SAMSUNG RC1005J123CS

February 2012
We, Samsung, declare that our component Chip Resistor is produced in accordance
with EU RoHS directive.
1. RoHS Compliance and restriction of Br
The following restricted materials are not used in packaging materials as well as products in compliance with the law and restriction.
- Cd, Pb, Hg, Cr+6, As, Br and the compounds, PCB, asbestos
- Bromic materials : PBBs, PBBOs, PBDO, PBDE, PBB
2. No use of materials breaking Ozone layer
The following ODS materials are not used in our fabrication process.
- ODS material : Freon, Haron, 1-1-1 TCE, CCl4, HCFC
If you want more detailed Information,Please Visit Samsung Electro-mechanics Website
[http://www.sem.samsung.com, http://www.semlcr.com]
CONTENTS
Operation Notes
4
Operation
Notes
Example of Land Pattern Design
5
Example of land
Pattern Design
Recommended Soldering Conditions
6
Recommended
Soldering Conditions
General Structure
7
General Structure
General
8
General
Precision
10
Precision
Jumper
12
Jumper
Low ohms(RC Series)
14
Low ohms
(RC Series)
Low ohms(RUT Series)
16
Low ohms
(RUT Series)
Ultra Low Ohms(RU Series)
18
Ultra Low Ohms
(RU Series)
Ultra Low Ohms(RUK Series)
20
Ultra Low Ohms
(RUK Series)
Ultra Low Ohms(RUW Series)
22
Ultra Low Ohms
(RUW Series)
Arrays(CONVEX Type)
24
Arrays
(CONVEX Type)
Arrays(CONCAVE Type)
26
Arrays
(CONCAVE Type)
Arrays(FLAT Type)
28
Arrays
(FLAT Type)
Arrays for Memory Modules
30
Arrays for
Memory Modules
Attenuator
32
Attenuator
Characteristics Performance
34
Characteristics
Performance
Packaging
36
Packaging
Standard Resistance Value
38
Standard
Resistance Value
Operation Notes
Applications
•Chip resistors are designed for general electronic devices
such as home appliances, computer, mobile communications,
digital circuit, etc. If you require our products with high
reliability-performing at more than 125℃ or below -55℃- for
medical equipments, aircrafts, high speed machines, military
usage, and items that can affect human life or if you need to
use in specific conditions (corrosive gas atmosphere like H2S
etc.), please contact us beforehand.
•Normal operation temperature ranges (℃) as follows.
-1608, 2012, 3216(general, precision) : -55℃~+155℃
-Others (rectangular, array, trimmable) : -55℃~+125℃
•Although resistor body is coated, sharp excessive impact
should be avoided to prevent damages and adverse effects
on characteristics (resistor value, open circuited, T.C.R.).
Mounting
Please give more attention not to press the chip owing to the
nozzle's improper height when it is mounted on PCB.
(Excessive pressure may cause exterior damage, change in
resistance, circuit open, etc.)
Safety precautions
•These products are designed and produced for applying
to the ordinary electronic equipments.
(AV equipment, OA equipment,Telecommunication
equipment, etc)
•Consult with our sales department before applying
in the devices that require extremely high
reliability such as medical equipments, transport
equipments, aircrafts/spacecrafts, nuclear power
controllers, fuel controllers, car equipments including
car accessories and other safety devices.
•Following special environments, and such
environmental conditions may affect the performance
of the product. Please verify the performance
and reliability thoroughly prior to use.
a) Using in various type of Liquid including water,
oil, organic solvent and other chemicals.
b) Using in the places where the products are exposed
to direct sunlight, sea wind, corrosive
gases (including Cl2, H2S, NH3, SO2, NO2),
static electricity, electromagnetic waves and dusty air.
c) Using close to heat generating components or
other flammable items.
d) Using in the places that is sealed or coated
with resins or other coating materials after
soldering.
e) Using in places subject to dew condensation.
•These products are not radiation resistant.
•The company is not responsible for any problems
resulting from using of the products under the
conditions not recommended herein.
•The company should notify any safety issues of the
products to the customer. And the safety of the
products should be monitored by the customer
periodically.
Storage
To maintain proper quality of chip components, the following
precautions are required for storage environment, method and
period.
•Storage Environment
- Make sure that the ambient temperature is within 5℃~40℃
and the ambient humidity is within 20~70%RH.
- Chip components may be deformed, if the temperature of
packaged components exceeds 40℃.
- Do not store where the soldering properties can be
deteriorated by harmful gas such as sulphurous gas,
chlorine gas, etc.
- Bulk packed chip components should be used as soon as
the seal is opened, thus preventing the solderability from
deteriorating.
- The remaining unused chips should be put in the original
bag and sealed again or store in a desiccator containing a
desiccating agent.
•Storage Time Period
Stored chip components should be used within 6 months
after receiving the components. If 6 months or more have
elapsed, please check the solderability before actually using.
Cleaning
After Soldering Cleaning, soldering flux & Ionic cleaning
liquid should be avoided on product.
If any possibility on product, please take a test before usage.
Caution for Chip Resistor
Seperation from PCB.
Chip resistor installation on PCB is a similar phenomenon on
to a chocolate chip on top of a cake.
PCB has enough flexibility on outer force but Chip resistor
can be defected without any bending.
(By chip resistor use of Ceramic, solder, metal)
Therefore, when separating a Chip resistor from a PCB,
beware of any crack on the chip.
Others
•Manual work
Whenever separating chip resistor from PCB, do not re-use
the chip resistor for circuit safety.
Electrical specification of chip resistors can be changed
by soldering iron after separation.
Re-use of separated chip resistor should be prohibited.
•Do not use more than rated voltage.
(Please check the contents of each product)
Example of Land
Pattern Design
Example of Land Pattern Design
When designing P.C.B, the shape and size of the solder lands must allow for the proper amount of solder under the resistor.
The amount of solder at the end terminations has a direct effect on the probability that the chip will crack.
The greater amount of solder, the amount of stress on the chip, and the more likely that it will break.
Use the following illustrations as guidelines for proper ‘solder lands design’.
Operation
Notes
For Chip Type
Example of land
Pattern Design
Recommended
Soldering Conditions
: Land Pattern
C
General Structure
: Chip Resistor
General
B
A
A
Precision
•Reflow soldering
(UNIT: mm)
Type
A
B
2A+B
0402
0.17
0.20
0603
0.37
1005
1608
•Reflow soldering(RU,RUW,RUK)
(UNIT: mm)
•Flow soldering
(UNIT: mm)
C
Type
A
B
2A+B
C
2.1
0.5
1005
0.7
0.5
1.9
0.5
0.5
2.1
0.8
1608
0.9
0.8
2.6
0.8
0.9
0.8
2.6
1.2
2012
1.0
1.4
3.4
1.3
1.7
1.2
4.6
1.4
3216
1.4
1.8
4.6
1.6
5025
2.15
1.8
6.1
2.6
3225
1.4
1.8
4.6
2.6
6432
2.3
3.0
7.6
3.3
5025
1.5
3.3
6.3
2.5
6432
1.5
4.6
7.6
3.2
C
Type
A
B
0.54
0.18
1005
0.8
0.5
0.28
1.02
0.29
1608
0.8
0.6
0.5
1.7
0.5
2012
0.8
0.8
2.4
0.8
3216
2012
0.9
1.4
3.2
1.2
3216
1.3
1.8
4.4
1.5
3225
1.3
1.8
4.4
2.4
5025
1.4
3.3
6.1
2.4
6432
1.4
4.6
7.4
3.0
2A+B
Jumper
Low ohms
(RC Series)
Low ohms
(RUT Series)
Ultra Low Ohms
(RU Series)
Ultra Low Ohms
(RUK Series)
Ultra Low Ohms
(RUW Series)
For Array Type
•Convex type
Arrays
(CONVEX Type)
•Concave type
P2
P1
P
E
E
Arrays
(CONCAVE Type)
D
Arrays
(FLAT Type)
: Land Pattern
D
: Chip Resistor
Arrays for
Memory Modules
B
A
A
C
B
C
(UNIT: mm)
(UNIT: mm)
Type
A
B
C
D
E
P1
P2
Type
A
B
C
D
E
P
062P
0.20
0.20
0.30
0.30
0.30
0.6
-
102P
0.3
0.3
0.2
0.5
0.4
0.5
0.5
104P
0.3
0.3
0.2
0.5
0.4
0.5
064P
0.20
0.20
0.20
0.30
0.30
0.5
10AT
0.4
0.4
0.25
0.5
0.5
0.65
102P
0.4
0.4
0.25
0.5
0.5
0.65
104P
0.7
0.3
0.2
0.5
0.5
0.55
0.5
164P
0.7
0.5
0.3
0.9
0.8
0.9
0.8
-
Attenuator
Characteristics
Performance
Packaging
Standard
Resistance Value
•This is the recommended land pattern for designing PCB.
This pattern does not guarantee any characteristic of other product.
The specifications and designs contained herein may be subject to change without notice.
Please contact our sales representatives or product engineers before order.
4
5
Recommended Soldering
Conditions
Abstract
•There are 3 soldering methods.
- Flow(wave) soldering.
- Reflow soldering. (Reflow soldering is broadly divided into the total heating method and local heating method.)
- Iron soldering.
Wave Soldering
Single Wave
Double Waves
Total Heating
Infrared Ray
Convection/Infrared
Hot Air
Hot Plate
Local Heating
Laser
Optical Beam
Air Heater
Reflow Soldering
Soldering Methods
Iron Soldering
Since Chip resistors come into direct contact with melted solder during soldering, it is exposed to potential mechanical stress caused
by the sudden temperature change. The chip resistors may also be subject to silver migration, and to contamination by the flux.
Because of these factors, soldering technique is critical.
Flow(wave) Soldering
•Features
PCB
solder
Primary wave
Secondary wave
There are two types of soldering methods in flow(wave) soldering.
One is single wave soldering, the other is a double waves soldering.
However, double waves soldering is mainly used. This method is
designed so that the continuous and multiple dipping processes
by waves of solder having completely different primary and
secondary characteristics and waveforms.
With the primary wave, a comparatively strong jet flow is used
to remove the flux gas and to solder.
With the secondary wave, it is used to remove excessive solder.
With the primary wave, the solder flows into a very small gap
between components and air bubbles remaining on the soldered
joint are removed.
With the secondary wave, the peel back is used to prevent bridging.
•Preheating
If a chip component is heated suddenly during soldering, it may be
cracked by the thermal shock caused by the temperature difference
Soldering
between the surface and the inside of the chip. To prevent this,
Temp.(℃)
a full preheating is necessary. In case of wave soldering, the
temperature difference between solder and surface of the
component is kept within 150℃. Also when cooling is done by
dipping into solvent, care should be taken to keep the temperature
Pre-heating
difference within 150℃.
245±10℃
5 sec. max.
Pre-heating
Gradual Cooling
in the air
△T
(Ⅰ)1206(3216) and below
:150℃ max.
Temp.(℃)
•Standard Soldering Condition
Soldering must be carried out without exceeding the approved
soldering temperature and time shown within the shaded area
of the right graph. An excessively long soldering time or high
soldering temperature results in leaching of the outer terminations.
When a PCB is warped, mechanical stress applied to the chip will
be increased and might be a cause of chip crack, especially if there
is big amount of solder on the chip. So, care should be taken not
to use excessive amount of solder on the PCB. For the flow(wave)
soldering, the solder amount can be controlled by land size.
Time(sec.)
120 sec. min.
< Flow Soldering>
General Structure
Reflow Soldering
•Pre-heating and cooling
In the reflow soldering method, a full pre-heating at the proper
temperature is necessary to dry and activate solder paste.
Tomb-stoning can be reduced by preheating at 150~180℃ for
more than 1 minute. Also when cooling is done by dipping into
solvent, care should be taken to keep the temperature difference
within 150℃.
•Standard Reflow Soldering Condition
Soldering must be carried out without exceeding the approved
soldering temperature and time shown within the shaded area
of the right graph. This prevents the terminations from leaching
and characteristics from deteriorating. When soldering is
repeated, the allowed time is the accumulated time.
245±10℃
10 sec. max.
Pre-heating
Soldering
Temp.(℃)
Gradual Cooling
in the air
217℃
Operation
Notes
Example of land
Pattern Design
200℃
150℃
Recommended
Soldering Conditions
General Structure
Time(sec.)
< Reflow Soldering>
•Standard solder amount
When a PCB is warped, mechanical stress applied to the chip should be reduced, and for doing so, care should be taken not to
use excessive amount of solder on the PCB. In case of the reflow method, the thickness of the coated solder paste is controlled to
prevent excessive solder. The thickness of solder paste should be 100~300㎛.
General
•Tombstoning and Prevention
When reflow soldering, or especially vapor phase soldering (VPS), small chip components of less than RC3216 type may break
away from solder and stand on end. This is commonly known as tombstoning or the Manhattan phenomenon.
Jumper
- Preventing tombstoning
Keep land size as small as possible.
Keep the pre-heating conditions properly
( Pre-heating temperature : 150 ~ 180°, Pre-heating time : more than 1 min.)
Keep the solder paste quantity not too much and uniform for every lands.
Keep the position of chips properly.
At around the soldering temperature, keep minimize the difference of the temperature between the electrodes of a chip.
Precision
Low ohms
(RC Series)
Low ohms
(RUT Series)
Ultra Low Ohms
(RU Series)
Ultra Low Ohms
(RUK Series)
Iron Soldering
When using a soldering iron or any other soldering operation, the permissible temperature and time should not be exceeded
that in the reflow soldering. In other to prevent the external terminations from leaching and characteristics from deteriorating,
the tip of the soldering iron should not touch the chip component (ceramic element, resin case, etc.). Soldering with a soldering
iron and correcting with a soldering iron can be performed right the following conditions.
Ultra Low Ohms
(RUW Series)
Arrays
(CONVEX Type)
Arrays
(CONCAVE Type)
Item
Condition
Temperature at tip
Soldering iron output
End of soldering iron
Note
350℃ Max.
20-Watt Max.
Ø3mm Max.
Do not directly touch the chip by the tip of the iron.
Arrays
(FLAT Type)
Arrays for
Memory Modules
General Structure of the Chip Resistor
Attenuator
Name
Main Substance
Ceramic Substrate
Inner Electrode
Resistor
Glass Coat
Protective Coat
Terminal Coat
Ni Plate
Sn Plate
Al2 O 3
Ag / Cu
Ag-Pd / Cu-Ni
Bi2O3, SiO2
Polymer / Glass
Ni-Cr Alloy
Ni
Sn
No.
The specifications and designs contained herein may be subject to change without notice.
Please contact our sales representatives or product engineers before order.
Characteristics
Performance
Packaging
Standard
Resistance Value
6
7
General
Feature
•Very small, thin, and light weight.
•Both flow and reflow soldering are applicable.
•Owing to the reduced lead inductance, the high frequency
characteristic is excellent.
•Suitable size and packaging for surface mount assembly.
The product of lead-free terminal is RoHS compliant.
PbO(lead oxide) is included in the glass of our product which is prescribed
on RoHS appendix as an exception.
Application
•General purpose
•Home Appliances
(DVD, Digital TV,CAMCODER, VTR, Digital Camera, Audio,Tunner)
•For Computers & Communications
(Notebook, Memory Module, Mobile, Network Equipment, etc)
Structure and Dimensions
103
l1
W
H
I2
L
<Top View>
<Side View>
(UNIT: mm)
Type
Inch
Power(W)
L
W
H
I1
I2
Average
Weight
RC0402
RC0603
RC1005
RC1608
RC2012
RC3216
RC3225
RC5025
RC6432
01005
0201
0402
0603
0805
1206
1210
2010
2512
1/32
1/20
1/16
1/10
1/8
1/4
1/3
2/3
1
0.40±0.02
0.60±0.03
1.00±0.05
1.60±0.10
2.00±0.20
3.20±0.20
3.20±0.20
5.00±0.20
6.30±0.20
0.20±0.02
0.30±0.03
0.50±0.05
0.80±0.15
1.25±0.15
1.60±0.15
2.55±0.20
2.50±0.20
3.20±0.20
0.13±0.02
0.23±0.03
0.35±0.05
0.45±0.10
0.50±0.10
0.55±0.10
0.55±0.10
0.55±0.10
0.55±0.10
0.10±0.03
0.10±0.05
0.20±0.10
0.30±0.20
0.40±0.20
0.45±0.20
0.45±0.20
0.60±0.20
0.60±0.20
0.10±0.03
0.15±0.05
0.25±0.10
0.35±0.10
0.35±0.20
0.40±0.20
0.40±0.20
0.60±0.20
0.60±0.20
0.04㎎
0.15㎎
0.6㎎
2.1㎎
4.9㎎
9.5㎎
16㎎
26㎎
41㎎
Parts Numbering System
•The part number system shall be in the following format
RC
Code Designation
2012
Dimension & Size Code
RC: Chip Resistor
0402: 0.4×0.2(㎜) - 01005(inch)
0603: 0.6×0.3(㎜) - 0201(inch)
1005: 1.0×0.5(㎜) - 0402(inch)
1608: 1.6×0.8(㎜) - 0603(inch)
2012: 2.0×1.2(㎜) - 0805(inch)
3216: 3.2×1.6(㎜) - 1206(inch)
3225: 3.2×2.5(㎜) - 1210(inch)
5025: 5.0×2.5(㎜) - 2010(inch)
6432: 6.4×3.2(㎜) - 2512(inch)
J
Tolerance
100
Resistance Value
F : ±1%
G : ±2%
J : ±5%
K : ±10%
3 or 4 digits coding system
(IEC coding system)
3digits (E-24 series)
4digits (E-96 series)
CS
Packaging Code
GS: Bulk Packaging
CS: Tape Packaging 7"
ES: Tape Packaging 10"
AS: Tape Packaging 13"
Specification
Power
Rating
(W)
Type
Working Overload
Voltage Voltage
(MAX)
(MAX)
RC 0402
1/32
15(V)
30(V)
RC0603
RC1005
RC1608
RC2012
RC3216
RC3225
RC5025
RC6432
1/20
1/16
1/10
1/8
1/4
1/3
2/3
1
25(V)
50(V)
50(V)
100(V)
150(V)
300(V)
200(V)
Resistance
Range (Ω)
TCR (ppm/℃)
10~99Ω: ±300
100~1 : ±250
Rated
Working
Temperature
Rated
Ambient
Temperature
10Ω~1
1~9.9Ω:+300,-200
10Ω~1 :±100
(0603: ±250)
1.1 ~10 :±300
-55℃~+125℃
Operation
Notes
Example of land
Pattern Design
Recommended
Soldering Conditions
70℃
1Ω~10
-55℃~+155℃
General Structure
400(V)
General
√
•Rated voltage (V) =
Rated power(W)×Normal resistance value (R)
Rated voltage should be lower than (MAX) working voltage.
Precision
Power Derating Curve
Jumper
The rated power is the maximum continuous loading power at 70℃ ambient temperature.
For ambient temperature above 70℃, the loading power follows the below power derating curve.
(The load current shall be derated according to derating curve in case of the 'Jumper')
<1005, 1608, 2012, 3216, 3225, 5025, 6432>
<0402, 0603>
Percentage of the rated
dissipation(%)
Percentage of the rated
dissipation(%)
Low ohms
(RUT Series)
100
100
80
60
Operation area
40
20
0
Low ohms
(RC Series)
-55
70
-40
0
40
Marking
Ultra Low Ohms
(RUK Series)
Operation area
40
Ultra Low Ohms
(RUW Series)
20
0
155
70
-55
-30
0
30
60
90
120
150
Ambient Temperature(℃)
•4 digits indication
(E-96 series)
- Left 2 digits represent
significant figures.
- Last 1 digit represents
exponential number of 10.
- Example: 103
Left 2 digits: 10
Last 1 digit: 3
103 = 10×10 3Ω
= 10000Ω=10kΩ
- Left 3 digits represent
significant figures.
- Last 1 digit represents
exponential number of 10.
- Example: 1002
Left 3 digits: 100
Last 1 digit: 2
1002 = 100×10 2Ω
= 10000Ω=10kΩ
1002
•0603, 1005 type: No marking. •0603, 1005, 1608 type:
No marking.
E-96
E-24
E-96
100
102
105
107
110
113
115
118
121
124
127
130
133
137
140
143
147
150
154
158
162
165
169
174
10
178
182
187
191
196
200
205
210
215
221
226
232
237
243
249
255
261
267
274
280
287
294
301
309
11
12
13
15
16
The specifications and designs contained herein may be subject to change without notice.
Please contact our sales representatives or product engineers before order.
E-24
18
20
22
24
27
30
E-96
316
324
332
340
348
357
365
374
383
392
402
412
422
432
442
453
464
475
487
499
511
523
536
549
E-24
33
36
39
43
47
51
Arrays
(CONVEX Type)
Arrays
(CONCAVE Type)
IEC Code System (E-96, E-24)
•3 digits indication
(E-24 series)
103
60
125
80
120
Ambient Temperature(℃)
Ultra Low Ohms
(RU Series)
80
E-96
E-24
562
576
590
604
619
634
649
665
681
698
715
732
750
768
787
806
825
845
866
887
909
931
953
976
56
Arrays
(FLAT Type)
Arrays for
Memory Modules
62
Attenuator
68
75
Characteristics
Performance
Packaging
82
Standard
Resistance Value
91
8
9
Precision
Feature
•Low tolerance (±0.5%)
•Both flow and reflow soldering are applicable.
•Suitable size and packaging for surface mount assembly.
•Owing to the reduced lead inductance, the high frequency
characteristic is excellent.
The product of lead-free terminal is RoHS compliant.
PbO(lead oxide) is included in the glass of our product which is prescribed
on RoHS appendix as an exception.
Application
•Circuit for high precision resistance and reliability.
•For signal control part
•For tunning circuit.
Structure and Dimensions
1002
l1
W
H
I2
L
<Top View>
<Side View>
(UNIT: mm)
Type
Inch
Power(W)
L
W
H
I1
I2
Average
Weight
RC1005
RC1608
RC2012
RC3216
RC3225
RC5025
RC6432
0402
0603
0805
1206
1210
2010
2512
1/16
1/10
1/8
1/4
1/3
2/3
1
1.00±0.05
1.60±0.10
2.00±0.20
3.20±0.20
3.20±0.20
5.00±0.20
6.30±0.20
0.50±0.05
0.80±0.15
1.25±0.15
1.60±0.15
2.55±0.20
2.50±0.20
3.20±0.20
0.35±0.05
0.45±0.10
0.50±0.10
0.55±0.10
0.55±0.10
0.55±0.10
0.55±0.10
0.20±0.10
0.30±0.20
0.40±0.20
0.45±0.20
0.45±0.20
0.60±0.20
0.60±0.20
0.25±0.10
0.35±0.10
0.35±0.20
0.40±0.20
0.40±0.20
0.60±0.20
0.60±0.20
0.6㎎
2.1㎎
4.9㎎
9.5㎎
16㎎
26㎎
41㎎
Parts Numbering System
•The part number system shall be in the following format
RC
Code Designation
1005
Dimension & Size Code
RC: Chip Resistor
1005: 1.0×0.5(㎜) - 0402(inch)
1608: 1.6×0.8(㎜) - 0603(inch)
2012: 2.0×1.2(㎜) - 0805(inch)
3216: 3.2×1.6(㎜) - 1206(inch)
3225: 3.2×2.5(㎜) - 1210(inch)
5025: 5.0×2.5(㎜) - 2010(inch)
6432: 6.4×3.2(㎜) - 2512(inch)
D
Tolerance
1002
Resistance Value
CS
Packaging Code
D : ±0.5%
3 or 4 digits coding system
(IEC coding system)
3digits (E-24 series)
4digits (E-96 series)
GS: Bulk Packaging
CS: Tape Packaging 7"
ES: Tape Packaging 10"
AS: Tape Packaging 13"
Specification
Working Overload
Voltage Voltage
(MAX)
(MAX)
Power
Rating
(W)
Type
RC1005
RC1608
RC2012
RC3216
RC3225
RC5025
RC6432
1/16
1/10
1/8
1/4
1/3
2/3
1
50(V)
100(V)
150(V)
300(V)
200(V)
400(V)
Rated
Working
Temperature
Rated
Ambient
Temperature
Resistance
Range (Ω)
TCR (ppm/℃)
Operation
Notes
Example of land
Pattern Design
1~9.9Ω:+300
10Ω~1 :±100
1.1 ~10 :±300
70℃
1Ω~10
-55℃~+155℃
Recommended
Soldering Conditions
General Structure
√
•Rated voltage (V) =
Rated power(W)×Normal resistance value (R)
Rated voltage should be lower than (MAX) working voltage.
General
Marking
Power Derating Curve
The rated power is the maximum continuous loading power at 70℃
ambient temperature.
For ambient temperature above 70℃, the loading power follows
the below power derating curve.
<1005, 1608, 2012, 3216, 3225, 5025, 6432>
Percentage of the rated
dissipation(%)
100
80
60
Operation area
40
•3 digits indication
(E-24 series)
•4 digits indication
(E-96 series)
- Left 2 digits represent
significant figures.
- Last 1 digit represents
exponential number of 10.
- Example: 103
Left 2 digits: 10
Last 1 digit: 3
103 = 10×10 3Ω
= 10000Ω=10kΩ
- Left 3 digits represent
significant figures.
- Last 1 digit represents
exponential number of 10.
- Example: 1002
Left 3 digits: 100
Last 1 digit: 2
1002 = 100×10 2Ω
= 10000Ω=10kΩ
103
20
0
Precision
-55
70
-30
0
30
60
155
90
120
150
Ambient Temperature(℃)
Low ohms
(RC Series)
Low ohms
(RUT Series)
Ultra Low Ohms
(RU Series)
Ultra Low Ohms
(RUK Series)
1002
•1005 type: No marking.
Jumper
Ultra Low Ohms
(RUW Series)
•1005, 1608 type:
No marking.
Arrays
(CONVEX Type)
Significant Figure of Resistance Value
Arrays
(CONCAVE Type)
E192 E96 E24 E192 E96 E24 E192 E96 E24 E192 E96 E24 E192 E96 E24 E192 E96 E24 E192 E96 E24 E192 E96 E24
100
101
102
104
105
106
107
109
110
111
113
114
115
117
118
120
121
123
124
126
127
129
130
132
100
10
102
105
107
110
11
113
115
118
12
121
124
127
130
13
133
135
137
138
140
142
143
145
147
149
150
152
154
156
158
160
162
164
165
167
169
172
174
176
133
137
140
143
147
150
15
154
158
16
162
165
169
174
178
180
182
184
187
189
191
193
196
198
200
203
205
208
210
213
215
218
221
223
226
229
232
234
178
18
182
187
191
196
200
20
205
210
215
221
226
232
22
237
240
243
246
249
252
255
258
261
264
267
271
274
277
280
284
287
291
294
298
301
305
309
312
237
24
243
249
255
261
267
27
274
280
287
294
301
309
30
316
320
324
328
332
336
340
344
348
352
357
361
365
370
374
379
383
388
392
397
402
407
412
417
316
324
332
33
340
348
357
36
365
374
383
392
402
412
39
422
427
432
437
442
448
453
459
464
470
475
481
487
493
499
505
511
517
523
530
536
542
549
556
The specifications and designs contained herein may be subject to change without notice.
Please contact our sales representatives or product engineers before order.
422
432
43
442
453
464
47
475
487
499
511
523
536
549
51
562
569
576
583
590
597
604
612
619
626
634
642
649
657
665
673
681
690
698
706
715
723
732
741
562
56
576
590
604
619
62
634
649
665
681
698
715
732
68
750
759
768
777
787
796
806
816
825
835
845
856
866
876
887
898
909
920
931
942
953
965
976
988
750
75
Arrays
(FLAT Type)
768
Arrays for
Memory Modules
787
806
825
82
845
Characteristics
Performance
866
887
909
931
Attenuator
Packaging
91
Standard
Resistance Value
953
976
10
11
Jumper
Feature
•Very small, thin, and light weight.
•Both flow and reflow soldering are applicable.
•Owing to the reduced lead inductance, the high frequency
characteristic is excellent.
•Suitable size and packaging for surface mount assembly.
The product of lead-free terminal is RoHS compliant.
PbO(lead oxide) is included in the glass of our product which is prescribed
on RoHS appendix as an exception.
Application
•General purpose
•Home Appliances
(DVD, Digital TV,CAMCODER, VTR, Digital Camera, Audio,Tunner)
•For Computers & Communications
(Notebook, Memory Module, Mobile, Network Equipment, etc)
Structure and Dimensions
<Top View>
<Top View>
000
000
W
A1
l1
<Side View>
A2
L
L
P
T
<Bottom View>
<Side View>
I2
T
W
I2
(UNIT: mm)
Type
Inch
Power(W)
L
W
T
RC0402
RC0603
RC1005
RC1608
RC2012
RC3216
RC3225
RC5025
RC6432
RP102P
RP104P
RP164P
01005
0201
0402
0603
0805
1206
1210
2010
2512
0404
0804
1206
1/32
1/20
1/16
1/10
1/8
1/4
1/3
2/3
1
1/16
1/16
1/16
0.40±0.02
0.60±0.03
1.00±0.05
1.60±0.10
2.00±0.20
3.20±0.20
3.20±0.20
5.00±0.20
6.30±0.20
1.00±0.10
2.00±0.10
3.20±0.10
0.20±0.02
0.30±0.03
0.50±0.05
0.80±0.15
1.25±0.15
1.60±0.15
2.55±0.20
2.50±0.20
3.20±0.20
1.00±0.10
1.00±0.10
1.60±0.10
0.13±0.02
0.23±0.03
0.35±0.05
0.45±0.10
0.50±0.10
0.55±0.10
0.55±0.10
0.55±0.10
0.55±0.10
0.35±0.10
0.35±0.10
0.50±0.10
A1
A2
0.33±0.10 0.33±0.10
0.40±0.15 0.30±0.15
0.60±0.15 0.40±0.15
I1
0.10±0.03
0.10±0.05
0.20±0.10
0.30±0.20
0.40±0.20
0.45±0.20
0.45±0.20
0.60±0.20
0.60±0.20
0.20±0.10
0.15±0.10
0.30±0.15
I2
P
0.10±0.03
0.15±0.05
0.25±0.10
0.35±0.10
0.35±0.20
0.40±0.20
0.40±0.20
0.60±0.20
0.60±0.20
0.25±0.10 0.65±0.10
0.25±0.10 0.50±0.15
0.30±0.15 0.80±0.15
Average
Weight
0.04㎎
0.15㎎
0.6㎎
2.1㎎
4.9㎎
9.5㎎
16㎎
26㎎
41㎎
1.1㎎
2.2㎎
8.9㎎
Parts Numbering System
•The part number system shall be in the following format
RC
Code Designation
2012
Dimension & Size Code
RC: Chip Resistor
RP : Array
0402: 0.4×0.2(㎜) - 01005(inch)
0603: 0.6×0.3(㎜) - 0201(inch)
1005: 1.0×0.5(㎜) - 0402(inch)
1608: 1.6×0.8(㎜) - 0603(inch)
2012: 2.0×1.2(㎜) - 0805(inch)
3216: 3.2×1.6(㎜) - 1206(inch)
3225: 3.2×2.5(㎜) - 1210(inch)
5025: 5.0×2.5(㎜) - 2010(inch)
6432: 6.4×3.2(㎜) - 2512(inch)
102P: 1.0×1.0(㎜) - 0404(inch)
104P: 2.0×1.0(㎜) - 0804(inch)
164P: 3.2×1.6(㎜) - 1206(inch)
J
Tolerance
CS
Packaging Code
000
Resistance Value
Operation
Notes
Example of land
Pattern Design
GS: Bulk Packaging
CS: Tape Packaging 7"
ES: Tape Packaging 10"
AS: Tape Packaging 13"
Jumer: 000
J : Max 50 Ω
Recommended
Soldering Conditions
General Structure
General
Precision
Jumper Resistors
Current Rating
Resistance
Type
RC0402
RC0603
RC1005
RC1608
RC2012
RC3216
RC3225
RC5025
RC6432
RP102P
RP104P
RP164P
Rated Ambient
Temperature
Jumper
Rated Working
Temperature
Marking
0.5 (A)
Low ohms
(RC Series)
X
1.0 (A)
Low ohms
(RUT Series)
50mΩmax
2.0 (A)
1 ~ 1M
-55℃ ~ +125℃
70℃
Ultra Low Ohms
(RU Series)
O
Ultra Low Ohms
(RUK Series)
X
O
1.0 (A)
Ultra Low Ohms
(RUW Series)
Arrays
(CONVEX Type)
Power Derating Curve
Arrays
(CONCAVE Type)
The rated power is the maximum continuous loading power at 70℃ ambient temperature.
For ambient temperature above 70℃, the loading power follows the below power derating curve.
(The load current shall be derated according to derating curve in case of the 'Jumper')
100
Percentage of the rated
dissipation(%)
Percentage of the rated
dissipation(%)
100
80
60
Operation area
40
20
0
Arrays
(FLAT Type)
<1005, 1608, 2012, 3216, 3225, 5025, 6432>
<0402, 0603>
-55
70
-40
0
40
80
Attenuator
60
Operation area
40
Characteristics
Performance
20
125
80
120
Ambient Temperature(℃)
Arrays for
Memory Modules
0
70
-55
-30
The specifications and designs contained herein may be subject to change without notice.
Please contact our sales representatives or product engineers before order.
0
30
60
155
90
120
150
Ambient Temperature(℃)
Packaging
Standard
Resistance Value
12
13
Low Ohms(RC Series)
Feature
•Under 1 ohms, precision resistance.
•Both flow and reflow soldering are applicable.
•The product of lead-free terminal is RoHS compliant.
100% Lead-free Products (PbO is not used)
Application
•Current detect.
•Safe circuit through protecting over-current flow.
•Power supplying part, DC power charger, adapter.
•Mobile Phone, HDD, DSC, LCD.
Structure and Dimensions
R100
l1
W
H
I2
L
<Top View>
<Side View>
(UNIT: mm)
Average
Weight
Type
Inch
Power(W)
L
W
H
I1
I2
RC1005
RC1608
RC2012
RC3216
RC3225
RC5025
RC6432
0402
0603
0805
1206
1210
2010
2512
1/16
1/10
1/8
1/ 4
1/3
2/3
1
1.00±0.05
1.60±0.10
2.00±0.20
3.20±0.20
3.20±0.20
5.00±0.20
6.30±0.20
0.50±0.05
0.80±0.15
1.25±0.15
1.60±0.15
2.55±0.20
2.50±0.20
3.20±0.20
0.35±0.05
0.45±0.10
0.50±0.10
0.55±0.10
0.55±0.10
0.55±0.10
0.55±0.10
0.20±0.10
0.30±0.20
0.40±0.20
0.45±0.20
0.45±0.20
0.60±0.20
0.60±0.20
0.25±0.10
0.35±0.10
0.35±0.20
0.40±0.20
0.40±0.20
0.60±0.20
0.60±0.20
0.6㎎
2.1㎎
4.9㎎
9.5㎎
16㎎
26㎎
41㎎
Parts Numbering System
•The part number system shall be in the following format
RC
Code Designation
6432
Dimension & Size Code
J
Tolerance
R68
Resistance Value
CS
Packaging Code
RC: Chip Resistor
1005: 1.0×0.5(㎜) - 0402(inch)
1608: 1.6×0.8(㎜) - 0603(inch)
2012: 2.0×1.2(㎜) - 0805(inch)
3216: 3.2×1.6(㎜) - 1206(inch)
3225: 3.2×2.5(㎜) - 1210(inch)
5025: 5.0×2.5(㎜) - 2010(inch)
6432: 6.4×3.2(㎜) - 2512(inch)
F: ±1%
G: ±2%
J: ±5%
3 or 4 digits coding system
(E-24 series)
GS: Bulk Packaging
CS: Tape Packaging 7"
ES: Tape Packaging 10"
AS: Tape Packaging 13"
Specification
Type
Power
Rating
(W)
RC1005
RC1608
RC2012
RC3216
RC3225
RC5025
RC6432
1/16
1/10
1/8
1/4
1/3
2/3
1
Working
Voltage
(V, MAX)
TCR (ppm/℃)
√(P×R)
0.1Ω≤R≤0.2Ω
:+700,- 600
R > 0.2Ω:±250
Resistance Range (Ω)
Rated
Rated
Working
F(±1%) G(±2%) J(±5%) Ambient
E-24
E-24 Temperature Temperature
E-24
Example of land
Pattern Design
0.1~0.98
70℃
-55~+155℃
Recommended
Soldering Conditions
General Structure
√
•Rated voltage (V) =
Rated power(W)×Normal resistance value (R)
Rated voltage should be lower than (MAX) working voltage.
Power Derating Curve
Percentage of the rated
dissipation(%)
100
60
Operation area
40
20
70
0
30
60
155
90
120
Precision
E-24 series
Jumper
3 digits indication
- R means decimal point.
- Other digits represent
significant value.
- Example: R22
Left 1 digit: R
Last 2 digits: 22
R22 = 0.22Ω
80
-55
-30
General
Marking
The rated power is the maximum continuous loading
power at 70℃ ambient temperature.
For ambient temperature above 70℃, the loading power
follows the below power derating curve.
0
Operation
Notes
R22
4 digits indication
- R means decimal point.
- Other digits represent
significant value.
-Example: R075
Left 1 digit: R
Last 3 digits:075
R075 = 0.075Ω
R075
150
Ambient Temperature(℃)
Low ohms
(RC Series)
Low ohms
(RUT Series)
Ultra Low Ohms
(RU Series)
Ultra Low Ohms
(RUK Series)
Ultra Low Ohms
(RUW Series)
Arrays
(CONVEX Type)
Arrays
(CONCAVE Type)
Resistance Value Table
•E-24 series
Code
R-value
Code
R-value
R10
0.10Ω
R33
0.33Ω
R11
0.11Ω
R36
0.36Ω
R12
0.12Ω
R39
0.39Ω
R13
0.13Ω
R43
0.43Ω
R15
0.15Ω
R47
0.47Ω
R16
0.16Ω
R51
0.51Ω
R18
0.18Ω
R56
0.56Ω
R20
0.20Ω
R62
0.62Ω
R22
0.22Ω
R68
0.68Ω
R24
0.24Ω
R75
0.75Ω
R27
0.27Ω
R82
0.82Ω
R30
0.30Ω
R91
0.91Ω
The specifications and designs contained herein may be subject to change without notice.
Please contact our sales representatives or product engineers before order.
Arrays
(FLAT Type)
Arrays for
Memory Modules
Attenuator
Characteristics
Performance
Packaging
Standard
Resistance Value
14
15
Low Ohms(RUT Series)
Feature
•Under 1 ohms, precision resistance.
•Both flow and reflow soldering are applicable.
•Ag metal is not used for termination electrode.
(Good Sulfide -Resistant)
•The product of lead-free terminal is RoHS compliant.
100% Lead-free Products (PbO is not used)
Application
•Current detect.
•Safe circuit through protecting over-current flow.
•Power supplying part, DC power charger, adapter.
•Mobile Phone, HDD, DSC, LCD.
Structure and Dimensions
R100
l1
W
H
I2
L
<Top View>
<Side View>
(UNIT: mm)
Type
Inch
RUT1005
0402
Power(W)
1/10
L
W
H
I1
I2
Average
Weight
1.00±0.05
0.50±0.05
0.35±0.05
0.20±0.10
0.25±0.10
0.6㎎
1/8
1.60±0.10
0.80±0.15
0.45±0.10
0.30±0.20
0.35±0.20
2.1㎎
1/4
1.25±0.15
0.55±0.10
0.40±0.20
0.35±0.20
4.9㎎
(0.1)
RUT1608
0603
RUT2012
0805
(0.25)
2.00±0.20
RUT3216
1206
(0.33)
1/3
3.20±0.20
1.60±0.15
0.60±0.10
0.45±0.20
0.40±0.20
9.5㎎
2512
1
6.30±0.20
3.20±0.20
0.60±0.10
0.60±0.25
0.60±0.25
41㎎
RUT6432
(0.125)
(1.0)
Parts Numbering System
•The part number system shall be in the following format
RUT
Code Designation
2012
Dimension & Size Code
J
Tolerance
RUT: Current
Sensing Resistor
Top Mounting
(Face-up)
1005: 1.0×0.5(㎜) - 0402(inch)
1608: 1.6×0.8(㎜) - 0603(inch)
2012: 2.0×1.2(㎜) - 0805(inch)
3216: 3.2×1.6(㎜) - 1206(inch)
6432: 6.4×3.2(㎜) - 2512(inch)
F: ±1%
G: ±2%
J: ±5%
R68
Resistance Value
CS
Packaging Code
3 or 4 digits coding system
GS: Bulk Packaging
CS: Tape Packaging 7"
ES : Tape Packaging 10"
AS: Tape Packaging 13"
(IEC conding system)
3digits(E-24 series)
4digits(E-96 series)
Specification
Type
Power
Rating
(W)
RUT1005
1/10
Working
Voltage
(V, MAX)
TCR (ppm/℃)
Resistance Range (Ω)
Rated
Rated
Working
F(±1%) G(±2%) J(±5%) Ambient
E-24
E-24 Temperature Temperature
E-24
(0.1)
Example of land
Pattern Design
1/8
RUT1608
(0.125)
RUT2012
(0.25)
RUT3216
(0.33)
RUT6432
(1.0)
√(P×R)
1/4
0.1~0.98
±150
-55~+155℃
70℃
Recommended
Soldering Conditions
1/3
1
General Structure
√
•Rated voltage (V) =
Rated power(W)×Normal resistance value (R)
Rated voltage should be lower than (MAX) working voltage.
Power Derating Curve
Percentage of the rated
dissipation(%)
100
60
Operation area
40
20
70
0
30
Precision
E-24 series
Jumper
3 digits indication
4 digits indication
- R means decimal point.
- Other digits represent
significant value.
- Example: R22
Left 1 digit: R
Last 2 digits: 22
R22 = 0.22Ω
80
-55
-30
General
Marking
The rated power is the maximum continuous loading
power at 70℃ ambient temperature.
For ambient temperature above 70℃, the loading power
follows the below power derating curve.
0
Operation
Notes
155
60
90
120
- R means decimal point.
- Other digits represent
significant value.
-Example: R075
Left 1 digit: R
Last 3 digits:075
R075 = 0.075Ω
Low ohms
(RUT Series)
Ultra Low Ohms
(RU Series)
Ultra Low Ohms
(RUK Series)
R075
R22
Low ohms
(RC Series)
Ultra Low Ohms
(RUW Series)
150
Ambient Temperature(℃)
Arrays
(CONVEX Type)
Resistance Value Table
Code Value
(Ω)
R100 0.1
R102 0.102
R105 0.105
R107 0.107
R110 0.11
R113 0.113
R115 0.115
R118 0.118
R120 0.12
R121 0.121
R124 0.124
R127 0.127
R130 0.13
R133 0.133
R137 0.137
R140 0.14
R143 0.143
R147 0.147
R150 0.15
Value Tol
Value Tol
Value Tol
Value Tol
Value Tol
Tol
(%) Code (Ω) (%) Code (Ω) (%) Code (Ω) (%) Code (Ω) (%) Code (Ω) (%)
±1, ±5
±1
±1
±1
±1, ±5
±1
±1
±1
±1, ±5
±1
±1
±1
±1, ±5
±1
±1
±1
±1
±1
±1, ±5
R154
R158
R160
R162
R165
R169
R174
R178
R180
R182
R187
R191
R196
R200
R205
R210
R215
R220
R221
0.154
0.158
0.16
0.162
0.165
0.169
0.174
0.178
0.180
0.182
0.187
0.191
0.196
0.200
0.205
0.21
0.215
0.22
0.221
±1
±1
±1, ±5
±1
±1
±1
±1
±1
±1, ±5
±1
±1
±1
±1
±1, ±5
±1
±1
±1
±1, ±5
±1
R226
R232
R237
R240
R243
R249
R255
R261
R267
R270
R274
R280
R287
R294
R300
R301
R309
R316
R24
0.226 ±1 R330 0.33 ±1, ±5
0.232 ±1 R332 0.332 ±1
0.237 ±1 R340 0.34 ±1
0.24 ±1, ±5 R348 0.348 ±1
0.243 ±1 R357 0.357 ±1
0.249 ±1 R360 0.36 ±1, ±5
0.255 ±1 R365 0.365 ±1
0.261 ±1 R374 0.374 ±1
0.267 ±1 R383 0.383 ±1
0.27 ±1, ±5 R390 0.39 ±1, ±5
0.274 ±1 R392 0.392 ±1
0.28 ±1 R402 0.402 ±1
0.287 ±1 R412 0.412 ±1
0.294 ±1 R422 0.422 ±1
0.3 ±1, ±5 R430 0.43 ±1, ±5
0.301 ±1 R432 0.432 ±1
0.309 ±1 R442 0.442 ±1
0.316 ±1 R453 0.453 ±1
0.324 ±1 R464 0.464 ±1
The specifications and designs contained herein may be subject to change without notice.
Please contact our sales representatives or product engineers before order.
R470
R475
R487
R499
R510
R511
R523
R536
R549
R560
R562
R576
R590
R604
R619
R620
R634
R649
R665
0.47
0.475
0.487
0.499
0.51
0.511
0.523
0.536
0.549
0.56
0.562
0.576
0.59
0.604
0.619
0.62
0.634
0.649
0.665
±1, ±5
±1
±1
±1
±1, ±5
±1
±1
±1
±1
±1, ±5
±1
±1
±1
±1
±1
±1, ±5
±1
±1
±1
R680
R681
R698
R715
R732
R750
R768
R787
R806
R820
R825
R845
R866
R887
R909
R910
R931
R953
R976
0.68
0.681
0.698
0.715
0.732
0.75
0.768
0.787
0.806
0.82
0.825
0.845
0.866
0.887
0.909
0.91
0.931
0.953
0.976
±1, ±5
±1
±1
±1
±1
±1, ±5
±1
±1
±1
±1, ±5
±1
±1
±1
±1
±1
±1, ±5
±1
±1
±1
Arrays
(CONCAVE Type)
Arrays
(FLAT Type)
Arrays for
Memory Modules
Attenuator
Characteristics
Performance
Packaging
Standard
Resistance Value
16
17
Ultra Low Ohms(RU Series)
Feature
•Ultra Low Ohms Resistor, high precision reliability
•Suitable for reflow and soldering.
•Very stable Temperature coefficient characteristics.
•Reverse Type.
•Ag metal is not used for termination electrode.
(Good Sulfide -Resistant)
•100% Lead-free Products (PbO is not used)
•RoHS Compliant.
Application
•Current Sensings.
•Safe circuit through protecting over current flow.
•Power supplying part, DC power charger, adapter.
•Mobile Phone, Mobile PC, Note PC, HDD, DSC, LCD
Structure and Dimensions
<Top View>
<Bottom View>
R010
l1
W
L
<Side View>
H
I2
(UNIT: mm)
Average
Weight
Type
Inch
Power(W)
L
W
H
I1
I2
RU1005
0402
(0.125)
1/8
1.00±0.05
0.50±0.05
0.35±0.05
0.25±0.15
0.25±0.15
0.6㎎
RU1608
0603
(0.25)
1/4
1.60±0.10
0.80±0.15
0.45±0.10
0.30±0.20
2.2㎎
RU2012
0805
(0.33)
1/3
2.00±0.20
1.25±0.15
0.55±0.10
0.40±0.20
RU3216
1206
1/ 2
(0.5)
3.20±0.20
1.60±0.15
0.60±0.10
0.45±0.20
RU6432
2512
(1.0)
1
6.30±0.20
3.20±0.20
0.60±0.10
0.80±0.25
R 〈0.03Ω:0.50±0.20
R≥0.03Ω:0.35±0.20
R 〈0.03Ω:0.65±0.20
R≥0.03Ω:0.40±0.20
R 〈0.03Ω:0.90±0.20
R≥0.03Ω:0.60±0.20
R 〈0.03Ω:1.90±0.20
R≥0.03Ω:1.10±0.25
4.7㎎
9.4㎎
42㎎
Parts Numbering System
•The part number system shall be in the following format
RU
Code Designation
2012
Dimension & Size Code
F
Tolerance
R051
Resistance Value
RU : Current
sensing resistor
1005: 1.0×0.5(㎜) - 0402(inch)
1608: 1.6×0.8(㎜) - 0603(inch)
2012: 2.0×1.2(㎜) - 0805(inch)
3216: 3.2×1.6(㎜) - 1206(inch)
6432: 6.4×3.2(㎜) - 2512(inch)
F: ±1%
G: ±2%
J: ±5%
3 or 4 digits
coding system
(E-24 series)
CS
Packaging Code
CS: Tape Packaging 7"
ES : Tape Packaging 10"
AS: Tape Packaging 13"
Specification
Working
Voltage
(V, MAX)
Power
Rating
(W)
Type
Tolerance
(%)
Resistance
Range (Ω)
T.C.R
(ppm/℃)
R〈47m:±500
R≥47m:±150
RU1005
1/8
(0.125)
F:±1
J:±5
25m~100m
RU1608
1/4
(0.25)
F:±1
J:±5
10m~100m
RU2012
1/3
(0.33)
F:±1
J:±5
10m~100m
RU3216
1/2
(0.5)
F:±1
J:±5
10m~100m
RU6432
1
(1)
F:±1
J:±5
10m~100m
√(P×R)
Rated
Rated
Working
Ambient
Temperature Temperature
R≤25m:±600
R〈33m:±400
R≥33m:±150
Operation
Notes
Example of land
Pattern Design
70℃
R≤25m:±500
R〈33m:±350
R≥33m:±150
•Working voltage = Rated voltage(Vr)=(P×R) (P:Rated Power, R:Norminal Resistance)
Please contact our sales representatives or product engineers for lower T.C.R or higher rated power products.
-55℃~+155℃
Recommended
Soldering Conditions
General Structure
General
Precision
Jumper
Power Derating Curve
Marking
The rated power is the maximum continuous loading
power at 70℃ ambient temperature.
For ambient temperature above 70℃, the loading power
follows the below power derating curve.
4 digits indication
(E-24 series)
- R means decimal point.
- Other digits represent
significant value.
- Example: R010
Left 1 digit: R
Last 3 digits:010
R010 = 0.010Ω = 10mΩ
Percentage of the rated
dissipation(%)
100
80
60
Operation area
40
R010
20
0
-55
70
-30
0
30
60
155
90
120
Low ohms
(RC Series)
Low ohms
(RUT Series)
Ultra Low Ohms
(RU Series)
Ultra Low Ohms
(RUK Series)
Ultra Low Ohms
(RUW Series)
Arrays
(CONVEX Type)
Arrays
(CONCAVE Type)
150
Ambient Temperature(℃)
Arrays
(FLAT Type)
Performance Characteristics
Arrays for
Memory Modules
Item
Requirement dR%
Test Method
Resistance
within specified tolerance
T.C.R
within specified T.C.R
20℃/-55℃ & 20℃/+125℃
Overload(Short time)
±(1.0%+0.0005Ω)
Rated Voltage×2.5 for 5sec.
Overload(Intermittent)
±(3.0%+0.0005Ω)
Resistance to solder Heat
±(1.0%+0.0005Ω)
260℃±5℃, 10±1sec
Moisture Resistance
±(3.0%+0.0005Ω)
40℃, 95%RH, 1,000hr, 1.5hr On/0.5hr off cycle
Endurance at 70℃
±(3.0%+0.0005Ω)
70℃, 1,000hr, 1.5hr On/0.5hr off cycle
Bending strength
±(0.5%+0.0005Ω)
60mm/min speed, Press until 3mm, keep 5sec
at 25℃. Kelvin Probing Method.
Attenuator
Characteristics
Performance
Rated Voltage×2.5
1sec on, 25sec off 10,000cycies.
The specifications and designs contained herein may be subject to change without notice.
Please contact our sales representatives or product engineers before order.
Packaging
Standard
Resistance Value
18
19
Ultra Low Ohms(RUK Series)
Feature
•Ultra Low Ohms Resistor, high precision reliability
•Suitable for reflow and soldering.
•Very stable Temperature coefficient characteristics.
•Reverse Type.
•Ag metal is not used for termination electrode.
(Good Sulfide -Resistant)
•100% Lead-free Products (PbO is not used)
•RoHS Compliant.
Application
•Current Sensings.
•Safe circuit through protecting over current flow.
•Power supplying part, DC power charger, adapter.
•Mobile Phone, Mobile PC, Note PC, HDD, DSC, LCD
Structure and Dimensions
<Top View>
<Bottom View>
R010
l1
W
L
<Side View>
H
I2
(UNIT: mm)
Inch
Power(W)
L
W
H
I1
RUK1608
0603
(0.33)
1/3
1.60±0.10
0.80±0.15
0.45±0.10
0.35±0.20
RUK3216
1206
(1.0)
1
3.20±0.25
1.60±0.15
0.60±0.10
0.45±0.20
RUK6432
2512
(1.0)
1
6.30±0.20
3.20±0.20
0.60±0.10
0.80±0.20
Type
Average
Weight
I2
R 〈0.03Ω:0.50±0.20
R≥0.03Ω:0.35±0.20
R 〈0.03Ω:0.90±0.20
R≥0.03Ω:0.60±0.20
R 〈0.03Ω:1.90±0.20
R≥0.03Ω:1.10±0.25
2.2㎎
9.4㎎
42㎎
Parts Numbering System
•The part number system shall be in the following format
RUK
Code Designation
1608
Dimension & Size Code
F
Tolerance
R010
Resistance Value
CS
Packaging Code
RUK : Current
Sensing Resistor
Low TCR
1608: 1.6×0.8(㎜) - 0603(inch)
3216: 3.2×1.6(㎜) - 1206(inch)
6432: 6.4×3.2(㎜) - 2512(inch)
F: ±1%
G: ±2%
J: ±5%
3 or 4 digits
coding system
(IEC conding system)
3digits(E-24 series)
4digits(E-96 series)
GS: Bulk Packaging
CS: Tape Packaging 7"
ES : Tape Packaging 10"
AS: Tape Packaging 13"
Specification
Working
Voltage
(Vr)
Power
Rating
(W)
Type
RUK1608
1/3
(0.33)
RUK3216
1
(1.0)
RUK6432
1
(1.0)
Resistance
Range (Ω)
Tolerance
(%)
Rated
Working
Temperature
R〈30m:±100
R≥30m:±75
F:±1
J:±5
F:±1
J:±5
√(P×R)
Rated
Ambient
Temperature
T.C.R
(ppm/℃)
10m~100m
F:±1
J:±5
Operation
Notes
Example of land
Pattern Design
70℃
±100
-55℃~+155℃
Recommended
Soldering Conditions
±100
•Working voltage = Rated voltage(Vr)=(P×R) (P:Rated Power, R:Norminal Resistance)
Please contact our sales representatives or product engineers for lower T.C.R or higher rated power products.
General Structure
General
Power Derating Curve
Marking
The rated power is the maximum continuous loading
power at 70℃ ambient temperature.
For ambient temperature above 70℃, the loading power
follows the below power derating curve.
Jumper
4 digits indication
(E-24 series)
- R means decimal point.
- Other digits represent
significant value.
- Example: R010
Left 1 digit: R
Last 3 digits:010
R010 = 0.010Ω = 10mΩ
Percentage of the rated
dissipation(%)
100
80
60
Operation area
40
R010
20
0
-55
70
-30
0
30
60
155
90
120
150
Resistance
within specified tolerance
Low ohms
(RUT Series)
Ultra Low Ohms
(RU Series)
Ultra Low Ohms
(RUK Series)
Ultra Low Ohms
(RUW Series)
Arrays
(CONCAVE Type)
Performance Characteristics
Requirement dR%
Low ohms
(RC Series)
Arrays
(CONVEX Type)
Ambient Temperature(℃)
Item
Precision
Test Method
at 25℃. Kelvin Probing Method.
T.C.R
within specified T.C.R
20℃/-55℃ & 20℃/+125℃
Overload(Short time)
±(1.0%+0.0005Ω)
Rated Voltage×2.5 for 5sec.
Overload(Intermittent)
±(3.0%+0.0005Ω)
Resistance to solder Heat
±(1.0%+0.0005Ω)
260℃±5℃, 10±1sec
Moisture Resistance
±(3.0%+0.0005Ω)
40℃, 95%RH, 1,000hr, 1.5hr On/0.5hr off cycle
Endurance at 70℃
±(3.0%+0.0005Ω)
70℃, 1,000hr, 1.5hr On/0.5hr off cycle
Bending strength
±(0.5%+0.0005Ω)
60mm/min speed, Press until 3mm, keep 5sec
Rated Voltage×2.5
1sec on, 25sec off 10,000cycies.
The specifications and designs contained herein may be subject to change without notice.
Please contact our sales representatives or product engineers before order.
Arrays
(FLAT Type)
Arrays for
Memory Modules
Attenuator
Characteristics
Performance
Packaging
Standard
Resistance Value
20
21
Ultra Low Ohms(RUW Series)
Feature
•Ultra Low Ohms Resistor, high precision reliability
•Suitable for reflow and soldering.
•Very stable Temperature coefficient characteristics.
•Reverse Type.
•Ag metal is not used for termination electrode
(Good Sulfide -Resistant)
•100% Lead-free Products (PbO is not used)
•RoHS Compliant.
Application
•Current Sensings.
•Safe circuit through protecting over current flow.
•Power supplying part, DC power charger, adapter.
•Mobile Phone, Mobile PC, Note PC, HDD, DSC, LCD
Structure and Dimensions
<Top View>
<Bottom View>
R010
l1
W
L
<Side View>
H
I2
(UNIT: mm)
Power(W)
Type
Inch
RUW1608
0603
RUW2012
0805
1/3
(0.33)
1/2
(0.5)
RUW3216
1206
1
(1)
L
W
H
I1
1.60±0.10
0.80±0.15
0.45±0.10
0.30±0.20
2.00±0.20
1.25±0.15
0.55±0.10
0.40±0.20
3.20±0.20
1.60±0.15
0.60±0.10
0.45±0.20
Average
Weight
I2
R 〈0.03Ω:0.50±0.20
R≥0.03Ω:0.35±0.20
R 〈0.03Ω:0.65±0.20
R≥0.03Ω:0.40±0.20
R 〈0.03Ω:0.90±0.20
R≥0.03Ω:0.60±0.20
2.2㎎
4.7㎎
9.4㎎
Parts Numbering System
•The part number system shall be in the following format
RUK
Code Designation
RUW : Current
Sensing Resistor
High Power
2012
Dimension & Size Code
F
Tolerance
R010
Resistance Value
2012: 2.0×1.2(㎜) - 0805(inch)
3216: 3.2×1.6(㎜) - 1206(inch)
F: ±1%
G: ±2%
J: ±5%
3 or 4 digits
coding system
(IEC conding system)
3digits(E-24 series)
4digits(E-96 series)
CS
Packaging Code
GS: Bulk Packaging
CS: Tape Packaging 7"
ES: Tape Packaging 10"
AS: Tape Packaging 13"
Specification
Working
Voltage Tolerance
(%)
(Vr)
Power
Rating
(W)
Type
RUW1608
1/3
(0.33)
RUW2012
1/2
(0.5)
RUW3216
1
(1)
Resistance
Range (Ω)
Rated
Working
Temperature
R≤25m:±600
R〈33m:±400
R≥33m:±150
F:±1
J:±5
F:±1
J:±5
√(P×R)
Rated
Ambient
Temperature
T.C.R
(ppm/℃)
10m~100m
Example of land
Pattern Design
R〈25m:±600
R〈33m:±400
R≥33m:±150
70℃
R〈25m:±500
R〈33m:±350
R≥33m:±150
F:±1
J:±5
Operation
Notes
-55℃~+155℃
Recommended
Soldering Conditions
General Structure
General
•Working voltage = Rated voltage(Vr)=(P×R) (P:Rated Power, R:Norminal Resistance)
Please contact our sales representatives or product engineers for lower T.C.R or higher rated power products.
Precision
Power Derating Curve
Marking
The rated power is the maximum continuous loading
power at 70℃ ambient temperature.
For ambient temperature above 70℃, the loading power
follows the below power derating curve.
4 digits indication
(E-24 series)
- R means decimal point.
- Other digits represent
significant value.
- Example: R010
Left 1 digit: R
Last 3 digits:010
R010 = 0.010Ω = 10mΩ
Percentage of the rated
dissipation(%)
100
80
60
Operation area
Jumper
Low ohms
(RC Series)
Low ohms
(RUT Series)
Ultra Low Ohms
(RU Series)
Ultra Low Ohms
(RUK Series)
40
R010
20
0
-55
70
-30
0
30
60
155
90
120
Ultra Low Ohms
(RUW Series)
Arrays
(CONVEX Type)
150
Ambient Temperature(℃)
Arrays
(CONCAVE Type)
Performance Characteristics
Arrays
(FLAT Type)
Item
Requirement dR%
Test Method
Resistance
within specified tolerance
T.C.R
within specified T.C.R
20℃/-55℃ & 20℃/+125℃
Overload(Short time)
±(1.0%+0.0005Ω)
Rated Voltage×2.5 for 5sec.
Overload(Intermittent)
±(3.0%+0.0005Ω)
Resistance to solder Heat
±(1.0%+0.0005Ω)
260℃±5℃, 10±1sec
Moisture Resistance
±(3.0%+0.0005Ω)
40℃, 95%RH, 1,000hr, 1.5hr On/0.5hr off cycle
Endurance at 70℃
±(3.0%+0.0005Ω)
70℃, 1,000hr, 1.5hr On/0.5hr off cycle
Bending strength
±(0.5%+0.0005Ω)
60mm/min speed, Press until 3mm, keep 5sec
at 25℃. Kelvin Probing Method.
Rated Voltage×2.5
1sec on, 25sec off 10,000cycies.
The specifications and designs contained herein may be subject to change without notice.
Please contact our sales representatives or product engineers before order.
Arrays for
Memory Modules
Attenuator
Characteristics
Performance
Packaging
Standard
Resistance Value
22
23
Arrays(Convex Type)
Feature
•Reducing SMD surface area (40% reduced).
•Reducing SMD costs (75% reduced).
•Both flow and reflow soldering are applicable.
•Convex & concave type.
The product of lead-free terminal is RoHS compliant.
PhO(lead oxide) is included in the glass of our product which is prescribed
on RoHS appendix as an exception.
Application
•For semiconductor devices.
•For computers, digital circuits.
Structure and Dimensions
•2 Array
•4 Array
A
A
T
T
D
123
W
W
B
B
P
L
P
L
G
G
(UNIT: mm)
Type
L
W
T
A
D
B
G
P
Average
Weight
RP102P
RP104P
RP164P
1.00±0.10
2.00±0.10
3.20±0.10
1.00±0.10
1.00±0.10
1.60±0.10
0.35±0.10
0.35±0.10
0.50±0.10
0.33±0.05
0.30±0.15
0.40±0.15
0.40±0.15
0.60±0.15
0.20±0.10
0.15±0.10
0.30±0.15
0.25±0.10
0.25±0.15
0.30±0.15
0.65±0.10
0.50±0.15
0.80±0.15
1.1㎎
2.2㎎
8.9㎎
Parts Numbering System
•The part number system shall be in the following format
RN
16
4P
J
100
Code Designation
Dimension
Resistors
Tolerance
Resistance Value
RP: Convex type array
10: 1005
16: 1608
2P: 2 Pieces
4P: 4 Pieces
※Jumper:’
J’
J: ±5%
FS
Packaging Code
3 digit coding system
(IEC coding system)
E-24 series
CS : Tape Packaging 7"
ES : Tape Packaging 10"
AS : Tape Packaging 13"
Specification
Type
Power
Rating
(W)
102P
104P
164P
1/16
•Rated voltage (V) =
Working Overload
Voltage Voltage
(MAX)
(MAX)
25(V)
25(V)
50(V)
√
50(V)
50(V)
100(V)
TCR (ppm/℃)
Resistance
Range (Ω)
±200
1Ω~1MΩ
Rated power(W)×Normal resistance value (R)
Rated voltage should be lower than (MAX) working voltage.
Rated
Rated
Working
Ambient
Temperature Temperature
70℃
-55℃~+125℃
Power Derating Curve
The rated power is the maximum continuous loading power at 70℃ ambient temperature.
For ambient temperature above 70℃, the loading power follows the below power derating curve.
(The load current shall be derated according to Derating curve in case of the 'Jumper')
Operation
Notes
Percentage of the rated
dissipation(%)
100
Example of land
Pattern Design
80
Recommended
Soldering Conditions
60
Operation area
40
General Structure
20
0
70
-55
-40
0
40
General
125
80
120
Ambient Temperature(℃)
Precision
Jumper
Jumper Resistors
Type
Resistance
Current Rating
Rated Ambient
Temperature
Rated Working
Temperature
Low ohms
(RC Series)
102P
104P
164P
50mΩMax.
1.0(A)
70℃
-55℃~+125℃
Low ohms
(RUT Series)
Ultra Low Ohms
(RU Series)
Marking
Ultra Low Ohms
(RUK Series)
•3 digits indication(E-24 series)
- Left 2 digits represent significant figures.
- Last 1 digit represents exponential number of 10.
- Example: 103
Left 2 digits: 10
Last 1 digit: 3
103 = 10×10 3 =10000Ω=10kΩ
Ultra Low Ohms
(RUW Series)
103
※Jumper chip is printed
as “000”.
Arrays
(CONVEX Type)
Arrays
(CONCAVE Type)
•RP102P, RN102P, RN104P type : No marking.
Arrays
(FLAT Type)
Land Pattern
P1
Arrays for
Memory Modules
P2
E
: Land Pattern
D
Attenuator
: Chip Resistor
A
B
Characteristics
Performance
C
Type
A
B
C
D
E
P1
10AT
0.4
0.4
0.25
0.5
0.5
0.65
102P
0.4
0.4
0.25
0.5
0.5
0.65
104P
164P
0.7
0.7
0.3
0.5
0.2
0.3
0.5
0.9
0.5
0.8
0.55
0.9
The specifications and designs contained herein may be subject to change without notice.
Please contact our sales representatives or product engineers before order.
P2
Packaging
0.5
0.8
Standard
Resistance Value
24
25
Arrays(Concave Type)
Feature
•Reducing SMD surface area (40% reduced).
•Reducing SMD costs (75% reduced).
•Both flow and reflow soldering are applicable.
•Convex & concave type.
The product of lead-free terminal is RoHS compliant.
PhO(lead oxide) is included in the glass of our product which is prescribed
on RoHS appendix as an exception.
Application
•For semiconductor devices.
•For computers, digital circuits.
Structure and Dimensions
•2 Array
•4 Array
T
A
T
A
B
B
(Top side)
W
W
P
P
L
L
(Bottom side)
G
G
(UNIT: mm)
Type
L
W
T
A
RN102P
RN104P
1.00±0.10
2.00±0.10
1.00±0.10
1.00±0.10
0.35±0.10
0.40±0.10
0.30±0.10
0.30±0.10
B
0.15±0.10
0.15±0.10
G
0.25±0.15
0.25±0.15
P
0.5±0.10
0.5±0.10
Average
Weight
1.2㎎
2.8㎎
Parts Numbering System
•The part number system shall be in the following format
RN
16
4P
J
100
Code Designation
Dimension
Resistors
Tolerance
Resistance Value
RN: Concave type array
10: 1005
16: 1608
2P: 2 Pieces
4P: 4 Pieces
J: ±5%
※Jumper:’
J’
3 digit coding system
(IEC coding system)
E-24 series
CS
Packaging Code
CS : Tape Packaging 7"
ES : Tape Packaging 10"
AS : Tape Packaging 13"
Specification
Power
Rating
(W)
Type
102P
104P
164P
Working Overload
Voltage Voltage
(MAX)
(MAX)
25(V)
25(V)
50(V)
1/16
•Rated voltage (V) =
50(V)
50(V)
100(V)
Rated
Rated
Working
Ambient
Temperature Temperature
Resistance
Range (Ω)
TCR (ppm/℃)
±200
70℃
1Ω~1MΩ
-55℃~+125℃
√
Rated power(W)×Normal resistance value (R)
Rated voltage should be lower than (MAX) working voltage.
Operation
Notes
Example of land
Pattern Design
Recommended
Soldering Conditions
General Structure
Power Derating Curve
The rated power is the maximum continuous loading power at 70℃ ambient temperature.
For ambient temperature above 70℃, the loading power follows the below power derating curve.
(The load current shall be derated according to Derating curve in case of the 'Jumper')
General
Precision
Percentage of the rated
dissipation(%)
100
80
Jumper
60
Low ohms
(RC Series)
Operation area
40
Low ohms
(RUT Series)
20
0
70
-55
-40
0
40
Ultra Low Ohms
(RU Series)
125
80
120
Ambient Temperature(℃)
Ultra Low Ohms
(RUK Series)
Ultra Low Ohms
(RUW Series)
Jumper Resistors
Type
Resistance
Current Rating
Rated Ambient
Temperature
Rated Working
Temperature
Arrays
(CONVEX Type)
102P
104P
164P
50mΩMax.
1.0(A)
70℃
-55℃~+125℃
Arrays
(CONCAVE Type)
Arrays
(FLAT Type)
Land Pattern
Arrays for
Memory Modules
P
Attenuator
E
: Land Pattern
D
Characteristics
Performance
: Chip Resistor
Packaging
B
A
C
Type
A
B
C
D
E
P
102P
0.3
0.3
0.2
0.5
0.4
0.5
104P
0.3
0.3
0.2
0.5
0.4
0.5
The specifications and designs contained herein may be subject to change without notice.
Please contact our sales representatives or product engineers before order.
Standard
Resistance Value
26
27
Arrays(Flat Type)
Feature
•Reducing SMD surface area (40% reduced).
•Reducing SMD costs (75% reduced).
•Both flow and reflow soldering are applicable.
•Convex & concave type.
The product of lead-free terminal is RoHS compliant.
PhO(lead oxide) is included in the glass of our product which is prescribed
on RoHS appendix as an exception.
Application
•For semiconductor devices.
•For computers, digital circuits.
Structure and Dimensions
•2 Array
•4 Array
A
B
B
<Top side>
P
L
A
T
P
L
G
<Bottom View>
T
G
W
W
(UNIT: mm)
L
Type
0.80±0.05
1.40±0.05
RF062P
RF064P
W
0.60±0.05
0.60±0.05
T
A
B
0.23±0.10
0.23±0.10
0.20±0.10
0.20±0.10
G
0.10±0.10
0.10±0.10
0.20±0.10
0.20±0.10
P
0.50±0.05
0.40±0.05
Average
Weight
0.3㎎
0.5㎎
Parts Numbering System
•The part number system shall be in the following format
RF
06
4P
J
R68
Code Designation
Dimension
Resistors
Tolerance
Resistance Value
RF: Flat type array
06: 0603
2P: 2 Pieces
4P: 4 Pieces
J: ±5%
※Jumper:’
J’
3 digit coding system
(IEC coding system)
E-24 series
CS
Packaging Code
CS : Tape Packaging 7"
ES : Tape Packaging 10"
AS : Tape Packaging 13"
Specification
Power
Rating
(W)
Type
062P
064P
Working Overload
Voltage Voltage
(MAX)
(MAX)
1/32
•Rated voltage (V) =
12.5(V)
70℃
10Ω~1MΩ
±250
25(V)
Rated
Rated
Working
Ambient
Temperature Temperature
Resistance
Range (Ω)
TCR (ppm/℃)
Operation
Notes
-55℃~+125℃
Example of land
Pattern Design
√
Rated power(W)×Normal resistance value (R)
Rated voltage should be lower than (MAX) working voltage.
Recommended
Soldering Conditions
Power Derating Curve
General Structure
The rated power is the maximum continuous loading power at 70℃ ambient temperature.
For ambient temperature above 70℃, the loading power follows the below power derating curve.
(The load current shall be derated according to Derating curve in case of the 'Jumper')
General
Percentage of the rated
dissipation(%)
100
Precision
80
Jumper
60
40
Low ohms
(RC Series)
20
Low ohms
(RUT Series)
Operation area
0
70
-55
-40
0
40
125
Ultra Low Ohms
(RU Series)
80
120
Ambient Temperature(℃)
Ultra Low Ohms
(RUK Series)
Jumper Resistors
Type
Resistance
Current Rating
Rated Ambient
Temperature
062P
064P
50mΩMax.
0.5(A)
70℃
Rated Working
Temperature
-55℃~+125℃
Ultra Low Ohms
(RUW Series)
Arrays
(CONVEX Type)
Arrays
(CONCAVE Type)
Land Pattern
Arrays
(FLAT Type)
A
A
: Land Pattern
B
B
Arrays for
Memory Modules
: Chip Resistor
A
C
D
A
C
C
D
C
Characteristics
Performance
TYPE (Inch)
Dimension
A
B
Reflow Soldering
2A + B
C
D
RF062P
0.3
0.3
0.9
0.2
0.3
RF064P
0.3
0.3
0.9
0.2
0.2
The specifications and designs contained herein may be subject to change without notice.
Please contact our sales representatives or product engineers before order.
Attenuator
Packaging
Standard
Resistance Value
28
29
Arrays for
Memory Modules
Feature
•Reducing SMD surface area (40% reduced).
•Reducing SMD costs (75% reduced).
•Applicable both flow and reflow soldering.
•Reverse & Short free Reverse Concave Type.
The product of lead-free terminal is RoHS compliant.
PhO(lead oxide) is included in the glass of our product which is prescribed
on RoHS appendix as an exception.
Application
•For semiconductor devices.
•For computers, digital circuits.
Structure and Dimensions
(1) REVERSE CONCAVE TYPE
<Side View>
<Top View>
<Bottom View>
B
G
150
W
P
A
T
L
(UNIT: mm)
Type
L
W
T
A
B
G
P
Average
Weight
RM102P
RM104P
1.00±0.10
2.00±0.10
1.00±0.10
1.00±0.10
0.35±0.10
0.45±0.10
0.30±0.10
0.30±0.10
0.15±0.10
0.15±0.10
0.25±0.15
0.25±0.15
0.50±0.10
0.50±0.10
1.2㎎
2.8㎎
(2) SHORT-FREE REVERSE CONCAVE TYPE
<Top View>
<Side View>
<Bottom View>
<Terminal Side View>
G
150
W
H
P
T
A
A
T
L
(UNIT: mm)
Type
L
W
T
A
G
P
H
Average
Weight
RK102P
RK104P
1.00±0.10
2.00±0.10
1.00±0.10
1.00±0.10
0.35±0.10
0.45±0.10
0.30±0.10
0.30±0.10
0.25±0.15
0.25±0.15
0.50±0.10
0.50±0.10
0.17min
0.23min
1.2㎎
2.8㎎
Parts Numbering System
•The part number system shall be in the following format
RM
10
4P
J
100
Code Designation
Dimension
Resistors
Tolerance
Resistance Value
RM : Reverse Concave
Array
RK : Short-free Reverse
Concave Array
10: 1005
16: 1608
2P: 2 Pieces
4P: 4 Pieces
※Jumper:’
J’
CS
Packaging Code
3 digit coding system
(IEC coding system)
E-24 series
J: ±5%
CS : Tape Packaging 7"
ES : Tape Packaging 10"
AS : Tape Packaging 13"
Operation
Notes
Example of land
Pattern Design
Recommended
Soldering Conditions
Specification
Power
Rating
(W)
Type
102P
104P
Working Overload
Voltage Voltage
(MAX)
(MAX)
25(V)
1/16
•Rated voltage (V) =
Resistance
Range (Ω)
TCR (ppm/℃)
±200ppm
50(V)
Rated
Rated
Working
Ambient
Temperature Temperature
1Ω~1MΩ
70℃
General Structure
General
-55℃~+125℃
Precision
√
Rated power(W)×Normal resistance value (R)
Rated voltage should be lower than (MAX) working voltage.
Jumper
Power Derating Curve
Low ohms
(RC Series)
The rated power is the maximum continuous loading power at 70℃ ambient temperature.
For ambient temperature above 70℃, the loading power follows the below power derating curve.
(The load current shall be derated according to Derating curve in case of the 'Jumper')
Low ohms
(RUT Series)
Percentage of the rated
dissipation(%)
100
Ultra Low Ohms
(RU Series)
80
Ultra Low Ohms
(RUK Series)
60
Operation area
40
Ultra Low Ohms
(RUW Series)
20
Arrays
(CONVEX Type)
0
70
-55
-40
0
40
125
Arrays
(CONCAVE Type)
80
120
Ambient Temperature(℃)
Jumper Resistors
Arrays
(FLAT Type)
Type
Resistance
Current Rating
Rated Ambient
Temperature
Rated Working
Temperature
102P
104P
50mΩMax.
1.0(A)
70℃
-55℃~+125℃
Attenuator
Marking
Characteristics
Performance
•3 digits indication(E-24 series)
- Left 2 digits represent significant figures.
- Last 1 digit represents exponential number of 10.
- Example: 150
Left 2 digits: 15
Last 1 digit: 0
150 = 15×10 0=15Ω
Arrays for
Memory Modules
Packaging
150
※Jumper chip is printed
as “000”.
Standard
Resistance Value
•RM102P, RK102P Type : No marking.
The specifications and designs contained herein may be subject to change without notice.
Please contact our sales representatives or product engineers before order.
30
31
Attenuator
Feature
•The RP10AT is small-size chip Attenuator,
suitable for high density surface mounting.
•Unbalanced πtype attenuator circuit in one chip(1.0 mm x 1.0 mm)
•Mounting occupation area reduction : about 50 % reduction
•Mounting cost reduction : Mounting times 3 times →1 time
•Attenuation : 0 dB to 10 dB
Application
•Attenuation / level control / impedance matching of high frequency
signals of communication equipment; cellular phones(GSM, CDMA,
etc.), PHS, PDA, for example.
Structure and Dimensions
• Structure
•Dimensions
Coating
A
T
Substrate
W
Resistor
B
P
L
Electrode
C
(UNIT: mm)
Type
Power(W)
L
W
T
A
B
C
P
Average
Weight
RP10AT
0.04W /
package
1.00±0.10
1.00±0.10
0.35±0.10
0.33±0.05
0.20±0.10
0.25±0.10
0.65±0.10
1.1㎎
Parts Numbering System
•The part number system shall be in the following format
RP
Code Designation
10AT
L
Dimensions & Circuit Configuration Attenuation Value Tolerance
RP:Convex type 10 :1.0x1.0(mm)-0404(inch)
AT:Unbalanced π-type
Attenuator
L : ± 0.3 dB
H : ± 0.5 dB
A
03
Characteristic Impedance
Attenuation Value
A : 50 ohm
3 dB
EX) 0 →0dB
CS
Packing Type
CS :Tape Packaging 7"
Specification
Item
Specifications
Attenuation Value
0 dB, 1 dB, 2 dB, 3 dB, 4 dB, 5 dB,
6 dB, 7 dB, 8 dB, 9 dB, 10dB
0 dB, 1 dB, 2 dB, 3 dB, 4 dB, 5 dB : ± 0.3 dB
6 dB, 7 dB, 8 dB, 9 dB, 10dB
: ± 0.5 dB
50Ω
0.04W / package
DC to 3 GHz
1.3 max
4 terminals
Attenuation Value Tolerance
Characteristic Impendance
Power Rating
Frequency Range
VSWR (Voltage Standing Wave Ratio)
Number of terminals
Category Temperature Range
(Operating Temperature Range)
-55 ℃ to +125 ℃
Operation
Notes
Example of land
Pattern Design
Recommended
Soldering Conditions
General Structure
General
Precision
Power Derating Curve
Jumper
The rated power is the maximum continuous loading power at 70℃ ambient temperature.
For ambient temperature above 70℃, the loading power follows the below power derating curve.
Percentage of the rated
dissipation(%)
Rated load percent (%)
100
Low ohms
(RC Series)
Low ohms
(RUT Series)
80
Ultra Low Ohms
(RU Series)
60
40
Ultra Low Ohms
(RUK Series)
20
Ultra Low Ohms
(RUW Series)
Operation area
0
70
-55
-40
0
40
125
80
120
Ambient Temperature(℃)
Arrays
(CONVEX Type)
Arrays
(CONCAVE Type)
Equivalent Circuit Configuration
Arrays
(FLAT Type)
Arrays for
Memory Modules
R2
Attenuator
R1
R3
Characteristics
Performance
Packaging
Standard
Resistance Value
The specifications and designs contained herein may be subject to change without notice.
Please contact our sales representatives or product engineers before order.
32
33
Characteristics
Performance
Electrical Characteristic
Requirements Specification
Jumper
Resistor
Item
Direct Current
Resistance
Temperature
Characteristic
Short-time
Overload
Intermittent
Overload
Within the regulated resistance tolerance.
50mΩMax.
J-Grade
1Ω≤R 〈10Ω:+300/-200ppm/℃
10Ω≤R≤1MΩ:±100ppm/℃(0603±250ppm)
1MΩ〈R≤10MΩ:±300ppm/℃
F-Grade
1Ω≤R≤10MΩ:±100ppm/℃(0603±250ppm)
ΔR Less than ±(1%+0.1Ω) of the initial value.
JIS C 5201-1 4.13
Apply 2.5 times rated voltage for 5 sec.
Wait 60 minutes at room temperature.
Measure the resistance value.
Test board: <FIG. 1>
Max Surge
Current
50mΩMax.
JIS C 5201-1 4.13
2.5 times of rated voltage .
1 second ON, 25 second OFF.
10,000 cycles.
Test board: <FIG. 1>
Max Surge
Current
Visual No evidence of mechanical damage.
Dielectric
Withstanding
Voltage
Insulation
Resistance
Jumper
JIS C 5201-1 4.5
Voltage apply Within 5 sec.
Test temp: 20℃, 65RH
Test board: <FIG. 1>
JIS C 5201-1 4.8
Test Temperature(℃)
20℃ → -55℃ / 20℃ → 125℃
T.C.R(ppm / ℃)=(R-R20) / R20×1/(T-T20)×106
※T=test Temperature, T20 =20℃
R=Resistance at T, R20 =Resistane at T20
Test board: <FIG. 1>
50mΩMax.
Visual No evidence of mechanical damage.
ΔR Less than ±(3%+0.1Ω) of the initial value.
Test Methods
Resistor
JIS C 5201-1 4.7
Apply Voltage for 1 minute
0402.0603:50V
1005, 1608: 100V
Other: 500V
No evidence of mechanical damage.
Over 1,000MΩ
Cu
Cu
Cu
P2
Substrate
V
Mechanical Characteristic
Requirements Specification
Jumper
Resistor
Item
Solderability
Bending
Test
ΔR
Coverage: ≥95% each termination.
No crack of termination parts and ceramic exposure of
surface by melting.
Less than±(0.5%+0.05Ω)of the initialvalue. 50mΩMax.
Visual No evidence of mechanical damage.
Adhesive strength
of termination
No mechanical damage or sign of disconnection
Resistance ΔR Less than±(1%+0.05Ω)of the initial value.
to
Soldering
Visual No evidence of mechanical damage.
Heat
50mΩMax.
ΔR Less than±(1%+0.05Ω)of the initial value.
AntiVibration
Test
Visual No evidence of mechanical damage.
50mΩMax.
Test Methods
Resistor
Jumper
IEC60068-2-58
Rosin Flux: Rosin 25%, Methanol 75%
Solder Temp.: 245+5/-0℃
Dipping time: 2±0.5 sec.(Both side dipping)
JIS C 5201-1 4.33
After soldering resistor on
the PCB, 3mm of bending shall
be applied for 10 sec.
Test board: <FIG. 2>
20
R230
3mm
90mm
JIS C 5201-1(4.16)
- Test strengh : 5N (500g . f), 0603 : 2N
- Test time : Applying pressure for 10 seconds
500 g.f
JIS C 5201-1 4.18
- Flow soldering :260±5℃,10 sec .max.(both side dipping)
- Reflow soldering :260±5℃, 10 sec. max.
over 230℃, 30~40 sec.
JIS C 5201-1 4.22
2 hours each in X, Y and Z axis(total 6 hours)
10 to 55Hz sweep in 1 minute at 1.5mm amplitude.
Environmental Characteristic
Item
Requirements Specification
Jumper
Resistor
Test Methods
Resistor
Jumper
JIS C 5201-1 4.19
ΔR Less than ±(1%+0.1Ω) of the initial value. 50mΩMax. Perform 100 cycles as follows.
Temperature
Test Condition: -55℃/ 30min ↔ 125℃/ 30min
Cycle
sweep time: 5 min
Visual No evidence of mechanical damage.
Test board: <FIG. 1>
JIS
C 5201-1 4.25
ΔR Less than ±(3%+0.1Ω) of the initial value. 50mΩMax.
Test Voltage: rated voltage
Test temp.: 70±2℃
Load Life
Time: 1,000+48 hours(90 min; ON, 30 min; OFF)
Visual No evidence of mechanical damage.
Test board: <FIG. 1>
JIS C 5201-1 4.23
ΔR Less than ±(3%+0.1Ω) of the initial value. 50mΩMax. Dwell in -55℃ chamber without loading for 1,000+48 hours.
Low Temp.
Stabilize for 60 minutes at room temperature.
Exposure
Measure value.
Visual No evidence of mechanical damage.
Test board: <FIG. 1>
JIS C 5201-1 4.23
or 155℃±2℃chamber without
High Temp. ΔR Less than ±(3%+0.1Ω) of the initial value. 50mΩMax. Dwell in 125℃±2℃
loading for 1,000+48 hours. Stabilize for 60 minutes at room
Exposure
temperature.
Visual No evidence of mechanical damage.
Measure value.
Test board: <FIG. 1>
ΔR Less than ±(3%+0.1Ω) of the initial value. 50mΩMax. JIS C 5201-1 4.14
Test Voltage: rated voltage
Test temp.: 40±2℃
Moisture
Time: 1,000+48 hours(90 min; ON, 30 min; OFF)
Resistance
Visual No evidence of mechanical damage.
Humidity: 90~95% RH Stabilize for 1 hrs & Measure.
Test board: <FIG. 1>
※These characteristics apply to 1Ω~10MΩ. In case of other resistance range, please contact us.
※The next is specification in our company for flow soldering and test boards.
Operation
Notes
Example of land
Pattern Design
Recommended
Soldering Conditions
General Structure
General
Precision
Jumper
Low ohms
(RC Series)
Low ohms
(RUT Series)
Ultra Low Ohms
(RU Series)
Ultra Low Ohms
(RUK Series)
Flow soldering Conditions
Item
Specification
Dipping
Ultra Low Ohms
(RUW Series)
Flux
ROSIN 25%, IPA 75%
Solder
Sn-3.0Ag-0.5Cu
Time: 5~10 sec.
Time: 10 sec max.
Temp.: 260±5℃.
Arrays
(CONVEX Type)
Arrays
(CONCAVE Type)
Arrays
(FLAT Type)
Arrays for
Memory Modules
Attenuator
Characteristics
Performance
Packaging
Standard
Resistance Value
The specifications and designs contained herein may be subject to change without notice.
Please contact our sales representatives or product engineers before order.
34
35
Packaging
Taping Type
•Reel dimensions
Symbol
Tape Width
8mm
12mm
8mm
12mm
8mm
12mm
7" Reel
10" Reel
E
C
13" Reel
C B
D
Symbol
t
A
10" Reel
W
B
C
Ø180+0/-3
Ø180+0/-3
Ø258+0/-3
Ø258+0/-3
Ø330±2.0
Ø330±2.0
Ø60±1.0
Ø60±1.0
Ø80±1.0
Ø80±1.0
Ø100±1.0
Ø80±1.0
Ø13±0.3
Ø13±0.3
Ø13±0.3
Ø13±0.3
Ø13±0.3
Ø13±0.3
Tape Width
8mm
12mm
8mm
12mm
8mm
12mm
7" Reel
13" Reel
Unit: mm
D
A
E
4±0.2
4±0.2
4±0.2
4±0.2
4±0.2
4±0.2
W
2.0±0.5
2.0±0.5
2.0±0.5
2.0±0.5
2.0±0.5
2.0±0.5
9±0.5
13±0.5
9±0.5
13±0.5
9±0.5
13±0.5
t
1.2±0.2
1.2±0.2
1.8±0.2
1.8±0.2
2.2±0.2
2.2±0.2
•Tape dimensions
Type
(UNIT: mm)
Pitch Width
Dimensions
4.0±0.1
Press
Pocket
or
Punched
Paper
1.5 +- 0.1
0
1.75±0.1
1.0
2mm
3.5±0.05
8.0±0.1
B
T
A
2.0±0.05
A
0402 0.24±0.03
0603 0.38±0.05
1005 0.70±0.10
RP102 1.17±0.10
RP10AT 1.20±0.10
RN102 1.20±0.10
RP104 1.20±0.10
RN104 1.20±0.10
- 0603: Press pocket.
B
0.45±0.03
0.68±0.05
1.20±0.10
1.17±0.10
1.20±0.10
1.20±0.10
2.20±0.10
2.20±0.10
T
0.5 Max
0.5 Max
0.6 Max
0.6 Max
0.6 Max
0.6 Max
0.6 Max
0.8 Max
8mm
4.0±0.1
1.5 +- 0.1
0
1.75±0.1
1.0
Punched
Paper
3.5±0.05
8.0±0.1
B
T
2.0±0.05
4.0±0.1
A
1608
2012
3216
3225
RP164
A
1.10±0.20
1.65±0.20
2.00±0.20
2.90±0.20
2.00±0.20
5025
6432
B
T
A
2.80±0.20 5.30±0.20
1.1 Max
3.50±0.20 6.75±0.20
B
T
1.90±0.20 0.8 Max
2.40±0.20
3.60±0.20
1.1 Max
3.60±0.20
3.60±0.20
0.3±0.02
4
Φ1.5 +0.1
- 0
B
12±0.2
12mm
B
Embossed
Tape
2±0.05
1.75
5.5±0.05
4mm
T
Φ1.5
4
A
Packaging Table
Taping Packaging
TYPE
(mm)
TYPE
(inch)
Code
Reels
Carrier Tape
Quantity
Weight(g)
0402
01005
CS
7”
Pressed Paper
CS
DP
AS
FP
CS
DS
ES
AS
CS
ES
AS
CS
ES
AS
CS
ES
AS
CS
ES
AS
CS
CS
AS
CS
AS
CS
AS
CS
AS
CS
AS
CS
AS
7”
7”
13”
13”
7”
7”
10”
13”
7”
10”
13”
7”
10”
13”
7”
10”
13”
7”
10”
13”
7”
7”
13”
7”
13”
7”
13”
7”
13”
7”
13”
7”
13”
Pressed Paper
20,000
15,000
143
126
20,000
60,000
50,000
10,000
20,000
30,000
40,000
5,000
10,000
20,000
5,000
10,000
20,000
5,000
10,000
20,000
5,000
10,000
20,000
4,000
4,000
15,000
15,000
60,000
15,000
60,000
10,000
40,000
10,000
40,000
5,000
20,000
154
573
474
92
152
331
539
125
324
561
149
360
658
157
382
695
183
463
674
202
267
1,041
126
573
126
573
100
485
136
610
157
695
0603
1005
1608
2012
0201
0402
0603
0805
3216
1206
3225
1210
5025
2010
6432
2512
062P
0201×2R
064P
0201×2R
102P
0402×2R
104P
0402×4R
164P
0603×4R
Punched PE
Pressed Paper
Punched PE
Punched paper
Embossed PE
Punched paper
•General type, Precision, Low ohms, High ohms.
•Packaging style can be modified when you want.
Operation
Notes
Example of land
Pattern Design
Recommended
Soldering Conditions
General Structure
General
Precision
Jumper
Low ohms
(RC Series)
Low ohms
(RUT Series)
Ultra Low Ohms
(RU Series)
Ultra Low Ohms
(RUK Series)
Ultra Low Ohms
(RUW Series)
Arrays
(CONVEX Type)
Arrays
(CONCAVE Type)
Arrays
(FLAT Type)
Arrays for
Memory Modules
Attenuator
Characteristics
Performance
Packaging
Standard
Resistance Value
The specifications and designs contained herein may be subject to change without notice.
Please contact our sales representatives or product engineers before order.
36
37
Standard Resistance
Value
Tolerance Code Table
Tolerance Code
D
Digit Number
IEC-Code System
Specification
F
4 digit
E-192
±0.5%
E-96
±1%
G
J
K
3 digit
M
E-48
±2%
E-24
±5%
E-12
±10%
E-6
±20%
Significant Figure of Resistance Value
E-192
E-96
E-48
E-24
E-192
E-96
E-48
100
101
102
104
105
106
107
109
110
111
113
114
115
117
118
120
121
123
124
126
127
129
130
132
133
135
137
138
140
142
143
145
147
149
150
152
154
156
158
160
162
164
165
167
169
172
174
176
100
100
10
178
180
182
184
187
189
191
193
196
198
200
203
205
208
210
213
215
218
221
223
226
229
232
234
237
240
243
246
249
252
255
258
261
264
267
271
274
277
280
284
287
291
294
298
301
305
309
312
178
178
102
105
105
107
110
110
11
113
115
115
118
12
121
121
124
127
127
130
133
13
133
137
140
140
143
147
147
150
154
15
154
158
16
162
162
165
169
169
174
E-24
18
182
187
187
191
196
196
200
205
20
205
210
215
215
221
226
22
226
232
237
237
24
243
249
249
255
261
261
267
27
274
274
280
287
287
294
301
309
301
30
E-192
E-96
E-48
316
320
324
328
332
336
340
344
348
352
357
361
365
370
374
379
383
388
392
397
402
407
412
417
422
427
432
437
442
448
453
459
464
470
475
481
487
493
499
505
511
517
523
530
536
542
549
556
316
316
E-24
324
332
332
33
340
348
348
357
36
365
365
374
383
383
392
402
39
402
412
422
422
432
442
43
442
453
464
464
47
475
487
487
499
511
511
51
523
536
536
549
E-192
E-96
E-48
E-24
562
569
576
583
590
597
604
612
619
626
634
642
649
657
665
673
681
690
698
706
715
723
732
741
750
759
768
777
787
796
806
816
825
835
845
856
866
876
887
898
909
920
931
942
953
965
976
988
562
562
56
576
590
590
604
619
619
62
634
649
649
665
681
681
698
715
715
732
750
750
787
787
806
825
825
105Ω
110Ω
82
845
866
866
887
909
909
91
931
953
953
976
E-6 series ±20%
80Ω
75
768
•Example
E-12 series ±10%
E-24 series ±5%
E-96 series ±1%
101Ω
90Ω
95Ω
99Ω
100Ω
68
120Ω
ISO/TS 16949
ISO 14001
OHSAS 18001
QC080000
Operation
Notes
Example of land
Pattern Design
Recommended
Soldering Conditions
General Structure
General
Precision
Quality System Certification List
Jumper
Table 1:Certification list of Samsung Factory
Certification
ISO / TS 16949
ISO 14001
OHSAS 18001
Low ohms
(RC Series)
Section
High Tech(China)
Authority
BSI
Number
TS 91430-008
Date
2011 - 11 - 29
Validity
2014 - 11 - 28
Authority
CCCI
Number
02109E110143R2L
Date
2009 - 04 - 28
Validity
2012 - 04 - 27
Authority
CCCI
Number
02109S10088R2L
Date
2009 - 04- 28
Validity
2012 - 04 - 27
Authority
UL
Number
PRC-HSPM-1766
Date
2010 - 07 - 27
Characteristics
Performance
Validity
2013 - 07 - 26
Packaging
QC080000
Low ohms
(RUT Series)
Ultra Low Ohms
(RU Series)
Ultra Low Ohms
(RUK Series)
Ultra Low Ohms
(RUW Series)
Arrays
(CONVEX Type)
Arrays
(CONCAVE Type)
Arrays
(FLAT Type)
Arrays for
Memory Modules
Attenuator
Standard
Resistance Value
38
39
Passive components sales offices
●
Head office
Philippines Plant (Philippines)
Block No.5, Calamba Premiere
International Park, Batino, Calamba,
Laguna, Manila, Philippines 4027
Te l:+63 - 49- 545- 0422
E-mail:[email protected]
206, Cheomdansaneop Road,
Yeongtong-gu, Suwon-city,
Gyeonggi province, Korea,
443- 743
Europe
Te l:+82- 31- 210 - 6328
E-mail:[email protected]
America
Te l:+82- 31- 210 - 6803
E-mail:[email protected]
Asia
Te l:+82 - 31- 210 - 6791
E-mail:[email protected]
Domestic
Te l:+82- 31- 210 - 5074
E-mail:[email protected]
●
Manufacturing sites
Suwon Plant (Korea)
206, Cheomdansaneop Road,
Yeongtong-gu, Suwon-city,
Gyeonggi province, Korea,
443- 743
Te l:+82- 31- 210-5074
E-mail:[email protected]
Busan Plant (Korea)
1623 - 2, Songjeong- dong,
Gangseo- gu, Busan, Korea,
618 - 270
Te l:+82- 51- 970 - 7671
E-mail:[email protected]
Tianjin Plant (China)
27, Heiniucheng- Road, Hexi District,
Tianjin, 300210 China
Te l:+86 - 22 - 2397- 9000(310)
E-mail:[email protected]
High Tech (China)
Xiqind Dist. Micro-Electronics
Industrial Park, Jingang Highway,
Tianjin, China 300485
Tel:+ 022- 23979000- 313
E-mail: [email protected]
Binhai Plant(China)
80, XiaQing Road, West area of
BinHai development zone,
TianJin, 300458, China
Te l:+86- 22- 6686- 3333(1300)
E-mail:[email protected]
●
Asia sales offices
●
Irvine Office
3333 Michelson Drive,
Suite 500, Irvine, CA 92612, USA
Tel: 1-949-797-8016
E-mail: [email protected]
●
Shenzhen Office
46 F, New World Center,
Yitian Road, Futian District,
Shenzhen, 518026 China
Te l:86 - 755 - 8608- 5571
E-mail:[email protected]
Shanghai Office
Rm. 1211, Shanghai International
Trade Center, No. 2201 Yan an(W) Rd.,
Shanghai, 200335 China
Te l:86 - 21- 6270 - 4168(274)
E-mail:[email protected]
HongKong Office
8/F.,Central Plaza, 18 Harbour Road,
Wanchai, Hongkong, China
Te l:852-28626344
E-mail:[email protected]
Qingdao Office
Rm 1201. Growne Plaza Qingdao 76,
Xiang Gang Zhong Rd, Qingdao,
266071 China
Te l:86 - 532 - 85779102
E-mail:[email protected]
America sales office
Europe sales offices
Frankfurt Office
Samsung Haus, Am Kronberger Hang 6,
D-65824 Schwalbach/Ts. Germany
Te l:49 - 6196 - 66 - 7255
E-mail:[email protected]
Hungary Office
H-2310, Leshegy utca 2-4,
Szigetszentmiklos, Pest megye, Hungary
Te l:36-24-551-148
E-mail:[email protected]
●
Domestic Distributors
Korchip Corporation
817-38, Anyang 2-dong, Manan-gu,
Anyang-city, Gyeonggi province,
Korea, 430-812
Te l:+82 - 31- 361- 8100
E-mail:[email protected]
Chunghan
Chunghan Bldg., 121-284, Dangsan-dong,
Youngdeungpo-gu, Seoul, Korea
Te l:+82 - 2 - 718 - 3322
E-mail:[email protected]
Taiwan Office
9F - 1, Np. 399 Ruey Kuang Rd., Neihu
District, Taipei City, Taiwan, 114
Te l:886 - 2 - 2656 - 8356
E-mail:[email protected]
SAMT
Daekyung Bldg., 983-10, Daechi-dong,
Gangnam- gu, Seoul, Korea
Te l:+82- 2- 3458- 9000
E-mail:[email protected]
Singapore Office
3 Church Street Samsung Hub,
#23-02 Singapore 049483
Te l:65-6833 - 3228
E-mail:[email protected]
CHUNGMAC
#53-5 Wonhyoro-3ga Yongsan- gu,
Seoul, Korea
Te l:+82- 31- 234- 2367~8
E-mail:[email protected]
Bangkok Office
23rd Floor, Lake Rajada Office Complex
193/89 Rachadapisek Road,
Khet Klongtoey, Bangkok 10110, Thailand
Te l:66 - 2- 661- 8004~5
E-mail:[email protected]
APEXINT
,
Room #905. C- dong Woorimlion s Valley
371-28, Gasan-dong, Guemcheon-gu,
Seoul, Korea
Te l:+82- 2- 2026- 2610(2)
E-mail:[email protected]
All information indicated in this catalog is as of February 2012
* The specifications and designs contained herein may be subject to change without notice.