STPAC01F2 IPAD™, RF detector for power amplifier control Features ■ STPAC01F2 has two outputs – one for the signal detection – one for the temperature compensation ■ VDCout = 0.88 V at 0.85 GHz at 10 dBm ■ VDCout = 1.07 V at 1.85 GHz at 10 dBm ■ Vsupply = 5 V max ■ Lead-free package Flip Chip (8 bumps) Figure 1. Pin layout (bump side) Benefit ■ The use of IPAD technology allows the RF front-end designer to save PCB area and to drastically reduce parasitic inductances. Applications Target applications are cellular phones and PDA using GSM, DCS, PCS, AMPS, TDMA, CDMA and 800 MHz to 1900 MHz frequency ranges. Figure 2. Description 3 2 1 DC out V Temp Gnd1 Gnd1 Gnd2 B RFin Gnd1 Bias C A Functional diagram Coupler The STPAC01F2 is an integrated RF detector for the power control stage. It converts RF signal coming from the coupler into a DC signal usable by the digital stage. It is based on the use of two similar diodes, one providing the signal detection while the second one is used to provide temperature information to a thermal compensation stage. A biasing stage suppresses the detection diode drop voltage effect. VBIAS RF input RF detector Low pass filter Thermal compensation VDCOut Vtemp STPAC01F2 GND1 GND2 TM: IPAD is a trademark of STMicroelectronics. April 2008 Rev 2 1/7 www.st.com 7 Characteristics 1 STPAC01F2 Characteristics Table 1. Absolute ratings (Tamb = 25 °C) Symbol Value Unit Bias voltage 5 V PRF RF power at the RF input 20 dBm FOP Operating frequency range 0.8 to 2 GHz VPP ESD level as per MIL-STD 883E method 3015.7 notice 8 (HBM) 250 V TOP Operating temperature range - 30 to + 85 °C TSTG Storage temperature range - 55 to + 150 °C VBIAS Table 2. Symbol Parameters related to bias voltage Parameter VBIAS Operating bias voltage IBIAS Bias current Table 3. Symbol VDCout ΔVDCout Table 4. Symbol 2/7 Parameter Test conditions Min. Typ. 2.2 VBIAS = 3.2 V Max. Unit 3.2 V 0.5 mA Unit Parameters related to detection function (VBIAS + 2.7 V, DC output load = 100 kΩ) Parameter DC output voltage (see Figure 1, IDC = 50 µA) Test conditions Min. Typ. Max. F = 1.85 GHz, PRF = 10 dBm 0.97 1.07 1.17 F = 1.85 GHz, PRF = - 20 dBm 1.83 1.93 2.03 F = 0.85 GHz, PRF = 10 dBm 0.78 0.88 0.98 F = 0.85 GHz, PRF = - 20 dBm 1.83 1.93 2.03 V 0 < Tamb < 70 °C DC output voltage F = 1.85 GHz, PRF = 10 dBm variation (see Figure 7, 2.2 < VBIAS < 3.2 V IDC = 50 µA) F = 1.85 GHz, PRF = 10 dBm 0.09 V 0.44 Parameters related detection function Parameter VTemp Temperature output voltage (see Figure 8) ΔVTemp Temperature output voltage variation (see Figure 8) Test conditions IDC = 50 µA Min. Typ. Max. Unit 1.83 1.93 2.03 V IDC = 50 µA, 0 < Tamb < 70 °C 0.09 IDC = 50 µA, 2.2 < VBIAS < 3.2V 0.44 V STPAC01F2 Figure 3. Characteristics VDCout measurement circuit Figure 4. VDCout versus RF input power VDCout RF in RF generator STPAC test board VDCOut Multimeter DC output voltage VBIAS Power supply 2 1.8 1.6 1850MHz Tamb = 25°C Ibias = 50µA Vbias = 2.7V 1.4 850MHz 1.2 Figure 5. 1 IDC Current generator 0.8 -20 Relative variation of VDCout versus frequency (from 800 to 900 MHz) -15 Figure 6. VDCout (Freq.) / VDCOut (850MHz) -10 -5 Pin (dBm) 0 5 10 Relative variation of VDCout versus frequency (from 1800 to 1900 MHz) VDCout (Freq.) / VDCOut (850MHz) 1.05 1.05 1 1 0.95 0.95 0.9 800 825 850 875 900 0.9 1800 Figure 7. 1825 1850 Temperature effect measurement circuit on VDCout Figure 8. Power supply Current generator RF in STPAC test board Climatic chamber VDCOut STPAC test board Multimeter DC output voltage VBIAS Power supply IDC 1900 Vtemp measurement circuit Climatic chamber RF generator 1875 Frequency in MHz Frequency in MHz Current generator Vtemp Multimeter Temp. voltage VBIAS IDC 3/7 Application information Figure 9. STPAC01F2 Vtemp output voltage versus ambient temperature Vtemp 1.98 Ibias = 50µA 1.96 1.94 1.92 1.9 1.88 0 10 20 30 40 50 60 70 Tamb (°C) 2 Application information Figure 10. Application diagram Coupler VBIAS IDC = 50µA RF input RF detector Low pass filter Thermal compensation VDCOut Vtemp - Out + STPAC01F2 IDC = 50µA GND1 GND2 The STPAC01 is the first part of the power amplifier stage and provides both RF power and die temperature measurements. Figure 10 shows the basic circuit of RF detector. A coupler located on the line between RF amplifier output and the antenna takes a part of the available power and applies it to STPAC01 RF input. The RF detector and the low-pass filter provide a DC voltage depending on the input power. Thermal compensation provides a DC voltage depending on the ambient temperature. As the detection system and the thermal compensation are based on the same topology, VDCout will have the same temperature variation as Vtemp. Connected to a differential amplifier, the output will be a voltage directly linked to the RF input power. VDCout and Vtemp must be biased with 50 µA DC current. This topology offers the most accurate output value as it is 100% compensated. 4/7 STPAC01F2 Package information In order to meet environmental requirements, ST offers these devices in ECOPACK® packages. These packages have a lead-free second level interconnect. The category of second level interconnect is marked on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at www.st.com. Figure 11. Flip Chip dimensions 500 µm ± 50 650 µm ± 65 315 µm ± 50 285 µm 1.57 mm ± 50 µm Figure 12. Footprint Copper pad Diameter: 250 µm recommended, 300 µm max Solder stencil opening: 330 µm Solder mask opening recommendation: 340 µm min for 300 µm copper pad diameter 285 µm 1.57 mm ± 50 µm 500 µm ± 50 3 Package information Figure 13. Marking Dot, ST logo xx = marking z = manufacturing location yww = datecode (y = year ww = week) E x x z y ww 5/7 Ordering information STPAC01F2 Figure 14. Flip Chip tape and reel specification Dot identifying Pin A1 location 3.5 ± 0.1 1.68 ST E 1.68 xxz yww xxz yww 4 ± 0.1 User direction of unreeling All dimensions in mm Note: ST E ST E xxz yww 8 ± 0.3 0.73 ± 0.05 1.75 ± 0.1 Ø 1.5 ± 0.1 4 ± 0.1 More informations are available in the application notes: AN1235:"Flip Chip: Package description and recommendations for use" AN1751: “EMI filters: Recommendations and measurements” 4 Ordering information Table 5. 5 Order code Marking Package Weight Base qty Delivery mode STPAC01F2 RA Flip Chip 3.3 mg 5000 Tape and reel 7” Revision history Table 6. 6/7 Ordering information Document revision history Date Revision Changes 21-Oct-2004 1 Initial release. 29-Apr-2008 2 Updated ECOPACK statement. Updated Figure 11, Figure 12, Figure 13 and Figure 14. Reformatted to current standards. STPAC01F2 Please Read Carefully: Information in this document is provided solely in connection with ST products. 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