SN74AUC1G66 www.ti.com .......................................................................................................................................................... SCES386L – MARCH 2002 – REVISED JULY 2009 SINGLE BILATERAL ANALOG SWITCH FEATURES 1 • Available in the Texas Instruments NanoFree™ Package • Wide VCC Range of 0.8 V to 2.7 V • Sub-1-V Operable • Low Power Consumption, 10-µA Max ICC • High On-Off Output Voltage Ratio • High Degree of Linearity • High Speed – Max 0.2 ns (VCC = 1.8 V, CL = 15 pF) • 2 DBV PACKAGE (TOP VIEW) A 1 B 2 GND 3 5 4 • • Low On-State Impedance – Typically 9 Ω (VCC = 2.3 V) Latch-Up Performance Exceeds 100 mA Per JESD 78, Class II ESD Protection Exceeds JESD 22 – 2000-V Human-Body Model (A114-A) – 200-V Machine Model (A115-A) – 1000-V Charged-Device Model (C101) DRY PACKAGE (TOP VIEW) DCK PACKAGE (TOP VIEW) A VCC 1 B 2 GND 3 5 VCC A B 4 C VCC W E I 2 V5 NC RE 1 GND P 3 6 4 C YZP PACKAGE (BOTTOM VIEW) GND 3 4 B 2 A 1 5 C VCC C See mechanical drawings for dimensions. NC– No internal connection DESCRIPTION/ORDERING INFORMATION This single analog switch is operational at 0.8-V to 2.7-V VCC, but is designed specifically for 1.65-V to 1.95-V VCC operation. The SN74AUC1G66 can handle both analog and digital signals. The combined AC and DC signal has to be between VCC and GND for it to be transmitted in either direction. NanoFree™ package technology is a major breakthrough in IC packaging concepts, using the die as the package. Applications include signal gating, chopping, modulation or demodulation (modem), and signal multiplexing for analog-to-digital and digital-to-analog conversion systems. 1 2 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. NanoFree is a trademark of Texas Instruments. UNLESS OTHERWISE NOTED this document contains PRODUCTION DATA information current as of publication date. Products conform to specifications per the terms of Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright © 2002–2009, Texas Instruments Incorporated SN74AUC1G66 SCES386L – MARCH 2002 – REVISED JULY 2009 .......................................................................................................................................................... www.ti.com ORDERING INFORMATION TA PACKAGE –40°C to 85°C (1) (2) (3) (1) (2) ORDERABLE PART NUMBER TOP-SIDE MARKING (3) NanoFree™ WCSP (DSBGA) – YZP (Pb-free) Reel of 3000 SN74AUC1G66YZPR _ _ _U6_ SON – DRY Reel of 5000 SN74AUC1G66DRYR PREVIEW SOT (SOT-23) – DBV Reel of 3000 SN74AUC1G66DBVR U66_ SOT (SC-70) – DCK Reel of 3000 SN74AUC1G66DCKR U6_ Package drawings, thermal data, and symbolization are available at www.ti.com/packaging. For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI website at www.ti.com. DBV/DCK/DRY: The actual top-side marking has one additional character that designates the assembly/test site. YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one following character to designate the assembly/test site. FUNCTION TABLE CONTROL INPUT (C) SWITCH L OFF H ON LOGIC DIAGRAM (POSITIVE LOGIC) 1 2 A B 4 C Absolute Maximum Ratings (1) over operating free-air temperature range (unless otherwise noted) MIN MAX VCC Supply voltage range –0.5 3.6 V VI Input voltage range (2) –0.5 3.6 V –0.5 VCC + 0.5 (2) (3) UNIT VI/O Switch I/O voltage range IIK Control input clamp current VI < 0 –50 mA IIOK I/O port diode current VI/O < 0 or VI/O > VCC ±50 mA IT On-state switch current VI/O = 0 to VCC ±50 mA ±100 mA Continuous current through VCC or GND θJA Package thermal impedance (4) Tstg Storage temperature range DBV package 206 DCK package 252 DRY package 234 YZP package (1) (2) (3) (4) 2 V °C/W 123 –65 150 °C Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. All voltages are with respect to ground, unless otherwise specified. The input negative-voltage and output voltage ratings may be exceeded if the input and output current ratings are observed. The package thermal impedance is calculated in accordance with JESD 51-7. Submit Documentation Feedback Copyright © 2002–2009, Texas Instruments Incorporated Product Folder Link(s): SN74AUC1G66 SN74AUC1G66 www.ti.com .......................................................................................................................................................... SCES386L – MARCH 2002 – REVISED JULY 2009 Recommended Operating Conditions (1) VCC Supply voltage VCC = 0.8 V VIH High-level input voltage MIN MAX 0.8 2.7 UNIT V VCC VCC = 1.1 V to 1.95 V 0.65 × VCC VCC = 2.3 V to 2.7 V V 1.7 VCC = 0.8 V 0 VIL Low-level input voltage VCC = 1.1 V to 1.95 V 0.35 × VCC VI/O I/O port voltage 0 VCC VI Control input voltage 0 3.6 V Δt/Δv Input transition rise or fall rate 20 ns/V TA Operating free-air temperature 85 °C VCC = 2.3 V to 2.7 V (1) V 0.7 –40 V All unused inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report, Implications of Slow or Floating CMOS Inputs, literature number SCBA004. Electrical Characteristics over recommended operating free-air temperature range (unless otherwise noted) PARAMETER TEST CONDITIONS VCC MIN TYP (1) MAX ron On-state switch resistance ron(p) Peak on resistance VI = VCC to GND, VC = VIH (see Figure 1) IS(off) Off-state switch leakage current VI = VCC and VO = GND, or VI = GND and VO = VCC, VC = VIL (see Figure 2) 2.7 V IS(on) On-state switch leakage current VI = VCC or GND, VC = VIH, VO = Open (see Figure 3) 2.7 V II Control input current VI = VCC or GND ICC Supply current VI = VCC or GND, Cic Control input capacitance 2.5 V 2 pF Cio(off) Switch input/output capacitance 2.5 V 3.5 pF Cio(on) Switch input/output capacitance 2.5 V 7 pF (1) IS = 4 mA 1.65 V 10 20 IS = 8 mA 2.3 V 9 15 IS = 4 mA 1.65 V 32 80 IS = 8 mA 2.3 V 15 20 UNIT VI = VCC or GND, VC = VIH (see Figure 1) ±1 ±0.1 (1) ±1 ±0.1 (1) 0 to 2.7 V IO = 0 0.8 V to 2.7 V Ω Ω µA µA ±5 µA 10 µA All typical values are at TA = 25°C. Switching Characteristics over recommended operating free-air temperature range, CL = 15 pF (unless otherwise noted) (see Figure 4) (1) VCC = 1.2 V ± 0.1 V VCC = 1.5 V ± 0.1 V FROM (INPUT) TO (OUTPUT) VCC = 0.8 V tpd (1) A or B B or A 0.9 ten C A or B 4.1 0.5 2.6 0.5 tdis C A or B 5 0.7 3.6 0.5 PARAMETER TYP MIN MAX MIN MAX 0.3 VCC = 1.8 V ± 0.15 V VCC = 2.5 V ± 0.2 V TYP 0.1 ns 1.7 0.5 0.8 1.1 0.5 1 ns 2.6 0.5 1.7 2.9 0.5 2.2 ns 0.2 MAX MIN UNIT MIN 0.2 MAX The propagation delay is the calculated RC time constant of the typical on-state resistance of the switch and the specified load capacitance, when driven by an ideal voltage source (zero output impedance). Submit Documentation Feedback Copyright © 2002–2009, Texas Instruments Incorporated Product Folder Link(s): SN74AUC1G66 3 SN74AUC1G66 SCES386L – MARCH 2002 – REVISED JULY 2009 .......................................................................................................................................................... www.ti.com Switching Characteristics over recommended operating free-air temperature range, CL = 30 pF (unless otherwise noted) (see Figure 4) FROM (INPUT) TO (OUTPUT) tpd (1) A or B B or A ten C tdis C PARAMETER (1) 4 VCC = 1.8 V ± 0.15 V VCC = 2.5 V ± 0.2 V MAX MIN UNIT MIN TYP 0.3 ns A or B 0.5 1.4 2.3 0.8 1.4 ns A or B 0.5 1.7 2.9 0.5 1.5 ns 0.3 MAX The propagation delay is the calculated RC time constant of the typical on-state resistance of the switch and the specified load capacitance, when driven by an ideal voltage source (zero output impedance). Submit Documentation Feedback Copyright © 2002–2009, Texas Instruments Incorporated Product Folder Link(s): SN74AUC1G66 SN74AUC1G66 www.ti.com .......................................................................................................................................................... SCES386L – MARCH 2002 – REVISED JULY 2009 Analog Switch Characteristics TA = 25°C FROM (INPUT) PARAMETER TO (OUTPUT) TEST CONDITIONS CL = 50 pF, RL = 600 Ω, fin = sine wave (see Figure 5) Frequency response (1) (switch ON) A or B Crosstalk (control input to signal output) C CL = 50 pF, RL = 600 Ω, fin = 1 MHz (square wave) (see Figure 6) A or B CL = 50 pF, RL = 600 Ω, fin = 1 MHz (sine wave) (see Figure 7) Feedthrough attenuation (switch OFF) A or B CL = 50 pF, RL = 10 kΩ, fin = 1 kHz (sine wave) (see Figure 8) B or A (1) (2) CL = 50 pF, RL = 10 kΩ, fin = 10 kHz (sine wave) (see Figure 8) B or A 1.1 V 60 80 2.3 V 170 0.8 V >500 1.1 V >500 1.4 V >500 1.65 V >500 2.3 V >500 0.8 V 9 1.1 V 14 1.4 V 15 1.65 V 16 2.3 V 20 0.8 V –60 1.1 V –60 1.4 V –60 1.65 V –60 2.3 V –60 0.8 V –55 1.1 V –55 1.4 V –55 1.65 V –55 2.3 V –55 0.8 V 7.5 1.1 V 0.16 1.4 V 0.04 1.65 V 0.03 2.3 V 0.02 0.8 V 4.2 Sine-wave distortion A or B 60 120 B or A CL = 5 pF, RL = 50 Ω, fin = 1 MHz (sine wave) (see Figure 7) 0.8 V 1.65 V (2) A or B TYP 1.4 V B or A CL = 5 pF, RL = 50 Ω, fin = sine wave (see Figure 5) VCC 1.1 V 0.2 1.4 V 0.03 1.65 V 0.02 2.3 V 0.02 UNIT MHz mV dB % Adjust fin voltage to obtain 0 dBm at output. Increase fin frequency until dB meter reads –3 dB. Adjust fin voltage to obtain 0 dBm at input. Operating Characteristics TA = 25°C PARAMETER Cpd Power dissipation capacitance TEST CONDITIONS VCC = 0.8 V VCC = 1.2 V VCC = 1.5 V VCC = 1.8 V VCC = 2.5 V TYP TYP TYP TYP TYP f = 10 MHz 3 3 3 3 3 Submit Documentation Feedback Copyright © 2002–2009, Texas Instruments Incorporated Product Folder Link(s): SN74AUC1G66 UNIT pF 5 SN74AUC1G66 SCES386L – MARCH 2002 – REVISED JULY 2009 .......................................................................................................................................................... www.ti.com PARAMETER MEASUREMENT INFORMATION VCC VCC B or A A or B VI = VCC or GND VO C VC VIH (ON) GND IS r on + V VI * VO W IS VI - VO Figure 1. On-State Resistance Test Circuit VCC VCC VI A VIL B or A A or B VO C VC (OFF) GND Condition 1: VI = GND, VO = VCC Condition 2: VI = VCC, VO = GND Figure 2. Off-State Switch Leakage-Current Test Circuit 6 Submit Documentation Feedback Copyright © 2002–2009, Texas Instruments Incorporated Product Folder Link(s): SN74AUC1G66 SN74AUC1G66 www.ti.com .......................................................................................................................................................... SCES386L – MARCH 2002 – REVISED JULY 2009 PARAMETER MEASUREMENT INFORMATION (Continued) VCC VCC VI = VCC or GND A B or A A or B VO VO = Open VIH C VC (ON) GND Figure 3. On-State Leakage-Current Test Circuit Submit Documentation Feedback Copyright © 2002–2009, Texas Instruments Incorporated Product Folder Link(s): SN74AUC1G66 7 SN74AUC1G66 SCES386L – MARCH 2002 – REVISED JULY 2009 .......................................................................................................................................................... www.ti.com PARAMETER MEASUREMENT INFORMATION (Continued) VLOAD S1 RL From Output Under Test Open TEST GND CL (see Note A) S1 Open VLOAD tPLH/tPHL tPLZ/tPZL tPHZ/tPZH RL GND LOAD CIRCUIT INPUTS VCC VI VCC VCC VCC VCC VCC VCC VCC 0.8 V 1.2 V ± 0.1 V 1.5 V ± 0.1 V 1.8 V ± 0.15 V 2.5 V ± 0.2 V 1.8 V ± 0.15 V 2.5 V ± 0.2 V tr/tf £2 ns £2 ns £2 ns £2 ns £2 ns £2 ns £2 ns VM VLOAD CL RL VD VCC/2 VCC/2 VCC/2 VCC/2 VCC/2 VCC/2 VCC/2 2 × VCC 2 × VCC 2 × VCC 2 × VCC 2 × VCC 2 × VCC 2 × VCC 15 pF 15 pF 15 pF 15 pF 15 pF 30 pF 30 pF 2 kW 2 kW 2 kW 2 kW 2 kW 1 kW 500 W 0.1 V 0.1 V 0.1 V 0.15 V 0.15 V 0.15 V 0.15 V VI Timing Input VM 0V tW tsu VI Input VM VM th VI Data Input VM VM 0V 0V VOLTAGE WAVEFORMS SETUP AND HOLD TIMES VOLTAGE WAVEFORMS PULSE DURATION VI VM Input VM 0V tPLH VM VOL tPHL 0V Output Waveform 1 S1 at VLOAD (see Note B) tPLH tPLZ VLOAD/2 VM tPZH VOH VM VM tPZL VOH Output VM tPHL VM Output VI Output Control VM VOL VOLTAGE WAVEFORMS PROPAGATION DELAY TIMES INVERTING AND NONINVERTING OUTPUTS Output Waveform 2 S1 at GND (see Note B) VOL + VD VOL tPHZ VM VOH – VD VOH »0 V VOLTAGE WAVEFORMS ENABLE AND DISABLE TIMES LOW- AND HIGH-LEVEL ENABLING NOTES: A. CL includes probe and jig capacitance. B. Waveform 1 is for an output with internal conditions such that the output is low, except when disabled by the output control. Waveform 2 is for an output with internal conditions such that the output is high, except when disabled by the output control. C. All input pulses are supplied by generators having the following characteristics: PRR £ 10 MHz, ZO = 50 W, Slew rate ³ 1 V/ns. D. The outputs are measured one at a time, with one transition per measurement. E. tPLZ and tPHZ are the same as tdis. F. tPZL and tPZH are the same as ten. G. tPLH and tPHL are the same as tpd. Figure 4. Load Circuit and Voltage Waveforms 8 Submit Documentation Feedback Copyright © 2002–2009, Texas Instruments Incorporated Product Folder Link(s): SN74AUC1G66 SN74AUC1G66 www.ti.com .......................................................................................................................................................... SCES386L – MARCH 2002 – REVISED JULY 2009 PARAMETER MEASUREMENT INFORMATION (Continued) VCC VCC 0.1 µF fin 50 Ω B or A A or B VIH VO C VC RL (ON) GND CL VCC/2 RL/CL: 600 Ω/50 pF RL/CL: 50 Ω/5 pF Figure 5. Frequency Response (Switch ON) VCC VCC VCC/2 Rin 600 Ω A or B B or A VO RL 600 Ω C VC GND CL 50 pF VCC/2 50 Ω Figure 6. Crosstalk (Control Input – Switch Output) Submit Documentation Feedback Copyright © 2002–2009, Texas Instruments Incorporated Product Folder Link(s): SN74AUC1G66 9 SN74AUC1G66 SCES386L – MARCH 2002 – REVISED JULY 2009 .......................................................................................................................................................... www.ti.com PARAMETER MEASUREMENT INFORMATION (Continued) VCC VCC 0.1 µF RL 50 Ω fin B or A A or B VO C VC VIL CL RL (OFF) GND VCC/2 VCC/2 RL/CL: 600 Ω/50 pF RL/CL: 50 Ω/5 pF Figure 7. Feedthrough (Switch OFF) VCC VCC 10 µF fin 600 Ω VIH 10 µF B or A A or B VO RL 10 kΩ C VC (ON) GND CL 50 pF VCC/2 VCC = 0.8 V, VI = __ VP-P VCC = 1.1 V, VI = __ VP-P VCC = 1.4 V, VI = __ VP-P VCC = 1.65 V, VI = 1.4 VP-P VCC = 2.3 V, VI = 2.5 VP-P Figure 8. Sine-Wave Distortion 10 Submit Documentation Feedback Copyright © 2002–2009, Texas Instruments Incorporated Product Folder Link(s): SN74AUC1G66 PACKAGE OPTION ADDENDUM www.ti.com 3-Aug-2009 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Eco Plan (2) Qty SN74AUC1G66DBVR ACTIVE SOT-23 DBV 5 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74AUC1G66DBVRE4 ACTIVE SOT-23 DBV 5 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74AUC1G66DBVRG4 ACTIVE SOT-23 DBV 5 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74AUC1G66DCKR ACTIVE SC70 DCK 5 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74AUC1G66DCKRE4 ACTIVE SC70 DCK 5 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74AUC1G66DCKRG4 ACTIVE SC70 DCK 5 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74AUC1G66YZPR ACTIVE DSBGA YZP 5 3000 Green (RoHS & no Sb/Br) SNAGCU Level-1-260C-UNLIM Lead/Ball Finish MSL Peak Temp (3) (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 24-Sep-2009 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing SPQ SOT-23 DBV 5 3000 180.0 9.2 SN74AUC1G66DCKR SC70 DCK 5 3000 180.0 SN74AUC1G66YZPR DSBGA YZP 5 3000 180.0 SN74AUC1G66DBVR Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) B0 (mm) K0 (mm) P1 (mm) 3.23 3.17 1.37 4.0 8.0 Q3 9.2 2.24 2.34 1.22 4.0 8.0 Q3 8.4 1.02 1.52 0.63 4.0 8.0 Q1 Pack Materials-Page 1 W Pin1 (mm) Quadrant PACKAGE MATERIALS INFORMATION www.ti.com 24-Sep-2009 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) SN74AUC1G66DBVR SOT-23 DBV 5 3000 202.0 201.0 28.0 SN74AUC1G66DCKR SC70 DCK 5 3000 202.0 201.0 28.0 SN74AUC1G66YZPR DSBGA YZP 5 3000 220.0 220.0 34.0 Pack Materials-Page 2 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue any product or service without notice. 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