TB62707F
TOSHIBA Bi−CMOS INTEGRATED CIRCUIT SILICON MONOLITHIC
TB62707F
8BIT PIPO (Pallalel In , Pallalel Out) CONSTANT CURRENT DRIVERS
The TB62707F is specifically designed for LED and LED
DISPLAY constant current drivers.
This constant current output is able to set up external resistor
(IOUT = 90 mA MAX.).
This IC is monolithic integrated circuit designed to be used
together with Bi−CMOS process.
The devices consist of 8bit latches, AND−GATE and Constant
Current Drivers.
FEATURES
Weight: 0.32 g (typ.)
z Constant Current Output:
Can set up all output current with one resistor for 5 to 90mA.
z Constant Output Current Matching:
OUTPUT−GND
VOLTAGE
CURRENT
MATCHING
OUTPUT
CURRENT
≥ 0.4 [V]
±6.0 [%]
5~40 mA
≥ 0.7 [V]
±6.0 [%]
40~90 mA
z 5 V CMOS Compatible Input
z Package: SSOP24−P−300
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TB62707F
PIN CONNECTION (Top view)
BLOCK DIAGRAM
TIMING DIAGRAM
Note:
Latches are level sensitive, not rising edge sensitive and not synchronous CLOCK.
Input of LATCH −terminal to "H" level, data passes latches, and input to "L" level, data hold latches.
Input of ENABLE −terminal to "H" level, all output (OUT0~7) do off.
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TB62707F
TERMINAL DESCRIPTION
PIN No.
PIN NAME
FUNCTION
1
LATCH
2
ENABLE
4~11
IN0~7
3
NC
12
L−GND
GND terminal for controll logic.
13
P−GND
GND terminal for output constant current drivers.
14~21
OUT0~7
Output terminals.
22
P−GND
GND terminal for output constant current drivers.
23
REXT
24
VDD
Input terminal of a data strobe. Latches passes data with "H" level input of
LATCH −terminal, and hold data with "L" level input.
Input terminal of output enable. All outputs (OUT0~7) do off with "H" level input of
ENABLE −terminal, and do on with "L" level input.
Input terminal of a parallel−data for latches.
No connection.
Input terminal of connects with a resister for to set up all output current.
5V Supply voltage terminal
TRUTH TABLE
IN0~7
LATCH
ENABLE
OUT0~7
L
L
L
OFF
H
L
L
OFF
L
H
L
OFF
H
H
L
ON
L
OFF
L
H
L
ON
H
H
OFF
EQUIVALENT CIRCUIT OF INPUTS
1. ENABLE terminal
2. LATCH terminal
3. IN0~7 terminal
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TB62707F
ABSOLUTE MAXIMUM RATINGS (Ta = 25°C)
CHARACTERISTIC
SYMBOL
RATING
UNIT
Supply Voltage
VCC
7.0
V
Input Voltage
VIN
−0.3~VDD + 0.3
V
Output Current
IO
90.0
mA
Output Voltage
VO
−0.3~17.0
V
IGND
720
mA
Power Dissipation
PD
780 (Note)
mW
Operating Temperature
Topr
−40~85
°C
Storage Temperature
Tstg
−55~150
°C
GND Terminal Current
Note:
On PCB (50 × 50 × 1.6 mm Cu 30% Glass Epoxy PCB)
Ambient temperature delated above 25°C in the proportion of 6.66 mW / °C
RECOMMENDED OPERATING CONDITION (Ta = −40~85°C unless otherwise noted)
CHARACTERISTIC
SYMBOL
TEST CONDITION
MIN
TYP.
MAX
UNIT
Supply Voltage
VDD
―
4.5
5.0
5.5
V
Output Voltage
VO
―
―
―
15.0
V
88
mA
Output Current
IOUT
DC 1 circuit
5.0
―
IOH
SERIAL−OUT
―
―
1.0
mA
IOL
SERIAL−OUT
―
―
−1.0
mA
VIH
―
0.7
VDD
―
VDD
+0.3
VIL
―
−0.3
―
0.3
VDD
Input Voltage
V
tw LAT
100
―
―
tw LAT
100
―
―
tw IN
4500
―
―
tw IN
4500
―
―
4500
―
―
t w EN
4500
―
―
Set−Up Time for LATCH
tsetup (L)
100
―
―
ns
Hold Time for LATCH
thold (L)
100
―
―
ns
―
―
0.60
W
LATCH Pulse Width
INPUT Pulse Width
ENABLE Pulse Width
Power Dissipation
tw EN
PD
VDD = 4.5 V
ON PCB, Ta = 85°C
4
ns
ns
ns
2006-06-13
TB62707F
ELECTRICAL CHARACTERISTICS (VDD = 5.0 V, Ta = 25°C unless otherwise noted)
SYMBOL
TEST
CIR−
CUIT
TEST CONDITION
MIN
TYP.
MAX
"H" Level
VIH
―
―
0.7
VDD
―
VDD
"L" Level
VIL
―
―
GND
―
0.3
VDD
CHARACTERISTIC
Input Voltage
Output Leakage Current
Output Voltage
SERIAL−OUT
Output Current 1
Current Skew
Output Current 2
Current Skew
Supply Voltage Regulation
Reference Voltage
Supply Current "OFF"
UNIT
V
IOH
―
VOH = 15.0 V
―
―
10
VOL
―
IOL = 1.0 mA
―
―
0.4
VOH
―
IOL = −1.0 mA
4.6
―
―
IOL1
―
VCE = 0.7 V
35.7
42.0
48.3
mA
IOL2
―
VCE = 0.4 V
REXT = 620 Ω
(Include skew)
68.0
80.0
92.0
mA
∆ IOL1
―
IO = 40 mA,
VCE = 0.4 V
REXT = 620 Ω
―
±1.5
±6.0
%
IOL3
―
VCE = 1.0 V
64.2
75.5
86.8
mA
IOL4
―
VCE = 0.7 V
REXT = 330 Ω
(Include skew)
63.8
75.0
86.2
mA
∆ IOL2
―
IO = 75 mA
VCE = 0.7 V
REXT = 330 Ω
―
±1.5
±6.0
%
% / VDD
―
REXT = 470 Ω, Ta = −40~85°C
―
+5.0
―
%/V
Vref
―
―
―
1.26
―
V
IDD (off) 1
―
REXT = OPEN, OUT0~7 = off
VDD = 4.5 V, ENABLE = "H"
―
0.6
1.2
IDD (off) 2
―
REXT = 500 Ω, OUT0~7 = off
VDD = 4.5V , ENABLE = "H"
6.0
8.0
10.0
IDD (off) 3
―
REXT = 280 Ω, OUT0~7 = off
VDD = 4.5V, ENABLE = "H"
12.0
15.0
18.0
IDD (on) 1
―
REXT = 500 Ω, OUT0~7 = on
VDD = 4.5 V, ENABLE = "L"
8.0
13.0
20.0
IDD (on) 2
―
REXT = 280 Ω, OUT0~7 = on
VDD = 4.5 V, ENABLE = "L"
18.0
25.0
35.0
Supply Current "ON"
5
µA
V
mA
mA
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TB62707F
SWITCHING CHARACTERISTICS (Ta = 25°C, unless otherwise noted)
CHARACTERISTIC
IN−OUTn
Propagation Delay
LATCH −OUTn
Time ("L" to "H")
ENABLE −OUTn
IN−OUTn
Propagation Delay
LATCH −OUTn
Time ("H" to "L")
ENABLE −OUTn
IN
SYMBOL
tpLH
―
tw IN, IN
―
―
LATCH
tw LAT, LAT
ENABLE
tw ENA, EN
Set−up Time for
LATCH & CLOCK
L−H
Hold Time for
LATCH & CLOCK
L−H
H−L
tsetup LAT
thold LAT
CONDITION
―
tpHL
Pulse Width
H−L
TEST
CIR−
CUIT
VDD = 5.0 V
VCE = 0.4 V
VIH = VDD
VIL = GND
REXT = 500 Ω
IOUT = 40 mA
VL = 3.0 V
RL = 65 Ω
CL = 10.5 pF
MIN
TYP.
MAX
―
600
1200
―
600
1200
―
600
1200
―
300
1200
―
300
1200
―
300
1200
―
2000
3500
―
25
50
―
2000
3500
―
―
25
50
―
―
25
50
―
―
0
30
―
―
0
30
UNIT
ns
ns
ns
ns
ns
Output Rise Time
tor
―
200
1000
1200
ns
Output Fall Time
tof
―
200
1000
1200
ns
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TB62707F
DC CHARACTERISTICS TEST CIRCUIT
AC CHARACTERISTICS TEST CIRCUIT
PRECAUTIONS for USING
Utmost care is necessary in the design of the output line, VCC (VDD) and GND (L−GND, P−GND) line since IC
may be destroyed due to short−circuit between outputs, air contamination fault, or fault by improper grounding.
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TB62707F
TIMING WAVEFORM
1. INn−OUTn
2. ENABLE −OUTn
3. LATCH −OUTn
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TB62707F
LED DRIVER TB6270X SERIES APPLICATION NOTE
[1]
Output current (IOUT)
IOUT is set by the external resistor (R−EXT) as shown
in Fig.1.
[2] Total supply voltage (VLED)
This device can operate 0.4~0.7V (VO).
When a higher voltage is input to the divide, the excess
voltage is consumed inside the device, that leads to power
dissipation.
In order to minimize power dissipation and loss, we would
like to recommended to set the total supply voltage as
shown below.
VLED (Total supply voltage)
= VCE (Tr Vsat) + Vf (LED Forward voltage) + VO
When the total supply is too high considering the
power dissipation of this divide, an additional R can
decrease the supply voltage (VO). Moreover, Resistor R is calculable by the lower formula.
VLED
VF of LED
VO (min .)
IO(max.) * Nu mber of CH s(max .)
Moreover, IC operation may become unstable by long wiring. It recommends arranging IC and LED to near.
APPLICATION
[3] Pattern layout
This device owns only one ground pin that means signal ground pin and power ground pin are common.
If ground pattern layout contains large inductance and impedance and the voltage between ground and
LATCH , CLOCK terminals exceeds 2.5V by switching noise in operation, this device may miss−operate. So we
would life you to pay attention to pattern layout to minimize inductance.
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TB62707F
Package Dimensions
Weight: 0.32 g (typ.)
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TB62707F
Notes on Contents
1. Block Diagrams
Some of the functional blocks, circuits, or constants in the block diagram may be omitted or simplified for
explanatory purposes.
2. Equivalent Circuits
The equivalent circuit diagrams may be simplified or some parts of them may be omitted for explanatory
purposes.
3. Timing Charts
Timing charts may be simplified for explanatory purposes.
4. Application Circuits
The application circuits shown in this document are provided for reference purposes only.
Thorough evaluation is required, especially at the mass production design stage.
Toshiba does not grant any license to any industrial property rights by providing these examples of
application circuits.
5. Test Circuits
Components in the test circuits are used only to obtain and confirm the device characteristics. These
components and circuits are not guaranteed to prevent malfunction or failure from occurring in the
application equipment.
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TB62707F
IC Usage Considerations
Notes on Handling of ICs
(1)
The absolute maximum ratings of a semiconductor device are a set of ratings that must not be
exceeded, even for a moment. Do not exceed any of these ratings.
Exceeding the rating(s) may cause the device breakdown, damage or deterioration, and may result
injury by explosion or combustion.
(2)
Use an appropriate power supply fuse to ensure that a large current does not continuously flow in
case of over current and/or IC failure. The IC will fully break down when used under conditions that
exceed its absolute maximum ratings, when the wiring is routed improperly or when an abnormal
pulse noise occurs from the wiring or load, causing a large current to continuously flow and the
breakdown can lead smoke or ignition. To minimize the effects of the flow of a large current in case of
breakdown, appropriate settings, such as fuse capacity, fusing time and insertion circuit location, are
required.
(3)
If your design includes an inductive load such as a motor coil, incorporate a protection circuit into the
design to prevent device malfunction or breakdown caused by the current resulting from the inrush
current at power ON or the negative current resulting from the back electromotive force at power OFF.
IC breakdown may cause injury, smoke or ignition.
Use a stable power supply with ICs with built-in protection functions. If the power supply is unstable,
the protection function may not operate, causing IC breakdown. IC breakdown may cause injury,
smoke or ignition.
(4)
Do not insert devices in the wrong orientation or incorrectly.
Make sure that the positive and negative terminals of power supplies are connected properly.
Otherwise, the current or power consumption may exceed the absolute maximum rating, and
exceeding the rating(s) may cause the device breakdown, damage or deterioration, and may result
injury by explosion or combustion.
In addition, do not use any device that is applied the current with inserting in the wrong orientation
or incorrectly even just one time.
(5)
Carefully select external components (such as inputs and negative feedback capacitors) and load
components (such as speakers), for example, power amp and regulator.
If there is a large amount of leakage current such as input or negative feedback condenser, the IC
output DC voltage will increase. If this output voltage is connected to a speaker with low input
withstand voltage, overcurrent or IC failure can cause smoke or ignition. (The over current can cause
smoke or ignition from the IC itself.) In particular, please pay attention when using a Bridge Tied
Load (BTL) connection type IC that inputs output DC voltage to a speaker directly.
Points to Remember on Handling of ICs
(1)
Heat Radiation Design
In using an IC with large current flow such as power amp, regulator or driver, please design the
device so that heat is appropriately radiated, not to exceed the specified junction temperature (Tj) at
any time and condition. These ICs generate heat even during normal use. An inadequate IC heat
radiation design can lead to decrease in IC life, deterioration of IC characteristics or IC breakdown. In
addition, please design the device taking into considerate the effect of IC heat radiation with
peripheral components.
(2)
Back-EMF
When a motor rotates in the reverse direction, stops or slows down abruptly, a current flow back to
the motor’s power supply due to the effect of back-EMF. If the current sink capability of the power
supply is small, the device’s motor power supply and output pins might be exposed to conditions
beyond maximum ratings. To avoid this problem, take the effect of back-EMF into consideration in
system design.
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RESTRICTIONS ON PRODUCT USE
060116EBA
• The information contained herein is subject to change without notice. 021023_D
• TOSHIBA is continually working to improve the quality and reliability of its products. Nevertheless, semiconductor
devices in general can malfunction or fail due to their inherent electrical sensitivity and vulnerability to physical
stress. It is the responsibility of the buyer, when utilizing TOSHIBA products, to comply with the standards of
safety in making a safe design for the entire system, and to avoid situations in which a malfunction or failure of
such TOSHIBA products could cause loss of human life, bodily injury or damage to property.
In developing your designs, please ensure that TOSHIBA products are used within specified operating ranges as
set forth in the most recent TOSHIBA products specifications. Also, please keep in mind the precautions and
conditions set forth in the “Handling Guide for Semiconductor Devices,” or “TOSHIBA Semiconductor Reliability
Handbook” etc. 021023_A
• The TOSHIBA products listed in this document are intended for usage in general electronics applications
(computer, personal equipment, office equipment, measuring equipment, industrial robotics, domestic appliances,
etc.). These TOSHIBA products are neither intended nor warranted for usage in equipment that requires
extraordinarily high quality and/or reliability or a malfunction or failure of which may cause loss of human life or
bodily injury (“Unintended Usage”). Unintended Usage include atomic energy control instruments, airplane or
spaceship instruments, transportation instruments, traffic signal instruments, combustion control instruments,
medical instruments, all types of safety devices, etc. Unintended Usage of TOSHIBA products listed in this
document shall be made at the customer’s own risk. 021023_B
• The products described in this document shall not be used or embedded to any downstream products of which
manufacture, use and/or sale are prohibited under any applicable laws and regulations. 060106_Q
• The information contained herein is presented only as a guide for the applications of our products. No
responsibility is assumed by TOSHIBA for any infringements of patents or other rights of the third parties which
may result from its use. No license is granted by implication or otherwise under any patent or patent rights of
TOSHIBA or others. 021023_C
• The products described in this document are subject to the foreign exchange and foreign trade laws. 021023_E
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