Voltage Level, L = Low Voltage Level, X = Don’t Care 2 CD74HC137, CD74HCT137, CD54/74HC237, CD74HCT237 Functional Block Diagram A0 15 LE 1 A0 Y0 A0 p 14 n Y1 LE LE p 13 Y2 n 12 LE Y3 A1 2 A1 A1 LATCH A0 11 Y4 10 3 A2 Y5 A2 A2 LATCH A2 9 Y6 LE 7 4 LE Y7 LE 5 OE1 6 OE0 3 CD74HC137, CD74HCT137, CD54/74HC237, CD74HCT237 Absolute Maximum Ratings Thermal Information DC Supply Voltage, VCC . . . . . . . . . . . . . . . . . . . . . . . . -0.5V to 7V DC Input Diode Current, IIK For VI < -0.5V or VI > VCC + 0.5V . . . . . . . . . . . . . . . . . . . . . .±20mA DC Output Diode Current, IOK For VO < -0.5V or VO > VCC + 0.5V . . . . . . . . . . . . . . . . . . . .±20mA DC Output Source or Sink Current per Output Pin, IO For VO > -0.5V or VO < VCC + 0.5V . . . . . . . . . . . . . . . . . . . .±25mA DC VCC or Ground Current, ICC . . . . . . . . . . . . . . . . . . . . . . . . .±50mA Package Thermal Impedance, θJA (see Note 3): PDIP Package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 67oC/W SOIC Package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 73oC/W SOP Package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 64oC/W TSSOP Package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 108oC/W Maximum Junction Temperature . . . . . . . . . . . . . . . . . . . . . . . 150oC Maximum Storage Temperature Range . . . . . . . . . .-65oC to 150oC Maximum Lead Temperature (Soldering 10s) . . . . . . . . . . . . . 300oC (SOIC - Lead Tips Only) Operating Conditions Temperature Range (TA) . . . . . . . . . . . . . . . . . . . . . -55oC to 125oC Supply Voltage Range, VCC HC Types . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .2V to 6V HCT Types . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .4.5V to 5.5V DC Input or Output Voltage, VI, VO . . . . . . . . . . . . . . . . . 0V to VCC Input Rise and Fall Time 2V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1000ns (Max) 4.5V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 500ns (Max) 6V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 400ns (Max) CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. NOTE: 3. The package thermal impedance is calculated in accordance with JESD 51-7. DC Electrical Specifications TEST CONDITIONS PARAMETER 25oC -40oC TO 85oC -55oC TO 125oC SYMBOL VI (V) IO (mA) VCC (V) VIH - - 2 1.5 - - 1.5 - 1.5 - V 4.5 3.15 - - 3.15 - 3.15 - V 6 4.2 - - 4.2 - 4.2 - V MIN TYP MAX MIN MAX MIN MAX UNITS HC TYPES High Level Input Voltage Low Level Input Voltage High Level Output Voltage CMOS Loads VIL VOH - VIH or VIL High Level Output Voltage TTL Loads Low Level Output Voltage CMOS Loads VOL VIH or VIL Low Level Output Voltage TTL Loads Input Leakage Current II VCC or GND - 2 - - 0.5 - 0.5 - 0.5 V 4.5 - - 1.35 - 1.35 - 1.35 V 6 - - 1.8 - 1.8 - 1.8 V -0.02 2 1.9 - - 1.9 - 1.9 - V -0.02 4.5 4.4 - - 4.4 - 4.4 - V -0.02 6 5.9 - - 5.9 - 5.9 - V - - - - - - - - - V -4 4.5 3.98 - - 3.84 - 3.7 - V -5.2 6 5.48 - - 5.34 - 5.2 - V 0.02 2 - - 0.1 - 0.1 - 0.1 V 0.02 4.5 - - 0.1 - 0.1 - 0.1 V 0.02 6 - - 0.1 - 0.1 - 0.1 V - - - - - - - - - V 4 4.5 - - 0.26 - 0.33 - 0.4 V 5.2 6 - - 0.26 - 0.33 - 0.4 V - 6 - - ±0.1 - ±1 - ±1 µA 4 CD74HC137, CD74HCT137, CD54/74HC237, CD74HCT237 DC Electrical Specifications (Continued) TEST CONDITIONS 25oC -40oC TO 85oC -55oC TO 125oC SYMBOL VI (V) IO (mA) VCC (V) MIN TYP MAX MIN MAX MIN MAX UNITS ICC VCC or GND 0 6 - - 8 - 80 - 160 µA High Level Input Voltage VIH - - 4.5 to 5.5 2 - - 2 - 2 - V Low Level Input Voltage VIL - - 4.5 to 5.5 - - 0.8 - 0.8 - 0.8 V High Level Output Voltage CMOS Loads VOH VIH or VIL -0.02 4.5 4.4 - - 4.4 - 4.4 - V -4 4.5 3.98 - - 3.84 - 3.7 - V 0.02 4.5 - - 0.1 - 0.1 - 0.1 V 4 4.5 - - 0.26 - 0.33 - 0.4 V PARAMETER Quiescent Device Current HCT TYPES High Level Output Voltage TTL Loads Low Level Output Voltage CMOS Loads VOL VIH or VIL Low Level Output Voltage TTL Loads Input Leakage Current Quiescent Device Current Additional Quiescent Device Current Per Input Pin: 1 Unit Load II VCC and GND 0 5.5 - - ±0.1 - ±1 - ±1 µA ICC VCC or GND 0 5.5 - - 8 - 80 - 160 µA ∆ICC (Note) VCC -2.1 - 4.5 to 5.5 - 100 360 - 450 - 490 µA NOTE: For dual-supply systems theoretical worst case (VI = 2.4V, VCC = 5.5V) specification is 1.8mA. HCT Input Loading Table INPUT UNIT LOADS All 1.5 NOTE: Unit Load is ∆ICC limit specified in DC Electrical Table, e.g., 360µA max at 25oC. Prerequisite For Switching Specifications PARAMETER HC TYPES An to LE Setup Time An to LE Hold Time SYMBOL tSU tH 25oC -40oC TO 85oC -55oC TO 125oC VCC (V) MIN TYP MAX MIN MAX MIN MAX UNITS 2 50 - - 65 - 75 - ns 4.5 10 - - 13 - 15 - ns 6 9 - - 11 - 13 - ns 2 30 - - 40 - 45 - ns 4.5 6 - - 8 - 9 - ns 6 5 - - 7 - 8 - ns 5 CD74HC137, CD74HCT137, CD54/74HC237, CD74HCT237 Prerequisite For Switching Specifications PARAMETER (Continued) 25oC -40oC TO 85oC -55oC TO 125oC SYMBOL VCC (V) MIN TYP MAX MIN MAX MIN MAX UNITS tW 2 50 - - 65 - 75 - ns 4.5 10 - - 13 - 15 - ns 6 9 - - 1 - 13 - ns 4.5 10 - - 13 - 15 - ns LE Pulse Width HCT TYPES An to LE Setup Time tSU An to LE Hold Time CD74HCT137 tH 4.5 7 - - 9 - 11 - ns CD74HCT237 tH 4.5 5 - - 5 - 5 - ns tW 4.5 10 - - 13 - 15 - ns LE Pulse Width Switching Specifications Input tr, tf = 6ns PARAMETER HC TYPES Propagation Delay CD74HC137, CD74HCT137 SYMBOL TEST CONDITIONS tPLH, tPHL CL = 50pF An to any Y Propagation Delay ’HC237, CD74HCT237 tPLH, tPHL CL = 50pF An to any Y -40oC TO 85oC 25oC -55oC TO 125oC VCC (V) MIN TYP MAX MIN MAX MIN MAX UNITS 2 - - 180 - 225 - 270 ns 4.5 - - 36 - 45 - 54 ns 6 - - 31 - 38 - 46 ns 2 - - 160 - 200 - 240 ns 4.5 - - 32 - 40 - 48 ns 6 - - 27 - 34 - 41 ns Address to Output CD74HC137 tPLH, tPHL CL = 15pF 5 5 15 - - - - - ns ’HC237 tPLH, tPHL CL = 15pF 5 - 13 - - - - - ns OE0 to any Y or Y OE1 to any Y or Y LE to any Y or Y Power Dissipation Capacitance, (Notes 4, 5) CD74HC137 ’HC237 Output Transition Time Input Capacitance tPLH, tPHL CL = 50pF tTLH, tTHL CL = 50pF tTLH, tTHL CL = 50pF 2 - - 145 - 180 - 220 ns 4.5 - - 29 - 36 - 44 ns 6 - - 25 - 31 - 38 ns 2 - - 145 - 180 - 220 ns 4.5 - - 29 - 36 - 44 ns 6 - - 25 - 31 - 38 ns 2 - - 190 - 240 - 285 ns 4.5 - - 38 - 48 - 57 ns 6 - - 32 - 41 - 48 ns - - - - - pF CPD CL = 15pF 5 - 19 CPD CL = 15pF 5 - 23 - - - - - pF tTLH, tTHL CL = 50pF 2 - - 75 - 95 - 110 ns 4.5 - - 15 - 19 - 22 ns 6 - - 13 - 16 - 19 ns - - - 10 - 10 - 10 pF CI - 6 CD74HC137, CD74HCT137, CD54/74HC237, CD74HCT237 Switching Specifications Input tr, tf = 6ns (Continued) PARAMETER TEST CONDITIONS SYMBOL HCT TYPES Propagation Delay An to any Y or Y Address to Output -40oC TO 85oC 25oC -55oC TO 125oC VCC (V) MIN TYP MAX MIN MAX MIN MAX UNITS 4.5 - - 38 - 48 - 57 ns tPLH, tPHL CL = 50pF tPLH, tPHL CL = 15pF 5 - 16 - - - - - ns OE0 to any Y (HC137) tPLH, tPHL CL = 50pF 4.5 - - 35 - 44 - 53 ns OE0 to any Y (HC237) tPLH, tPHL CL = 50pF 4.5 - - 33 - 41 - 60 ns OE1 to any Y (HC137) tTLH, tTHL CL = 50pF 4.5 - - 37 - 46 - 56 ns OE1 to any Y (HC237) tTLH, tTHL CL = 50pF 4.5 - - 35 - 44 - 53 ns LE to any Y (HC137) tTLH, tTHL CL = 50pF 4.5 - - 44 - 55 - 66 ns LE to any Y (HC237) tTLH, tTHL CL = 50pF 4.5 - - 42 - 53 - 63 ns Power Dissipation Capacitance, (Notes 4, 5) CD74HC137 ’HC237 Output Transition Time CPD CL = 15pF 5 - 19 - - - - - pF CPD CL = 15pF 5 - 23 - - - - - pF 22 ns 10 pF tTLH, tTHL CL = 50pF Input Capacitance CI 4.5 - 15 - - - 10 19 - 10 - NOTES: 4. CPD is used to determine the dynamic power consumption, per gate. 5. PD = VCC2 fi (CPD + CL) where: fi = Input Frequency, CL = Output Load Capacitance, VCC = Supply Voltage. Test Circuits and Waveforms tfCL trCL CLOCK tWL + tWH = 90% 10% I fCL CLOCK 50% 50% 1.3V 0.3V FIGURE 2. HCT CLOCK PULSE RISE AND FALL TIMES AND PULSE WIDTH tf = 6ns tf = 6ns tr = 6ns VCC 90% 50% 10% GND tTLH GND tTHL 90% 50% 10% INVERTING OUTPUT 3V 2.7V 1.3V 0.3V INPUT tTHL GND tWH NOTE: Outputs should be switching from 10% VCC to 90% VCC in accordance with device truth table. For fMAX, input duty cycle = 50%. FIGURE 1. HC CLOCK PULSE RISE AND FALL TIMES AND PULSE WIDTH tr = 6ns 1.3V 1.3V tWL tWH NOTE: Outputs should be switching from 10% VCC to 90% VCC in accordance with device truth table. For fMAX, input duty cycle = 50%. tPHL 2.7V 0.3V GND tWL INPUT tfCL = 6ns I fCL 3V VCC 50% 10% tWL + tWH = trCL = 6ns tTLH 90% 1.3V 10% INVERTING OUTPUT tPHL tPLH FIGURE 3. HC AND HCU TRANSITION TIMES AND PROPAGATION DELAY TIMES, COMBINATION LOGIC tPLH FIGURE 4. HCT TRANSITION TIMES AND PROPAGATION DELAY TIMES, COMBINATION LOGIC 7 CD74HC137, CD74HCT137, CD54/74HC237, CD74HCT237 Test Circuits and Waveforms trCL tfCL trCL CLOCK INPUT (Continued) VCC 90% GND tH(H) GND tH(H) VCC DATA INPUT 50% tH(L) 3V 1.3V 1.3V 1.3V GND tSU(H) tSU(H) tSU(L) tTLH 90% OUTPUT tTHL 90% 50% 10% tTLH 90% 1.3V OUTPUT tREM 3V SET, RESET OR PRESET GND tTHL 1.3V 10% FIGURE 5. HC SETUP TIMES, HOLD TIMES, REMOVAL TIME, AND PROPAGATION DELAY TIMES FOR EDGE TRIGGERED SEQUENTIAL LOGIC CIRCUITS tPHL 1.3V GND IC CL 50pF GND 90% tPLH 50% IC tSU(L) tPHL tPLH tREM VCC SET, RESET OR PRESET 1.3V 0.3V tH(L) DATA INPUT 3V 2.7V CLOCK INPUT 50% 10% tfCL CL 50pF FIGURE 6. HCT SETUP TIMES, HOLD TIMES, REMOVAL TIME, AND PROPAGATION DELAY TIMES FOR EDGE TRIGGERED SEQUENTIAL LOGIC CIRCUITS 8 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All products are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment. TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standard warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where mandated by government requirements, testing of all parameters of each product is not necessarily performed. TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and applications using TI components. To minimize the risks associated with customer products and applications, customers should provide adequate design and operating safeguards. TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask work right, or other TI intellectual property right relating to any combination, machine, or process in which TI products or services are used. Information published by TI regarding third–party products or services does not constitute a license from TI to use such products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI. Reproduction of information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an unfair and deceptive business practice. TI is not responsible or liable for such altered documentation. Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice. TI is not responsible or liable for any such statements. Mailing Address: Texas Instruments Post Office Box 655303 Dallas, Texas 75265 Copyright 2002, Texas Instruments Incorporated