STMICROELECTRONICS TDA1170D

TDA1170D
LOW-NOISE TV VERTICAL DEFLECTION SYSTEM
.
..
COMPLETE VERTICAL DEFLECTION SYSTEM
LOW NOISE
SUITABLE FOR HIGH DEFINITION MONITORS
DIP16
(Plastic Package)
DESCRIPTION
The TDA 1170D is a monolithic integrated circuit in
a 16-lead dual in-line plastic package. It is intended
for use in black and white and colour TV receivers.
Low-noise makes this device particularly suitable for use in monitors. The functions incorporated are : synchronization circuit, oscillator and
ramp generator, high power gain amplifier, flyback
generator, voltage regulator.
ORDER CODE : TDA1170D
PIN CONNECTIONS
RAMP OUTPUT
1
16
RAMP GENERATOR
SUPPLY VOLTAGE
2
15
COMPENSATION
FLYBACK
3
14
AMPLIFIER INPUT
GROUND
4
13
GROUND
GROUND
5
12
GROUND
POWER AMPLIFIER OUTPUT
6
11
OSCILLATOR
POWER AMPLIFIER
SUPPLY VOLTAGE
7
10
SYNC. INPUT
REGULATED VOLTAGE
8
9
1170D-01.EPS
HEIGHT ADJUST
December 1992
1/8
TDA1170D
BLOCK DIAGRAM
+ VS
FREQ
8
2
3
7
FLYBACK
GENERATOR
POWER
AMPLIFLIER
TDA1170D
VOLTAGE
REGULATOR
OSCILLATOR
11
6
YOKE
SYNC
SYNC
CIRCUIT
10
4
5
12
RAMP
GENERATOR
13
BUFFER
STAGE
PREAMPLIFLIER
1
16
LINEARITY
9
15
14
1170D-02.EPS
HEIGHT
Symbol
VS
V6, V7
V14
Value
Unit
Supply Voltage at Pin 2
Parameter
35
V
Flyback Peak Voltage
60
V
+ 10
– 0.5
V
V
2
A
A
Power Amplifier Input Voltage
Io
Output Peak Current (non repetitive) at t = 2msec
Io
Output Peak Current at f = 50Hz t ≤ 10µsec
2.5
Io
Output Prak Current at f = 50Hz t > 10µsec
1.5
A
I3
Pin 3 DC Current at V6 < V2
100
mA
I3
Pin 3 Peak to Peak Flyback Current for f = 50Hz, tfly ≤ 1.5msec
1.8
A
I10
Pin 10 Current
± 20
mA
Ptot
Power Dissipation : at Ttab = 90°C
at Tamb = 70 ° C (free air)
4.3
1
W
W
– 40 to 150
°C
Tstg, Tj
Storage and Junction Temperature
1170D-01.TBL
ABSOLUTE MAXIMUM RATINGS
Symbol
Rth j–case
R th j–amb
Parameter
Thermal Resistance Junction–pins
Thermal Resistance Junction-ambient
* Obtained with pins 4, 5, 12, 13 soldered to printed circuit with minimized copper area.
2/8
Max
Max
Value
Unit
14
80
°C/W
°C/W*
1170D-02.TBL
THERMAL DATA
TDA1170D
Symbol
Parameter
Test Conditions
Min.
Typ.
Max.
Unit
Fig.
1b
I2
Pin 2 Quiescent Current
I3 = 0
7
14
mA
I7
Pin 7 Quiescent Current
I6 = 0
8
17
mA
1b
– I11
Oscillator Bias Current
V11 = 1V
0.1
1
µA
1a
– I14
Amplifier Input Bias Current
V14 = 1V
– I16
Ramp Generator Bias Current
V16 = 0
– I16
Ramp Generator Current
I9 = 20µA, V16 = 0
∆I16
I16
Ramp Generator Non-linearity
∆V16 = 0 to 12V, I9 = 20µA
VS
Supply Voltage Range
18.5
1
10
µA
1b
0.02
0.3
µA
1a
20
21.5
µA
1b
0.2
1
%
1b
35
V
–
10
V1
Pin 1 Saturation Voltage to Ground
I1 = 1mA
1
1.4
V
–
V3
Pin 3 Saturation Voltage to Ground
I3 = 10mA
300
450
mV
1a
V6
Quiescent Output Voltage
Vs = 10V
R1 = 1kΩ, R2 = 1kΩ
4.1
4.4
4.75
V
1a
Vs = 35V
R1 = 3kΩ, R2 = 1kΩ
8.3
8.8
9.45
V
1a
V6L
Output Saturation Voltage to Ground
– I6 = 0.1A
– I6 = 0.8A
0.9
1.9
1.2
2.3
V
V
1c
1c
V6H
Output Saturation Voltage to Supply
I6 = 0.1A
I6 = 0.8A
1.4
2.8
2.1
3.2
V
V
1d
1d
V8
Regulated Voltage at Pin 8
6.1
6.5
6.9
V
1b
V9
Regulated Voltage at Pin 9
I9 = 20µA
6.2
6.6
7
V
1b
Regulated Voltage Drift with Supply
Voltage
∆VS = 10 to 35V
mV/V
1b
∆V8 ∆V9
,
∆VS ∆VS
V14
Amplifier Input Reference Voltage
R10
Pin 10 Input Resistance
1
2.07
V10 ≤ 0.4V
1
2.2
2.3
V
–
MΩ
1a
3/8
1170D-03.TBL
ELECTRICAL CHARACTERISTICS
(refer to the test circuits, VS = 35V, Tamb = 25oC, unless otherwise specified)
DC CHARACTERISTICS
TDA1170D
Figure 1 : DC Test Circuit
Figure 1a
Figure 1b
+ Vs
I2
V3
+ Vs
I3
I7
2
3
2
7
7
10
TDA1170D
TDA1170D
11
6
14
11
R1
I10
9
1kΩ
16
- I11
4
5
12
13
14
16
8
4
9
5
V6
- I16
V8
- I16
12
13
- I14
V9
R2
1V
8V
1V
Figure 1c
1170D-04.EPS
1170D-03.EPS
100kΩ
Figure 1d
+ Vs
2
+ Vs
7
TDA1170D
11
14
4
6
12
13
4/8
7
14
V6L
V6H
TDA1170D
11
4
1V
1170D-05.EPS
4V
5
2
I6
5
6
12
13
I6
1170D-06.EPS
1V
TDA1170D
ELECTRICAL CHARACTERISTICS
(refer to the AC test circuit, VS = 22V ; f = 50Hz ; Tamb = 25oC, unless otherwise specified)
AC CHARACTERISTICS
Parameter
Test Conditions
Is
Supply Current
I10
Sync. Input Current (positive or negative)
V6
Flyback Voltage
tfly
Min.
Iy = 1App
Typ.
Max.
140
Unit
mA
µA
500
Iy = 1App
45
Flyback Time
Iy = App
0.7
Peak to Peak Output Noise
Pin 11 Connected to GND
fo
Free Running Frequency
(P1 = R1) = 260kΩ, C2 = 0.1µF
(P1 = R1) = 300kΩ, C2 = 0.1µF
∆f
Synchronization Range
I8 = 0.5mA
Frequency Drift with Supply Voltage
Vs = 10 to 35V
0.005
Hz/V
Frequency Drift vs. Pins 4, 5, 12 and 13
Temp.
Tpins = 40 to 120°C
0.01
Hz/°C
VON
∆f
∆VS
∆f
∆Tpins
V
ms
40
48.5
42.2
mVPP
Hz
Hz
14
Hz
1170D-04.TBL
Symbol
Figure 2 : AC Test Circuit
VS = 22V
470µF
1N4001
0.1µF
7
100µF
4
5
12 13
3
Sync.
Input
2
0.1mF
3.3Ω
6
T
D
A
1
1
7
0
D
10
VD
220kΩ
100pF
15
5.6kΩ
470pF
YOKE
Ry = 10Ω
Ly = 20mH
5.6kΩ
14
22kΩ
10µF
1000µF
1
11
100kΩ
8
P1
9
16
R1
47kΩ
220kΩ
1.8kΩ
0.1µF
VRf
120kΩ
910kΩ
0.1µF
Rf
1W
1170D-07.EPS
C2
0.1µF
5/8
TDA1170D
Figure 3 : Typical Application Circuit for Smal Screen B/W TV SET (Ry = 2.9Ω, Ly = 6mH, Iy = 1.1App)
VS = 12V
C5
470µF
D1
1N4001
C4
4
7
5
12 13
2
3
C2
f sync =
50Hz
6
R5
150kΩ
T
D
A
1
1
7
0
D
0.1µF
10
R1
4.7kΩ
15
C6
470pF
100kΩ
C3
0.1µF
R13
270Ω
YOKE
Ry = 2.9Ω
Ly = 6mH
R10
R6
22kΩ
2.2kΩ
C11
100µF
C12
2200µF
1
8
9
P3
100kΩ
16
R2
150kΩ
C9
100pF
R11
1.8kΩ
14
11
P1
C10
0.1µF
R8
3.3Ω
100µF
P2
220kΩ
R3
220kΩ
C7
0.1µF
R4
910kΩ
R7
82kΩ
R9
1.8kΩ
C8
0.1µF
R12
1Ω
1170D-08.EPS
C1
0.1µF
1170D-09.TIF
Figure 4 : P.C. Board and Components Layout of the Circuit of Fig. 3 (1 : 1 scale)
6/8
TDA1170D
Figure 5 :
Example of P.C. Board Copper Area
which is Used as Heatsink
Figure 6 : External Heatsink Mounting Example
Figure 7 :
Maximum Dissipable Power and
Junction-Ambient Thermal
Resistance versus Side ”l”
1170D-11.EPS
the side ”l” of two equal square copper areas having
a thickness of 35 µ (1.4 mils).
During soldering the pins temperature must not
exceed 260 °C and the soldering time must not be
longer than 12 seconds.
The external heatsink or printed circuit copper area
must be connected to electrical ground.
1170D-10.EPS
MOUNTING INSTRUCTION
The Rth j-amb of the TDA 1170D can be reduced by
soldering the GND pins to a suitable copper area
of the printed circuit board (fig. 5) or to an external
heatsink (fig. 6).
The diagram of figure 7 shows the maximum dissipable power P tot and the Rth j-amb as a function of
1170D-13.EPS
Maximum Allowable Power
Dissipation versus Ambient
Temperature
1170D-12.EPS
Figure 8 :
7/8
TDA1170D
I
b1
L
a1
PACKAGE MECHANICAL DATA
16 PINS - PLASTIC PACKAGE
b
B
e
E
Z
e3
D
9
1
8
a1
B
b
b1
D
E
e
e3
F
i
L
Z
Min.
0.51
0.77
Millimeters
Typ.
Max.
1.65
Min.
0.020
0.030
0.5
0.25
Inches
Typ.
Max.
0.065
0.020
0.010
20
8.5
2.54
17.78
0.787
0.335
0.100
0.700
7.1
5.1
3.3
0.280
0.201
0.130
1.27
0.050
Information furnished is believed to be accurate and reliable. However, SGS-THOMSON Microelectronics assumes no responsibility
for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may result
from its use. No licence is granted by implication or otherwise under any patent or patent rights of SGS-THOMSON Microelectronics.
Specifications mentioned in this publication are subject to change without noti ce. This publication supersedes and replaces all
information previously supplied. SGS-THOMSON Microelectronics products are not authorized for use as critical components in life
support devices or systems without express written approval of SGS-THOMSON Microelectronics.
 1994 SGS-THOMSON Microelectronics - All Rights Reserved
Purchase of I2C Components of SGS-THOMSON Microelectronics, conveys a license under the Philips
I2C Patent. Rights to use these components in a I2C system, is granted provided that the system confo rms to
the I2C Standard Specifications as defined by Philips.
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8/8
DIP16.TBL
Dimensions
PM-DIP16.EPS
F
16