ONSEMI NL17SZ07DFT2

NL17SZ07
Single Non−Inverting Buffer
with Open Drain Output
The NL17SZ07 is a high performance single inverter with open
drain outputs operating from a 1.65 to 5.5 V supply.
The Output stage is open drain with Over Voltage Tolerance. This
allows the NL17SZ07 to be used to interface 5.0 V circuits to circuits
of any voltage between 0 and +7.0 V.
•
•
•
•
•
•
Tiny SOT−353 and SOT−553 Packages
Extremely High Speed: tPD 2.5 ns (typical) at VCC = 5 V
Designed for 1.65 V to 5.5 V VCC Operation, CMOS Compatible
Over Voltage Tolerant Inputs VIN may be Between 0 and 7.0 V for
VCC Between 0.5 and 5.4 V
TTL Compatible − Interface Capability with 5.0 V TTL Logic with
VCC = 2.7 V to 3.6 V
LVCMOS Compatible
24 mA Output Sink Capability, Pullup may be between 0 and 7.0 V
Near Zero Static Supply Current Substantially Reduces System
Power Requirements
Chip Complexity: FET = 20
Pb−Free Packages are Available
MARKING
DIAGRAM
SC−88A / SOT−353 / SC−70
DF SUFFIX
CASE 419A
NC
5
1
L7 M G
G
SOT−553
XV5 SUFFIX
CASE 463B
L7
M
G
L7 M G
G
M
•
•
•
•
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= Device Code
= Date Code*
= Pb−Free Package
(Note: Microdot may be in either location)
VCC
*Date Code orientation and/or position may
vary depending upon manufacturing location.
OVT
IN A
GND
2
PIN ASSIGNMENT
4
3
OUT Y
Figure 1. Pinout
IN A
1
Pin
Function
1
NC
2
IN A
3
GND
4
OUT Y
5
VCC
FUNCTION TABLE
OUT Y
Figure 2. Logic Symbol
A Input
Y Output
L
L
H
Z
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 4 of this data sheet.
© Semiconductor Components Industries, LLC, 2006
March, 2006 − Rev. 7
1
Publication Order Number:
NL17SZ07/D
NL17SZ07
MAXIMUM RATINGS
Symbol
Characteristics
Value
Unit
*0.5 to )7.0
V
*0.5 ≤ VI ≤ )7.0
V
*0.5 ≤ VO ≤ 7.0
V
VI < GND
*50
mA
VO < GND
*50
mA
DC Output Sink Current
$50
mA
DC Supply Current per Supply Pin
$100
mA
IGND
DC Ground Current per Ground Pin
$100
mA
TSTG
Storage Temperature Range
*65 to )150
°C
PD
Power Dissipation in Still Air
SOT−353
SOT−553
186
135
mW
qJA
Thermal Resistance
SOT−353
SOT−553
350
496
°C/W
TL
Lead Temperature, 1 mm from Case for 10 Seconds
260
°C
TJ
Junction Temperature Under Bias
)150
°C
ILatch−Up
Latch−Up Performance
$500
mA
MSL
Moisture Sensitivity
FR
Flammability Rating
ESD
ESD Classification
VCC
DC Supply Voltage
VI
DC Input Voltage
VO
DC Output Voltage
IIK
DC Input Diode Current
IOK
DC Output Diode Current
IO
ICC
Output in Z or LOW State (Note 1)
Above VCC and Below GND at 85°C (Note 5)
Level 1
Oxygen Index: 28 to 34
UL 94 V−0 @ 0.125 in
Human Body Model (Note 3)
Machine Model (Note 4)
Charged Device Model (Note 5)
Class IC
Class A
N/A
Maximum ratings are those values beyond which device damage can occur. Maximum ratings applied to the device are individual stress limit
values (not normal operating conditions) and are not valid simultaneously. If these limits are exceeded, device functional operation is not implied,
damage may occur and reliability may be affected.
1. IO absolute maximum rating must be observed.
2. Tested to EIA/JESD22−A114−A, rated to EIA/JESD22−A114−B.
3. Tested to EIA/JESD22−A115−A, rated to EIA/JESD22−A115−A.
4. Tested to JESD22−C101−A.
5. Tested to EIA/JESD78.
RECOMMENDED OPERATING CONDITIONS
Symbol
Parameter
VCC
Supply Voltage
VI
Input Voltage
VO
Output Voltage
TA
Operating Free−Air Temperature
Δt/ΔV
Input Transition Rise or Fall Rate
Operating
Data Retention Only
(Z or LOW State)
VCC = 2.5 V $0.2 V
VCC = 3.0 V $0.3 V
VCC = 5.0 V $0.5 V
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2
Min
Max
Unit
1.65
1.5
5.5
5.5
V
0
5.5
V
0
5.5
V
−55
)125
°C
0
0
0
20
10
5
ns/V
NL17SZ07
DC ELECTRICAL CHARACTERISTICS
Symbol
Parameter
Condition
TA = 25°C
VCC
(V)
Min
0.7 VCC
0.7 VCC
*55°C ≤TA ≤ 125°C
Typ
Max
Min
Max
0.7 VCC
0.7 VCC
Unit
VIH
High−Level Input Voltage
1.65 to 1.95
2.3 to 5.5
V
VIL
Low−Level Input Voltage
1.65 to 1.95
2.3 to 5.5
0.3 VCC
0.3 VCC
0.3VCC
0.3 VCC
V
ILKG
Z−State Output Leakage
Current
VIN = VIH
VOUT = VCC or GND
2.3 to 5.5
$5.0
$10.0
mA
VOL
Low−Level Output
Voltage
VIN = VIL
IOL = 100 mA
1.65 to 5.5
0.0
0.1
0.1
V
IOL = 4 mA
1.65
0.08
0.24
0.24
IOL = 8 mA
2.3
0.20
0.3
0.3
IOL = 12 mA
2.7
0.22
0.4
0.4
IOL = 16 mA
3.0
0.28
0.4
0.4
IOL = 24 mA
3.0
0.38
0.55
0.55
IOL = 32 mA
4.5
0.42
0.55
0.55
VIN or VOUT = VCC or GND
0 to 5.5
$0.1
$1.0
mA
VOUT = 5.5 V
0
1
10
mA
IIN
Input Leakage Current
IOFF
Power Off−Output
Leakage Current
ICC
Quiescent Supply Current
VIN = VCC or GND
5.5
1
10
mA
ICCT
Quiescent Supply Current
VIN = 3.0 V
3.6
10
100
mA
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎ
ÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
AC ELECTRICAL CHARACTERISTICS tR = tF = 2.5 ns; CL = 50 pF; RL = 500 W
TA = 25°C
Symbol
tPZL
tPLZ
Condition
VCC (V)
Min
Typ
Max
Min
Max
Unit
RL = R1= 500 W, CL = 50 pF
1.8 $ 0.15
0.8
5.3
11.6
0.8
12.0
ns
2.5 $ 0.2
1.2
3.7
5.8
1.2
6.4
3.3 $ 0.3
0.8
2.9
4.4
0.8
4.8
Parameter
Propagation Delay
(Fi
(Figure
3 and
d 4)
Propagation Delay
(Fi
(Figure
3 and
d 4)
*55°C ≤TA ≤ 125°C
RL = R1= 500 W, CL = 50 pF
5.0 $ 0.5
0.5
2.3
3.5
0.5
3.9
1.8 $ 0.15
0.8
5.3
11.6
0.8
1.20
2.5 $ 0.2
1.2
2.8
5.8
1.2
6.4
3.3 $ 0.3
0.8
2.1
4.4
0.8
4.8
5.0 $ 0.5
0.5
1.4
3.5
0.5
3.9
ns
CAPACITIVE CHARACTERISTICS
Condition
Typical
Unit
CIN
Symbol
Input Capacitance
Parameter
VCC = 5.5 V, VI = 0 V or VCC
u2.5
pF
COUT
Output Capacitance
VCC = 5.5 V, VI = 0 V or VCC
4.0
pF
CPD
Power Dissipation Capacitance (Note 6)
10 MHz, VCC = 5.5 V, VI = 0 V or VCC
4.0
pF
6. CPD is defined as the value of the internal equivalent capacitance which is calculated from the operating current consumption without load.
Average operating current can be obtained by the equation: ICC(OPR) = CPD VCC fin ) ICC. CPD is used to determine the no−load dynamic
power consumption; PD = CPD VCC2 fin ) ICC VCC.
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3
NL17SZ07
A
VCC
50%
tPZL
Y
GND
tPLZ
50% VCC
HIGH
IMPEDANCE
VOL )0.3 V
Figure 3. Switching Waveforms
VCC
R1
PULSE
GENERATOR
DUT
RT
CL
VCC
2
RL
RT = ZOUT of pulse generator (typically 50 Ω)
Figure 4. Test Circuit
DEVICE ORDERING INFORMATION
Package
Shipping†
NL17SZ07DFT2
SOT−353/SC70−5/SC−88A
3000 / Tape & Reel
NL17SZ07DFT2G
SOT−353/SC70−5/SC−88A
(Pb−Free)
3000 / Tape & Reel
NL17SZ07XV5T2
SOT−553
4000 / Tape & Reel
NL17SZ07XV5T2G
SOT−553
(Pb−Free)
4000 / Tape & Reel
Device
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
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4
NL17SZ07
PACKAGE DIMENSIONS
SC−88A, SOT−353, SC−70
CASE 419A−02
ISSUE J
A
NOTES:
1. DIMENSIONING AND TOLERANCING
PER ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. 419A−01 OBSOLETE. NEW STANDARD
419A−02.
4. DIMENSIONS A AND B DO NOT INCLUDE
MOLD FLASH, PROTRUSIONS, OR GATE
BURRS.
G
5
4
−B−
S
1
2
DIM
A
B
C
D
G
H
J
K
N
S
3
D 5 PL
0.2 (0.008)
B
M
M
N
INCHES
MIN
MAX
0.071
0.087
0.045
0.053
0.031
0.043
0.004
0.012
0.026 BSC
−−−
0.004
0.004
0.010
0.004
0.012
0.008 REF
0.079
0.087
J
C
K
H
SOLDERING FOOTPRINT*
0.50
0.0197
0.65
0.025
0.65
0.025
0.40
0.0157
1.9
0.0748
SCALE 20:1
mm Ǔ
ǒinches
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
http://onsemi.com
5
MILLIMETERS
MIN
MAX
1.80
2.20
1.15
1.35
0.80
1.10
0.10
0.30
0.65 BSC
−−−
0.10
0.10
0.25
0.10
0.30
0.20 REF
2.00
2.20
NL17SZ07
PACKAGE DIMENSIONS
SOT−553, 5 LEAD
CASE 463B−01
ISSUE B
D
−X−
5
A
4
1
e
2
E
−Y−
3
b
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETERS
3. MAXIMUM LEAD THICKNESS INCLUDES
LEAD FINISH THICKNESS. MINIMUM LEAD
THICKNESS IS THE MINIMUM THICKNESS
OF BASE MATERIAL.
L
HE
c
5 PL
0.08 (0.003)
M
MILLIMETERS
NOM
MAX
0.55
0.60
0.22
0.27
0.13
0.18
1.60
1.70
1.20
1.30
0.50 BSC
0.10
0.20
0.30
1.50
1.60
1.70
DIM
A
b
c
D
E
e
L
HE
X Y
MIN
0.50
0.17
0.08
1.50
1.10
INCHES
NOM
0.022
0.009
0.005
0.063
0.047
0.020 BSC
0.004
0.008
0.059
0.063
MIN
0.020
0.007
0.003
0.059
0.043
MAX
0.024
0.011
0.007
0.067
0.051
0.012
0.067
SOLDERING FOOTPRINT*
0.3
0.0118
0.45
0.0177
1.35
0.0531
1.0
0.0394
0.5
0.5
0.0197 0.0197
SCALE 20:1
mm Ǔ
ǒinches
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
ON Semiconductor and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
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PUBLICATION ORDERING INFORMATION
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6
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For additional information, please contact your
local Sales Representative.
NL17SZ07/D