ONSEMI MM5Z4V7ST1G/T5G

MM5ZxxxST1G Series,
SZMM5ZxxxST1G Series
Zener Voltage Regulators
200 mW SOD−523 Surface Mount
This series of Zener diodes is packaged in a SOD−523 surface
mount package. They are designed to provide voltage regulation
protection and are especially attractive in situations where space is at a
premium. They are well suited for applications such as cellular
phones, hand held portables, and high density PC boards.
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SOD−523
CASE 502
PLASTIC
Specification Features
 Standard Zener Breakdown Voltage Range −2.4 V to 18 V
 Steady State Power Rating of 200 mW
 Small Body Outline Dimensions:






0.047 x 0.032 (1.20 mm x 0.80 mm)
Low Body Height: 0.028 (0.7 mm)
ESD Rating of Class 3 (> 16 kV) per Human Body Model
Tight Tolerance VZ
AEC−Q101 Qualified and PPAP Capable
SZ Prefix for Automotive and Other Applications Requiring Unique
Site and Control Change Requirements
These are Pb−Free Devices*
Mechanical Characteristics
CASE: Void-free, transfer-molded, thermosetting plastic
MAXIMUM RATINGS
Junction and Storage Temperature Range
1
XX MG
G
2
*Date Code orientation may vary depending
upon manufacturing location.
Device Meets MSL 1 Requirements
Thermal Resistance from
Junction−to−Ambient
MARKING DIAGRAM
(Note: Microdot may be in either location)
QUALIFIED MAX REFLOW TEMPERATURE: 260C
Total Device Dissipation FR−5 Board,
(Note 1) @ TA = 25C
Derate above 25C
2
Anode
XX = Specific Device Code
M
Date Code*
G
= Pb−Free Package
Epoxy Meets UL 94, V−0
LEAD FINISH: 100% Matte Sn (Tin)
MOUNTING POSITION: Any
Rating
1
Cathode
ORDERING INFORMATION
Symbol
Max
Unit
200
1.5
mW
mW/C
RqJA
635
C/W
TJ, Tstg
−65 to
+150
C
PD
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
1. FR−4 Minimum Pad.
Device
Package
Shipping†
MM5ZxxxST1G
SOD−523**
3,000 /
Tape & Reel
SZMM5ZxxxST1G
SOD−523**
3,000 /
Tape & Reel
SZMM5ZxxxST5G
SOD−523**
8,000 /
Tape & Reel
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
**This package is inherently Pb−Free.
DEVICE MARKING INFORMATION
*For additional information on our Pb−Free strategy and soldering details, please
download the ON Semiconductor Soldering and Mounting Techniques
Reference Manual, SOLDERRM/D.
 Semiconductor Components Industries, LLC, 2012
January, 2012 − Rev. 8
1
See specific marking information in the device marking
column of the Electrical Characteristics table on page 2 of
this data sheet.
Publication Order Number:
MM5Z2V4ST1/D
MM5ZxxxST1G Series, SZMM5ZxxxST1G Series
ELECTRICAL CHARACTERISTICS
(TA = 25C unless otherwise noted,
VF = 0.9 V Max. @ IF = 10 mA for all types)
Symbol
Parameter
VZ
Reverse Zener Voltage @ IZT
IZT
Reverse Current
ZZT
Maximum Zener Impedance @ IZT
IZK
Reverse Current
ZZK
Maximum Zener Impedance @ IZK
IR
Reverse Leakage Current @ VR
VR
Reverse Voltage
IF
Forward Current
VF
Forward Voltage @ IF
QVZ
C
I
IF
VZ VR
V
IR VF
IZT
Figure 1. Zener Voltage Regulator
Maximum Temperature Coefficient of VZ
Max. Capacitance @VR = 0 and f = 1 MHz
ELECTRICAL CHARACTERISTICS (VF = 0.9 Max @ IF = 10 mA for all types)
Zener Voltage
VZ
ZZT
IZ = IZT
@ 10%
Mod W
Max
Max
IR @ VR
dVZ/dt (mV/k)
@ IZT1 = 5 mA
Device
Marking
Test
Current
Izt mA
Min
Max
ZZK IZ
= 1.0
mA W
Max
mA
V
Min
Max
C pF Max @
VR = 0
f = 1 MHz
MM5Z2V4ST1G
T2
5.0
2.43
2.63
1000
100
120
1.0
−3.5
0
450
MM5Z2V7ST1G
T3
5.0
2.67
2.91
1000
100
100
1.0
−3.5
0
450
MM5Z3V3ST1G
T5
5.0
3.32
3.53
1000
95
5.0
1.0
−3.5
0
450
MM5Z3V6ST1G
T6
5.0
3.60
3.85
1000
90
5.0
1.0
−3.5
0
450
MM5Z3V9ST1G
T7
5.0
3.89
4.16
1000
90
3.0
1.0
−3.5
−2.5
450
MM5Z4V3ST1G
T8
5.0
4.17
4.43
1000
90
3.0
1.0
−3.5
0
450
MM5Z4V7ST1G/T5G
T9
5.0
4.55
4.75
800
80
3.0
2.0
−3.5
0.2
260
MM5Z5V1ST1G
TA
5.0
4.98
5.2
500
60
2.0
2.0
−2.7
1.2
225
MM5Z5V6ST1G
TC
5.0
5.49
5.73
200
40
1.0
2.0
−2.0
2.5
200
MM5Z6V2ST1G
TE
5.0
6.06
6.33
100
10
3.0
4.0
0.4
3.7
185
MM5Z6V8ST1G
TF
5.0
6.65
6.93
160
15
2.0
4.0
1.2
4.5
155
MM5Z7V5ST1G
TG
5.0
7.28
7.6
160
15
1.0
5.0
2.5
5.3
140
MM5Z8V2ST1G
TH
5.0
8.02
8.36
160
15
0.7
5.0
3.2
6.2
135
MM5Z9V1ST1G
TK
5.0
8.85
9.23
160
15
0.5
6.0
3.8
7.0
130
MM5Z12VST1G
TN
5.0
11.74
12.24
80
25
0.1
8.0
6.0
10
130
MM5Z16VST1G
TU
5.0
15.85
16.51
80
40
0.05
11.2
10.4
14
105
MM5Z18VST1G
TW
5.0
17.56
18.35
80
45
0.05
12.6
12.4
16
100
Device*
*Include SZ-prefix devices where applicable.
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2
MM5ZxxxST1G Series, SZMM5ZxxxST1G Series
TYPICAL CHARACTERISTICS
100
POWER DISSIPATION (%)
80
60
40
20
0
0
25
50
75
100
125
TEMPERATURE (C)
Figure 2. Steady State Power Derating
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3
150
MM5ZxxxST1G Series, SZMM5ZxxxST1G Series
PACKAGE DIMENSIONS
SOD−523
CASE 502−01
ISSUE E
−X−
D
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH.
MINIMUM LEAD THICKNESS IS THE MINIMUM THICKNESS OF
BASE MATERIAL.
4. DIMENSIONS D AND E DO NOT INCLUDE MOLD FLASH, PROTRUSIONS, OR GATE BURRS.
−Y−
E
2X
b
0.08
1
M
2
X Y
DIM
A
b
c
D
E
HE
L
L2
TOP VIEW
A
c
HE
RECOMMENDED
SOLDERING FOOTPRINT*
SIDE VIEW
2X
2X
2X
MILLIMETERS
MIN
NOM
MAX
0.50
0.60
0.70
0.25
0.30
0.35
0.07
0.14
0.20
1.10
1.20
1.30
0.70
0.80
0.90
1.50
1.60
1.70
0.30 REF
0.15
0.20
0.25
L
PACKAGE
OUTLINE
L2
BOTTOM VIEW
1.80
0.48
2X
0.40
DIMENSION: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
ON Semiconductor and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
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“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
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MM5Z2V4ST1/D