TDA1175P LOW-NOISE VERTICAL DEFLECTION SYSTEM . .. . COMPLETE VERTICAL DEFLECTION SYSTEM LOW NOISE SUITABLE FOR HIGH DEFINITION MONITORS ESD PROTECTED POWERDIP16 (Plastic Package) DESCRIPTION The TDA1175P is a monolithic integrated circuit in POWERDIP16 plastic package. It is intended for use in black and white and colour TV receivers. Low-noise makes this device particularly suitable for use in monitors. The functions incorporated are : synchronization circuit, oscillator and ramp generator, high power gain amplifier, flyback generator, voltage regulator. ORDER CODE : TDA1175P PIN CONNECTIONS RAMP OUTPUT 1 16 RAMP GENERATOR SUPPLY VOLTAGE 2 15 COMPENSATION FLYBACK 3 14 AMP. INPUT GROUND 4 13 GROUND GROUND 5 12 GROUND POWER AMPLIFIER OUTPUT POWER AMPLIFIER SUPPLY VOLTAGE REGULATED VOLTAGE 6 11 OSCILLATOR 7 10 SYNC. INPUT 8 9 1175P-01.EPS HEIGHT ADJUSTMENT August 1995 1/8 TDA1175P BLOCK DIAGRAM + VS C4 FREQ P1 8 TDA1175P 11 2 3 DA 7 C9 RH VOLTAGE REGULATOR OSCILLATOR POWER AMPLIFIER FLYBACK GENERATOR 6 C1 RG YOKE C8 SYNC CIRCUIT 10 SYNC RAMP GENERATOR BUFFER STAGE 15 PREAMPLIFIER C5 4 5 12 13 9 16 1 LINEARITY RD C2 TABS HEIGHT C7 RE 14 P2 RA RB P3 RC C6 RF 1175P-02.EPS C3 ABSOLUTE MAXIMUM RATINGS Vs V6, V7 V14 Parameter Value Unit Supply Voltage at Pin 2 35 V Flyback Peak Voltage 60 V + 10 – 0.5 V V 2 A Power Amplifier Input Voltage Io Output Peak Current (non repetitive) at t = 2ms Io Output Peak Current at f = 50Hz, t ≤ 10µs 2.5 A Io Output Peak Current at f = 50Hz, t > 10µs 1.5 A I3 Pin 3 DC Current at V6 < V2 100 mA I3 Pin 3 Peak to Peak Flyback Current for f = 50Hz, tfly ≤ 1.5ms 1.8 A I10 Pin 10 Current ± 20 mA Ptot Power Dissipation : at Ttab = 90°C at Tamb = 70°C (free air) (1) 4.3 1 W W – 40, + 150 °C Tstg, Tj Storage and Junction Temperature 1175P-01.TBL Symbol Symbol Value Unit R th (j-tab) Thermal Resistance Junction-pin Parameter Max. 12 °C/W Rth (j-amb) Thermal Resistance Junction-ambient Max. 80 °C/W(1) (1) Obtained with tabs soldered to printed circuit with minimized copper area. 2/8 1175P-02.TBL THERMAL DATA TDA1175P ELECTRICAL CHARACTERISTICS (Tamb = 25 °C, unless otherwise specified) Symbol Parameter Test Conditions Min. Typ. Max. Unit Fig. DC CHARACTERISTICS (Refer to the test circuits, VS = 35V) I2 Pin 2 Quiescent Current I3 = 0 7 14 mA 1b I7 Pin 7 Quiescent Current I6 = 0 8 17 mA 1b – I 11 Oscillator Bias Current V11 = 1V 0.1 1 µA 1a – I 14 Amplifier Input Bias Current V14 = 1V 1 10 µA 1b – I 16 Ramp Generator Bias Current V16 = 0 0.02 0.3 µA 1a – I 16 Ramp Generator Current I9 = 20µA, V16 = 0 20 21.5 µA 1b ∆I16 I16 Ramp Generator Non-linearity ∆V16 = 0 to 12V, I9 = 20µA 0.2 1 % 1b 35 V Vs Supply Voltage Range 18.5 10 V1 Pin 1 Saturation Voltage to Ground I1 = 1mA 1 1.4 V V3 Pin 3 Saturation Voltage to Ground I3 = 10mA 1.5 2.5 V 1a V6 Qiuescent output Voltage Vs = 10V, R1 = 1kΩ, R2 = 1kΩ Vs = 35V, R1 = 3kΩ, R2 = 1kΩ 4.4 8.8 4.7 9.4 V V 1a 1a V6L Output Saturation Voltage to Ground – I6 = 0.1A – I6 = 0.8A 0.9 1.8 1.2 2.2 V v 1c 1c V6H Output Saturation Voltage to Supply I6 = 0.1A I6 = 0.8A 1.4 2.8 2.1 3.1 V V 1d 1d V8 Regulated Voltage at Pin 8 6.5 6.7 6.9 V 1b V9 Regulated Voltage at Pin 9 6.6 6.8 7 V 1b 1 2 mV/V 1b 2.27 2.35 V mA 2 2 mA 2 |∆V8| |∆V9| Regulated Voltage Drift with Supply , Voltage ∆VS ∆VS V14 Amplifier Input Reference Voltage I9 = 20µA 4.1 8.2 ∆Vs = 10 to 35V V10 ≤ 0.4V 2.20 Is Supply Current I10 Sync. Input Current (positive or negative) Iy = 1APP 140 0.5 V6 Flyback Voltage Iy = 1APP 45 V 2 tfly Flyback Time Iy = 1APP 0.7 ms 2 VON Peak to Peak Output Noise Pin 11 Connected to GND mVpp 2 Free Running Frequency (P1 + R1) = 300kΩ C9 = 0.1 µF Hz 2 Hz 2 Hz 2 fo fOPER ∆f Operating Frequency Range Synchronization Range 18 36 10 I10 = 0.5mA, C9 = 0.1µF (P1+R1) = 300kΩ 30 43.5 120 14 ∆f ∆VS Frequency Drift with Supply Voltage Vs = 10 to 35V 0.005 Hz/V 2 |∆f| ∆T ab Frequency Drift with tab Temperature 0.01 Hz/°C 2 Ttab = 40 to 120°C 3/8 1175P-03.TBL AC CHARACTERISTICS (Refer to the AC test circuit, VS = 22V, f = 50Hz) TDA1175P Figure 1 : DC Test Circuits Figure 1a Figure 1b V3 +V S I2 +V S I3 I5 3 2 2 7 7 10 TDA1175P 6 TDA1175P 11 11 1V 1V R1 - I 12 16 8 V6 V4 9 - I 12 R2 8V TABS - I 10 V7 100kΩ - I9 14 1V 1175P-03.EPS 1kΩ 16 TABS Figure 1c 1175P-04.EPS 9 I8 14 Figure 1d +V S 11 I4 7 TDA1175P 14 2 6 11 TDA1175P 14 TABS 6 TABS I4 V4L 1V 1175P-05.EPS 4V 4/8 V 4H 7 1175P-06.EPS 2 +V S TDA1175P Figure 2 : AC Test and Application Circuit for Large Screen B/W TV Set 10Ω/20mH/1APP VS = 22V 0.1µF 470µF 1N4001 TABS 100µF 7 0.1µF 2 3.3Ω 3 6 220kΩ Yoke Ry = 10Ω Ly = 20mH 5.6kΩ 100pF 560Ω* 15 SYNC. INPUT 1000µF 470pF 10 5.6kΩ TDA1175P 14 10µF 22kΩ 1 11 P1 100kΩ 100kΩ 8 R1 9 16 47kΩ 1.8kΩ 220kΩ 100kΩ 0.1µF C9 0.1µF 1Ω 910kΩ 1175P-07.EPS 120kΩ 0.1µF * on application only Figure 3 : Typical Application Circuit for VGA Monitor (RY = 10Ω, LY = 20mH, IY = 0.8APP) C9 C10 560pF 3.3nF R12 R13 3.3Ω 220kΩ C1 0.1µF C2 1000µF 35V 15 D1 1N4007 2 C11 0.1µF C8 22µF 35V 6 R7 27kΩ 7 R1 3.3kΩ R8 10 1 47kΩ 11 R9 5.1kΩ P3 50kΩ C4 0.15µF 8 9 16 R2 82kΩ 5 12 13 V.LIN R6 56kΩ R10 0.82Ω R4 1MΩ C7 0.1µF V. FREQ R3 240kΩ 4 C6 0.1µF P1 100kΩ R5 200kΩ Y1 YOKE TDA1175P 3 C5 1.8nF R14 220Ω 1/2W 14 C3 100µF 35V C12 470µF 50V P2 220kΩ 1175P-08.EPS VS (26V) R11 2.7kΩ V. SIZE 5/8 TDA1175P Figure 4 : P.C. Board and Components Layout of the Circuit of Figure 3 (1:1 scale) V-SIZE V-FREQ C9 C12 R12 C18 C6 P2 R18 P1 R6 R9 C2 R11 R2 GN D C4 VS C11 R1 R10 C1 D1 C8 Y1 IC1 R8 C3 R14 P3 R7 V.LIN C7 1175P-09.EPS R8 R4 C6 R6 R Item Qty Reference Part Item Qty Reference Part 1 4 C1, C6, C7, C11 0.1µF 16 1 R2 82kΩ 2 1 C2 1000µF 35V 17 1 R3 240kΩ 3 1 C3 100µF 35V 18 1 R4 1MΩ 4 1 C4 0.15µF 19 1 R5 200kΩ 5 1 C5 1.8nF 20 1 R6 56kΩ 6 1 C8 22µF 35V 21 1 R7 27kΩ 7 1 C9 3.3nF 22 1 R8 47kΩ 8 1 C10 560pF 23 1 R9 5.1kΩ 9 1 C12 470µF 50V 24 1 R10 0.82Ω 10 1 D1 1N4007 25 1 R11 2.7kΩ 11 1 IC1 TDA1175P 26 1 R12 220kΩ 6/8 12 1 P1 100kΩ POT 27 1 R13 3.3Ω 13 1 P2 220kΩ POT 28 1 R14 220Ω 1/2W 14 1 P3 50kΩPOT 29 1 Y1 YOKE 15 1 R1 3.3kΩ 1175P-04.TBL BILL OF MATERIAL TDA1175P MOUNTING INSTRUCTION The Rth (j-a) can be reduced by soldering the GND pins to a suitable copper area of the printed circuit board (Figure 5) or to an external heatsink (Figure 6). The diagram of Figure 7 shows the maximum dissipable power Ptot and the Rth (j-a) as a function of the side ”I” of two equal square copper areas having a thicknessof 35µ (1.4 mils). Figure 5 : Example of P.C. Board Copper Area Figure 6 : External Heatsink Mounting Example During soldering the pins temperature must not exceed 260°C and the soldering time must not be longer than 12 seconds. 1175P-10.EPS 1175P-11.EPS The external heatsink or printed circuit copper area must be connected to electrical ground. 1175P-13.EPS Figure 8 : Maximum Allowable Power Dissipation versus Ambient Temperature 1175P-12.EPS Figure 7 : Maximum Power Dissipation and Junction-ambient Thermal Resistance versus ”I” 7/8 TDA1175P I b1 L a1 PACKAGE MECHANICAL DATA 16 PINS - PLASTIC POWERDIP b B e E Z e3 D 9 1 8 a1 B b b1 D E e e3 F i L Z Min. 0.51 0.85 Millimeters Typ. Max. 1.4 Min. 0.020 0.033 0.5 0.38 Inches Typ. Max. 0.055 0.020 0.5 20 0.015 8.8 2.54 17.78 0.020 0.787 0.346 0.100 0.700 7.1 5.1 3.3 0.280 0.201 0.130 1.27 0.050 Information furnished is believed to be accurate and reliable. However, SGS-THOMSON Microelectronics assumes no responsibility for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No licence is granted by implication or otherwise under any patent or patent rights of SGS-THOMSON Microelectronics. Specifications mentioned in this publication are subject to change without notice. This publication supersedes and replaces all information previously supplied. SGS-THOMSON Microelectronics products are not authorized for use as critical components in life support devices or systems without express written approval of SGS-THOMSON Microelectronics. 1995 SGS-THOMSON Microelectronics - All Rights Reserved Purchase of I2C Components of SGS-THOMSON Microelectronics, conveys a license under the Philips I2C Patent. Rights to use these components in a I2C system, is granted provided that the system conforms to the I2C Standard Specifications as defined by Philips. SGS-THOMSON Microelectronics GROUP OF COMPANIES Australia - Brazil - China - France - Germany - Hong Kong - Italy - Japan - Korea - Malaysia - Malta - Morocco The Netherlands - Singapore - Spain - Sweden - Switzerland - Taiwan - Thailand - United Kingdom - U.S.A. 8/8 DIP16PW.TBL Dimensions PMDIP16W.EPS F 16