ONSEMI MC74HCT14ADG

MC74HCT14A
Hex Schmitt-Trigger
Inverter with LSTTL
Compatible Inputs
High−Performance Silicon−Gate CMOS
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The MC74HCT14A may be used as a level converter for interfacing
TTL or NMOS outputs to high−speed CMOS inputs.
The HCT14A is useful to “square up” slow input rise and fall times.
Due to the hysteresis voltage of the Schmitt trigger, the HCT14A finds
applications in noisy environments.
Features
•
•
•
•
•
•
•
•
MARKING
DIAGRAMS
14
PDIP−14
N SUFFIX
CASE 646
14
Output Drive Capability: 10 LSTTL Loads
TTL/NMOS−Compatible Input Levels
Outputs Directly Interface to CMOS, NMOS, and TTL
Operating Voltage Range: 4.5 to 5.5 V
Low Input Current: 1.0 mA
In Compliance With the JEDEC Standard No. 7.0 A Requirements
Chip Complexity: 72 FETs or 18 Equivalent Gates
These Devices are Pb−Free, Halogen Free and are RoHS Compliant
1
MC74HCT14AN
AWLYYWWG
1
14
SOIC−14
D SUFFIX
CASE 751A
14
1
HCT14AG
AWLYWW
1
14
14
1
HCT
14A
ALYWG
G
TSSOP−14
DT SUFFIX
CASE 948G
1
14
14
1
SOEIAJ−14
F SUFFIX
CASE 965
74HCT14A
ALYWG
1
A
L, WL
Y, YY
W, WW
G or G
= Assembly Location
= Wafer Lot
= Year
= Work Week
= Pb−Free Package
(Note: Microdot may be in either location)
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 2 of this data sheet.
© Semiconductor Components Industries, LLC, 2011
May, 2011 − Rev. 12
1
Publication Order Number:
MC74HCT14A/D
MC74HCT14A
PIN ASSIGNMENT
A1
1
14
VCC
Y1
2
13
A6
A2
3
12
Y6
Y2
4
11
A5
A3
5
10
Y5
Y3
6
9
A4
GND
7
8
Y4
LOGIC DIAGRAM
A1
A2
A3
A4
FUNCTION TABLE
Input
A
Output
Y
L
H
H
L
A5
A6
1
2
3
4
5
6
9
8
11
10
13
12
Y=A
Y1
Y2
Y3
Y4
Y5
Y6
PIN 14 = VCC
PIN 7 = GND
ORDERING INFORMATION
Package
Shipping†
MC74HCT14ANG
PDIP−14
(Pb−Free)
25 Units / Rail
MC74HCT14ADG
SOIC−14
(Pb−Free)
55 Units / Rail
MC74HCT14ADR2G
SOIC−14
(Pb−Free)
2500 / Tape & Reel
MC74HCT14ADTR2G
TSSOP−14*
2500 / Tape & Reel
MC74HCT14AFELG
SOEIAJ−14
(Pb−Free)
2000 / Tape & Reel
Device
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
*This package is inherently Pb−Free.
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2
MC74HCT14A
MAXIMUM RATINGS
Symbol
VCC
Parameter
Value
Unit
DC Supply Voltage
(Referenced to GND)
*0.5 to )7.0
V
VI
DC Input Voltage
(Referenced to GND)
*0.5 to VCC )0.5
V
VO
DC Output Voltage
(Referenced to GND)
*0.5 to VCC )0.5
V
IIK
DC Input Diode Current
$20
mA
IOK
DC Output Diode Current
$25
mA
IO
DC Output Sink Current
$25
mA
ICC
DC Supply Current per Supply Pin
$50
mA
IGND
DC Ground Current per Ground Pin
$50
mA
TSTG
Storage Temperature Range
*65 to )150
_C
TL
Lead Temperature, 1 mm from Case for 10 Seconds
TJ
Junction Temperature under Bias
qJA
Thermal Resistance
PD
Power Dissipation in Still Air at 85_C
MSL
Moisture Sensitivity
FR
Flammability Rating
VESD
ILatchup
_C
_C
PDIP
SOIC
TSSOP
78
125
170
_C/W
PDIP
SOIC
TSSOP
750
500
450
mW
Level 1
Oxygen Index: 30% − 35%
ESD Withstand Voltage
Latchup Performance
260
)150
UL 94 V−0 @ 0.125 in
Human Body Model (Note 1)
Machine Model (Note 2)
Charged Device Model (Note 3)
>4000
>300
>1000
V
Above VCC and Below GND at 85_C (Note 4)
$300
mA
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
1. Tested to EIA/JESD22−A114−A.
2. Tested to EIA/JESD22−A115−A.
3. Tested to JESD22−C101−A.
4. Tested to EIA/JESD78.
RECOMMENDED OPERATING CONDITIONS
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
Symbol
VCC
VI, VO
Parameter
Min
Max
Unit
DC Supply Voltage
(Referenced to GND)
4.5
5.5
V
DC Input Voltage, Output Voltage
(Referenced to GND)
0
VCC
V
*55
)125
_C
−
(Note 5)
ns
TA
Operating Temperature, All Package Types
tr, tf
Input Rise and Fall Time (Figure 1)
5. No Limit when VI [ 50% VCC, ICC > 1 mA.
6. Unused inputs may not be left open. All inputs must be tied to a high−logic voltage level or a low−logic input voltage level.
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3
MC74HCT14A
DC ELECTRICAL CHARACTERISTICS (Voltages Referenced to GND)
Temperature Limit
VCC
*55_C to 25_C
v85_C
v125_C
ÎÎÎÎ
ÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎ
ÎÎÎ
ÎÎÎ
ÎÎÎ
ÎÎÎ
ÎÎ
ÎÎÎ
ÎÎÎ
ÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎ
ÎÎÎÎÎÎ
ÎÎÎÎÎÎ
ÎÎÎÎÎ
ÎÎÎÎÎ
ÎÎÎÎÎÎ
ÎÎÎÎÎ
ÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎ
ÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎ
ÎÎÎ
ÎÎÎ
ÎÎÎ
ÎÎÎ
ÎÎ
ÎÎÎ
ÎÎÎ
ÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎ
ÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎ
ÎÎÎ
ÎÎÎÎÎÎÎ
ÎÎÎÎÎÎ
ÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
Symbol
Parameter
VT)max
Maximum Positive−Going
Input Threshold Voltage
VO = 0.1 V or VCC – 0.1 V
|Iout| v 20 mA
4.5
5.5
VT)min
Minimum Positive−Going
Input Threshold Voltage
VO = 0.1 V or VCC – 0.1 V
|Iout| v 20 mA
4.5
5.5
VT*max
Maximum Negative−Going
Input Threshold Voltage
VO = 0.1 V or VCC – 0.1 V
|Iout| v 20 mA
4.5
5.5
VT*min
Minimum Negative−Going
Input Threshold Voltage
VO = 0.1 V or VCC – 0.1 V
|Iout| v 20 mA
4.5
5.5
VH max
Maximum Hysteresis
Voltage
VO = 0.1 V or VCC – 0.1 V
|Iout| v 20 mA
4.5
5.5
VH min
Minimum Hysteresis
Voltage
VO = 0.1 V or VCC – 0.1 V
|Iout| v 20 mA
4.5
5.5
0.4
0.4
0.4
0.4
0.4
04
VOH
Minimum High−Level
Output Voltage
VI < VT*min
|Iout| v 20 mA
4.5
5.5
4.4
5.4
4.4
5.4
4.4
5.4
VI < VT*min
|Iout| v 4.0 mA
4.5
3.98
3.84
3.7
VI ≥ VT)max
|Iout| v 20 mA
4.5
5.5
0.1
0.1
0.1
0.1
0.1
0.1
VI ≥ VT)max
|Iout| v 4.0 mA
4.5
0.26
0.33
0.4
VOL
Maximum Low−Level
Output Voltage
Test Conditions
Volts
Min
Max
Min
1.9
2.1
1.2
1.4
Max
1.9
2.1
1.2
1.4
1.2
1.4
0.5
0.6
Min
Unit
1.9
2.1
V
1.2
1.4
1.2
1.4
0.5
0.6
1.4
1.5
Max
V
1.2
1.4
0.5
0.6
1.4
1.5
1.4
1.5
V
V
IIK
Maximum Input
Leakage Current
VI = VCC or GND
5.5
$0.1
$1.0
$1.0
mA
ICC
Maximum Quiescent
Supply Current
(per package)
VI = VCC or GND
Iout = 0 mA
5.5
1.0
10
40
mA
DICC
Additional Quiescent
Supply Current
VI = 2.4 V, Any One Input
VI = VCC or GND, Other Inputs
lout = 0 mA
w*55_C
25_C to 125_C
2.9
2.4
5.5
mA
AC CHARACTERISTICS (CL = 50 pF; Input tr = tf = 6.0 ns)
Guaranteed Limit
*55_C to 25_C
v85_C
v125_C
ÎÎÎÎ
ÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎ
ÎÎÎÎ
ÎÎÎ
ÎÎÎ
ÎÎÎ
ÎÎ
ÎÎÎ
ÎÎÎ
ÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
Symbol
Parameter
Test Conditions
Figures
Min
Max
tPLH,
tPHL
Maximum Propagation
Delay, Input A to Output
Y (L to H)
VCC = 5.0 V $ 10%
CL = 50 pF, Input tr = tf = 6.0 ns
1&2
32
tTLH,
tTHL
Maximum Output
Transition Time, Any
Output
VCC = 5.0 V $ 10%
CL = 50 pF, Input tr = tf = 6.0 ns
1&2
15
Min
Max
Min
Max
Unit
40
48
ns
19
22
ns
Typical @ 25°C, VCC = 5.0 V
CPD
Power Dissipation Capacitance, per Inverter (Note 7)
32
7. Used to determine the no−load dynamic power consumption: P D = CPD VCC 2 f + ICC VCC .
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4
pF
MC74HCT14A
tr
tf
INPUT A 2.7 V
1.3 V
0.3 V
OUTPUT Y
tPLH
tPHL
90%
1.3 V
10%
tTLH
tTHL
Figure 1. Switching Waveforms
TEST POINT
OUTPUT
DEVICE
UNDER
TEST
CL *
*Includes all probe and jig capacitance.
Figure 2. Test Circuit
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5
3V
GND
MC74HCT14A
PACKAGE DIMENSIONS
PDIP−14
N SUFFIX
CASE 646−06
ISSUE P
14
8
1
7
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEADS WHEN
FORMED PARALLEL.
4. DIMENSION B DOES NOT INCLUDE MOLD FLASH.
5. ROUNDED CORNERS OPTIONAL.
B
A
F
L
N
C
−T−
SEATING
PLANE
H
G
D 14 PL
J
K
0.13 (0.005)
M
M
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6
DIM
A
B
C
D
F
G
H
J
K
L
M
N
INCHES
MIN
MAX
0.715
0.770
0.240
0.260
0.145
0.185
0.015
0.021
0.040
0.070
0.100 BSC
0.052
0.095
0.008
0.015
0.115
0.135
0.290
0.310
−−−
10 _
0.015
0.039
MILLIMETERS
MIN
MAX
18.16
19.56
6.10
6.60
3.69
4.69
0.38
0.53
1.02
1.78
2.54 BSC
1.32
2.41
0.20
0.38
2.92
3.43
7.37
7.87
−−−
10 _
0.38
1.01
MC74HCT14A
PACKAGE DIMENSIONS
SOIC−14
D SUFFIX
CASE 751A−03
ISSUE J
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS A AND B DO NOT INCLUDE
MOLD PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006)
PER SIDE.
5. DIMENSION D DOES NOT INCLUDE
DAMBAR PROTRUSION. ALLOWABLE
DAMBAR PROTRUSION SHALL BE 0.127
(0.005) TOTAL IN EXCESS OF THE D
DIMENSION AT MAXIMUM MATERIAL
CONDITION.
−A−
14
8
−B−
P 7 PL
0.25 (0.010)
B
M
7
1
G
−T−
D 14 PL
0.25 (0.010)
T B
S
A
DIM
A
B
C
D
F
G
J
K
M
P
R
J
M
K
M
F
R X 45 _
C
SEATING
PLANE
M
S
SOLDERING FOOTPRINT
7X
7.04
14X
1.52
1
14X
0.58
1.27
PITCH
DIMENSIONS: MILLIMETERS
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7
MILLIMETERS
MIN
MAX
8.55
8.75
3.80
4.00
1.35
1.75
0.35
0.49
0.40
1.25
1.27 BSC
0.19
0.25
0.10
0.25
0_
7_
5.80
6.20
0.25
0.50
INCHES
MIN
MAX
0.337 0.344
0.150 0.157
0.054 0.068
0.014 0.019
0.016 0.049
0.050 BSC
0.008 0.009
0.004 0.009
0_
7_
0.228 0.244
0.010 0.019
MC74HCT14A
PACKAGE DIMENSIONS
TSSOP−14
DT SUFFIX
CASE 948G−01
ISSUE B
14X K REF
0.10 (0.004)
0.15 (0.006) T U
M
T U
V
S
S
N
2X
14
L/2
0.25 (0.010)
8
M
B
−U−
L
PIN 1
IDENT.
N
F
7
1
0.15 (0.006) T U
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION A DOES NOT INCLUDE MOLD
FLASH, PROTRUSIONS OR GATE BURRS.
MOLD FLASH OR GATE BURRS SHALL NOT
EXCEED 0.15 (0.006) PER SIDE.
4. DIMENSION B DOES NOT INCLUDE
INTERLEAD FLASH OR PROTRUSION.
INTERLEAD FLASH OR PROTRUSION SHALL
NOT EXCEED 0.25 (0.010) PER SIDE.
5. DIMENSION K DOES NOT INCLUDE
DAMBAR PROTRUSION. ALLOWABLE
DAMBAR PROTRUSION SHALL BE 0.08
(0.003) TOTAL IN EXCESS OF THE K
DIMENSION AT MAXIMUM MATERIAL
CONDITION.
6. TERMINAL NUMBERS ARE SHOWN FOR
REFERENCE ONLY.
7. DIMENSION A AND B ARE TO BE
DETERMINED AT DATUM PLANE −W−.
S
S
DETAIL E
K
A
−V−
ÉÉÉ
ÇÇÇ
ÇÇÇ
ÉÉÉ
K1
J J1
SECTION N−N
−W−
C
0.10 (0.004)
−T− SEATING
PLANE
D
H
G
DETAIL E
DIM
A
B
C
D
F
G
H
J
J1
K
K1
L
M
MILLIMETERS
MIN
MAX
4.90
5.10
4.30
4.50
−−−
1.20
0.05
0.15
0.50
0.75
0.65 BSC
0.50
0.60
0.09
0.20
0.09
0.16
0.19
0.30
0.19
0.25
6.40 BSC
0_
8_
SOLDERING FOOTPRINT
7.06
1
0.65
PITCH
14X
0.36
14X
1.26
DIMENSIONS: MILLIMETERS
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8
INCHES
MIN MAX
0.193 0.200
0.169 0.177
−−− 0.047
0.002 0.006
0.020 0.030
0.026 BSC
0.020 0.024
0.004 0.008
0.004 0.006
0.007 0.012
0.007 0.010
0.252 BSC
0_
8_
MC74HCT14A
PACKAGE DIMENSIONS
SOEIAJ−14
F SUFFIX
CASE 965−01
ISSUE B
14
LE
8
Q1
E HE
M_
L
7
1
DETAIL P
Z
D
VIEW P
A
e
DIM
A
A1
b
c
D
E
e
HE
L
LE
M
Q1
Z
A1
b
0.13 (0.005)
c
M
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS D AND E DO NOT INCLUDE
MOLD FLASH OR PROTRUSIONS AND ARE
MEASURED AT THE PARTING LINE. MOLD FLASH
OR PROTRUSIONS SHALL NOT EXCEED 0.15
(0.006) PER SIDE.
4. TERMINAL NUMBERS ARE SHOWN FOR
REFERENCE ONLY.
5. THE LEAD WIDTH DIMENSION (b) DOES NOT
INCLUDE DAMBAR PROTRUSION. ALLOWABLE
DAMBAR PROTRUSION SHALL BE 0.08 (0.003)
TOTAL IN EXCESS OF THE LEAD WIDTH
DIMENSION AT MAXIMUM MATERIAL CONDITION.
DAMBAR CANNOT BE LOCATED ON THE LOWER
RADIUS OR THE FOOT. MINIMUM SPACE
BETWEEN PROTRUSIONS AND ADJACENT LEAD
TO BE 0.46 ( 0.018).
0.10 (0.004)
MILLIMETERS
MIN
MAX
--2.05
0.05
0.20
0.35
0.50
0.10
0.20
9.90
10.50
5.10
5.45
1.27 BSC
7.40
8.20
0.50
0.85
1.10
1.50
10 _
0_
0.70
0.90
--1.42
INCHES
MIN
MAX
--0.081
0.002
0.008
0.014
0.020
0.004
0.008
0.390
0.413
0.201
0.215
0.050 BSC
0.291
0.323
0.020
0.033
0.043
0.059
10 _
0_
0.028
0.035
--0.056
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MC74HCT14A/D