TI SNJ54HC164FK

 SCLS115D − DECEMBER 1982 − REVISED AUGUST 2003
D
D
D
D
D
D
D
D
D
Wide Operating Voltage Range of 2 V to 6 V
Outputs Can Drive Up To 10 LSTTL Loads
Low Power Consumption, 80-µA Max ICC
Typical tpd = 20 ns
±4-mA Output Drive at 5 V
Low Input Current of 1 µA Max
AND-Gated (Enable / Disable) Serial Inputs
Fully Buffered Clock and Serial Inputs
Direct Clear
SN54HC164 . . . J OR W PACKAGE
SN74HC164 . . . D, N, NS, OR PW PACKAGE
(TOP VIEW)
A
B
QA
QB
QC
QD
GND
description/ordering information
1
14
2
13
3
12
4
11
5
10
6
9
7
8
VCC
QH
QG
QF
QE
CLR
CLK
SN54HC164 . . . FK PACKAGE
(TOP VIEW)
B
A
NC
VCC
QH
These 8-bit shift registers feature AND-gated
serial inputs and an asynchronous clear (CLR)
input. The gated serial (A and B) inputs permit
complete control over incoming data; a low at
either input inhibits entry of the new data and
resets the first flip-flop to the low level at the next
clock (CLK) pulse. A high-level input enables the
other input, which then determines the state of the
first flip-flop. Data at the serial inputs can be
changed while CLK is high or low, provided the
minimum setup time requirements are met.
Clocking occurs on the low-to-high-level transition
of CLK.
4
3 2 1 20 19
18
5
17
6
16
7
15
8
14
9 10 11 12 13
QG
NC
QF
NC
QE
QD
GND
NC
CLK
CLR
QA
NC
QB
NC
QC
NC − No internal connection
ORDERING INFORMATION
PACKAGE†
TA
PDIP − N
SN74HC164N
Tube of 50
SN74HC164D
Reel of 2500
SN74HC164DR
Reel of 250
SN74HC164DT
Reel of 2000
SN74HC164NSR
Tube of 90
SN74HC164PW
Reel of 2000
SN74HC164PWR
Reel of 250
SN74HC164PWT
CDIP − J
Tube of 25
SNJ54HC164J
SNJ54HC164J
CFP − W
Tube of 150
SNJ54HC164W
SNJ54HC164W
LCCC − FK
Tube of 55
SNJ54HC164FK
SOP − NS
TSSOP − PW
−55°C
125°C
−55
C to 125
C
TOP-SIDE
MARKING
Tube of 25
SOIC − D
−40°C to 85°C
ORDERABLE
PART NUMBER
SN74HC164N
HC164
HC164
HC164
SNJ54HC164FK
† Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are
available at www.ti.com/sc/package.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
Copyright  2003, Texas Instruments Incorporated
!" # $%&" !# '%()$!" *!"&+
*%$"# $ " #'&$$!"# '& ",& "&# &-!# #"%&"#
#"!*!* .!!"/+ *%$" '$&##0 *&# " &$&##!)/ $)%*&
"&#"0 !)) '!!&"&#+
'*%$"# $')!" " 122 !)) '!!&"&# !& "&#"&*
%)&## ",&.#& "&*+ !)) ",& '*%$"# '*%$"
'$&##0 *&# " &$&##!)/ $)%*& "&#"0 !)) '!!&"&#+
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
1
SCLS115D − DECEMBER 1982 − REVISED AUGUST 2003
FUNCTION TABLE
OUTPUTS
INPUTS
CLR
CLK
A
B
QA
QB . . . QH
L
X
X
X
L
L
L
H
L
X
X
QA0
QB0
QH0
H
↑
H
H
H
QAn
QGn
H
↑
L
X
L
QAn
QGn
H
↑
X
L
L
QAn
QGn
QA0, QB0, QH0 = the level of QA, QB, or QH, respectively,
before the indicated steady-state input conditions were
established
QAn, QGn = the level of QA or QG before the most recent
↑ transition of CLK: indicates a 1-bit shift
logic diagram (positive logic)
CLK
A
B
CLR
8
1
2
C1
1D
R
C1
1D
R
C1
1D
R
C1
1D
R
C1
1D
R
C1
1D
R
C1
1D
R
9
3
4
5
6
QA
QB
QC
QD
Pin numbers shown are for the D, J, N, NS, PW, and W packages.
2
C1
1D
R
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
10
QE
11
QF
12
QG
13
QH
SCLS115D − DECEMBER 1982 − REVISED AUGUST 2003
typical clear, shift, and clear sequence
Serial Inputs
CLR
A
B
CLK
QA
QB
Outputs
QC
QD
QE
QF
QG
QH
Clear
Clear
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)†
Supply voltage range, VCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to 7 V
Input clamp current, IIK (VI < 0 or VI > VCC) (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±20 mA
Output clamp current, IOK (VO < 0 or VO > VCC) (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±20 mA
Continuous output current, IO (VO = 0 to VCC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±25 mA
Continuous current through VCC or GND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±50 mA
Package thermal impedance, θJA (see Note 2): D package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 86°C/W
N package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 80°C/W
NS package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 76°C/W
PW package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 113°C/W
Storage temperature range, Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −65°C to 150°C
† Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTES: 1. The input and output voltage ratings may be exceeded if the input and output current ratings are observed.
2. The package thermal impedance is calculated in accordance with JESD 51-7.
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
3
SCLS115D − DECEMBER 1982 − REVISED AUGUST 2003
recommended operating conditions (see Note 3)
SN54HC164
VCC
Supply voltage
VIH
VCC = 2 V
VCC = 4.5 V
High-level input voltage
VCC = 6 V
VCC = 2 V
VIL
VI
VO
Input voltage
NOM
MAX
2
5
6
NOM
MAX
2
5
6
1.5
3.15
3.15
4.2
4.2
0
VCC = 6 V
UNIT
V
V
0.5
0.5
1.35
1.35
1.8
1.8
VCC
VCC
VCC = 2 V
VCC = 4.5 V
Input transition rise/fall time
MIN
1.5
0
Output voltage
∆t/∆v†
MIN
VCC = 4.5 V
VCC = 6 V
Low-level input voltage
SN74HC164
0
VCC
VCC
0
1000
1000
500
500
400
400
V
V
V
ns
TA
Operating free-air temperature
−55
125
−40
85
°C
NOTE 3: All unused inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report,
Implications of Slow or Floating CMOS Inputs, literature number SCBA004.
† If this device is used in the threshold region (from VILmax = 0.5 V to VIHmin = 1.5 V), there is a potential to go into the wrong state from induced
grounding, causing double clocking. Operating with the inputs at tt = 1000 ns and VCC = 2 V does not damage the device; however, functionally,
the CLK inputs are not ensured while in the shift, count, or toggle operating modes.
electrical characteristics over recommended operating free-air temperature range (unless
otherwise noted)
PARAMETER
TEST CONDITIONS
IOH = −20 µA
VOH
VI = VIH or VIL
IOH = −4 mA
IOH = −5.2 mA
IOL = 20 µA
VOL
VI = VIH or VIL
IOL = 4 mA
IOL = 5.2 mA
II
ICC
Ci
4
VI = VCC or 0
VI = VCC or 0,
IO = 0
TA = 25°C
TYP
MAX
SN54HC164
SN74HC164
VCC
MIN
2V
1.9
1.998
1.9
1.9
4.5 V
4.4
4.499
4.4
4.4
6V
5.9
5.999
5.9
5.9
4.5 V
3.98
4.3
3.7
3.84
6V
5.48
5.8
MIN
MAX
5.2
MIN
MAX
UNIT
V
5.34
2V
0.002
0.1
0.1
0.1
4.5 V
0.001
0.1
0.1
0.1
6V
0.001
0.1
0.1
0.1
4.5 V
0.17
0.26
0.4
0.33
6V
0.15
0.26
0.4
0.33
6V
±0.1
±100
±1000
±1000
nA
8
160
80
µA
10
10
10
pF
6V
2 V to 6 V
POST OFFICE BOX 655303
3
• DALLAS, TEXAS 75265
V
SCLS115D − DECEMBER 1982 − REVISED AUGUST 2003
timing requirements over recommended operating free-air temperature range (unless otherwise
noted)
VCC
fclock
Clock frequency
CLR low
tw
Pulse duration
CLK high or low
Data
tsu
Setup time before CLK↑
CLR inactive
th
CLK↑
Hold time, data after CLK
TA = 25°C
MIN
MAX
SN54HC164
MIN
MAX
SN74HC164
MIN
MAX
2V
6
4.2
5
4.5 V
31
21
25
6V
36
25
28
2V
100
150
125
4.5 V
20
30
25
6V
17
25
21
2V
80
120
100
4.5 V
16
24
20
6V
14
20
18
2V
100
150
125
4.5 V
20
30
25
6V
17
25
21
2V
100
150
125
4.5 V
20
30
25
6V
17
25
21
2V
5
5
5
4.5 V
5
5
5
6V
5
5
5
UNIT
MHz
ns
ns
ns
switching characteristics over recommended operating free-air temperature range, CL = 50 pF
(unless otherwise noted) (see Figure 1)
PARAMETER
FROM
(INPUT)
TO
(OUTPUT)
fmax
tPHL
tpd
CLR
CLK
Any Q
Any Q
tt
VCC
MIN
TA = 25°C
TYP
MAX
SN54HC164
MIN
MAX
SN74HC164
MIN
2V
6
10
4.2
5
4.5 V
31
54
21
25
6V
36
62
25
28
MAX
UNIT
MHz
2V
140
205
295
255
4.5 V
28
41
59
51
6V
24
35
51
46
2V
115
175
265
220
4.5 V
23
35
53
44
6V
20
30
45
38
2V
38
75
110
95
4.5 V
8
15
22
19
6V
6
13
19
16
ns
ns
operating characteristics, TA = 25°C
PARAMETER
Cpd
Power dissipation capacitance
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
TEST CONDITIONS
TYP
UNIT
No load
135
pF
5
SCLS115D − DECEMBER 1982 − REVISED AUGUST 2003
PARAMETER MEASUREMENT INFORMATION
From Output
Under Test
VCC
High-Level
Pulse
Test
Point
50%
50%
0V
tw
CL = 50 pF
(see Note A)
VCC
Low-Level
Pulse
50%
50%
0V
LOAD CIRCUIT
VOLTAGE WAVEFORMS
PULSE DURATIONS
Input
VCC
50%
50%
0V
tPLH
Reference
Input
VCC
50%
In-Phase
Output
0V
tsu
Data
Input 50%
10%
90%
tr
tPHL
VCC
50%
10% 0 V
90%
90%
tr
th
90%
50%
10%
tPHL
Out-of-Phase
Output
90%
VOLTAGE WAVEFORMS
SETUP AND HOLD AND INPUT RISE AND FALL TIMES
tPLH
50%
10%
tf
tf
VOH
50%
10%
VOL
tf
50%
10%
90%
VOH
VOL
tr
VOLTAGE WAVEFORMS
PROPAGATION DELAY AND OUTPUT TRANSITION TIMES
NOTES: A. CL includes probe and test-fixture capacitance.
B. Phase relationships between waveforms were chosen arbitrarily. All input pulses are supplied by generators having the following
characteristics: PRR ≤ 1 MHz, ZO = 50 Ω, tr = 6 ns, tf = 6 ns.
C. For clock inputs, fmax is measured when the input duty cycle is 50%.
D. The outputs are measured one at a time with one input transition per measurement.
E. tPLH and tPHL are the same as tpd.
Figure 1. Load Circuit and Voltage Waveforms
6
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
PACKAGE OPTION ADDENDUM
www.ti.com
15-Oct-2009
PACKAGING INFORMATION
Orderable Device
Status (1)
Package
Type
5962-8416201VCA
ACTIVE
CDIP
J
14
1
TBD
A42
N / A for Pkg Type
5962-8416201VDA
ACTIVE
CFP
W
14
1
TBD
A42
N / A for Pkg Type
Package
Drawing
Pins Package Eco Plan (2)
Qty
Lead/Ball Finish
MSL Peak Temp (3)
84162012A
ACTIVE
LCCC
FK
20
1
TBD
8416201CA
ACTIVE
CDIP
J
14
1
TBD
A42
N / A for Pkg Type
SN54HC164J
ACTIVE
CDIP
J
14
1
TBD
A42
N / A for Pkg Type
SN74HC164D
ACTIVE
SOIC
D
14
50
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74HC164DE4
ACTIVE
SOIC
D
14
50
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74HC164DG4
ACTIVE
SOIC
D
14
50
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74HC164DR
ACTIVE
SOIC
D
14
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74HC164DRE4
ACTIVE
SOIC
D
14
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74HC164DRG4
ACTIVE
SOIC
D
14
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74HC164DT
ACTIVE
SOIC
D
14
250
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74HC164DTE4
ACTIVE
SOIC
D
14
250
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74HC164DTG4
ACTIVE
SOIC
D
14
250
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74HC164N
ACTIVE
PDIP
N
14
25
Pb-Free
(RoHS)
CU NIPDAU
N / A for Pkg Type
SN74HC164N3
OBSOLETE
PDIP
N
14
TBD
Call TI
SN74HC164NE4
ACTIVE
PDIP
N
14
Pb-Free
(RoHS)
CU NIPDAU
N / A for Pkg Type
SN74HC164NSR
ACTIVE
SO
NS
14
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74HC164NSRE4
ACTIVE
SO
NS
14
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74HC164NSRG4
ACTIVE
SO
NS
14
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74HC164PW
ACTIVE
TSSOP
PW
14
90
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74HC164PWE4
ACTIVE
TSSOP
PW
14
90
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74HC164PWG4
ACTIVE
TSSOP
PW
14
90
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74HC164PWR
ACTIVE
TSSOP
PW
14
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74HC164PWRE4
ACTIVE
TSSOP
PW
14
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74HC164PWRG4
ACTIVE
TSSOP
PW
14
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74HC164PWT
ACTIVE
TSSOP
PW
14
250
CU NIPDAU
Level-1-260C-UNLIM
25
Addendum-Page 1
Green (RoHS &
no Sb/Br)
POST-PLATE N / A for Pkg Type
Call TI
PACKAGE OPTION ADDENDUM
www.ti.com
15-Oct-2009
Orderable Device
Status (1)
Package
Type
Package
Drawing
Pins Package Eco Plan (2)
Qty
SN74HC164PWTE4
ACTIVE
TSSOP
PW
14
250
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74HC164PWTG4
ACTIVE
TSSOP
PW
14
250
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SNJ54HC164FK
ACTIVE
LCCC
FK
20
1
TBD
SNJ54HC164J
ACTIVE
CDIP
J
14
1
TBD
A42
N / A for Pkg Type
SNJ54HC164W
ACTIVE
CFP
W
14
1
TBD
A42
N / A for Pkg Type
Lead/Ball Finish
MSL Peak Temp (3)
POST-PLATE N / A for Pkg Type
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
6-Aug-2010
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
B0
(mm)
K0
(mm)
P1
(mm)
W
Pin1
(mm) Quadrant
SN74HC164DR
SOIC
D
14
2500
330.0
16.4
6.5
9.0
2.1
8.0
16.0
Q1
SN74HC164DR
SOIC
D
14
2500
330.0
16.4
6.55
9.05
2.1
8.0
16.0
Q1
SN74HC164DR
SOIC
D
14
2500
330.0
16.4
6.5
9.0
2.1
8.0
16.0
Q1
SN74HC164DT
SOIC
D
14
250
330.0
16.4
6.5
9.0
2.1
8.0
16.0
Q1
SN74HC164NSR
SO
NS
14
2000
330.0
16.4
8.2
10.5
2.5
12.0
16.0
Q1
SN74HC164PWR
TSSOP
PW
14
2000
330.0
12.4
6.9
5.6
1.6
8.0
12.0
Q1
SN74HC164PWT
TSSOP
PW
14
250
330.0
12.4
6.9
5.6
1.6
8.0
12.0
Q1
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
6-Aug-2010
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
SN74HC164DR
SOIC
D
14
2500
333.2
345.9
28.6
SN74HC164DR
SOIC
D
14
2500
385.0
388.0
194.0
SN74HC164DR
SOIC
D
14
2500
346.0
346.0
33.0
SN74HC164DT
SOIC
D
14
250
346.0
346.0
33.0
SN74HC164NSR
SO
NS
14
2000
346.0
346.0
33.0
SN74HC164PWR
TSSOP
PW
14
2000
346.0
346.0
29.0
SN74HC164PWT
TSSOP
PW
14
250
346.0
346.0
29.0
Pack Materials-Page 2
Height (mm)
MECHANICAL DATA
MLCC006B – OCTOBER 1996
FK (S-CQCC-N**)
LEADLESS CERAMIC CHIP CARRIER
28 TERMINAL SHOWN
18
17
16
15
14
13
NO. OF
TERMINALS
**
12
19
11
20
10
A
B
MIN
MAX
MIN
MAX
20
0.342
(8,69)
0.358
(9,09)
0.307
(7,80)
0.358
(9,09)
28
0.442
(11,23)
0.458
(11,63)
0.406
(10,31)
0.458
(11,63)
21
9
22
8
44
0.640
(16,26)
0.660
(16,76)
0.495
(12,58)
0.560
(14,22)
23
7
52
0.739
(18,78)
0.761
(19,32)
0.495
(12,58)
0.560
(14,22)
24
6
68
0.938
(23,83)
0.962
(24,43)
0.850
(21,6)
0.858
(21,8)
84
1.141
(28,99)
1.165
(29,59)
1.047
(26,6)
1.063
(27,0)
B SQ
A SQ
25
5
26
27
28
1
2
3
4
0.080 (2,03)
0.064 (1,63)
0.020 (0,51)
0.010 (0,25)
0.020 (0,51)
0.010 (0,25)
0.055 (1,40)
0.045 (1,14)
0.045 (1,14)
0.035 (0,89)
0.045 (1,14)
0.035 (0,89)
0.028 (0,71)
0.022 (0,54)
0.050 (1,27)
4040140 / D 10/96
NOTES: A.
B.
C.
D.
E.
All linear dimensions are in inches (millimeters).
This drawing is subject to change without notice.
This package can be hermetically sealed with a metal lid.
The terminals are gold plated.
Falls within JEDEC MS-004
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
MECHANICAL DATA
MTSS001C – JANUARY 1995 – REVISED FEBRUARY 1999
PW (R-PDSO-G**)
PLASTIC SMALL-OUTLINE PACKAGE
14 PINS SHOWN
0,30
0,19
0,65
14
0,10 M
8
0,15 NOM
4,50
4,30
6,60
6,20
Gage Plane
0,25
1
7
0°– 8°
A
0,75
0,50
Seating Plane
0,15
0,05
1,20 MAX
PINS **
0,10
8
14
16
20
24
28
A MAX
3,10
5,10
5,10
6,60
7,90
9,80
A MIN
2,90
4,90
4,90
6,40
7,70
9,60
DIM
4040064/F 01/97
NOTES: A.
B.
C.
D.
All linear dimensions are in millimeters.
This drawing is subject to change without notice.
Body dimensions do not include mold flash or protrusion not to exceed 0,15.
Falls within JEDEC MO-153
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
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