TI TMS320LF2406APZAR

SPRS145J − JULY 2000 − REVISED NOVEMBER 2004
D High-Performance Static CMOS Technology
D
D
D
D
D
− 25-ns Instruction Cycle Time (40 MHz)
− 40-MIPS Performance
− Low-Power 3.3-V Design
Based on TMS320C2xx DSP CPU Core
− Code-Compatible With F243/F241/C242
− Instruction Set and Module Compatible
With F240/C240
Flash (LF) and ROM (LC) Device Options
− LF240xA: LF2407A, LF2406A,
LF2403A, LF2402A
− LC240xA: LC2406A, LC2404A,
LC2403A, LC2402A
On-Chip Memory
− Up to 32K Words x 16 Bits of Flash
EEPROM (4 Sectors) or ROM
− Programmable “Code-Security” Feature
for the On-Chip Flash/ROM
− Up to 2.5K Words x 16 Bits of
Data/Program RAM
− 544 Words of Dual-Access RAM
− Up to 2K Words of Single-Access RAM
Boot ROM (LF240xA Devices)
− SCI/SPI Bootloader
Up to Two Event-Manager (EV) Modules
(EVA and EVB), Each Includes:
− Two 16-Bit General-Purpose Timers
− Eight 16-Bit Pulse-Width Modulation
(PWM) Channels Which Enable:
− Three-Phase Inverter Control
− Center- or Edge-Alignment of PWM
Channels
− Emergency PWM Channel Shutdown
With External PDPINTx Pin
− Programmable Deadband (Deadtime)
Prevents Shoot-Through Faults
− Three Capture Units for Time-Stamping
of External Events
− Input Qualifier for Select Pins
− On-Chip Position Encoder Interface
Circuitry
− Synchronized A-to-D Conversion
− Designed for AC Induction, BLDC,
Switched Reluctance, and Stepper Motor
Control
− Applicable for Multiple Motor and/or
Converter Control
D External Memory Interface (LF2407A)
D
D
D
D
D
D
D
D
D
D
D
D
D
− 192K Words x 16 Bits of Total Memory:
64K Program, 64K Data, 64K I/O
Watchdog (WD) Timer Module
10-Bit Analog-to-Digital Converter (ADC)
− 8 or 16 Multiplexed Input Channels
− 500-ns MIN Conversion Time
− Selectable Twin 8-State Sequencers
Triggered by Two Event Managers
Controller Area Network (CAN) 2.0B Module
(LF2407A, 2406A, 2403A)
Serial Communications Interface (SCI)
16-Bit Serial Peripheral Interface (SPI)
(LF2407A, 2406A, LC2404A, 2403A)
Phase-Locked-Loop (PLL)-Based Clock
Generation
Up to 40 Individually Programmable,
Multiplexed General-Purpose Input / Output
(GPIO) Pins
Up to Five External Interrupts (Power Drive
Protection, Reset, Two Maskable Interrupts)
Power Management:
− Three Power-Down Modes
− Ability to Power Down Each Peripheral
Independently
Real-Time JTAG-Compliant Scan-Based
Emulation, IEEE Standard 1149.1† (JTAG)
Development Tools Include:
− Texas Instruments (TI) ANSI C Compiler,
Assembler/ Linker, and Code Composer
Studio Debugger
− Evaluation Modules
− Scan-Based Self-Emulation (XDS510)
− Broad Third-Party Digital Motor Control
Support
Package Options
− 144-Pin LQFP PGE (LF2407A)
− 100-Pin LQFP PZ (2406A, LC2404A)
− 64-Pin TQFP PAG (LF2403A, LC2403A,
LC2402A)
− 64-Pin QFP PG (2402A)
Extended Temperature Options (A and S)
− A: − 40°C to 85°C
− S: − 40°C to 125°C
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
Code Composer Studio and XDS510 are trademarks of Texas Instruments.
Other trademarks are the property of their respective owners.
† IEEE Standard 1149.1−1990, IEEE Standard Test-Access Port; however, boundary scan is not supported in this device family.
Copyright  2004, Texas Instruments Incorporated
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POST OFFICE BOX 1443
• HOUSTON, TEXAS 77251−1443
1
SPRS145J − JULY 2000 − REVISED NOVEMBER 2004
Table of Contents
Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
TMS320x240xA Device Summary . . . . . . . . . . . . . . . . . 5
Functional Block Diagram of the 2407A
DSP Controller . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Pinouts . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Pin Functions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Memory Maps . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
Peripheral Memory Map of the 2407A/2406A . . . . . . . 29
Device Reset and Interrupts . . . . . . . . . . . . . . . . . . . . . 30
DSP CPU Core . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34
TMS320x240xA Instruction Set . . . . . . . . . . . . . . . . . . . 34
Scan-Based Emulation . . . . . . . . . . . . . . . . . . . . . . . . . . 34
Functional Block Diagram of the 2407A DSP CPU . . 35
Internal Memory . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 42
Peripherals . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 45
Event Manager Modules (EVA, EVB) . . . . . . . . . . . . 45
Enhanced Analog-to-Digital Converter
(ADC) Module . . . . . . . . . . . . . . . . . . . . . . . . . . . . 49
Serial Communications Interface (SCI) Module . . . . 53
2
POST OFFICE BOX 1443
Controller Area Network (CAN) Module . . . . . . . . . . 51
Serial Peripheral Interface (SPI) Module . . . . . . . . . . 55
PLL-Based Clock Module . . . . . . . . . . . . . . . . . . . . . . 57
Digital I/O and Shared Pin Functions . . . . . . . . . . . . . 60
External Memory Interface (LF2407A) . . . . . . . . . . . . 64
Watchdog (WD) Timer Module . . . . . . . . . . . . . . . . . . 65
Development Support . . . . . . . . . . . . . . . . . . . . . . . . . . . 67
Documentation Support . . . . . . . . . . . . . . . . . . . . . . . . . 70
LF240xA and LC240xA Electrical
Specifications Data . . . . . . . . . . . . . . . . . . . . . . . . . 71
Absolute Maximum Ratings . . . . . . . . . . . . . . . . . . . . . . 71
Recommended Operating Conditions . . . . . . . . . . . . . 71
Migrating From LF240xA (Flash) Devices to
LC240xA (ROM) Devices . . . . . . . . . . . . . . . . . . . 110
Migrating From 240x Devices to 240xA Devices . . . 111
Migrating From LF240x Devices to
LC240xA Devices . . . . . . . . . . . . . . . . . . . . . . . . . 112
Peripheral Register Description . . . . . . . . . . . . . . . . . . 113
Mechanical Data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 126
• HOUSTON, TEXAS 77251−1443
SPRS145J − JULY 2000 − REVISED NOVEMBER 2004
REVISION HISTORY
PAGE
HIGHLIGHTS
global
Added the LC2403A device.
1
Added LC2402A to the 64-pin TQFP PAG package option on the Features page.
5
Changed MIN Conversion Time for the ADC from 375 or 500 ns to 500 ns on the Features page, in Table 1, in the
ADC absolute maximum ratings table, and in the internal ADC module timing parameters table.
5
Added PAG to the LC2402A column in Table 1, Hardware Features of 240xA Devices.
36
Changed seven interrupts to six core-level interrupts in Table 4.
36
Changed the description for IFR in Table 4.
49
Changed the formula for deriving the digital value of the input analog voltage
58
Added a note concerning the need for an external 1-M-Ω resistor across X1 and X2 terminals.
69
Added note on lead-free package to Figure 20.
72
Changed MAX value for ADC module current in current consumption by power-supply pins over recommended
operating free-air temperature ranges for both operational and low-power modes.
81
Added a note to Figure 27
73
Changed the IDD current specification for ROM parts in LPM2 mode.
108
Changed DNL/INL information for LC240xA parts. There is now one table for both Flash and ROM parts.
POST OFFICE BOX 1443
• HOUSTON, TEXAS 77251−1443
3
SPRS145J − JULY 2000 − REVISED NOVEMBER 2004
description
The TMS320LF240xA and TMS320LC240xA devices, new members of the TMS320C24x generation of
digital signal processor (DSP) controllers, are part of the TMS320C2000 platform of fixed-point DSPs. The
240xA devices offer the enhanced TMS320 DSP architectural design of the C2xx core CPU for low-cost,
low-power, and high-performance processing capabilities. Several advanced peripherals, optimized for digital
motor and motion control applications, have been integrated to provide a true single-chip DSP controller. While
code-compatible with the existing C24x DSP controller devices, the 240xA offers increased processing
performance (40 MIPS) and a higher level of peripheral integration. See the TMS320x240xA Device Summary
section for device-specific features.
The 240xA generation offers an array of memory sizes and different peripherals tailored to meet the specific
price/performance points required by various applications. Flash devices of up to 32K words offer a
cost-effective reprogrammable solution for volume production. The 240xA devices offer a password-based
“code security” feature which is useful in preventing unauthorized duplication of proprietary code stored in
on-chip Flash/ROM. Note that Flash-based devices contain a 256-word boot ROM to facilitate in-circuit
programming. The 240xA family also includes ROM devices that are fully pin-to-pin compatible with their Flash
counterparts.
All 240xA devices offer at least one event manager module which has been optimized for digital motor control
and power conversion applications. Capabilities of this module include center- and/or edge-aligned PWM
generation, programmable deadband to prevent shoot-through faults, and synchronized analog-to-digital
conversion. Devices with dual event managers enable multiple motor and/or converter control with a single
240xA DSP controller. Select EV pins have been provided with an “input-qualifier” circuitry, which minimizes
inadvertent pin-triggering by glitches.
The high-performance, 10-bit analog-to-digital converter (ADC) has a minimum conversion time of 375 ns and
offers up to 16 channels of analog input. The autosequencing capability of the ADC allows a maximum of
16 conversions to take place in a single conversion session without any CPU overhead.
A serial communications interface (SCI) is integrated on all devices to provide asynchronous communication
to other devices in the system. For systems requiring additional communication interfaces, the 2407A, 2406A,
2404A, and 2403A offer a 16-bit synchronous serial peripheral interface (SPI). The 2407A, 2406A, and 2403A
offer a controller area network (CAN) communications module that meets 2.0B specifications. To maximize
device flexibility, functional pins are also configurable as general-purpose inputs/outputs (GPIOs).
To streamline development time, JTAG-compliant scan-based emulation has been integrated into all devices.
This provides non-intrusive real-time capabilities required to debug digital control systems. A complete suite
of code-generation tools from C compilers to the industry-standard Code Composer Studio debugger
supports this family. Numerous third-party developers not only offer device-level development tools, but also
system-level design and development support.
TMS320C24x, TMS320C2000, TMS320, and C24x are trademarks of Texas Instruments.
4
POST OFFICE BOX 1443
• HOUSTON, TEXAS 77251−1443
SPRS145J − JULY 2000 − REVISED NOVEMBER 2004
TMS320x240xA device summary
Note that throughout this data sheet, 240xA is used as a generic name for the LF240xA/LC240xA generation
of devices.
Table 1. Hardware Features of 240xA Devices
LF2407A
LF2406A
LF2403A
LF2402A
LC2406A
LC2404A
LC2403A
C2xx DSP Core
FEATURE
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Instruction Cycle
25 ns
25 ns
25 ns
25 ns
25 ns
25 ns
25 ns
25 ns
MIPS (40 MHz)
LC2402A
40 MIPS
40 MIPS
40 MIPS
40 MIPS
40 MIPS
40 MIPS
40 MIPS
40 MIPS
Dual-Access
RAM (DARAM)
544
544
544
544
544
544
544
544
Single-Access
RAM (SARAM)
2K
2K
512
512
2K
1K
512
—
32K
32K
16K
8K
—
—
—
—
—
—
—
—
32K
16K
16K
6K
Code Security for On-Chip Flash/ROM
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Boot ROM
Yes
Yes
Yes
Yes
—
—
—
—
External Memory Interface
Yes
—
—
—
—
—
—
—
Event Managers A and B (EVA and EVB)
EVA,
EVB
EVA,
EVB
EVA
EVA
EVA,
EVB
EVA,
EVB
EVA
EVA
RAM (16-bit word)
3.3-V On-chip Flash (16-bit word)
(4 sectors: 4K, 12K, 12K, 4K)
On-chip ROM (16-bit word)
S
General-Purpose (GP) Timers
S
Compare (CMP)/PWM
S
S
4
4
2
2
4
4
2
2
12/16
12/16
6/8
6/8
12/16
12/16
6/8
6/8
Capture (CAP)/QEP
6/4
6/4
3/2
3/2
6/4
6/4
3/2
3/2
Input qualifier circuitry on
PDPINTx, CAPx, QEPx,
XINT1/2, and ADCSOC pins
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Status of PDPINTx pin reflected
in COMCONx register
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Watchdog Timer
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
10-Bit ADC
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
16
16
8
8
16
16
8
8
500 ns
S
S
Channels
S
Conversion Time (minimum)
500 ns
500 ns
500 ns
500 ns
500 ns
500 ns
500 ns
SPI
Yes
Yes
Yes
—
Yes
Yes
Yes
—
SCI
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
CAN
Yes
Yes
Yes
—
Yes
—
Yes
—
Digital I/O Pins
(Shared)
41
41
21
21
41
41
21
21
External Interrupts
5
5
3
3
5
5
3
3
Supply Voltage
Packaging
Product Status:
Product Preview (PP)
Advance Information (AI)
Production Data (PD)
3.3 V
3.3 V
3.3 V
3.3 V
3.3 V
3.3 V
3.3 V
3.3 V
144-pin
PGE
100-pin
PZ
64-pin
PAG
64-pin
PG
100-pin
PZ
100-pin
PZ
64-pin
PAG
64-pin
PG, PAG
PD
PD
PD
PD
PD
PD
PD
PD
Denotes features that are different/new compared to 240x devices.
POST OFFICE BOX 1443
• HOUSTON, TEXAS 77251−1443
5
SPRS145J − JULY 2000 − REVISED NOVEMBER 2004
functional block diagram of the 2407A DSP controller
PLLF
PLLVCCA
DARAM (B0)
256 Words
XINT1/IOPA2
RS
PLL Clock
XTAL1/CLKIN
CLKOUT/IOPE0
XTAL2
TMS2
BIO/IOPC1
MP/MC
BOOT_EN/XF
C2xx
DSP
Core
ADCIN00−ADCIN07
ADCIN08−ADCIN15
VCCA
DARAM (B1)
256 Words
10-Bit ADC
(With Twin
Autosequencer)
VDD (3.3 V)
VSS
DARAM (B2)
32 Words
ÈÈÈÈÈÈÈ
ÈÈÈÈÈÈÈÈÈÈÈÈÈÈ
ÈÈÈÈÈÈÈÈÈÈÈÈÈÈ
ÈÈÈÈÈÈÈÈÈÈÈÈÈÈ
ÈÈÈÈÈÈÈÈÈÈÈÈÈÈ
ÈÈÈÈÈÈÈÈÈÈÈÈÈÈ
ÈÈÈÈÈÈÈ
ÈÈÈÈÈÈÈ
ÈÈÈÈÈÈÈ
ÈÈÈÈÈÈÈ
ÈÈÈÈÈÈÈ
ÈÈÈÈÈÈÈ
ÈÈÈÈÈÈÈ
ÈÈÈÈÈÈÈ
ÈÈÈÈÈÈÈÈÈÈÈÈÈÈ
ÈÈÈÈÈÈÈ
ÈÈÈÈÈÈÈ
ÈÈÈÈÈÈÈ
ÈÈÈÈÈÈÈ
ÈÈÈÈÈÈÈ
ÈÈÈÈÈÈÈ
ÈÈÈÈÈÈÈ
ÈÈÈÈÈÈÈ
ÈÈÈÈÈÈÈ
SCI
SARAM (2K Words)
SPI
TP1
TP2
VCCP(5V)
A0−A15
D0−D15
PS, DS, IS
R/W
RD
READY
STRB
WE
ENA_144
VIS_OE
W/R / IOPC0
PDPINTA
CAP1/QEP1/IOPA3
CAP2/QEP2/IOPA4
CAP3/IOPA5
PWM1/IOPA6
PWM2/IOPA7
PWM3/IOPB0
PWM4/IOPB1
PWM5/IOPB2
PWM6/IOPB3
T1PWM/T1CMP/IOPB4
T2PWM/T2CMP/IOPB5
TDIRA/IOPB6
TCLKINA/IOPB7
ÈÈÈ
ÈÈÈ
ÈÈÈ
6
PLLF2
Flash/ROM
(32K Words:
4K/12K/12K/4K)
CAN
External Memory
Interface
JTAG Port
D 3 × Capture Input
D 6 × Compare/PWM
Output
D 2 × GP
Timers/PWM
VREFLO
XINT2/ADCSOC/IOPD0
SCITXD/IOPA0
SCIRXD/IOPA1
SPISIMO/IOPC2
SPISOMI/IOPC3
SPICLK/IOPC4
SPISTE/IOPC5
CANTX/IOPC6
CANRX/IOPC7
WD
Digital I/O
(Shared With
Other Pins)
Event Manager A
VSSA
VREFHI
Event Manager B
D 3 × Capture Input
D 6 × Compare/PWM
Output
D 2 × GP
Timers/PWM
Port A(0−7) IOPA[0:7]
Port B(0−7) IOPB[0:7]
Port C(0−7) IOPC[0:7]
Port D(0) IOPD[0]
Port E(0−7) IOPE[0:7]
Port F(0−6) IOPF[0:6]
TRST
TDO
TDI
TMS
TCK
EMU0
EMU1
PDPINTB
CAP4/QEP3/IOPE7
CAP5/QEP4/IOPF0
CAP6/IOPF1
PWM7/IOPE1
PWM8/IOPE2
PWM9/IOPE3
PWM10/IOPE4
PWM11/IOPE5
PWM12/IOPE6
T3PWM/T3CMP/IOPF2
T4PWM/T4CMP/IOPF3
TDIRB/IOPF4
TCLKINB/IOPF5
Indicates optional modules.
The memory size and peripheral selection of these modules change for different 240xA devices.
See Table 1 for device-specific details.
POST OFFICE BOX 1443
• HOUSTON, TEXAS 77251−1443
SPRS145J − JULY 2000 − REVISED NOVEMBER 2004
pinouts
ADCIN08
ADCIN00
ADCIN09
ADCIN01
ADCIN10
111
110
109
118
112
BIO/ IOPC1
MP/MC
V SSA
119
113
READY
120
VREFHI
VREFLO
BOOT_EN/XF ‡
121
114
ENA_144
122
V CCA
XTAL1/CLKIN
123
115
XTAL2
124
116
TCLKINB/ IOPF5
V SSO
126
117
D0
127
125
V SS
128
D1
VDD
RS
133
129
D3
134
130
TCK
135
D2
D4
136
IOPF6
PDPINTB
137
131
D5
138
132
V SSO
TDI
139
TDO
VDDO
142
140
D6
143
141
TMS
144
PGE PACKAGE†
(TOP VIEW)
TRST
1
108
ADCIN11
TDIRB/IOPF4
2
107
ADCIN02
VSSO
3
106
ADCIN12
VDDO
4
105
ADCIN03
D7
5
104
ADCIN13
T4PWM/T4CMP/IOPF3
6
103
ADCIN04
PDPINTA
7
102
ADCIN05
T3PWM/T3CMP/IOPF2
8
101
ADCIN14
D8
9
100
ADCIN06
PLLF2
10
99
ADCIN07
PLLF
11
98
ADCIN15
PLLVCCA
12
97
VIS_OE
D9
13
96
STRB
TDIRA/IOPB6
14
95
VDDO
D10
15
94
VSSO
T1PWM/T1CMP/IOPB4
16
93
RD
92
R/W
91
EMU1/OFF
D11
17
T2PWM/T2CMP/IOPB5
18
W/R/IOPC0
19
90
EMU0
D12
20
89
WE
XINT2/ADCSOC/IOPD0
21
88
CAP4/QEP3/IOPE7
D13
22
87
DS
XINT1/IOPA2
23
86
VDD
D14
24
85
VSS
SCITXD/IOPA0
25
84
PS
SCIRXD/IOPA1
26
83
CAP1/QEP1/IOPA3
D15
27
82
IS
VSS
28
81
CAP5/QEP4/IOPF0
VDD
29
80
A0
SPISIMO/IOPC2
30
79
CAP2/QEP2/IOPA4
A15
31
78
A1
SPISOMI/IOPC3
32
77
VDDO
SPISTE/IOPC5
33
76
VSSO
A14
34
75
CAP3/IOPA5
SPICLK/IOPC4
35
74
A2
TMS2
36
73
CLKOUT/IOPE0
69
70
71
72
A3
CANTX/ IOPC6
67
VDDO
68
66
A4
65
CAP6/ IOPF1
CANRX/ IOPC7
64
A5
PWM7/ IOPE1
V SSO
60
TP1
63
59
PWM9/ IOPE3
TP2
58
62
57
A7
V CCP
61
56
PWM1/ IOPA6
A6
PWM8/ IOPE2
55
PWM10/ IOPE4
48
A10
V SS
54
47
PWM4/ IOPB1
53
46
PWM11/ IOPE5
A8
45
A11
PWM2/ IOPA7
44
52
43
A12
PWM5/ IOPB2
51
42
A9
41
VDDO
PWM3/ IOPB0
40
PWM6/ IOPB3
V SSO
50
39
A13
VDD
38
PWM12/ IOPE6
49
37
TCLKINA/ IOPB7
TMS320LF2407A PGE
† Bold, italicized pin names indicate pin function after reset.
‡ BOOT_EN is available only on Flash devices.
POST OFFICE BOX 1443
• HOUSTON, TEXAS 77251−1443
7
SPRS145J − JULY 2000 − REVISED NOVEMBER 2004
pinouts (continued)
ADCIN11
ADCIN02
ADCIN12
ADCIN03
ADCIN13
ADCIN04
ADCIN05
ADCIN14
ADCIN06
ADCIN07
ADCIN15
V DDO
V SSO
EMU1/ OFF
EMU0
CAP4/QEP3/ IOPE7
V DD
V SS
CAP1/QEP1/ IOPA3
CAP5/QEP4/ IOPF0
CAP2/QEP2/ IOPA4
V DDO
V SSO
CAP3/ IOPA5
CLKOUT/IOPE0
PZ PACKAGE†
( TOP VIEW )
75 74 73 72 71 70 69 68 67 66 65 64 63 62 61 60 59 58 57 56 55 54 53 52 51
ADCIN10
ADCIN01
ADCIN09
ADCIN00
ADCIN08
VREFLO
VREFHI
VCCA
VSSA
BIO/IOPC1
BOOT_EN/XF§
XTAL1/CLKIN
XTAL2
TCLKINB/IOPF5
VSS
VDD
50
49
48
47
46
45
44
43
42
41
40
TMS320LC2404A PZ
39
TMS320LC2406A PZ
38
37
TMS320LF2406A PZ
36
35
34
33
32
31
30
29
28
27
26
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25
TRST
TDIRB/ IOPF4
V SSO
V DDO
T4PWM/T4CMP/ IOPF3
PDPINTA
T3PWM/T3CMP/ IOPF2
PLLF2
PLLF
PLLVCCA
TDIRA/ IOPB6
T1PWM/T1CMP/ IOPB4
T2PWM/T2CMP/ IOPB5
IOPC0
XINT2/ADCSOC/ IOPD0
XINT1/ IOPA2
SCITXD/ IOPA0
SCIRXD/ IOPA1
V SS
V DD
SPISIMO/IOPC2
SPISOMI/ IOPC3
SPISTE/ IOPC5
SPICLK/ IOPC4
TMS2
IOPF6
RS
TCK
PDPINTB
TDI
VSSO
VDDO
TDO
TMS
76
77
78
79
80
81
82
83
84
85
86
87
88
89
90
91
92
93
94
95
96
97
98
99
100
† Bold, italicized pin names indicate pin function after reset.
‡ CANTX and CANRX are not available on LC2404A devices.
§ BOOT_EN is available only on Flash devices.
¶ On the ROM devices (LC240xA), VCCP is a No Connect (NC).
8
POST OFFICE BOX 1443
• HOUSTON, TEXAS 77251−1443
CANTX/IOPC6‡
CANRX/IOPC7‡
CAP6/IOPF1
VDDO
VSSO
PWM7/IOPE1
TP2
PWM8/IOPE2
TP1
PWM9/IOPE3
VCCP¶
PWM1/IOPA6
PWM10/IOPE4
PWM2/IOPA7
PWM3/IOPB0
VDD
VSS
PWM4/IOPB1
PWM11/IOPE5
PWM5/IOPB2
VDDO
VSSO
PWM6/IOPB3
PWM12/IOPE6
TCLKINA/IOPB7
SPRS145J − JULY 2000 − REVISED NOVEMBER 2004
pinouts (continued)
TMS2
SPICLK/IOPC4
SPISOMI/IOPC3
SPISIMO/IOPC2
SCIRXD/IOPA1
SCITXD/IOPA0
XINT2/ADCSOC/IOPD0
T2PWM/T2CMP/IOPB5
T1PWM/T1CMP/IOPB4
PLLV CCA
PLLF
PLLF2
PDPINTA
VDDO
VSSO
TRST
PAG PACKAGE†‡
(TOP VIEW)
48 47 46 45 44 4342 41 40 39 38 37 36 35 34 33
TP1
TP2
CANRX/IOPC7
CANTX/IOPC6
49
50
51
52
53
54
55
56
57
58
59
60
61
62
63
64
TMS320LF2403A PAG
TMS320LC2403A PAG
TMS320LC2402A PAG
TMS
TDO
TDI
TCK
RS
VDD
VSS
XTAL2
XTAL1/CLKIN
BOOT_EN/XF§
VSSA
VCCA
VREFHI
VREFLO
ADCIN00
ADCIN01
2 3 4 5 6 7 8 9 10 11 12 13 14 15 16
CLKOUT/IOPE0
CAP3/IOPA5
CAP2/QEP2/IOPA4
CAP1/QEP1/IOPA3
VSS
VDD
1
32
31
30
29
28
27
26
25
24
23
22
21
20
19
18
17
EMU0
EMU1/ OFF
VSSO
VDDO
ADCIN07
ADCIN06
ADCIN05
ADCIN04
ADCIN03
ADCIN02
TCLKINA/IOPB7
PWM6/IOPB3
VSSO
VDDO
PWM5/IOPB2
PWM4/IOPB1
VSS
VDD
PWM3/IOPB0
PWM2/IOPA7
PWM1/IOPA6
VCCP¶
† Bold, italicized pin names indicate pin function after reset.
‡ For LC2402A, the following pins are different from what is shown:
Pin 45: IOPC2
Pin 46: IOPC3
Pin 47: IOPC4
Pin 63: IOPC7
Pin 64: IOPC6
§ BOOT_EN is available only on flash devices.
¶ On the ROM devices (LC240xA), VCCP is a No Connect (NC).
POST OFFICE BOX 1443
• HOUSTON, TEXAS 77251−1443
9
SPRS145J − JULY 2000 − REVISED NOVEMBER 2004
pinouts (continued)
TRST
PDPINTA
VDDO
VSSO
PLLF
PLLF2
VSSO
PWM6/ IOPB3
TCLKINA/ IOPB7
TMS2
IOPC4
IOPC3
IOPC2
SCIRXD/ IOPA1
SCITXD/ IOPA0
XINT2/ADCSOC/ IOPD0
T2PWM/T2CMP/ IOPB5
T1PWM/T1CMP/ IOPB4
PLLV CCA
PG PACKAGE†
(TOP VIEW)
51 50 49 48 47 46 45 44 43 42 41 40 39 38 37 36 35 34 33
VDDO
PWM5/IOPB2
PWM4/IOPB1
VSS
VDD
PWM3/IOPB0
PWM2/IOPA7
PWM1/IOPA6
VCCP§
TP1
TP2
IOPC7
IOPC6
52
53
54
55
56
57
58
TMS320LC2402A PG
TMS320LF2402A PG
59
60
61
62
63
64
CLKOUT /IOPE0
CAP3/IOPA5
CAP2/QEP2/ IOPA4
CAP1/QEP1/ IOPA3
VSS
VDD
EMU0
EMU1/ OFF
VSSO
VDDO
ADCIN07
ADCIN06
ADCIN05
ADCIN04
ADCIN03
ADCIN02
ADCIN01
ADCIN00
V REFLO
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 1718 19
† Bold, italicized pin names indicate pin function after reset.
‡ BOOT_EN is available only on Flash devices.
§ On the ROM devices (LC240xA), VCCP is a No Connect (NC).
10
POST OFFICE BOX 1443
• HOUSTON, TEXAS 77251−1443
32
31
30
29
28
27
26
25
24
23
22
21
20
TMS
TDO
TDI
TCK
RS
VDD
VSS
XTAL2
XTAL1/CLKIN
BOOT_EN/XF‡
VSSA
VCCA
VREFHI
SPRS145J − JULY 2000 − REVISED NOVEMBER 2004
pin functions
The TMS320LF2407A device is the superset of all the 240xA devices. All signals are available on the 2407A
device. Table 2 lists the signals available in the 240xA generation of devices.
Table 2. LF240xA and LC240xA Pin List and Package Options†‡
PIN NAME
LF2407A
(144-PGE)
2406A
(100-PZ)
LC2404A
(100-PZ)
2403A,
LC2402A
(64-PAG)
and
2402A
(64-PG)
DESCRIPTION
EVENT MANAGER A (EVA)
CAP1/QEP1/IOPA3
83
57
57
4
Capture input #1/quadrature encoder pulse input #1 (EVA) or
GPIO (↑)
CAP2/QEP2/IOPA4
79
55
55
3
Capture input #2/quadrature encoder pulse input #2 (EVA) or
GPIO (↑)
CAP3/IOPA5
75
52
52
2
Capture input #3 (EVA) or GPIO (↑)
PWM1/IOPA6
56
39
39
59
Compare/PWM output pin #1 (EVA) or GPIO (↑)
PWM2/IOPA7
54
37
37
58
Compare/PWM output pin #2 (EVA) or GPIO (↑)
PWM3/IOPB0
52
36
36
57
Compare/PWM output pin #3 (EVA) or GPIO (↑)
PWM4/IOPB1
47
33
33
54
Compare/PWM output pin #4 (EVA) or GPIO (↑)
PWM5/IOPB2
44
31
31
53
Compare/PWM output pin #5 (EVA) or GPIO (↑)
PWM6/IOPB3
40
28
28
50
Compare/PWM output pin #6 (EVA) or GPIO (↑)
T1PWM/T1CMP/IOPB4
16
12
12
40
Timer 1 compare output (EVA) or GPIO (↑)
T2PWM/T2CMP/IOPB5
18
13
13
41
Timer 2 compare output (EVA) or GPIO (↑)
TDIRA/IOPB6
14
11
11
TCLKINA/IOPB7
37
26
26
Counting direction for general-purpose (GP) timer (EVA) or
GPIO. If TDIRA = 1, upward counting is selected. If
TDIRA = 0, downward counting is selected. (↑)
49
External clock input for GP timer (EVA) or GPIO. Note that
the timer can also use the internal device clock. (↑)
EVENT MANAGER B (EVB)
CAP4/QEP3/IOPE7
88
60
60
Capture input #4/quadrature encoder pulse input #3 (EVB) or
GPIO (↑)
CAP5/QEP4/IOPF0
81
56
56
Capture input #5/quadrature encoder pulse input #4 (EVB) or
GPIO (↑)
CAP6/IOPF1
69
48
48
Capture input #6 (EVB) or GPIO (↑)
PWM7/IOPE1
65
45
45
Compare/PWM output pin #7 (EVB) or GPIO (↑)
PWM8/IOPE2
62
43
43
Compare/PWM output pin #8 (EVB) or GPIO (↑)
PWM9/IOPE3
59
41
41
Compare/PWM output pin #9 (EVB) or GPIO (↑)
PWM10/IOPE4
55
38
38
Compare/PWM output pin #10 (EVB) or GPIO (↑)
PWM11/IOPE5
46
32
32
Compare/PWM output pin #11 (EVB) or GPIO (↑)
PWM12/IOPE6
38
27
27
Compare/PWM output pin #12 (EVB) or GPIO (↑)
† Bold, italicized pin names indicate pin function after reset.
‡ GPIO − General-purpose input/output pin. All GPIOs come up as input after reset.
§ It is highly recommended that VCCA be isolated from the digital supply voltage (and VSSA from digital ground) to maintain the specified accuracy
and improve the noise immunity of the ADC.
¶ Only when all of the following conditions are met: EMU1/OFF is low, TRST is low, and EMU0 is high
# No power supply pin (VDD, VDDO, VSS, or VSSO) should be left unconnected. All power supply pins must be connected appropriately for proper
device operation.
LEGEND: ↑ − Internal pullup
↓ − Internal pulldown
(Typical active pullup/pulldown value is ±16 µA.)
POST OFFICE BOX 1443
• HOUSTON, TEXAS 77251−1443
11
SPRS145J − JULY 2000 − REVISED NOVEMBER 2004
pin functions (continued)
Table 2. LF240xA and LC240xA Pin List and Package Options†‡ (Continued)
PIN NAME
LF2407A
(144-PGE)
2406A
(100-PZ)
LC2404A
(100-PZ)
2403A,
LC2402A
(64-PAG)
and
2402A
(64-PG)
DESCRIPTION
EVENT MANAGER B (EVB) (CONTINUED)
T3PWM/T3CMP/IOPF2
8
7
7
Timer 3 compare output (EVB) or GPIO (↑)
T4PWM/T4CMP/IOPF3
6
5
5
Timer 4 compare output (EVB) or GPIO (↑)
TDIRB/IOPF4
2
2
2
Counting direction for general-purpose (GP) timer
(EVB) or GPIO. If TDIRB = 1, upward counting is
selected. If TDIRB = 0, downward counting is
selected. (↑)
TCLKINB/IOPF5
126
89
89
External clock input for GP timer (EVB) or GPIO.
Note that the timer can also use the internal
device clock. (↑)
ADCIN00
112
79
79
18
Analog input #0 to the ADC
ADCIN01
110
77
77
17
Analog input #1 to the ADC
ADCIN02
107
74
74
16
Analog input #2 to the ADC
ADCIN03
105
72
72
15
Analog input #3 to the ADC
ADCIN04
103
70
70
14
Analog input #4 to the ADC
ADCIN05
102
69
69
13
Analog input #5 to the ADC
ADCIN06
100
67
67
12
Analog input #6 to the ADC
ADCIN07
99
66
66
11
Analog input #7 to the ADC
ADCIN08
113
80
80
Analog input #8 to the ADC
ADCIN09
111
78
78
Analog input #9 to the ADC
ADCIN10
109
76
76
Analog input #10 to the ADC
ADCIN11
108
75
75
Analog input #11 to the ADC
ADCIN12
106
73
73
Analog input #12 to the ADC
ADCIN13
104
71
71
Analog input #13 to the ADC
ADCIN14
101
68
68
Analog input #14 to the ADC
ADCIN15
98
65
65
Analog input #15 to the ADC
VREFHI
VREFLO
115
82
82
20
ADC analog high-voltage reference input
114
81
81
19
VCCA
VSSA
116
83
83
21
ADC analog low-voltage reference input
Analog supply voltage for ADC (3.3 V)§
117
84
84
22
Analog ground reference for ADC
ANALOG-TO-DIGITAL CONVERTER (ADC)
† Bold, italicized pin names indicate pin function after reset.
‡ GPIO − General-purpose input/output pin. All GPIOs come up as input after reset.
§ It is highly recommended that VCCA be isolated from the digital supply voltage (and VSSA from digital ground) to maintain the specified accuracy
and improve the noise immunity of the ADC.
¶ Only when all of the following conditions are met: EMU1/OFF is low, TRST is low, and EMU0 is high
# No power supply pin (VDD, VDDO, VSS, or VSSO) should be left unconnected. All power supply pins must be connected appropriately for proper
device operation.
LEGEND: ↑ − Internal pullup
↓ − Internal pulldown
(Typical active pullup/pulldown value is ±16 µA.)
12
POST OFFICE BOX 1443
• HOUSTON, TEXAS 77251−1443
SPRS145J − JULY 2000 − REVISED NOVEMBER 2004
pin functions (continued)
Table 2. LF240xA and LC240xA Pin List and Package Options†‡ (Continued)
LF2407A
(144-PGE)
PIN NAME
2406A
(100-PZ)
LC2404A
(100-PZ)
2403A,
LC2402A
(64-PAG)
and
2402A
(64-PG)
DESCRIPTION
CONTROLLER AREA NETWORK (CAN), SERIAL COMMUNICATIONS INTERFACE (SCI), SERIAL PERIPHERAL INTERFACE (SPI)
CANRX
70
49
−
63
CAN receive data or GPIO (LF2403A) (↑)
IOPC7
70
49
49
63
GPIO only (2402A) (↑)
CANTX
72
50
−
64
CAN transmit data or GPIO (LF2403A) (↑)
IOPC6
72
50
50
64
GPIO only (2402A) (↑)
SCITXD/IOPA0
25
17
17
43
SCI asynchronous serial port transmit data or GPIO (↑)
SCIRXD/IOPA1
26
18
18
44
SCI asynchronous serial port receive data or or
GPIO (↑)
SPICLK
35
24
24
47
SPI clock or GPIO (LF2403A) (↑)
IOPC4
35
24
24
47
GPIO only (2402A) (↑)
SPISIMO
30
21
21
45
SPI slave in, master out or GPIO (LF2403A) (↑)
IOPC2
30
21
21
45
GPIO only (2402A) (↑)
SPISOMI
32
22
22
46
SPI slave out, master in or GPIO (LF2403A) (↑)
IOPC3
32
22
22
46
GPIO only (2402A) (↑)
SPISTE
33
23
23
−
IOPC5
33
23
23
−
CANRX/IOPC7
CANTX/IOPC6
SPICLK/IOPC4
SPISIMO/IOPC2
SPISOMI/IOPC3
SPISTE/IOPC5
SPI slave transmit-enable (optional) or GPIO (↑)
EXTERNAL INTERRUPTS, CLOCK
Device Reset (in) and Watchdog Reset (out).
RS
133
93
93
28
Device reset. RS causes the device to terminate execution
and to set PC = 0. When RS is brought to a high level,
execution begins at location 0x0000 of program memory.
This pin is driven low by the DSP when a watchdog reset
occurs. During watchdog reset, the RS pin will be driven
low for the watchdog reset duration of 128 CLKIN cycles.
The output buffer of this pin is an open-drain with an
internal pullup (20 µA, typical). It is recommended that this
pin be driven by an open-drain device. (↑)
PDPINTA
7
6
6
36
Power drive protection interrupt input. This interrupt, when
activated, puts the PWM output pins (EVA) in the
high-impedance state should motor drive/power converter
abnormalities, such as overvoltage or overcurrent, etc.,
arise. PDPINTA is a falling-edge-sensitive interrupt. (↑)
† Bold, italicized pin names indicate pin function after reset.
‡ GPIO − General-purpose input/output pin. All GPIOs come up as input after reset.
§ It is highly recommended that VCCA be isolated from the digital supply voltage (and VSSA from digital ground) to maintain the specified accuracy
and improve the noise immunity of the ADC.
¶ Only when all of the following conditions are met: EMU1/OFF is low, TRST is low, and EMU0 is high
# No power supply pin (VDD, VDDO, VSS, or VSSO) should be left unconnected. All power supply pins must be connected appropriately for proper
device operation.
LEGEND: ↑ − Internal pullup
↓ − Internal pulldown
(Typical active pullup/pulldown value is ±16 µA.)
POST OFFICE BOX 1443
• HOUSTON, TEXAS 77251−1443
13
SPRS145J − JULY 2000 − REVISED NOVEMBER 2004
pin functions (continued)
Table 2. LF240xA and LC240xA Pin List and Package Options†‡ (Continued)
LF2407A
(144-PGE)
PIN NAME
2406A
(100-PZ)
LC2404A
(100-PZ)
2403A,
LC2402A
(64-PAG)
and
2402A
(64-PG)
DESCRIPTION
EXTERNAL INTERRUPTS, CLOCK (CONTINUED)
XINT1/IOPA2
23
XINT2/ADCSOC/IOPD0
CLKOUT/IOPE0
16
21
15
73
PDPINTB
51
137
95
16
External user interrupt 1 or GPIO. Both XINT1 and XINT2
are
edge-sensitive.
The
edge
polarity
is
programmable. (↑)
15
42
External user interrupt 2 and ADC start of conversion or
GPIO. External “start-of-conversion” input for ADC/GPIO.
Both XINT1 and XINT2 are edge-sensitive. The edge
polarity is programmable. (↑)
1
Clock output or GPIO. This pin outputs either the CPU clock
(CLKOUT) or the watchdog clock (WDCLK). The selection
is made by the CLKSRC bit (bit 14) of the system control
and status register (SCSR). This pin can be used as a GPIO
if not used as a clock output pin. (↑)
51
Power drive protection interrupt input. This interrupt, when
activated, puts the PWM output pins (EVB) in the
high-impedance state should motor drive/power converter
abnormalities, such as overvoltage or overcurrent, etc.,
arise. PDPINTB is a falling-edge-sensitive interrupt. (↑)
95
OSCILLATOR, PLL, FLASH, BOOT, AND MISCELLANEOUS
XTAL1/CLKIN
123
87
87
24
PLL oscillator input pin. Crystal input to PLL/clock source
input to PLL. XTAL1/CLKIN is tied to one side of a reference
crystal.
XTAL2
124
88
88
25
Crystal output. PLL oscillator output pin. XTAL2 is tied to
one side of a reference crystal. This pin goes in the
high-impedance state when EMU1/OFF is active low.
PLLVCCA
IOPF6
12
10
10
39
PLL supply (3.3 V)
131
92
92
BOOT_EN
121
86
−
23
XF
121
86
86
23
General-purpose I/O (↑)
BOOT_EN /
XF
Boot ROM enable, GPO, XF. This pin will be sampled as
input (BOOT_EN) to update SCSR2.3 (BOOT_EN bit)
during reset and then driven as an output signal for XF. After
reset, XF is driven high. ROM devices do not have boot
ROM, hence, no BOOT_EN modes. The BOOT_EN pin
must be driven with a passive circuit only. (↑)
PLLF
11
9
9
38
PLL loop filter input 1
† Bold, italicized pin names indicate pin function after reset.
‡ GPIO − General-purpose input/output pin. All GPIOs come up as input after reset.
§ It is highly recommended that VCCA be isolated from the digital supply voltage (and VSSA from digital ground) to maintain the specified accuracy
and improve the noise immunity of the ADC.
¶ Only when all of the following conditions are met: EMU1/OFF is low, TRST is low, and EMU0 is high
# No power supply pin (VDD, VDDO, VSS, or VSSO) should be left unconnected. All power supply pins must be connected appropriately for proper
device operation.
LEGEND: ↑ − Internal pullup
↓ − Internal pulldown
(Typical active pullup/pulldown value is ±16 µA.)
14
POST OFFICE BOX 1443
• HOUSTON, TEXAS 77251−1443
SPRS145J − JULY 2000 − REVISED NOVEMBER 2004
pin functions (continued)
Table 2. LF240xA and LC240xA Pin List and Package Options†‡ (Continued)
PIN NAME
LF2407A
(144-PGE)
2406A
(100-PZ)
LC2404A
(100-PZ)
2403A,
LC2402A
(64-PAG)
and
2402A
(64-PG)
DESCRIPTION
OSCILLATOR, PLL, FLASH, BOOT, AND MISCELLANEOUS (CONTINUED)
PLLF2
10
8
8
37
PLL loop filter input 2
VCCP (5V)
58
40
40
60
Flash programming voltage pin. This pin must be connected to
a 5-V supply for Flash programming. The Flash cannot be
programmed if this pin is connected to GND. When not
programming the Flash (i.e., during normal device operation),
this pin can either be left connected to the 5-V supply or it can
be tied to GND. This pin must not be left floating at any time. Do
not use any current-limiting resistor in series with the 5-V supply
on this pin. This pin is a “no connect” (NC) on ROM parts (i.e.,
this pin is not connected to any circuitry internal to the device).
Connecting this pin to 5 V or leaving it open makes no difference
on ROM parts.
TP1
60
42
42
61
Test pin 1. Do not connect.
TP2
63
44
44
62
Test pin 2. Do not connect.
BIO/IOPC1
119
85
Branch control input. BIO is polled by the BCND pma,BIO
instruction. If BIO is low, a branch is executed. If BIO is not used,
it should be pulled high. This pin is configured as a branch
control input by all device resets. It can be used as a GPIO, if
not used as a branch control input. (↑)
85
EMULATION AND TEST
EMU0
90
61
61
7
Emulator I/O #0 with internal pullup. When TRST is driven high,
this pin is used as an interrupt to or from the emulator system
and is defined as input/output through the JTAG scan. (↑)
EMU1/OFF
91
62
62
8
Emulator pin 1. Emulator pin 1 disables all outputs. When TRST
is driven high, EMU1/OFF is used as an interrupt to or from the
emulator system and is defined as an input/output through the
JTAG scan. When TRST is driven low, this pin is configured as
OFF. EMU1/OFF, when active low, puts all output drivers in the
high-impedance state. Note that OFF is used exclusively for
testing and emulation purposes (not for multiprocessing
applications). Therefore, for the OFF condition, the following
apply:
TRST = 0
EMU0 = 1
EMU1/OFF = 0 (↑)
TCK
135
94
94
29
JTAG test clock with internal pullup
(↑)
† Bold, italicized pin names indicate pin function after reset.
‡ GPIO − General-purpose input/output pin. All GPIOs come up as input after reset.
§ It is highly recommended that VCCA be isolated from the digital supply voltage (and VSSA from digital ground) to maintain the specified accuracy
and improve the noise immunity of the ADC.
¶ Only when all of the following conditions are met: EMU1/OFF is low, TRST is low, and EMU0 is high
# No power supply pin (VDD, VDDO, VSS, or VSSO) should be left unconnected. All power supply pins must be connected appropriately for proper
device operation.
LEGEND: ↑ − Internal pullup
↓ − Internal pulldown
(Typical active pullup/pulldown value is ±16 µA.)
POST OFFICE BOX 1443
• HOUSTON, TEXAS 77251−1443
15
SPRS145J − JULY 2000 − REVISED NOVEMBER 2004
pin functions (continued)
Table 2. LF240xA and LC240xA Pin List and Package Options†‡ (Continued)
PIN NAME
LF2407A
(144-PGE)
2406A
(100-PZ)
LC2404A
(100-PZ)
2403A,
LC2402A
(64-PAG)
and
2402A
(64-PG)
DESCRIPTION
EMULATION AND TEST (CONTINUED)
TDI
139
96
96
30
JTAG test data input (TDI) with internal pullup. TDI
is clocked into the selected register (instruction or
data) on a rising edge of TCK. (↑)
TDO
142
99
99
31
JTAG scan out, test data output (TDO). The
contents of the selected register (instruction or
data) is shifted out of TDO on the falling edge of
TCK. (↓)
TMS
144
100
100
32
JTAG test-mode select (TMS) with internal pullup.
This serial control input is clocked into the TAP
controller on the rising edge of TCK. (↑)
48
JTAG test-mode select 2 (TMS2) with internal
pullup. This serial control input is clocked into the
TAP controller on the rising edge of TCK. Used for
test and emulation only. This pin can be left
unconnected in user applications. If the PLL bypass
mode is desired, TMS2, TMS, and TRST should be
held low during reset. (↑)
TMS2
36
25
25
JTAG test reset with internal pulldown. TRST, when
driven high, gives the scan system control of the
operations of the device. If this signal is not
connected or driven low, the device operates in its
functional mode, and the test reset signals are
ignored. (↓)
TRST
1
1
1
33
NOTE: Do not use pullup resistors on TRST; it has
an internal pulldown device. In a low-noise
environment, TRST can be left unconnected. In a
high-noise environment, an additional pulldown
resistor may be needed. The value of this resistor
should be based on drive strength of the debugger
pods applicable to the design. A 2.2-kΩ resistor
generally offers adequate protection. Since this is
application-specific, it is recommended that each
target board is validated for proper operation of the
debugger and the application.
ADDRESS, DATA, AND MEMORY CONTROL SIGNALS
DS
87
Data space strobe. IS, DS, and PS are always high
unless low-level asserted for access to the relevant
external memory space or I/O. They are placed in
the high-impedance state.¶
† Bold, italicized pin names indicate pin function after reset.
‡ GPIO − General-purpose input/output pin. All GPIOs come up as input after reset.
§ It is highly recommended that VCCA be isolated from the digital supply voltage (and VSSA from digital ground) to maintain the specified accuracy
and improve the noise immunity of the ADC.
¶ Only when all of the following conditions are met: EMU1/OFF is low, TRST is low, and EMU0 is high
# No power supply pin (VDD, VDDO, VSS, or VSSO) should be left unconnected. All power supply pins must be connected appropriately for proper
device operation.
LEGEND: ↑ − Internal pullup
↓ − Internal pulldown
(Typical active pullup/pulldown value is ±16 µA.)
16
POST OFFICE BOX 1443
• HOUSTON, TEXAS 77251−1443
SPRS145J − JULY 2000 − REVISED NOVEMBER 2004
pin functions (continued)
Table 2. LF240xA and LC240xA Pin List and Package Options†‡ (Continued)
LF2407A
(144-PGE)
PIN NAME
2406A
(100-PZ)
LC2404A
(100-PZ)
2403A,
LC2402A
(64-PAG)
and
2402A
(64-PG)
DESCRIPTION
ADDRESS, DATA, AND MEMORY CONTROL SIGNALS (CONTINUED)
IS
82
I/O space strobe. IS, DS, and PS are always high
unless low-level asserted for access to the
relevant external memory space or I/O. They are
placed in the high-impedance state.¶
PS
84
Program space strobe. IS, DS, and PS are always
high unless low-level asserted for access to the
relevant external memory space or I/O. They are
placed in the high-impedance state.¶
92
Read/write qualifier signal. R/W indicates transfer
direction during communication to an external
device. It is normally in read mode (high), unless
low level is asserted for performing a write
operation. R/W is placed in the high-impedance
state.¶
R/W
W/R
19
IOPC0
19
W/R / IOPC0
RD
WE
STRB
14
14
Write/Read qualifier or GPIO. This is an inverted
R/W signal useful for zero-wait-state memory
interface. It is normally low, unless a memory write
operation is performed. See Table 12, Port C
section, for reset note regarding LF2406A and
LF2402A. (↑)
93
Read-enable strobe. Read-select indicates an
active, external read cycle. RD is active on all
external program, data, and I / O reads. RD is
placed in the high-impedance state.¶
89
Write-enable strobe. The falling edge of WE
indicates that the device is driving the external
data bus (D15 −D0). WE is active on all external
program, data, and I/O writes. WE is placed in the
high-impedance state.¶
96
External memory access strobe. STRB is always
high unless asserted low to indicate an external
bus cycle. STRB is active for all off-chip
accesses. STRB is placed in the high-impedance
state.¶
† Bold, italicized pin names indicate pin function after reset.
‡ GPIO − General-purpose input/output pin. All GPIOs come up as input after reset.
§ It is highly recommended that VCCA be isolated from the digital supply voltage (and VSSA from digital ground) to maintain the specified accuracy
and improve the noise immunity of the ADC.
¶ Only when all of the following conditions are met: EMU1/OFF is low, TRST is low, and EMU0 is high
# No power supply pin (VDD, VDDO, VSS, or VSSO) should be left unconnected. All power supply pins must be connected appropriately for proper
device operation.
LEGEND: ↑ − Internal pullup
↓ − Internal pulldown
(Typical active pullup/pulldown value is ±16 µA.)
POST OFFICE BOX 1443
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17
SPRS145J − JULY 2000 − REVISED NOVEMBER 2004
pin functions (continued)
Table 2. LF240xA and LC240xA Pin List and Package Options†‡ (Continued)
PIN NAME
LF2407A
(144-PGE)
2406A
(100-PZ)
LC2404A
(100-PZ)
2403A,
LC2402A
(64-PAG)
and
2402A
(64-PG)
DESCRIPTION
ADDRESS, DATA, AND MEMORY CONTROL SIGNALS (CONTINUED)
120
READY is pulled low to add wait states for external accesses.
READY indicates that an external device is prepared for a bus
transaction to be completed. If the device is not ready, it pulls the
READY pin low. The processor waits one cycle and checks
READY again. Note that the processor performs
READY-detection if at least one software wait state is
programmed. To meet the external READY timing parameters,
the wait-state generator control register (WSGR) should be
programmed for at least one wait state. (↑)
MP/MC
118
Microprocessor/Microcomputer mode select. If this pin is low
during reset, the device is put in microcomputer mode and
program execution begins at 0000h of internal program memory
(Flash EEPROM). A high value during reset puts the device in
microprocessor mode and program execution begins at 0000h
of external program memory. This line sets the MP/MC bit (bit 2
in the SCSR2 register). (↓)
ENA_144
122
Active high to enable external interface signals. If pulled low, the
2407A behaves like the 2406A/2403A/2402A—i.e., it has no
external memory and generates an illegal address if DS is
asserted. This pin has an internal pulldown. (↓)
VIS_OE
97
Visibility output enable (active when data bus is output). This pin
is active (low) whenever the external data bus is driving as an
output during visibility mode. Can be used by external decode
logic to prevent data bus contention while running in visibility
mode.
A0
80
Bit 0 of the 16-bit address bus
A1
78
Bit 1 of the 16-bit address bus
A2
74
Bit 2 of the 16-bit address bus
A3
71
Bit 3 of the 16-bit address bus
A4
68
Bit 4 of the 16-bit address bus
A5
64
Bit 5 of the 16-bit address bus
A6
61
Bit 6 of the 16-bit address bus
A7
57
Bit 7 of the 16-bit address bus
A8
53
Bit 8 of the 16-bit address bus
A9
51
Bit 9 of the 16-bit address bus
A10
48
Bit 10 of the 16-bit address bus
READY
A11
45
Bit 11 of the 16-bit address bus
† Bold, italicized pin names indicate pin function after reset.
‡ GPIO − General-purpose input/output pin. All GPIOs come up as input after reset.
§ It is highly recommended that VCCA be isolated from the digital supply voltage (and VSSA from digital ground) to maintain the specified accuracy
and improve the noise immunity of the ADC.
¶ Only when all of the following conditions are met: EMU1/OFF is low, TRST is low, and EMU0 is high
# No power supply pin (VDD, VDDO, VSS, or VSSO) should be left unconnected. All power supply pins must be connected appropriately for proper
device operation.
LEGEND: ↑ − Internal pullup
↓ − Internal pulldown
(Typical active pullup/pulldown value is ±16 µA.)
18
POST OFFICE BOX 1443
• HOUSTON, TEXAS 77251−1443
SPRS145J − JULY 2000 − REVISED NOVEMBER 2004
pin functions (continued)
Table 2. LF240xA and LC240xA Pin List and Package Options†‡ (Continued)
PIN NAME
LF2407A
(144-PGE)
2406A
(100-PZ)
LC2404A
(100-PZ)
2403A,
LC2402A
(64-PAG)
and
2402A
(64-PG)
DESCRIPTION
ADDRESS, DATA, AND MEMORY CONTROL SIGNALS (CONTINUED)
A12
43
Bit 12 of the 16-bit address bus
A13
39
Bit 13 of the 16-bit address bus
A14
34
Bit 14 of the 16-bit address bus
A15
31
Bit 15 of the 16-bit address bus
D0
127
Bit 0 of 16-bit data bus (↑)
D1
130
Bit 1 of 16-bit data bus (↑)
D2
132
Bit 2 of 16-bit data bus (↑)
D3
134
Bit 3 of 16-bit data bus (↑)
D4
136
Bit 4 of 16-bit data bus (↑)
D5
138
Bit 5 of 16-bit data bus (↑)
D6
143
Bit 6 of 16-bit data bus (↑)
D7
5
Bit 7 of 16-bit data bus (↑)
D8
9
Bit 8 of 16-bit data bus (↑)
D9
13
Bit 9 of 16-bit data bus (↑)
D10
15
Bit 10 of 16-bit data bus (↑)
D11
17
Bit 11 of 16-bit data bus (↑)
D12
20
Bit 12 of 16-bit data bus (↑)
D13
22
Bit 13 of 16-bit data bus (↑)
D14
24
Bit 14 of 16-bit data bus (↑)
D15
27
Bit 15 of 16-bit data bus (↑)
POWER SUPPLY
VDD#
VDDO#
29
20
20
6
50
35
35
27
86
59
59
56
129
91
91
4
4
4
10
42
30
30
35
67
47
47
52
77
54
54
95
64
64
141
98
Core supply +3.3 V. Digital logic supply voltage.
I/O buffer supply +3.3 V. Digital logic and buffer supply
voltage.
98
† Bold, italicized pin names indicate pin function after reset.
‡ GPIO − General-purpose input/output pin. All GPIOs come up as input after reset.
§ It is highly recommended that VCCA be isolated from the digital supply voltage (and VSSA from digital ground) to maintain the specified accuracy
and improve the noise immunity of the ADC.
¶ Only when all of the following conditions are met: EMU1/OFF is low, TRST is low, and EMU0 is high
# No power supply pin (VDD, VDDO, VSS, or VSSO) should be left unconnected. All power supply pins must be connected appropriately for proper
device operation.
LEGEND: ↑ − Internal pullup
↓ − Internal pulldown
(Typical active pullup/pulldown value is ±16 µA.)
POST OFFICE BOX 1443
• HOUSTON, TEXAS 77251−1443
19
SPRS145J − JULY 2000 − REVISED NOVEMBER 2004
pin functions (continued)
Table 2. LF240xA and LC240xA Pin List and Package Options†‡ (Continued)
PIN NAME
LC2404A
(100-PZ)
2403A,
LC2402A
(64-PAG)
and
2402A
(64-PG)
LF2407A
(144-PGE)
2406A
(100-PZ)
28
19
19
5
49
34
34
26
85
58
58
55
128
90
90
3
3
3
9
41
29
29
34
66
46
46
51
76
53
53
94
63
63
125
97
97
DESCRIPTION
POWER SUPPLY (CONTINUED)
VSS#
VSSO#
Core ground. Digital logic ground reference.
I/O buffer ground. Digital logic and buffer ground reference.
140
† Bold, italicized pin names indicate pin function after reset.
‡ GPIO − General-purpose input/output pin. All GPIOs come up as input after reset.
§ It is highly recommended that VCCA be isolated from the digital supply voltage (and VSSA from digital ground) to maintain the specified accuracy
and improve the noise immunity of the ADC.
¶ Only when all of the following conditions are met: EMU1/OFF is low, TRST is low, and EMU0 is high
# No power supply pin (VDD, VDDO, VSS, or VSSO) should be left unconnected. All power supply pins must be connected appropriately for proper
device operation.
LEGEND: ↑ − Internal pullup
↓ − Internal pulldown
(Typical active pullup/pulldown value is ±16 µA.)
20
POST OFFICE BOX 1443
• HOUSTON, TEXAS 77251−1443
SPRS145J − JULY 2000 − REVISED NOVEMBER 2004
memory maps
Hex
0000
Hex
0000
Program
Flash Sector 0 (4K)
Interrupt Vectors (0000−003Fh)
Reserved † (0040−0043h)
User code begins at 0044h
0FFF
1000
Flash Sector 1 (12K)
3FFF
4000
Flash Sector 2 (12K)
Data
005F
0060
007F
0080
00FF
0100
01FF
0200
ÈÈÈÈÈÈÈÈÈ
ÈÈÈÈÈÈÈÈÈ
ÈÈÈÈÈÈÈÈÈ
02FF
0300
03FF
0400
04FF
0500
07FF
0800
ÈÈÈÈÈÈÈÈÈ
ÈÈÈÈÈÈÈÈÈ
ÈÈÈÈÈÈÈÈÈ
ÉÉÉÉÉÉÉÉÉ
ÉÉÉÉÉÉÉÉÉ
ÉÉÉÉÉÉÉÉÉ
ÈÈÈÈÈÈÈÈÈ
ÈÈÈÈÈÈÈÈÈ
ÈÈÈÈÈÈÈÈÈ
ÈÈÈÈÈÈÈÈÈ
0FFF
1000
Hex
0000
Memory-Mapped
Registers/Reserved Addresses
I/O
On-Chip DARAM B2
Illegal
Reserved
On-Chip DARAM (B0)§ (CNF = 0)
Reserved (CNF = 1)
On-Chip DARAM (B1)¶
Reserved
Illegal
External
SARAM (2K)
Internal (DON = 1)
Reserved (DON=0)
Illegal
6FFF
7000
6FFF
7000
Flash Sector 3 (4K)
7FFF
8000
87FF
8800
ÉÉÉÉÉÉÉÉÉ
ÉÉÉÉÉÉÉÉÉ
ÉÉÉÉÉÉÉÉÉ
SARAM (2K)
Internal (PON = 1)
External (PON=0)
7FFF
8000
Peripheral Memory-Mapped
Registers (System, WD, ADC,
SCI, SPI, CAN, I/O, Interrupts)
FEFF
FF00
External
FF0E
External
FF0F
FDFF
FE00
FEFF
FF00
FFFF
FF10
Reserved‡ (CNF = 1)
External (CNF = 0)
FFFE
On-Chip DARAM (B0)‡ (CNF = 1)
External (CNF = 0)
FFFF
On-Chip Flash Memory (Sectored) − if MP/MC = 0
External Program Memory − if MP/MC = 1
ÉÉÉ
ÉÉÉ
ÈÈÈ
ÈÈÈ
ÈÈÈÈÈÈÈÈÈ
ÈÈÈÈÈÈÈÈÈ
ÈÈÈÈÈÈÈÈÈ
ÈÈÈÈÈÈÈÈÈ
ÈÈÈÈÈÈÈÈÈ
Reserved
Flash Control Mode Register
Reserved
Wait-State Generator Control
Register (On-Chip)
FFFF
SARAM (See Table 1 for details.)
Reserved or Illegal
NOTE A: Boot ROM: If the boot ROM is enabled, then addresses 0000−00FF in the program space will be occupied by boot ROM.
† Addresses 0040h−0043h in on-chip program memory are reserved for code security passwords.
‡ When CNF = 1, addresses FE00h−FEFFh and FF00h−FFFFh are mapped to the same physical block (B0) in program-memory space. For
example, a write to FE00h has the same effect as a write to FF00h. For simplicity, addresses FE00h−FEFFh are referred to as reserved when
CNF = 1.
§ When CNF = 0, addresses 0100h−01FFh and 0200h−02FFh are mapped to the same physical block (B0) in data-memory space. For example,
a write to 0100h has the same effect as a write to 0200h. For simplicity, addresses 0100h−01FFh are referred to as reserved.
¶ Addresses 0300h−03FFh and 0400h−04FFh are mapped to the same physical block (B1) in data-memory space. For example, a write to 0400h
has the same effect as a write to 0300h. For simplicity, addresses 0400h−04FFh are referred to as reserved.
Figure 1. TMS320LF2407A Memory Map
POST OFFICE BOX 1443
• HOUSTON, TEXAS 77251−1443
21
SPRS145J − JULY 2000 − REVISED NOVEMBER 2004
memory maps (continued)
Hex
0000
Hex
0000
Program
Flash Sector 0 (4K)
0FFF
1000
02FF
0300
03FF
0400
04FF
0500
07FF
0800
Flash Sector 1 (12K)
3FFF
4000
Flash Sector 2 (12K)
6FFF
7000
6FFF
7000
Flash Sector 3 (4K)
ÉÉÉÉÉÉÉÉÉÉ
ÉÉÉÉÉÉÉÉÉÉ
ÉÉÉÉÉÉÉÉÉÉ
ÈÈÈÈÈÈÈÈÈÈ
ÈÈÈÈÈÈÈÈÈÈ
ÈÈÈÈÈÈÈÈÈÈ
ÈÈÈÈÈÈÈÈÈÈ
ÈÈÈÈÈÈÈÈÈÈ
ÈÈÈÈÈÈÈÈÈÈ
SARAM (2K)
Internal (PON = 1)
Reserved (PON=0)
87FF
8800
Illegal
FDFF
FE00
Reserved‡
FEFF
FF00
On-Chip DARAM B2
Illegal
Reserved
On-Chip DARAM (B0)§ (CNF = 0)
Reserved (CNF = 1)
ÈÈÈÈÈÈÈÈÈÈ
ÈÈÈÈÈÈÈÈÈÈ
ÈÈÈÈÈÈÈÈÈÈ
ÉÉÉÉÉÉÉÉÉÉ
ÉÉÉÉÉÉÉÉÉÉ
ÉÉÉÉÉÉÉÉÉÉ
ÈÈÈÈÈÈÈÈÈÈ
ÈÈÈÈÈÈÈÈÈÈ
ÈÈÈÈÈÈÈÈÈÈ
ÈÈÈÈÈÈÈÈÈÈ
ÈÈÈÈÈÈÈÈÈÈ
ÈÈÈÈÈÈÈÈÈÈ
ÈÈÈÈÈÈÈÈÈÈ
ÈÈÈÈÈÈÈÈÈÈ
ÈÈÈÈÈÈÈÈÈÈ
ÈÈÈÈÈÈÈÈÈÈ
ÈÈÈÈÈÈÈÈÈÈ
ÈÈÈÈÈÈÈÈÈÈ
ÈÈÈÈÈÈÈÈÈÈ
ÈÈÈÈÈÈÈÈÈÈ
ÈÈÈÈÈÈÈÈÈÈ
ÈÈÈÈÈÈÈÈÈÈ
ÈÈÈÈÈÈÈÈÈÈ
ÉÉÉ
ÉÉÉ
ÈÈÈ
ÈÈÈ
0FFF
1000
7FFF
8000
ÈÈÈÈÈÈÈÈÈÈ
ÈÈÈÈÈÈÈÈÈÈ
ÈÈÈÈÈÈÈÈÈÈ
ÈÈÈÈÈÈÈÈÈÈ
ÈÈÈÈÈÈÈÈÈÈ
ÈÈÈÈÈÈÈÈÈÈ
ÈÈÈÈÈÈÈÈÈÈ
ÈÈÈÈÈÈÈÈÈÈ
ÈÈÈÈÈÈÈÈÈÈ
ÈÈÈÈÈÈÈÈÈÈ
ÈÈÈÈÈÈÈÈÈÈ
ÈÈÈÈÈÈÈÈÈÈ
ÈÈÈÈÈÈÈÈÈÈ
ÈÈÈÈÈÈÈÈÈÈ
ÈÈÈÈÈÈÈÈÈÈ
ÈÈÈÈÈÈÈÈÈÈ
ÈÈÈÈÈÈÈÈÈÈ
ÈÈÈÈÈÈÈÈÈÈ
ÈÈÈÈÈÈÈÈÈÈ
ÈÈÈÈÈÈÈÈÈÈ
ÈÈÈÈÈÈÈÈÈÈ
ÈÈÈÈÈÈÈÈÈÈ
ÈÈÈÈÈÈÈÈÈÈ
ÈÈÈÈÈÈÈÈÈÈ
ÈÈÈÈÈÈÈÈÈÈ
ÈÈÈÈÈÈÈÈÈÈ
ÈÈÈÈÈÈÈÈÈÈ
ÈÈÈÈÈÈÈÈÈÈ
Hex
0000
ÈÈÈÈÈÈÈÈÈÈ
ÈÈÈÈÈÈÈÈÈÈ
ÈÈÈÈÈÈÈÈÈÈ
005F
0060
007F
0080
00FF
0100
01FF
0200
Interrupt Vectors (0000−003Fh)
Reserved † (0040−0043h)
User code begins at 0044h
7FFF
8000
Data
Memory-Mapped
Registers/Reserved Addresses
On-Chip DARAM (B1)¶
Reserved
Illegal
SARAM (2K)
Internal (DON = 1)
Reserved (DON = 0)
Illegal
Peripheral Memory-Mapped
Registers (System, WD, ADC,
SCI, SPI, CAN, I/O, Interrupts)
Illegal
FEFF
FF00
FF0E
Illegal
FF0F
FF10
FFFE
On-Chip DARAM (B0)‡ (CNF = 1)
External (CNF = 0)
FFFF
Reserved
Flash Control Mode Register
Reserved
Reserved
FFFF
FFFF
On-Chip Flash Memory (Sectored)
I/O
SARAM (See Table 1 for details.)
Reserved or Illegal
NOTE A: Boot ROM: If the boot ROM is enabled, then addresses 0000−00FF in the program space will be occupied by boot ROM.
† Addresses 0040h−0043h in program memory are reserved for code security passwords.
‡ When CNF = 1, addresses FE00h−FEFFh and FF00h−FFFFh are mapped to the same physical block (B0) in program-memory space. For
example, a write to FE00h has the same effect as a write to FF00h. For simplicity, addresses FE00h−FEFFh are referred to as reserved.
§ When CNF = 0, addresses 0100h−01FFh and 0200h−02FFh are mapped to the same physical block (B0) in data-memory space. For example,
a write to 0100h has the same effect as a write to 0200h. For simplicity, addresses 0100h−01FFh are referred to as reserved.
¶ Addresses 0300h−03FFh and 0400h−04FFh are mapped to the same physical block (B1) in data-memory space. For example, a write to 0400h
has the same effect as a write to 0300h. For simplicity, addresses 0400h−04FFh are referred to as reserved.
Figure 2. TMS320LF2406A Memory Map
22
POST OFFICE BOX 1443
• HOUSTON, TEXAS 77251−1443
SPRS145J − JULY 2000 − REVISED NOVEMBER 2004
memory maps (continued)
Hex
Flash Sector 0 (4K)
Interrupt Vectors (0000−003Fh)
Reserved † (0040−0043h)
User code begins at 0044h
0000
0FFF
1000
3FFF
4000
Hex
0000
Program
ÈÈÈÈÈÈÈÈÈ
ÈÈÈÈÈÈÈÈÈ
ÈÈÈÈÈÈÈÈÈ
ÈÈÈÈÈÈÈÈÈ
ÈÈÈÈÈÈÈÈÈ
ÈÈÈÈÈÈÈÈÈ
ÈÈÈÈÈÈÈÈÈ
ÈÈÈÈÈÈÈÈÈ
ÉÉÉÉÉÉÉÉÉ
ÈÈÈÈÈÈÈÈÈ
ÉÉÉÉÉÉÉÉÉ
ÉÉÉÉÉÉÉÉÉ
ÉÉÉÉÉÉÉÉÉ
ÈÈÈÈÈÈÈÈÈ
ÈÈÈÈÈÈÈÈÈ
ÈÈÈÈÈÈÈÈÈ
ÈÈÈÈÈÈÈÈÈ
ÈÈÈÈÈÈÈÈÈ
ÈÈÈÈÈÈÈÈÈ
ÈÈÈÈÈÈÈÈÈ
ÈÈÈÈÈÈÈÈÈ
ÈÈÈÈÈÈÈÈÈ
ÈÈÈÈÈÈÈÈÈ
Flash Sector 1 (12K)
Reserved
7FFF
8000
81FF
8200
87FF
8800
ÈÈÈÈÈÈÈÈÈ
ÈÈÈÈÈÈÈÈÈ
ÈÈÈÈÈÈÈÈÈ
02FF
0300
03FF
0400
04FF
0500
07FF
0800
ÈÈÈÈÈÈÈÈÈ
ÈÈÈÈÈÈÈÈÈ
ÈÈÈÈÈÈÈÈÈ
ÉÉÉÉÉÉÉÉÉ
ÉÉÉÉÉÉÉÉÉ
ÉÉÉÉÉÉÉÉÉ
ÉÉÉÉÉÉÉÉÉ
ÈÈÈÈÈÈÈÈÈ
ÈÈÈÈÈÈÈÈÈ
ÈÈÈÈÈÈÈÈÈ
ÈÈÈÈÈÈÈÈÈ
ÈÈÈÈÈÈÈÈÈ
ÈÈÈÈÈÈÈÈÈ
ÈÈÈÈÈÈÈÈÈ
ÈÈÈÈÈÈÈÈÈ
ÈÈÈÈÈÈÈÈÈ
ÈÈÈÈÈÈÈÈÈ
ÈÈÈÈÈÈÈÈÈ
ÈÈÈÈÈÈÈÈÈ
ÈÈÈÈÈÈÈÈÈ
ÈÈÈÈÈÈÈÈÈ
ÈÈÈÈÈÈÈÈÈ
ÈÈÈÈÈÈÈÈÈ
ÉÉÉ
ÉÉÉ
ÈÈÈ
ÈÈÈ
0FFF
1000
6FFF
7000
Reserved
7FFF
8000
Illegal
On-Chip DARAM B2
Illegal
Reserved
On-Chip DARAM (B0)§ (CNF = 0)
Reserved (CNF = 1)
On-Chip DARAM (B1)¶
Reserved
Illegal
SARAM (512 words)
Internal (DON = 1)
Reserved (DON = 0)
Reserved
Illegal
Peripheral Memory-Mapped
Registers (System, WD, ADC,
SCI, I/O, Interrupts)
FEFF
FF00
FF0E
Illegal
FDFF
FE00
FF0F
FF10
Reserved‡
FEFF
FF00
Hex
0000
005F
0060
007F
0080
00FF
0100
01FF
0200
09FF
0A00
SARAM (512 words)
Internal (PON = 1)
Reserved (PON = 0)
Data
Memory-Mapped
Registers/Reserved Addresses
FFFE
On-Chip DARAM (B0)‡ (CNF = 1)
Reserved (CNF = 0)
FFFF
FFFF
On-Chip Flash Memory (Sectored)
FFFF
ÈÈÈÈÈÈÈÈÈ
ÈÈÈÈÈÈÈÈÈ
ÈÈÈÈÈÈÈÈÈ
ÈÈÈÈÈÈÈÈÈ
ÈÈÈÈÈÈÈÈÈ
ÈÈÈÈÈÈÈÈÈ
ÈÈÈÈÈÈÈÈÈ
ÈÈÈÈÈÈÈÈÈ
ÈÈÈÈÈÈÈÈÈ
ÈÈÈÈÈÈÈÈÈ
ÈÈÈÈÈÈÈÈÈ
ÈÈÈÈÈÈÈÈÈ
ÈÈÈÈÈÈÈÈÈ
ÈÈÈÈÈÈÈÈÈ
ÈÈÈÈÈÈÈÈÈ
ÈÈÈÈÈÈÈÈÈ
ÈÈÈÈÈÈÈÈÈ
ÈÈÈÈÈÈÈÈÈ
ÈÈÈÈÈÈÈÈÈ
ÈÈÈÈÈÈÈÈÈ
ÈÈÈÈÈÈÈÈÈ
ÈÈÈÈÈÈÈÈÈ
ÈÈÈÈÈÈÈÈÈ
ÈÈÈÈÈÈÈÈÈ
ÈÈÈÈÈÈÈÈÈ
ÈÈÈÈÈÈÈÈÈ
ÈÈÈÈÈÈÈÈÈ
ÈÈÈÈÈÈÈÈÈ
I/O
Illegal
Reserved
Flash Control Mode Register
Reserved
Reserved
SARAM (See Table 1 for details.)
Reserved or Illegal
NOTE A: Boot ROM: If the boot ROM is enabled, then addresses 0000−00FF in the program space will be occupied by boot ROM.
† Addresses 0040h−0043h in program memory are reserved for code security passwords.
‡ When CNF = 1, addresses FE00h−FEFFh and FF00h−FFFFh are mapped to the same physical block (B0) in program-memory space. For
example, a write to FE00h has the same effect as a write to FF00h. For simplicity, addresses FE00h−FEFFh are referred to as reserved.
§ When CNF = 0, addresses 0100h−01FFh and 0200h−02FFh are mapped to the same physical block (B0) in data-memory space. For example,
a write to 0100h has the same effect as a write to 0200h. For simplicity, addresses 0100h−01FFh are referred to as reserved.
¶ Addresses 0300h−03FFh and 0400h−04FFh are mapped to the same physical block (B1) in data-memory space. For example, a write to 0400h
has the same effect as a write to 0300h. For simplicity, addresses 0400h−04FFh are referred to as reserved.
Figure 3. TMS320LF2403A Memory Map
POST OFFICE BOX 1443
• HOUSTON, TEXAS 77251−1443
23
SPRS145J − JULY 2000 − REVISED NOVEMBER 2004
memory maps (continued)
Hex
0000
0FFF
1000
1FFF
2000
Flash Sector 0 (4K)
Interrupt Vectors (0000−003Fh)
Reserved † (0040−0043h)
User code begins at 0044h
ÈÈÈÈÈÈÈÈÈÈ
ÈÈÈÈÈÈÈÈÈÈ
ÈÈÈÈÈÈÈÈÈÈ
ÈÈÈÈÈÈÈÈÈÈ
ÈÈÈÈÈÈÈÈÈÈ
ÈÈÈÈÈÈÈÈÈÈ
ÈÈÈÈÈÈÈÈÈÈ
ÈÈÈÈÈÈÈÈÈÈ
ÉÉÉÉÉÉÉÉÉÉ
ÈÈÈÈÈÈÈÈÈÈ
ÉÉÉÉÉÉÉÉÉÉ
ÉÉÉÉÉÉÉÉÉÉ
ÉÉÉÉÉÉÉÉÉÉ
ÈÈÈÈÈÈÈÈÈÈ
ÈÈÈÈÈÈÈÈÈÈ
ÈÈÈÈÈÈÈÈÈÈ
ÈÈÈÈÈÈÈÈÈÈ
ÈÈÈÈÈÈÈÈÈÈ
ÈÈÈÈÈÈÈÈÈÈ
ÈÈÈÈÈÈÈÈÈÈ
ÈÈÈÈÈÈÈÈÈÈ
ÈÈÈÈÈÈÈÈÈÈ
ÈÈÈÈÈÈÈÈÈÈ
Flash Sector 1 (4K)
Reserved
7FFF
8000
81FF
8200
87FF
8800
SARAM (512 words)
Internal (PON = 1)
Reserved (PON = 0)
Reserved
Illegal
FDFF
FE00
Reserved‡
FEFF
FF00
ÈÈÈÈÈÈÈÈÈÈ
ÈÈÈÈÈÈÈÈÈÈ
ÈÈÈÈÈÈÈÈÈÈ ÈÈÈÈÈÈÈÈÈÈ
ÈÈÈÈÈÈÈÈÈÈ ÈÈÈÈÈÈÈÈÈÈ
ÈÈÈÈÈÈÈÈÈÈ ÈÈÈÈÈÈÈÈÈÈ
ÈÈÈÈÈÈÈÈÈÈ
ÈÈÈÈÈÈÈÈÈÈ
ÈÈÈÈÈÈÈÈÈÈ ÈÈÈÈÈÈÈÈÈÈ
ÈÈÈÈÈÈÈÈÈÈ ÈÈÈÈÈÈÈÈÈÈ
ÈÈÈÈÈÈÈÈÈÈ ÈÈÈÈÈÈÈÈÈÈ
ÉÉÉÉÉÉÉÉÉÉ
ÉÉÉÉÉÉÉÉÉÉ ÈÈÈÈÈÈÈÈÈÈ
ÉÉÉÉÉÉÉÉÉÉ ÈÈÈÈÈÈÈÈÈÈ
ÉÉÉÉÉÉÉÉÉÉ
ÈÈÈÈÈÈÈÈÈÈ ÈÈÈÈÈÈÈÈÈÈ
ÈÈÈÈÈÈÈÈÈÈ ÈÈÈÈÈÈÈÈÈÈ
ÈÈÈÈÈÈÈÈÈÈ ÈÈÈÈÈÈÈÈÈÈ
ÈÈÈÈÈÈÈÈÈÈ ÈÈÈÈÈÈÈÈÈÈ
ÈÈÈÈÈÈÈÈÈÈ
ÈÈÈÈÈÈÈÈÈÈ ÈÈÈÈÈÈÈÈÈÈ
ÈÈÈÈÈÈÈÈÈÈ ÈÈÈÈÈÈÈÈÈÈ
ÈÈÈÈÈÈÈÈÈÈ ÈÈÈÈÈÈÈÈÈÈ
ÈÈÈÈÈÈÈÈÈÈ ÈÈÈÈÈÈÈÈÈÈ
ÈÈÈÈÈÈÈÈÈÈ ÈÈÈÈÈÈÈÈÈÈ
ÈÈÈÈÈÈÈÈÈÈ
ÈÈÈÈÈÈÈÈÈÈ ÈÈÈÈÈÈÈÈÈÈ
ÈÈÈÈÈÈÈÈÈÈ ÈÈÈÈÈÈÈÈÈÈ
ÈÈÈÈÈÈÈÈÈÈ ÈÈÈÈÈÈÈÈÈÈ
ÈÈÈÈÈÈÈÈÈÈ ÈÈÈÈÈÈÈÈÈÈ
ÈÈÈÈÈÈÈÈÈÈ ÈÈÈÈÈÈÈÈÈÈ
ÈÈÈÈÈÈÈÈÈÈ ÈÈÈÈÈÈÈÈÈÈ
ÉÉÉ
ÉÉÉ
ÈÈÈ
ÈÈÈ
Hex
0000
Program
005F
0060
007F
0080
00FF
0100
01FF
0200
02FF
0300
03FF
0400
04FF
0500
07FF
0800
Data
Illegal
Reserved
On-Chip DARAM (B0)§ (CNF = 0)
Reserved (CNF = 1)
On-Chip DARAM (B1)¶
Reserved
Illegal
Illegal
SARAM (512 words)
Internal (DON = 1)
Reserved (DON = 0)
Reserved
0FFF
1000
7FFF
8000
Illegal
Peripheral Memory-Mapped
Registers (System, WD, ADC,
SCI, I/O, Interrupts)
FEFF
FF00
FF0E
Illegal
FF0F
FF10
FFFE
On-Chip DARAM (B0)‡ (CNF = 1)
Reserved (CNF = 0)
I/O
On-Chip DARAM B2
09FF
0A00
6FFF
7000
Hex
0000
Memory-Mapped
Registers/Reserved Addresses
Reserved
Flash Control Mode Register
Reserved
Reserved
FFFF
FFFF
FFFF
On-Chip Flash Memory (Sectored)
SARAM (See Table 1 for details.)
Reserved or Illegal
NOTE A: Boot ROM: If the boot ROM is enabled, then addresses 0000−00FF in the program space will be occupied by boot ROM.
† Addresses 0040h−0043h in program memory are reserved for code security passwords.
‡ When CNF = 1, addresses FE00h−FEFFh and FF00h−FFFFh are mapped to the same physical block (B0) in program-memory space. For
example, a write to FE00h has the same effect as a write to FF00h. For simplicity, addresses FE00h−FEFFh are referred to as reserved.
§ When CNF = 0, addresses 0100h−01FFh and 0200h−02FFh are mapped to the same physical block (B0) in data-memory space. For example,
a write to 0100h has the same effect as a write to 0200h. For simplicity, addresses 0100h−01FFh are referred to as reserved.
¶ Addresses 0300h−03FFh and 0400h−04FFh are mapped to the same physical block (B1) in data-memory space. For example, a write to 0400h
has the same effect as a write to 0300h. For simplicity, addresses 0400h−04FFh are referred to as reserved.
Figure 4. TMS320LF2402A Memory Map
24
POST OFFICE BOX 1443
• HOUSTON, TEXAS 77251−1443
SPRS145J − JULY 2000 − REVISED NOVEMBER 2004
memory maps (continued)
Hex
0000
Program
On-Chip ROM (32K)
Interrupt Vectors (0000−003Fh)
Reserved † (0040−0043h)
User code begins at 0044h
7FBF
7FC0
ÉÉÉÉÉÉÉÉÉÉ
ÉÉÉÉÉÉÉÉÉÉ
ÉÉÉÉÉÉÉÉÉÉ
ÉÉÉÉÉÉÉÉÉÉ
ÈÈÈÈÈÈÈÈÈÈ
ÈÈÈÈÈÈÈÈÈÈ
ÈÈÈÈÈÈÈÈÈÈ
ÈÈÈÈÈÈÈÈÈÈ
ÈÈÈÈÈÈÈÈÈÈ
ÈÈÈÈÈÈÈÈÈÈ
ÈÈÈÈÈÈÈÈÈÈ
ÈÈÈÈÈÈÈÈÈÈ
Reserved
7FFF
8000
87FF
8800
SARAM (2K)
Internal (PON = 1)
Reserved (PON = 0)
Reserved
Illegal
FDFF
FE00
Reserved‡
FEFF
FF00
On-Chip DARAM (B0)‡ (CNF = 1)
Reserved (CNF = 0)
Hex
0000
Data
Memory-Mapped
Registers/Reserved Addresses
ÈÈÈÈÈÈÈÈÈÈ
ÈÈÈÈÈÈÈÈÈÈ
ÈÈÈÈÈÈÈÈÈÈ
005F
0060
007F
0080
00FF
0100
01FF
0200
02FF
0300
03FF
0400
04FF
0500
07FF
0800
On-Chip DARAM B2
Illegal
Reserved
On-Chip DARAM (B0)§ (CNF = 0)
Reserved (CNF = 1)
ÈÈÈÈÈÈÈÈÈÈ
ÈÈÈÈÈÈÈÈÈÈ
ÈÈÈÈÈÈÈÈÈÈ
ÉÉÉÉÉÉÉÉÉÉ
ÉÉÉÉÉÉÉÉÉÉ
ÉÉÉÉÉÉÉÉÉÉ
ÈÈÈÈÈÈÈÈÈÈ
ÉÉÉÉÉÉÉÉÉÉ
ÈÈÈÈÈÈÈÈÈÈ
ÈÈÈÈÈÈÈÈÈÈ
On-Chip DARAM (B1)¶
Reserved
Illegal
SARAM (2K)
Internal (DON = 1)
Reserved (DON = 0)
0FFF
1000
Illegal
6FFF
7000
Peripheral Memory-Mapped
Registers (System, WD, ADC,
SCI, SPI, CAN, I/O, Interrupts)
ÈÈÈÈÈÈÈÈÈÈ
ÈÈÈÈÈÈÈÈÈÈ
ÈÈÈÈÈÈÈÈÈÈ
ÈÈÈÈÈÈÈÈÈÈ
ÈÈÈÈÈÈÈÈÈÈ
ÈÈÈÈÈÈÈÈÈÈ
ÈÈÈÈÈÈÈÈÈÈ
ÈÈÈÈÈÈÈÈÈÈ
ÈÈÈÈÈÈÈÈÈÈ
ÈÈÈÈÈÈÈÈÈÈ
ÈÈÈÈÈÈÈÈÈÈ
ÈÈÈÈÈÈÈÈÈÈ
ÈÈÈÈÈÈÈÈÈÈ
ÉÉÉ
ÉÉÉ
ÈÈÈ
ÈÈÈ
7FFF
8000
Illegal
FFFF
FFFF
On-Chip ROM memory
SARAM (See Table 1 for details.)
Reserved or Illegal
† Addresses 0040h−0043h in program memory are reserved for code security passwords.
‡ When CNF = 1, addresses FE00h−FEFFh and FF00h−FFFFh are mapped to the same physical block (B0) in program-memory space. For
example, a write to FE00h has the same effect as a write to FF00h. For simplicity, addresses FE00h−FEFFh are referred to as reserved.
§ When CNF = 0, addresses 0100h−01FFh and 0200h−02FFh are mapped to the same physical block (B0) in data-memory space. For example,
a write to 0100h has the same effect as a write to 0200h. For simplicity, addresses 0100h−01FFh are referred to as reserved.
¶ Addresses 0300h−03FFh and 0400h−04FFh are mapped to the same physical block (B1) in data-memory space. For example, a write to 0400h
has the same effect as a write to 0300h. For simplicity, addresses 0400h−04FFh are referred to as reserved.
Figure 5. TMS320LC2406A Memory Map
POST OFFICE BOX 1443
• HOUSTON, TEXAS 77251−1443
25
SPRS145J − JULY 2000 − REVISED NOVEMBER 2004
memory maps (continued)
Hex
0000
Program
On-Chip ROM (16K)
Interrupt Vectors (0000−003Fh)
Reserved † (0040−0043h)
User code begins at 0044h
3FBF
3FC0
ÈÈÈÈÈÈÈÈÈÈ
ÈÈÈÈÈÈÈÈÈÈ
ÈÈÈÈÈÈÈÈÈÈ
ÉÉÉÉÉÉÉÉÉÉ
ÉÉÉÉÉÉÉÉÉÉ
ÉÉÉÉÉÉÉÉÉÉ
ÈÈÈÈÈÈÈÈÈÈ
ÈÈÈÈÈÈÈÈÈÈ
ÈÈÈÈÈÈÈÈÈÈ
ÈÈÈÈÈÈÈÈÈÈ
ÈÈÈÈÈÈÈÈÈÈ
ÈÈÈÈÈÈÈÈÈÈ
ÈÈÈÈÈÈÈÈÈÈ
ÈÈÈÈÈÈÈÈÈÈ
ÈÈÈÈÈÈÈÈÈÈ
ÈÈÈÈÈÈÈÈÈÈ
ÈÈÈÈÈÈÈÈÈÈ
ÈÈÈÈÈÈÈÈÈÈ
ÈÈÈÈÈÈÈÈÈÈ
Reserved
3FFF
4000
7FFF
8000
83FF
8400
Reserved
SARAM (1K)
Internal (PON = 1)
Reserved (PON = 0)
Hex
0000
005F
0060
007F
0080
00FF
0100
01FF
0200
ÈÈÈÈÈÈÈÈÈ
ÈÈÈÈÈÈÈÈÈ
ÈÈÈÈÈÈÈÈÈ
02FF
0300
03FF
0400
04FF
0500
07FF
0800
ÈÈÈÈÈÈÈÈÈ
ÈÈÈÈÈÈÈÈÈ
ÈÈÈÈÈÈÈÈÈ
ÉÉÉÉÉÉÉÉÉ
ÉÉÉÉÉÉÉÉÉ
ÉÉÉÉÉÉÉÉÉ
ÈÈÈÈÈÈÈÈÈ
ÉÉÉÉÉÉÉÉÉ
ÈÈÈÈÈÈÈÈÈ
ÈÈÈÈÈÈÈÈÈ
0BFF
0C00
6FFF
7000
7FFF
8000
Reserved
Reserved‡
On-Chip DARAM (B0)‡ (CNF = 1)
Reserved (CNF = 0)
FFFF
FFFF
On-Chip ROM memory
On-Chip DARAM B2
Illegal
Reserved
On-Chip DARAM (B0)§ (CNF = 0)
Reserved (CNF = 1)
On-Chip DARAM (B1)¶
Reserved
Illegal
SARAM (1K)
Internal (DON = 1)
Reserved (DON = 0)
Illegal
Peripheral Memory-Mapped
Registers (System, WD, ADC,
SCI, SPI, I/O, Interrupts)
ÈÈÈÈÈÈÈÈÈ
ÈÈÈÈÈÈÈÈÈ
ÈÈÈÈÈÈÈÈÈ
ÈÈÈÈÈÈÈÈÈ
ÈÈÈÈÈÈÈÈÈ
ÈÈÈÈÈÈÈÈÈ
ÈÈÈÈÈÈÈÈÈ
ÈÈÈÈÈÈÈÈÈ
ÈÈÈÈÈÈÈÈÈ
ÈÈÈÈÈÈÈÈÈ
ÈÈÈÈÈÈÈÈÈ
ÈÈÈÈÈÈÈÈÈ
ÈÈÈÈÈÈÈÈÈ
ÉÉ
ÉÉ
ÈÈ
ÈÈ
Illegal
FDFF
FE00
FEFF
FF00
Data
Memory-Mapped
Registers/Reserved Addresses
SARAM (See Table 1 for details.)
Reserved or Illegal
† Addresses 0040h−0043h in program memory are reserved for code security passwords.
‡ When CNF = 1, addresses FE00h−FEFFh and FF00h−FFFFh are mapped to the same physical block (B0) in program-memory space. For
example, a write to FE00h has the same effect as a write to FF00h. For simplicity, addresses FE00h−FEFFh are referred to as reserved.
§ When CNF = 0, addresses 0100h−01FFh and 0200h−02FFh are mapped to the same physical block (B0) in data-memory space. For example,
a write to 0100h has the same effect as a write to 0200h. For simplicity, addresses 0100h−01FFh are referred to as reserved.
¶ Addresses 0300h−03FFh and 0400h−04FFh are mapped to the same physical block (B1) in data-memory space. For example, a write to 0400h
has the same effect as a write to 0300h. For simplicity, addresses 0400h−04FFh are referred to as reserved.
Figure 6. TMS320LC2404A Memory Map
26
POST OFFICE BOX 1443
• HOUSTON, TEXAS 77251−1443
SPRS145J − JULY 2000 − REVISED NOVEMBER 2004
memory maps (continued)
Hex
0000
Program
On-chip ROM (16K)
Interrupt Vectors (0000−003Fh)
Reserved † (0040−0043h)
User code begins at 0044h
3FFF
4000
ÈÈÈÈÈÈÈÈÈ
ÈÈÈÈÈÈÈÈÈ
ÈÈÈÈÈÈÈÈÈ
ÈÈÈÈÈÈÈÈÈ
ÈÈÈÈÈÈÈÈÈ
ÈÈÈÈÈÈÈÈÈ
ÈÈÈÈÈÈÈÈÈ
ÈÈÈÈÈÈÈÈÈ
ÉÉÉÉÉÉÉÉÉ
ÉÉÉÉÉÉÉÉÉ
ÉÉÉÉÉÉÉÉÉ
ÉÉÉÉÉÉÉÉÉ
ÈÈÈÈÈÈÈÈÈ
ÈÈÈÈÈÈÈÈÈ
ÈÈÈÈÈÈÈÈÈ
ÈÈÈÈÈÈÈÈÈ
ÈÈÈÈÈÈÈÈÈ
ÈÈÈÈÈÈÈÈÈ
ÈÈÈÈÈÈÈÈÈ
ÈÈÈÈÈÈÈÈÈ
ÈÈÈÈÈÈÈÈÈ
ÈÈÈÈÈÈÈÈÈ
Reserved
7FFF
8000
81FF
8200
87FF
8800
SARAM (512 words)
Internal (PON = 1)
Reserved (PON = 0)
Reserved
Illegal
FDFF
FE00
Reserved‡
FEFF
FF00
On-Chip DARAM (B0)‡ (CNF = 1)
Reserved (CNF = 0)
FFFF
Hex
0000
Data
Memory-Mapped
Registers/Reserved Addresses
ÈÈÈÈÈÈÈÈÈÈ
ÈÈÈÈÈÈÈÈÈÈ
ÈÈÈÈÈÈÈÈÈÈ
005F
0060
007F
0080
00FF
0100
01FF
0200
02FF
0300
03FF
0400
04FF
0500
07FF
0800
On-Chip DARAM B2
Illegal
Reserved
On-Chip DARAM (B0)§ (CNF = 0)
Reserved (CNF = 1)
ÈÈÈÈÈÈÈÈÈÈ
ÈÈÈÈÈÈÈÈÈÈ
ÈÈÈÈÈÈÈÈÈÈ
ÉÉÉÉÉÉÉÉÉÉ
ÉÉÉÉÉÉÉÉÉÉ
ÉÉÉÉÉÉÉÉÉÉ
ÉÉÉÉÉÉÉÉÉÉ
ÈÈÈÈÈÈÈÈÈÈ
ÈÈÈÈÈÈÈÈÈÈ
ÈÈÈÈÈÈÈÈÈÈ
ÈÈÈÈÈÈÈÈÈÈ
ÈÈÈÈÈÈÈÈÈÈ
ÈÈÈÈÈÈÈÈÈÈ
ÈÈÈÈÈÈÈÈÈÈ
ÈÈÈÈÈÈÈÈÈÈ
ÈÈÈÈÈÈÈÈÈÈ
ÈÈÈÈÈÈÈÈÈÈ
ÈÈÈÈÈÈÈÈÈÈ
ÈÈÈÈÈÈÈÈÈÈ
ÈÈÈÈÈÈÈÈÈÈ
ÈÈÈÈÈÈÈÈÈÈ
ÈÈÈÈÈÈÈÈÈÈ
ÈÈÈÈÈÈÈÈÈÈ
ÉÉÉ
ÉÉÉ
ÈÈÈ
ÈÈÈ
On-Chip DARAM (B1)¶
Reserved
Illegal
SARAM (512 words)
Internal (DON = 1)
Reserved (DON = 0)
09FF
0A00
Reserved
0FFF
1000
6FFF
7000
7FFF
8000
Illegal
Peripheral Memory-Mapped
Registers (System, WD, ADC,
SCI, I/O, Interrupts)
Illegal
FFFF
On-Chip Flash Memory (Sectored)
SARAM (See Table 1 for details.)
Reserved or Illegal
† Addresses 0040h−0043h in program memory are reserved for code security passwords.
‡ When CNF = 1, addresses FE00h−FEFFh and FF00h−FFFFh are mapped to the same physical block (B0) in program-memory space. For
example, a write to FE00h has the same effect as a write to FF00h. For simplicity, addresses FE00h−FEFFh are referred to as reserved.
§ When CNF = 0, addresses 0100h−01FFh and 0200h−02FFh are mapped to the same physical block (B0) in data-memory space. For example,
a write to 0100h has the same effect as a write to 0200h. For simplicity, addresses 0100h−01FFh are referred to as reserved.
¶ Addresses 0300h−03FFh and 0400h−04FFh are mapped to the same physical block (B1) in data-memory space. For example, a write to 0400h
has the same effect as a write to 0300h. For simplicity, addresses 0400h−04FFh are referred to as reserved.
Figure 7. TMS320LC2403A Memory Map
POST OFFICE BOX 1443
• HOUSTON, TEXAS 77251−1443
27
SPRS145J − JULY 2000 − REVISED NOVEMBER 2004
memory maps (continued)
Hex
0000
Program
On-Chip ROM (6K)
17BF
17C0
17FF
1800
7FFF
8000
Interrupt Vectors (0000−003Fh)
Reserved † (0040−0043h)
User code begins at 0044h
ÈÈÈÈÈÈÈÈÈÈ
ÈÈÈÈÈÈÈÈÈÈ
ÈÈÈÈÈÈÈÈÈÈ
ÈÈÈÈÈÈÈÈÈÈ
ÈÈÈÈÈÈÈÈÈÈ
ÈÈÈÈÈÈÈÈÈÈ
ÈÈÈÈÈÈÈÈÈÈ
ÈÈÈÈÈÈÈÈÈÈ
ÈÈÈÈÈÈÈÈÈÈ
ÈÈÈÈÈÈÈÈÈÈ
ÈÈÈÈÈÈÈÈÈÈ
ÈÈÈÈÈÈÈÈÈÈ
ÈÈÈÈÈÈÈÈÈÈ
ÈÈÈÈÈÈÈÈÈÈ
ÈÈÈÈÈÈÈÈÈÈ
ÈÈÈÈÈÈÈÈÈÈ
ÈÈÈÈÈÈÈÈÈÈ
ÈÈÈÈÈÈÈÈÈÈ
ÈÈÈÈÈÈÈÈÈÈ
ÈÈÈÈÈÈÈÈÈÈ
Reserved
Reserved
Reserved
87FF
8800
Reserved
FDFF
FE00
Reserved‡
FEFF
FF00
On-Chip DARAM (B0)‡ (CNF = 1)
Reserved (CNF = 0)
Hex
0000
005F
0060
007F
0080
00FF
0100
01FF
0200
02FF
0300
03FF
0400
04FF
0500
07FF
0800
Data
Memory-Mapped
Registers/Reserved Addresses
ÈÈÈÈÈÈÈÈÈ
ÈÈÈÈÈÈÈÈÈ
ÈÈÈÈÈÈÈÈÈ
On-Chip DARAM B2
Illegal
Reserved
On-Chip DARAM (B0)§ (CNF = 0)
Reserved (CNF = 1)
ÈÈÈÈÈÈÈÈÈ
ÈÈÈÈÈÈÈÈÈ
ÈÈÈÈÈÈÈÈÈ
ÈÈÈÈÈÈÈÈÈ
ÈÈÈÈÈÈÈÈÈ
ÈÈÈÈÈÈÈÈÈ
ÈÈÈÈÈÈÈÈÈ
ÈÈÈÈÈÈÈÈÈ
ÈÈÈÈÈÈÈÈÈ
ÈÈÈÈÈÈÈÈÈ
ÈÈÈÈÈÈÈÈÈ
ÈÈÈÈÈÈÈÈÈ
ÈÈÈÈÈÈÈÈÈ
ÈÈÈÈÈÈÈÈÈ
ÈÈÈÈÈÈÈÈÈ
ÈÈÈÈÈÈÈÈÈ
ÈÈÈÈÈÈÈÈÈ
ÈÈÈÈÈÈÈÈÈ
ÈÈÈÈÈÈÈÈÈ
ÈÈÈÈÈÈÈÈÈ
ÈÈÈÈÈÈÈÈÈ
ÈÈÈ
ÈÈÈ
On-Chip DARAM (B1)¶
Reserved
Illegal
Reserved
0FFF
1000
6FFF
7000
7FFF
8000
Illegal
Peripheral Memory-Mapped
Registers (System, WD, ADC,
SCI, I/O, Interrupts)
Illegal
FFFF
FFFF
On-Chip ROM memory
Reserved or Illegal
† Addresses 0040h−0043h in program memory are reserved for code security passwords.
‡ When CNF = 1, addresses FE00h−FEFFh and FF00h−FFFFh are mapped to the same physical block (B0) in program-memory space. For
example, a write to FE00h has the same effect as a write to FF00h. For simplicity, addresses FE00h−FEFFh are referred to as reserved.
§ When CNF = 0, addresses 0100h−01FFh and 0200h−02FFh are mapped to the same physical block (B0) in data-memory space. For example,
a write to 0100h has the same effect as a write to 0200h. For simplicity, addresses 0100h−01FFh are referred to as reserved.
¶ Addresses 0300h−03FFh and 0400h−04FFh are mapped to the same physical block (B1) in data-memory space. For example, a write to 0400h
has the same effect as a write to 0300h. For simplicity, addresses 0400h−04FFh are referred to as reserved.
Figure 8. TMS320LC2402A Memory Map
28
POST OFFICE BOX 1443
• HOUSTON, TEXAS 77251−1443
SPRS145J − JULY 2000 − REVISED NOVEMBER 2004
peripheral memory map of the 2407A/2406A
Interrupt-Mask Register
Hex
0000
0003
0004
Reserved
0005
Interrupt Flag Register
0006
0007
Reserved
Emulation Registers
and Reserved
Hex
0000
005F
0060
007F
0080
00FF
0100
Memory-Mapped Registers
and Reserved
ÈÈÈÈÈÈÈÈÈ
ÈÈÈÈÈÈÈÈÈ
On-Chip DARAM B2
Illegal
Reserved
01FF
0200
On-Chip DARAM B0
02FF
0300
03FF
0400
04FF
0500
07FF
0800
0FFF
1000
6FFF
7000
73FF
7400
743F
7440
74FF
7500
753F
7540
77EF
77F0
77F3
77F4
77FF
7800
7FFF
8000
FFFF
On-Chip DARAM B1
ÈÈÈÈÈÈÈÈÈ
ÈÈÈÈÈÈÈÈÈ
ÈÈÈÈÈÈÈÈÈ
ÈÈÈÈÈÈÈÈÈ
Reserved
Illegal
SARAM (2K)
Illegal
Peripheral Frame 1 (PF1)
ÈÈÈÈÈÈÈÈÈ
ÈÈÈÈÈÈÈÈÈ
ÈÈÈÈÈÈÈÈÈ
ÈÈÈÈÈÈÈÈÈ
Peripheral Frame 2 (PF2)
Illegal
Peripheral Frame 3 (PF3)
Illegal
Code Security Passwords
ÈÈÈÈÈÈÈÈÈ
ÈÈÈÈÈÈÈÈÈ
ÈÈÈÈ
ÈÈÈÈ
ÈÈÈÈ
Illegal
Reserved
Reserved
Illegal
External†
“Illegal” indicates that access to
these addresses causes a
nonmaskable interrupt (NMI).
“Reserved” indicates addresses that
are reserved for test.
† Available in LF2407A only
POST OFFICE BOX 1443
005F
ÈÈÈÈÈÈÈÈÈ
ÈÈÈÈÈÈÈÈÈ
Illegal
7000−700F
System Configuration and
Control Registers
7010−701F
ÈÈÈÈÈÈÈÈÈ
ÈÈÈÈÈÈÈÈÈ
ÈÈÈÈÈÈÈÈÈ
ÈÈÈÈÈÈÈÈÈ
ÈÈÈÈÈÈÈÈÈ
ÈÈÈÈÈÈÈÈÈ
ÈÈÈÈÈÈÈÈÈ
ÈÈÈÈÈÈÈÈÈ
ÈÈÈÈÈÈÈÈÈ
ÈÈÈÈÈÈÈÈÈ
ÈÈÈÈÈÈÈÈÈ
ÈÈÈÈÈÈÈÈÈ
Watchdog Timer Registers
7020−702F
Illegal
7030−703F
SPI
7040−704F
SCI
7050−705F
Illegal
7060−706F
External-Interrupt Registers
7070−707F
Illegal
7080−708F
Digital I/O Control Registers
7090−709F
ADC Control Registers
70A0−70BF
Illegal
70C0−70FF
CAN Control Registers
7100−710E
Illegal
710F−71FF
CAN Mailbox
7200−722F
Illegal
7230−73FF
Event Manager − EVA
General-Purpose
Timer Registers
Compare, PWM, and
Deadband Registers
Capture and QEP Registers
7400−7408
7411−7419
7420−7429
ÈÈÈÈÈÈÈÈÈ
ÈÈÈÈÈÈÈÈÈ
Interrupt Mask, Vector and
Flag Registers
742C−7431
Illegal
7432−743F
Event Manager − EVB
General-Purpose
Timer Registers
Compare, PWM, and
Deadband Registers
7500−7508
7511−7519
Capture and QEP Registers
7520−7529
Interrupt Mask, Vector, and
Flag Registers
752C−7531
Reserved
7532−753F
• HOUSTON, TEXAS 77251−1443
29
SPRS145J − JULY 2000 − REVISED NOVEMBER 2004
device reset and interrupts
The TMS320x240xA software-programmable interrupt structure supports flexible on-chip and external interrupt
configurations to meet real-time interrupt-driven application requirements. The LF240xA recognizes three types
of interrupt sources.
D Reset (hardware- or software-initiated) is unarbitrated by the CPU and takes immediate priority over any
other executing functions. All maskable interrupts are disabled until the reset service routine enables them.
The LF240xA devices have two sources of reset: an external reset pin and a watchdog timer time-out
(reset).
D Hardware-generated interrupts are requested by external pins or by on-chip peripherals. There are two
types:
−
External interrupts are generated by one of four external pins corresponding to the interrupts XINT1,
XINT2, PDPINTA, and PDPINTB. These four can be masked both by dedicated enable bits and by the
CPU interrupt mask register (IMR), which can mask each maskable interrupt line at the DSP core.
−
Peripheral interrupts are initiated internally by these on-chip peripheral modules: event manager A,
event manager B, SPI, SCI, CAN, and ADC. They can be masked both by enable bits for each event in
each peripheral and by the CPU IMR, which can mask each maskable interrupt line at the DSP core.
D Software-generated interrupts for the LF240xA devices include:
−
The INTR instruction. This instruction allows initialization of any LF240xA interrupt with software. Its
operand indicates the interrupt vector location to which the CPU branches. This instruction globally
disables maskable interrupts (sets the INTM bit to 1).
−
The NMI instruction. This instruction forces a branch to interrupt vector location 24h. This instruction
globally disables maskable interrupts. 240xA devices do not have the NMI hardware signal, only
software activation is provided.
−
The TRAP instruction. This instruction forces the CPU to branch to interrupt vector location 22h. The
TRAP instruction does not disable maskable interrupts (INTM is not set to 1); therefore, when the CPU
branches to the interrupt service routine, that routine can be interrupted by the maskable hardware
interrupts.
−
An emulator trap. This interrupt can be generated with either an INTR instruction or a TRAP instruction.
Six core interrupts (INT1−INT6) are expanded using a peripheral interrupt expansion (PIE) module identical to
the F24x devices. The PIE manages all the peripheral interrupts from the 240xA peripherals and are grouped to
share the six core level interrupts. Figure 9 shows the PIE block diagram for hardware-generated interrupts.
The PIE block diagram (Figure 9) and the interrupt table (Table 3) explain the grouping and interrupt vector
maps. LF240xA devices have interrupts identical to those of the F24x devices and should be completely
code-compatible. 240xA devices also have peripheral interrupts identical to those of the F24x − plus additional
interrupts for new peripherals such as event manager B. Though the new interrupts share the 24x interrupt
grouping, they all have a unique vector to differentiate among the interrupts. See Table 3 for details.
30
POST OFFICE BOX 1443
• HOUSTON, TEXAS 77251−1443
SPRS145J − JULY 2000 − REVISED NOVEMBER 2004
device reset and interrupts (continued)
PDPINTA
PIE
PDPINTB
IMR
ADCINT
XINT1
XINT2
SPIINT
RXINT
TXINT
CANMBINT
CANERINT
CMP1INT
CMP2INT
CMP3INT
CMP4INT
CMP5INT
CMP6INT
T1PINT
T1CINT
T1UFINT
T1OFINT
T3PINT
T3CINT
T3UFINT
T3OFINT
T2PINT
T2CINT
T2UFINT
T2OFINT
T4PINT
T4CINT
T4UFINT
T4OFINT
IFR
Level 1
IRQ GEN
INT1
INT2
Level 2
IRQ GEN
CPU
INT3
Level 3
IRQ GEN
CAP1INT
CAP2INT
CAP3INT
CAP4INT
CAP5INT
CAP6INT
Level 4
IRQ GEN
SPIINT
RXINT
TXINT
CANMBINT
CANERINT
Level 5
IRQ GEN
ADCINT
XINT1
INT4
INT5
INT6
Level 6
IRQ GEN
XINT2
IACK
PIVR & Logic
PIRQR#
PIACK#
Data Bus
Addr Bus
Indicates change with respect to the TMS320F243/F241/C242 data sheets.
Interrupts from external interrupt pins. The remaining interrupts are internal to the peripherals.
Figure 9. Peripheral Interrupt Expansion (PIE) Module Block Diagram for Hardware-Generated Interrupts
POST OFFICE BOX 1443
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31
SPRS145J − JULY 2000 − REVISED NOVEMBER 2004
interrupt request structure
Table 3. LF240xA/LC240xA Interrupt Source Priority and Vectors
OVERALL
PRIORITY
CPU
INTERRUPT
AND
VECTOR
ADDRESS
Reset
1
Reserved
PERIPHERAL
INTERRUPT
VECTOR
(PIV)
MASKABLE?
SOURCE
PERIPHERAL
MODULE
RSN
0000h
N/A
N
RS pin,
Watchdog
2
−
0026h
N/A
N
CPU
NMI
3
NMI
0024h
N/A
N
Nonmaskable
Interrupt
Nonmaskable interrupt,
software interrupt only
PDPINTA
4
0.0
0020h
Y
EVA
PDPINTB
5
2.0
0019h
Y
EVB
Power device protection
interrupt pins
ADCINT
6
0.1
0004h
Y
ADC
XINT1
7
0.2
0001h
Y
External
Interrupt Logic
INTERRUPT
NAME
XINT2
8
INT1
0002h
BIT
POSITION IN
PIRQRx AND
PIACKRx
DESCRIPTION
Reset from pin, watchdog
timeout
Emulator trap
ADC interrupt in
high-priority mode
External interrupt pins in high
priority
0.3
0011h
Y
External
Interrupt Logic
0.4
0005h
Y
SPI
SPI interrupt pins in high priority
SPIINT
9
RXINT
10
0.5
0006h
Y
SCI
SCI receiver interrupt in
high-priority mode
TXINT
11
0.6
0007h
Y
SCI
SCI transmitter interrupt in
high-priority mode
CANMBINT
12
0.7
0040
Y
CAN
CAN mailbox in high-priority
mode
CANERINT
13
0.8
0041
Y
CAN
CAN error interrupt in
high-priority mode
CMP1INT
14
0.9
0021h
Y
EVA
Compare 1 interrupt
CMP2INT
15
0.10
0022h
Y
EVA
Compare 2 interrupt
CMP3INT
16
0.11
0023h
Y
EVA
Compare 3 interrupt
T1PINT
17
0.12
0027h
Y
EVA
Timer 1 period interrupt
INT2
0004h
T1CINT
18
0.13
0028h
Y
EVA
Timer 1 compare interrupt
T1UFINT
19
0.14
0029h
Y
EVA
Timer 1 underflow interrupt
T1OFINT
20
0.15
002Ah
Y
EVA
Timer 1 overflow interrupt
CMP4INT
21
2.1
0024h
Y
EVB
Compare 4 interrupt
CMP5INT
22
2.2
0025h
Y
EVB
Compare 5 interrupt
CMP6INT
23
2.3
0026h
Y
EVB
Compare 6 interrupt
T3PINT
24
2.4
002Fh
Y
EVB
Timer 3 period interrupt
T3CINT
25
2.5
0030h
Y
EVB
Timer 3 compare interrupt
T3UFINT
26
2.6
0031h
Y
EVB
Timer 3 underflow interrupt
T3OFINT
27
2.7
0032h
Y
EVB
Timer 3 overflow interrupt
† See the TMS320LF/LC240xA DSP Controllers Reference Guide: System and Peripherals (literature number SPRU357) for more information.
NOTE: Some interrupts may not be available in a particular device due to the absence of a peripheral. See Table 1 for more details.
New peripheral interrupts and vectors with respect to the F243/F241 devices.
32
POST OFFICE BOX 1443
• HOUSTON, TEXAS 77251−1443
SPRS145J − JULY 2000 − REVISED NOVEMBER 2004
interrupt request structure (continued)
Table 3. LF240xA/LC240xA Interrupt Source Priority and Vectors (Continued)
INTERRUPT
NAME
OVERALL
PRIORITY
CPU
INTERRUPT
AND
VECTOR
ADDRESS
BIT
POSITION IN
PIRQRx AND
PIACKRx
PERIPHERAL
INTERRUPT
VECTOR
(PIV)
MASKABLE?
SOURCE
PERIPHERAL
MODULE
DESCRIPTION
T2PINT
28
1.0
002Bh
Y
EVA
Timer 2 period interrupt
T2CINT
29
1.1
002Ch
Y
EVA
Timer 2 compare interrupt
T2UFINT
30
1.2
002Dh
Y
EVA
Timer 2 underflow interrupt
T2OFINT
31
1.3
002Eh
Y
EVA
Timer 2 overflow interrupt
T4PINT
32
2.8
0039h
Y
EVB
Timer 4 period interrupt
T4CINT
33
2.9
003Ah
Y
EVB
Timer 4 compare interrupt
T4UFINT
34
2.10
003Bh
Y
EVB
Timer 4 underflow interrupt
T4OFINT
35
2.11
003Ch
Y
EVB
Timer 4 overflow interrupt
CAP1INT
36
1.4
0033h
Y
EVA
Capture 1 interrupt
CAP2INT
37
1.5
0034h
Y
EVA
Capture 2 interrupt
CAP3INT
38
1.6
0035h
Y
EVA
Capture 3 interrupt
CAP4INT
39
2.12
0036h
Y
EVB
Capture 4 interrupt
CAP5INT
40
2.13
0037h
Y
EVB
Capture 5 interrupt
CAP6INT
41
2.14
0038h
Y
EVB
Capture 6 interrupt
SPIINT
42
1.7
0005h
Y
SPI
SPI interrupt (low priority)
RXINT
43
1.8
0006h
Y
SCI
SCI receiver interrupt
(low-priority mode)
TXINT
44
1.9
0007h
Y
SCI
SCI transmitter interrupt
(low-priority mode)
CANMBINT
45
1.10
0040h
Y
CAN
CAN mailbox interrupt
(low-priority mode)
CANERINT
46
1.11
0041h
Y
CAN
CAN error interrupt
(low-priority mode)
ADCINT
47
1.12
0004h
Y
ADC
ADC interrupt
(low priority)
XINT1
48
1.13
0001h
Y
External
Interrupt Logic
Y
External
Interrupt Logic
XINT2
INT3
0006h
INT4
0008h
INT5
000Ah
INT6
000Ch
49
Reserved
1.14
0011h
External interrupt pins
(low-priority mode)
000Eh
N/A
Y
CPU
Analysis interrupt
TRAP
N/A
0022h
N/A
N/A
CPU
TRAP instruction
Phantom
Interrupt
Vector
N/A
N/A
0000h
N/A
CPU
Phantom interrupt vector
INT8−INT16
N/A
0010h−0020h
N/A
N/A
CPU
Software interrupt vectors†
INT20−INT31
N/A
00028h−0003Fh
N/A
N/A
CPU
† See the TMS320LF/LC240xA DSP Controllers Reference Guide: System and Peripherals (literature number SPRU357) for more information.
NOTE: Some interrupts may not be available in a particular device due to the absence of a peripheral. See Table 1 for more details.
New peripheral interrupts and vectors with respect to the F243/F241 devices.
POST OFFICE BOX 1443
• HOUSTON, TEXAS 77251−1443
33
SPRS145J − JULY 2000 − REVISED NOVEMBER 2004
DSP CPU core
The TMS320x240xA devices use an advanced Harvard-type architecture that maximizes processing power by
maintaining two separate memory bus structures — program and data — for full-speed execution. This multiple
bus structure allows data and instructions to be read simultaneously. Instructions support data transfers
between program memory and data memory. This architecture permits coefficients that are stored in program
memory to be read in RAM, thereby eliminating the need for a separate coefficient ROM. This, coupled with a
four-deep pipeline, allows the LF240xA/LC240xA devices to execute most instructions in a single cycle. See
the functional block diagram of the 240xA DSP CPU for more information.
TMS320x240xA instruction set
The x240xA microprocessor implements a comprehensive instruction set that supports both numeric-intensive
signal-processing operations and general-purpose applications, such as multiprocessing and high-speed
control.
For maximum throughput, the next instruction is prefetched while the current one is being executed. Because
the same data lines are used to communicate to external data, program, or I/O space, the number of cycles an
instruction requires to execute varies, depending upon whether the next data operand fetch is from internal or
external memory. Highest throughput is achieved by maintaining data memory on chip and using either internal
or fast external program memory.
addressing modes
The TMS320x240xA instruction set provides four basic memory-addressing modes: direct, indirect, immediate,
and register.
In direct addressing, the instruction word contains the lower seven bits of the data memory address. This field
is concatenated with the nine bits of the data memory page pointer (DP) to form the 16-bit data memory address.
Therefore, in the direct-addressing mode, data memory is paged effectively with a total of 512 pages, with each
page containing 128 words.
Indirect addressing accesses data memory through the auxiliary registers. In this addressing mode, the address
of the instruction operand is contained in the currently selected auxiliary register. Eight auxiliary registers
(AR0−AR7) provide flexible and powerful indirect addressing. To select a specific auxiliary register, the auxiliary
register pointer (ARP) is loaded with a value from 0 to 7 for AR0 through AR7, respectively.
scan-based emulation
TMS320x2xx devices incorporate scan-based emulation logic for code-development and hardwaredevelopment support. Scan-based emulation allows the emulator to control the processor in the system without
the use of intrusive cables to the full pinout of the device. The scan-based emulator communicates with the x2xx
by way of the IEEE 1149.1-compatible (JTAG) interface. The x240xA DSPs do not include boundary scan. The
scan chain of these devices is useful for emulation function only.
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functional block diagram of the 2407A DSP CPU
Program Bus
IS
DS
PS
Data Bus
Control
XTAL1
CLKOUT
XTAL2
NPAR
16
PC
PAR
Program Bus
MUX
R/W
STRB
READY
XF
MSTACK
MUX
RD
WE
RS
Stack 8 × 16
MP/MC
XINT[1−2]
2
FLASH EEPROM/
ROM
16
Program Control
(PCTRL)
16
MUX
A15−A0
16
16
16
16
MUX
D15−D0
16
16
Data Bus
16
Data Bus
16
16
9
3
AR0(16)
DP(9)
AR1(16)
16
7
LSB
from
IR
16
16
AR2(16)
ARP(3)
16
MUX
MUX
AR3(16)
3
16
16
9
AR4(16)
3
AR5(16)
ARB(3)
TREG0(16)
AR6(16)
Multiplier
AR7(16)
3
ISCALE (0−16)
PREG(32)
16
32
PSCALE (−6,ā 0,ā 1,ā 4)
32
32
16
MUX
ARAU(16)
MUX
32
CALU(32)
16
32
Memory Map
Register
32
MUX
MUX
Data/Prog
DARAM
B0 (256 × 16)
Data
DARAM
B2 (32 × 16)
IFR (16)
GREG (16)
C ACCH(16)
ACCL(16)
32
B1 (256 × 16)
MUX
OSCALE (0−7)
Program Bus
IMR (16)
16
16
16
16
NOTES: A. See Table 4 for symbol descriptions.
B. For clarity, the data and program buses are shown as single buses although they include address and data bits.
C. See the TMS320F/C24x DSP Controllers Reference Guide: CPU and Instruction Set (literature number SPRU160) for CPU
instruction set information.
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240xA legend for the internal hardware
Table 4. Legend for the 240xA DSP CPU Internal Hardware
SYMBOL
NAME
DESCRIPTION
ACC
Accumulator
32-bit register that stores the results and provides input for subsequent CALU operations. Also includes shift
and rotate capabilities
ARAU
Auxiliary Register
Arithmetic Unit
An unsigned, 16-bit arithmetic unit used to calculate indirect addresses using the auxiliary registers as inputs
and outputs
AUX
REGS
Auxiliary Registers
0 −7
These 16-bit registers are used as pointers to anywhere within the data space address range. They are
operated upon by the ARAU and are selected by the auxiliary register pointer (ARP). AR0 can also be used
as an index value for AR updates of more than one and as a compare value to AR.
C
Carry
Register carry output from CALU. C is fed back into the CALU for extended arithmetic operation. The C bit
resides in status register 1 (ST1), and can be tested in conditional instructions. C is also used in accumulator
shifts and rotates.
CALU
Central Arithmetic
Logic Unit
32-bit-wide main arithmetic logic unit for the TMS320C2xx core. The CALU executes 32-bit operations in a
single machine cycle. CALU operates on data coming from ISCALE or PSCALE with data from ACC, and
provides status results to PCTRL.
DARAM
Dual-Access RAM
If the on-chip RAM configuration control bit (CNF) is set to 0, the reconfigurable data dual-access RAM
(DARAM) block B0 is mapped to data space; otherwise, B0 is mapped to program space. Blocks B1 and B2
are mapped to data memory space only, at addresses 0300−03FF and 0060−007F, respectively. Blocks 0
and 1 contain 256 words, while block 2 contains 32 words.
DP
Data Memory
Page Pointer
The 9-bit DP register is concatenated with the seven least significant bits (LSBs) of an instruction word to
form a direct memory address of 16 bits. DP can be modified by the LST and LDP instructions.
GREG
Global Memory
Allocation
Register
GREG specifies the size of the global data memory space. Since the global memory space is not used in
the 240xA devices, this register is reserved.
IMR
Interrupt Mask
Register
IMR individually masks or enables the six core-level interrupts.
IFR
Interrupt Flag
Register
The 6-bit IFR indicates that the TMS320Lx240xA has latched an interrupt from one of the six maskable
interrupts.
INT#
Interrupt Traps
A total of 32 interrupts by way of hardware and/or software are available.
ISCALE
Input Data-Scaling
Shifter
16- to 32-bit barrel left-shifter. ISCALE shifts incoming 16-bit data 0 to16 positions left, relative to the 32-bit
output within the fetch cycle; therefore, no cycle overhead is required for input scaling operations.
MPY
Multiplier
16 × 16-bit multiplier to a 32-bit product. MPY executes multiplication in a single cycle. MPY operates either
signed or unsigned 2s-complement arithmetic multiply.
MSTACK
Micro Stack
MSTACK provides temporary storage for the address of the next instruction to be fetched when program
address-generation logic is used to generate sequential addresses in data space.
MUX
Multiplexer
Multiplexes buses to a common input
NPAR
Next Program
Address Register
NPAR holds the program address to be driven out on the PAB in the next cycle.
OSCALE
Output
Data-Scaling
Shifter
16- to 32-bit barrel left-shifter. OSCALE shifts the 32-bit accumulator output 0 to 7 bits left for quantization
management and outputs either the 16-bit high- or low-half of the shifted 32-bit data to the data-write data
bus (DWEB).
PAR
Program Address
Register
PAR holds the address currently being driven on PAB for as many cycles as it takes to complete all memory
operations scheduled for the current bus cycle.
PC
Program Counter
PC increments the value from NPAR to provide sequential addresses for instruction-fetching and sequential
data-transfer operations.
PCTRL
Program
Controller
PCTRL decodes instruction, manages the pipeline, stores status, and decodes conditional operations.
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240xA legend for the internal hardware (continued)
Table 4. Legend for the 240xA DSP CPU Internal Hardware (Continued)
SYMBOL
NAME
DESCRIPTION
PREG
Product Register
32-bit register holds results of 16 × 16 multiply
PSCALE
Product-Scaling
Shifter
0-, 1-, or 4-bit left shift, or 6-bit right shift of multiplier product. The left-shift options are used to manage the
additional sign bits resulting from the 2s-complement multiply. The right-shift option is used to scale down
the number to manage overflow of product accumulation in the CALU. PSCALE resides in the path from the
32-bit product shifter and from either the CALU or the data-write data bus (DWEB), and requires no cycle
overhead.
STACK
Stack
STACK is a block of memory used for storing return addresses for subroutines and interrupt-service
routines, or for storing data. The C2xx stack is 16 bits wide and 8 levels deep.
TREG
Temporary
Register
16-bit register holds one of the operands for the multiply operations. TREG holds the dynamic shift count
for the LACT, ADDT, and SUBT instructions. TREG holds the dynamic bit position for the BITT instruction.
status and control registers
Two status registers, ST0 and ST1, contain the status of various conditions and modes. These registers can
be stored into data memory and loaded from data memory, thus allowing the status of the machine to be saved
and restored for subroutines.
The load status register (LST) instruction is used to write to ST0 and ST1. The store status register (SST)
instruction is used to read from ST0 and ST1 — except for the INTM bit, which is not affected by the LST
instruction. The individual bits of these registers can be set or cleared when using the SETC and CLRC
instructions. Figure 10 shows the organization of status registers ST0 and ST1, indicating all status bits
contained in each. Several bits in the status registers are reserved and are read as logic 1s. Table 5 lists status
register field definitions.
15
ST0
13
ARP
15
ST1
13
ARB
12
11
10
9
OV
OVM
1
INTM
8
0
DP
12
11
10
9
8
7
6
5
4
3
2
CNF
TC
SXM
C
1
1
1
1
XF
1
1
1
0
PM
Figure 10. Organization of Status Registers ST0 and ST1
Table 5. Status Register Field Definitions
FIELD
FUNCTION
ARB
Auxiliary register pointer buffer. When the ARP is loaded into ST0, the old ARP value is copied to the ARB except during an LST
instruction. When the ARB is loaded by way of an LST #1 instruction, the same value is also copied to the ARP.
ARP
Auxiliary register (AR) pointer. ARP selects the AR to be used in indirect addressing. When the ARP is loaded, the old ARP value
is copied to the ARB register. ARP can be modified by memory-reference instructions when using indirect addressing, and by the
LARP, MAR, and LST instructions. The ARP is also loaded with the same value as ARB when an LST #1 instruction is executed.
C
Carry bit. C is set to 1 if the result of an addition generates a carry, or reset to 0 if the result of a subtraction generates a borrow.
Otherwise, C is reset after an addition or set after a subtraction, except if the instruction is ADD or SUB with a 16-bit shift. In these
cases, ADD can only set and SUB can only reset the carry bit, but cannot affect it otherwise. The single-bit shift and rotate
instructions also affect C, as well as the SETC, CLRC, and LST #1 instructions. Branch instructions have been provided to branch
on the status of C. C is set to 1 on a reset.
CNF
On-chip RAM configuration control bit. If CNF is set to 0, the reconfigurable data dual-access RAM blocks are mapped to data
space; otherwise, they are mapped to program space. The CNF can be modified by the SETC CNF, CLRC CNF, and LST #1
instructions. RS sets the CNF to 0.
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status and control registers (continued)
Table 5. Status Register Field Definitions (Continued)
FIELD
FUNCTION
DP
Data memory page pointer. The 9-bit DP register is concatenated with the 7 LSBs of an instruction word to form a direct memory
address of 16 bits. DP can be modified by the LST and LDP instructions.
INTM
Interrupt mode bit. When INTM is set to 0, all unmasked interrupts are enabled. When set to 1, all maskable interrupts are disabled.
INTM is set and reset by the SETC INTM and CLRC INTM instructions. RS also sets INTM. INTM has no effect on the unmaskable
RS and NMI interrupts. Note that INTM is unaffected by the LST instruction. This bit is set to 1 by reset. It is also set to 1 when
a maskable interrupt trap is taken.
OV
Overflow flag bit. As a latched overflow signal, OV is set to 1 when overflow occurs in the arithmetic logic unit (ALU). Once an
overflow occurs, the OV remains set until a reset, BCND/D on OV/NOV, or LST instruction clears OV.
OVM
Overflow mode bit. When OVM is set to 0, overflowed results overflow normally in the accumulator. When set to 1, the accumulator
is set to either its most positive or negative value upon encountering an overflow. The SETC and CLRC instructions set and reset
this bit, respectively. LST can also be used to modify the OVM.
PM
Product shift mode. If these two bits are 00, the multiplier’s 32-bit product is loaded into the ALU with no shift. If PM = 01, the PREG
output is left-shifted one place and loaded into the ALU, with the LSB zero-filled. If PM = 10, the PREG output is left-shifted by 4 bits
and loaded into the ALU, with the LSBs zero-filled. PM = 11 produces a right shift of 6 bits, sign-extended. Note that the PREG
contents remain unchanged. The shift takes place when transferring the contents of the PREG to the ALU. PM is loaded by the
SPM and LST #1 instructions. PM is cleared by RS.
SXM
Sign-extension mode bit. SXM = 1 produces sign extension on data as it is passed into the accumulator through the scaling shifter.
SXM = 0 suppresses sign extension. SXM does not affect the definitions of certain instructions; for example, the ADDS instruction
suppresses sign extension regardless of SXM. SXM is set by the SETC SXM instruction and reset by the CLRC SXM instruction
and can be loaded by the LST #1 instruction. SXM is set to 1 by reset.
TC
Test/control flag bit. TC is affected by the BIT, BITT, CMPR, LST #1, and NORM instructions. TC is set to a 1 if a bit tested by BIT
or BITT is a 1, if a compare condition tested by CMPR exists between AR (ARP) and AR0, if the exclusive-OR function of the 2 most
significant bits (MSBs) of the accumulator is true when tested by a NORM instruction. The conditional branch, call, and return
instructions can execute based on the condition of TC.
XF
XF pin status bit. XF indicates the state of the XF pin, a general-purpose output pin. XF is set by the SETC XF instruction and reset
by the CLRC XF instruction. XF is set to 1 by reset.
central processing unit
The TMS320x240xA central processing unit (CPU) contains a 16-bit scaling shifter, a 16 x 16-bit parallel
multiplier, a 32-bit central arithmetic logic unit (CALU), a 32-bit accumulator, and additional shifters at the
outputs of both the accumulator and the multiplier. This section describes the CPU components and their
functions. The functional block diagram shows the components of the CPU.
input scaling shifter
The TMS320x240xA provides a scaling shifter with a 16-bit input connected to the data bus and a 32-bit output
connected to the CALU. This shifter operates as part of the path of data coming from program or data space
to the CALU and requires no cycle overhead. It is used to align the 16-bit data coming from memory to the 32-bit
CALU. This is necessary for scaling arithmetic as well as aligning masks for logical operations.
The scaling shifter produces a left shift of 0 to 16 on the input data. The LSBs of the output are filled with zeros;
the MSBs can either be filled with zeros or sign-extended, depending upon the value of the SXM bit
(sign-extension mode) of status register ST1. The shift count is specified by a constant embedded in the
instruction word or by a value in TREG. The shift count in the instruction allows for specific scaling or alignment
operations specific to that point in the code. The TREG base shift allows the scaling factor to be adaptable to
the system’s performance.
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multiplier
The TMS320x240xA devices use a 16 x 16-bit hardware multiplier that is capable of computing a signed or an
unsigned 32-bit product in a single machine cycle. All multiply instructions, except the MPYU (multiply unsigned)
instruction, perform a signed multiply operation. That is, two numbers being multiplied are treated as
2s-complement numbers, and the result is a 32-bit 2s-complement number. There are two registers associated
with the multiplier, as follow:
D 16-bit temporary register (TREG) that holds one of the operands for the multiplier
D 32-bit product register (PREG) that holds the product
Four product-shift modes (PM) are available at the PREG output (PSCALE). These shift modes are useful for
performing multiply/accumulate operations, performing fractional arithmetic, or justifying fractional products.
The PM field of status register ST1 specifies the PM shift mode, as shown in Table 6.
Table 6. PSCALE Product-Shift Modes
PM
SHIFT
00
No shift
DESCRIPTION
01
Left 1
Removes the extra sign bit generated in a 2s-complement multiply to produce a Q31 product
10
Left 4
Removes the extra 4 sign bits generated in a 16x13 2s-complement multiply to a produce a Q31 product when
using the multiply-by-a-13-bit constant
11
Right 6
Scales the product to allow up to 128 product accumulation without the possibility of accumulator overflow
Product feed to CALU or data bus with no shift
The product can be shifted one bit to compensate for the extra sign bit gained in multiplying two 16-bit
2s-complement numbers (MPY instruction). A four-bit shift is used in conjunction with the MPY instruction with
a short immediate value (13 bits or less) to eliminate the four extra sign bits gained in multiplying a 16-bit number
by a 13-bit number. Finally, the output of PREG can be right-shifted 6 bits to enable the execution of up to
128 consecutive multiply/accumulates without the possibility of overflow.
The LT (load TREG) instruction normally loads TREG to provide one operand (from the data bus), and the MPY
(multiply) instruction provides the second operand (also from the data bus). A multiplication also can be
performed with a 13-bit immediate operand when using the MPY instruction. Then, a product is obtained every
two cycles. When the code is executing multiple multiplies and product sums, the CPU supports the pipelining
of the TREG load operations with CALU operations using the previous product. The pipeline operations that
run in parallel with loading the TREG include: load ACC with PREG (LTP); add PREG to ACC (LTA); add PREG
to ACC and shift TREG input data (DMOV) to next address in data memory (LTD); and subtract PREG from ACC
(LTS).
Two multiply/accumulate instructions (MAC and MACD) fully utilize the computational bandwidth of the
multiplier, allowing both operands to be processed simultaneously. The data for these operations can be
transferred to the multiplier each cycle by way of the program and data buses. This facilitates single-cycle
multiply/accumulates when used with the repeat (RPT) instruction. In these instructions, the coefficient
addresses are generated by program address generation (PAGEN) logic, while the data addresses are
generated by data address generation (DAGEN) logic. This allows the repeated instruction to access the values
from the coefficient table sequentially and step through the data in any of the indirect addressing modes.
The MACD instruction, when repeated, supports filter constructs (weighted running averages) so that as the
sum-of-products is executed, the sample data is shifted in memory to make room for the next sample and to
throw away the oldest sample.
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multiplier (continued)
The MPYU instruction performs an unsigned multiplication, which greatly facilitates extended-precision
arithmetic operations. The unsigned contents of TREG are multiplied by the unsigned contents of the addressed
data memory location, with the result placed in PREG. This process allows the operands of greater than 16 bits
to be broken down into 16-bit words and processed separately to generate products of greater than 32 bits. The
SQRA (square / add) and SQRS (square/subtract) instructions pass the same value to both inputs of the
multiplier for squaring a data memory value.
After the multiplication of two 16-bit numbers, the 32-bit product is loaded into the 32-bit product register
(PREG). The product from PREG can be transferred to the CALU or to data memory by way of the SPH (store
product high) and SPL (store product low) instructions. Note: the transfer of PREG to either the CALU or data
bus passes through the PSCALE shifter, and therefore is affected by the product shift mode defined by PM. This
is important when saving PREG in an interrupt-service-routine context save as the PSCALE shift effects cannot
be modeled in the restore operation. PREG can be cleared by executing the MPY #0 instruction. The product
register can be restored by loading the saved low half into TREG and executing a MPY #1 instruction. The high
half, then, is loaded using the LPH instruction.
central arithmetic logic unit
The TMS320x240xA central arithmetic logic unit (CALU) implements a wide range of arithmetic and logical
functions, the majority of which execute in a single clock cycle. This ALU is referred to as central to differentiate
it from a second ALU used for indirect-address generation called the auxiliary register arithmetic unit (ARAU).
Once an operation is performed in the CALU, the result is transferred to the accumulator (ACC) where additional
operations, such as shifting, can occur. Data that is input to the CALU can be scaled by ISCALE when coming
from one of the data buses (DRDB or PRDB) or scaled by PSCALE when coming from the multiplier.
The CALU is a general-purpose ALU that operates on 16-bit words taken from data memory or derived from
immediate instructions. In addition to the usual arithmetic instructions, the CALU can perform Boolean
operations, facilitating the bit-manipulation ability required for a high-speed controller. One input to the CALU
is always provided from the accumulator, and the other input can be provided from the product register (PREG)
of the multiplier or the output of the scaling shifter (that has been read from data memory or from the ACC). After
the CALU has performed the arithmetic or logical operation, the result is stored in the accumulator.
The TMS320x240xA devices support floating-point operations for applications requiring a large dynamic range.
The NORM (normalization) instruction is used to normalize fixed-point numbers contained in the accumulator
by performing left shifts. The four bits of the TREG define a variable shift through the scaling shifter for the
LACT/ADDT/SUBT (load/add to/subtract from accumulator with shift specified by TREG) instructions. These
instructions are useful in floating-point arithmetic where a number needs to be denormalized — that is,
floating-point to fixed-point conversion. They are also useful in the execution of an automatic gain control (AGC)
going into a filter. The BITT (bit test) instruction provides testing of a single bit of a word in data memory based
on the value contained in the four LSBs of TREG.
The CALU overflow saturation mode can be enabled/disabled by setting/resetting the OVM bit of ST0. When
the CALU is in the overflow saturation mode and an overflow occurs, the overflow flag is set and the accumulator
is loaded with either the most positive or the most negative value representable in the accumulator, depending
on the direction of the overflow. The value of the accumulator at saturation is 07FFFFFFFh (positive) or
080000000h (negative). If the OVM (overflow mode) status register bit is reset and an overflow occurs, the
overflowed results are loaded into the accumulator with modification. (Note that logical operations cannot result
in overflow.)
The CALU can execute a variety of branch instructions that depend on the status of the CALU and the
accumulator. These instructions can be executed conditionally based on any meaningful combination of these
status bits. For overflow management, these conditions include OV (branch on overflow) and EQ (branch on
accumulator equal to zero). In addition, the BACC (branch to address in accumulator) instruction provides the
ability to branch to an address specified by the accumulator (computed goto). Bit test instructions (BIT and
BITT), which do not affect the accumulator, allow the testing of a specified bit of a word in data memory.
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central arithmetic logic unit (continued)
The CALU also has an associated carry bit that is set or reset depending on various operations within the device.
The carry bit allows more efficient computation of extended-precision products and additions or subtractions.
It is also useful in overflow management. The carry bit is affected by most arithmetic instructions as well as the
single-bit shift and rotate instructions. It is not affected by loading the accumulator, logical operations, or other
such non-arithmetic or control instructions.
The ADDC (add to accumulator with carry) and SUBB (subtract from accumulator with borrow) instructions use
the previous value of carry in their addition/subtraction operation.
The one exception to the operation of the carry bit is in the use of ADD with a shift count of 16 (add to high
accumulator) and SUB with a shift count of 16 (subtract from high accumulator) instructions. This case of the
ADD instruction can set the carry bit only if a carry is generated, and this case of the SUB instruction can reset
the carry bit only if a borrow is generated; otherwise, neither instruction affects it.
Two conditional operands, C and NC, are provided for branching, calling, returning, and conditionally executing,
based upon the status of the carry bit. The SETC, CLRC, and LST #1 instructions also can be used to load the
carry bit. The carry bit is set to one on a hardware reset.
accumulator
The 32-bit accumulator is the registered output of the CALU. It can be split into two 16-bit segments for storage
in data memory. Shifters at the output of the accumulator provide a left shift of 0 to 7 places. This shift is
performed while the data is being transferred to the data bus for storage. The contents of the accumulator
remain unchanged. When the postscaling shifter is used on the high word of the accumulator (bits 16−31), the
MSBs are lost and the LSBs are filled with bits shifted in from the low word (bits 0−15). When the postscaling
shifter is used on the low word, the LSBs are zero-filled.
The SFL and SFR (in-place one-bit shift to the left / right) instructions and the ROL and ROR (rotate to the
left/right) instructions implement shifting or rotating of the contents of the accumulator through the carry bit. The
SXM bit affects the definition of the SFR (shift accumulator right) instruction. When SXM = 1, SFR performs an
arithmetic right shift, maintaining the sign of the accumulator data. When SXM = 0, SFR performs a logical shift,
shifting out the LSBs and shifting in a zero for the MSB. The SFL (shift accumulator left) instruction is not affected
by the SXM bit and behaves the same in both cases, shifting out the MSB and shifting in a zero. Repeat (RPT)
instructions can be used with the shift and rotate instructions for multiple-bit shifts.
auxiliary registers and auxiliary-register arithmetic unit (ARAU)
The 240xA provides a register file containing eight auxiliary registers (AR0 −AR7). The auxiliary registers are
used for indirect addressing of the data memory or for temporary data storage. Indirect auxiliary-register
addressing allows placement of the data memory address of an instruction operand into one of the auxiliary
registers. These registers are referenced with a 3-bit auxiliary register pointer (ARP) that is loaded with a value
from 0 through 7, designating AR0 through AR7, respectively. The auxiliary registers and the ARP can be loaded
from data memory, the ACC, the product register, or by an immediate operand defined in the instruction. The
contents of these registers also can be stored in data memory or used as inputs to the CALU.
The auxiliary register file (AR0−AR7) is connected to the ARAU. The ARAU can autoindex the current auxiliary
register while the data memory location is being addressed. Indexing either by ±1 or by the contents of the AR0
register can be performed. As a result, accessing tables of information does not require the CALU for address
manipulation; therefore, the CALU is free for other operations in parallel.
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internal memory
The TMS320x240xA devices are configured with the following memory modules:
D
D
D
D
D
Dual-access random-access memory (DARAM)
Single-access random-access memory (SARAM)
Flash
ROM
Boot ROM
dual-access RAM (DARAM)
There are 544 words × 16 bits of DARAM on the 240xA devices. The 240xA DARAM allows writes to and reads
from the RAM in the same cycle. The DARAM is configured in three blocks: block 0 (B0), block 1 (B1), and
block 2 (B2). Block 1 contains 256 words and Block 2 contains 32 words, and both blocks are located only in
data memory space. Block 0 contains 256 words, and can be configured to reside in either data or program
memory space. The SETC CNF (configure B0 as program memory) and CLRC CNF (configure B0 as data
memory) instructions allow dynamic configuration of the memory maps through software.
When using on-chip RAM, the 240xA runs at full speed with no wait states. The ability of the DARAM to allow
two accesses to be performed in one cycle, coupled with the parallel nature of the 240xA architecture, enables
the device to perform three concurrent memory accesses in any given machine cycle. Externally, the READY
line or on-chip software wait-state generator can be used to interface the 2407A to slower, less expensive
external memory.
single-access RAM (SARAM)
There are 2K words × 16 bits of SARAM on some of the 240xA devices.† The PON and DON bits select SARAM
(2K) mapping in program space, data space, or both. See Table 19 for details on the SCSR2 register and the
PON and DON bits. At reset, these bits are 11, and the on-chip SARAM is mapped in both the program and data
spaces. The SARAM (starting at 8000h in program memory) is accessible in external memory space (for 2407A
only), if the on-chip SARAM is not enabled.
flash EEPROM
Flash EEPROM provides an attractive alternative to masked program ROM. Like ROM, Flash is nonvolatile.
However, it has the advantage of “in-target” reprogrammability. The LF2407A incorporates one 32K 16-bit
Flash EEPROM module in program space. The Flash module has multiple sectors that can be individually
protected while erasing or programming. The sector size is non-uniform and partitioned as 4K/12K/12K/4K
sectors.
Unlike most discrete Flash memory, the LF240xA Flash does not require a dedicated state machine, because
the algorithms for programming and erasing the Flash are executed by the DSP core. This enables several
advantages, including: reduced chip size and sophisticated, adaptive algorithms. For production programming,
the IEEE Standard 1149.1‡ (JTAG) scan port provides easy access to the on-chip RAM for downloading the
algorithms and Flash code. This Flash requires 5 V for programming (at VCCP pin only) the array. The Flash runs
at zero wait state while the device is powered at 3.3 V.
ROM
The LC240xA devices contain mask-programmable ROM located in program memory space. Customers can
arrange to have this ROM programmed with contents unique to any particular application. See Table 1 for the
ROM memory capacity of each LC240xA device.
† See Table 1 for device-specific features.
‡ IEEE Standard 1149.1−1990, IEEE Standard Test Access Port.
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boot ROM (LF240xA only)
Boot ROM is a 256-word ROM memory-mapped in program space 0000−00FF. This ROM will be enabled if the
BOOT_EN pin is low during reset. The BOOT_EN bit (bit 3 of the SCSR2 register) will be set to 0 if the BOOT_EN
pin is low at reset. Boot ROM can also be enabled by writing 0 to the SCSR2.3 bit and disabled by writing 1 to
this bit.
The boot ROM has a generic bootloader to transfer code through SCI or SPI ports. The incoming code should
disable the BOOT_ROM bit by writing 1 to bit 3 of the SCSR2 register, or else, the whole Flash array will not
be enabled.
The boot ROM code sets the PLL to x2 or x4 option based on the condition of the SCITXD pin during reset. The
SCITXD pin should be pulled high/low to select the PLL multiplication factor. The choices made are as follows:
D If the SCITXD pin is pulled low, the PLL multiplier is set to 2.
D If the SCITXD pin is pulled high, the PLL multiplier is set to 4. (Default)
D If the SCITXD pin is not driven at reset, the internal pullup selects the default multiplier of 4.
Care should be taken such that a combination of CLKIN and the PLL multiplication factor should not result in
a CPU clock speed of greater than 40 MHz, the maximum rated speed.
Furthermore, when the bootloader is used, only specific values of CLKIN would result in a baud-lock for the SCI.
See the TMS320LF/LC240xA DSP Controllers Reference Guide: System and Peripherals (literature number
SPRU357) for more details about the bootloader operation.
flash/ROM security
240xA devices incorporate a security feature that prevents external access to program memory. This feature
is useful in preventing unauthorized duplication of proprietary code.
If access to Flash/ROM contents are desired for debugging purposes, two actions need to be taken:
1. A “dummy” read of locations 40h, 41h, 42h and 43h (of program memory space) is necessary. The word
“dummy” indicates that the destination address of this read is insignificant.
NOTE: Step 2 is not required if 40h−43h contain 0000 0000 0000 0000h or FFFF FFFF FFFF FFFFh.
2. A 64-bit password (split as four 16-bit words) must be written to the data-memory locations 77F0h, 77F1h,
77F2h, and 77F3h. The four 16-bit words written to these locations must match the four words stored in 40h,
41h, 42h, and 43h (of program memory space), respectively. The device becomes “unsecured” one cycle
after the last instruction that unsecures the part.
Code Security Module Disclaimer
The Code Security Module (“CSM”) included on this device was designed to password
protect the data stored in the associated memory (either ROM or Flash) and is warranted
by Texas Instruments (TI), in accordance with its standard terms and conditions, to
conform to TI’s published specifications for the warranty period applicable for this device.
TI DOES NOT, HOWEVER, WARRANT OR REPRESENT THAT THE CSM CANNOT BE
COMPROMISED OR BREACHED OR THAT THE DATA STORED IN THE
ASSOCIATED MEMORY CANNOT BE ACCESSED THROUGH OTHER MEANS.
MOREOVER, EXCEPT AS SET FORTH ABOVE, TI MAKES NO WARRANTIES OR
REPRESENTATIONS CONCERNING THE CSM OR OPERATION OF THIS DEVICE,
INCLUDING ANY IMPLIED WARRANTIES OF MERCHANTABILITY OR FITNESS FOR
A PARTICULAR PURPOSE.
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IN NO EVENT SHALL TI BE LIABLE FOR ANY CONSEQUENTIAL, SPECIAL,
INDIRECT, INCIDENTAL, OR PUNITIVE DAMAGES, HOWEVER CAUSED, ARISING
IN ANY WAY OUT OF YOUR USE OF THE CSM OR THIS DEVICE, WHETHER OR NOT
TI HAS BEEN ADVISED OF THE POSSIBILITY OF SUCH DAMAGES. EXCLUDED
DAMAGES INCLUDE, BUT ARE NOT LIMITED TO LOSS OF DATA, LOSS OF
GOODWILL, LOSS OF USE OR INTERRUPTION OF BUSINESS OR OTHER
ECONOMIC LOSS.
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PERIPHERALS
The integrated peripherals of the TMS320x240xA are described in the following subsections:
D
D
D
D
D
D
D
D
D
Two event-manager modules (EVA, EVB)
Enhanced analog-to-digital converter (ADC) module
Controller area network (CAN) module
Serial communications interface (SCI) module
Serial peripheral interface (SPI) module
PLL-based clock module
Digital I/O and shared pin functions
External memory interfaces (LF2407A only)
Watchdog (WD) timer module
event manager modules (EVA, EVB)
The event-manager modules include general-purpose (GP) timers, full-compare/PWM units, capture units, and
quadrature-encoder pulse (QEP) circuits. EVA and EVB timers, compare units, and capture units function
identically. However, timer/unit names differ for EVA and EVB. Table 7 shows the module and signal names
used. Table 7 shows the features and functionality available for the event-manager modules and highlights EVA
nomenclature.
Event managers A and B have identical peripheral register sets with EVA starting at 7400h and EVB starting
at 7500h. The paragraphs in this section describe the function of GP timers, compare units, capture units, and
QEPs using EVA nomenclature. These paragraphs are applicable to EVB with regard to function—however,
module/signal names would differ.
Table 7. Module and Signal Names for EVA and EVB
EVA
EVENT MANAGER MODULES
EVB
MODULE
SIGNAL
MODULE
SIGNAL
Timer 1
Timer 2
T1PWM/T1CMP
T2PWM/T2CMP
Timer 3
Timer 4
T3PWM/T3CMP
T4PWM/T4CMP
Compare Units
Compare 1
Compare 2
Compare 3
PWM1/2
PWM3/4
PWM5/6
Compare 4
Compare 5
Compare 6
PWM7/8
PWM9/10
PWM11/12
Capture Units
Capture 1
Capture 2
Capture 3
CAP1
CAP2
CAP3
Capture 4
Capture 5
Capture 6
CAP4
CAP5
CAP6
QEP1
QEP2
QEP1
QEP2
QEP3
QEP4
QEP3
QEP4
Direction
External Clock
TDIRA
TCLKINA
Direction
External Clock
TDIRB
TCLKINB
GP Timers
QEP
External Inputs
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event manager modules (EVA, EVB) (continued)
240xA DSP Core
Data Bus
ADDR Bus
Reset INT2,3,4 Clock
16
3
16
16
16
EV Control Registers
and Control Logic
ADC Start of
Conversion
Output
Logic
GP Timer 1
Compare
T1PWM/
T1CMP
TDIRA†
16
TCLKINA
GP Timer 1
Prescaler
CLKOUT
(Internal)
16
T1CON[4,5]
16
Full-Compare
Units
3
SVPWM
State
Machine
T1CON[8,9,10]
PWM1
3
3
Deadband
Units
Output
Logic
PWM6
16
16
GP Timer 2
Compare
T2PWM/
T2CMP
Output
Logic
16
TCLKINA
Prescaler
GP Timer 2
CLKOUT
(Internal)
T2CON[8,9,10]
T2CON[4,5]
TDIRA
16
DIR
Clock
QEP
Circuit
MUX
CAPCONA[14,13]
2
2
16
2
Capture Units
CAP3
16
† 2402A devices do not support external direction control. TDIR is not available.
Figure 11. Event Manager A Block Diagram
46
CAP1/QEP1
CAP2/QEP2
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general-purpose (GP) timers
There are two GP timers. The GP timer x (x = 1 or 2 for EVA; x = 3 or 4 for EVB) includes:
D
D
D
D
D
D
D
D
A 16-bit timer, up-/down-counter, TxCNT, for reads or writes
A 16-bit timer-compare register, TxCMPR (double-buffered with shadow register), for reads or writes
A 16-bit timer-period register, TxPR (double-buffered with shadow register), for reads or writes
A 16-bit timer-control register,TxCON, for reads or writes
Selectable internal or external input clocks
A programmable prescaler for internal or external clock inputs
Control and interrupt logic, for four maskable interrupts: underflow, overflow, timer compare, and period
interrupts
A selectable direction input pin (TDIRx) (to count up or down when directional up- / down-count mode is
selected)
The GP timers can be operated independently or synchronized with each other. The compare register
associated with each GP timer can be used for compare function and PWM-waveform generation. There are
three continuous modes of operations for each GP timer in up- or up / down-counting operations. Internal or
external input clocks with programmable prescaler are used for each GP timer. GP timers also provide the time
base for the other event-manager submodules: GP timer 1 for all the compares and PWM circuits, GP timer 2/1
for the capture units and the quadrature-pulse counting operations. Double-buffering of the period and compare
registers allows programmable change of the timer (PWM) period and the compare/PWM pulse width as
needed.
full-compare units
There are three full-compare units on each event manager. These compare units use GP timer1 as the time
base and generate six outputs for compare and PWM-waveform generation using programmable deadband
circuit. The state of each of the six outputs is configured independently. The compare registers of the compare
units are double-buffered, allowing programmable change of the compare/PWM pulse widths as needed.
programmable deadband generator
The deadband generator circuit includes three 8-bit counters and an 8-bit compare register. Desired deadband
values (from 0 to 16 µs) can be programmed into the compare register for the outputs of the three compare units.
The deadband generation can be enabled/disabled for each compare unit output individually. The
deadband-generator circuit produces two outputs (with or without deadband zone) for each compare unit output
signal. The output states of the deadband generator are configurable and changeable as needed by way of the
double-buffered ACTR register.
PWM waveform generation
Up to eight PWM waveforms (outputs) can be generated simultaneously by each event manager: three
independent pairs (six outputs) by the three full-compare units with programmable deadbands, and two
independent PWMs by the GP-timer compares.
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PWM characteristics
Characteristics of the PWMs are as follows:
D
D
D
D
D
D
D
D
D
16-bit registers
Programmable deadband for the PWM output pairs, from 0 to 12 µs
Minimum deadband width of 25 ns
Change of the PWM carrier frequency for PWM frequency wobbling as needed
Change of the PWM pulse widths within and after each PWM period as needed
External-maskable power and drive-protection interrupts
Pulse-pattern-generator circuit, for programmable generation of asymmetric, symmetric, and four-space
vector PWM waveforms
Minimized CPU overhead using auto-reload of the compare and period registers
The PWM pins are driven to a high-impedance state when the PDPINTx pin is driven low and after PDPINTx
signal qualification. The PDPINTx pin (after qualification) is reflected in bit 8 of the COMCONx register.
−
PDPINTA pin status is reflected in bit 8 of COMCONA register.
−
PDPINTB pin status is reflected in bit 8 of COMCONB register.
capture unit
The capture unit provides a logging function for different events or transitions. The values of the selected GP
timer counter is captured and stored in the two-level-deep FIFO stacks when selected transitions are detected
on capture input pins, CAPx (x = 1, 2, or 3 for EVA; and x = 4, 5, or 6 for EVB). The capture unit consists of three
capture circuits.
Capture units include the following features:
D
D
D
D
D
One 16-bit capture control register, CAPCONx (R/W)
One 16-bit capture FIFO status register, CAPFIFOx
Selection of GP timer 1/2 (for EVA) or 3/4 (for EVB) as the time base
Three 16-bit 2-level-deep FIFO stacks, one for each capture unit
Three capture input pins (CAP1/2/3 for EVA, CAP4/5/6 for EVB)—one input pin per capture unit. [All inputs
are synchronized with the device (CPU) clock. In order for a transition to be captured, the input must hold
at its current level to meet two rising edges of the device clock. The input pins CAP1/2 and CAP4/5 can also
be used as QEP inputs to the QEP circuit.]
D User-specified transition (rising edge, falling edge, or both edges) detection
D Three maskable interrupt flags, one for each capture unit
quadrature-encoder pulse (QEP) circuit
Two capture inputs (CAP1 and CAP2 for EVA; CAP4 and CAP5 for EVB) can be used to interface the on-chip
QEP circuit with a quadrature encoder pulse. Full synchronization of these inputs is performed on-chip.
Direction or leading-quadrature pulse sequence is detected, and GP timer 2/4 is incremented or decremented
by the rising and falling edges of the two input signals (four times the frequency of either input pulse).
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input qualifier circuitry
An input-qualifier circuitry qualifies the input signal to the CAP1−6, QEP1−4, XINT1/2, ADCSOC and
PDPINTA/B pins in the 240xA devices. (The I/O functions of these pins do not use the input-qualifier circuitry).
The state of the internal input signal will change only after the pin is high/low for 6(12) clock edges. This ensures
that a glitch smaller than 5(11) CLKOUT cycles wide will not change the internal pin input state. The user must
hold the pin high/low for 6(12) cycles to ensure the device will see the level change. Bit 6 of the SCSR2 register
controls whether 6 clock edges (bit 6 = 0) or 12 clock edges (bit 6 = 1) are used to block 5- or 11-cycle glitches.
On the LC2402A, input qualification is for the CAP1, CAP2, CAP3, PDPINTA, and XINT2/ADCSOC pins.
enhanced analog-to-digital converter (ADC) module
A simplified functional block diagram of the ADC module is shown in Figure 12. The ADC module consists of
a 10-bit ADC with a built-in sample-and-hold (S / H) circuit. Functions of the ADC module include:
D 10-bit ADC core with built-in S/H
D 16-channel, MUXed inputs
D Autosequencing capability provides up to 16 “autoconversions” in a single session. Each conversion can
be programmed to select any 1 of 16 input channels
D Sequencer can be operated as two independent 8-state sequencers or as one large 16-state sequencer
(i.e., two cascaded 8-state sequencers)
D Sixteen result registers (individually addressable) to store conversion values
−
The digital value of the input analog voltage is derived by:
when input ≤ VREFLO
Digital Value = 0
Digital Value + 1024
Input Analog Voltage * V REFLO
V REFHI * V REFLO
when input ≥ VREFHI
Digital Value = 1023
Note:
when VREFLO < input < VREFHI
All fractional values are truncated.
D Multiple triggers as sources for the start-of-conversion (SOC) sequence
−
S/W − software immediate start
−
EVA − Event manager A (multiple event sources within EVA)
−
EVB − Event manager B (multiple event sources within EVB)
−
Ext − External pin (ADCSOC)
D Flexible interrupt control allows interrupt request on every end-of-sequence (EOS) or every other EOS
D Sequencer can operate in “start/stop” mode, allowing multiple “time-sequenced triggers” to synchronize
conversions
D EVA and EVB triggers can operate independently in dual-sequencer mode
D Sample-and-hold (S/H) acquisition time window has separate prescale control
NOTE: The calibration and self-test features are not present in 240xA devices.
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enhanced analog-to-digital converter (ADC) module (continued)
The ADC module in the 240xA has been enhanced to provide flexible interface to event managers A and B. The
ADC interface is built around a fast, 10-bit ADC module with a total minimum conversion time of 375 ns
(S/H + conversion). The ADC module has 16 channels, configurable as two independent 8-channel modules
to service event managers A and B. The two independent 8-channel modules can be cascaded to form a
16-channel module. Although there are multiple input channels and two sequencers, there is only one converter
in the ADC module. Figure 12 shows the block diagram of the 240xA ADC module.
The two 8-channel modules have the capability to autosequence a series of conversions, each module has the
choice of selecting any one of the respective eight channels available through an analog MUX. In the cascaded
mode, the autosequencer functions as a single 16-channel sequencer. On each sequencer, once the
conversion is complete, the selected channel value is stored in its respective RESULT register. Autosequencing
allows the system to convert the same channel multiple times, allowing the user to perform oversampling
algorithms. This gives increased resolution over traditional single-sampled conversion results.
Result Registers
Analog MUX
Result Reg 0
ADCIN00
70A8h
Result Reg 1
10-Bit
ADC
Module
(375 ns MIN)
ADCIN07
ADCIN08
ADCIN15
Result Reg 7
70AFh
Result Reg 8
70B0h
Result Reg 15
70B7h
ADC Control Registers
S/W
EVA
SOC
Sequencer 1
Sequencer 2
SOC
ADCSOC
S/W
EVB
Figure 12. Block Diagram of the 240xA ADC Module
To obtain the specified accuracy of the ADC, proper board layout is very critical. To the best extent possible,
traces leading to the ADCINn pins should not run in close proximity to the digital signal paths. This is to minimize
switching noise on the digital lines from getting coupled to the ADC inputs. Furthermore, proper isolation
techniques must be used to isolate the ADC module power pins (such as VCCA, VREFHI, and VSSA) from the
digital supply.
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controller area network (CAN) module
The CAN module is a full-CAN controller designed as a 16-bit peripheral module and supports the following
features:
D CAN specification 2.0B (active)
−
−
Standard data and remote frames
Extended data and remote frames
D Six mailboxes for objects of 0- to 8-byte data length
−
−
D
D
D
D
D
D
Two receive mailboxes, two transmit mailboxes
Two configurable transmit/receive mailboxes
Local acceptance mask registers for mailboxes 0 and 1 and mailboxes 2 and 3
Configurable standard or extended message identifier
Programmable bit rate
Programmable interrupt scheme
Readable error counters
Self-test mode
−
In this mode, the CAN module operates in a loop-back fashion, receiving its own transmitted message.
The CAN module is a 16-bit peripheral. The accesses are split into the control/status-registers accesses and
the mailbox-RAM accesses.
CAN peripheral registers: The CPU can access the CAN peripheral registers only using 16-bit write accesses.
The CAN peripheral always presents full 16-bit data to the CPU bus during read cycles.
CAN controller architecture
Figure 13 shows the basic architecture of the CAN controller through this block diagram of the CAN Peripherals.
CAN Module
Transmit Buffer
Control/Status Registers
Interrupt Logic
CANTX
Control Bus
CAN
CAN
Core
CPU Interface/
Memory Management Unit
CPU
Transceiver
CANRX
R
R
T/R
T/R
T
T
Temporary Receive Buffer
mailbox 0
mailbox 1
mailbox 2
mailbox 3
mailbox 4
mailbox 5
RAM 48x16
Data
ID
Matchid
Control Logic
Acceptance Filter
Figure 13. CAN Module Block Diagram
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controller area network (CAN) module (continued)
The mailboxes are situated in one 48-word x 16-bit RAM. It can be written to or read by the CPU or the CAN.
The CAN write or read access, as well as the CPU read access, needs one clock cycle. The CPU write access
needs two clock cycles. In these two clock cycles, the CAN performs a read-modify-write cycle and, therefore,
inserts one wait state for the CPU.
Address bit 0 of the address bus used when accessing the RAM decides if the lower (0) or the higher (1)
16-bit word of the 32-bit word is taken. The RAM location is determined by the upper bits 5 to 1 of the address
bus.
Table 8. 3.3-V CAN Transceivers for the TMS320Lx240xA DSPs
PART NUMBER
LOW-POWER MODE
INTEGRATED
SLOPE CONTROL
Vref PIN
SN65HVD230
370 µA standby mode
Yes
Yes
SN65HVD231
40 nA sleep mode
Yes
Yes
SN65HVD232
No standby or sleep mode
No
No
TA
MARKED AS†
VP230
−40°C
−40
C to 85
85°C
C
VP231
VP232
† This is the nomenclature printed on the device, since the footprint is too small to accommodate the entire part number.
CAN interrupt logic
There are two interrupt requests from the CAN module to the peripheral interrupt expansion (PIE) controller:
the mailbox interrupt and the error interrupt. Both interrupts can assert either a high-priority request or a
low-priority request to the CPU. Since CAN mailboxes can generate multiple interrupts, the software should
read the CAN_IFR register for every interrupt and prioritize the interrupt service, or else, these multiple
interrupts will not be recognized by the CPU and PIE hardware logic. Each interrupt routine should service all
the interrupt bits that are set and clear them after service.
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serial communications interface (SCI) module
The 240xA devices include a serial communications interface (SCI) module. The SCI module supports digital
communications between the CPU and other asynchronous peripherals that use the standard
non-return-to-zero (NRZ) format. The SCI receiver and transmitter are double-buffered, and each has its own
separate enable and interrupt bits. Both can be operated independently or simultaneously in the full-duplex
mode. To ensure data integrity, the SCI checks received data for break detection, parity, overrun, and framing
errors. The bit rate is programmable to over 65 000 different speeds through a 16-bit baud-select register.
Features of the SCI module include:
D Two external pins:
−
−
SCITXD: SCI transmit-output pin
SCIRXD: SCI receive-input pin
NOTE: Both pins can be used as GPIO if not used for SCI.
D Baud rate programmable to 64K different rates
−
Up to 2500 Kbps at 40-MHz CPUCLK
D Data-word format
−
−
−
−
D
D
D
D
D
One start bit
Data-word length programmable from one to eight bits
Optional even/odd/no parity bit
One or two stop bits
Four error-detection flags: parity, overrun, framing, and break detection
Two wake-up multiprocessor modes: idle-line and address bit
Half- or full-duplex operation
Double-buffered receive and transmit functions
Transmitter and receiver operations can be accomplished through interrupt-driven or polled algorithms with
status flags.
−
Transmitter: TXRDY flag (transmitter-buffer register is ready to receive another character) and
TX EMPTY flag (transmitter-shift register is empty)
−
Receiver: RXRDY flag (receiver-buffer register is ready to receive another character), BRKDT flag
(break condition occurred), and RX ERROR flag (monitoring four interrupt conditions)
D Separate enable bits for transmitter and receiver interrupts (except BRKDT)
D NRZ (non-return-to-zero) format
D Ten SCI module control registers located in the control register frame beginning at address 7050h
NOTE: All registers in this module are 8-bit registers that are connected to the 16-bit peripheral bus. When a register is accessed, the
register data is in the lower byte (7 −0), and the upper byte (15 −8) is read as zeros. Writing to the upper byte has no effect.
Figure 14 shows the SCI module block diagram.
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serial communications interface (SCI) module (continued)
TXWAKE
Frame Format and Mode
SCICTL1.3
SCITXBUF.7−0
Transmitter-Data
Buffer Register
Parity
Even/Odd Enable
SCICCR.6 SCICCR.5
SCI TX Interrupt
TXRDY
TX INT ENA
SCICTL2.7
TX EMPTY
8
TXINT
SCICTL2.0
External
Connections
SCICTL2.6
WUT
TXENA
TXSHF
Register
SCITXD
SCITXD
SCICTL1.1
SCIHBAUD. 15 −8
SCI Priority Level
1
Level 5 Int.
0
Level 1 Int.
SCI TX
Priority
Baud Rate
MSbyte
Register
Internal
Clock
SCILBAUD. 7 −0
SCIPRI.6
Baud Rate
LSbyte
Register
Level 5 Int.
1
0
Level 1 Int.
SCI RX
Priority
SCIPRI.5
RXENA
RX ERR INT ENA
SCICTL1.6
RX Error
SCIRXST.7
SCIRXST.4 −2
RX Error
FE OE PE
SCIRXD
SCICTL1.0
8
Receiver-Data
Buffer
Register
SCIRXBUF.7−0
SCI RX Interrupt
RXRDY
SCIRXST.6
BRKDT
SCIRXST.5
RX/BK INT ENA
SCICTL2.1
RXINT
RXWAKE
SCIRXST.1
SCIRXD
RXSHF
Register
Figure 14. Serial Communications Interface (SCI) Module Block Diagram
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serial peripheral interface (SPI) module
Some 240xA devices include the four-pin serial peripheral interface (SPI) module. The SPI is a high-speed,
synchronous serial I/O port that allows a serial bit stream of programmed length (one to sixteen bits) to be shifted
into and out of the device at a programmable bit-transfer rate. Normally, the SPI is used for communications
between the DSP controller and external peripherals or another processor. Typical applications include external
I/O or peripheral expansion through devices such as shift registers, display drivers, and ADCs. Multidevice
communications are supported by the master/slave operation of the SPI.
The SPI module features include:
D Four external pins:
−
SPISOMI: SPI slave-output/master-input pin
−
SPISIMO: SPI slave-input/master-output pin
−
SPISTE: SPI slave transmit-enable pin
−
SPICLK: SPI serial-clock pin
NOTE: All four pins can be used as GPIO, if the SPI module is not used.
D
D
D
D
Two operational modes: master and slave
Baud rate: 125 different programmable rates / 10 Mbps at 40-MHz CPUCLK
Data word length: one to sixteen data bits
Four clocking schemes (controlled by clock polarity and clock phase bits) include:
−
Falling edge without phase delay: SPICLK active high. SPI transmits data on the falling edge of the
SPICLK signal and receives data on the rising edge of the SPICLK signal.
−
Falling edge with phase delay: SPICLK active high. SPI transmits data one half-cycle ahead of the
falling edge of the SPICLK signal and receives data on the falling edge of the SPICLK signal.
−
Rising edge without phase delay: SPICLK inactive low. SPI transmits data on the rising edge of the
SPICLK signal and receives data on the falling edge of the SPICLK signal.
−
Rising edge with phase delay: SPICLK inactive low. SPI transmits data one half-cycle ahead of the
falling edge of the SPICLK signal and receives data on the rising edge of the SPICLK signal.
D Simultaneous receive and transmit operation (transmit function can be disabled in software)
D Transmitter and receiver operations are accomplished through either interrupt-driven or polled algorithms.
D Nine SPI module control registers: Located in control register frame beginning at address 7040h.
NOTE: All registers in this module are 16-bit registers that are connected to the 16-bit peripheral bus. When a register is accessed, the
register data is in the lower byte (7 −0), and the upper byte (15 −8) is read as zeros. Writing to the upper byte has no effect.
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serial peripheral interface (SPI) module (continued)
Figure 15 is a block diagram of the SPI in slave mode.
SPIRXBUF.15 −0
Receiver
Overrun Flag
SPIRXBUF
Buffer Register
Overrun
INT ENA
SPI Priority
SPISTS.7
0 Level 1
INT
1 Level 5
INT
SPIPRI.6
To CPU
SPICTL.4
SPITXBUF.15 −0
16
SPITXBUF
Buffer Register
SPI INT FLAG
SPI INT
ENA
External
Connections
SPISTS.6
16
SPICTL.0
M
M
SPIDAT
Data Register
S
SW1
S
SPISIMO
M
M
SPIDAT.15 −0
S
SW2
S
SPISOMI
Talk
SPICTL.1
SPISTE†
State Control
Master/Slave
SPICCR.3 −0
SPI Char
3
2
1
SW3
M
SPI Bit Rate
Internal
Clock
SPIBRR.6 −0
6
5
4
3
SPICTL.2
S
0
2
S
Clock
Polarity
Clock
Phase
SPICCR.6
SPICTL.3
SPICLK
M
1
0
NOTE A: The diagram is shown in the slave mode.
† The SPISTE pin is driven low externally. Note that SW1, SW2, and SW3 are closed in this configuration. See the following errata for restrictions
on using the SPISTE pin:
TMS320LF2407A, TMS320LF2406A, TMS320LF2403A, TMS320LF2402A DSP Controllers Silicon Errata
(literature number SPRZ002)
TMS320LC2406A, TMS320LC2404A, TMS320LC2402A DSP Controllers Silicon Errata (literature number SPRZ185)
Figure 15. Four-Pin Serial Peripheral Interface Module Block Diagram
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SPI slave mode operation in LF2403A
The LF2403A device does not have the SPISTE/IOPC5 pin. (This function is available as an internal signal only.)
The following must be done to put the LF2403A SPI in slave mode:
1. Configure SPISTE/IOPC5 signal for GPIO mode by clearing the MCRB.5 bit.
2. Configure SPISTE/IOPC5 signal as an output (by writing a 1 to bit 13 of PCDATDIR) and drive it low (by
writing a 0 to bit 5 of PCDATDIR). Note that SPISTE/IOPC5 should not be driven low until after the SPI is
configured and taken out of reset.
NOTE: The slave SPISTE/IOPC5 signal must not be driven low until after the master and slave SPI modules
are configured and taken out of reset. The initialization sequence is as follows:
a. The master SPI is configured first and taken out of reset. This ensures that the master SPICLK is
initialized to its appropriate level (high or low, depending on the polarity bit) first, before the slave SPI
starts accepting clock pulses.
b. The slave SPI is configured and taken out of reset.
c.
The GPIO/SPI pins of the slave is then configured for SPI operation and the SPISTE/IOPC5 signal is
driven low. This is done after ensuring the correct level of the master SPICLK signal. One method of
doing this would be to read the level of the SPICLK pin through the PCDATDIR register and then
deciding on the appropriate course of action.
d. SPI transmission may commence now. Transmission of data should not be attempted until both master
and slave are configured and the slave SPISTE/IOPC5 signal is driven low.
PLL-based clock module
The 240xA has an on-chip, PLL-based clock module. This module provides all the necessary clocking signals
for the device, as well as control for low-power mode entry. The PLL has a 3-bit ratio control to select different
CPU clock rates. See Figure 16 for the PLL Clock Module Block Diagram, Table 9 for clock rates, and Table 10
for the loop filter component values.
The PLL-based clock module provides two modes of operation:
D Crystal-operation
This mode allows the use of an external crystal/resonator to provide the time base to the device.
D External clock source operation
This mode allows the internal oscillator to be bypassed. The device clocks are generated from an external
clock source input on the XTAL1/CLKIN pin. In this case, an external oscillator clock is connected to the
XTAL1/CLKIN pin.
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PLL-based clock module (continued)
XTAL1/CLKIN
Cb1
RESONATOR/
CRYSTAL
XTAL2
Fin
Cb2
PLL
CLKOUT
PLLF
R1
C2
XTAL
OSC
3-bit
PLL Select
(SCSR1.[11:9])
C1
PLLF2
Figure 16. PLL Clock Module Block Diagram
Table 9. PLL Clock Selection Through Bits (11−9) in SCSR1 Register
CLK PS2
CLK PS1
CLK PS0
CLKOUT
0
0
0
4 × Fin
0
0
1
2 × Fin
0
1
0
1.33 × Fin
0
1
1
1
0
0
1 × Fin
0.8 × Fin
1
0
1
0.66 × Fin
1
1
0
0.57 × Fin
1
1
1
0.5 × Fin
Default multiplication factor after reset is (1,1,1), i.e., 0.5 × Fin.
NOTE:
The bootloader sets the PLL to x2 or x4 option. If the bootloader is used, the value of CLKIN used
should not force CLKOUT to exceed the maximum rated device speed. See the “Boot ROM” section
for more details.
external reference crystal clock option
The internal oscillator is enabled by connecting a crystal across the XTAL1/CLKIN and XTAL2 pins as shown
in Figure 17a. The crystal should be in fundamental operation and parallel resonant, with an effective series
resistance of 30 Ω−150 Ω and can dissipate at least 1 mW; it should be specified at a load capacitance of 20 pF.
NOTE: Lx240xA crystal biasing needs an external 1-M-Ω resistor across X1 and X2 pins for reliable operation. See the TMS320LF2407A,
LF2406A, LF2403A, LF2402A DSP Controllers Silicon Errata (literature number SPRZ002) or the TMS320LC2406A, TMS320LC2404A,
TMS320LC2402A DSP Controllers Silicon Errata (literature number SPRZ185) for details on this requirement.
external reference oscillator clock option
The internal oscillator is disabled by connecting a clock signal to XTAL1/CLKIN and leaving the XTAL2 input
pin unconnected as shown in part b of Figure 17.
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external reference oscillator clock option (continued)
XTAL1/CLKIN
XTAL2
Crystal
XTAL1/CLKIN
XTAL2
External Clock Signal
(Toggling 0 −3.3 V)
NC
Cb2
(see Note A)
Cb1
(see Note A)
(a)
(b)
NOTE A: TI recommends that customers have the resonator/crystal vendor characterize the operation of their device with the DSP chip. The
resonator/crystal vendor has the equipment and expertise to tune the tank circuit. The vendor can also advise the customer regarding
the proper tank component values that will ensure start-up and stability over the entire operating range.
Figure 17. Recommended Crystal / Clock Connection
loop filter
The PLL module uses an external loop filter circuit for jitter minimization. The components for the loop filter
circuit are R1, C1, and C2. The capacitors (C1 and C2) must be non-polarized. This loop filter circuit is connected
between the PLLF and PLLF2 pins (see Figure 16). For examples of component values of R1, C1, and C2 at
a specified oscillator frequency (XTAL1), see Table 10.
Table 10. Loop Filter Component Values With Damping Factor = 2.0
XTAL1/CLKIN FREQUENCY
(MHz)
R1 (Ω) (± 5% TOLERANCE)
C1 (µF) (± 20% TOLERANCE)
C2 (µF) (± 20% TOLERANCE)
4
4.7
3.9
0.082
5
5.6
2.7
0.056
6
6.8
1.8
0.039
7
8.2
1.5
0.033
8
9.1
1
0.022
9
10
0.82
0.015
10
11
0.68
0.015
11
12
0.56
0.012
12
13
0.47
0.01
13
15
0.39
0.0082
14
15
0.33
0.0068
15
16
0.33
0.0068
16
18
0.27
0.0056
17
18
0.22
0.0047
18
20
0.22
0.0047
19
22
0.18
0.0039
20
24
0.15
0.0033
low-power modes
The 240xA has an IDLE instruction. When executed, the IDLE instruction stops the clocks to all circuits in the
CPU, but the clock output from the CPU continues to run. With this instruction, the CPU clocks can be shut down
to save power while the peripherals (clocked with CLKOUT) continue to run. The CPU exits the IDLE state if
it is reset, or, if it receives an interrupt request.
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clock domains
All 240xA-based devices have two clock domains:
1. CPU clock domain − consists of the clock for most of the CPU logic
2. System clock domain − consists of the peripheral clock (which is derived from CLKOUT of the CPU) and
the clock for the interrupt logic in the CPU.
When the CPU goes into IDLE mode, the CPU clock domain is stopped while the system clock domain continues
to run. This mode is also known as IDLE1 mode. The 240xA CPU also contains support for a second IDLE mode,
IDLE2. By asserting IDLE2 to the 240xA CPU, both the CPU clock domain and the system clock domain are
stopped, allowing further power savings. A third low-power mode, HALT mode, the deepest, is possible if the
oscillator and WDCLK are also shut down when in IDLE2 mode.
Two control bits, LPM1 and LPM0, specify which of the three possible low-power modes is entered when the
IDLE instruction is executed (see Table 11). These bits are located in the System Control and Status
Register 1 (SCSR1), and they are described in the TMS320LF/LC240xA DSP Controllers Reference Guide:
System and Peripherals (literature number SPRU357).
Table 11. Low-Power Modes Summary
LOW-POWER MODE
LPMx BITS
SCSR1
[13:12]
CPU
CLOCK
DOMAIN
SYSTEM
CLOCK
DOMAIN
WDCLK
STATUS
PLL
STATUS
OSC
STATUS
FLASH
POWER
EXIT
CONDITION
CPU running normally
XX
On
On
On
On
On
On
—
On
Peripheral
Interrupt,
External Interrupt,
Reset,
PDPINTA/B
IDLE1 − (LPM0)
00
Off
On
On
On
On
IDLE2 − (LPM1)
01
Off
Off
On
On
On
On
Wakeup
Interrupts,
External Interrupt,
Reset,
PDPINTA/B
HALT − (LPM2)
[PLL/OSC power down]
1X
Off
Off
Off
Off
Off
Off†
Reset,
PDPINTA/B
† The Flash must be powered down by the user code prior to entering LPM2. For more details, see the TMS320LF/LC240xA DSP Controllers
Reference Guide: System and Peripherals (literature number SPRU357).
other power-down options
240xA devices have clock-enable bits to the following on-chip peripherals: ADC, SCI, SPI, CAN, EVB, and EVA.
Clock to these peripherals are disabled after reset; thus, start-up power can be low for the device.
Depending on the application, these peripherals can be turned on/off to achieve low power.
See the SCSR1 register for details on the peripheral clock enable bits.
digital I/O and shared pin functions
The 240xA has up to 41 general-purpose, bidirectional, digital I/O (GPIO) pins—most of which are shared
between primary functions and I/O. Most I/O pins of the 240xA are shared with other functions. The digital I/O
ports module provides a flexible method for controlling both dedicated I/O and shared pin functions. All I/O and
shared pin functions are controlled using eight 16-bit registers. These registers are divided into two types:
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digital I/O and shared pin functions (continued)
D Output Control Registers — used to control the multiplexer selection that chooses between the primary
function of a pin or the general-purpose I/O function.
D Data and Control Registers — used to control the data and data direction of bidirectional I/O pins.
description of shared I/O pins
The control structure for shared I/O pins is shown in Figure 18, where each pin has three bits that define its
operation:
D MUX control bit — this bit selects between the primary function (1) and I/O function (0) of the pin.
D I/O direction bit — if the I/O function is selected for the pin (MUX control bit is set to 0), this bit determines
whether the pin is an input (0) or an output (1).
D I/O data bit — if the I/O function is selected for the pin (MUX control bit is set to 0) and the direction selected
is an input, data is read from this bit; if the direction selected is an output, data is written to this bit.
The MUX control bit, I/O direction bit, and I/O data bit are in the I/O control registers.
IOP Data Bit
(Read/Write)
In
Primary
Function
(Output Section)
Primary
Function
(Input Section)
Out
IOP DIR Bit
0 = Input
1 = Output
0
1
MUX Control Bit
0 = I/O Function
1 = Primary Function
Pullup
or
Pulldown
(Internal)
Primary
Function
or I/O Pin
Pin
Figure 18. Shared Pin Configuration
A summary of shared pin configurations and associated bits is shown in Table 12.
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description of shared I/O pins (continued)
Table 12. Shared Pin Configurations†
PIN FUNCTION SELECTED
(MCRx.n = 1)
Primary Function
(MCRX.N = 0)
I/O
MUX
CONTROL
REGISTER
(name.bit #)
MUX CONTROL
VALUE AT RESET
(MCRx.n)
I/O PORT DATA AND DIRECTION‡
REGISTER
DATA BIT NO.§
DIR BIT NO.¶
8
PORT A
SCITXD
IOPA0
MCRA.0
0
PADATDIR
0
SCIRXD
IOPA1
MCRA.1
0
PADATDIR
1
9
XINT1
IOPA2
MCRA.2
0
PADATDIR
2
10
CAP1/QEP1
IOPA3
MCRA.3
0
PADATDIR
3
11
CAP2/QEP2
IOPA4
MCRA.4
0
PADATDIR
4
12
CAP3
IOPA5
MCRA.5
0
PADATDIR
5
13
PWM1
IOPA6
MCRA.6
0
PADATDIR
6
14
PWM2
IOPA7
MCRA.7
0
PADATDIR
7
15
8
PORT B
PWM3
IOPB0
MCRA.8
0
PBDATDIR
0
PWM4
IOPB1
MCRA.9
0
PBDATDIR
1
9
PWM5
IOPB2
MCRA.10
0
PBDATDIR
2
10
PWM6
IOPB3
MCRA.11
0
PBDATDIR
3
11
T1PWM/T1CMP
IOPB4
MCRA.12
0
PBDATDIR
4
12
T2PWM/T2CMP
IOPB5
MCRA.13
0
PBDATDIR
5
13
TDIRA
IOPB6
MCRA.14
0
PBDATDIR
6
14
TCLKINA
IOPB7
MCRA.15
0
PBDATDIR
7
15
8
PORT C
W/R #
IOPC0
MCRB.0
1
PCDATDIR
0
BIO
IOPC1
MCRB.1
1
PCDATDIR
1
9
SPISIMO
IOPC2
MCRB.2
0
PCDATDIR
2
10
SPISOMI
IOPC3
MCRB.3
0
PCDATDIR
3
11
SPICLK
IOPC4
MCRB.4
0
PCDATDIR
4
12
SPISTE
IOPC5
MCRB.5
0
PCDATDIR
5
13
CANTX
IOPC6
MCRB.6
0
PCDATDIR
6
14
CANRX
IOPC7
MCRB.7
0
PCDATDIR
7
15
8
PORT D
XINT2/ADCSOC
IOPD0
EMU0
Reserved
EMU1
Reserved
TCK
Reserved
TDI
Reserved
TDO
Reserved
TMS
Reserved
TMS2
Reserved
MCRB.8
MCRB.9||
0
PDDATDIR
0
1
PDDATDIR
1
9
MCRB.10||
MCRB.11||
1
PDDATDIR
2
10
1
PDDATDIR
3
11
MCRB.12||
MCRB.13||
1
PDDATDIR
4
12
1
PDDATDIR
5
13
MCRB.14||
MCRB.15||
1
PDDATDIR
6
14
1
PDDATDIR
7
15
† Bold, italicized pin names indicate pin functions at reset.
‡ Valid only if the I/O function is selected on the pin
§ If the GPIO pin is configured as an output, these bits can be written to. If the pin is configured as an input, these bits are read from.
¶ If the DIR bit is 0, the GPIO pin functions as an input. For a value of 1, the pin is configured as an output.
# At reset, all LF240xA devices come up with the W/R/IOPC0 pin in W/R mode. On devices that lack an external memory interface (e.g., LF2406A),
W/R mode is not functional and MCRB.0 must be set to a 0 if the IOPC0 pin is to be used. The XMIF Hi-Z control bit (bit 4 of the SCSR2 register)
is reserved in these devices and must be written with a zero.
|| Bits 15 through 9 of the MCRB register must be written as 1 only. Writing a 0 to any of these bits will cause unpredictable operation of the device.
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description of shared I/O pins (continued)
Table 12. Shared Pin Configurations† (Continued)
PIN FUNCTION SELECTED
(MCRx.n = 1)
Primary Function
(MCRX.N = 0)
I/O
MUX
CONTROL
REGISTER
(name.bit #)
MUX CONTROL
VALUE AT RESET
(MCRx.n)
I/O PORT DATA AND DIRECTION‡
REGISTER
DATA BIT NO.§
DIR BIT NO.¶
8
PORT E
CLKOUT
IOPE0
MCRC.0
1
PEDATDIR
0
PWM7
IOPE1
MCRC.1
0
PEDATDIR
1
9
PWM8
IOPE2
MCRC.2
0
PEDATDIR
2
10
PWM9
IOPE3
MCRC.3
0
PEDATDIR
3
11
PWM10
IOPE4
MCRC.4
0
PEDATDIR
4
12
PWM11
IOPE5
MCRC.5
0
PEDATDIR
5
13
PWM12
IOPE6
MCRC.6
0
PEDATDIR
6
14
CAP4/QEP3
IOPE7
MCRC.7
0
PEDATDIR
7
15
CAP5/QEP4
IOPF0
MCRC.8
0
PFDATDIR
0
8
PORT F
CAP6
IOPF1
MCRC.9
0
PFDATDIR
1
9
T3PWM/T3CMP
IOPF2
MCRC.10
0
PFDATDIR
2
10
T4PWM/T4CMP
IOPF3
MCRC.11
0
PFDATDIR
3
11
TDIRB
IOPF4
MCRC.12
0
PFDATDIR
4
12
TCLKINB
IOPF5
MCRC.13
0
PFDATDIR
5
13
† Bold, italicized pin names indicate pin functions at reset.
‡ Valid only if the I/O function is selected on the pin
§ If the GPIO pin is configured as an output, these bits can be written to. If the pin is configured as an input, these bits are read from.
¶ If the DIR bit is 0, the GPIO pin functions as an input. For a value of 1, the pin is configured as an output.
# At reset, all LF240xA devices come up with the W/R/IOPC0 pin in W/R mode. On devices that lack an external memory interface (e.g., LF2406A),
W/R mode is not functional and MCRB.0 must be set to a 0 if the IOPC0 pin is to be used. The XMIF Hi-Z control bit (bit 4 of the SCSR2 register)
is reserved in these devices and must be written with a zero.
|| Bits 15 through 9 of the MCRB register must be written as 1 only. Writing a 0 to any of these bits will cause unpredictable operation of the device.
digital I/O control registers
Table 13 lists the registers available in the digital I/O module. As with other 240xA peripherals, these registers
are memory-mapped to the data space.
Table 13. Addresses of Digital I/O Control Registers
ADDRESS
REGISTER
NAME
7090h
MCRA
I/O MUX control register A
7092h
MCRB
I/O mux control register B
7094h
MCRC
I/O mux control register C
7095h
PEDATDIR
I/O port E data and direction register
7096h
PFDATDIR
I/O port F data and direction register
7098h
PADATDIR
I/O port A data and direction register
709Ah
PBDATDIR
I/O port B data and direction register
709Ch
PCDATDIR
I/O port C data and direction register
709Eh
PDDATDIR
I/O port D data and direction register
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external memory interface (LF2407A)
The TMS320LF2407A can address up to 64K × 16 words of memory (or registers) in each of the program, data,
and I / O spaces. On-chip memory, when enabled, occupies some of this off-chip range.
The CPU of the TMS320LF2407A schedules a program fetch, data read, and data write on the same machine
cycle. This is because from on-chip memory, the CPU can execute all three of these operations in the same
cycle. However, the external interface multiplexes the internal buses to one address bus and one data bus. The
external interface sequences these operations to complete first the data write, then the data read, and finally
the program read.
The LF2407A supports a wide range of system interfacing requirements. Program, data, and I/O address
spaces provide interface to memory and I/O, thereby maximizing system throughput. The full 16-bit address
and data buses, along with the PS, DS, and IS space-select signals, allow addressing of 64K 16-bit words in
program, data, and I/O space. Since on-chip peripheral registers occupy positions of data-memory space
(7000−7FFF), the externally addressable data-memory space is 32K 16-bit words (8000−FFFF). Note that the
global memory space of the C2xx core is not used for 240xA DSP devices. Therefore, the global memory
allocation register (GREG) is reserved for all these devices.
Input/output (I/O) design is simplified by having I/O space treated the same way as memory. I/O devices are
accessed in the I/O address space using the processor’s external address and data buses in the same manner
as memory-mapped devices.
The LF2407A external parallel interface provides various control signals to facilitate interfacing to the device.
The R/ W output signal is provided to indicate whether the current cycle is a read or a write. The STRB output
signal provides a timing reference for all external cycles. For convenience, the device also provides the RD and
the WE output signals, which indicate a read cycle and a write cycle, respectively, along with timing information
for those cycles. The availability of these signals minimizes external gating necessary for interfacing external
devices to the LF2407A.
The 2407A provides RD and W/R signals to help the zero-wait-state external memory interface. At higher
CLKOUT speeds, RD may not meet the slow memory device’s timing. In such instances, the W/R signal could
be used as an alternative signal with some tradeoffs. See the timing parameters for details.
The TMS320LF2407A supports zero-wait-state reads on the external interface. However, to avoid bus conflicts,
writes take two cycles. This allows the TMS320LF2407A to buffer the transition of the data bus from input to
output (or from output to input) by a half cycle. In most systems, the TMS320LF2407A ratio of reads to writes
is significantly large to minimize the overhead of the extra cycle on writes.
wait-state generation (LF2407A only)
Wait-state generation is incorporated in the LF2407A without any external hardware for interfacing the LF2407A
with slower off-chip memory and I/O devices. Adding wait states lengthens the time the CPU waits for external
memory or an external I/O port to respond when the CPU reads from or writes to that external memory or I/O
port. Specifically, the CPU waits one extra cycle (one CLKOUT cycle) for every wait state. The wait states
operate on CLKOUT cycle boundaries.
To avoid bus conflicts, writes from the LF2407A always take at least two CLKOUT cycles. The LF2407A offers
two options for generating wait states:
D READY Signal. With the READY signal, you can externally generate any number of wait states. The READY
pin has no effect on accesses to internal memory.
D On-Chip Wait-State Generator. With this generator, you can generate zero to seven wait states.
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generating wait states with the READY signal
When the READY signal is low, the LF2407A waits one CLKOUT cycle and then checks READY again. The
LF2407A does not continue executing until the READY signal is driven high; therefore, if the READY signal is
not used, it should be pulled high.
The READY pin can be used to generate any number of wait states. However, when the LF2407A operates at
full speed, it may not respond fast enough to provide a READY-based wait state for the first cycle. For extended
wait states using external READY logic, the on-chip wait-state generator should be programmed to generate
at least one wait state.
generating wait states with the LF2407A on-chip software wait-state generator
The software wait-state generator can be programmed to generate zero to seven wait states for a given off-chip
memory space (program, data, or I/O), regardless of the state of the READY signal. These zero to seven wait
states are controlled by the wait-state generator register (WSGR) (I/O FFFFh). For more detailed information
on the WSGR and associated bit functions, see the TMS320LF/LC240xA DSP Controllers Reference Guide:
System and Peripherals (literature number SPRU357).
watchdog (WD) timer module
The x240xA devices include a watchdog (WD) timer module. The WD function of this module monitors software
and hardware operation by generating a system reset if it is not periodically serviced by software by having the
correct key written. The WD timer operates independently of the CPU. It does not need any CPU initialization
to function. When a system reset occurs, the WD timer defaults to the fastest WD timer rate available (WDCLK
signal = CLKOUT/512). As soon as reset is released internally, the CPU starts executing code, and the WD timer
begins incrementing. This means that, to avoid a premature reset, WD setup should occur early in the power-up
sequence. See Figure 19 for a block diagram of the WD module. The WD module features include the following:
D WD Timer
− Seven different WD overflow rates
− A WD-reset key (WDKEY) register that clears the WD counter when a correct value is written, and
generates a system reset if an incorrect value is written to the register
− WD check bits that initiate a system reset if an incorrect value is written to the WD control register
(WDCR)
D Automatic activation of the WD timer, once system reset is released
− Three WD control registers located in control register frame beginning at address 7020h.
NOTE: All registers in this module are 8-bit registers. When a register is accessed, the register data is in the lower byte, the upper byte
is read as zeros. Writing to the upper byte has no effect.
Figure 19 shows the WD block diagram. Table 14 shows the different WD overflow (time-out) selections.
The watchdog can be disabled in software by writing ‘1’ to bit 6 of the WDCR register (WDCR.6) while bit 5 of
the SCSR2 register (SCSR2.5) is 1. If SCSR2.5 is 0, the watchdog will not be disabled. SCSR2.5 is equivalent
to the WDDIS pin of the TMS320F243/241 devices.
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watchdog (WD) timer module (continued)
CLKOUT
÷ 512
WDCLK
System
Reset
6-Bit
FreeRunning
Counter
3-bit
Prescaler
PLL
CLKIN
/64
/32
On-Chip
Oscillator or
External
Clock
/16
/8
/4
/2
CLR
000
001
010
011
WDPS
WDCR.2 −0
2 1 0
100
101
110
WDCR.6
111
WDDIS
WDFLAG
WDCR.7
WDCNTR.7 −0
8-Bit Watchdog
Counter
One-Cycle
Delay
CLR
Reset Flag
Internal
Pullup
PS/257
RS Pin
System
Reset
Request
WDKEY.7 −0
Bad Key
Watchdog
Reset Key
Register
55 + AA
Detector
Good Key
WDCHK2−0
WDCR.5 −3†
Bad WDCR Key
3
3
System Reset
1 0 1
(Constant
Value)
† Writing to bits WDCR.5 −3 with anything but the correct pattern (101) generates a system reset.
Figure 19. Block Diagram of the WD Module
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watchdog (WD) timer module (continued)
Table 14. WD Overflow (Time-out) Selections
WD PRESCALE SELECT BITS
WDPS2
WDPS1
0
0
WDCLK DIVIDER
WATCHDOG
CLOCK RATE†
0
WDPS0
X‡
FREQUENCY (Hz)
1
WDCLK/1
1
0
2
WDCLK/2
0
1
1
4
WDCLK/4
1
0
0
8
WDCLK/8
1
0
1
16
WDCLK/16
1
1
0
32
WDCLK/32
1
1
1
64
WDCLK/64
† WDCLK = CLKOUT/512
‡ X = Don’t care
development support
Texas Instruments (TI) offers an extensive line of development tools for the x240xA generation of DSPs,
including tools to evaluate the performance of the processors, generate code, develop algorithm
implementations, and fully integrate and debug software and hardware modules.
The following products support development of x240xA-based applications:
Software Development Tools:
Assembler/linker
Simulator
Optimizing ANSI C compiler
Application algorithms
C/Assembly debugger and code profiler
Hardware Development Tools:
Emulator XDS510 (supports x24x multiprocessor system debug)
TMS320LF2407 EVM (Evaluation module for 2407 DSP)
See Table 15 and Table 16 for complete listings of development support tools for the x240xA. For information
on pricing and availability, contact the nearest TI field sales office or authorized distributor.
Table 15. Development Support Tools
DEVELOPMENT TOOL
PLATFORM
PART NUMBER
Software
Code Composer Studio v.2.2
PC
TMDSCCS2000-1
Hardware − Emulation Debug Tools
XDS510PP Pod (Parallel Port) with JTAG cable
PC
TMDS3P701014
PC is a trademark of International Business Machines Corp..
Code Composer Studio, XDS510, and XDS510PP are trademarks of Texas Instruments.
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development support (continued)
Table 16. TMS320x24x-Specific Development Tools
DEVELOPMENT TOOL
PLATFORM
PART NUMBER
Hardware − Evaluation/Starter Kits
2401A eZdsp
PC
TMDSeZD2401
F2407A EVM
PC
TMDS3P701016A
LF2407A eZdsp
PC
TMDSEZD2407
The LF2407 Evaluation Module (EVM) provide designers of motor and motion control applications with a
complete and cost-effective way to take their designs from concept to production. These tools offer both a
hardware and software development environment and include:
D
D
D
D
D
D
D
D
D
D
D
Flash-based LF240xA evaluation board
Code Generation Tools
Assembler/Linker
C Compiler
Source code debugger
C24x Debugger
Code Composer IDE
XDS510PP JTAG-based emulator
Sample applications code
Universal 5-V DC power supply
Documentation and cables
device and development support tool nomenclature
To designate the stages in the product development cycle, TI assigns prefixes to the part numbers of all
TMS320 DSP devices and support tools. Each TMS320 DSP commercial family member has one of three
prefixes: TMX, TMP, or TMS. Texas Instruments recommends two of three possible prefix designators for its
support tools: TMDX and TMDS. These prefixes represent evolutionary stages of product development from
engineering prototypes (TMX / TMDX) through fully qualified production devices/tools (TMS / TMDS).
Device development evolutionary flow:
TMX
Experimental device that is not necessarily representative of the final device’s electrical specifications
TMP
Final silicon die that conforms to the device’s electrical specifications but has not completed quality
and reliability verification
TMS
Fully qualified production device
Support tool development evolutionary flow:
TMDX Development-support product that has not yet completed Texas Instruments internal qualification
testing.
TMDS Fully qualified development-support product
TMX and TMP devices and TMDX development-support tools are shipped against the following disclaimer:
“Developmental product is intended for internal evaluation purposes.”
TMS devices and TMDS development-support tools have been characterized fully, and the quality and reliability
of the device have been demonstrated fully. TI’s standard warranty applies.
TMS320 is a trademark of Texas Instruments.
eZdsp is a trademark of Spectrum Digital, Inc.
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device and development support tool nomenclature (continued)
Predictions show that prototype devices (TMX or TMP) have a greater failure rate than the standard production
devices. Texas Instruments recommends that these devices not be used in any production system because their
expected end-use failure rate still is undefined. Only qualified production devices are to be used.
TI device nomenclature also includes a suffix with the device family name. This suffix indicates the package type
(for example, PAG, PG, PGE, and PZ) and temperature range (for example, A). Figure 20 provides a legend
for reading the complete device name for any TMS320x240xA family member. See the timing section for specific
options that are available on 240xA devices.
TMS 320 LF 2407A
PGE
A
PREFIX
TMX = experimental device
TMP = prototype device
TMS = qualified device
DEVICE FAMILY
320 = TMS320 DSP Family
TECHNOLOGY
LC = ROM (3.3 V)
LF = Flash EEPROM (3.3 V)
TEMPERATURE RANGE
A
= −40°C to 85°C
S
= −40°C to 125°C
PACKAGE TYPE†‡
PG = 64-pin QFP
PAG = 64-pin TQFP
PGE = 144-pin plastic LQFP
PZ = 100-pin plastic LQFP
VF = 32-pin plastic LQFP
DEVICE
240xA DSP
2407A§
2406A§
2404A
2403A
2402A
2401A
† QFP = Quad Flatpack
LQFP = Low-Profile Quad Flatpack
TQFP = Thin Quad Flatpack
‡ Not yet available Lead (Pb)-free. For estimated conversion dates, go to www.ti.com/leadfree
§ The package dimensions of the 2407A and 2406A devices correspond to the LQFP package. These devices were stated to be
in TQFP packaging in the TMX data sheets. The package dimensions have not changed; only the package designation has
changed.
Figure 20. TMS320x240xA Device Nomenclature
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documentation support
Extensive documentation supports all of the TMS320 DSP family generations of devices from product
announcement through applications development. The types of documentation available include: data sheets,
such as this document, with design specifications; complete user’s guides for all devices and development
support tools; and hardware and software applications. Useful reference documentation includes:
D User Guides
−
TMS320LF/LC240xA DSP Controllers Reference Guide: System and Peripherals (literature number
SPRU357)
−
Manual Update Sheet for TMS320LF/LC240xA DSP Controllers Reference Guide: System and
Peripherals (SPRU357) [literature number SPRZ015]
−
TMS320C240 DSP Controllers CPU, System, and Instruction Set Reference Guide
(literature number SPRU160)
D Data Sheets
−
TMS320LF2407A, TMS320LF2406A, TMS320LF2403A, TMS320LF2402A, TMS320LC2406A,
TMS320LC2404A, TMS320LC2402A DSP Controllers (literature number SPRS145)
−
TMS320LF2407, TMS320LF2406, TMS320LF2402 DSP Controllers (literature number SPRS094)
−
TMS320LF2401A DSP Controller (literature number SPRS161)
D Application Reports
−
3.3-V DSP for Digital Motor Control (literature number SPRA550)
To receive copies of TMS320 DSP literature, contact the Literature Response Center at 800-477-8924.
A series of DSP textbooks is published by Prentice-Hall and John Wiley & Sons to support digital signal
processing research and education. The TMS320 DSP newsletter, Details on Signal Processing, is published
quarterly and distributed to update TMS320 DSP customers on product information.
Updated information on the TMS320 DSP controllers can be found on the worldwide web at:
http://www.ti.com.
To send comments regarding this TMS320x240xA data sheet (literature number SPRS145), use the
[email protected] email address, which is a repository for feedback. For questions and support,
contact the Product Information Center listed at the http://www.ti.com/sc/docs/pic/home.htm site.
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LF240xA AND LC240xA ELECTRICAL SPECIFICATIONS DATA
absolute maximum ratings over operating free-air temperature ranges (unless otherwise noted)†
Supply voltage range, VDD, PLLVCCA, VDDO, and VCCA (see Note 1) . . . . . . . . . . . . . . . . . . − 0.3 V to 4.6 V
VCCP range . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . − 0.3 V to 5.5 V
Input voltage range, VIN . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . − 0.3 V to 4.6 V
Output voltage range, VO LF240xA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . − 0.3 V to 4.6 V
Output voltage range,VO LC240xA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . − 0.3 V to 4.6 V
Input clamp current, IIK (VIN < 0 or VIN > VCC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ± 20 mA
Output clamp current, IOK (VO < 0 or VO > VCC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ± 20 mA
Operating free-air temperature ranges, TA: A version . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . − 40°C to 85°C
S version . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . − 40°C to 125°C
Junction temperature range, TJ (see Note 2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . − 40°C to 150°C
Storage temperature range, Tstg (see Note 2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . − 65°C to 150°C
† Clamp current stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress
ratings only, and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating
conditions” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTES: 1. All voltage values are with respect to VSS.
2. Long−term high−temperature storage and/or extended use at maximum temperature conditions may result in a reduction of overall
device life. For additional thermal reliability data for these devices, contact Texas Instruments.
recommended operating conditions‡§
VDDO = VDD ± 0.3 V
MIN
NOM
MAX
3
3.3
3.6
UNIT
V
0
0
V
3.3
3.6
V
3.3
3.6
V
5
5.25
VDD/VDDO
VSS
Supply voltage
Supply ground
0
PLLVCCA
VCCA¶
PLL supply voltage
3
ADC supply voltage
3
VCCP
fCLKOUT
Flash programming supply voltage
4.75
VIH#
VIL
High-level input voltage
All inputs
Low-level input voltage
All inputs
−2
mA
High-level output source current, VOH = 2.4 V
Output pins Group 1||
Output pins Group 2||
−4
mA
Output pins Group 3||
Output pins Group 1||
−8
mA
2
mA
Output pins Group 2||
Output pins Group 3||
4
mA
8
mA
IOH
IOL
Device clock frequency (system clock)
Low-level output sink current, VOL = VOL MAX
2
40
2
VDD + 0.3
0.8
A version
− 40
85
S version
− 40
125
TA
Free-air temperature
TJ
Junction temperature
Nf
Flash endurance for the array (Write/erase
cycles)
− 40
− 40°C to 85°C
25
10K
150
V
MHz
V
V
°C
°C
cycles
‡ See the mechanical data package page for thermal resistance values, ΘJA (junction-to-ambient), ΘJC (junction-to-case), and Ψjt (junction-to-top
of case)
§ The drive strength of the EVA PWM pins and the EVB PWM pins are not identical.
¶ VCCA should not differ from VDD by more than 0.3 V.
# The input buffers used in 240x/240xA are not 5-V compatible.
|| Primary signals and their groupings:
Group 1: PWM1−PWM6, T1PWM, T2PWM, CAP1−CAP6, TCLKINA, IOPF6, IOPC1, TCK, TDI, TMS, XF, A0−A15
Group 2: PS/DS/IS, RD, W/R, STRB, R/W, VIS_OE, D0−D15, T3PWM, T4PWM, PWM7−PWM12, CANTX, CANRX, SPICLK,
SPISOMI, SPISIMO, SPISTE, EMU0, EMU1, TDO, TMS2
Group 3: TDIRA, TDIRB, SCIRXD, SCITXD, XINT1, XINT2, CLKOUT, TCLKINB
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electrical characteristics over recommended operating free-air temperature ranges (unless
otherwise noted)
PARAMETER
VOH
High-level output voltage
VOL
Low-level output voltage
TEST CONDITIONS
VDD = 3.0 V, IOH = IOHMAX
All outputs at 50 µA
MIN
TYP
2.4
VDDO
VDDO − 0.2
IOL = IOLMAX
With pullup
MAX
0.4
−10
−16
VDD = 3.3 V, VIN = 0 V
−30
UNIT
V
V
µA
A
IIL
Input current (low level)
IIH
Input current (high level)
IOZ
Ci
Leakage current, high-impedance state (off-state)
Input capacitance
2
pF
Co
Output capacitance
3
pF
With pulldown
±2
±2
With pullup
VDD = 3.3 V, VIN = VDD
With pulldown
10
16
30
±2
VO = VDD or 0 V
A
µA
µA
current consumption by power-supply pins over recommended operating free-air temperature
ranges at 40-MHz CLOCKOUT
PARAMETER
IDD†
Operational Current
TEST CONDITIONS
A test code running in B0 RAM does the
following:
1. Enables clock to all peripherals.
2. Toggles all PWM outputs at 20 kHz.
3. Performs a continuous conversion of all
ADC channels.
4. An infinite loop which transmits a character
out of SCI and executes MACD instructions.
NOTE: All I/O pins are floating.
ICCA
MIN
TYP
MAX
UNIT
LF2407A
95
120
mA
LF2406A
95
120
mA
LF2403A
95
120
mA
LF2402A
85
110
mA
LC2406A
85
110
mA
LC2404A
85
110
mA
LC2403A
75
95
mA
LC2402A
75
95
mA
LF2407A
10
22
mA
LF2406A
10
22
mA
LF2403A
10
22
mA
LF2402A
10
22
mA
LC2406A
10
22
mA
LC2404A
10
22
mA
LC2403A
10
22
mA
LC2402A
10
22
mA
ADC module current
† IDD is the current flowing into the VDD, VDDO, and PLLVCCA pins.
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current consumption by power-supply pins over recommended operating free-air temperature
ranges during low-power modes at 40-MHz CLOCKOUT (TMS320LF2407A)
PARAMETER
IDD†
Operational Current
ICCA
IDD†
ADC module current
ICCA
ADC module current
IDD†
Operational Current
MODE
TEST CONDITIONS
MIN
TYP
MAX
80
UNIT
mA
LPM0
Clock to all peripherals is enabled.
No I/O pins are switching.
70
10
22
mA
Clock to all peripherals is disabled.
No I/O pins are switching.
35
45
mA
LPM1
0
0
mA
Clock to all peripherals is disabled.
Flash is powered down.
Input clock is disabled.‡
200
400
µA
LPM2
ICCA
ADC module current
0
† IDD is the current flowing into the VDD, VDDO, and PLLVCCA pins.
‡ If a quartz crystal or ceramic resonator is used as the clock source, the LPM2 mode shuts down the internal oscillator.
0
mA
Operational Current
current consumption by power-supply pins over recommended operating free-air temperature
ranges during low-power modes at 40-MHz CLOCKOUT (TMS320LF2406A)
PARAMETER
IDD†
Operational Current
ICCA
IDD†
ADC module current
ICCA
ADC module current
IDD†
Operational Current
ICCA
ADC module current
MODE
TEST CONDITIONS
MIN
TYP
MAX
UNIT
Clock to all peripherals is enabled.
No I/O pins are switching.
70
80
mA
LPM0
10
22
mA
Clock to all peripherals is disabled.
No I/O pins are switching.
35
45
mA
LPM1
0
0
mA
Clock to all peripherals is disabled.
Flash is powered down.
Input clock is disabled.‡
200
400
µA
LPM2
0
0
mA
Operational Current
† IDD is the current flowing into the VDD, VDDO, and PLLVCCA pins.
‡ If a quartz crystal or ceramic resonator is used as the clock source, the LPM2 mode shuts down the internal oscillator.
current consumption by power-supply pins over recommended operating free-air temperature
ranges during low-power modes at 40-MHz CLOCKOUT (TMS320LF2403A)
PARAMETER
IDD†
Operational Current
ICCA
IDD†
ADC module current
ICCA
ADC module current
IDD†
Operational Current
MODE
TEST CONDITIONS
MIN
TYP
MAX
UNIT
Clock to all peripherals is enabled.
No I/O pins are switching.
70
80
mA
LPM0
10
22
mA
Clock to all peripherals is disabled.
No I/O pins are switching.
35
45
mA
LPM1
0
0
mA
Clock to all peripherals is disabled.
Flash is powered down.
Input clock is disabled.‡
200
400
µA
LPM2
ICCA
ADC module current
0
† IDD is the current flowing into the VDD, VDDO, and PLLVCCA pins.
‡ If a quartz crystal or ceramic resonator is used as the clock source, the LPM2 mode shuts down the internal oscillator.
0
mA
Operational Current
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current consumption by power-supply pins over recommended operating free-air temperature
ranges during low-power modes at 40-MHz CLOCKOUT (TMS320LF2402A)
PARAMETER
IDD†
Operational Current
ICCA
IDD†
ADC module current
ICCA
ADC module current
IDD†
Operational Current
MODE
TEST CONDITIONS
MIN
TYP
MAX
70
UNIT
mA
LPM0
Clock to all peripherals is enabled.
No I/O pins are switching.
60
10
22
mA
Clock to all peripherals is disabled.
No I/O pins are switching.
35
45
mA
LPM1
0
0
mA
Clock to all peripherals is disabled.
Flash is powered down.
Input clock is disabled.‡
200
400
µA
LPM2
ICCA
ADC module current
0
† IDD is the current flowing into the VDD, VDDO, and PLLVCCA pins.
‡ If a quartz crystal or ceramic resonator is used as the clock source, the LPM2 mode shuts down the internal oscillator.
0
mA
Operational Current
current consumption by power-supply pins over recommended operating free-air temperature
ranges during low-power modes at 40-MHz CLOCKOUT (TMS320LC2406A)
PARAMETER
IDD†
Operational Current
ICCA
IDD†
ADC module current
ICCA
ADC module current
IDD†
MODE
MIN
TYP
MAX
UNIT
Clock to all peripherals is enabled.
No I/O pins are switching.
50
70
mA
LPM0
10
22
mA
Clock to all peripherals is disabled.
No I/O pins are switching.
35
45
mA
LPM1
0
0
mA
−40°C to 85°C
20
200
µA
−40°C to 125°C
20
400
µA
0
0
mA
Operational Current
Operational Current
LPM2
ICCA
TEST CONDITIONS
Clock to all peripherals is disabled.
Input clock is disabled.‡
ADC module current
† IDD is the current flowing into the VDD, VDDO, and PLLVCCA pins.
‡ If a quartz crystal or ceramic resonator is used as the clock source, the LPM2 mode shuts down the internal oscillator.
current consumption by power-supply pins over recommended operating free-air temperature
ranges during low-power modes at 40-MHz CLOCKOUT (TMS320LC2404A)
PARAMETER
IDD†
Operational Current
ICCA
IDD†
ADC module current
ICCA
ADC module current
IDD†
Operational Current
MODE
MIN
TYP
MAX
Clock to all peripherals is enabled.
No I/O pins are switching.
50
70
mA
10
22
mA
Clock to all peripherals is disabled.
No I/O pins are switching.
35
45
mA
LPM1
0
0
mA
−40°C to 85°C
20
200
µA
−40°C to 125°C
20
400
µA
0
0
mA
Operational Current
Clock to all peripherals is disabled.
Input clock is disabled.‡
ADC module current
† IDD is the current flowing into the VDD, VDDO, and PLLVCCA pins.
‡ If a quartz crystal or ceramic resonator is used as the clock source, the LPM2 mode shuts down the internal oscillator.
74
UNIT
LPM0
LPM2
ICCA
TEST CONDITIONS
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current consumption by power-supply pins over recommended operating free-air temperature
ranges during low-power modes at 40-MHz CLOCKOUT (TMS320LC2403A)
PARAMETER
IDD†
Operational Current
ICCA
IDD†
ADC module current
ICCA
ADC module current
IDD†
Operational Current
MODE
MIN
TYP
MAX
70
UNIT
mA
LPM0
Clock to all peripherals is enabled.
No I/O pins are switching.
50
10
22
mA
Clock to all peripherals is disabled.
No I/O pins are switching.
35
45
mA
LPM1
0
0
mA
−40°C to 85°C
20
200
µA
−40°C to 125°C
20
400
µA
0
0
mA
Operational Current
LPM2
ICCA
TEST CONDITIONS
Clock to all peripherals is disabled.
Input clock is disabled.‡
ADC module current
† IDD is the current flowing into the VDD, VDDO, and PLLVCCA pins.
‡ If a quartz crystal or ceramic resonator is used as the clock source, the LPM2 mode shuts down the internal oscillator.
current consumption by power-supply pins over recommended operating free-air temperature
ranges during low-power modes at 40-MHz CLOCKOUT (TMS320LC2402A)
PARAMETER
IDD†
Operational Current
ICCA
IDD†
ADC module current
ICCA
ADC module current
IDD†
MODE
TYP
MAX
UNIT
Clock to all peripherals is enabled.
No I/O pins are switching.
40
60
mA
10
22
mA
Clock to all peripherals is disabled.
No I/O pins are switching.
35
45
mA
LPM1
0
0
mA
−40°C to 85°C
20
200
µA
−40°C to 125°C
20
400
µA
0
0
mA
Operational Current
Operational Current
ADC module current
MIN
LPM0
LPM2
ICCA
TEST CONDITIONS
Clock to all peripherals is disabled.
Input clock is disabled.‡
† IDD is the current flowing into the VDD, VDDO, and PLLVCCA pins.
‡ If a quartz crystal or ceramic resonator is used as the clock source, the LPM2 mode shuts down the internal oscillator.
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current consumption graphs
100
90
80
Current (mA)
I DD
70
60
50
40
30
20
10
0
0
5
10
15
20
25
30
35
40
45
CLKOUT Frequency (MHz)
Figure 21. LF2407A Typical Current Consumption (With Peripheral Clocks Enabled)
100
90
80
Current (mA)
I DD
70
60
50
40
30
20
10
0
0
5
10
15
20
25
30
35
40
45
CLKOUT Frequency (MHz)
Figure 22. LC2406A Typical Current Consumption (With Peripheral Clocks Enabled)
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reducing current consumption
240x DSPs incorporate a unique method to reduce the device current consumption. A reduction in current
consumption can be achieved by turning off the clock to any peripheral module which is not used in a given
application. Table 17 indicates the typical reduction in current consumption achieved by turning off the clocks
to various peripherals. See the TMS320LF/LC240xA DSP Controllers Reference Guide: System and
Peripherals (literature number SPRU357) for further information on how to turn off the clock to the peripherals.
Table 17. Typical Current Consumption by Various Peripherals (at 40 MHz)
PERIPHERAL MODULE
CURRENT REDUCTION (mA)
CAN
8.4
EVA
6.1
EVB
6.1
ADC
3.7†
SCI
1.9
SPI
1.3
† This number represents the current drawn by the digital portion of the ADC module.
Turning off the clock to the ADC module results in the elimination of the current drawn
by the analog portion of the ADC (ICCA) as well.
PARAMETER MEASUREMENT INFORMATION
IOL
Tester Pin
Electronics
50 Ω
VLOAD
Output
Under
Test
CT
IOH
Where:
IOL
IOH
VLOAD
CT
=
=
=
=
2 mA (all outputs)
300 µA (all outputs)
1.5 V
50-pF typical load-circuit capacitance
Figure 23. Test Load Circuit
signal transition levels
The data in this section is shown for the 3.3-V version. Note that some of the signals use different reference
voltages, see the recommended operating conditions table. Output levels are driven to a minimum logic-high
level of 2.4 V and to a maximum logic-low level of 0.8 V.
Figure 24 shows output levels.
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SPRS145J − JULY 2000 − REVISED NOVEMER 2004
2.4 V (VOH)
80%
20%
0.4 V (VOL)
Figure 24. Output Levels
Output transition times are specified as follows:
D For a high-to-low transition, the level at which the output is said to be no longer high is below 80% of the
total voltage range and lower and the level at which the output is said to be low is 20% of the total voltage
range and lower.
D For a low-to-high transition, the level at which the output is said to be no longer low is 20% of the total voltage
range and higher and the level at which the output is said to be high is 80% of the total voltage range and
higher.
Figure 25 shows the input levels.
2.0 V (VIH)
90%
10%
0.8 V (VIL)
Figure 25. Input Levels
Input transition times are specified as follows:
D For a high-to-low transition on an input signal, the level at which the input is said to be no longer high is 90%
of the total voltage range and lower and the level at which the input is said to be low is 10% of the total voltage
range and lower.
D For a low-to-high transition on an input signal, the level at which the input is said to be no longer low is 10%
of the total voltage range and higher and the level at which the input is said to be high is 90% of the total
voltage range and higher.
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PARAMETER MEASUREMENT INFORMATION
timing parameter symbology
Timing parameter symbols used are created in accordance with JEDEC Standard 100. To shorten the symbols,
some of the pin names and other related terminology have been abbreviated as follows:
A
A[15:0]
MS
Memory strobe pins IS, DS, or PS
Cl
XTAL1/CLKIN
R
READY
CO
CLKOUT
RD
Read cycle or RD
D
D[15:0]
RS
RESET pin RS
INT
XINT1, XINT2
W
Write cycle or WE
Lowercase subscripts and their meanings:
Letters and symbols and their meanings:
a
access time
H
High
c
cycle time (period)
L
Low
d
delay time
V
Valid
f
fall time
X
Unknown, changing, or don’t care level
h
hold time
Z
High impedance
r
rise time
su
setup time
t
transition time
v
valid time
w
pulse duration (width)
general notes on timing
All output signals from the 240xA devices (including CLKOUT) are derived from an internal clock such that all
output transitions for a given half-cycle occur with a minimum of skewing relative to each other.
The signal combinations shown in the following timing diagrams may not necessarily represent actual cycles.
For actual cycle examples, see the appropriate cycle description section of this data sheet.
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external reference crystal/clock with PLL circuit enabled
timing parameters with the PLL circuit enabled
PARAMETER
MIN
Input clock frequency†
fx
MAX
Resonator
4
13
Crystal
4
20
CLKIN
4
20
UNIT
MHz
† Input frequency should be adjusted (CLK PS bits in SCSR1 register) such that CLKOUT = 40 MHz maximum, 4 MHz minimum.
switching characteristics over recommended operating conditions [H = 0.5 tc(CO)] (see Figure 26)
PARAMETER
PLL MODE
×4 mode†
MIN
TYP
MAX
25
UNIT
tc(CO)
Cycle time, CLKOUT
tf(CO)
tr(CO)
Fall time, CLKOUT
ns
tw(COL)
tw(COH)
Pulse duration, CLKOUT low
H −3
H
H +3
ns
Pulse duration, CLKOUT high
H −3
H
H +3
ns
tt
4096tc(Cl)
Transition time, PLL synchronized after RS pin high
† Input frequency should be adjusted (CLK PS bits in SCSR1 register) such that CLKOUT = 40 MHz maximum, 4 MHz minimum.
ns
4
Rise time, CLKOUT
ns
4
ns
timing requirements (see Figure 26)
MIN
MAX
UNIT
tc(Cl)
Cycle time, XTAL1/CLKIN
250
ns
tf(Cl)
tr(Cl)
Fall time, XTAL1/CLKIN
5
ns
Rise time, XTAL1/CLKIN
5
ns
tw(CIL)
tw(CIH)
Pulse duration, XTAL1/CLKIN low as a percentage of tc(Cl)
40
60
%
Pulse duration, XTAL1/CLKIN high as a percentage of tc(Cl)
40
60
%
tc(CI)
tw(CIH)
tf(Cl)
tr(Cl)
tw(CIL)
XTAL1/CLKIN
tw(COH)
tc(CO)
tw(COL) tr(CO)
CLKOUT
Figure 26. CLKIN-to-CLKOUT Timing with PLL and External Clock in ×4 Mode
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tf(CO)
SPRS145J − JULY 2000 − REVISED NOVEMER 2004
RS timing
timing requirements for a reset [H = 0.5tc(CO)] (see Figure 27 and Figure 28)
MIN
NOM
MAX
UNIT
tw(RSL)
Pulse duration, stable CLKIN to RS high
8tc(CI)†
cycles
tw(RSL2)
Pulse duration, RS low
8tc(CI)
cycles
tp
PLL lock-up time
td(EX)
4096tc(CI)
36H
Delay time, reset vector executed after PLL lock time
cycles
ns
† During power-on reset, the device can continue to hold the RS pin low for another 128 CLKIN cycles.
VDD/VDDO
tp
td(EX)
tw(RSL)
RS
CLKIN
XTAL1
(See Note B)
tOSCST
(See Note C)
BOOT_EN
BOOT_EN/XF
XF
CLKOUT
I/Os
Hi-Z (See Note D)
Code-Dependent
Address/
Data/
Control
Address/Data/Control
Valid
NOTES: A. Be certain that the emulation logic is reset before de-asserting the device reset. That is, TRST of the device is not driven high before
the device reset is de-asserted. This is applicable to XDS510, XDS510PP, and XDS510PP+ class of emulators. New
generation emulators such as SPI515 and XDS510 USB emulators have built-in protection mechanism to take care of this
requirement.
B. XTAL1 refers to the internal oscillator clock if on-chip oscillator is used.
C. tOSCST is the oscillator start-up time, which is dependent on crystal/resonator and board design.
D. All I/Os contain a clamp to VDD. Inputs of approximately 0.7 V above VDD will cause the I/O to sink current. I/Os containing pullups
or pulldowns will always sink/source a small amount of current once powered.
Figure 27. Power-on Reset (See Note A)
XDS510PP+, SP515, and XDS510 USB are trademarks of Spectrum Digital.
XDS510 and XDS510PP, are trademarks of Texas Instruments.
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RS timing (continued)
tp
tw(RSL2)
td(EX)
RS
CLKIN
XTAL1†
BOOT_EN
/XF
BOOT_EN
XF
CLKOUT
I/Os
Hi-Z
Code-Dependent
Address/
Data/
Control
† XTAL1 refers to internal oscillator clock if on-chip oscillator is used.
Figure 28. Warm Reset
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Address/Data/Control Valid
SPRS145J − JULY 2000 − REVISED NOVEMER 2004
RS timing (continued)
switching characteristics over recommended operating conditions for a reset [H = 0.5tc(CO)]
(see Figure 29)
PARAMETER
MIN
tw(RSL1)
Pulse duration, RS low†
td(EX)
Delay time, reset vector executed after PLL lock time
MAX
128tc(CI)
ns
36H
ns
tp
PLL lock time (input cycles)
† The parameter tw(RSL1) refers to the time RS is an output.
4096tc(CI)
tp
tw(RSL1)
UNIT
ns
td(EX)
RS
CLKIN
XTAL1†
BOOT_EN
/XF
BOOT_EN
XF
CLKOUT
I/Os
Hi-Z
Code-Dependent
Address/
Data/
Control
† XTAL1 refers to internal oscillator clock if on-chip oscillator is used.
Address/Data/Control Valid
Figure 29. Watchdog Initiated Reset
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low-power mode timing
switching characteristics over recommended operating conditions [H = 0.5tc(CO)]
(see Figure 30, Figure 31, and Figure 32)
PARAMETER
LOW-POWER MODES
MIN
TYP
MAX
IDLE1
LPM0
12 × tc(CO)
UNIT
td(WAKE-A)
Delay time, CLKOUT switching to
program execution resume
IDLE2
LPM1
15 × tc(CO)
ns
td(IDLE-COH)
Delay time, Idle instruction executed to
IDLE2
CLKOUT high
LPM1
4tc(CO)
ns
td(WAKE-OSC)
Delay time, wakeup interrupt
asserted to oscillator running
OSC start-up
time
ms
4tc(CO)
ns
td(IDLE-OSC)
HALT
Delay time, Idle instruction executed to {PLL/OSC power down}
oscillator power off
td(EX)
Delay time, reset vector executed after PLL lock time
LPM2
36H
ns
td(WAKE−A)
A0−A15
CLKOUT
WAKE INT†
† WAKE INT can be any valid interrupt or RESET.
Figure 30. IDLE1 Entry and Exit Timing − LPM0
td(IDLE−COH)
A0−A15
CLKOUT
WAKE INT†
td(WAKE−A)
† WAKE INT can be any valid interrupt or RESET.
Figure 31. IDLE2 Entry and Exit Timing − LPM1
tp
A0−A15
td(IDLE−OSC)
td(IDLE−COH)
CLKOUT
td(WAKE−OSC)
RESET
Figure 32. HALT Mode − LPM2
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tw(RSL)
td(EX)
SPRS145J − JULY 2000 − REVISED NOVEMER 2004
LPM2 wakeup timing
switching characteristics over recommended operating conditions (see Figure 33)
PARAMETER
td(PDP-PWM)HZ
Delay time, PDPINTA low to PWM
high-impedance state
td(INT)
Delay time, INT low/high to interrupt-vector
fetch
MAX
UNIT
if bit 6 of SCSR2 = 0
MIN
(6 + 1)tc(CO) + 12†
ns
if bit 6 of SCSR2 = 1
(12+ 1)tc(CO) + 12†
ns
10tc(CO) + tw(PDP−WAKE)
ns
MIN
UNIT
† Includes i/p qualifier cycles plus synchronization plus propagation delay
timing requirements (see Figure 33)
tw(PDP−WAKE)‡
Pulse duration, PDPINTA input low
if bit 6 of SCSR2 = 0
6tc(CO)
if bit 6 of SCSR2 = 1
12tc(CO)
tp
PLL lock-up time
‡ This is different from 240x devices.
XTAL1
MAX
ns
4096tc(CI)
cycles
Oscillator Disabled
tOSC†
tp
CLKIN
CLKOUT‡
tw(PDP−WAKE)
PDPINTx
td(PDP-PWM)HZ
PWM
td(INT)
CPU Status
CPU IDLE State (LPM2)
Interrupt Vector§ or
Next Instruction¶
† tOSC is the oscillator start-up time.
‡ CLKOUT frequency after LPM2 wakeup will be the same as that upon entering LPM2 (x4 shown as an example).
§ PDPINTx interrupt vector, if PDPINTx interrupt is enabled.
¶ If PDPINTx interrupt is disabled.
Figure 33. LPM2 Wakeup Using PDPINTx
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XF, BIO, and MP/MC timing
switching characteristics over recommended operating conditions (see Figure 34)
PARAMETER
td(XF)
Delay time, CLKOUT high to XF high/low
MIN
MAX
−3
7
MIN
MAX
UNIT
ns
timing requirements (see Figure 34)
tsu(BIO)CO
Setup time, BIO or MP/MC low before CLKOUT low
th(BIO)CO
Hold time, BIO or MP/MC low after CLKOUT low
ns
19
ns
CLKOUT
td(XF)
XF
tsu(BIO)CO
BIO,
MP/MC
Figure 34. XF and BIO Timing
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UNIT
0
th(BIO)CO
SPRS145J − JULY 2000 − REVISED NOVEMER 2004
TIMING EVENT MANAGER INTERFACE
PWM timing
PWM refers to all PWM outputs on EVA and EVB.
switching characteristics over recommended operating conditions for PWM timing
[H = 0.5tc(CO)] (see Figure 35)
PARAMETER
tw(PWM)†
MIN
MAX
2H+5
Pulse duration, PWMx output high/low
td(PWM)CO
Delay time, CLKOUT low to PWMx output switching
† PWM outputs may be 100%, 0%, or increments of tc(CO) with respect to the PWM period.
UNIT
ns
15
ns
timing requirements‡ [H = 0.5tc(CO)] (see Figure 36)
MIN
tw(TMRDIR)
Pulse duration, TMRDIR low/high
tw(TMRCLK)
Pulse duration, TMRCLK low as a percentage of TMRCLK cycle time
twh(TMRCLK)
Pulse duration, TMRCLK high as a percentage of TMRCLK cycle time
MAX
4H+5
tc(TMRCLK)
Cycle time, TMRCLK
‡ Parameter TMRDIR is equal to the pin TDIRx, and parameter TMRCLK is equal to the pin TCLKINx.
ns
40
60
40
60
4 tc(CO)
UNIT
%
%
ns
CLKOUT
td(PWM)CO
tw(PWM)
PWMx
Figure 35. PWM Output Timing
CLKOUT
tw(TMRDIR)
TMRDIR†
† Parameter TMRDIR is equal to the pin TDIRx.
Figure 36. TMRDIR Timing
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capture and QEP timing
CAP refers to all QEP and capture input pins.
timing requirements (see Figure 37)
MIN
tw(CAP)†
if bit 6 of SCSR2 = 0
6tc(CO)
if bit 6 of SCSR2 = 1
12tc(CO)
Pulse duration, CAPx input low/high
† This is different from 240x devices.
CLKOUT
tw(CAP)
CAPx
Figure 37. Capture Input and QEP Timing
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MAX
UNIT
ns
SPRS145J − JULY 2000 − REVISED NOVEMER 2004
interrupt timing
INT refers to XINT1 and XINT2. PDP refers to PDPINTx.
switching characteristics over recommended operating conditions (see Figure 38)
PARAMETER
td(PDP-PWM)HZ
Delay time, PDPINTA low to PWM
high-impedance state
td(INT)
Delay time, INT low/high to interrupt-vector
fetch
MIN
MAX
UNIT
if bit 6 of SCSR2 = 0
(6 + 1)tc(CO) + 12†
ns
if bit 6 of SCSR2 = 1
(12+ 1)tc(CO) + 12†
ns
10tc(CO) + tW (INT)
ns
† Includes i/p qualifier cycles plus synchronization plus propagation delay
timing requirements (see Figure 38)
MIN
tw(INT)†
Pulse duration, INT input low/high
tw(PDP)†
Pulse duration, PDPINTx input low
if bit 6 of SCSR2 = 0
6tc(CO)
if bit 6 of SCSR2 = 1
12tc(CO)
if bit 6 of SCSR2 = 0
6tc(CO)
if bit 6 of SCSR2 = 1
12tc(CO)
MAX
UNIT
ns
ns
† This is different from 240x devices.
CLKOUT
tw(PDP)
PDPINTx
td(PDP-PWM)HZ
PWM†
tw(INT)
XINT1, XINT2
td(INT)
Interrupt Vector
A0−A15
† PWM refers to all the PWM pins in the device (i.e., PWMn and TnPWM pins). The state of the PWM pins after PDPINTx is taken
high depends on the state of the FCOMPOE bit.
Figure 38. External Interrupts Timing
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general-purpose input/output timing
switching characteristics over recommended operating conditions (see Figure 39)
PARAMETER
MIN
MAX
UNIT
td(GPO)CO
tr(GPO)
Delay time, CLKOUT low to GPIO low/high
All GPIOs
9
ns
Rise time, GPIO switching low to high
All GPIOs
8
ns
tf(GPO)
Fall time, GPIO switching high to low
All GPIOs
6
ns
timing requirements [H = 0.5tc(CO)] (see Figure 40)
MIN
tw(GPI)
2H+15
Pulse duration, GPI high/low
CLKOUT
td(GPO)CO
GPIO
tr(GPO)
tf(GPO)
Figure 39. General-Purpose Output Timing
CLKOUT
tw(GPI)
GPIO
Figure 40. General-Purpose Input Timing
90
POST OFFICE BOX 1443
• HOUSTON, TEXAS 77251−1443
MAX
UNIT
ns
POST OFFICE BOX 1443 • HOUSTON, TEXAS 77251−1443
0.5tc(SPC)M −10
0.5tc(SPC)M −10
− 10
0.5tc(SPC)M −10
Pulse duration, SPICLK low
(clock polarity = 1)
Pulse duration, SPICLK low
(clock polarity = 0)
Pulse duration, SPICLK high
(clock polarity = 1)
Delay time, SPICLK high to
SPISIMO valid (clock polarity = 0)
Delay time, SPICLK low to
SPISIMO valid (clock polarity = 1)
Valid time, SPISIMO data valid after
SPICLK low (clock polarity =0)
Valid time, SPISIMO data valid after
SPICLK high (clock polarity =1)
Setup time, SPISOMI before
SPICLK low (clock polarity = 0)
Setup time, SPISOMI before
SPICLK high (clock polarity = 1)
Valid time, SPISOMI data valid after
SPICLK low (clock polarity = 0)
Valid time, SPISOMI data valid after
SPICLK high (clock polarity = 1)
tw(SPCL)M
tw(SPCL)M
tw(SPCH)M
td(SPCH-SIMO)M
td(SPCL-SIMO)M
tv(SPCL-SIMO)M
tv(SPCH-SIMO)M
tsu(SOMI-SPCL)M
tsu(SOMI-SPCH)M
tv(SPCL-SOMI)M
tv(SPCH-SOMI)M
0.25tc(SPC)M −10
0.25tc(SPC)M −10
0
0
0.5tc(SPC)M −10
− 10
0.5tc(SPC)M −10
0.5tc(SPC)M −10
Pulse duration, SPICLK high
(clock polarity = 0)
tw(SPCH)M
4tc(CO)
Cycle time, SPICLK
tc(SPC)M
MIN
10
10
0.5tc(SPC)M
0.5tc(SPC)M
0.5tc(SPC)M
0.5tc(SPC)M
128tc(CO)
MAX
SPI WHEN (SPIBRR + 1) IS EVEN
OR SPIBRR = 0 OR 2
† The MASTER / SLAVE bit (SPICTL.2) is set and the CLOCK PHASE bit (SPICTL.3) is cleared.
‡ tc = system clock cycle time = 1/CLKOUT = tc(CO)
§ The active edge of the SPICLK signal referenced is controlled by the CLOCK POLARITY bit (SPICCR.6).
9§
8§
5§
4§
3§
2§
1
NO.
5tc(CO)
MIN
0.5tc(SPC)M −0.5tc (CO)−10
0.5tc(SPC)M −0.5tc(CO) −10
0
0
0.5tc(SPC)M + 0.5tc(CO) −10
0.5tc(SPC)M + 0.5tc(CO) −10
− 10
− 10
0.5tc(SPC)M + 0.5tc (CO)−10
0.5tc(SPC)M + 0.5tc (CO)−10
0.5tc(SPC)M −0.5tc(CO) −10
MAX
10
10
0.5tc(SPC)M + 0.5tc(CO)
0.5tc(SPC)M + 0.5tc(CO)
0.5tc(SPC)M − 0.5tc(CO)
0.5tc(SPC)M −0.5tc(CO)
127tc(CO)
SPI WHEN (SPIBRR + 1)
IS ODD AND SPIBRR > 3
0.5tc(SPC)M −0.5tc(CO) −10
SPI master mode external timing parameters (clock phase = 0)†‡ (see Figure 41)
SPI master mode timing information is listed in the following tables.
SPI MASTER MODE TIMING PARAMETERS
ns
ns
ns
ns
ns
ns
ns
UNIT
000
000
0
S{RS145J − July 2000 − − REVISED November 2004
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PARAMETER MEASUREMENT INFORMATION
1
SPICLK
(clock polarity = 0)
2
3
SPICLK
(clock polarity = 1)
4
5
SPISIMO
Master Out Data Is Valid
8
9
SPISOMI
Master In Data
Must Be Valid
SPISTE†
† The SPISTE signal is active before the SPI communication stream starts; the SPISTE signal remains active until the SPI
communication stream is complete.
Figure 41. SPI Master Mode External Timing (Clock Phase = 0)
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0.5tc(SPC)M −10
0.5tc(SPC)M −10
Pulse duration, SPICLK low
(clock polarity = 1)
Pulse duration, SPICLK low
(clock polarity = 0)
Pulse duration, SPICLK high
(clock polarity = 1)
tw(SPCH)M
tw(SPCL)M
tw(SPCL)M
tw(SPCH)M
0.5tc(SPC)M −10
Setup time, SPISIMO data
valid before SPICLK low
(clock polarity = 1)
Valid time, SPISIMO data
valid after SPICLK high
(clock polarity =0)
Valid time, SPISIMO data
valid after SPICLK low
(clock polarity =1)
Setup time, SPISOMI before
SPICLK high
(clock polarity = 0)
Setup time, SPISOMI before
SPICLK low
(clock polarity = 1)
Valid time, SPISOMI data
valid after SPICLK high
(clock polarity = 0)
Valid time, SPISOMI data
valid after SPICLK low
(clock polarity = 1)
tsu(SIMO-SPCL)M
tv(SPCH-SIMO)M
tv(SPCL-SIMO)M
tsu(SOMI-SPCH)M
tsu(SOMI-SPCL)M
tv(SPCH-SOMI)M
tv(SPCL-SOMI)M
0.25tc(SPC)M −10
0.25tc(SPC)M −10
0
0
0.5tc(SPC)M −10
0.5tc(SPC)M −10
Setup time, SPISIMO data
valid before SPICLK high
(clock polarity = 0)
tsu(SIMO-SPCH)M
0.5tc(SPC)M −10
0.5tc(SPC)M −10
0.5tc(SPC)M −10
Pulse duration, SPICLK high
(clock polarity = 0)
4tc(CO)
Cycle time, SPICLK
tc(SPC)M
MIN
0.5tc(SPC)M
0.5tc(SPC)M
0.5tc(SPC)M
0.5tc(SPC)M
128tc(CO)
MAX
SPI WHEN (SPIBRR + 1) IS EVEN
OR SPIBRR = 0 OR 2
† The MASTER / SLAVE bit (SPICTL.2) is set and the CLOCK PHASE bit (SPICTL.3) is set.
‡ tc = system clock cycle time = 1/CLKOUT = tc(CO)
§ The active edge of the SPICLK signal referenced is controlled by the CLOCK POLARITY bit (SPICCR.6).
11§
10§
7§
6§
3§
2§
1
NO.
5tc(CO)
MIN
0.5tc(SPC)M −10
0.5tc(SPC)M −10
0
0
0.5tc(SPC)M −10
0.5tc(SPC)M −10
0.5tc(SPC)M −10
0.5tc(SPC)M − 10
0.5tc(SPC)M + 0.5tc(CO) −10
0.5tc(SPC)M + 0.5tc(CO) −10
0.5tc(SPC)M −0.5tc (CO)−10
MAX
0.5tc(SPC)M + 0.5tc(CO)
0.5tc(SPC)M + 0.5tc(CO)
0.5tc(SPC)M − 0.5tc(CO)
0.5tc(SPC)M − 0.5tc(CO)
127tc(CO)
SPI WHEN (SPIBRR + 1)
IS ODD AND SPIBRR > 3
0.5tc(SPC)M −0.5tc (CO)−10
SPI master mode external timing parameters (clock phase = 1)†‡ (see Figure 42)
ns
ns
ns
ns
ns
ns
ns
UNIT
000
000
0
S{RS145J − July 2000 − − REVISED November 2004
93
SPRS145J − JULY 2000 − REVISED NOVEMBER 2004
PARAMETER MEASUREMENT INFORMATION
1
SPICLK
(clock polarity = 0)
2
3
SPICLK
(clock polarity = 1)
6
7
SPISIMO
Data Valid
Master Out Data Is Valid
10
11
Master In Data
Must Be Valid
SPISOMI
SPISTE†
† The SPISTE signal is active before the SPI communication stream starts; the SPISTE signal remains active until the SPI
communication stream is complete.
Figure 42. SPI Master Mode External Timing (Clock Phase = 1)
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SPI slave mode timing parameters
Slave mode timing information is listed in the following tables.
SPI slave mode external timing parameters (clock phase = 0)†‡ (see Figure 43)
NO.
12
13§
14§
15§
tc(SPC)S
tw(SPCH)S
Cycle time, SPICLK
tw(SPCL)S
tw(SPCL)S
Pulse duration, SPICLK low (clock polarity = 1)
tw(SPCH)S
Pulse duration, SPICLK high (clock polarity = 1)
td(SPCH-SOMI)S
Delay time, SPICLK high to SPISOMI valid
(clock polarity = 0)
0.375tc(SPC)S −10
td(SPCL-SOMI)S
Delay time, SPICLK low to SPISOMI valid (clock polarity = 1)
0.375tc(SPC)S −10
tv(SPCL-SOMI)S
Valid time, SPISOMI data valid after SPICLK low
(clock polarity =0)
0.75tc(SPC)S
tv(SPCH-SOMI)S
Valid time, SPISOMI data valid after SPICLK high
(clock polarity =1)
0.75tc(SPC)S
16§
19§
MIN
4tc(CO)‡
tsu(SIMO-SPCL)S
tsu(SIMO-SPCH)S
Pulse duration, SPICLK high (clock polarity = 0)
Pulse duration, SPICLK low (clock polarity = 0)
UNIT
ns
0.5tc(SPC)S −10
0.5tc(SPC)S −10
0.5tc(SPC)S
0.5tc(SPC)S
ns
0.5tc(SPC)S −10
0.5tc(SPC)S −10
0.5tc(SPC)S
0.5tc(SPC)S
ns
ns
ns
Setup time, SPISIMO before SPICLK low (clock polarity = 0)
0
Setup time, SPISIMO before SPICLK high (clock polarity = 1)
0
tv(SPCL-SIMO)S
Valid time, SPISIMO data valid after SPICLK low
(clock polarity = 0)
0.5tc(SPC)S
tv(SPCH-SIMO)S
Valid time, SPISIMO data valid after SPICLK high
(clock polarity = 1)
0.5tc(SPC)S
20§
MAX
ns
ns
† The MASTER / SLAVE bit (SPICTL.2) is cleared and the CLOCK PHASE bit (SPICTL.3) is cleared.
‡ tc = system clock cycle time = 1/CLKOUT = tc(CO)
§ The active edge of the SPICLK signal referenced is controlled by the CLOCK POLARITY bit (SPICCR.6).
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SPRS145J − JULY 2000 − REVISED NOVEMBER 2004
SPI slave mode external timing parameters (continued)
12
SPICLK
(clock polarity = 0)
13
14
SPICLK
(clock polarity = 1)
15
16
SPISOMI
SPISOMI Data Is Valid
19
20
SPISIMO
SPISIMO Data
Must Be Valid
SPISTE†
† The SPISTE signal must be active before the SPI communication stream starts; the SPISTE signal must remain active until
the SPI communication stream is complete.
Figure 43. SPI Slave Mode External Timing (Clock Phase = 0)
96
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SPRS145J − JULY 2000 − REVISED NOVEMBER 2004
SPI slave mode timing parameters (continued)
SPI slave mode external timing parameters (clock phase = 1)†‡ (see Figure 44)
NO.
12
13§
14§
17§
MIN
tc(SPC)S
tw(SPCH)S
Cycle time, SPICLK
tw(SPCL)S
tw(SPCL)S
Pulse duration, SPICLK low (clock polarity = 1)
tw(SPCH)S
tsu(SOMI-SPCH)S
Pulse duration, SPICLK high (clock polarity = 1)
Setup time, SPISOMI before SPICLK high (clock polarity = 0)
0.5tc(SPC)S −10
0.125tc(SPC)S
tsu(SOMI-SPCL)S
Setup time, SPISOMI before SPICLK low (clock polarity = 1)
0.125tc(SPC)S
tv(SPCH-SOMI)S
Valid time, SPISOMI data valid after SPICLK high
(clock polarity =0)
0.75tc(SPC)S
tv(SPCL-SOMI)S
Valid time, SPISOMI data valid after SPICLK low
(clock polarity =1)
0.75tc(SPC)S
18§
21§
tsu(SIMO-SPCH)S
tsu(SIMO-SPCL)S
Pulse duration, SPICLK high (clock polarity = 0)
Pulse duration, SPICLK low (clock polarity = 0)
8tc(CO)
0.5tc(SPC)S −10
0.5tc(SPC)S −10
0.5tc(SPC)S −10
UNIT
ns
0.5tc(SPC)S
0.5tc(SPC)S
ns
0.5tc(SPC)S
0.5tc(SPC)S
ns
ns
ns
Setup time, SPISIMO before SPICLK high (clock polarity = 0)
0
Setup time, SPISIMO before SPICLK low (clock polarity = 1)
0
tv(SPCH-SIMO)S
Valid time, SPISIMO data valid after SPICLK high
(clock polarity = 0)
0.5tc(SPC)S
tv(SPCL-SIMO)S
Valid time, SPISIMO data valid after SPICLK low
(clock polarity = 1)
0.5tc(SPC)S
22§
MAX
ns
ns
† The MASTER / SLAVE bit (SPICTL.2) is cleared and the CLOCK PHASE bit (SPICTL.3) is set.
‡ tc = system clock cycle time = 1/CLKOUT = tc(CO)
§ The active edge of the SPICLK signal referenced is controlled by the CLOCK POLARITY bit (SPICCR.6).
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SPRS145J − JULY 2000 − REVISED NOVEMBER 2004
SPI slave mode timing parameters (continued)
12
SPICLK
(clock polarity = 0)
13
14
SPICLK
(clock polarity = 1)
17
18
SPISOMI
SPISOMI Data Is Valid
Data Valid
21
22
SPISIMO
SPISIMO Data
Must Be Valid
SPISTE†
† The SPISTE signal must be active before the SPI communication stream starts; the SPISTE signal must remain active until
the SPI communication stream is complete.
Figure 44. SPI Slave Mode External Timing (Clock Phase = 1)
98
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external memory interface read timing
switching characteristics over recommended operating conditions for an external memory
interface read at 40 MHz [H = 0.5tc(CO)] (see Figure 45)
PARAMETER
MIN
MAX
UNIT
td(COL-CNTL)
Delay time, CLKOUT low to control valid
4
ns
td(COL-CNTH)
Delay time, CLKOUT low to control inactive
5
ns
td(COL-A)RD
Delay time, CLKOUT low to address valid
8
ns
td(COH-RDL)
Delay time, CLKOUT high to RD strobe active
5
ns
td(COL-RDH)
Delay time, CLKOUT low to RD strobe inactive high
1
ns
td(COL-SL)
Delay time, CLKOUT low to STRB strobe active low
5
ns
td(COL-SH)
Delay time, CLKOUT low to STRB strobe inactive high
6
ns
td(WRN)
Delay time, W/R going low to R/W rising
5
ns
th(A)COL
Hold time, address valid after CLKOUT low
tsu(A)RD
th(A)RD
−8
2
ns
Setup time, address valid before RD strobe active low
H−7
ns
Hold time, address valid after RD strobe inactive high
0
ns
timing requirements [H = 0.5tc(CO)] (see Figure 45)
MIN
ta(A)
Access time, read data from address valid
ta(RD)
Access time, read data from RD low
tsu(D)RD
MAX
UNIT
2H −10
ns
H−7
ns
Setup time, read data before RD strobe inactive high
8
ns
th(D)RD
Hold time, read data after RD strobe inactive high
0
ns
th(AIV-D)
Hold time, read data after address invalid
0
ns
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SPRS145J − JULY 2000 − REVISED NOVEMBER 2004
external memory interface read timing (continued)
CLKOUT
td(COL−CNTL)
td(COL−CNTH)
PS, DS,
IS
td(COL−A)RD
td(COL−A)RD
th(A)COL
th(A)COL
A[0:15]
td(COH−RDL)
td(COL−RDH)
ta(A)
td(COH−RDL)
td(COL−RDH)
th(A)RD
RD
th(AIV−D)
tsu(A)RD
ta(A)
tsu(D)RD
td(WRN)
th(D)RD
ta(RD)
tsu(D)RD
th(D)RD
W/R
R/W
D[0:15]
td(COL−SL)
td(COL−SH)
STRB
Figure 45. Memory Interface Read/Read Timings
100
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external memory interface write timing
switching characteristics over recommended operating conditions for an external memory
interface write at 40 MHz [H = 0.5tc(CO)] (see Figure 46)
PARAMETER
td(COH-CNTL)
Delay time, CLKOUT high to control valid
td(COH-CNTH)
Delay time, CLKOUT high to control inactive
MIN
MAX
UNIT
4
ns
5
ns
10
ns
Delay time, CLKOUT high to R/W low
6
ns
td(COH-RWH)
Delay time, CLKOUT high to R/W high
6
ns
td(COL-WL)
Delay time, CLKOUT low to WE strobe active low
6
ns
td(COL-WH)
Delay time, CLKOUT low to WE strobe inactive high
6
ns
ten(D)COL
Enable time, data bus driven from CLKOUT low
td(COL-SL)
Delay time, CLKOUT low to STRB active low
6
ns
td(COL-SH)
td(COH-A)W
Delay time, CLKOUT high to address valid
td(COH-RWL)
−3
ns
Delay time, CLKOUT low to STRB inactive high
6
ns
td(WRN)
Delay time, W/R going low to R/W rising
5
ns
th(A)COLW
Hold time, address valid after CLKOUT low
tsu(A)W
Setup time, address valid before WE strobe active low
tsu(D)W
Setup time, write data before WE strobe inactive high
th(D)W
Hold time, write data after WE strobe inactive high
tdis(W-D)
Disable time, data bus high impedance from WE high
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−5
ns
H−9
ns
2H−17
ns
2
ns
5
ns
101
SPRS145J − JULY 2000 − REVISED NOVEMBER 2004
external memory interface write timing (continued)
CLKOUT
td(COH−CNTL)
td(COH−CNTH)
td(COH−CNTL)
PS, DS, IS
td(COH−A)W
th(A)COLW
A[0:15]
td(COH−RWL)
td(COH−RWH)
tsu(A)W
R/W
td(WRN)
W/R
td(COL−WH)
td(COL−WL)
td(COL−WH)
td(COL−WL)
WE
tdis(W-D)
ten(D)COL
ten(D)COL
tsu(D)W
th(D)W
tsu(D)W
th(D)W
D[0:15]
td(COL−SL)
td(COL−SL)
td(COL−SH)
td(COL−SH)
STRB
ENA_144
CLKOUT
2H
2H
VIS_OE
NOTE A: VIS_OE will be visible at pin 97 of LF2407A when ENA_144 is high along with BVIS bits (10,9 of WSGR register − [email protected]/O) set to
10 or 11. CLKOUT and VIS_OE indicate internal memory write cycles (program/data). During VIS_OE cycles, the external bus will be
driven. CLKOUT is to be used along with VIS_OE for trace capabilities.
Figure 46. Memory Interface Write/Write Timings
102
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external memory interface ready-on-read timing
switching characteristics over recommended operating conditions for an external memory
interface ready-on-read (see Figure 47)
PARAMETER
td(COL-A)RD
MIN
MAX
8
Delay time, CLKOUT low to address valid
UNIT
ns
timing requirements for an external memory interface ready-on-read (see Figure 47)
MIN
th(RDY)COH
Hold time, READY after CLKOUT high
tsu(D)RD
Setup time, read data before RD strobe inactive high
tv(RDY)ARD
Valid time, READY after address valid on read
tsu(RDY)COH
Setup time, READY before CLKOUT high
MAX
−3
UNIT
ns
8
ns
−2
22
ns
ns
CLKOUT
Wait Cycle
PS, DS, IS
td(COL−A)RD
A[0:15]
RD
tsu(D)RD
D[0:15]
STRB
tv(RDY)ARD
th(RDY)COH
READY†
tsu(RDY)COH
† The WSGR register must be programmed before the READY pin can be used. See the READY pin description for more details.
Figure 47. Ready-on-Read Timings
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SPRS145J − JULY 2000 − REVISED NOVEMBER 2004
external memory interface ready-on-read timing (continued)
timing requirements for an external memory interface ready-on-read with one software wait state
and one external wait state (see Figure 48)
MIN
MAX
UNIT
th(RDY)COH
Hold time, READY after CLKOUT high
H − 2.5
ns
tsu(RDY)COH
Setup time, READY before CLKOUT high
H − 9.5
ns
td(COL-A)RD
Delay time, CLKOUT low to address valid
SW = 1 cycle
8
EXW = 1 cycle
Read Cycle
CLKOUT
PS, DS, IS
td(COL-A)RD
A[0:15]
W/R
R/W
D[0:15]
STRB
th(RDY)COH
tsu(RDY)COH
READY
RD
Figure 48. Ready-on-Read Timings With One Software Wait (SW) State and
One External Wait (EXW) State
104
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ns
SPRS145J − JULY 2000 − REVISED NOVEMBER 2004
external memory interface ready-on-write timing
switching characteristics over recommended operating conditions for an external memory
interface ready-on-write (see Figure 49)
PARAMETER
td(COH-A)W
MIN
MAX
10
Delay time, CLKOUT high to address valid
UNIT
ns
timing requirements for an external memory interface ready-on-write [H = 0.5tc(CO)]
(see Figure 49)
MIN
th(RDY)COH
Hold time, READY after CLKOUT high
tsu(D)W
Setup time, write data before WE strobe inactive high
tv(RDY)AW
Valid time, READY after address valid on write
tsu(RDY)COH
Setup time, READY before CLKOUT high
MAX
UNIT
−3
ns
2H−17
ns
−3
22
ns
ns
CLKOUT
Wait Cycle
PS, DS, IS
td(COH−A)W
A[0:15]
WE
tsu(D)W
D[0:15]
STRB
tv(RDY)AW
tsu(RDY)COH
th(RDY)COH
READY
Figure 49. Ready-on-Write Timings
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105
SPRS145J − JULY 2000 − REVISED NOVEMBER 2004
external memory interface ready-on-write timing (continued)
timing requirements for an external memory interface ready-on-write with one software wait state
and one external wait state (see Figure 50)
MIN
MAX
UNIT
th(RDY)COH
Hold time, READY after CLKOUT high
H − 2.5
ns
tsu(RDY)COH
Setup time, READY before CLKOUT high
H − 9.5
ns
td(COH-A)W
Delay time, CLKOUT high to address valid
SW = 1 cycle
10
EXW = 1 cycle
Write Cycle
CLKOUT
PS, DS, IS
td(COH−A)W
A[0:15]
tsu(RDY)COH
th(RDY)COH
READY
R/W
WE
D[0:15]
STRB
Figure 50. Ready-on-Write Timings With One Software Wait (SW) State and
One External Wait (EXW) State
106
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ns
SPRS145J − JULY 2000 − REVISED NOVEMBER 2004
10-bit analog-to-digital converter (ADC)
The 10-bit ADC has a separate power bus for its analog circuitry. These pins are referred to as VCCA and VSSA.
The power bus isolation is to enhance ADC performance by preventing digital switching noise of the logic
circuitry that can be present on VSS and VCC from coupling into the ADC analog stage. All ADC specifications
are given with respect to VSSA unless otherwise noted.
Resolution . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10-bit (1024 values)
Monotonic . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Assured
Output conversion mode . . . . . . . . . . . . . . . . . . . 000h to 3FFh (000h for VI ≤ VREFLO; 3FFh for VI ≥ VREFHI)
Minimum conversion time (including sample time) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 500 ns
recommended operating conditions
MIN
VCCA
VSSA
Analog supply voltage
3.0
VREFHI
VREFLO
Analog supply reference source†
Analog ground reference source†
Analog ground
NOM
MAX
3.3
3.6
0
UNIT
V
V
‡
VCCA
VSSA
VAI
Analog input voltage, ADCIN00−ADCIN07
VREFLO
VREFHI
† VREFHI and VREFLO must be stable, within ±1/2 LSB of the required resolution, during the entire conversion time.
‡ VREFHI can be from 2.0 V to VCCA; however, the accuracy of the ADC depends on the ground bounce and noise on the target board.
V
V
V
ADC operating frequency
MIN
ADC operating frequency
4
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MAX
UNIT
30
MHz
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SPRS145J − JULY 2000 − REVISED NOVEMBER 2004
10-bit analog-to-digital converter (ADC) (continued)
operating characteristics over recommended operating condition ranges†
PARAMETER
DESCRIPTION
MIN
VCCA = 3.3 V
ICCA
Analog supply current
IADREFHI
VREFHI input current
IADCIN
Analog input leakage
VCCA = VREFHI = 3.3 V
TYP
MAX
10
15
mA
1
µA
1.5
mA
1
µA
PLL or OSC power
down
0.75
Non-sampling
10
Sampling
30
Cai
Analog input capacitance
Typical capacitive load on
analog input pin
td(PU)
Delay time, power-up to ADC valid
Time to stabilize analog stage after power-up
ZAI
Analog input source impedance
Analog input source impedance needed for
conversions to remain within specifications at min
tw(SH)
53
pF
10
µs
10
Ω
"2
Zero-offset error
UNIT
LSB
† Absolute resolution = 3.22 mV. At VREFHI = 3.3 V and VREFLO = 0 V, this is one LSB. As VREFHI decreases, VREFLO increases, or both, the LSB
size decreases. Therefore, the absolute accuracy and differential/integral linearity errors in terms of LSBs increase.
EDNL and EINL
PARAMETER
DESCRIPTION
CLKOUT
MIN
MAX
UNIT
EDNL‡
Differential nonlinearity error
Difference between the actual step width
and the ideal value
30 MHz
"2
LSB
EINL‡
Integral nonlinearity error
Maximum deviation from the best straight
line through the ADC transfer
characteristics, excluding the quantization
error
30 MHz
"2
LSB
‡ Test conditions: VREFHI = VCCA , VREFLO = VSSA
108
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10-bit analog-to-digital converter (ADC) (continued)
internal ADC module timing† (see Figure 51)
MIN
MAX
UNIT
tc(AD)
Cycle time, ADC prescaled clock
33.3
ns
tw(SHC)
Pulse duration, total sample/hold and
conversion time‡
500
ns
2tc(CO)
2tc(AD)§
ns
td(SOC-SH)
tw(SH)
Delay time, start of conversion to beginning of sample and hold
tw(C)
td(EOC)
Pulse duration, total conversion time
Pulse duration, sample and hold time
10tc(AD)
2tc(CO)
Delay time, end of conversion to data loaded into result register
32tc(AD)
ns
ns
ns
td(ADCINT)
Delay time, ADC flag to ADC interrupt
2tc(CO)
ns
† The ADC timing diagram represents a typical conversion sequence. See the ADC chapter in the TMS320LF/LC240xA DSP Controllers Reference
Guide: System and Peripherals (literature number SPRU357) for more details.
‡ The total sample/hold and conversion time is determined by the summation of td(SOC-SH), tw(SH), tw(C), and td(EOC) .
§ Can be varied by ACQ Prescaler bits in the ADCTRL1 register
tc(AD)
Bit Converted
9
8
7
6
5
4
3
2
1
0
ADC Clock
Analog Input
Á
Á Á
Á
tw(C)
EOC/Convert
tw(SH)
Internal Start/
Sample Hold
td(SOC−SH)
Start of Convert
td(EOC)
tw(SHC)
XFR to RESULTn
td(ADCINT)
ADC Interrupt
Figure 51. Analog-to-Digital Internal Module Timing
POST OFFICE BOX 1443
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109
SPRS145J − JULY 2000 − REVISED NOVEMBER 2004
Flash parameters @40 MHz CLOCKOUT†
PARAMETER
MIN
TYP
Erase time‡
ICCP (VCCP pin current)
UNIT
30
µs
Time/4K Sector
130
ms
Time/12K Sector
400
ms
Time/4K Sector
350
ms
Time/Word (16-bit)
Clear/Programming time‡
MAX
Time/12K Sector
1
Indicates the typical/maximum current consumption during the
Clear-Erase-Program (C-E-P) cycle
5
s
15
mA
† TI releases upgrades to the Flash algorithms for these devices; hence, these typical values are subject to change.
‡ The indicated time does not include the time it takes to load the C-E-P algorithm and the code (to be programmed) onto on-chip RAM. The values
specified are when VDD = 3.3 V and VCCP = 5 V, and any deviation from these values could affect the timing parameters. Aging and process variance
could also impact the timing parameters.
migrating from LF240xA (Flash) devices to LC240xA (ROM) devices
Table 18 outlines the differences between the LF240xA (Flash) devices and the LC240xA (ROM) devices.
These differences should be taken into consideration when migrating between the devices.
Table 18. Differences Between LF240xA (Flash) Devices and LC240xA (ROM) Devices
LF2406A
LC2406A
LC2404A
LF2403A
LF2402A
LC2402A
On-chip Flash or ROM
FEATURE
32K
32K
16K
16K
8K
6K
Single-Access RAM (SARAM)
(16-bit words)
2K
2K
1K
512
512
—
Boot ROM
Event Managers
Yes
—
—
Yes
Yes
—
EVA, EVB
EVA, EVB
EVA, EVB
EVA
EVA
EVA
ADC Channels
16
16
16
8
Yes
Yes
Yes
8
Yes§
8
SPI
—
—
CAN
Yes
Yes
—
Yes
—
—
GPIO Pins
41
41
41
21
21
21
BIO Pin
Yes
Yes
Yes
—
—
—
TDIRx Pin
Yes
Yes
Yes
—
—
—
5
5
5
3
3
3
External Interrupts
Access to External Memory Spaces
(NOTE: Application code should NOT
access Illegal/Reserved
addresses.)
VCCP Pin Functionality
Packaging
See Note 3
VCCP
100-pin
PZ
See Note 4
See Note 4
No Connect
No Connect
100-pin
PZ
100-pin
PZ
See Note 3
See Note 3
VCCP
64-pin
PAG
VCCP
64-pin
PG
See Note 4
No Connect
64-pin
PG, PAG
§ The SPISTE pin is not available on the LF2403A. See the SPI Slave Mode Operation in LF2403A section.
NOTES: 3. Access to external Program, Data, and I/O space is considered illegal and would assert an NMI.
4. The external Program and I/O spaces are implemented as “reserved” addresses and any access will not assert an NMI. However,
the external data memory space is illegal.
110
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migrating from 240x devices to 240xA devices
This section highlights the new features/migration issues of the 240xA devices (as compared to the 240x family)
and describes the impact these features/issues have on user applications.
maximum clock speed
240xA devices can operate at a maximum speed of 40 MHz compared to the 30-MHz operation of 240x devices.
This change in clock speed warrants a change in the register contents of all the peripherals. For example, to
maintain the same baud rate, the divisor values that are loaded to the SPI, SCI, and CAN registers must be
recalculated.
code security module
240xA devices incorporate a “code security module” which protects the contents of program memory from
unauthorized duplication. Passwords stored in password locations (PWL) 0040h to 0043h are used for this
purpose. Even if the code is not secured with passwords (i.e., PWL contains FFFFFFFFFFFFFFFFh), the PWL
must still be read to gain access to the program memory contents. Note that locations 0040h to 0043h were
available for user code in the 240x devices, which lack the “code security module”. In 240xA devices, these
locations are reserved for the passwords and are not available for the user code. Even if code security feature
is not used, these locations must be written with all ones. This fact must be borne in mind while submitting ROM
codes to TI.
input-qualifier circuitry
An input-qualifier circuitry qualifies the input signal to the CAP1–6 (QEP1−4), XINT1/2, ADCSOC, and
PDPINTA/B pins in the x240xA devices. The state of the internal input signal will change only after these pins
are high/low for 6 (12) clock edges. The user must hold the pin high/low for 6 (12) cycles to ensure that the device
see the level change. The increase in the pulse width of the signals used to excite these pins must be taken
into account while migrating from the 240x to the 240xA family.
Bit 6 of the SCSR2 register controls whether 6 clock edges (bit 6 = 0) or 12 clock edges (bit 6 = 1) are used
to block 5- or 11-cycle glitches. This bit is a “reserved” bit in 240x devices.
status of the PDPINTx pin
The current status of the PDPINTx pins is now reflected in bit 8 of the COMCONx registers. This bit is a
“reserved” bit in 240x devices.
operation of the IOPC0 pin
At reset, all LF240xA devices come up with the W/R/IOPC0 pin in W/R mode. On devices that lack an external
memory interface (e.g., LF2406A), W/R mode is not functional and MCRB.0 must be set to a 0 if the IOPC0
pin is to be used. The XMIF Hi-Z control bit (bit 4 of the SCSR2 register) is reserved in these devices and must
be written with a zero.
external pulldown resistor for TRST pin
An external pulldown resistor may be needed for the TRST pin in boards that operate in noisy environments.
Refer to the TRST pin description for more details.
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migrating from LF240x devices to LC240xA devices
When migrating from an “unsecured” Flash device (LF240x) to a “secured” ROM device (LC240xA), two
migration paths have to be taken into consideration:
D Migrating from a 240x device to a 240xA device (see the Migrating From 240x Devices to 240xA Devices
section)
D Migrating from a Flash (LF) device to a ROM (LC) device (see the Migrating From LF240xA (Flash) Devices
to LC240xA (ROM) Devices section)
112
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peripheral register description
Table 19 is a collection of all the programmable registers of the LF240xA/LC240xA and is provided as a quick
reference.
Table 19. LF240xA/LC240xA DSP Peripheral Register Description
ADDR
BIT 15
BIT 14
BIT 13
BIT 12
BIT 11
BIT 10
BIT 9
BIT 8
BIT 7
BIT 6
BIT 5
BIT 4
BIT 3
BIT 2
BIT 1
BIT 0
REG
DATA MEMORY SPACE
CPU STATUS REGISTERS
ARP
DP(7)
DP(6)
DP(5)
ARB
1
OV
OVM
1
INTM
DP(8)
DP(4)
DP(3)
DP(2)
DP(1)
DP(0)
CNF
TC
SXM
C
XF
1
1
ST0
1
ST1
1
1
PM
—
—
—
—
—
—
—
—
—
—
INT6 MASK
INT5 MASK
INT4 MASK
INT3 MASK
INT2 MASK
INT1 MASK
—
—
—
—
—
—
—
—
—
—
INT6 FLAG
INT5 FLAG
INT4 FLAG
INT3 FLAG
INT2 FLAG
INT1 FLAG
IRQ0.15
IRQ0.14
IRQ0.13
IRQ0.12
IRQ0.11
IRQ0.10
IRQ0.9
IRQ0.8
IRQ0.7
IRQ0.6
IRQ0.5
IRQ0.4
IRQ0.3
IRQ0.2
IRQ0.1
IRQ0.0
IRQ1.15
IRQ1.14
IRQ1.13
IRQ1.12
IRQ1.11
IRQ1.10
IRQ1.9
IRQ1.8
IRQ1.7
IRQ1.6
IRQ1.5
IRQ1.4
IRQ1.3
IRQ1.2
IRQ1.1
IRQ1.0
IRQ2.15
IRQ2.14
IRQ2.13
IRQ2.12
IRQ2.11
IRQ2.10
IRQ2.9
IRQ2.8
IRQ2.7
IRQ2.6
IRQ2.5
IRQ2.4
IRQ2.3
IRQ2.2
IRQ2.1
IRQ2.0
IAK0.15
IAK0.14
IAK0.13
IAK0.12
IAK0.11
IAK0.10
IAK0.9
IAK0.8
IAK0.7
IAK0.6
IAK0.5
IAK0.4
IAK0.3
IAK0.2
IAK0.1
IAK0.0
IAK1.15
IAK1.14
IAK1.13
IAK1.12
IAK1.11
IAK1.10
IAK1.9
IAK1.8
IAK1.7
IAK1.6
IAK1.5
IAK1.4
IAK1.3
IAK1.2
IAK1.1
IAK1.0
IAK2.15
IAK2.14
IAK2.13
IAK2.12
IAK2.11
IAK2.10
IAK2.9
IAK2.8
IAK2.7
IAK2.6
IAK2.5
IAK2.4
IAK2.3
IAK2.2
IAK2.1
IAK2.0
—
CLKSRC
LPM1
LPM0
CLK PS2
CLK PS1
CLK PS0
—
ADC CLKEN
SCI CLKEN
SPI CLKEN
CAN CLKEN
EVB CLKEN
EVA CLKEN
—
ILLADR
—
—
—
—
—
—
—
—
—
I/P
QUALIFIER
CLOCKS
WD
OVERRIDE
XMIF HI Z
BOOT_EN
MP/MC
DON
PON
GLOBAL MEMORY AND CPU INTERRUPT REGISTERS
00004h
00005h
00006h
Reserved
IMR
GREG
IFR
SYSTEM REGISTERS
07010h
07011h
07012h
07013h
07014h
07015h
07016h
07019h
PIACKR0
PIACKR1
PIACKR2
SCSR1
SCSR2
Illegal
DIN15
DIN14
DIN13
DIN12
DIN11
DIN10
DIN9
DIN8
DIN7
DIN6
DIN5
DIN4
DIN3
DIN2
DIN1
DIN0
V15
V14
V13
V12
V11
V10
V9
V8
V7
V6
V5
V4
V3
V2
V1
V0
0701Dh
0701Eh
PIRQR2
Illegal
0701Ah
to
0701Bh
0701Ch
PIRQR1
Illegal
07017h
07018h
PIRQR0
DINR
Illegal
0701Fh
PIVR
Illegal
Indicates change with respect to the F243/F241, C242 device register maps.
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peripheral register descriptions (continued)
Table 19. LF240xA/LC240xA DSP Peripheral Register Description (Continued)
ADDR
BIT 15
BIT 14
BIT 13
BIT 12
BIT 11
BIT 10
BIT 9
BIT 8
BIT 7
BIT 6
BIT 5
BIT 4
BIT 3
BIT 2
BIT 1
BIT 0
D3
D2
D1
D0
WDCNTR
D3
D2
D1
D0
WDKEY
WDCHK0
WDPS2
WDPS1
WDPS0
WDCR
REG
WD CONTROL REGISTERS
07020h
to
07022h
07023h
Illegal
D7
D6
D5
D4
07024h
07025h
Illegal
D7
D6
D5
D4
07026h
to
07028h
07029h
Illegal
WDFLAG
WDDIS
WDCHK2
WDCHK1
0702Ah
to
0703Fh
Illegal
SERIAL PERIPHERAL INTERFACE (SPI) CONFIGURATION CONTROL REGISTERS
07040h
SPI SW
RESET
CLOCK
POLARITY
—
—
SPI
CHAR3
SPI
CHAR2
SPI
CHAR1
SPI
CHAR0
SPICCR
07041h
—
—
—
OVERRUN
INT ENA
CLOCK
PHASE
MASTER/
SLAVE
TALK
SPI INT
ENA
SPICTL
07042h
RECEIVER
OVERRUN
FLAG
SPI INT
FLAG
TX BUF
FULL FLAG
—
—
—
—
—
SPISTS
—
SPI BIT
RATE 6
SPI BIT
RATE 5
SPI BIT
RATE 4
SPI BIT
RATE 3
SPI BIT
RATE 2
SPI BIT
RATE 1
SPI BIT
RATE 0
SPIBRR
ERXB15
ERXB14
ERXB13
ERXB12
ERXB11
ERXB10
ERXB9
ERXB8
ERXB7
ERXB6
ERXB5
ERXB4
ERXB3
ERXB2
ERXB1
ERXB0
RXB15
RXB14
RXB13
RXB12
RXB11
RXB10
RXB9
RXB8
RXB7
RXB6
RXB5
RXB4
RXB3
RXB2
RXB1
RXB0
TXB15
TXB14
TXB13
TXB12
TXB11
TXB10
TXB9
TXB8
TXB7
TXB6
TXB5
TXB4
TXB3
TXB2
TXB1
TXB0
SDAT15
SDAT14
SDAT13
SDAT12
SDAT11
SDAT10
SDAT9
SDAT8
SDAT7
SDAT6
SDAT5
SDAT4
SDAT3
SDAT2
SDAT1
SDAT0
—
—
—
—
07043h
07044h
Illegal
07045h
07046h
07047h
07048h
07049h
Illegal
0704Ah
to
0704Eh
0704Fh
SPIRXBUF
SPITXBUF
SPIDAT
Illegal
—
SPI
PRIORITY
SPI
SUSP SOFT
SPI
SUSP FREE
Indicates change with respect to the F243/F241, C242 device register maps.
114
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SPIPRI
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peripheral register descriptions (continued)
Table 19. LF240xA/LC240xA DSP Peripheral Register Description (Continued)
ADDR
BIT 15
BIT 14
BIT 13
BIT 12
BIT 11
BIT 10
BIT 9
BIT 8
BIT 7
BIT 6
BIT 5
BIT 4
BIT 3
BIT 2
BIT 1
BIT 0
REG
SERIAL COMMUNICATIONS INTERFACE (SCI) CONFIGURATION CONTROL REGISTERS
07050h
STOP
BITS
EVEN/ODD
PARITY
PARITY
ENABLE
LOOP BACK
ENA
ADDR/IDLE
MODE
SCI
CHAR2
SCI
CHAR1
SCI
CHAR0
SCICCR
07051h
—
RX ERR
INT ENA
SW RESET
—
TXWAKE
SLEEP
TXENA
RXENA
SCICTL1
07052h
BAUD15
(MSB)
BAUD14
BAUD13
BAUD12
BAUD11
BAUD10
BAUD9
BAUD8
SCIHBAUD
07053h
BAUD7
BAUD6
BAUD5
BAUD4
BAUD3
BAUD2
BAUD1
BAUD0
(LSB)
SCILBAUD
07054h
TXRDY
TX EMPTY
—
—
—
—
RX/BK
INT ENA
TX
INT ENA
SCICTL2
07055h
RX ERROR
RXRDY
BRKDT
FE
OE
PE
RXWAKE
—
SCIRXST
07056h
ERXDT7
ERXDT6
ERXDT5
ERXDT4
ERXDT3
ERXDT2
ERXDT1
ERXDT0
SCIRXEMU
07057h
RXDT7
RXDT6
RXDT5
RXDT4
RXDT3
RXDT2
RXDT1
RXDT0
SCIRXBUF
TXDT2
TXDT1
TXDT0
SCITXBUF
—
—
—
07058h
07059h
Illegal
TXDT7
TXDT6
TXDT5
TXDT4
0705Ah
to
0705Eh
0705Fh
TXDT3
Illegal
—
SCITX
PRIORITY
SCIRX
PRIORITY
SCI
SOFT
07060h
to
0706Fh
SCI
FREE
SCIPRI
Illegal
EXTERNAL INTERRUPT CONTROL REGISTERS
XINT1
FLAG
—
—
—
—
—
—
—
—
—
—
—
—
XINT1
POLARITY
XINT1
PRIORITY
XINT1
ENA
XINT2
FLAG
—
—
—
—
—
—
—
—
—
—
—
—
XINT2
POLARITY
XINT2
PRIORITY
XINT2
ENA
07070h
07071h
07072h
to
0708Fh
XINT1CR
XINT2CR
Illegal
DIGITAL I/O CONTROL REGISTERS
07090h
MCRA.15
MCRA.14
MCRA.13
MCRA.12
MCRA.11
MCRA.10
MCRA.9
MCRA.8
MCRA.7
MCRA.6
MCRA.5
MCRA.4
MCRA.3
MCRA.2
MCRA.1
MCRA.0
MCRB.15
MCRB.14
MCRB.13
MCRB.12
MCRB.11
MCRB.10
MCRB.9
MCRB.8
MCRB.7
MCRB.6
MCRB.5
MCRB.4
MCRB.3
MCRB.2
MCRB.1
MCRB.0
MCRC.15
MCRC.14
MCRC.13
MCRC.12
MCRC.11
MCRC.10
MCRC.9
MCRC.8
MCRC.7
MCRC.6
MCRC.5
MCRC.4
MCRC.3
MCRC.2
MCRC.1
MCRC.0
E7DIR
E6DIR
E5DIR
E4DIR
E3DIR
E2DIR
E1DIR
E0DIR
IOPE7
IOPE6
IOPE5
IOPE4
IOPE3
IOPE2
IOPE1
IOPE0
07091h
07092h
Illegal
07093h
07094h
07095h
MCRA
MCRB
Illegal
MCRC
PEDATDIR
Indicates change with respect to the F243/F241, C242 device register maps.
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peripheral register descriptions (continued)
Table 19. LF240xA/LC240xA DSP Peripheral Register Description (Continued)
ADDR
BIT 15
BIT 14
BIT 13
BIT 12
BIT 11
BIT 10
BIT 9
BIT 8
BIT 7
BIT 6
BIT 5
BIT 4
BIT 3
BIT 2
BIT 1
BIT 0
REG
DIGITAL I/O CONTROL REGISTERS (CONTINUED)
07096h
07098h
—
F6DIR
F5DIR
F4DIR
F3DIR
F2DIR
F1DIR
F0DIR
—
IOPF6
IOPF5
IOPF4
IOPF3
IOPF2
IOPF1
IOPF0
A7DIR
A6DIR
A5DIR
A4DIR
A3DIR
A2DIR
A1DIR
A0DIR
IOPA7
IOPA6
IOPA5
IOPA4
IOPA3
IOPA2
IOPA1
IOPA0
B7DIR
B6DIR
B5DIR
B4DIR
B3DIR
B2DIR
B1DIR
B0DIR
IOPB7
IOPB6
IOPB5
IOPB4
IOPB3
IOPB2
IOPB1
IOPB0
07099h
0709Ah
PBDATDIR
Illegal
C7DIR
C6DIR
C5DIR
C4DIR
C3DIR
C2DIR
C1DIR
C0DIR
IOPC7
IOPC6
IOPC5
IOPC4
IOPC3
IOPC2
IOPC1
IOPC0
—
—
—
—
—
—
—
D0DIR
—
—
—
—
—
—
—
IOPD0
0709Dh
0709Eh
PADATDIR
Illegal
0709Bh
0709Ch
PFDATDIR
PCDATDIR
Illegal
0709Fh
PDDATDIR
Illegal
ANALOG-TO-DIGITAL CONVERTER (ADC) REGISTERS
070A0h
070A1h
070A2h
070A3h
070A4h
070A5h
070A6h
070A7h
070A8h
070A9h
070AAh
—
ADC
S/W RESET
SOFT
FREE
ACQ
PRESCALE3
ACQ
PRESCALE2
ACQ
PRESCALE1
ACQ
PRESCALE0
CONV PRESCALE (CPS)
CONTINUOUS RUN
INT
PRIORITY
SEQ1/2
CASCADE
—
—
—
—
EVB SOC
EN SEQ1
RESET
SEQ1
SOC SEQ1
SEQ1 BUSY
INT ENA
SEQ1 Mode1
INT ENA
SEQ1 Mode0
INT FLAG
SEQ1
EVA SOC
EN SEQ1
EXT SOC
EN SEQ1
Reset SEQ2
SOC SEQ2
SEQ2 BUSY
INT ENA
SEQ2 Mode1
INT ENA
SEQ2 Mode0
INT FLAG
SEQ2
EVB SOC
EN SEQ2
ADCTRL1
—
—
—
—
—
—
—
—
—
MAXCONV2
2
MAXCONV2
1
MAXCONV2
0
MAXCONV1
3
MAXCONV1
2
MAXCONV1
1
MAXCONV1
0
CONV 3
CONV 3
CONV 3
CONV 3
CONV 2
CONV 2
CONV 2
CONV 2
CONV 1
CONV 1
CONV 1
CONV 1
CONV 0
CONV 0
CONV 0
CONV 0
CONV 7
CONV 7
CONV 7
CONV 7
CONV 6
CONV 6
CONV 6
CONV 6
CONV 5
CONV 5
CONV 5
CONV 5
CONV 4
CONV 4
CONV 4
CONV 4
CONV 11
CONV 11
CONV 11
CONV 11
CONV 10
CONV 10
CONV 10
CONV 10
CONV 9
CONV 9
CONV 9
CONV 9
CONV 8
CONV 8
CONV 8
CONV 8
CONV 15
CONV 15
CONV 15
CONV 15
CONV 14
CONV 14
CONV 14
CONV 14
CONV 13
CONV 13
CONV 13
CONV 13
CONV 12
CONV 12
CONV 12
CONV 12
—
—
—
—
SEQ CNTR3
SEQ CNTR2
SEQ CNTR1
SEQ CNTR0
SEQ2
STATE 3
SEQ2
STATE 2
SEQ2
STATE 1
SEQ2
STATE 0
SEQ1
STATE 3
SEQ1
STATE 2
SEQ1
STATE 1
SEQ1
STATE 0
D9
D8
D7
D6
D5
D4
D3
D2
D1
D0
0
0
0
0
0
0
D9
D8
D7
D6
D5
D4
D3
D2
D1
D0
0
0
0
0
0
0
D9
D8
D7
D6
D5
D4
D3
D2
D1
D0
0
0
0
0
0
0
Indicates change with respect to the F243/F241, C242 device register maps.
116
POST OFFICE BOX 1443
• HOUSTON, TEXAS 77251−1443
ADCTRL2
MAXCONV
CHSELSEQ1
CHSELSEQ2
CHSELSEQ3
CHSELSEQ4
AUTO_SEQ_SR
RESULT0
RESULT1
RESULT2
SPRS145J − JULY 2000 − REVISED NOVEMBER 2004
peripheral register descriptions (continued)
Table 19. LF240xA/LC240xA DSP Peripheral Register Description (Continued)
ADDR
BIT 15
BIT 14
BIT 13
BIT 12
BIT 11
BIT 10
BIT 9
BIT 8
BIT 7
BIT 6
BIT 5
BIT 4
BIT 3
BIT 2
BIT 1
BIT 0
REG
ANALOG-TO-DIGITAL CONVERTER (ADC) REGISTERS (CONTINUED)
070ABh
070ACh
070ADh
070AEh
070AFh
070B0h
070B1h
070B2h
070B3h
070B4h
070B5h
070B6h
070B7h
D9
D8
D7
D6
D5
D4
D3
D2
D1
D0
0
0
0
0
0
0
D9
D8
D7
D6
D5
D4
D3
D2
D1
D0
0
0
0
0
0
0
D9
D8
D7
D6
D5
D4
D3
D2
D1
D0
0
0
0
0
0
0
D9
D8
D7
D6
D5
D4
D3
D2
D1
D0
0
0
0
0
00
0
D9
D8
D7
D6
D5
D4
D3
D2
D1
D0
0
0
0
0
0
0
D9
D8
D7
D6
D5
D4
D3
D2
D1
D0
0
0
0
0
0
0
D9
D8
D7
D6
D5
D4
D3
D2
D1
D0
0
0
0
0
0
0
D9
D8
D7
D6
D5
D4
D3
D2
D1
D0
0
0
0
0
0
0
D9
D8
D7
D6
D5
D4
D3
D2
D1
D0
0
0
0
0
0
0
D9
D8
D7
D6
D5
D4
D3
D2
D1
D0
0
0
0
0
0
0
D9
D8
D7
D6
D5
D4
D3
D2
D1
D0
0
0
0
0
0
0
D9
D8
D7
D6
D5
D4
D3
D2
D1
D0
0
0
0
0
0
0
D9
D8
D7
D6
D5
D4
D3
D2
D1
D0
0
0
0
0
0
0
070B8h
Reserved
070B9h
to
070FFh
Illegal
RESULT3
RESULT4
RESULT5
RESULT6
RESULT7
RESULT8
RESULT9
RESULT10
RESULT11
RESULT12
RESULT13
RESULT14
RESULT15
CONTROLLER AREA NETWORK (CAN) CONFIGURATION CONTROL REGISTERS
07100h
07101h
07102h
07103h
07104h
—
—
—
—
—
—
—
—
MD3
MD2
ME5
ME4
ME3
ME2
ME1
ME0
TA5
TA4
TA3
TA2
AA5
AA4
AA3
AA2
TRS5
TRS4
TRS3
TRS2
TRR5
TRR4
TRR3
TRR2
RFP3
RFP2
RFP1
RFP0
RML3
RML2
RML1
RML0
RMP3
RMP2
RMP1
RMP0
OPC3
OPC2
OPC1
OPC0
—
—
SUSP
CCR
PDR
DBO
WUBA
CDR
ABO
STM
—
—
—
—
MBNR1
MBNR0
—
—
—
—
—
—
—
—
BRP7
BRP6
BRP5
BRP4
BRP3
BRP2
BRP1
BRP0
MDER
TCR
RCR
MCR
BCR2
Indicates change with respect to the F243/F241, C242 device register maps.
POST OFFICE BOX 1443
• HOUSTON, TEXAS 77251−1443
117
SPRS145J − JULY 2000 − REVISED NOVEMBER 2004
peripheral register descriptions (continued)
Table 19. LF240xA/LC240xA DSP Peripheral Register Description (Continued)
ADDR
BIT 15
BIT 14
BIT 13
BIT 12
BIT 11
BIT 10
BIT 9
BIT 8
BIT 7
BIT 6
BIT 5
BIT 4
BIT 3
BIT 2
BIT 1
BIT 0
REG
CONTROLLER AREA NETWORK (CAN) CONFIGURATION CONTROL REGISTERS (CONTINUED)
07105h
07106h
07107h
07108h
07109h
0710Ah
0710Bh
0710Ch
0710Dh
0710Eh
—
—
—
—
—
SBG
SJW1
SJW0
SAM
TSEG1−3
TSEG1−2
TSEG1−1
TSEG1−0
TSEG2−2
TSEG2−1
TSEG2−0
—
—
—
—
—
—
—
FER
BEF
SA1
CRCE
SER
ACKE
BO
EP
EW
—
—
—
—
—
—
—
—
—
—
SMA
CCE
PDA
—
RM
TM
TEC7
TEC6
TEC5
TEC4
TEC3
TEC2
TEC1
TEC0
REC7
REC6
REC5
REC4
REC3
REC2
REC1
REC0
—
—
MIF5
MIF4
MIF3
MIF2
MIF1
MIF0
—
RMLIF
AAIF
WDIF
WUIF
BOIF
EPIF
WLIF
MIL
—
MIM5
MIM4
MIM3
MIM2
MIM1
MIM0
EIL
RMLIM
AAIM
WDIM
WUIM
BOIM
EPIM
WLIM
LAMI
—
—
LAM0−28
LAM0−27
LAM0−26
LAM0−25
LAM0−24
LAM0−23
LAM0−22
LAM0−21
LAM0−20
LAM0−19
LAM0−18
LAM0−17
LAM0−16
LAM0−15
LAM0−14
LAM0−13
LAM0−12
LAM0−11
LAM0−10
LAM0−9
LAM0−8
LAM0−7
LAM0−6
LAM0−5
LAM0−4
LAM0−3
LAM0−2
LAM0−1
LAM0−0
LAMI
—
—
LAM1−28
LAM1−27
LAM1−26
LAM1−25
LAM1−24
LAM1−23
LAM1−22
LAM1−21
LAM1−20
LAM1−19
LAM1−18
LAM1−17
LAM1−16
LAM1−15
LAM1−14
LAM1−13
LAM1−12
LAM1−11
LAM1−10
LAM1−9
LAM1−8
LAM1−7
LAM1−6
LAM1−5
LAM1−4
LAM1−3
LAM1−2
LAM1−1
LAM1−0
0710Fh
to
071FFh
BCR1
ESR
GSR
CEC
CAN_IFR
CAN_IMR
LAM0_H
LAM0_L
LAM1_H
LAM1_L
Illegal
Message Object #0
07200h
07201h
07202h
IDL−15
IDL−14
IDL−13
IDL−12
IDL−11
IDL−10
IDL−9
IDL−8
IDL−7
IDL−6
IDL−5
IDL−4
IDL−3
IDL−2
IDL−1
IDL−0
IDE
AME
AAM
IDH−28
IDH−27
IDH−26
IDH−25
IDH−24
IDH−23
IDH−22
IDH−21
IDH−20
IDH−19
IDH−18
IDH−17
IDH−16
—
—
—
—
—
—
—
—
—
—
—
RTR
DLC3
DLC2
DLC1
DLC0
D15
D14
D13
D12
D11
D10
D9
D8
D7
D6
D5
D4
D3
D2
D1
D0
D15
D14
D13
D12
D11
D10
D9
D8
D7
D6
D5
D4
D3
D2
D1
D0
D15
D14
D13
D12
D11
D10
D9
D8
D7
D6
D5
D4
D3
D2
D1
D0
D15
D14
D13
D12
D11
D10
D9
D8
D7
D6
D5
D4
D3
D2
D1
D0
07203h
07204h
07205h
07206h
07207h
MSGID0H
MSGCTRL0
Reserved
Indicates change with respect to the F243/F241, C242 device register maps.
118
MSGID0L
POST OFFICE BOX 1443
• HOUSTON, TEXAS 77251−1443
MBX0A
MBX0B
MBX0C
MBX0D
SPRS145J − JULY 2000 − REVISED NOVEMBER 2004
peripheral register descriptions (continued)
Table 19. LF240xA/LC240xA DSP Peripheral Register Description (Continued)
ADDR
BIT 15
BIT 14
BIT 13
BIT 12
BIT 11
BIT 10
BIT 9
BIT 8
BIT 7
BIT 6
BIT 5
BIT 4
BIT 3
BIT 2
BIT 1
BIT 0
REG
CONTROLLER AREA NETWORK (CAN) CONFIGURATION CONTROL REGISTERS (CONTINUED)
Message Object #1
07208h
07209h
0720Ah
IDL−15
IDL−14
IDL−13
IDL−12
IDL−11
IDL−10
IDL−9
IDL−8
IDL−7
IDL−6
IDL−5
IDL−4
IDL−3
IDL−2
IDL−1
IDL−0
IDE
AME
AAM
IDH−28
IDH−27
IDH−26
IDH−25
IDH−24
IDH−23
IDH−22
IDH−21
IDH−20
IDH−19
IDH−18
IDH−17
IDH−16
—
—
—
—
—
—
—
—
—
—
—
RTR
DLC3
DLC2
DLC1
DLC0
D15
D14
D13
D12
D11
D10
D9
D8
D7
D6
D5
D4
D3
D2
D1
D0
D15
D14
D13
D12
D11
D10
D9
D8
D7
D6
D5
D4
D3
D2
D1
D0
D15
D14
D13
D12
D11
D10
D9
D8
D7
D6
D5
D4
D3
D2
D1
D0
D15
D14
D13
D12
D11
D10
D9
D8
D7
D6
D5
D4
D3
D2
D1
D0
IDL−15
IDL−14
IDL−13
IDL−12
IDL−11
IDL−10
IDL−9
IDL−8
IDL−7
IDL−6
IDL−5
IDL−4
IDL−3
IDL−2
IDL−1
IDL−0
0720Bh
0720Ch
0720Dh
0720Eh
0720Fh
MSGID1L
MSGID1H
MSGCTRL1
Reserved
MBX1A
MBX1B
MBX1C
MBX1D
Message Object #2
07210h
07211h
07212h
IDE
AME
AAM
IDH−28
IDH−27
IDH−26
IDH−25
IDH−24
IDH−23
IDH−22
IDH−21
IDH−20
IDH−19
IDH−18
IDH−17
IDH−16
—
—
—
—
—
—
—
—
—
—
—
RTR
DLC3
DLC2
DLC1
DLC0
D15
D14
D13
D12
D11
D10
D9
D8
D7
D6
D5
D4
D3
D2
D1
D0
D15
D14
D13
D12
D11
D10
D9
D8
D7
D6
D5
D4
D3
D2
D1
D0
D15
D14
D13
D12
D11
D10
D9
D8
D7
D6
D5
D4
D3
D2
D1
D0
D15
D14
D13
D12
D11
D10
D9
D8
D7
D6
D5
D4
D3
D2
D1
D0
IDL−15
IDL−14
IDL−13
IDL−12
IDL−11
IDL−10
IDL−9
IDL−8
IDL−7
IDL−6
IDL−5
IDL−4
IDL−3
IDL−2
IDL−1
IDL−0
07213h
07214h
07215h
07216h
07217h
MSGID2L
MSGID2H
MSGCTRL2
Reserved
MBX2A
MBX2B
MBX2C
MBX2D
Message Object #3
07218h
07219h
0721Ah
IDE
AME
AAM
IDH−28
IDH−27
IDH−26
IDH−25
IDH−24
IDH−23
IDH−22
IDH−21
IDH−20
IDH−19
IDH−18
IDH−17
IDH−16
—
—
—
—
—
—
—
—
—
—
—
RTR
DLC3
DLC2
DLC1
DLC0
D15
D14
D13
D12
D11
D10
D9
D8
D7
D6
D5
D4
D3
D2
D1
D0
0721Bh
0721Ch
MSGID3L
MSGID3H
MSGCTRL3
Reserved
MBX3A
Indicates change with respect to the F243/F241, C242 device register maps.
POST OFFICE BOX 1443
• HOUSTON, TEXAS 77251−1443
119
SPRS145J − JULY 2000 − REVISED NOVEMBER 2004
peripheral register descriptions (continued)
Table 19. LF240xA/LC240xA DSP Peripheral Register Description (Continued)
ADDR
BIT 15
BIT 14
BIT 13
BIT 12
BIT 11
BIT 10
BIT 9
BIT 8
BIT 7
BIT 6
BIT 5
BIT 4
BIT 3
BIT 2
BIT 1
BIT 0
REG
CONTROLLER AREA NETWORK (CAN) CONFIGURATION CONTROL REGISTERS (CONTINUED)
0721Dh
0721Eh
0721Fh
D15
D14
D13
D12
D11
D10
D9
D8
D7
D6
D5
D4
D3
D2
D1
D0
D15
D14
D13
D12
D11
D10
D9
D8
D7
D6
D5
D4
D3
D2
D1
D0
D15
D14
D13
D12
D11
D10
D9
D8
D7
D6
D5
D4
D3
D2
D1
D0
MBX3B
MBX3C
MBX3D
Message Object #4
07220h
07221h
07222h
IDL−15
IDL−14
IDL−13
IDL−12
IDL−11
IDL−10
IDL−9
IDL−8
IDL−7
IDL−6
IDL−5
IDL−4
IDL−3
IDL−2
IDL−1
IDL−0
IDE
AME
AAM
IDH−28
IDH−27
IDH−26
IDH−25
IDH−24
IDH−23
IDH−22
IDH−21
IDH−20
IDH−19
IDH−18
IDH−17
IDH−16
—
—
—
—
—
—
—
—
—
—
—
RTR
DLC3
DLC2
DLC1
DLC0
D15
D14
D13
D12
D11
D10
D9
D8
D7
D6
D5
D4
D3
D2
D1
D0
D15
D14
D13
D12
D11
D10
D9
D8
D7
D6
D5
D4
D3
D2
D1
D0
D15
D14
D13
D12
D11
D10
D9
D8
D7
D6
D5
D4
D3
D2
D1
D0
D15
D14
D13
D12
D11
D10
D9
D8
D7
D6
D5
D4
D3
D2
D1
D0
IDL−15
IDL−14
IDL−13
IDL−12
IDL−11
IDL−10
IDL−9
IDL−8
IDL−7
IDL−6
IDL−5
IDL−4
IDL−3
IDL−2
IDL−1
IDL−0
07223h
07224h
07225h
07226h
07227h
MSGID4L
MSGID4H
MSGCTRL4
Reserved
MBX4A
MBX4B
MBX4C
MBX4D
Message Object #5
07228h
07229h
0722Ah
IDE
AME
AAM
IDH−28
IDH−27
IDH−26
IDH−25
IDH−24
IDH−23
IDH−22
IDH−21
IDH−20
IDH−19
IDH−18
IDH−17
IDH−16
—
—
—
—
—
—
—
—
—
—
—
RTR
DLC3
DLC2
DLC1
DLC0
D15
D14
D13
D12
D11
D10
D9
D8
D7
D6
D5
D4
D3
D2
D1
D0
D15
D14
D13
D12
D11
D10
D9
D8
D7
D6
D5
D4
D3
D2
D1
D0
D15
D14
D13
D12
D11
D10
D9
D8
D7
D6
D5
D4
D3
D2
D1
D0
D15
D14
D13
D12
D11
D10
D9
D8
D7
D6
D5
D4
D3
D2
D1
D0
0722Bh
0722Ch
0722Dh
0722Eh
0722Fh
MSGID5H
MSGCTRL5
Reserved
07230h
to
073FFh
Illegal
Indicates change with respect to the F243/F241, C242 device register maps.
120
MSGID5L
POST OFFICE BOX 1443
• HOUSTON, TEXAS 77251−1443
MBX5A
MBX5B
MBX5C
MBX5D
SPRS145J − JULY 2000 − REVISED NOVEMBER 2004
peripheral register descriptions (continued)
Table 19. LF240xA/LC240xA DSP Peripheral Register Description (Continued)
ADDR
BIT 15
BIT 14
BIT 13
BIT 12
BIT 11
BIT 10
BIT 9
BIT 8
BIT 7
BIT 6
BIT 5
BIT 4
BIT 3
BIT 2
BIT 1
BIT 0
REG
GENERAL-PURPOSE (GP) TIMER CONFIGURATION CONTROL REGISTERS − EVA
07400h
07401h
07402h
07403h
07404h
07405h
07406h
07407h
07408h
—
T2STAT
T1TOADC(0)
TCOMPOE
T1STAT
—
T2TOADC
D15
D14
D13
D12
D11
D10
D9
D8
D7
D6
D5
D4
D3
D2
D1
D0
D15
D14
D13
D12
D11
D10
D9
D8
D7
D6
D5
D4
D3
D2
D1
D0
D15
D14
D13
D12
D11
D10
D9
D8
D7
D6
D5
D4
D3
D2
D1
D0
FREE
SOFT
—
TMODE1
TMODE0
TPS2
TPS1
TPS0
—
TENABLE
TCLKS1
TCLKS0
TCLD1
TCLD0
TECMPR
—
D15
D14
D13
D12
D11
D10
D9
D8
D7
D6
D5
D4
D3
D2
D1
D0
D15
D14
D13
D12
D11
D10
D9
D8
D7
D6
D5
D4
D3
D2
D1
D0
D15
D14
D13
D12
D11
D10
D9
D8
D7
D6
D5
D4
D3
D2
D1
D0
FREE
SOFT
—
TMODE1
TMODE0
TPS2
TPS1
TPS0
T2SWT1
TENABLE
TCLKS1
TCLKS0
TCLD1
TCLD0
TECMPR
SELT1PR
—
T1TOADC(1)
T2PIN
07409h
to
07410h
GPTCONA
T1PIN
T1CNT
T1CMPR
T1PR
T1CON
T2CNT
T2CMPR
T2PR
T2CON
Illegal
FULL AND SIMPLE COMPARE UNIT REGISTERS − EVA
CENABLE
CLD1
CLD0
SVENABLE
ACTRLD1
ACTRLD0
FCOMPOE
PDPINTA
STATUS
—
—
—
—
—
—
—
—
SVRDIR
D2
D1
D0
CMP6ACT1
CMP6ACT0
CMP5ACT1
CMP5ACT0
CMP4ACT1
CMP4ACT0
CMP3ACT1
CMP3ACT0
CMP2ACT1
CMP2ACT0
CMP1ACT1
CMP1ACT0
—
—
—
—
DBT3
DBT2
DBT1
DBT0
EDBT3
EDBT2
EDBT1
DBTPS2
DBTPS1
DBTPS0
—
—
D15
D14
D13
D12
D11
D10
D9
D8
D7
D6
D5
D4
D3
D2
D1
D0
D15
D14
D13
D12
D11
D10
D9
D8
D7
D6
D5
D4
D3
D2
D1
D0
D15
D14
D13
D12
D11
D10
D9
D8
D7
D6
D5
D4
D3
D2
D1
D0
07411h
07412h
07413h
Illegal
07414h
07415h
07418h
07419h
0741Ah
to
0741Fh
ACTRA
Illegal
07416h
07417h
COMCONA
DBTCONA
Illegal
CMPR1
CMPR2
CMPR3
Illegal
Indicates change with respect to the F243/F241, C242 device register maps.
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121
SPRS145J − JULY 2000 − REVISED NOVEMBER 2004
peripheral register descriptions (continued)
Table 19. LF240xA/LC240xA DSP Peripheral Register Description (Continued)
ADDR
BIT 15
BIT 14
BIT 13
BIT 12
BIT 11
BIT 10
BIT 9
BIT 8
BIT 7
BIT 6
BIT 5
BIT 4
BIT 3
BIT 2
BIT 1
BIT 0
CAP3TSEL
CAP12TSEL
REG
CAPTURE UNIT REGISTERS − EVA
CAPRES
07420h
CAPQEPN
CAP3EN
CAP1EDGE
CAP2EDGE
—
CAP3FIFO
CAP3EDGE
07421h
07422h
07423h
07424h
07425h
07428h
07429h
CAP3TOADC
CAPCONA
—
Illegal
CAP2FIFO
CAP1FIFO
—
—
—
—
—
—
—
—
D15
D14
D13
D12
D11
D10
D9
D8
D7
D6
D5
D4
D3
D2
D1
D0
D15
D14
D13
D12
D11
D10
D9
D8
D7
D6
D5
D4
D3
D2
D1
D0
D15
D14
D13
D12
D11
D10
D9
D8
D7
D6
D5
D4
D3
D2
D1
D0
D15
D14
D13
D12
D11
D10
D9
D8
D7
D6
D5
D4
D3
D2
D1
D0
D15
D14
D13
D12
D11
D10
D9
D8
D7
D6
D5
D4
D3
D2
D1
D0
D15
D14
D13
D12
D11
D10
D9
D8
D7
D6
D5
D4
D3
D2
D1
D0
07426h
07427h
—
CAPFIFOA
CAP1FIFO
CAP2FIFO
CAP3FIFO
Illegal
0742Ah
to
0742Bh
CAP1FBOT
CAP2FBOT
CAP3FBOT
Illegal
EVENT MANAGER (EVA) INTERRUPT CONTROL REGISTERS
0742Ch
0742Dh
0742Eh
0742Fh
07430h
07431h
—
—
—
—
—
T1OFINT
ENA
T1UFINT
ENA
T1CINT
ENA
T1PINT
ENA
—
—
—
CMP3INT
ENA
CMP2INT
ENA
CMP1INT
ENA
PDPINTA
ENA
—
—
—
—
—
—
—
—
T2UFINT
ENA
T2CINT
ENA
T2PINT
ENA
—
—
—
—
T2OFINT
ENA
—
—
—
—
—
—
—
—
CAP2INT
ENA
CAP1INT
ENA
—
—
—
—
—
CAP3INT
ENA
—
—
—
—
—
T1OFINT
FLAG
T1UFINT
FLAG
T1CINT
FLAG
T1PINT
FLAG
—
—
—
CMP3INT
FLAG
CMP2INT
FLAG
CMP1INT
FLAG
PDPINTA
FLAG
—
—
—
—
—
—
—
—
T2UFINT
FLAG
T2CINT
FLAG
T2PINT
FLAG
—
—
—
—
T2OFINT
FLAG
—
—
—
—
—
—
—
—
—
CAP3INT
FLAG
CAP2INT
FLAG
CAP1INT
FLAG
—
—
—
—
07432h
to
074FFh
Illegal
Indicates change with respect to the F243/F241, C242 device register maps.
122
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EVAIMRA
EVAIMRB
EVAIMRC
EVAIFRA
EVAIFRB
EVAIFRC
SPRS145J − JULY 2000 − REVISED NOVEMBER 2004
peripheral register descriptions (continued)
Table 19. LF240xA/LC240xA DSP Peripheral Register Description (Continued)
ADDR
BIT 15
BIT 14
BIT 13
BIT 12
BIT 11
BIT 10
BIT 9
BIT 8
BIT 7
BIT 6
BIT 5
BIT 4
BIT 3
BIT 2
BIT 1
BIT 0
REG
GENERAL-PURPOSE (GP) TIMER CONFIGURATION CONTROL REGISTERS − EVB
07500h
07501h
07502h
07503h
07504h
07505h
07506h
07507h
07508h
—
T4STAT
T3TOADC(0)
TCOMPOEB
T3STAT
—
T4TOADC
D15
D14
D13
D12
D11
D10
D9
D8
D7
D6
D5
D4
D3
D2
D1
D0
D15
D14
D13
D12
D11
D10
D9
D8
D7
D6
D5
D4
D3
D2
D1
D0
D15
D14
D13
D12
D11
D10
D9
D8
D7
D6
D5
D4
D3
D2
D1
D0
FREE
SOFT
—
TMODE1
TMODE0
TPS2
TPS1
TPS0
—
TENABLE
TCLKS1
TCLKS0
TCLD1
TCLD0
TECMPR
—
D15
D14
D13
D12
D11
D10
D9
D8
D7
D6
D5
D4
D3
D2
D1
D0
D15
D14
D13
D12
D11
D10
D9
D8
D7
D6
D5
D4
D3
D2
D1
D0
D15
D14
D13
D12
D11
D10
D9
D8
D7
D6
D5
D4
D3
D2
D1
D0
FREE
SOFT
—
TMODE1
TMODE0
TPS2
TPS1
TPS0
T4SWT3
TENABLE
TCLKS1
TCLKS0
TCLD1
TCLD0
TECMPR
SELT3PR
—
T3TOADC(1)
T4PIN
07509h
to
07510h
GPTCONB
T3PIN
T3CNT
T3CMPR
T3PR
T3CON
T4CNT
T4CMPR
T4PR
T4CON
Reserved
FULL AND SIMPLE COMPARE UNIT REGISTERS− EVB
CENABLE
CLD1
CLD0
SVENABLE
ACTRLD1
ACTRLD0
FCOMPOEB
PDPINTB
STATUS
—
—
—
—
—
—
—
—
SVRDIR
D2
D1
D0
CMP12ACT1
CMP12ACT0
CMP11ACT1
CMP11ACT0
CMP10ACT1
CMP10ACT0
CMP9ACT1
CMP9ACT0
CMP8ACT1
CMP8ACT0
CMP7ACT1
CMP7ACT0
—
—
—
—
DBT3
DBT2
DBT1
DBT0
EDBT3
EDBT2
EDBT1
DBTPS2
DBTPS1
DBTPS0
—
—
D15
D14
D13
D12
D11
D10
D9
D8
D7
D6
D5
D4
D3
D2
D1
D0
D15
D14
D13
D12
D11
D10
D9
D8
D7
D6
D5
D4
D3
D2
D1
D0
D15
D14
D13
D12
D11
D10
D9
D8
D7
D6
D5
D4
D3
D2
D1
D0
07511h
07512h
07513h
Reserved
07514h
07515h
07518h
07519h
0751Ah
to
0751Fh
ACTRB
Reserved
07516h
07517h
COMCONB
DBTCONB
Reserved
CMPR4
CMPR5
CMPR6
Reserved
Indicates change with respect to the F243/F241, C242 device register maps.
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SPRS145J − JULY 2000 − REVISED NOVEMBER 2004
peripheral register descriptions (continued)
Table 19. LF240xA/LC240xA DSP Peripheral Register Description (Continued)
ADDR
BIT 15
BIT 14
BIT 13
BIT 12
BIT 11
BIT 10
BIT 9
BIT 8
BIT 7
BIT 6
BIT 5
BIT 4
BIT 3
BIT 2
BIT 1
BIT 0
CAP6TSEL
CAP45SEL
REG
CAPTURE UNIT REGISTERS− EVB
CAPRES
07520h
CAPQEPN
CAP6EN
CAP4EDGE
CAP5EDGE
—
CAP6FIFO
CAP6EDGE
07521h
07522h
07523h
07524h
07525h
07528h
07529h
CAP6TOADC
CAPCONB
—
Reserved
CAP5FIFO
CAP4FIFO
—
—
—
—
—
—
—
—
D15
D14
D13
D12
D11
D10
D9
D8
D7
D6
D5
D4
D3
D2
D1
D0
D15
D14
D13
D12
D11
D10
D9
D8
D7
D6
D5
D4
D3
D2
D1
D0
D15
D14
D13
D12
D11
D10
D9
D8
D7
D6
D5
D4
D3
D2
D1
D0
D15
D14
D13
D12
D11
D10
D9
D8
D7
D6
D5
D4
D3
D2
D1
D0
D15
D14
D13
D12
D11
D10
D9
D8
D7
D6
D5
D4
D3
D2
D1
D0
D15
D14
D13
D12
D11
D10
D9
D8
D7
D6
D5
D4
D3
D2
D1
D0
07526h
07527h
—
CAPFIFOB
CAP4FIFO
CAP5FIFO
CAP6FIFO
Reserved
0752Ah
to
0752Bh
CAP4FBOT
CAP5FBOT
CAP6FBOT
Reserved
EVENT MANAGER (EVB) INTERRUPT CONTROL REGISTERS
0752Ch
0752Dh
0752Eh
0752Fh
07530h
07531h
07532h
to
0753Fh
—
—
—
—
—
T3OFINT
ENA
T3UFINT
ENA
T3CINT
ENA
T3PINT
ENA
—
—
—
CMP6INT
ENA
CMP5INT
ENA
CMP4INT
ENA
PDPINTB
ENA
—
—
—
—
—
—
—
—
T4UFINT
ENA
T4CINT
ENA
T4PINT
ENA
—
—
—
—
T4OFINT
ENA
—
—
—
—
—
—
—
—
CAP5INT
ENA
CAP4INT
ENA
—
—
—
—
—
CAP6INT
ENA
—
—
—
—
—
T3OFINT
FLAG
T3UFINT
FLAG
T3CINT
FLAG
T3PINT
FLAG
—
—
—
CMP6INT
FLAG
CMP5INT
FLAG
CMP4INT
FLAG
PDPINTB
FLAG
—
—
—
—
—
—
—
—
T4UFINT
FLAG
T4CINT
FLAG
T4PINT
FLAG
—
—
—
—
T4OFINT
FLAG
—
—
—
—
—
—
—
—
—
CAP6INT
FLAG
CAP5INT
FLAG
CAP4INT
FLAG
—
—
—
—
Reserved
Indicates change with respect to the F243/F241, C242 device register maps.
124
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EVBIMRA
EVBIMRB
EVBIMRC
EVBIFRA
EVBIFRB
EVBIFRC
SPRS145J − JULY 2000 − REVISED NOVEMBER 2004
peripheral register descriptions (continued)
Table 19. LF240xA/LC240xA DSP Peripheral Register Description (Continued)
ADDR
BIT 15
BIT 14
BIT 13
BIT 12
BIT 11
BIT 10
BIT 9
BIT 8
BIT 7
BIT 6
BIT 5
BIT 4
BIT 3
BIT 2
BIT 1
BIT 0
REG
KEY REGISTERS
077F0h
High Word of the 64-Bit KEY Register
KEY3
077F1h
Third Word of the 64-Bit KEY Register
KEY2
077F2h
Second Word of the 64-Bit KEY Register
KEY1
Low Word of the 64-Bit KEY Register
KEY0
077F3h
PROGRAM MEMORY SPACE − FLASH REGISTERS
0xx00h
0xx01h
—
—
—
—
—
—
—
—
—
—
—
—
PWR DWN
KEY1
KEY0
EXEC
—
—
—
—
—
—
WSVER EN
PRECND
Mode1
PRECND
Mode0
ENG/R
Mode2
ENG/R
Mode1
ENG/R
Mode0
FCM3
FCM2
FCM1
FCM0
PMPC
CTRL†
0xx02h
WADDR
0xx03h
WDATA
0xx04h
0xx05h
0xx06h
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
SECT 4
ENABLE
SECT 3
ENABLE
SECT 2
ENABLE
SECT 1
ENABLE
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
BVIS.1
BVIS.0
ISWS.2
ISWS.1
ISWS.0
DSWS.2
DSWS.1
DSWS.0
PSWS.2
PSWS.1
PSWS.0
TCR
ENAB
SECT
I/O MEMORY SPACE
0FF0Fh
FCMR
WAIT-STATE GENERATOR CONTROL REGISTER
0FFFFh
WSGR
Indicates change with respect to the F243/F241, C242 device register maps.
† Register shown with bits set in register mode.
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125
SPRS145J − JULY 2000 − REVISED NOVEMBER 2004
MECHANICAL DATA
Table 20 through Table 23 provide the typical thermal resistance characteristics for each mechanical
package.
Table 20. Typical Thermal Resistance Characteristics
for the PAG Package
PARAMETER
DESCRIPTION
°C / W
ΘJA
Junction-to-ambient
42
ΘJC
Junction-to-case
7
Ψjt
Junction-to-top of package
0.5
Table 21. Typical Thermal Resistance Characteristics
for the PG Package
PARAMETER
DESCRIPTION
°C / W
ΘJA
Junction-to-ambient
35
ΘJC
Junction-to-case
11
Ψjt
Junction-to-top of package
1.0
Table 22. Typical Thermal Resistance Characteristics
for the PGE Package
PARAMETER
DESCRIPTION
°C / W
ΘJA
Junction-to-ambient
32
ΘJC
Junction-to-case
8
Ψjt
Junction-to-top of package
0.5
Table 23. Typical Thermal Resistance Characteristics
for the PZ Package
126
PARAMETER
DESCRIPTION
°C / W
ΘJA
Junction-to-ambient
42
ΘJC
Junction-to-case
8
Ψjt
Junction-to-top of package
0.5
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SPRS145J − JULY 2000 − REVISED NOVEMBER 2004
MECHANICAL DATA (CONTINUED)
The following mechanical package diagram(s) reflect the most current released mechanical data available
for the designated device(s).
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127
PACKAGE OPTION ADDENDUM
www.ti.com
18-Mar-2005
PACKAGING INFORMATION
Orderable Device
Status (1)
TMS320LC2402APG
TMS320LC2404APZ
Pins Package Eco Plan (2)
Qty
Lead/Ball Finish
MSL Peak Temp (3)
Package
Type
Package
Drawing
ACTIVE
QFP
PG
64
TBD
Call TI
Call TI
ACTIVE
LQFP
PZ
100
TBD
Call TI
Call TI
TMS320LC2406APZA
ACTIVE
LQFP
PZ
100
TBD
Call TI
Call TI
TMS320LC2406APZS
ACTIVE
LQFP
PZ
100
TBD
Call TI
Call TI
TMS320LF2402APGA
ACTIVE
QFP
PG
64
66
TBD
CU
Level-4-220C-72HR
TMS320LF2402APGS
ACTIVE
QFP
PG
64
66
TBD
CU
Level-4-220C-72HR
TMS320LF2403APAGA
ACTIVE
TQFP
PAG
64
160
TBD
CU NIPDAU
Level-3-220C-168HR
TMS320LF2403APAGS
ACTIVE
TQFP
PAG
64
160
TBD
CU NIPDAU
Level-3-220C-168HR
TMS320LF2406APZA
ACTIVE
LQFP
PZ
100
90
TBD
CU NIPDAU
Level-2-220C-1YR
TMS320LF2406APZAR
ACTIVE
LQFP
PZ
100
1000
TBD
CU NIPDAU
Level-2-220C-1YR
TMS320LF2406APZS
ACTIVE
LQFP
PZ
100
90
TBD
CU NIPDAU
Level-2-220C-1YR
TMS320LF2407APGEA
ACTIVE
LQFP
PGE
144
60
TBD
CU NIPDAU
Level-2-220C-1YR
TMS320LF2407APGES
ACTIVE
LQFP
PGE
144
60
TBD
CU NIPDAU
Level-2-220C-1YR
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS) or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 1
MECHANICAL DATA
MQFP008 – JULY 1998
PG (R-PQFP-G64)
PLASTIC QUAD FLATPACK
0,45
0,25
1,00
51
0,20 M
33
52
32
12,00 TYP
64
14,20
13,80
18,00
17,20
20
1
19
0,15 NOM
18,00 TYP
20,20
19,80
24,00
23,20
Gage Plane
0,25
0,10 MIN
2,70 TYP
0°– 10°
1,10
0,70
Seating Plane
3,10 MAX
0,10
4040101 / B 03/95
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
C. Contact field sales office to determine if a tighter coplanarity requirement is available for this package.
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
1
MECHANICAL DATA
MTQF006A – JANUARY 1995 – REVISED DECEMBER 1996
PAG (S-PQFP-G64)
PLASTIC QUAD FLATPACK
0,27
0,17
0,50
48
0,08 M
33
49
32
64
17
0,13 NOM
1
16
7,50 TYP
Gage Plane
10,20
SQ
9,80
12,20
SQ
11,80
0,25
0,05 MIN
1,05
0,95
0°– 7°
0,75
0,45
Seating Plane
0,08
1,20 MAX
4040282 / C 11/96
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
C. Falls within JEDEC MS-026
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
1
MECHANICAL DATA
MTQF013A – OCTOBER 1994 – REVISED DECEMBER 1996
PZ (S-PQFP-G100)
PLASTIC QUAD FLATPACK
0,27
0,17
0,50
75
0,08 M
51
76
50
100
26
1
0,13 NOM
25
12,00 TYP
Gage Plane
14,20
SQ
13,80
16,20
SQ
15,80
0,05 MIN
1,45
1,35
0,25
0°– 7°
0,75
0,45
Seating Plane
0,08
1,60 MAX
4040149 /B 11/96
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
C. Falls within JEDEC MS-026
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
1
MECHANICAL DATA
MTQF017A – OCTOBER 1994 – REVISED DECEMBER 1996
PGE (S-PQFP-G144)
PLASTIC QUAD FLATPACK
108
73
109
72
0,27
0,17
0,08 M
0,50
144
0,13 NOM
37
1
36
Gage Plane
17,50 TYP
20,20 SQ
19,80
22,20
SQ
21,80
0,25
0,05 MIN
0°– 7°
0,75
0,45
1,45
1,35
Seating Plane
0,08
1,60 MAX
4040147 / C 10/96
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
C. Falls within JEDEC MS-026
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
1
IMPORTANT NOTICE
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Following are URLs where you can obtain information on other Texas Instruments products and application
solutions:
Products
Applications
Amplifiers
amplifier.ti.com
Audio
www.ti.com/audio
Data Converters
dataconverter.ti.com
Automotive
www.ti.com/automotive
DSP
dsp.ti.com
Broadband
www.ti.com/broadband
Interface
interface.ti.com
Digital Control
www.ti.com/digitalcontrol
Logic
logic.ti.com
Military
www.ti.com/military
Power Mgmt
power.ti.com
Optical Networking
www.ti.com/opticalnetwork
Microcontrollers
microcontroller.ti.com
Security
www.ti.com/security
Telephony
www.ti.com/telephony
Video & Imaging
www.ti.com/video
Wireless
www.ti.com/wireless
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