AM26LV31C, AM26LV31I LOW-VOLTAGE HIGH-SPEED QUADRUPLE DIFFERENTIAL LINE DRIVERS www.ti.com SLLS201G – MAY 1995 – REVISED MAY 2005 FEATURES • • • • • • • • • • • • • D OR NS PACKAGE (TOP VIEW) Switching Rates up to 32 MHz Operate From a Single 3.3-V Supply Propagation Delay Time . . . 8 ns Typ Pulse Skew Time . . . 500 ps Typ High Output-Drive Current . . . ±30 mA Controlled Rise and Fall Times . . . 3 ns Typ Differential Output Voltage With 100-Ω Load . . . 1.5 V Typ Ultra-Low Power Dissipation – dc, 0.3 mW Max – 32 MHz All Channels (No Load), 385 mW Typ Accept 5-V Logic Inputs With 3.3-V Supply Low-Voltage Pin-to-Pin Compatible Replacement for AM26C31, AM26LS31, MB571 High Output Impedance in Power-Off Condition Driver Output Short-Protection Circuit Package Options Include Plastic Small-Outline (D, NS) Packages 1A 1Y 1Z G 2Z 2Y 2A GND 1 16 2 15 3 14 4 13 5 12 6 11 7 10 8 9 VCC 4A 4Y 4Z G 3Z 3Y 3A DESCRIPTION/ORDERING INFORMATION The AM26LV31C and AM26LV31I are BiCMOS quadruple differential line drivers with 3-state outputs. They are designed to be similar to TIA/EIA-422-B and ITU Recommendation V.11 drivers with reduced supply-voltage range. The devices are optimized for balanced-bus transmission at switching rates up to 32 MHz. The outputs have very high current capability for driving balanced lines such as twisted-pair transmission lines and provide a high impedance in the power-off condition. The enable function is common to all four drivers and offers the choice of active-high or active-low enable inputs. The AM26LV31C and AM26LV31I are designed using Texas Instruments proprietary LinIMPACT-C60™ technology, facilitating ultra-low power consumption without sacrificing speed. These devices offer optimum performance when used with the AM26LV32 quadruple line receivers. The AM26LV31C is characterized for operation from 0°C to 70°C. The AM26LV31I is characterized for operation from –45°C to 85°C ORDERING INFORMATION PACKAGE (1) TA SOIC – D Tape and reel SOIC – NS Tape and reel SOIC – D Tape and reel SOIC – NS Tape and reel 0°C to 70°C –45°C to 85°C (1) ORDERABLE PART NUMBER AM26LV31CD AM26LV31CDR AM26LV31CNS AM26LV31CNSR AM26LV31ID AM26LV31IDR AM26LV31INS AM26LV31INSR TOP-SIDE MARKING AM26LV31C 26LV31 AM26LV31I 26LV31I Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at www.ti.com/sc/package. Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. LinIMPACT-C60 is a trademark of Texas Instruments. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright © 1995–2005, Texas Instruments Incorporated AM26LV31C, AM26LV31I LOW-VOLTAGE HIGH-SPEED QUADRUPLE DIFFERENTIAL LINE DRIVERS www.ti.com SLLS201G – MAY 1995 – REVISED MAY 2005 FUNCTION TABLE (1) (1) ENABLES OUTPUTS INPUT A G G Y H H X H L L H X L H H X L H L L X L L H X L H Z Z Z H = high level, L = low level, X = irrelevant, Z = high impedance (off) LOGIC DIAGRAM (POSITIVE LOGIC) G G 1A 2A 3A 4A 4 12 2 1 3 6 7 5 10 9 11 14 15 13 1Y 1Z 2Y 2Z 3Y 3Z 4Y 4Z SCHEMATIC (EACH DRIVER) EQUIVALENT OF EACH INPUT (A, G, OR G) TYPICAL OF ALL OUTPUTS (Y AND Z) VCC VCC 100 Ω 6Ω Output GND GND All resistor values are nominal. 2 40 kΩ Input AM26LV31C, AM26LV31I LOW-VOLTAGE HIGH-SPEED QUADRUPLE DIFFERENTIAL LINE DRIVERS www.ti.com SLLS201G – MAY 1995 – REVISED MAY 2005 Absolute Maximum Ratings (1) over operating free-air temperature range (unless otherwise noted) MIN MAX VCC Supply voltage range (2) –0.3 6 V VI Input voltage range –0.3 6 V VO Output voltage range 6 V θJA Package thermal impedance (3) Lead temperature Tstg (1) (2) (3) –0.3 D package 73 NS package 64 1,6 mm (1/16 in) from case for 10 s Storage temperature range –65 UNIT °C/W 260 °C 150 °C Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. All voltage values are with respect to GND. The package thermal impedance is calculated in accordance with JESD 51-7. Recommended Operating Conditions MIN NOM MAX VCC Supply voltage 3 3.3 3.6 VIH High-level input voltage 2 VIL Low-level input voltage 0.8 V IOH High-level output current –30 mA IOL Low-level output current 30 mA TA Operating free-air temperature AM26LV31C AM26LV31I UNIT V V 0 70 –45 85 °C Electrical Characteristics over recommended operating supply-voltage and free-air temperature ranges (unless otherwise noted) PARAMETER TEST CONDITIONS VIK Input clamp voltage II = 18 mA VOH High-level output voltage VIH = 2 V, IOH = –12 mA VOL Low-level output voltage VIL = 0.8 V, IOH = 12 mA |VOD| Differential output voltage (2) VOC Common-mode output voltage ∆|VOC| Change in magnitude of common-mode output voltage (2) IO Output current with power off VO = –0.25 V or 6 V, IOZ Off-state (high-impedance state) output current IH IL MIN 1.85 TYP (1) MAX UNIT –1.5 V 2.3 0.8 0.95 1.5 1.3 1.55 V 1.05 V V 1.8 V ±0.2 V VCC = 0 ±100 µA VO = –0.25 V or 6 V, G = 0.8 V or G = 2 V ±100 µA High-level input current VCC = 0 or 3 V, VI = 5.5 V 10 µA Low-level input current VCC = 3.6 V, VI = 0 –10 µA IOS Short-circuit output current VCC = 3.6 V, VO = 0 –200 mA ICC Supply current (all drivers) VI = VCC or GND, No load 100 µA Cpd Power-dissipation capacitance (all drivers) (3) No load (1) (2) (3) RL = 100 Ω 160 pF All typical values are at VCC = 3.3 V, TA = 25°C. ∆|VOD| and ∆|VOC| are the changes in magnitude of VOD and VOC, respectively, that occur when the input is changed from a high level to a low level. Cpd determines the no-load dynamic current consumption. IS = Cpd × VCC × f + ICC 3 AM26LV31C, AM26LV31I LOW-VOLTAGE HIGH-SPEED QUADRUPLE DIFFERENTIAL LINE DRIVERS www.ti.com SLLS201G – MAY 1995 – REVISED MAY 2005 Switching Characteristics VCC = 3.3 V, TA = 25°C PARAMETER TEST CONDITIONS See Figure 2 MIN TYP (1) MAX 4 8 12 ns 4 8 12 ns 0.3 1 V/ns UNIT tPLH Propagation delay time, low- to high-level output tPHL Propagation delay time, high- to low-level output tt Transition time (tr or tf) SR Slew rate, single-ended output voltage See Note tPZH Output-enable time to high level See Figure 3 10 20 ns tPZL Output-enable time to low level See Figure 4 10 20 ns tPHZ Output-disable time from high level See Figure 3 10 20 ns tPLZ Output-disable time from low level See Figure 4 10 20 ns 0.5 1.5 ns 1.5 ns 3 ns 3 (2) tsk(p) Pulse skew f = 32 MHz, tsk(o) Skew limit f = 32 MHz tsk(lim) Skew limit (device to device) f = 32 MHz, (1) (2) (3) (4) 4 and Figure 2 See Note See Note (3) (4) ns All typical values are at VCC = 3.3 V, TA = 25°C. Slew rate is defined by: 90%V OH VOL 10%VOH VOL SR , the differential slew rate of VOD is 2 SR. tr Pulse skew is defined as the |tPLH - tPHL| of each channel of the same device. Skew limit (device to device) is the maximum difference in propagation delay times between any two channels of any two devices. AM26LV31C, AM26LV31I LOW-VOLTAGE HIGH-SPEED QUADRUPLE DIFFERENTIAL LINE DRIVERS www.ti.com SLLS201G – MAY 1995 – REVISED MAY 2005 PARAMETER MEASUREMENT INFORMATION RL/2 Y Z A VOD2 G RL/2 VOC G Figure 1. Differential and Common-Mode Output Voltages Y A Generator (see Note B) VCC Z CL = 15 pF (see Note A) RL = 100 Ω VO VOD 50 Ω VO G G TEST CIRCUIT VCC Input 50% 50% A 0V tPHL tPLH Z Output, VO Y PROPAGATION DELAY TIMES 90% 10% Y VOH 90% 10% tr tf tf tr VOL Output, VO Z 90% 90% 10% 10% VOH VOL RISE AND FALL TIMES NOTES: A. CL includes probe and jig capacitance. B. The input pulse is supplied by a generator having the following characteristics: PRR = 32 MHz, ZO ≈ 50 Ω, 50% duty cycle, tr and tf ≤ 2 ns. Figure 2. Test Circuit and Voltage Waveforms, tPHL and tPLH 5 AM26LV31C, AM26LV31I LOW-VOLTAGE HIGH-SPEED QUADRUPLE DIFFERENTIAL LINE DRIVERS www.ti.com SLLS201G – MAY 1995 – REVISED MAY 2005 PARAMETER MEASUREMENT INFORMATION S1 Y A VCC Z Output CL = 15 pF (see Note A) RL = 110 Ω G Generator (see Note B) 50 Ω G VCC (see Note C) TEST CIRCUIT VCC 50% Input 50% 0V tPHZ tPZH 0.3 V VOH Output 50% Voff ≈0 VOLTAGE WAVEFORMS NOTES: A. CL includes probe and jig capacitance. B. The input pulse is supplied by a generator having the following characteristics: PRR = 1 MHz, ZO = 50 Ω, 50% duty cycle, tr and tf (10% to 90%) ≤ 2 ns. C. To test the active-low enable G, ground G and apply an inverted waveform to G. Figure 3. Test Circuit and Voltage Waveforms, tPZH and tPHZ 6 AM26LV31C, AM26LV31I LOW-VOLTAGE HIGH-SPEED QUADRUPLE DIFFERENTIAL LINE DRIVERS www.ti.com SLLS201G – MAY 1995 – REVISED MAY 2005 PARAMETER MEASUREMENT INFORMATION VCC Y A VCC RL = 110 Ω S1 Z Output CL = 15 pF (see Note A) G Generator (see Note B) 50 Ω G VCC (see Note C) TEST CIRCUIT VCC Input 50% 50% 0V tPLZ tPZL Voff ≈VCC Output 50% VOL VOLTAGE WAVEFORMS 0.3 V NOTES: A. CL includes probe and jig capacitance. B. The input pulse is supplied by a generator having the following characteristics: PRR = 1 MHz, ZO = 50 Ω, 50% duty cycle, tr and tf (10% to 90%) ≤ 2 ns. C. To test the active-low enable G, ground G and apply an inverted waveform to G. Figure 4. Test Circuit and Voltage Waveforms, tPZL and tPLZ 7 PACKAGE OPTION ADDENDUM www.ti.com 4-Jun-2007 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Eco Plan (2) Qty AM26LV31CD ACTIVE SOIC D 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM AM26LV31CDE4 ACTIVE SOIC D 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM AM26LV31CDG4 ACTIVE SOIC D 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM AM26LV31CDR ACTIVE SOIC D 16 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM AM26LV31CDRE4 ACTIVE SOIC D 16 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM AM26LV31CDRG4 ACTIVE SOIC D 16 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM AM26LV31CNSLE OBSOLETE SO NS 16 AM26LV31CNSR ACTIVE SO NS 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM AM26LV31CNSRE4 ACTIVE SO NS 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM AM26LV31CNSRG4 ACTIVE SO NS 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM AM26LV31ID ACTIVE SOIC D 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM AM26LV31IDE4 ACTIVE SOIC D 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM AM26LV31IDG4 ACTIVE SOIC D 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM AM26LV31IDR ACTIVE SOIC D 16 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM AM26LV31IDRE4 ACTIVE SOIC D 16 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM AM26LV31IDRG4 ACTIVE SOIC D 16 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM AM26LV31INSR ACTIVE SO NS 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM AM26LV31INSRE4 ACTIVE SO NS 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM AM26LV31INSRG4 ACTIVE SO NS 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TBD Lead/Ball Finish Call TI MSL Peak Temp (3) Call TI (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Addendum-Page 1 PACKAGE OPTION ADDENDUM www.ti.com 4-Jun-2007 Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 2 PACKAGE MATERIALS INFORMATION www.ti.com 4-Oct-2007 TAPE AND REEL BOX INFORMATION Device Package Pins Site Reel Diameter (mm) Reel Width (mm) A0 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant AM26LV31CDR D 16 SITE 27 330 16 6.5 10.3 2.1 8 16 Q1 AM26LV31CNSR NS 16 SITE 41 330 16 8.2 10.5 2.5 12 16 Q1 AM26LV31IDR D 16 SITE 27 330 16 6.5 10.3 2.1 8 16 Q1 AM26LV31INSR NS 16 SITE 41 330 16 8.2 10.5 2.5 12 16 Q1 Pack Materials-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com Device 4-Oct-2007 Package Pins Site Length (mm) Width (mm) Height (mm) AM26LV31CDR D 16 SITE 27 342.9 336.6 28.58 AM26LV31CNSR NS 16 SITE 41 346.0 346.0 33.0 AM26LV31IDR D 16 SITE 27 342.9 336.6 28.58 AM26LV31INSR NS 16 SITE 41 346.0 346.0 33.0 Pack Materials-Page 2 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue any product or service without notice. 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