STMICROELECTRONICS STPAC01F2

STPAC01F2
IPAD™, RF detector for power amplifier control
Features
■
STPAC01F2 has two outputs
– one for the signal detection
– one for the temperature compensation
■
VDCout = 0.88 V at 0.85 GHz at 10 dBm
■
VDCout = 1.07 V at 1.85 GHz at 10 dBm
■
Vsupply = 5 V max
■
Lead-free package
Flip Chip
(8 bumps)
Figure 1.
Pin layout (bump side)
Benefit
■
The use of IPAD technology allows the RF
front-end designer to save PCB area and to
drastically reduce parasitic inductances.
Applications
Target applications are cellular phones and PDA
using GSM, DCS, PCS, AMPS, TDMA, CDMA
and 800 MHz to 1900 MHz frequency ranges.
Figure 2.
Description
3
2
1
DC
out
V
Temp
Gnd1
Gnd1
Gnd2
B
RFin
Gnd1
Bias
C
A
Functional diagram
Coupler
The STPAC01F2 is an integrated RF detector for
the power control stage. It converts RF signal
coming from the coupler into a DC signal usable
by the digital stage. It is based on the use of two
similar diodes, one providing the signal detection
while the second one is used to provide
temperature information to a thermal
compensation stage. A biasing stage suppresses
the detection diode drop voltage effect.
VBIAS
RF input
RF detector
Low pass
filter
Thermal
compensation
VDCOut
Vtemp
STPAC01F2
GND1
GND2
TM: IPAD is a trademark of STMicroelectronics.
April 2008
Rev 2
1/7
www.st.com
7
Characteristics
1
STPAC01F2
Characteristics
Table 1.
Absolute ratings (Tamb = 25 °C)
Symbol
Value
Unit
Bias voltage
5
V
PRF
RF power at the RF input
20
dBm
FOP
Operating frequency range
0.8 to 2
GHz
VPP
ESD level as per MIL-STD 883E method 3015.7 notice 8 (HBM)
250
V
TOP
Operating temperature range
- 30 to + 85
°C
TSTG
Storage temperature range
- 55 to + 150
°C
VBIAS
Table 2.
Symbol
Parameters related to bias voltage
Parameter
VBIAS
Operating bias voltage
IBIAS
Bias current
Table 3.
Symbol
VDCout
ΔVDCout
Table 4.
Symbol
2/7
Parameter
Test conditions
Min.
Typ.
2.2
VBIAS = 3.2 V
Max.
Unit
3.2
V
0.5
mA
Unit
Parameters related to detection function
(VBIAS + 2.7 V, DC output load = 100 kΩ)
Parameter
DC output voltage
(see Figure 1,
IDC = 50 µA)
Test conditions
Min.
Typ.
Max.
F = 1.85 GHz, PRF = 10 dBm
0.97
1.07
1.17
F = 1.85 GHz, PRF = - 20 dBm
1.83
1.93
2.03
F = 0.85 GHz, PRF = 10 dBm
0.78
0.88
0.98
F = 0.85 GHz, PRF = - 20 dBm
1.83
1.93
2.03
V
0 < Tamb < 70 °C
DC output voltage
F = 1.85 GHz, PRF = 10 dBm
variation (see Figure 7,
2.2 < VBIAS < 3.2 V
IDC = 50 µA)
F = 1.85 GHz, PRF = 10 dBm
0.09
V
0.44
Parameters related detection function
Parameter
VTemp
Temperature output
voltage (see Figure 8)
ΔVTemp
Temperature output
voltage variation
(see Figure 8)
Test conditions
IDC = 50 µA
Min.
Typ.
Max.
Unit
1.83
1.93
2.03
V
IDC = 50 µA, 0 < Tamb < 70 °C
0.09
IDC = 50 µA, 2.2 < VBIAS < 3.2V
0.44
V
STPAC01F2
Figure 3.
Characteristics
VDCout measurement circuit
Figure 4.
VDCout versus RF input power
VDCout
RF in
RF generator
STPAC
test board
VDCOut
Multimeter
DC output
voltage
VBIAS
Power
supply
2
1.8
1.6
1850MHz
Tamb = 25°C
Ibias = 50µA
Vbias = 2.7V
1.4
850MHz
1.2
Figure 5.
1
IDC
Current
generator
0.8
-20
Relative variation of VDCout versus
frequency (from 800 to 900 MHz)
-15
Figure 6.
VDCout (Freq.) / VDCOut (850MHz)
-10
-5
Pin (dBm)
0
5
10
Relative variation of VDCout versus
frequency (from 1800 to 1900 MHz)
VDCout (Freq.) / VDCOut (850MHz)
1.05
1.05
1
1
0.95
0.95
0.9
800
825
850
875
900
0.9
1800
Figure 7.
1825
1850
Temperature effect measurement
circuit on VDCout
Figure 8.
Power
supply
Current
generator
RF in
STPAC
test board
Climatic
chamber
VDCOut
STPAC
test board
Multimeter
DC output
voltage
VBIAS
Power
supply
IDC
1900
Vtemp measurement circuit
Climatic
chamber
RF generator
1875
Frequency in MHz
Frequency in MHz
Current
generator
Vtemp
Multimeter
Temp.
voltage
VBIAS
IDC
3/7
Application information
Figure 9.
STPAC01F2
Vtemp output voltage versus ambient temperature
Vtemp
1.98
Ibias = 50µA
1.96
1.94
1.92
1.9
1.88
0
10
20
30
40
50
60
70
Tamb (°C)
2
Application information
Figure 10. Application diagram
Coupler
VBIAS
IDC = 50µA
RF input
RF detector
Low pass
filter
Thermal
compensation
VDCOut
Vtemp
-
Out
+
STPAC01F2
IDC = 50µA
GND1
GND2
The STPAC01 is the first part of the power amplifier stage and provides both RF power and
die temperature measurements. Figure 10 shows the basic circuit of RF detector.
A coupler located on the line between RF amplifier output and the antenna takes a part of
the available power and applies it to STPAC01 RF input.
The RF detector and the low-pass filter provide a DC voltage depending on the input power.
Thermal compensation provides a DC voltage depending on the ambient temperature. As
the detection system and the thermal compensation are based on the same topology,
VDCout will have the same temperature variation as Vtemp. Connected to a differential
amplifier, the output will be a voltage directly linked to the RF input power. VDCout and
Vtemp must be biased with 50 µA DC current.
This topology offers the most accurate output value as it is 100% compensated.
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STPAC01F2
Package information
In order to meet environmental requirements, ST offers these devices in ECOPACK®
packages. These packages have a lead-free second level interconnect. The category of
second level interconnect is marked on the inner box label, in compliance with JEDEC
Standard JESD97. The maximum ratings related to soldering conditions are also marked on
the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at
www.st.com.
Figure 11. Flip Chip dimensions
500 µm ± 50
650 µm ± 65
315 µm ± 50
285 µm
1.57 mm ± 50 µm
Figure 12. Footprint
Copper pad Diameter:
250 µm recommended, 300 µm max
Solder stencil opening: 330 µm
Solder mask opening recommendation:
340 µm min for 300 µm copper pad diameter
285 µm
1.57 mm ± 50 µm
500 µm ± 50
3
Package information
Figure 13. Marking
Dot, ST logo
xx = marking
z = manufacturing location
yww = datecode
(y = year
ww = week)
E
x x z
y ww
5/7
Ordering information
STPAC01F2
Figure 14. Flip Chip tape and reel specification
Dot identifying Pin A1 location
3.5 ± 0.1
1.68
ST E
1.68
xxz
yww
xxz
yww
4 ± 0.1
User direction of unreeling
All dimensions in mm
Note:
ST E
ST E
xxz
yww
8 ± 0.3
0.73 ± 0.05
1.75 ± 0.1
Ø 1.5 ± 0.1
4 ± 0.1
More informations are available in the application notes:
AN1235:"Flip Chip: Package description and recommendations for use"
AN1751: “EMI filters: Recommendations and measurements”
4
Ordering information
Table 5.
5
Order code
Marking
Package
Weight
Base qty
Delivery mode
STPAC01F2
RA
Flip Chip
3.3 mg
5000
Tape and reel 7”
Revision history
Table 6.
6/7
Ordering information
Document revision history
Date
Revision
Changes
21-Oct-2004
1
Initial release.
29-Apr-2008
2
Updated ECOPACK statement. Updated Figure 11, Figure 12,
Figure 13 and Figure 14. Reformatted to current standards.
STPAC01F2
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