NL27WZ07 Dual Buffer with Open Drain Outputs The NL27WZ07 is a high performance dual buffer with open drain outputs operating from a 1.65 to 5.5 V supply. The internal circuit is composed of multiple stages, including an open drain output. The open drain output provides the capability to set the output switching level to a user selectable value with an external resistor and power supply. The logic high output value is set by the external power supply and can be less than, equal or greater than the VCC power supply, provided the voltage supply is less than 5.5 V. • • • • • • • • • • Extremely High Speed: tPD 2.3 ns (typical) at VCC = 5 V Designed for 1.65 V to 5.5 V VCC Operation, CMOS compatible Over Voltage Tolerant Inputs LVTTL Compatible − Interface Capability with 5 V TTL Logic with VCC = 3 V LVCMOS Compatible 24 mA Output Sink Capability Near Zero Static Supply Current Substantially Reduces System Power Requirements Chip Complexity: FET = 72; Equivalent Gate = 18 These Devices are Pb−Free and are RoHS Compliant NLV Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC−Q100 Qualified and PPAP Capable IN A1 GND 1 6 2 5 OUT Y1 VCC MARKING DIAGRAMS 6 SC−88 DF SUFFIX CASE 419B 1 M Features http://onsemi.com M7 M G G 1 TSOP−6 DT SUFFIX CASE 318G 1 M7 M G G 1 M7 M G = Device Code = Date Code* = Pb−Free Package (Note: Microdot may be in either location) *Date Code orientation and/or position may vary depending upon manufacturing location. PIN ASSIGNMENT Pin Function 1 IN A1 2 GND 3 IN A2 4 OUT Y2 5 VCC 6 OUT Y1 FUNCTION TABLE IN A2 3 4 OUT Y2 Figure 1. Pinout (Top View) IN A1 1 OUT Y1 IN A2 1 OUT Y2 A Input Y Output L L H Z ORDERING INFORMATION See detailed ordering and shipping information in the package dimensions section on page 4 of this data sheet. Figure 2. Logic Symbol © Semiconductor Components Industries, LLC, 2012 April, 2012 − Rev. 15 1 Publication Order Number: NL27WZ07/D NL27WZ07 MAXIMUM RATINGS Symbol VCC Characteristics DC Supply Voltage Value Units −0.5 to +7.0 V VI DC Input Voltage −0.5 ≤ VI ≤ +7.0 V VO DC Output Voltage Output in Z or LOW State (Note 1) −0.5 ≤ VO ≤ +7.0 V IIK DC Input Diode Current VI < GND −50 mA IOK DC Output Diode Current VO < GND −50 mA IO DC Output Sink Current ±50 mA ICC DC Supply Current per Supply Pin ±100 mA IGND DC Ground Current per Ground Pin ±100 mA TSTG Storage Temperature Range −65 to +150 °C PD Power Dissipation in Still Air SC−88, TSOP−6 200 qJA Thermal Resistance SC−88, TSOP−6 333 TL Lead Temperature, 1 mm from case for 10 s 260 °C TJ Junction Temperature under Bias +150 °C Latchup Performance Above VCC and Below GND at 85°C (Note 5) ±500 ILatchup MSL FR VESD Moisture Sensitivity mW °C/W mA Level 1 Flammability Rating Oxygen Index: 28 to 34 UL 94 V−0 @ 0.125 in ESD Classification Human Body Model (Note 3) Machine Model (Note 4) Charged Device Model (Note 5) V > 2000 > 200 N/A Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. 1. IO absolute maximum rating must be observed. 2. Tested to EIA/JESD22−A114−A, rated to EIA/JESD22−A114−B. 3. Tested to EIA/JESD22−A115−A, rated to EIA/JESD22−A115−A. 4. Tested to JESD22−C101−A 5. Tested to EIA/JESD78 RECOMMENDED OPERATING CONDITIONS Symbol VCC Parameter Supply Voltage Operating Data Retention Only Min Max 1.65 1.5 5.5 5.5 Units V VI Input Voltage 0 5.5 V VO Output Voltage (Z or LOW State) 0 5.5 V TA Operating Free−Air Temperature −55 +125 °C Dt/DV Input Transition Rise or Fall Rate VCC = 2.5 V ±0.2 V VCC = 3.0 V ±0.3 V VCC = 5.0 V ±0.5 V 0 0 0 20 10 5 http://onsemi.com 2 ns/V NL27WZ07 DC ELECTRICAL CHARACTERISTICS Min 0.75 VCC 0.7 VCC Typ −55°C 3 TA 3 125°C Max Min Max Symbol Parameter VIH High−Level Input Voltage 1.65 to 1.95 2.3 to 5.5 VIL Low−Level Input Voltage 1.65 to 1.95 2.3 to 5.5 0.25 VCC 0.3 VCC 0.25 VCC 0.3 VCC V ILKG Z−State Output Leakage Current VIN = VIL VOUT = VCC or GND 2.3 to 5.5 ±5.0 ±10.0 mA VOL Low−Level Output Voltage VIN = VIL IOL = 100 mA 1.65 to 5.5 0.0 0.1 0.1 V IOL = 4 mA 1.65 0.08 0.24 0.24 IIN Input Leakage Current IOFF Power Off Leakage Current ICC Quiescent Supply Current Condition TA = 25°C VCC (V) 0.75 VCC 0.7 VCC Units V IOL = 8 mA 2.3 0.20 0.3 0.3 IOL = 12 mA 2.7 0.22 0.4 0.4 IOL = 16 mA 3.0 0.28 0.4 0.4 IOL = 24 mA 3.0 0.38 0.55 0.55 IOL = 32 mA 4.5 0.42 0.55 0.55 VIN = 5.5 V or GND 0 to 5.5 ±0.1 ±1.0 mA VIN = 5.5 V or VOUT = 5.5 V 0 1 10 mA VIN = 5.5 V or GND 5.5 1 10 mA AC ELECTRICAL CHARACTERISTICS tR = tF = 2.5 ns; CL = 50 pF; RL = 500 W TA = 25°C Symbol tPZL Condition VCC (V) Min Typ Max Min Max Units RL = R1 = 5000 W, CL = 15 pF 1.8 ± 0.15 1.8 5.3 11.5 1.8 12.0 ns 2.5 ± 0.2 1.2 3.7 5.8 1.2 6.4 3.3 ± 0.3 0.8 2.9 4.4 0.8 4.8 5.0 ± 0.5 0.5 2.3 3.5 0.5 3.9 1.8 ± 0.15 1.8 5.3 11.5 1.8 12.0 2.5 ± 0.2 1.2 2.8 5.8 1.2 6.4 3.3 ± 0.3 0.8 2.1 4.4 0.8 4.8 5.0 ± 0.5 0.5 1.4 3.5 0.5 3.9 Parameter Propagation Delay (Figure 3 and 4) RL = R1 = 500 W, CL = 50 pF tPLZ Propagation Delay (Figure 3 and 4) −55°C 3 TA 3 125°C RL = R1 = 5000 W, CL = 15 pF RL = R1 = 500 W, CL = 50 pF ns CAPACITIVE CHARACTERISTICS Symbol CIN Parameter Condition Typical Units Input Capacitance VCC = 5.5 V, VI = 0 V or VCC 2.5 pF COUT Output Capacitance VCC = 5.5 V, VI = 0 V or VCC 4.0 pF CPD Power Dissipation Capacitance (Note 6) 10 MHz, VCC = 5.5 V, VI = 0 V or VCC 4.0 pF 6. CPD is defined as the value of the internal equivalent capacitance which is calculated from the operating current consumption without load. Average operating current can be obtained by the equation: ICC(OPR) = CPD VCC fin ) ICC. CPD is used to determine the no−load dynamic power consumption; PD = CPD VCC2 fin ) ICC VCC. http://onsemi.com 3 NL27WZ07 A VCC 50% tPZL Y GND tPLZ HIGH IMPEDANCE 50% VCC VOL )0.3 V Figure 3. Switching Waveforms VCC R1 PULSE GENERATOR DUT RT CL VCC 2 RL RT = ZOUT of pulse generator (typically 50 W) Figure 4. Test Circuit ORDERING INFORMATION Package Shipping† NL27WZ07DFT2G SC−88 / SOT−363 / SC−70−6 (Pb−Free) 3000 / Tape & Reel NLV27WZ07DFT2G* SC−88 / SOT−363 / SC−70−6 (Pb−Free) 3000 / Tape & Reel TSOP−6 (Pb−Free) 3000 / Tape & Reel Device NL27WZ07DTT1G †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. *NLV Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC−Q100 Qualified and PPAP Capable. http://onsemi.com 4 NL27WZ07 PACKAGE DIMENSIONS SC−88/SC70−6/SOT−363 CASE 419B−02 ISSUE W NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. 419B−01 OBSOLETE, NEW STANDARD 419B−02. D e 6 5 4 1 2 3 HE DIM A A1 A3 b C D E e L HE −E− b 6 PL 0.2 (0.008) M E M MILLIMETERS MIN NOM MAX 0.80 0.95 1.10 0.00 0.05 0.10 0.20 REF 0.10 0.21 0.30 0.10 0.14 0.25 1.80 2.00 2.20 1.15 1.25 1.35 0.65 BSC 0.10 0.20 0.30 2.00 2.10 2.20 A3 C A A1 L SOLDERING FOOTPRINT* 0.50 0.0197 0.65 0.025 0.65 0.025 0.40 0.0157 1.9 0.0748 SCALE 20:1 mm Ǔ ǒinches *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. http://onsemi.com 5 INCHES NOM MAX 0.037 0.043 0.002 0.004 0.008 REF 0.004 0.008 0.012 0.004 0.005 0.010 0.070 0.078 0.086 0.045 0.049 0.053 0.026 BSC 0.004 0.008 0.012 0.078 0.082 0.086 MIN 0.031 0.000 NL27WZ07 PACKAGE DIMENSIONS TSOP−6 CASE 318G−02 ISSUE U NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH. MINIMUM LEAD THICKNESS IS THE MINIMUM THICKNESS OF BASE MATERIAL. 4. DIMENSIONS D AND E1 DO NOT INCLUDE MOLD FLASH, PROTRUSIONS, OR GATE BURRS. MOLD FLASH, PROTRUSIONS, OR GATE BURRS SHALL NOT EXCEED 0.15 PER SIDE. DIMENSIONS D AND E1 ARE DETERMINED AT DATUM H. 5. PIN ONE INDICATOR MUST BE LOCATED IN THE INDICATED ZONE. D H 6 5 ÉÉ E1 1 NOTE 5 2 L2 4 GAUGE PLANE E 3 L b C DETAIL Z e 0.05 M A SEATING PLANE DIM A A1 b c D E E1 e L L2 M c A1 DETAIL Z MIN 0.90 0.01 0.25 0.10 2.90 2.50 1.30 0.85 0.20 0° MILLIMETERS NOM MAX 1.00 1.10 0.06 0.10 0.38 0.50 0.18 0.26 3.00 3.10 2.75 3.00 1.50 1.70 0.95 1.05 0.40 0.60 0.25 BSC 10° − RECOMMENDED SOLDERING FOOTPRINT* 6X 0.60 6X 3.20 0.95 0.95 PITCH DIMENSIONS: MILLIMETERS *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). 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