SCDS161A − MAY 2004 – REVISED OCTOBER 2004
D Wide Bandwidth (BW = 350 MHz Min)
D Low Differential Crosstalk
D Data and Control Inputs Have Undershoot
(XTALK = −68 dB Typ)
D Low Power Consumption (ICC = 10 mA Max)
D Bidirectional Data Flow, With Near-Zero
D
1
16
2
15
3
14
4
13
5
12
6
11
7
10
8
9
VCC
E
ID0
ID1
YD
IC0
IC1
YC
IA0
IA1
YA
IB0
IB1
YB
1
16
15 E
14 ID0
2
3
13 ID1
12 YD
4
5
6
7
8
9
YC
S
IA0
IA1
YA
IB0
IB1
YB
GND
VCC
RGY PACKAGE
(TOP VIEW)
D, DBQ, DGV, OR PW PACKAGE
(TOP VIEW)
S
D
D
D
GND
D
D
Propagation Delay
Low ON-State Resistance (ron = 5 W Typ)
Rail-to-Rail Switching on Data I/O Ports
(0 to VCC)
VCC Operating Range From 3 V to 3.6 V
Ioff Supports Partial-Power-Down Mode
Operation
D
Clamp Diodes
Latch-Up Performance Exceeds 100 mA Per
JESD 78, Class II
ESD Performance Tested Per JESD 22
− 2000-V Human-Body Model
(A114-B, Class II)
− 1000-V Charged-Device Model (C101)
Suitable for Both 10 Base-T/100 Base-T
Signaling
11 IC0
10 IC1
description/ordering information
The TI TS3L100 LAN switch is a 4-bit 1-of-2 multiplexer/demultiplexer with a single switch-enable (E) input.
When E is low, the switch is enabled and the I port is connected to the Y port. When E is high, the switch is
disabled and the high-impedance state exists between the I and Y ports. The select (S) input controls the data
path of the multiplexer/demultiplexer.
ORDERING INFORMATION
QFN − RGY
SOIC − D
0°C
0
C to 70
70°C
C
ORDERABLE
PART NUMBER
PACKAGE†
TA
SSOP (QSOP) − DBQ
TSSOP − PW
Tape and reel
TS3L100RGYR
Tube
TS3L100D
Tape and reel
TS3L100DR
Tape and reel
TS3L100DBQR
Tube
TS3L100PW
Tape and reel
TS3L100PWR
TOP-SIDE
MARKING
TK100
TS3L100
TK100
TK100
TVSOP − DGV
Tape and reel
TS3L100DGVR
TK100
† Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines
are available at www.ti.com/sc/package.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
Copyright 2004, Texas Instruments Incorporated
!" #!$% &"'
&! #" #" (" " ") !"
&& *+' &! #", &" ""%+ %!&"
", %% #""'
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
1
SCDS161A − MAY 2004 – REVISED OCTOBER 2004
description/ordering information (continued)
This device can be used to replace mechanical relays in LAN applications. This device has low ron, wide
bandwidth, and low differential crosstalk, making it suitable for 10 Base-T, 100 Base-T, and various other LAN
applications.
This device is fully specified for partial-power-down applications using Ioff. The Ioff feature ensures that
damaging current will not backflow through the device when it is powered down. The device has isolation during
power off.
To ensure the high-impedance state during power up or power down, E should be tied to VCC through a pullup
resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver.
FUNCTION TABLE
INPUTS
E
INPUT/OUTPUT
YX
S
FUNCTION
L
L
H
IX0
IX1
YX = IX0
L
H
X
Z
Disconnect
YX = IX1
PIN DESCRIPTIONS
PIN NAME
IAn−IDn
S
Select input
E
Enable input
YA−YD
2
DESCRIPTION
Data I/Os
Data I/Os
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
SCDS161A − MAY 2004 – REVISED OCTOBER 2004
logic diagram (positive logic)
2
4
IA0
YA
3
IA1
YB
7
5
IB0
6
IB1
9
11
YC
10
YD
12
14
13
S
IC0
IC1
ID0
ID1
1
15
Control
Logic
E
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
3
SCDS161A − MAY 2004 – REVISED OCTOBER 2004
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)†
Supply voltage range, VCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to 4.6 V
Control input voltage range, VIN (see Notes 1 and 2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to 4.6 V
Switch I/O voltage range, VI/O (see Notes 1, 2, and 3) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to 4.6 V
Control input clamp current, IIK (VIN < 0) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −50 mA
I/O port clamp current, II/OK (VI/O < 0) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −50 mA
ON-state switch current, II/O (see Note 4) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±128 mA
Continuous current through VCC or GND terminals . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±100 mA
Package thermal impedance, θJA (see Note 5): D package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 73°C/W
DB package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 82°C/W
DBQ package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 90°C/W
PW package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 108°C/W
Storage temperature range, Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −65°C to 150°C
† Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTES: 1. All voltages are with respect to ground, unless otherwise specified.
2. The input and output voltage ratings may be exceeded if the input and output clamp-current ratings are observed.
3. VI and VO are used to denote specific conditions for VI/O.
4. II and IO are used to denote specific conditions for II/O.
5. The package thermal impedance is calculated in accordance with JESD 51-7.
recommended operating conditions (see Note 6)
MIN
MAX
VCC
VIH
Supply voltage
3
3.6
UNIT
V
High-level control input voltage (E, S)
2
Low-level control input voltage (E, S)
0
VCC
0.8
V
VIL
TA
Operating free-air temperature
0
70
°C
V
NOTE 6: All unused control inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report,
Implications of Slow or Floating CMOS Inputs, literature number SCBA004.
4
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
SCDS161A − MAY 2004 – REVISED OCTOBER 2004
electrical characteristics over recommended
VCC = 3.3 V + 0.3 V (unless otherwise noted)
PARAMETER
VIK
Vhys
E, S
IIH
IIL
E, S
operating
free-air
TEST CONDITIONS
IIN = −18 mA
VCC = 3.6 V,
VCC = 3.6 V,
VIN = VCC
VIN = GND
TYP†
MAX
UNIT
−1.8
V
IOZ‡
VCC = 3.6 V,
VO = 0 to 3.6 V,
VI = 0,
Switch OFF
IOS§
VCC = 3.6 V,
VO = 0 to 0.5 VCC,
VI = 0,
Switch ON
Ioff
ICC
VCC = 0,
VCC = 3.6 V,
VO = 0 to 3.6 V,
II/O = 0,
VI = 0
Switch ON or OFF
VCC = 3.6 V,
One input at VCC − 0.6 V,
Other inputs at VCC or GND
E, S
E, S
E, S
ICCD
CIN
range,
MIN
VCC = 3 V,
∆ICC
temperature
150
VCC = 3.6 V,
E, S
I and Y ports open,
µA
±1
µA
±1
µA
50
mA
0.1
VIN input switching 50% duty cycle
f = 1 MHz
I port
mV
±1
15
µA
10
µA
750
µA
0.45
mA/
MHz
3
pF
5
VI = 0,
f = 1 MHz,
Outputs open,
Switch OFF
CON
VI = 0,
f = 1 MHz,
Outputs open,
Switch ON
17
IO = 48 mA
7
VCC = 3 V
VI = 0 V,
5
ron
VI = 2 V,
IO = 15 mA
10
15
∆ron
VI = 3 V,
Switch ON,
IO = 15 mA
1
COFF
Y port
pF
10
pF
Ω
Ω
VI, VO, II, and IO refer to I/O pins. VIN refers to the control inputs.
† All typical values are at VCC = 3.3 V (unless otherwise noted), TA = 25°C.
‡ For I/O ports, the parameter IOZ includes the input leakage current.
§ The IOS test is applicable to only one ON channel at a time. The duration of this test is less than one second.
switching characteristics over recommended operating free-air temperature range,
VCC = 3.3 V + 0.3 V, RL = 100 Ω, CL = 35 pF (unless otherwise noted) (see Figure 4)
PARAMETER
tON
FROM
(INPUT)
TO
(OUTPUT)
S
tOFF
S
† All typical values are at VCC = 3.3 V (unless otherwise noted), TA = 25°C.
dynamic characteristics over recommended
VCC = 3.3 V + 0.3 V (unless otherwise noted)
PARAMETER
operating
MIN
MAX
Y
1
7.5
ns
Y
1
3.5
ns
free-air
TYP†
TEST CONDITIONS
XTALK(Diff)
XTALK
RL = 100 Ω,
f = 10 MHz, see Figure 8,
RL = 100 Ω,
OIRR
RL = 100 Ω,
temperature
range,
UNIT
−55
dB
f = 30 MHz, see Figure 6
−68
dB
f = 30 MHz, see Figure 7
−42
dB
350
MHz
BW
RL = 100 Ω, see Figure 5
† All typical values are at VCC = 3.3 V (unless otherwise noted), TA = 25°C.
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
tr = tf = 2 ns
UNIT
5
SCDS161A − MAY 2004 – REVISED OCTOBER 2004
OPERATING CHARACTERISTICS
0
0
Phase
−2
−20
−3
−30
Gain
−4
−40
J
−5
Y
−50
−6
−60
−7
−70
−8
−80
−9
1
Y Gain 3 dB at 450 MHz
10
100
Frequency − MHz
J Phase at 3-dB Frequency, −43 Degrees
Figure 1. Gain/Phase vs Frequency
6
−10
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
−90
600
Phase − Deg
Gain − dB
−1
SCDS161A − MAY 2004 – REVISED OCTOBER 2004
OPERATING CHARACTERISTICS
Off Isolation − dB
−10
140
−20
120
−30
100
Phase
J
−40
80
Y
Phase − Deg
160
0
60
−50
Off Isolation
−60
40
−70
20
−80
1
10
100
0
600
Frequency − MHz
Y Off Isolation at 30 MHz, −44.6 dB
J Phase at 30 MHz, 84.41 Degrees
Figure 2. Off Isolation vs Frequency
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
7
SCDS161A − MAY 2004 – REVISED OCTOBER 2004
OPERATING CHARACTERISTICS
0
250
−20
200
−40
150
Crosstalk
100
Y
−80
50
−100
0
−120
−50
Phase
−140
−100
J
−160
−150
−180
−200
−200
1
10
100
Frequency − MHz
Y Crosstalk at 30 MHz, −67.3 dB
J Phase at 30 MHz, −118.4 Degrees
Figure 3. Crosstalk vs Frequency
8
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
−250
600
Phase − Deg
Crosstalk − dB
−60
SCDS161A − MAY 2004 – REVISED OCTOBER 2004
PARAMETER MEASUREMENT INFORMATION
VCC
Input Generator
VS
50 Ω
S
50 Ω
VG1
IX0
DUT
VX0
VO
YX
IX1
CL
(see Note A)
E
RL
VX1
TEST
VCC
RL
CL
VX0
VX1
tON
3.3 V + 0.3 V
3.3 V + 0.3 V
100 Ω
100 Ω
35 pF
35 pF
GND
3V
3V
GND
tOFF
3.3 V + 0.3 V
3.3 V + 0.3 V
100 Ω
100 Ω
35 pF
35 pF
GND
3V
3V
GND
TEST CIRCUIT
3V
Output
Control
(VS)
50%
50%
0V
tON
Analog Output
Waveform
(VO)
tOFF
90%
90%
VOH
0V
VOLTAGE WAVEFORMS
tON AND tOFF TIMES
NOTES: A. CL includes probe and jig capacitance.
B. All input pulses are supplied by generators having the following characteristics: PRR ≤ 10 MHz, ZO = 50 Ω, tr ≤ 2.5 ns, tf ≤ 2.5 ns.
C. The outputs are measured one at a time, with one transition per measurement.
Figure 4. Test Circuit and Voltage Waveforms
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
9
SCDS161A − MAY 2004 – REVISED OCTOBER 2004
PARAMETER MEASUREMENT INFORMATION
EXT TRIGGER
BIAS
Network Analyzer
(HP8753ES)
VBIAS
P1
P2
VCC
IA0
YA
RL = 100 Ω
S
DUT
VS
E
VE
Figure 5. Test Circuit for Frequency Response (BW)
Frequency response is measured at the output of the ON channel. For example, when VS = 0, VE = 0, and YA is the
input, the output is measured at IA0. All unused analog I/O ports are left open.
HP8753ES setup
Average = 4
RBW = 3 kHz
VBIAS = 0.35 V
ST = 2 s
P1 = 0 dBM
10
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
SCDS161A − MAY 2004 – REVISED OCTOBER 2004
PARAMETER MEASUREMENT INFORMATION
EXT TRIGGER
BIAS
Network Analyzer
(HP8753ES)
VBIAS
P1
P2
VCC
YA
IA0
RL = 100 Ω
S
50 Ω†
VS
E
DUT
VE
YB
IB0
RL = 100 Ω
† A 50-Ω termination resistor is needed for the network analyzer.
Figure 6. Test Circuit for Crosstalk (XTALK)
Crosstalk is measured at the output of the nonadjacent ON channel. For example, when VS = 0,
VE = 0, and YA is the input, the output is measured at IB0. All unused analog input (Y) ports are connected to GND
and output (I) ports are connected to GND through 50-Ω pulldown resistors.
HP8753ES setup
Average = 4
RBW = 3 kHz
VBIAS = 0.35 V
ST = 2 s
P1 = 0 dBM
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
11
SCDS161A − MAY 2004 – REVISED OCTOBER 2004
PARAMETER MEASUREMENT INFORMATION
EXT TRIGGER
BIAS
Network Analyzer
(HP8753ES)
VBIAS
P1
P2
VCC
IA0
YA
RL = 100 Ω
S
DUT
VS
IA1
E
RL = 100 Ω
50 Ω†
VE
† A 50-Ω termination resistor is needed for the network analyzer.
Figure 7. Test Circuit for Off Isolation (OIRR)
OFF isolation is measured at the output of the OFF channel. For example, when VS = VCC, VE = 0, and YA is the input,
the output is measured at IA0. All unused analog input (Y) ports are left open and output (I) ports are connected to
GND through 50-Ω pulldown resistors.
HP8753ES setup
Average = 4
RBW = 3 kHz
VBIAS = 0.35 V
ST = 2 s
P1 = 0 dBM
12
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
SCDS161A − MAY 2004 – REVISED OCTOBER 2004
PARAMETER MEASUREMENT INFORMATION
VCC = 3.3 V
0.1 µF
Oscilloscope
S
VO+
16
IA0
2
15
IA1
3
14
ID0
4
13
ID1
YA
100 Ω
100 Ω
VO−
VCC
1
TS3L100
E
YD
IB0
5
12
IB1
6
11
IC0
7
10
IC1
8
9
YB
GND
VI+
100 Ω
YC
100 Ω
Pulse
Generator
VI−
Figure 8. Differential Crosstalk Measurement
Differential crosstalk is a measure of coupling noise between a transmit and receive pair in the LAN application.
Differential crosstalk depends on the edge rate, frequency, and load. This is calculated from the equation,
XTALK(Diff) db = 20 log VO(Diff)/VI(Diff), where VO(Diff) is the differential output voltage and VI(Diff) is the differential
input voltage.
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
13
PACKAGE OPTION ADDENDUM
www.ti.com
21-Dec-2009
PACKAGING INFORMATION
Orderable Device
Status (1)
Package
Type
Package
Drawing
Pins Package Eco Plan (2)
Qty
TS3L100D
ACTIVE
SOIC
D
16
TS3L100DBQR
ACTIVE
SSOP/
QSOP
DBQ
TS3L100DBQRE4
ACTIVE
SSOP/
QSOP
TS3L100DBQRG4
ACTIVE
TS3L100DE4
40
Lead/Ball Finish
MSL Peak Temp (3)
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
16
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
DBQ
16
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
SSOP/
QSOP
DBQ
16
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
ACTIVE
SOIC
D
16
40
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
TS3L100DG4
ACTIVE
SOIC
D
16
40
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
TS3L100DGVR
ACTIVE
TVSOP
DGV
16
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
TS3L100DGVRE4
ACTIVE
TVSOP
DGV
16
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
TS3L100DGVRG4
ACTIVE
TVSOP
DGV
16
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
TS3L100DR
ACTIVE
SOIC
D
16
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
TS3L100DRE4
ACTIVE
SOIC
D
16
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
TS3L100DRG4
ACTIVE
SOIC
D
16
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
TS3L100PW
ACTIVE
TSSOP
PW
16
90
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
TS3L100PWE4
ACTIVE
TSSOP
PW
16
90
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
TS3L100PWG4
ACTIVE
TSSOP
PW
16
90
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
TS3L100PWR
ACTIVE
TSSOP
PW
16
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
TS3L100PWRE4
ACTIVE
TSSOP
PW
16
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
TS3L100PWRG4
ACTIVE
TSSOP
PW
16
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
TS3L100RGYR
ACTIVE
VQFN
RGY
16
3000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
TS3L100RGYRG4
ACTIVE
VQFN
RGY
16
3000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
21-Dec-2009
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
30-Jul-2010
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
TS3L100DGVR
Package Package Pins
Type Drawing
TVSOP
SPQ
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
B0
(mm)
K0
(mm)
P1
(mm)
W
Pin1
(mm) Quadrant
DGV
16
2000
330.0
12.4
6.8
4.0
1.6
8.0
12.0
Q1
TS3L100DR
SOIC
D
16
2500
330.0
16.4
6.5
10.3
2.1
8.0
16.0
Q1
TS3L100PWR
TSSOP
PW
16
2000
330.0
12.4
6.9
5.6
1.6
8.0
12.0
Q1
TS3L100RGYR
VQFN
RGY
16
3000
330.0
12.4
3.8
4.3
1.5
8.0
12.0
Q1
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
30-Jul-2010
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
TS3L100DGVR
TVSOP
DGV
16
2000
346.0
346.0
29.0
TS3L100DR
SOIC
D
16
2500
333.2
345.9
28.6
TS3L100PWR
TSSOP
PW
16
2000
346.0
346.0
29.0
TS3L100RGYR
VQFN
RGY
16
3000
346.0
346.0
29.0
Pack Materials-Page 2
MECHANICAL DATA
MPDS006C – FEBRUARY 1996 – REVISED AUGUST 2000
DGV (R-PDSO-G**)
PLASTIC SMALL-OUTLINE
24 PINS SHOWN
0,40
0,23
0,13
24
13
0,07 M
0,16 NOM
4,50
4,30
6,60
6,20
Gage Plane
0,25
0°–8°
1
0,75
0,50
12
A
Seating Plane
0,15
0,05
1,20 MAX
PINS **
0,08
14
16
20
24
38
48
56
A MAX
3,70
3,70
5,10
5,10
7,90
9,80
11,40
A MIN
3,50
3,50
4,90
4,90
7,70
9,60
11,20
DIM
4073251/E 08/00
NOTES: A.
B.
C.
D.
All linear dimensions are in millimeters.
This drawing is subject to change without notice.
Body dimensions do not include mold flash or protrusion, not to exceed 0,15 per side.
Falls within JEDEC: 24/48 Pins – MO-153
14/16/20/56 Pins – MO-194
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
MECHANICAL DATA
MTSS001C – JANUARY 1995 – REVISED FEBRUARY 1999
PW (R-PDSO-G**)
PLASTIC SMALL-OUTLINE PACKAGE
14 PINS SHOWN
0,30
0,19
0,65
14
0,10 M
8
0,15 NOM
4,50
4,30
6,60
6,20
Gage Plane
0,25
1
7
0°– 8°
A
0,75
0,50
Seating Plane
0,15
0,05
1,20 MAX
PINS **
0,10
8
14
16
20
24
28
A MAX
3,10
5,10
5,10
6,60
7,90
9,80
A MIN
2,90
4,90
4,90
6,40
7,70
9,60
DIM
4040064/F 01/97
NOTES: A.
B.
C.
D.
All linear dimensions are in millimeters.
This drawing is subject to change without notice.
Body dimensions do not include mold flash or protrusion not to exceed 0,15.
Falls within JEDEC MO-153
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
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