ISM97 Series 2.5 mm x 3.2 mm Ceramic Package SMD Oscillator, TTL / HC-MOS Product Features: Applications: Low Jitter, Non-PLL Based Output CMOS/TTL Compatible Logic Levels Compatible with Leadfree Processing Fibre Channel Server & Storage Sonet /SDH 802.11 / Wifi T1/E1, T3/E3 System Clock Frequency 1.000 MHz to 152.250 MHz Output Level HC-MOS TTL Duty Cycle ‘0’ = 0.1 Vcc Max., ‘1’ = 0.9 Vcc Min. ‘0’ = 0.4 VDC Max., ‘1’ = 2.4 VDC Min. Specify 50% ±10% or ±5% See Table in Part Number Guide Rise / Fall Time 6 nS Max. Output Load See Table in Part Number Guide Frequency Stability See Frequency Stability Table (Includes room temperature tolerance and stability over operating temperature) 10 mS Max. Start-up Time Enable / Disable Time Supply Voltage 100 nS Max. N.C. or ≥ 70% Vdd = Enable. ≤ 30% Vdd = Disable. Current 25 mA Max. (5.0V) Recommended Pad layout See Input Voltage Table, tolerance ±5 % 2.6 20 mA Max. (1.8V-3.3V) 2.0 Operating See Operating Temperature Table in Part Number Guide Storage -55 C to +125 C 1.3 1.4 Jitter: RMS(1sigma) 1 MHz-60 MHz Max Integrated 1 MHz-60 MHz 1.5 pS RMS (1 sigma -12KHz to 20MHz) Max Total Jitter 1 MHz-60 MHz 50 pS p-p (100K adjacent periods) Part Number Guide Package ISM97 - Pin Connection 1 Enable 2 GND 3 Output 4 Vcc 5 pS RMS (1 sigma) Max. accumulated jitter (20K adjacent periods) Input Voltage Dimension Units: mm Sample Part Number: Operating Temperature Symmetry (Duty Cycle) 5 = 5.0 V 1 = 0 C to +70 C 5 = 45 / 55 Max. 3 = 3.3 V 6 = -10 C to +70 C 6 = 40 / 60 Max. 7 = 3.0 V 3 = -20 C to +70 C 2 = 2.7 V 4 = -30 C to +75 C 6 = 2.5 V 2 = -40 C to +85 C 1 = 1.8 V* ISM97 - 3251BH - 20.000 Output Stability (in ppm) Enable / Disable **E = 10 H = Enable 6 = 30 pF **D = 15 O = N/C 5 = 50 pF HC-MOS (<40 MHz) **F = 20 1 = 10TTL / 15 pF HC-MOS **A = 25 Frequency - 20.000 MHz B = 50 C = 100 NOTE: A 0.01 µF bypass capacitor is recommended between Vcc (pin 4) and GND (pin 2) to minimize power supply noise. * Not available at all frequencies. ** Not available for all temperature ranges. *** Frequency, supply, and load related parameters. ILSI America Phone 775-851-8880 ● Fax 775-851-8882 ●email: [email protected] ● www.ilsiamerica.com Specifications subject to change without notice Rev: 08/12/15_C Page 1 of 2 ISM97 Series 2.5 mm x 3.2 mm Ceramic Package SMD Oscillator, TTL / HC-MOS Pb Free Solder Reflow Profile: Typical Application: *Units are backward compatible with 240C reflow processes Package Information: MSL = N.A. (package does not contain plastic; storage life is unlimited under normal room conditions. Termination = e4 (Au over Ni over W base metalization. Tape and Reel Information: Quantity per Reel A B C D E F 3000 8.0 +/-.2 4.0 +/-.2 5.5 +/-.1 9.0 +/-1 50 / 60 / 80 180 Environmental Specifications Thermal Shock Moisture Resistance Mechanical Shock Mechanical Vibration Resistance to Soldering Heat Hazardous Substance Solderability Terminal Strength Gross Leak Fine Leak Solvent Resistance MIL-STD-883, Method 1011, Condition A MIL-STD-883, Method 1004 MIL-STD-883, Method 2002, Condition B MIL-STD-883, Method 2007, Condition A J-STD-020C, Table 5-2 Pb-free devices (except 2 cycles max) Pb-Free / RoHS / Green Compliant JESD22-B102-D Method 2 (Preconditioning E) MIL-STD-883, Method 2004, Test Condition D MIL-STD-883, Method 1014, Condition C MIL-STD-883, Method 1014, Condition A2, R1=2x10-8 atm cc/s MIL-STD-202, Method 215 Marking Line 1: ILSI, Date Code (YWW) Line 2: Frequency PROPRIETARY AND CONFIDENTIAL THIS DOCUMENT CONTAINS PROPRIETARY INFORMATION, AND SUCH INFORMATION MAY NOT BE DISCLOSED TO OTHERS FOR ANY PURPOSE NOR USED FOR MANUFACTURING PURPOSES WITHOUT WRITTEN PERMISSION FROM ILSI America. ILSI America Phone 775-851-8880 ● Fax 775-851-8882 ●email: [email protected] ● www.ilsiamerica.com Specifications subject to change without notice Rev: 08/12/15_C Page 2 of 2