DECEMBER 2, 1996 TEST REPORT #96291F, TEMPERATURE/HUMIDITY CYCLING (100 CYCLES OF DURABILITY) SSW/TSW (10 MICROINCHES GOLD) SAMTEC CORPORATION APPROVED BY: LUANNE WITT PROGRAM MANAGER CONTECH RESEARCH, INC. 1 Contech Research CERTIFICATION This is to certify that the evaluation described herein was designed and executed by personnel of Contech Research, Inc. It was performed in concurrence of Samtec Corporation of New Albany, IN who was the test sponsor. All equipment and measuring instruments used during testing were calibrated and traceable to NIST according to IS0 10012-l and ANSI/NCSL 2540-1, as applicable. All data, raw and summarized, analysis and conclusions presented herein are the property of the test sponsor. No copy of this report, in part or in full, shall be forwarded to any agency, customer, etc., by Contech Research without the written approval of the test sponsor. Luanne Witt Program Manager LW:js 2 Contech Research SCOPE To perform Temperature/Humidity Cycling (with mating cycles) on Connectors as manufactured and submitted by the test sponsor, Samtec Corporation. TEST SAMPLES AND PREPARATION 1. The following test samples were submitted by the test sponsor, Samtec Corporation, for the evaluation to be performed by Contech Research, Inc. a) b) 2. SSW Receptacle Connectors (10 Microinches Gold) TSW Plug Connectors (10 Microinches Gold) Unless otherwise indicated, all materials were certified by the manufacturer to be in accordance with the applicable product specification. 3. The test samples as submitted were certified by the manufacturer as being fabricated and assembled.utilizing normal product techniques common for this type of product and inspected in accordance with the quality criteria as established for the product involved. 4.. All test samples were coded and identified to maintain continuity throughout the test sequences. 5. Test boards were supplied by the test sponsor with pads located as applicable. 6. The test samples were assembled to test boards. The assembled test samples were "hand" soldered in place. 7. After test lead attachments and/or soldering, all test units were cleaned prior to mating via DI water wash, isopropyl alcohol rinse, and vapor degreasing (in the order indicated). 8. Unless otherwise specified in the test procedures used, no further preparation was used. 9. All equipment and measuring instruments used during testing were calibrated and traceable to NIST according to IS0 10012-l and ANSI/NCSL 2540-1, as applicable. f . J 3 Contech Research TEST SELECTION 1. The following test sequence was established: LLiCR DURABILITY 25 TLES LLiCR CYCLIC HUMIDITY (240 TOURS) LLiCR DURABILITY 25 cTcLEs LLCR I CYCLIC HUMIDITY (240 TOURS) LLiCR DURABILITY 25 TLES LLiCR CYCLIC HUMIDITY (240 TOURS) LLCR I DURABILITY 25 CYCLES I LLCR I CYCLIC HUMIDITY (240 YOURS) LLCR TOTAL OF 100 CYCLES OF DURABILITY TEST1 4' Contech Research MONITORING TESTS Throughout the test sequence selected for this evaluation one test was performed on a periodic basis. The following is the rational for this test which is significant and important in evaluating the data in proper perspective. LOW LEVEL CIRCUIT RESISTANCE 1. To evaluate contact resistance characteristics of the contact systems under conditions where applied voltages and currents do not alter the physical contact interface and will detect oxides and films which degrade electrical stability. 2. The test method is also sensitive to and may detect the presence of fretting corrosion induced by mechanical or thermal environments and any significant loss of.contact pressure. 3. This attribute was monitored after each preconditioning and/or test exposure in order to determine said stability of the connector material systems as they progress through the applicable test sequences. 4. The electrical stability of the system is determined by comparing the resistance value after a given test exposure to its initial value (prior to any exposure). The difference is the change in resistance occurringwhose magnitude establishes the stability of the interface being evaluated. 5. The test is performed with a four wire system. The test is performed in accordance with MIL-STD-1344, Method 3002 with a 100 milliamp maximum test current and an open circuit voltage of 20 millivolts. Measurements are taken in the forward and reverse direction and averaged. 5 Contech Research V/N V/N wuow 9 sllluo~ 9 swJ0~ 9 wluo~ 9 WUO~ 9 V/N V/N isel W33 swJ0~ 9 WJO~ 9 SlllUO~ 9 IW baJd V/N V/N t LPSBP SP8LLP 8EPZLt7 9tEzz P88E V/N VI/N OE 1 L-IA GPZ-Zzl EZLOZ z 10SLLZ # Ie!JaS ‘3NI ‘H3WElS3ki HXLLN03 I OP-99P V/N 0909-AX V/N pnu8w eeS 09s lenu8w eeS 089 j8nwt.u eeS C-089 oi-stwa w= m 10 %SZT OE-ddCl ews iin! ~0 %sz lZ6SZ V/N lZ6SZ V/N l-IV00 l-d/\ Hkl %LT 3oS’OT U8ds $0 %lT l-3d9SZ-kkl SZ-ddCl w= iiw 10 749-0 30 LE’OT V06 1Z h3rncmy # iww JojndLUO=) SWOJWH 3klV W~l A - x “4-l PWIIU)V ‘TN Au8dwoo hwa JeleW UJ’-lOOJ~!W L6/0 l/P 9610 l/O 1 Auoduro=) r(elqlley 96lSZIL mew wo OJa!W LGISZIl Xuodluoa Aepg1ey JeleW U-“-lo OJD!W 96/EZ/ll 96/IZ/S 41 oc e689 cow lwf3a L~/Z C/E 96/Z C/6 ~u8duw WlllW3 (‘WI OE) e6@3 =J’Y LGltrllS 96/Pi/l 1 WIPW U8lUSU8J3 P’J% s=Jd ll!Ja U8lUS~8J3 P’J%i s=Jd ll!Ja r(u8duioL) w enlg JeV’-J~‘43 ‘JJnH Ilo9 h8dwo3 w enlg elOb wnH/dwel ~6/6/6 961616 91 S Z - e6W =‘JOj 96/lZ/Zl 96/CZ/9 Jw~ouJJeu 1~116la 96/LZ/Z 1 96/LZ/9 WllWl3 -Nfl wtd wr reln~~8pNJ8~ aww wawd!nba 91s 918 L62 082 99z 9oz 691 191 OS1 98 LZ C1 1 (d m tw ww lea se1 #aI . . - EIA 364, TP23 SPECIFICATION: PROJECT NO.: 96291F -------------------_---------------------------------------PART DESCRIPTION: Plug & Receptacle PART NO.: SSW/TSW Connector -----------------------------------------------------------TECHNICIAN: SR SAMPLE SIZE: Two -----------------------------------------------------------11-8-96 COMPLETE DATE: 9-11-96 START DATE: __-___-_---------------------------------------------------50% RELATIVE HUMIDITY: ROOM AMBIENT: 23OC ______-----------------------------------------------------266, 280, 297, 518 EQUIPMENT ID#: -----------------------------------------------------------LOW LEVEL CIRCUIT RESISTANCE (LLCR) PURPOSE: To evaluate contact resistance characteristics of the contact systems under conditions where applied voltages and currents do not alter the physical contact interface and will detect oxides and films which degrade electrical It is also sensitive to and may detect the stability. presence of fretting corrosion induced by mechanical or thermal environments as well as any significant loss of pressure. 1 __--__-___-_------------------------------------------------ PROCEDURE: 1. This test was performed in accordance with EIA 364;TP23 with a 100 milliamp maximum test current and an open circuit voltage of 20 millivolts (four wire technique). 2. The voltage probes were attached to the contact terminations within 0.060" of the connector housing. i 3 i The low level circuit resistance as measured shall not exceed 15.0 mS2. ----------___----------------------------------------------- RESULTS: See next page. Contech Research RESULTS: 1. The following is a summary of the data observed: Sample ID# 1 2 2. LOW LEVEL CIRCUIT RESISTANCE (Milliohms) Std. Dev. Min. 4.0 3.9 4.2 4.2 3.7 3.6 0.1 0.2 See pages 13a thru 13b for individual data points. a Contech Research - EIA 364, TP09 SPECIFICATION: 96291F PROJECT NO.: ---______________-__---------------------------------------PART DESCRIPTION: Plug & Receptacle SSW/TSW PART NO.: Connector ---________-__---------------------------------------------TECHNICIAN: SR SAMPLE SIZE: Two ________________------------------ __-__--_________----___^__ 10-29-96 COMPLETE DATE: 9-12-96 START DATE: ---_____----_----------------------------------------------RELATIVE HUMIDITY: 50% 23OC ROOM AMBIENT: _________________-_----------------------------------------11, 150, 152, 159, 206, 297, 315, 518 EQUIPMENT ID#: __________--_____-__----------- ---_______--__----__--------DURABILITY PURPOSE: 1. To determine the effects of subjecting the test samples to a predetermined number of mating and unmating cycles simulating the expected mechanical life of the product being evaluated. 2. This is a preconditioning sequence which is used to induce the type of wear on the contacting surfaces which may occur under normal service conditions. The connectors are mated and unmated a predetermined number of cycles. Upon completion, the units being evaluated are exposed to the environments as specified to asses any impact on electrical stability resulting from wear or other wear dependent phenomenon. 3. This type of preconditioning sequence is also used to mechanically stress the-connector system as would This sequence in normally occur in actual service. conjunction with other tests is used to determine if a significant loss of contact pressure occurs from said stresses which in turn, may result in an unstable electrical condition to exist. ------------------------------------------~------~---PROCEDURE: ------ 1. The test was performed in accordance with EIA 364, TP09. 2. Test Conditions: a) No. of cycles : : b) Rate 25 per interval 500 cycles/hr 9 Contech Research PROCEDURE - Continued: 3. The test samples were axially aligned to accomplish the mating and unmating function allowing for self-centering movement. 4. Low level circuit resistance was performed in accordance with EIA 364, TP23 using a 100 milliamp maximum test voltage and a 20.0 millivolt open circuit voltage. ___--------------------------------------------------------REQUIREMENTS: 1. There shall be no evidence of physical damage to the test sample so tested. 2. The change in low level circuit resistance shall not exceed +15.0 m. ___-_------------------------------------------------------RESULTS : 1. There was no evidence of physical damage to the test samples as tested. 2. The following is a summary of the data observed: LOW LEVEL CIRCUIT RESISTANCE (Milliohms) Sample ID# 1 2 3. Avg. - Max. - Min. - 4.0 3.9 4.2 4.4 3.5 3.6 Avg. Change Max. Change +o.o 0.0 +0.2 +0.3 Std. Dev. 0.1 0.1 See pages 13a thru 13b for individual data points. Contech Research PROJECT NO.: PART NO.: 96291F SSW/TSW SPECIFICATION: EIA 364, TP31 PART DESCRIPTION: Plug 6: Receptacle Connector __________________-_____________________-------------------- SAMPLE SIZE: Two TECHNICIAN: SR _______________-___----------------------------------------- START DATE: 9-13-96 COMPLETE DATE: 11-8-96 ___________________----------------------------------------- ROOMAMBIENT: 23OC RELATIVE HUMIDITY: 52% ___________________-____________________-------------------- EQUIPMENT ID#: 1, 27, 36, 297, 518 ____-----------------------------------------------------HUMIDITY (THERMAL CYCLING) PURPOSE: To evaluate the impact on electrical stability of the contact system when exposed to any environment which may generate thermal/moisture type.failure mechanisms such as: a) Fretting corrosion due to wear resulting from micromotion. Thermal cycling induces micromotion between contacting surfaces and humidity accelerates the oxidation process. b) Oxidation of wear debris resulting from induced micromotion which may have become entrapped between the contacting surfaces. cl Oxidation of particulates which may have been deposited on the contacting surfaces from the surrounding atmosphere which may have been entrapped between them due to induce micromotion. d) Failure mechanisms resulting from a wet oxidation process. d To determine the number of mating cycles which may be performed whereby the change in low level circuit resistance is <+15.0 mf~ (stable). Wear occurs on the contacting surfaces as the number of mating cycles increase. If the wear does not result in gross exposure of the underplate/base metal and the wear debris is not entrapped, then electrical stability will remain in the stable region. If gross exposure of the underplate/base metal occurs and sufficient debris is entrapped, 11 Contech Research PURPOSE: Continued electrical instability or marginal conditions will result due to the temp/humidity exposure. f) This test obtains added effectiveness in employment of temperature cycling that provides a breathing action, inducing corrosion processes, and the introduction of moisture into partially sealed test samples. This condition imposes a vapor pressure on the samples which constitutes the major force behind the moisture migration and penetration. --_--_-----------------------------------------------------PROCEDURE: 1. The test was performed in accordance with EIA 364, TP31 with the following conditions. 2. Test Conditions: a) b) c) d) e) f) Preconditioning (24 hours) Relative Humidity Temperature Conditions Mating Conditions Mounting Conditions Duration : : : : : : 5ooc f 2°C 90% to 95% 25°C to 65°C Mated Mounted 960 hours 3. Prior to performing attribute measurements, the test samples were allowed to recover to room ambient conditions. 4. All subsequent attribute testing was performed in accordance with the procedures previously indicated. 5 *. During the exposure, resistance measurements were taken at specific intervals and in the following sequence. a) Place the test samples in the test chamber. b) After the initial 240 hours of exposure, remove the test units from the test chamber when it is at 25°C. The test samples were exposed to room ambient for one hour prior to making low level circuit resistance measurements. E 12 Contech Research - . PROCEDURE: CS Continued LOW level circuit resistance was measured. If the measurements remained within the stable range (x+15.0 ti AR), perform additional 25 mating cycles and remeasure low level circuit resistance. d) Upon completion of the measurements, place the test units back into the test chamber for an additional 240 hours (when the chamber is at 25°C). d Repeat Steps c) and d) until a AR measurement is >+15.0 mR or the total specified duration is completed whichever occurs first. --_----------------------------------- ---------------------- REQUIREMENTS: 1. There shall be no evidence of physical deterioration of the test samples as tested. 2. The change in low level circuit resistance shall not exceed +15.0 m when based on 3 sigma limits. ---------------------‘---‘--“-““----’-~------------------ RESULTS: 1. The test samples as tested showed no evidence of physical.,deterioration. : 2. The following is a summary of the observed data: i LOW LEVEL CIRCUIT RESISTANCE (Milliohms) Sample ID# Avg. Max. Min. Avg. Change Max. Change Std. Dev. +4.2 +5.3 0.9 1.8 Cycled (After 960 Hrs, 100 Mating Cycles) ID# 1 ID# 2 3. 5.8 4.8 8.3 9.3 4.3 3.5 +1.8 +0.9 See pages 13a thru 13b for individual data points. r f 13 Contech Research