TDA1170N LOW-NOISE TV VERTICAL DEFLECTION SYSTEM . .. COMPLETE VERTICAL DEFLECTION SYSTEM LOW NOISE SUITABLE FOR HIGH DEFINITION MONITORS FINDIP12 (Plastic Package) DESCRIPTION The TDA1170N is a monolithic integrated circuit in a 12-lead quad in-line plastic package. It is intended for use in black and white and colour TV receivers. Low-noise makes this device particularly suitable for use in monitors. The functions incorporated are : synchronization circuit, oscillator and ramp generator, high power gain amplifier, flyback generator, voltage regulator. ORDER CODE : TDA1170N PIN CONNECTIONS RAMP OUTPUT 1 12 RAMP GENERATOR SUPPLY VOLTAGE 2 11 COMPENSATION FLYBACK 3 10 AMP. INPUT GROUND GROUND POWER AMPLIFLIER OUTPUT 4 9 OSCILLATOR POWER AMPLIFLIER SUPPLY VOLTAGE 5 8 SYNC. INPUT 6 7 HEIGHT ADJUSTMENT 1170N-01.EPS REGULATED VOLTAGE December 1992 1/8 TDA1170N BLOCK DIAGRAM + VS C4 FREQ 6 2 3 DA 5 TDA1170N P1 9 C9 RH POWER AMPLIFLIER FLYBACK GENERATOR VOLTAGE REGULATOR OSCILLATOR 4 C1 RG YOKE C8 SYNC 8 SYNC CIRCUIT RAMP GENERATOR BUFFER STAGE PREAMPLIFLIER 11 C5 7 12 1 LINEARITY TABS C7 RE 10 RD C2 P2 P3 RA HEIGHT RB RC C6 RF 1170N-02.EPS C3 Symbol VS V4, V5 V10 Parameter Value Unit Supply Voltage at Pin 2 35 V Flyback Peak Voltage 60 V + 10 – 0.5 V V Power Amplifier Input Voltage Io Output Peak Current (non repetitive) at t = 2msec Io Output Peak Current at f = 50Hz t ≤ 10µsec Io Output Peak Current at f = 50Hz t > 10µsec 1.5 A I3 Pin 3 DC Current at V4 < V2 100 mA I3 Pin 3 Peak to Peak Flyback Current for f = 50Hz, tfly ≤ 1.5msec 1.8 A I8 Pin 8 Current ± 20 mA 5 1 W W – 40, +150 °C Ptot Tstg, Tj Power Dissipation : at Tab = 90°C at Tamb = 80°C (free air) Storage and Junction Temperature 2 A 2.5 A 1170N-01.TBL ABSOLUTE MAXIMUM RATINGS Symbol Rth j-tab R th j-amb Parameter Thermal Resistance Junction-tab Thermal Resistance Junction-ambient * Obtained with tabs soldered to printed circuit with minimized copper area. 2/8 Max Max Value Unit 12 70 °C/W °C/W * 1170N-02.TBL THERMAL DATA TDA1170N Symbol Parameter Test Conditions Min. Typ. Max. Unit Fig. 1b I2 Pin 2 Quiescent Current I3 = 0 7 14 mA I5 Pin 5 Quiescent Current I4 = 0 8 17 mA 1b – I9 Oscillator Bias Current V9 = 1V 0.1 1 µA 1a – I10 Amplifier Input Bias Current V10 = 1V – I12 Ramp Generator Bias Current V12 = 0 – I12 Ramp Generator Current I7 = 20µA, V12 = 0 ∆I12 I12 Ramp Generator Non-linearity ∆V12 = 0 to 12V, I7 = 20µA Vs Supply Voltage Range 18.5 1 10 µA 1b 0.02 0.3 µA 1a 20 21.5 µA 1b 0.2 1 % 1b 35 V 10 V1 Pin 1 Saturation Voltage to Ground I1 = 1mA 1 1.4 V V3 Pin 3 Saturation Voltage to Ground I3 = 10mA 300 450 mV 1a V4 Qiuescent output Voltage VS = 10V R1 = 1kΩ, R2 = 1kΩ 4.1 4.4 4.75 V 1a VS = 35V R1 = 3kΩ, R2 = 1kΩ 8.3 8.8 9.45 V 1a V4L Output Saturation Voltage to Ground – I4 = 0.1A – I4 = 0.8A 0.9 1.9 1.2 2.3 V V 1c 1c V4H Output Saturation Voltage to Supply I4 = 0.1A I4 = 0.8A 1.4 2.8 2.1 3.2 V V 1d 1d V6 Regulated Voltage at Pin 6 6.1 6.5 6.9 V 1b V7 Regulated Voltage at Pin 7 I7 = 20µA 6.2 6.6 7 V 1b Regulated Voltage Drift with Supply Voltage ∆VS = 10 to 35V mV/V 1b |∆V6| ∆V7 ; ∆VS ∆VS V10 Amplifier Input Reference Voltage R8 Pin 8 Input Resistance 1 2.07 V8 ≤ 0.4V 1 2.2 2.3 V MΩ 1a 3/8 1170N-03.TBL ELECTRICAL CHARACTERISTICS (Refer to the test circuits, VS = 35 V, Tamb = 25oC,unless otherwise specified) DC CHARACTERISTICS TDA1170N Figure 1 : DC Test Circuits Figure 1a Figure 1b + Vs I2 V3 + Vs I3 I5 2 3 2 5 5 8 TDA1170N TDA1170N 9 4 10 9 R1 TABS I8 7 12 TABS 10 6 - I9 V4 - I12 R2 1V 1V 7 V6 - I12 - I10 V7 8V 1V 1170N-03.EPS 1170N-04.EPS 100kΩ Figure 1c Figure 1d + Vs 2 + Vs 5 TDA1170N 9 2 I4 4 5 TDA1170N 9 TABS 4 TABS 10 10 V4L 1V 1170N-05.EPS 4V 4/8 V4H I4 1170N-06.EPS 1kΩ 12 TDA1170N ELECTRICAL CHARACTERISTICS (Refer to the AC test circuit, VS = 22V ; f = 50Hz ; Tamb = 25°C, unless otherwise specified) AC CHARACTERISTICS Parameter Test Conditions Min. Typ. Is Supply Current I8 Sync. Input Current (positive or negative) Iy = 1App V4 Flyback Voltage Iy = 1App 45 tfly Flyback Time Iy = 1App 0.7 VON Peak to Peak Output Noise Pin 9 Connected to GND fo Free Running Frequency (P1 + R1) = 300kΩ, C2 = 0.1µF (P1 + R1) = 260kΩ, C2 = 0.1µF ∆f Max. 140 Unit mA µA 500 V ms 40 42.2 48.5 14 mVPP Hz Hz Sychronization Range I8 = 0.5mA ∆f ∆VS Hz Frequency Drift with Supply Voltage Vs = 10 to 35V 0.005 Hz/V | ∆f | ∆Tab Frequency Drift with tab Temperature Ttab = 40 to 120°C 0.01 Hz/°C 1170N-04.TBL Symbol Figure 2 : AC Test and Application Circuit for Large Screen B/W TV Set 10Ω/20mH/1App V S = 2.2V 470µF 1N4001 TABS 0.1µF 5 100µF 2 3 Sync. Input 0.1µF 3.3Ω 4 T D A 1 1 7 0 N 8 220kΩ 100pF 11 5.6kΩ 470pF YOKE Ry = 10Ω Ly = 20mH 5.6kΩ 10 22kΩ µ 1000µF 1 9 100kΩ P1 6 7 R1 47kΩ 100kΩ 0.1µF 120kΩ 910kΩ 0.1µF 1170N-07.EPS C2 1.8kΩ 0.1µF 1Ω 5/8 TDA1170N Figure 3 : Typical Application Circuit for Small Screen 90°TVC Set (RY = 15Ω, LY = 30mH, IY = 0.82 App) V S = 26V C5 470µF D1 1N4001 TABS 5 C4 100 µF 2 4 3 f sync = 50Hz R5 390kΩ T D A 1 1 7 0 N C2 0.1µF 8 R1 4.7kΩ C6 470pF 100kΩ C3 0.15µF R11 5.6kΩ R13 270Ω YOKE Ry = 15Ω Ly = 30mH R10 R6 18kΩ 5.6kΩ C11 10µF C12 1000µF 1 6 7 P3 100kΩ 12 R2 150kΩ C9 100pF 10 9 P1 C10 0.1µF R8 3.3Ω P2 100kΩ R3 100kΩ C7 0.1µF R4 680kΩ R7 47kΩ R9 1.5kΩ C8 0.1µF R12 1Ω 1170N-08.EPS C1 0.1µF 1170N-09.TIF Figure 4 : P.C. Board and Components Layout of the Circuit of fig. 3 (1:1 scale) 6/8 TDA1170N MOUNTING INSTRUCTION The external heatsink or printed circuit copper area must be connected to electrical ground. The junction to ambient thermal resistance can be The diagram of fig. 7 shows the maximum dissipable power Ptot and the Rth j-amb as a function of the side ”e” of two equal square copper areas having a thicknessof 35 µ (1.4 mil). Figure 5 : Example of P.C. Board Copper Area Used as Heatsink Figure 6 : Example of External heatsink Figure 7 : Maximum Power Dissipation and Junction-Ambient Thermal Resistance versus ”e” 1170N-11.EPS reduced by soldering the tabs to a suitable copper area of the printed circuit board (fig. 5) or to an external heatsink (fig. 6). 1170N-10.EPS During soldering the tab temperature must not exceed 260°C and the soldering time must not be longer than 12 seconds. Maximum Allowable Power Dissipation versus Ambient Temperature 1170N-13.EPS 1170N-12.EPS Figure 8 : 7/8 TDA1170N PACKAGE MECHANICAL DATA : 12 PINS - PLASTIC FINDIP G D I b1 M L a1 A e4 b c c1 e5 e E1 e6 E2 e3 E KD 7 1 6 PM-FDIP.EPS F 12 A a1 b b1 c c1 D E E1 E2 e e3 e4 e5 e6 F G I K L M Min. 3.8 1.5 0.55 0.3 Millimeters Typ. Max. 4.05 1.75 0.6 0.35 Min. 0.150 0.059 0.022 0.012 1.32 0.94 19.2 16.8 4.86 10.11 2.29 17.43 7.27 12.35 6.3 17.2 2.54 17.78 7.62 7.62 12.7 Max. 0.159 0.069 0.024 0.014 0.052 0.037 19.9 17.6 5.56 10.81 2.79 18.13 0.756 0.661 0.191 0.398 0.090 0.686 7.97 13.05 7.1 0.286 0.486 0.248 8.6 6.5 2.9 3.1 0.307 0.240 0.098 0.098 9.8 7.8 6.1 2.5 2.5 Inches Typ. 0.677 0.100 0.700 0.300 0.300 0.500 0.783 0.693 0.219 0.426 0.110 0.714 0.314 0.514 0.280 0.386 0.339 0.256 0.114 Information furnished is believed to be accurate and reliable. However, SGS-THOMSON Microelectronics assumes no responsibility for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No licence is granted by implication or otherwise under any patent or patent rights of SGS-THOMSON Microelectronics. Specifications mentioned in this publication are subject to change without noti ce. This publication supersedes and replaces all information previously supplied. SGS-THOMSON Microelectronics products are not authorized for use as critical components in life support devices or systems without express written approval of SGS-THOMSON Microelectronics. 1994 SGS-THOMSON Microelectronics - All Rights Reserved Purchase of I2C Components of SGS-THOMSON Microelectronics, conveys a license under the Philips I2C Patent. Rights to use these components in a I2C system, is granted provided that the system confo rms to the I2C Standard Specifications as defined by Philips. SGS-THOMSON Microelectronics GROUP OF COMPANIES Australia - Brazil - China - France - Germany - Hong Kong - Italy - Japan - Korea - Malaysia - Malta - Morocco The Netherlands - Singapore - Spain - Sweden - Switzerland - Taiwan - Thailand - United Kingdom - U.S.A. 8/8 FINDIP.TBL Dimensions