TC74AC367P/F/FN/FT TOSHIBA CMOS Digital Integrated Circuit Silicon Monolithic TC74AC367P,TC74AC367F,TC74AC367FN,TC74AC367FT Hex Bus Buffer (3-state) Note: The TC74AC367 is an advanced high speed CMOS HEX BUS BUFFERs fabricated with silicon gate and double-layer metal wiring C2MOS technology. It achieves the high speed operation similar to equivalent Bipolar Schottky TTL while maintaining the CMOS low power dissipation. It contains six buffers; four buffers are controlled by an enable input ( G1 ), and the other two buffers are controlled by another enable input ( G2 ). The outputs of each buffer group are enabled when G1 and/or G2 inputs are held low; if held high, these outputs are in a high impedance state. All inputs are equipped with protection circuits against static discharge or transient excess voltage. xxxFN (JEDEC SOP) is not available in Japan. TC74AC367P TC74AC367F Features • High speed: tpd = 3.7 ns (typ.) at VCC = 5 V • Low power dissipation: ICC = 8 μA (max) at Ta = 25°C • High noise immunity: VNIH = VNIL = 28% VCC (min) • Symmetrical output impedance: |IOH| = IOL = 24 mA (min) • Capability of driving 50 Ω transmission lines. ∼ tpHL Balanced propagation delays: tpLH − • Wide operating voltage range: VCC (opr) = 2 to 5.5 V • Pin and function compatible with 74F367 TC74AC367FN TC74AC367FT Weight DIP16-P-300-2.54A SOP16-P-300-1.27A SOL16-P-150-1.27 TSSOP16-P-0044-0.65A 1 : 1.00 g (typ.) : 0.18 g (typ.) : 0.13 g (typ.) : 0.06 g (typ.) 2007-10-01 TC74AC367P/F/FN/FT Pin Assignment IEC Logic Symbol G1 1 16 VCC 1A 2 15 G2 1Y 3 14 6A 2A 4 13 6Y 2Y 5 12 5A 3A 6 11 5Y 3Y 7 10 4A GND 8 9 4Y G1 1A 2A 3A 4A G2 5A 6A (1) EN (2) (4) (6) (10) (15) (3) (5) (7) (9) 1Y 2Y 3Y 4Y EN (12) (14) (11) (13) 5Y 6Y (top view) Truth Table Inputs Output G A Y L L L L H H H X Z X: Don’t care Z: High impedance Absolute Maximum Ratings (Note 1) Characteristics Symbol Rating Unit Supply voltage range VCC −0.5 to 7.0 V DC input voltage VIN −0.5 to VCC + 0.5 V DC output voltage VOUT −0.5 to VCC + 0.5 V Input diode current IIK ±20 mA Output diode current IOK ±50 mA DC output current IOUT ±50 mA DC VCC/ground current ICC ±150 mA Power dissipation PD 500 (DIP) (Note 2)/180 (SOP/TSSOP) mW Storage temperature Tstg −65 to 150 °C Note 1: Exceeding any of the absolute maximum ratings, even briefly, lead to deterioration in IC performance or even destruction. Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum ratings and the operating ranges. Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook (“Handling Precautions”/Derating Concept and Methods) and individual reliability data (i.e. reliability test report and estimated failure rate, etc). Note 2: 500 mW in the range of Ta = −40 to 65°C. From Ta = 65 to 85°C a derating factor of −10 mW/°C should be applied up to 300 mW. 2 2007-10-01 TC74AC367P/F/FN/FT Operating Ranges (Note) Characteristics Symbol Rating Unit Supply voltage VCC 2.0 to 5.5 V Input voltage VIN 0 to VCC V VOUT 0 to VCC V −40 to 85 °C Output voltage Operating temperature Topr Input rise and fall time Note: 0 to 100 (VCC = 3.3 ± 0.3 V) dt/dV ns/V 0 to 20 (VCC = 5 ± 0.5 V) The operating ranges must be maintained to ensure the normal operation of the device. Unused inputs must be tied to either VCC or GND. Electrical Characteristics DC Characteristics Characteristics High-level input voltage Low-level input voltage Symbol VIH VIL ― ― IOH = −50 μA High-level output voltage VOH VIN = VIH or IOH = −4 mA VIL IOH = −24 mA IOH = −75 mA Low-level output voltage VOL (Note) Ta = −40 to 85°C Ta = 25°C Test Condition VCC (V) Min Typ. Max Min Max 2.0 1.50 ― ― 1.50 ― 3.0 2.10 ― ― 2.10 ― 5.5 3.85 ― ― 3.85 ― 2.0 ― ― 0.50 ― 0.50 3.0 ― ― 0.90 ― 0.90 5.5 ― ― 1.65 ― 1.65 2.0 1.9 2.0 ― 1.9 ― 3.0 2.9 3.0 ― 2.9 ― 4.5 4.4 4.5 ― 4.4 ― 3.0 2.58 ― ― 2.48 ― 4.5 3.94 ― ― 3.80 ― 5.5 ― ― ― 3.85 ― 2.0 ― 0.0 0.1 ― 0.1 0.1 ― 0.1 Unit V V V IOL = 50 μA 3.0 ― 0.0 VIN = VIH or IOL = 12 mA VIL 4.5 ― 0.0 0.1 ― 0.1 3.0 ― ― 0.36 ― 0.44 IOL = 24 mA 4.5 ― ― 0.36 ― 0.44 5.5 ― ― ― ― 1.65 5.5 ― ― ±0.5 ― ±5.0 μA IOL = 75 mA (Note) VIN = VIH or VIL V 3-state output off-state current IOZ Input leakage current IIN VIN = VCC or GND 5.5 ― ― ±0.1 ― ±1.0 μA Quiescent supply current ICC VIN = VCC or GND 5.5 ― ― 8.0 ― 80.0 μA Note: VOUT = VCC or GND This spec indicates the capability of driving 50 Ω transmission lines. One output should be tested at a time for a 10 ms maximum duration. 3 2007-10-01 TC74AC367P/F/FN/FT AC Characteristics (CL = 50 pF, RL = 500 Ω, input: tr = tf = 3 ns) Characteristics Propagation delay time Output enable time Output disable time Input capacitance Output capacitance Power dissipation capacitance Note: Symbol tpLH tpHL tpZL tpZH tpLZ tpHZ Test Condition ― ― ― Ta = −40 to 85°C Ta = 25°C VCC (V) Min Typ. Max Min Max 3.3 ± 0.3 ― 6.5 11.0 1.0 12.5 5.0 ± 0.5 ― 4.5 7.0 1.0 8.0 3.3 ± 0.3 ― 7.9 13.2 1.0 15.0 5.0 ± 0.5 ― 5.5 8.7 1.0 10.0 3.3 ± 0.3 ― 6.3 10.5 1.0 12.0 5.0 ± 0.5 ― 5.2 7.9 1.0 9.0 Unit ns ns ns CIN ― ― 5 10 ― 10 pF COUT ― ― 10 ― ― ― pF ― 28 ― ― ― pF CPD (Note) CPD is defined as the value of the internal equivalent capacitance which is calculated from the operating current consumption without load. Average operating current can be obtained by the equation: ICC (opr) = CPD·VCC·fIN + ICC/6 (per bit) 4 2007-10-01 TC74AC367P/F/FN/FT Package Dimensions Weight: 1.00 g (typ.) 5 2007-10-01 TC74AC367P/F/FN/FT Package Dimensions Weight: 0.18 g (typ.) 6 2007-10-01 TC74AC367P/F/FN/FT Package Dimensions (Note) Note: This package is not available in Japan. Weight: 0.13 g (typ.) 7 2007-10-01 TC74AC367P/F/FN/FT Package Dimensions Weight: 0.06 g (typ.) 8 2007-10-01 TC74AC367P/F/FN/FT RESTRICTIONS ON PRODUCT USE 20070701-EN GENERAL • The information contained herein is subject to change without notice. • TOSHIBA is continually working to improve the quality and reliability of its products. Nevertheless, semiconductor devices in general can malfunction or fail due to their inherent electrical sensitivity and vulnerability to physical stress. It is the responsibility of the buyer, when utilizing TOSHIBA products, to comply with the standards of safety in making a safe design for the entire system, and to avoid situations in which a malfunction or failure of such TOSHIBA products could cause loss of human life, bodily injury or damage to property. In developing your designs, please ensure that TOSHIBA products are used within specified operating ranges as set forth in the most recent TOSHIBA products specifications. Also, please keep in mind the precautions and conditions set forth in the “Handling Guide for Semiconductor Devices,” or “TOSHIBA Semiconductor Reliability Handbook” etc. • The TOSHIBA products listed in this document are intended for usage in general electronics applications (computer, personal equipment, office equipment, measuring equipment, industrial robotics, domestic appliances, etc.).These TOSHIBA products are neither intended nor warranted for usage in equipment that requires extraordinarily high quality and/or reliability or a malfunction or failure of which may cause loss of human life or bodily injury (“Unintended Usage”). Unintended Usage include atomic energy control instruments, airplane or spaceship instruments, transportation instruments, traffic signal instruments, combustion control instruments, medical instruments, all types of safety devices, etc.. Unintended Usage of TOSHIBA products listed in his document shall be made at the customer’s own risk. • The products described in this document shall not be used or embedded to any downstream products of which manufacture, use and/or sale are prohibited under any applicable laws and regulations. • The information contained herein is presented only as a guide for the applications of our products. No responsibility is assumed by TOSHIBA for any infringements of patents or other rights of the third parties which may result from its use. No license is granted by implication or otherwise under any patents or other rights of TOSHIBA or the third parties. • Please contact your sales representative for product-by-product details in this document regarding RoHS compatibility. Please use these products in this document in compliance with all applicable laws and regulations that regulate the inclusion or use of controlled substances. Toshiba assumes no liability for damage or losses occurring as a result of noncompliance with applicable laws and regulations. 9 2007-10-01