MX6895 -550V Full Bridge Gate Driver Features Description • • • • • • Built on Clare’s high voltage integrated circuit (HVIC) technology, the MX6895 combines high-side and low-side N-channel power MOSFET drivers in a full bridge configuration. The circuit is optimally configured to be used as a commutator for High Intensity Discharge (HID) lamps. Full Bridge Gate Driver Internal High Voltage Level Shift Function Negative 550V Lamp Supply Voltage 3V to 12V CMOS Logic Compatible 8V to 12V Input Supply Voltage No External Bootstrap Capacitors Needed Applications • • • • • • Ordering Information Commutator for High Intensity Discharge Lamps Vehicle Head Lamps Outdoor/Street Lighting Multimedia Projectors Retail Accent Lighting Warehouse Lighting Part Description MX6895BE SOIC-16 Tube (49/Tube) MX6895BETR SOIC-16 Tape & Reel (2500/Reel) Pb RoHS 2002/95/EC e3 Functional Block Diagram and Typical Application Circuit VDD 8 VDD 16 +10V INA INB 7 6 GND 1 250Ω 14 250Ω G2 INA CONTROL LOGIC G1 INB M1 13 VZ=18V A1 GATE DRIVERS G4 G3 4 250Ω 11 250Ω M3 9 VZ=18V VPP July 29, 2011 M2 IGNITER 2 A2 VZ=18V www.clare.com VZ=18V -550VDC M4 VPP 1 MX6895 1. Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1.1 Package Pinout . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1.2 Pin Description. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1.3 Absolute Maximum Ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1.4 Thermal Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1.5 Recommended Operating Conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1.6 DC Electrical Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1.7 AC Electrical Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 3 3 3 4 4 4 5 2. Functional Block Diagram and Truth Table . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 3. Input / Output Switching Waveforms. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 4. Manufacturing Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4.1 Moisture Sensitivity . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4.2 ESD Sensitivity . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4.3 Reflow Profile. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4.4 Mechanical Dimensions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 www.clare.com 8 8 8 8 9 July 29, 2011 MX6895 1 Specifications 1.2 Pin Description 1.1 Package Pinout Pin# Name Description 1 G2 High-Side Gate Driver 2 Output 1 - G2 16 - GND 2 - A2 15 - NC 2 A2 High-Side Gate Driver 2 Floating DC Power Return 3 - NC 14 - G1 3 NC No Connection 4 - G4 13 - A1 4 G4 Low-Side Gate Driver 4 Output 5 NC No Connection 5 - NC 12 - NC 6 - INB 11 - G3 6 INB Control Input for High-Side Driver 2 and Low-Side Driver 3 7 - INA 10 - NC 7 INA 8 - VDD 9 - VPP Control Input for High-Side Driver 1 and Low-Side Driver 4 8 VDD Logic Power Supply 9 VPP High-Voltage Negative Lamp Supply 10 NC No Connection 11 G3 Low-Side Gate Driver 3 Output 12 NC No Connection 13 A1 High-Side Gate Driver 1 Floating DC Power Return 14 G1 High-Side Gate Driver 1 Output 15 NC No Connection 16 GND ESD Warning: ESD (electrostatic discharge) sensitive device. Although the MX6895 features proprietary ESD protection circuitry, permanent damage may be sustained if it is subjected to high energy electrostatic discharges. Proper ESD precautions are recommended to avoid performance degradation or loss of functionality. Note: The exposed thermal pad of the device package must be connected to GND (ground). Ground 1.3 Absolute Maximum Ratings Parameter Symbol Min Power Supply Voltage Range VDD -0.3 - 15 V Lamp Supply Voltage, Max VPP - - V VINA, VINB -0.3 - -550 VDD+0.3 VG1-VA1 VG2-VA2 VG3-VPP VG4-VPP -0.3 - 20 V Power Dissipation PD - - 2.9 W Operating Junction Temperature Input Capacitance of External Power Transistors Storage Temperature TJ - - 150 °C CISS(LOAD) 0.4 - 1.5 nF TSTG -50 - 150 °C Input Voltage Gate Driver Output Voltage Absolute maximum electrical ratings are at 25°C. Voltages with respect to GND=0V. July 29, 2011 Typ Max Units V Absolute maximum ratings are stress ratings. Stresses in excess of these ratings can cause permanent damage to the device. Functional operation of the device at conditions beyond those indicated in the operational sections of this data sheet is not implied. www.clare.com 3 MX6895 1.4 Thermal Characteristics Parameter Thermal Resistance, Junction-to-Ambient 1 Symbol Minimum Typical Maximum Unit RJA - 42 - °C/W 1 4-layer PCB 1.5 Recommended Operating Conditions Parameter Symbol Min Typ Max Units Power Supply Voltage VDD 8 10 12 V Lamp Supply Voltage VPP -50 - -550 V Logic Input Voltage, High VINAH, VINBH 2.5 VDD VDD V Logic Input Voltage, Low VINAL, VINBL 0 0 0.5 V TA -40 - 105 °C Ambient Temperature 1.6 DC Electrical Characteristics Parameter Conditions Symbol Min Typ Max Units Power Supply Current VDD=10V, VPP= -85V, VINA=VDD , VINB=VDD IDD - 1 2 mA Power Supply Current VDD=10V, VPP= -85V, VINA=VDD , VINB=VDD IPP - 0.8 2 mA Power Supply Current VDD=10V, VPP= -85V, VINA=2.5V, VINB=2.5V IDD - 1.5 4 mA VINAH=10V, VINBH=10V IINAH, IINBH - - 10 A VINAL=0V, VINBL=0V IINAL, IINBL - - 10 A VDD=8V, VPP= -85V, VA1=VA2=0V (VG1-VA1), (VG2-VA2) 7 - 8 V VDD=10V, VPP= -85V, VA1=VA2=0V (VG1-VA1), (VG2-VA2) 9 - 10 V VDD=8V to 10V, VPP= -85V (VG3-VPP), (VG4-VPP) 7 16 18 V High-Side Gate Driver Output Source Current VDD=10V, VPP= -85V, VA1=VA2=0V, VG1-VA1=0V, VG2-VA2=0V (IG1, IG2) - -3.9 - mA Low-Side Gate Driver Output Source Current VDD=8V to 10V, VPP= -85V, VG3-VPP=0V, VG4-VPP=0V (IG3, IG4) - -14 - mA High Input Current Low Input Current High-Side Gate Driver Output Voltage High-Side Gate Driver Output Voltage Low-Side Gate Driver Output Voltage 4 www.clare.com July 29, 2011 MX6895 1.7 AC Electrical Characteristics Test Conditions: VDD=10V, VPP=-85V, VA1=VA2=0V, TA=25° unless otherwise specified. Parameter Conditions Symbol Minimum Typical Maximum Units - fOP - 0.5 - kHz - 3.48 - s - 3.77 - - 0.31 - - 0.66 - - 2.46 - - 2.44 - - 0.29 - - 0.76 - Operating Frequency CLOAD=1nF, RS=0 High-Side ON Time @ VOUT=5V CLOAD=1nF, RS=0 High-Side OFF Time @ VOUT=2V tOFFH CLOAD=1nF, RS=250 CLOAD=1nF, RS=0 Low-Side ON Time @ VOUT=5V tONL CLOAD=1nF, RS=250 CLOAD=1nF, RS=0 Low-Side OFF Time @ VOUT=2V Notes: tONH CLOAD=1nF, RS=250 tOFFL CLOAD=1nF, RS=250 s s s 1. VOUT is the voltage on CLOAD at the defined time. 2. VOUT = VG1-VA1, or VOUT = VG2-VA2, or VOUT = VG3-VPP , or VOUT = VG4-VPP Figure 1. AC Test Circuit 8 VDD GND 16 RS 1 7 G2 INA 14 6 RS G1 CL INB MX6895 A1 A2 13 VG2-VA2 VG1-VA1 CL VA1 2 VA2 RS 4 G4 11 RS CL VG4-VPP G3 CL 9 VG3-VPP Vpp VPP Figure 2. AC Switching Waveforms High Low t VG1-VA1 VG2-VA2 VG3-VPP VG4-VPP CLOAD=1nF 5V 2V t tON July 29, 2011 www.clare.com tOFF 5 MX6895 2 Functional Block Diagram and Truth Table MX6895 VDD G1 A1 INA G2 CONTROL LOGIC A2 INB G3 G4 VPP GND 6 INA INB G1 - A1 G2 - A2 G3 - VPP G4 - VPP LOW HIGH LOW HIGH LOW LOW HIGH HIGH LOW HIGH LOW LOW LOW LOW HIGH LOW LOW LOW HIGH LOW LOW HIGH LOW LOW www.clare.com July 29, 2011 MX6895 3 Input / Output Switching Waveforms VINA High Low t VINB High Low tDEAD t tON t VG1-A1 VG4-VPP VG2-A2 VG3-VPP tOFF July 29, 2011 t www.clare.com 7 MX6895 4 Manufacturing Information 4.1 Moisture Sensitivity All plastic encapsulated semiconductor packages are susceptible to moisture ingression. Clare classified all of its plastic encapsulated devices for moisture sensitivity according to the latest version of the joint industry standard, IPC/JEDEC J-STD-020, in force at the time of product evaluation. We test all of our products to the maximum conditions set forth in the standard, and guarantee proper operation of our devices when handled according to the limitations and information in that standard as well as to any limitations set forth in the information or standards referenced below. Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced product performance, reduction of operable life, and/or reduction of overall reliability. This product carries a Moisture Sensitivity Level (MSL) rating as shown below, and should be handled according to the requirements of the latest version of the joint industry standard IPC/JEDEC J-STD-033. Device Moisture Sensitivity Level (MSL) Rating MX6895BE MSL 1 4.2 ESD Sensitivity This product is ESD Sensitive, and should be handled according to the industry standard JESD-625. 4.3 Reflow Profile This product has a maximum body temperature and time rating as shown below. All other guidelines of J-STD-020 must be observed. Pb 8 RoHS 2002/95/EC Device Maximum Temperature x Time MX6895BE 260°C for 30 seconds e3 www.clare.com July 29, 2011 MX6895 4.4 Mechanical Dimensions 4.4.1 16-Pin SOIC Package Recommended PCB Land Pattern 0.51 min / 0.812 max (0.020 min / 0.032 max) PIN 16 0.18 min / 0.25 max (0.007 min / 0.010 max) 5.89 min / 6.19 max (0.232 min / 0.244 max) 3.91 ± 0.10 (0.154 ± 0.004) 1.09 ± 0.10 (0.043 ± 0.004) 1.55 (0.061) 0.60 (0.024) 5.40 (0.213) 2.25 (0.089) 0.38 ± 0.10 (0.015 ± 0.004) PIN 1 1.27 (0.05) 0º -8º 1.35 min / 1.75 max (0.053 min / 0.069 max) 9.90 ± 0.10 (0.390 ± 0.004) 0.0762 ± 0.0508 (0.003 ± 0.002) 2.667 ± 0.127 (0.105 ± 0.005) DIMENSIONS mm (inches) 1.27 min / 1.42 max (0.050 min / 0.056 max) 0.36 min / 0.48 max (0.014 min / 0.019 max) 2.75 (0.108) 2.159 ± 0.127 (0.085 ± 0.005) 1.27 TYP. (0.05 TYP.) 4.4.2 Tape & Reel Packaging for 16-Pin SOIC Package 330.2 Dia (13.00 Dia) See Note I 2.0 ± 0.1 (0.079 ± 0.004) 0.30 ± 0.05 (0.012 ± 0.002) ø1.55 ± 0.05 (0.061 ± 0.002) Top Cover Tape Thickness 0.066 Max (0.0026 Max) See Note II 4.0 ± 0.1 (0.157 ± 0.004) 1.75 ± 0.1 (0.069 ± 0.004) A ø1.6 ± 0.1 (0.063 ± 0.004) B0=10.3 ± 0.1 (0.406 ± 0.004) 7.5 ± 0.1 (0.295 ± 0.004) See Note I R 0.3 TYP. (0.012 TYP.) Embossed Carrier K0=2.10 ± 0.10 (0.083 ± 0.004) Section A-A W=16.00 ± 0.3 (0.63 ± 0.012) A P1=8.0 ± 0.1 (0.315 ± 0.004) A0=6.5 ± 0.1 (0.256 ± 0.004) Embossment NOTES: (I) Measured from centerline of sprocket hole to centerline of pocket. (II) Cumulative tolerance of ten (10) sprocket holes is ± 0.20mm. (III) Material: Conductive polystyrene. Other material available. Dimensions mm (inches) For additional information please visit our website at: www.clare.com Clare, Inc. makes no representations or warranties with respect to the accuracy or completeness of the contents of this publication and reserves the right to make changes to specifications and product descriptions at any time without notice. Neither circuit patent licenses nor indemnity are expressed or implied. Except as set forth in Clare’s Standard Terms and Conditions of Sale, Clare, Inc. assumes no liability whatsoever, and disclaims any express or implied warranty, relating to its products including, but not limited to, the implied warranty of merchantability, fitness for a particular purpose, or infringement of any intellectual property right. The products described in this document are not designed, intended, authorized or warranted for use as components in systems intended for surgical implant into the body, or in other applications intended to support or sustain life, or where malfunction of Clare’s product may result in direct physical harm, injury, or death to a person or severe property or environmental damage. Clare, Inc. reserves the right to discontinue or make changes to its products at any time without notice. Specification: DS-MX6895-20110729 ©Copyright 2011, Clare, Inc. All rights reserved. Printed in USA. 7/29/2011 July 29, 2011 www.clare.com 9