SAMSUNG RC2012F2491CS

SPECIFICATION
• Supplier : Samsung electro-mechanics
• Samsung P/N:
RC2012F***CS
• Product : Thick - Film chip RESISTOR
• Description :
2012, ±1%, (1Ω~1㏁), 1/8W
A. Samsung Part Number
RC 2012
F
***
CS
①
③
④
⑤
②
① Code designation
Samsung Thick - Film Chip Resistor
② Dimension
2012 (mm code)
③ Resistancs tolerance
L:
2.0
± 0.2
W : 1.25 ± 0.15
T : 0.5 ± 0.1
mm
mm
mm
±1 %
④ Nominal resistance value
※3digits -Left 2 digits : Resistance value, Right 1 digits : Exponential number of 10.
ex) 101 : 10×101 = 10×10 = 100Ω
※4digits -Left 3 digits : Resistance value, Right 1 digits : Exponential number of 10.
ex) 4222 : 422×102 = 422×100 = 42.2㏀
Read alphabet "R" as decimal point
"000" : Jumper(0Ω)
ex) 3R7 : 3.7 = 3.7Ω / 88R7 : 88.7 = 88.7Ω
⑤ Packing code
7" Reel packaging
B. Samsung Reliablility Test and Judgement condition
Judgement
Resistor
Direct Current
Within the regulated resistance
Resistance
tolerance.
Short-time
Less than ±(1%+0.1Ω)of the initial value
Overload
No evidence of mechanical damage
Intermittent
Less than ±(3%+0.1Ω)of the initial value
Overload
Dielectric
Resistor
Jumper
50mΩ Max
Voltage apply Within 5 sec
50mΩ Max
Apply 2.5 times rated voltage for 5sec Max Surge
Current
2.5 times of rated voltage.
Max Surge
No evidence of mechanical damage
1 sec On, 25 sec Off / 10,000cycles
Current
No evidence of mechanical damage
Apply Voltage for 1minute
Withstanding Voltage
Insulation
Test condition
Jumper
50mΩ Max
0603:50v
Over 1,000MΩ
Resistance
1005,1608:100v
Other: 500v
■ J-Grade
Test Temperature(℃) 20℃→-55℃/20℃→125℃
Temperature
1Ω≤R<10Ω:+300/-200ppm/℃
T.C.R(ppm/℃)
Characteristic
10Ω≤R≤1MΩ:±100ppm/℃(0603±250ppm)
= R − R0
1
×
× 106
R0
T − T0
1MΩ<R≤10MΩ:±300ppm/℃
■ F-Grade
10Ω≤R≤1MΩ:±100ppm/℃(0603±250ppm)
Solderability
Coverage: 95%≤ each termination.
T0 : 20 ± 2℃, R0 : Resistance at T0 (Ω)
T : Test temperature , R : Resistance at T (Ω)
Solder Temp : 245℃
Dipping time : 3 sec
Judgement
Bending test
Adhesive strength
Test condition
Less than ±(0.5%+0.05Ω)of the initial value 50mΩ Max
3mm of bending shall be applied
No evidence of mechanical damage
for 5sec.
No mechanical damage or sign of disconnection
Test strengh : 5N
of termination
Test time: Applying pressure for 10seconds
Resistance to
Less than ±(1%+0.05Ω)of the initial value
soldering heat
No evidence of mechanical damage
Anti-Vibration
Less than ±(1%+0.05Ω)of the initial value
test
No evidence of mechanical damage
Temperature
Less than ±(1%+0.1Ω)of the initial value
cycle
No evidence of mechanical damage
Load life
Less than ±(3%+0.1Ω)of the initial value
50mΩ Max
260±5℃ , 10 sec
50mΩ Max
Test amplitude : 1.5mm
Frequency 10㎐-55㎐-10㎐ / 2hr in x,y,z direction.
50mΩ Max
50mΩ Max
No evidence of mechanical damage
Low Temp.
Less than ±(3%+0.1Ω)of the initial value
Exposure
No evidence of mechanical damage
High Temp
Less than ±(3%+0.1Ω)of the initial value
Exposure
No evidence of mechanical damage
Moisture
Less than ±(3%+0.1Ω)of the initial value
Resistance
No evidence of mechanical damage
100cycles, -55℃/30min ↔125℃/30min
sweep time:5min
Test voltage: rated voltage / 70±2℃
1,000hours(90min:On , 30min:Off)
50mΩ Max
Dwell in -55℃ chamber without loading
for 1,000hours
50mΩ Max
Dwel in 125℃ or 155℃ chamber without loading
for 1,000hours
50mΩ Max
Test voltage: rated voltage / 40±2℃
1,000hours(90min:On,30min:Off) / 90~95% RH
C. Recommended Soldering method :
Reflow ( Reflow Peak Temperature : 260+0/-5℃, 10sec. Max )
* For the more detail Specification, Please refer to the samsung chip RESISTOR catalogue.