SCDS122A − JULY 2003 − REVISED OCTOBER 2003 D Undershoot Protection for Off-Isolation on D D D D 14 2 13 3 12 4 11 5 10 6 9 7 8 VCC 4OE 4A 4B 3OE 3A 3B 1OE 1 D D RGY PACKAGE (TOP VIEW) D, DB, DGV, OR PW PACKAGE (TOP VIEW) 1OE 1A 1B 2OE 2A 2B GND D 5-V/3.3-V CMOS Outputs Ioff Supports Partial-Power-Down Mode Operation Latch-Up Performance Exceeds 100 mA Per JESD 78, Class II ESD Performance Tested Per JESD 22 − 2000-V Human-Body Model (A114-B, Class II) − 1000-V Charged-Device Model (C101) Supports Both Digital and Analog Applications: USB Interface, Bus Isolation, Low-Distortion Signal Gating 1 1A 1B 2OE 2A 2B DBQ PACKAGE (TOP VIEW) VCC D D 14 2 13 4OE 3 12 4A 11 4B 4 10 3OE 9 3A 5 6 7 8 3B D D Control Inputs Can Be Driven by TTL or GND D A and B Ports Up To −2 V Bidirectional Data Flow, With Near-Zero Propagation Delay Low ON-State Resistance (ron) Characteristics (ron = 3 Ω Typical) Low Input/Output Capacitance Minimizes Loading and Signal Distortion (Cio(OFF) = 5 pF Typical) Data and Control Inputs Provide Undershoot Clamp Diodes Low Power Consumption (ICC = 3 µA Max) VCC Operating Range From 4 V to 5.5 V Data I/Os Support 0 to 5-V Signaling Levels (0.8-V, 1.2-V, 1.5-V, 1.8-V, 2.5-V, 3.3-V, 5-V) NC 1OE 1A 1B 2OE 2A 2B GND 1 16 2 15 3 14 4 13 5 12 6 11 7 10 8 9 VCC 4OE 4A 4B 3OE 3A 3B NC NC − No internal connection description/ordering information The SN74CBT3125C is a high-speed TTL-compatible FET bus switch with low ON-state resistance (ron), allowing for minimal propagation delay. Active Undershoot-Protection Circuitry on the A and B ports of the SN74CBT3125C provides protection for undershoot up to −2 V by sensing an undershoot event and ensuring that the switch remains in the proper OFF state. The SN74CBT3125C is organized as four 1-bit bus switches with separate output-enable (1OE, 2OE, 3OE, 4OE) inputs. It can be used as four 1-bit bus switches or as one 4-bit bus switch. When OE is low, the associated 1-bit bus switch is ON, and the A port is connected to the B port, allowing bidirectional data flow between ports. When OE is high, the associated 1-bit bus switch is OFF, and the high-impedance state exists between the A and B ports. This device is fully specified for partial-power-down applications using Ioff. The Ioff feature ensures that damaging current will not backflow through the device when it is powered down. The device has isolation during power off. Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. Copyright 2003, Texas Instruments Incorporated !"#$ % &'!!($ #% )'*+&#$ ,#$(!,'&$% &!" $ %)(&&#$% )(! $.( $(!"% (/#% %$!'"($% %$#,#!, 0#!!#$1- !,'&$ )!&(%%2 ,(% $ (&(%%#!+1 &+',( $(%$2 #++ )#!#"($(!%- POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 1 SCDS122A − JULY 2003 − REVISED OCTOBER 2003 description/ordering information (continued) To ensure the high-impedance state during power up or power down, OE should be tied to VCC through a pullup resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver. ORDERING INFORMATION QFN − RGY Tape and reel SOIC − D −40°C 85°C −40 C to 85 C ORDERABLE PART NUMBER PACKAGE† TA SSOP − DB SSOP (QSOP) − DBQ TSSOP − PW TOP-SIDE MARKING SN74CBT3125CRGYR Tube SN74CBT3125CD Tape and reel SN74CBT3125CDR Tube SN74CBT3125CDB Tape and reel SN74CBT3125CDBR Tape and reel SN74CBT3125CDBQR Tube SN74CBT3125CPW Tape and reel SN74CBT3125CPWR CU125C CBT3125C CU125C CU125C CU125C TVSOP − DGV Tape and reel SN74CBT3125CDGVR CU125C † Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at www.ti.com/sc/package. FUNCTION TABLE (each bus switch) INPUT OE INPUT/OUTPUT A FUNCTION L B A port = B port H Z Disconnect logic diagram (positive logic) 2 1A 1OE 3 1B SW 5 2A 2B 4 1 2OE 9 3A 12 8 SW 3B 4A 4OE Pin numbers shown are for the D, DB, DGV, PW, and RGY packages. POST OFFICE BOX 655303 11 SW 13 10 3OE 2 6 SW • DALLAS, TEXAS 75265 4B SCDS122A − JULY 2003 − REVISED OCTOBER 2003 simplified schematic, each FET switch (SW) A B Undershoot Protection Circuit EN† † EN is the internal enable signal applied to the switch. absolute maximum ratings over operating free-air temperature range (unless otherwise noted)‡ Supply voltage range, VCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to 7 V Control input voltage range, VIN (see Notes 1 and 2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to 7 V Switch I/O voltage range, VI/O (see Notes 1, 2, and 3) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to 7 V Control input clamp current, IIK (VIN < 0) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −50 mA I/O port clamp current, II/OK (VI/O < 0) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −50 mA ON-state switch current, II/O (see Note 4) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±128 mA Continuous current through VCC or GND terminals . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±100 mA Package thermal impedance, θJA (see Note 5): D package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 86°C/W (see Note 5): DB package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 96°C/W (see Note 5): DBQ package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 90°C/W (see Note 5): DGV package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 127°C/W (see Note 5): PW package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 113°C/W (see Note 6): RGY package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 47°C/W Storage temperature range, Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −65°C to 150°C ‡ Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. NOTES: 1. All voltages are with respect to ground unless otherwise specified. 2. The input and output voltage ratings may be exceeded if the input and output clamp-current ratings are observed. 3. VI and VO are used to denote specific conditions for VI/O. 4. II and IO are used to denote specific conditions for II/O. 5. The package thermal impedance is calculated in accordance with JESD 51-7. 6. The package thermal impedance is calculated in accordance with JESD 51-5. recommended operating conditions (see Note 7) MIN MAX VCC VIH Supply voltage 4 5.5 UNIT V High-level control input voltage 2 5.5 V VIL VI/O Low-level control input voltage 0 0.8 V Data input/output voltage 0 5.5 V TA Operating free-air temperature −40 85 °C NOTE 7: All unused control inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report, Implications of Slow or Floating CMOS Inputs, literature number SCBA004. POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 3 SCDS122A − JULY 2003 − REVISED OCTOBER 2003 electrical characteristics over recommended operating free-air temperature range (unless otherwise noted) PARAMETER TEST CONDITIONS VIK Control inputs VCC = 4.5 V, VIKU Data inputs VCC = 5 V, IIN Control inputs VCC = 5.5 V, IOZ‡ VCC = 5.5 V, Ioff VCC = 0, ICC VCC = 5.5 V, IIN = −18 mA 0 mA > II ≥ −50 mA, VIN = VCC or GND, VIN = VCC or GND VO = 0 to 5.5 V, VI = 0, MIN Switch OFF Switch OFF, VIN = VCC or GND VO = 0 to 5.5 V, II/O = 0, VIN = VCC or GND, VI = 0 VCC = 5.5 V, VIN = 3 V or 0 One input at 3.4 V, Other inputs at VCC or GND Cio(OFF) VI/O = 3 V or 0, Switch OFF, Cio(ON) VI/O = 3 V or 0, VCC = 4 V, TYP at VCC = 4 V ∆ICC§ Cin Control inputs Control inputs ron¶ VCC = 4.5 V TYP† MAX UNIT −1.8 V −2 V ±1 µA ±10 µA 10 µA 3 µA 2.5 mA Switch ON or OFF 3 pF VIN = VCC or GND 5 pF Switch ON, VIN = VCC or GND 12.5 pF VI = 2.4 V, IO = −15 mA 8 12 IO = 64 mA IO = 30 mA 3 6 VI = 0 3 6 Ω VI = 2.4 V, IO = −15 mA 5 10 VIN and IIN refer to control inputs. VI, VO, II, and IO refer to data pins. † All typical values are at VCC = 5 V (unless otherwise noted), TA = 25°C. ‡ For I/O ports, the parameter IOZ includes the input leakage current. § This is the increase in supply current for each input that is at the specified voltage level, rather than VCC or GND. ¶ Measured by the voltage drop between the A and B terminals at the indicated current through the switch. ON-state resistance is determined by the lower of the voltages of the two (A or B) terminals. switching characteristics over recommended operating free-air temperature range (unless otherwise noted) (see Figure 3) VCC = 4 V VCC = 5 V ± 0.5 V MIN MIN FROM (INPUT) TO (OUTPUT) tpd# A or B B or A 0.24 ten OE A or B 4.4 PARAMETER MAX 1.5 UNIT MAX 0.15 ns 4 ns tdis A or B 4.4 1.5 4.4 ns OE # The propagation delay is the calculated RC time constant of the typical ON-state resistance of the switch and the specified load capacitance, when driven by an ideal voltage source (zero output impedance). 4 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 SCDS122A − JULY 2003 − REVISED OCTOBER 2003 undershoot characteristics (see Figures 1 and 2) PARAMETER TEST CONDITIONS VOUTU VCC = 5.5 V, Switch OFF, † All typical values are at VCC = 5 V (unless otherwise noted), TA = 25°C. VCC Input Generator Ax VS DUT TYP† 2 VOH−0.3 VIN = VCC or GND MAX UNIT V 11 V Input (Open Socket) 100 kΩ 50 Ω MIN Bx 100 kΩ 90 % 2 ns 10 % −2 V 20 ns Output (VOUTU) POST OFFICE BOX 655303 5.5 V 2 ns 10 % 10 pF Figure 1. Device Test Setup 90 % VOH VOH − 0.3 Figure 2. Transient Input Voltage (VI) and Output Voltage (VOUTU) Waveforms (Switch OFF) • DALLAS, TEXAS 75265 5 SCDS122A − JULY 2003 − REVISED OCTOBER 2003 PARAMETER MEASUREMENT INFORMATION VCC Input Generator VIN 50 Ω 50 Ω VG1 TEST CIRCUIT DUT 7V Input Generator VI S1 RL VO GND 50 Ω 50 Ω VG2 CL (see Note A) RL TEST VCC S1 RL VI CL tpd(s) 5 V ± 0.5 V 4V Open Open 500 Ω 500 Ω VCC or GND VCC or GND 50 pF 50 pF tPLZ/tPZL 5 V ± 0.5 V 4V 7V 7V 500 Ω 500 Ω GND GND 50 pF 50 pF 0.3 V 0.3 V tPHZ/tPZH 5 V ± 0.5 V 4V Open Open 500 Ω 500 Ω VCC VCC 50 pF 50 pF 0.3 V 0.3 V Output Control (VIN) V∆ 3V 1.5 V 3V 1.5 V 1.5 V 0V tPLH VOH Output 1.5 V Output Waveform 1 S1 at 7 V (see Note B) tPLZ 3.5 V 1.5 V tPZH tPHL 1.5 V VOL Output Waveform 2 S1 at Open (see Note B) VOLTAGE WAVEFORMS PROPAGATION DELAY TIMES (tpd(s)) 1.5 V 0V tPZL Output Control (VIN) Open VOL + V∆ VOL tPHZ 1.5 V VOH − V∆ VOH 0V VOLTAGE WAVEFORMS ENABLE AND DISABLE TIMES NOTES: A. CL includes probe and jig capacitance. B. Waveform 1 is for an output with internal conditions such that the output is low except when disabled by the output control. Waveform 2 is for an output with internal conditions such that the output is high except when disabled by the output control. C. All input pulses are supplied by generators having the following characteristics: PRR ≤ 10 MHz, ZO = 50 Ω, tr ≤ 2.5 ns, tf ≤ 2.5 ns. D. The outputs are measured one at a time with one transition per measurement. E. tPLZ and tPHZ are the same as tdis. F. tPZL and tPZH are the same as ten. G. tPLH and tPHL are the same as tpd(s). The tpd propagation delay is the calculated RC time constant of the typical ON-state resistance of the switch and the specified load capacitance, when driven by an ideal voltage source (zero output impedance). H. All parameters and waveforms are not applicable to all devices. Figure 3. Test Circuit and Voltage Waveforms 6 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 PACKAGE OPTION ADDENDUM www.ti.com 28-May-2007 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Eco Plan (2) Qty SN74CBT3125CD ACTIVE SOIC D 14 50 Green (RoHS & no Sb/Br) 80 TBD Lead/Ball Finish CU NIPDAU Level-1-260C-UNLIM SN74CBT3125CDB PREVIEW SSOP DB 14 SN74CBT3125CDBQR ACTIVE SSOP/ QSOP DBQ 16 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR SN74CBT3125CDBQRE4 ACTIVE SSOP/ QSOP DBQ 16 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR SN74CBT3125CDBQRG4 ACTIVE SSOP/ QSOP DBQ 16 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR SN74CBT3125CDBR ACTIVE SSOP DB 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74CBT3125CDBRE4 ACTIVE SSOP DB 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74CBT3125CDBRG4 ACTIVE SSOP DB 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74CBT3125CDE4 ACTIVE SOIC D 14 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74CBT3125CDG4 ACTIVE SOIC D 14 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74CBT3125CDGVR ACTIVE TVSOP DGV 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74CBT3125CDGVRE4 ACTIVE TVSOP DGV 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74CBT3125CDGVRG4 ACTIVE TVSOP DGV 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74CBT3125CDR ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74CBT3125CDRE4 ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74CBT3125CDRG4 ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74CBT3125CPW ACTIVE TSSOP PW 14 90 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74CBT3125CPWE4 ACTIVE TSSOP PW 14 90 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74CBT3125CPWG4 ACTIVE TSSOP PW 14 90 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74CBT3125CPWR ACTIVE TSSOP PW 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74CBT3125CPWRE4 ACTIVE TSSOP PW 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74CBT3125CPWRG4 ACTIVE TSSOP PW 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74CBT3125CRGYR ACTIVE QFN RGY 14 1000 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR SN74CBT3125CRGYRG4 ACTIVE QFN RGY 14 1000 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. Addendum-Page 1 Call TI MSL Peak Temp (3) Call TI PACKAGE OPTION ADDENDUM www.ti.com 28-May-2007 LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 2 PACKAGE MATERIALS INFORMATION www.ti.com 19-Mar-2008 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing SPQ Reel Reel Diameter Width (mm) W1 (mm) A0 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant SN74CBT3125CDBR SSOP DB 14 2000 330.0 16.4 8.2 6.6 2.5 12.0 16.0 Q1 SN74CBT3125CDGVR TVSOP DGV 14 2000 330.0 12.4 6.8 4.0 1.6 8.0 12.0 Q1 SN74CBT3125CDR SOIC D 14 2500 330.0 16.4 6.5 9.0 2.1 8.0 16.0 Q1 SN74CBT3125CPWR TSSOP PW 14 2000 330.0 12.4 7.0 5.6 1.6 8.0 12.0 Q1 SN74CBT3125CRGYR QFN RGY 14 1000 180.0 12.4 3.85 3.85 1.35 8.0 12.0 Q1 Pack Materials-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 19-Mar-2008 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) SN74CBT3125CDBR SSOP DB 14 2000 346.0 346.0 33.0 SN74CBT3125CDGVR TVSOP DGV 14 2000 346.0 346.0 29.0 SN74CBT3125CDR SOIC D 14 2500 333.2 345.9 28.6 SN74CBT3125CPWR TSSOP PW 14 2000 346.0 346.0 29.0 SN74CBT3125CRGYR QFN RGY 14 1000 190.5 212.7 31.8 Pack Materials-Page 2 MECHANICAL DATA MSSO002E – JANUARY 1995 – REVISED DECEMBER 2001 DB (R-PDSO-G**) PLASTIC SMALL-OUTLINE 28 PINS SHOWN 0,38 0,22 0,65 28 0,15 M 15 0,25 0,09 8,20 7,40 5,60 5,00 Gage Plane 1 14 0,25 A 0°–ā8° 0,95 0,55 Seating Plane 2,00 MAX 0,10 0,05 MIN PINS ** 14 16 20 24 28 30 38 A MAX 6,50 6,50 7,50 8,50 10,50 10,50 12,90 A MIN 5,90 5,90 6,90 7,90 9,90 9,90 12,30 DIM 4040065 /E 12/01 NOTES: A. B. C. D. All linear dimensions are in millimeters. This drawing is subject to change without notice. Body dimensions do not include mold flash or protrusion not to exceed 0,15. Falls within JEDEC MO-150 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 MECHANICAL DATA MTSS001C – JANUARY 1995 – REVISED FEBRUARY 1999 PW (R-PDSO-G**) PLASTIC SMALL-OUTLINE PACKAGE 14 PINS SHOWN 0,30 0,19 0,65 14 0,10 M 8 0,15 NOM 4,50 4,30 6,60 6,20 Gage Plane 0,25 1 7 0°– 8° A 0,75 0,50 Seating Plane 0,15 0,05 1,20 MAX PINS ** 0,10 8 14 16 20 24 28 A MAX 3,10 5,10 5,10 6,60 7,90 9,80 A MIN 2,90 4,90 4,90 6,40 7,70 9,60 DIM 4040064/F 01/97 NOTES: A. B. C. D. All linear dimensions are in millimeters. This drawing is subject to change without notice. Body dimensions do not include mold flash or protrusion not to exceed 0,15. Falls within JEDEC MO-153 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 MECHANICAL DATA MPDS006C – FEBRUARY 1996 – REVISED AUGUST 2000 DGV (R-PDSO-G**) PLASTIC SMALL-OUTLINE 24 PINS SHOWN 0,40 0,23 0,13 24 13 0,07 M 0,16 NOM 4,50 4,30 6,60 6,20 Gage Plane 0,25 0°–8° 1 0,75 0,50 12 A Seating Plane 0,15 0,05 1,20 MAX PINS ** 0,08 14 16 20 24 38 48 56 A MAX 3,70 3,70 5,10 5,10 7,90 9,80 11,40 A MIN 3,50 3,50 4,90 4,90 7,70 9,60 11,20 DIM 4073251/E 08/00 NOTES: A. B. C. D. All linear dimensions are in millimeters. This drawing is subject to change without notice. Body dimensions do not include mold flash or protrusion, not to exceed 0,15 per side. Falls within JEDEC: 24/48 Pins – MO-153 14/16/20/56 Pins – MO-194 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All products are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment. TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standard warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where mandated by government requirements, testing of all parameters of each product is not necessarily performed. TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and applications using TI components. To minimize the risks associated with customer products and applications, customers should provide adequate design and operating safeguards. TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask work right, or other TI intellectual property right relating to any combination, machine, or process in which TI products or services are used. Information published by TI regarding third-party products or services does not constitute a license from TI to use such products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI. Reproduction of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an unfair and deceptive business practice. TI is not responsible or liable for such altered documentation. Information of third parties may be subject to additional restrictions. Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice. TI is not responsible or liable for any such statements. TI products are not authorized for use in safety-critical applications (such as life support) where a failure of the TI product would reasonably be expected to cause severe personal injury or death, unless officers of the parties have executed an agreement specifically governing such use. Buyers represent that they have all necessary expertise in the safety and regulatory ramifications of their applications, and acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any use of TI products in such safety-critical applications, notwithstanding any applications-related information or support that may be provided by TI. Further, Buyers must fully indemnify TI and its representatives against any damages arising out of the use of TI products in such safety-critical applications. TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products are specifically designated by TI as military-grade or "enhanced plastic." Only products designated by TI as military-grade meet military specifications. Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is solely at the Buyer's risk, and that they are solely responsible for compliance with all legal and regulatory requirements in connection with such use. TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products are designated by TI as compliant with ISO/TS 16949 requirements. Buyers acknowledge and agree that, if they use any non-designated products in automotive applications, TI will not be responsible for any failure to meet such requirements. Following are URLs where you can obtain information on other Texas Instruments products and application solutions: Products Amplifiers Data Converters DSP Clocks and Timers Interface Logic Power Mgmt Microcontrollers RFID RF/IF and ZigBee® Solutions amplifier.ti.com dataconverter.ti.com dsp.ti.com www.ti.com/clocks interface.ti.com logic.ti.com power.ti.com microcontroller.ti.com www.ti-rfid.com www.ti.com/lprf Applications Audio Automotive Broadband Digital Control Medical Military Optical Networking Security Telephony Video & Imaging Wireless www.ti.com/audio www.ti.com/automotive www.ti.com/broadband www.ti.com/digitalcontrol www.ti.com/medical www.ti.com/military www.ti.com/opticalnetwork www.ti.com/security www.ti.com/telephony www.ti.com/video www.ti.com/wireless Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265 Copyright © 2008, Texas Instruments Incorporated