STPS5H100 ® HIGH VOLTAGE POWER SCHOTTKY RECTIFIER Table 1: Main Product Characteristics IF(AV) 5A VRRM 100 V Tj 175°C VF(max) 0.61 V K A NC DPAK FEATURES AND BENEFITS ■ ■ ■ ■ ■ Negligible switching losses High junction temperature capability Low leakage current Good trade off between leakage current and forward voltage drop Avalanche specification Table 2: Order Codes Part Number STPS5H100B STPS5H100B-TR Marking S5H100 S5H100 DESCRIPTION High voltage Schottky barrier rectifier designed for high frequency miniature Switched Mode Power Supplies such as adaptators and on board DC to DC converters. Table 3: Absolute Maximum (limiting values) Symbol VRRM IF(RMS) Parameter Value Unit Repetitive peak reverse voltage 100 V RMS forward voltage 10 A 5 A δ = 0.5 IF(AV) Average forward current Tc = 165°C IFSM Surge non repetitive forward current tp = 10ms sinusoidal 75 A IRRM Repetitive peak reverse current tp = 2µs F = 1KHz 1 A IRSM Non repetitive peak reverse current tp = 100µs square 2 A PARM Repetitive peak avalanche power tp = 1µs Tj = 25°C 7200 W -65 to + 175 °C 175 °C 10000 V/µs Tstg Tj dV/dt Storage temperature range Maximum operating junction temperature Critical rate of rise of reverse voltage 1 dPtot * : --------------- > -------------------------- thermal runaway condition for a diode on its own heatsink Rth ( j – a ) dTj February 2006 REV. 8 1/5 STPS5H100 Table 4: Thermal Parameters Symbol Rth(j-c) Parameter Value Unit 2.5 °C/W Junction to case Table 5: Static Electrical Characteristics Symbol Parameter Tests conditions IR * Reverse leakage current Tj = 25°C Tj = 125°C Tj = 25°C VF ** Forward voltage drop Tj = 125°C Tj = 25°C Tj = 125°C Pulse test: Min. VR = VRRM Typ Max. Unit 3.5 µA 4.5 mA 1.3 0.73 IF = 5A 0.57 0.61 V 0.85 IF = 10A 0.66 0.71 * tp = 5 ms, δ < 2% ** tp = 380 µs, δ < 2% 2 To evaluate the conduction losses use the following equation: P = 0.51 x IF(AV) + 0.02 IF (RMS) Figure 1: Average forward power dissipation versus average forward current Figure 2: Average forward current versus ambient temperature (δ = 0.5) IF(av)(A) PF(av)(W) 4.0 δ = 0.1 3.5 δ = 0.2 6 δ = 0.5 Rth(j-a)=Rth(j-c) 5 δ = 0.05 3.0 2.5 4 δ=1 Rth(j-a)=80°C/W 3 2.0 1.5 2 T T 1.0 0.5 IF(av) (A) δ=tp/T tp 0.0 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0 Figure 3: Normalized avalanche derating versus pulse duration power 1 0 0 tp 20 40 Tamb(°C) 60 80 100 120 140 160 Figure 4: Normalized avalanche derating versus junction temperature PARM(tp) PARM(1µs) 1 δ=tp/T 1.2 180 power PARM(tp) PARM(25°C) 1 0.1 0.8 0.6 0.4 0.01 0.2 0.001 0.01 2/5 Tj(°C) tp(µs) 0.1 1 0 10 100 1000 0 25 50 75 100 125 150 STPS5H100 Figure 5: Non repetitive surge peak forward current versus overload duration (maximum values) IM(A) 120 110 100 90 80 70 60 50 40 30 IM 20 10 0 1E-3 Figure 6: Relative variation of thermal impedance junction to case versus pulse duration Zth(j-c)/Rth(j-c) 1.0 0.8 Tc=50°C 0.6 Tc=75°C 0.4 δ = 0.5 δ = 0.2 δ = 0.1 Tc=125°C t T 0.2 Single pulse t(s) δ=0.5 tp(s) 1E-2 1E-1 1E+0 Figure 7: Reverse leakage current versus reverse voltage applied 0.0 1E-3 1E-2 δ=tp/T tp 1E-1 1E+0 Figure 8: Junction capacitance versus reverse voltage applied (typical values) IR(µA) C(pF) 5E+3 1000 1E+3 F=1MHz Tj=25°C Tj=125°C 1E+2 1E+1 100 1E+0 Tj=25°C 1E-1 1E-2 VR(V) VR(V) 0 10 20 30 40 50 60 70 80 90 100 Figure 9: Forward voltage drop versus forward current (maximum values) 10 100 Rth(j-a) (°C/W) 100 90 80 70 60 50 40 30 20 10 0 Tj=125°C 10.0 Tj=25°C 1.0 VFM(V) 0.2 10 Figure 10: Thermal resistance junction to ambient versus copper surface under tab (Epoxy printed circuit board, copper thickness: 35µm) IFM(A) 50.0 0.1 0.0 1 0.4 0.6 0.8 1.0 1.2 1.4 1.6 S(Cu) (cm²) 0 2 4 6 8 10 12 14 16 18 20 3/5 STPS5H100 Figure 11: DPAK Package Mechanical Data REF. E A B2 C2 L2 D R H L4 A1 B R G C A2 0.60 MIN. V2 A A1 A2 B B2 C C2 D E G H L2 L4 V2 DIMENSIONS Millimeters Inches Min. Max Min. Max. 2.20 2.40 0.086 0.094 0.90 1.10 0.035 0.043 0.03 0.23 0.001 0.009 0.64 0.90 0.025 0.035 5.20 5.40 0.204 0.212 0.45 0.60 0.017 0.023 0.48 0.60 0.018 0.023 6.00 6.20 0.236 0.244 6.40 6.60 0.251 0.259 4.40 4.60 0.173 0.181 9.35 10.10 0.368 0.397 0.80 typ. 0.031 typ. 0.60 1.00 0.023 0.039 0° 8° 0° 8° Figure 12: Foot Print Dimensions (in millimeters) 6.7 3 3 1.6 2.3 6.7 2.3 1.6 In order to meet environmental requirements, ST offers these devices in ECOPACK® packages. These packages have a Lead-free second level interconnect . The category of second level interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com. 4/5 STPS5H100 Table 6: Ordering Information Ordering type ■ Marking STPS5H100B S5H100 STPS5H100B-TR S5H100 Package Weight DPAK 0.30 g Base qty Delivery mode 75 Tube 2500 Tape & reel Cooling method: by conduction (C) Table 7: Revision History Date Revision Jul-2003 6B Description of Changes 03-Nov-2005 7 DPAK Foot Print dimensions updated. 15-Feb-2006 8 ECOPACK statement added. Last issue. Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject to change without notice. This publication supersedes and replaces all information previously supplied. STMicroelectronics products are not authorized for use as critical components in life support devices or systems without express written approval of STMicroelectronics. The ST logo is a registered trademark of STMicroelectronics. All other names are the property of their respective owners © 2006 STMicroelectronics - All rights reserved STMicroelectronics group of companies Australia - Belgium - Brazil - Canada - China - Czech Republic - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan Malaysia - Malta - Morocco - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States of America www.st.com 5/5